US8350567B2 - Pre-adjustable SMD coils for high currents - Google Patents
Pre-adjustable SMD coils for high currents Download PDFInfo
- Publication number
- US8350567B2 US8350567B2 US12/649,425 US64942509A US8350567B2 US 8350567 B2 US8350567 B2 US 8350567B2 US 64942509 A US64942509 A US 64942509A US 8350567 B2 US8350567 B2 US 8350567B2
- Authority
- US
- United States
- Prior art keywords
- coil
- substrate
- circuit board
- magnetic resonance
- adjusted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000012360 testing method Methods 0.000 claims abstract description 10
- 238000009434 installation Methods 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 230000001939 inductive effect Effects 0.000 claims 3
- 238000005259 measurement Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005577 local transmission Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003325 tomography Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
- G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
- G01R33/32—Excitation or detection systems, e.g. using radio frequency signals
- G01R33/34—Constructional details, e.g. resonators, specially adapted to MR
- G01R33/34007—Manufacture of RF coils, e.g. using printed circuit board technology; additional hardware for providing mechanical support to the RF coil assembly or to part thereof, e.g. a support for moving the coil assembly relative to the remainder of the MR system
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
- G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
- G01R33/32—Excitation or detection systems, e.g. using radio frequency signals
- G01R33/36—Electrical details, e.g. matching or coupling of the coil to the receiver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/02—Fixed inductances of the signal type without magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F21/00—Variable inductances or transformers of the signal type
- H01F21/02—Variable inductances or transformers of the signal type continuously variable, e.g. variometers
- H01F21/04—Variable inductances or transformers of the signal type continuously variable, e.g. variometers by relative movement of turns or parts of windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/045—Trimming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Definitions
- the present invention concerns methods for installing a coil in a circuit and devices for this purpose.
- Magnetic resonance systems for the examination of patients by magnetic resonance tomography are known from, for example, DE 103 142 15 B4.
- the front end electronics of the transmission path of a conventional magnetic resonance system normally include a series circuit composed of different function units such as, for example, a transmission path crossover switch, a 90° hybrid circuit, a phase shifter and a transmission/reception diplexer.
- a transmission path crossover switch In nearly all of these units, high-current air-core coils formed by silver-plated copper wire are used.
- each of these coils should exhibit an inductance value that is predetermined for it within narrow tolerances. Due to unavoidable heat that arises during losses, the components may heat to temperatures of over 100° C.
- the execution of the coils as through components prevents the presence (and thus the use) of continuous mass on the back side of the circuit board and therefore makes cooling of the module more difficult.
- a simplification of the adjustment or even a complete absence of adjustment can be achieved by the use of narrow-tolerance components at the critical positions.
- capacitors for example, various manufacturers offer their components with tolerances of + ⁇ 2% or even + ⁇ 1%.
- the above object is achieved in accordance with the present invention in a method to install a coil in a circuit on a circuit board, including the steps of initially installing the coil on a substrate, testing the inductance of the coil on the substrate before attaching the substrate to a circuit board, and subsequently installing the substrate with the tested coil thereon on a circuit board to incorporate the coil in a circuit of the circuit board.
- a magnetic resonance system having a circuit formed on a circuit board, the circuit including a coil that is mounted on a substrate, with the coil and the substrate connected to the circuit board as an SMD (surface mounted device).
- SMD surface mounted device
- the adjustment of coils (in particular of an MR front end electronics module) can be significantly simplified; a subsequent adjustment can even be entirely omitted.
- a continuous mass surface (and therefore an efficient cooling of the module) is enabled.
- Attachment of the coil on the substrate by a rigid connection avoids the connection between the coil and the substrate changes significantly upon soldering of the substrate with the adjusted coil into a circuit.
- FIGS. 1A and 1B show examples of embodiments of pre-adjustable SMD coils on a substrate carrier.
- FIG. 2 shows the installation of a substrate of an SMD coil (of the type shown in the embodiment in FIG. 1 ) in a test version.
- FIG. 3 shows installation of a carrier of an SMD coil in a circuit of an MR apparatus.
- FIG. 4 schematically illustrates a known magnetic resonance tomography system
- FIG. 5 schematically shows the arrangement of a front end and transmission path in an MR apparatus, as a block diagram.
- FIG. 4 shows a magnetic resonance apparatus 1 with a displaceable patient bed 2 , with which a patient 3 is examined.
- the patient 3 is moved in the patient bed 2 in the Z-direction (i.e. in the axial direction) through the imaging region of the magnetic resonance apparatus 1 .
- FIGS. 1A and 1B show examples of embodiments of pre-adjustable SMD coils for circuits in the transmission path of a magnetic resonance apparatus 1 .
- FIG. 1A on a substrate 5 made of low-loss material (for example RO4350) the two ends 8 a , 8 b of a coil 8 that are inserted through the substrate 5 are contacted by soldering.
- solder connection 14 such as that in FIG. 1
- a rigid connection can also be used (for example by riveting the coil ends 8 a , 8 b into recesses of the substrate 5 ) in order to prevent that the connection between the coil and the substrate from shifting upon soldering of the adjusted coil.
- a connection with known SMD pads 6 , 7 also can be produced according to the example in FIG. 1B .
- a connection without SMD pads can also ensue according to the example in FIG. 1B , for example, with curved ends of the coil that can possibly be additionally soldered.
- the coil 8 can be mechanically predefined (for example by the coil ends 8 a , 8 b being folded for the recesses in the substrate) and thermally unloaded before the mounting on SMD substrate 5 .
- the coil 8 installed on the substrate 5 can be adjusted to the desired inductance value in a test circuit 9 , for example according to FIG. 2 .
- the substrate 5 on which the coil 8 is already mounted is here inserted with a force F (for example manually) into clamp contacts of the test circuit located on a test circuit board, and the coil 8 is then tuned in a known manner (for example by pinching); its inductance is thus set to a desired value.
- a force F for example manually
- a suitable test circuit for example a resonant circuit
- tolerances of below 1% could be achieved by such testing.
- FIG. 3 shows a section of a circuit board of a circuit 10 that can be populated with the substrate 5 of the coil 8 (after the adjustment of the coil 8 in the arrangement according to FIG. 2 ). For example, this can ensue by a solder connection 11 between the substrate 5 of the coil 8 (that is fashioned here as an SMD module) and the circuit 10 . Recesses in the form of blind holes 15 , 16 can be provided in the circuit board 10 . The blind holes produce a safe spacing between the ends 8 a , 8 b of the coil 8 (in particular given execution according to the right side of FIG. 1 ) and the circuit board 10 .
- a base metallization 12 on the underside of the circuit 10 forms a continuous mass that can be cooled well.
- the adjustment of the front end electronics module can be significantly simplified by the use of mechanically reliable, narrow-tolerance coils; ideally, a subsequent adjustment can even be entirely foregone.
- the invention has been described in the context of a coil for the transmission path of an MR system, but it can also be used in other configurations.
- FIG. 5 schematically shows an arrangement of a front end electronics unit 58 of an MR apparatus 1 and a local transmission coil 56 as a block diagram.
- Test signals 53 and reception signals of the whole-body resonator and/or of the local transmission coil 56 of the MR apparatus are transferred between a controller with an evaluation device 51 and the front end electronics unit 54 , for example.
- the front end electronic unit 58 is connected with the whole-body resonator 1 via connections 55 , 59 to send and to receive.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008063312.7A DE102008063312B4 (en) | 2008-12-30 | 2008-12-30 | Pre-adjustable SMD coils for high currents |
DE102008063312.7 | 2008-12-30 | ||
DE102008063312 | 2008-12-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20100164497A1 US20100164497A1 (en) | 2010-07-01 |
US8350567B2 true US8350567B2 (en) | 2013-01-08 |
Family
ID=42234606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/649,425 Expired - Fee Related US8350567B2 (en) | 2008-12-30 | 2009-12-30 | Pre-adjustable SMD coils for high currents |
Country Status (2)
Country | Link |
---|---|
US (1) | US8350567B2 (en) |
DE (1) | DE102008063312B4 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105023732A (en) * | 2015-06-30 | 2015-11-04 | 安捷利(番禺)电子实业有限公司 | Three-dimensional inductance coil and method for preparing three-dimensional inductance coil through printed circuit method |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR112021020784A2 (en) | 2019-05-29 | 2021-12-14 | Philip Morris Products Sa | Coil former, inductive component and method for adjusting an inductance |
EP3977493B1 (en) | 2019-05-29 | 2023-07-05 | Philip Morris Products S.A. | Inductive component and method for adjusting an inductance |
US20220336150A1 (en) | 2019-09-20 | 2022-10-20 | Philip Morris Products S.A. | Inductive component and method for adjusting an inductance value |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0962946A2 (en) | 1998-06-04 | 1999-12-08 | Siemens Aktiengesellschaft Österreich | Standing mounted coil for printed circuit boards |
US7088104B2 (en) * | 2001-12-31 | 2006-08-08 | The John Hopkins University | MRI tunable antenna and system |
US20090021261A1 (en) | 2004-01-14 | 2009-01-22 | Koninklijke Philips Electronics Nv | Rf trap tuned by selectively inserting electrically conductive tuning elements |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3539135A1 (en) * | 1985-11-05 | 1987-05-07 | Bosch Gmbh Robert | Air-cored coil which can be trimmed |
DE10314215B4 (en) * | 2003-03-28 | 2006-11-16 | Siemens Ag | Magnetic resonance antenna and method for detuning their natural resonance frequency |
US6950005B2 (en) * | 2003-06-30 | 2005-09-27 | International Business Machines Corporation | Adjustable coilform for variable inductance |
-
2008
- 2008-12-30 DE DE102008063312.7A patent/DE102008063312B4/en not_active Expired - Fee Related
-
2009
- 2009-12-30 US US12/649,425 patent/US8350567B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0962946A2 (en) | 1998-06-04 | 1999-12-08 | Siemens Aktiengesellschaft Österreich | Standing mounted coil for printed circuit boards |
US7088104B2 (en) * | 2001-12-31 | 2006-08-08 | The John Hopkins University | MRI tunable antenna and system |
US20090021261A1 (en) | 2004-01-14 | 2009-01-22 | Koninklijke Philips Electronics Nv | Rf trap tuned by selectively inserting electrically conductive tuning elements |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105023732A (en) * | 2015-06-30 | 2015-11-04 | 安捷利(番禺)电子实业有限公司 | Three-dimensional inductance coil and method for preparing three-dimensional inductance coil through printed circuit method |
Also Published As
Publication number | Publication date |
---|---|
DE102008063312A1 (en) | 2010-07-08 |
US20100164497A1 (en) | 2010-07-01 |
DE102008063312B4 (en) | 2015-05-21 |
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Owner name: SIEMENS AKTIENGESELLSCHAFT,GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUBER, KLAUS;POTT, STEFAN;REEL/FRAME:024067/0933 Effective date: 20100202 Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUBER, KLAUS;POTT, STEFAN;REEL/FRAME:024067/0933 Effective date: 20100202 |
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Owner name: SIEMENS HEALTHCARE GMBH, GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SIEMENS AKTIENGESELLSCHAFT;REEL/FRAME:039271/0561 Effective date: 20160610 |
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