US7675071B2 - Light emitting transistor - Google Patents
Light emitting transistor Download PDFInfo
- Publication number
- US7675071B2 US7675071B2 US11/878,680 US87868007A US7675071B2 US 7675071 B2 US7675071 B2 US 7675071B2 US 87868007 A US87868007 A US 87868007A US 7675071 B2 US7675071 B2 US 7675071B2
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- Prior art keywords
- layer
- light emitting
- type
- emitting transistor
- collector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
- H01L33/18—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
Definitions
- the present invention relates to a light emitting transistor with a nano structure which can amplify and switch optical and electrical characteristics.
- a light emitting diode In general, a light emitting diode (LED) generates minority carriers (electrons or holes) injected by using the p-n junction structure of a semiconductor, and recombines the minority carriers so as to emit light.
- minority carriers electrons or holes
- a forward voltage is applied to a specific element of semiconductor, electrons and holes are recombined while moving through the junction between an anode and a cathode. Since energy in such a state is smaller than energy in a state where the electrons and holes are separated, light is emitted due to a difference in energy occurring at this time.
- Such an LED can irradiate light with high efficiency by using a low voltage. Therefore, the LED is used in a home appliance, a remote control, an electronic display board, a marker, an automation equipment and the like.
- transistors are implemented with transistors, and transistors formed of group III-V and II-VI nitride semiconductors are manufactured and are used in various fields.
- An advantage of the present invention is that it provides a light emitting transistor with a nano structure which can amplify and switch optical and electrical characteristics.
- a light emitting transistor comprises a first conductivity-type collector layer formed on a substrate; a second conductivity-type base layer formed on the collector layer; and a first conductivity-type emitter layer formed on the base layer. At least one of the collector layer, the base layer, and the emitter layer has a nanorod structure with a plurality of nanorods.
- the first conductivity type may n-type, and the second conductivity type may be p-type. Alternately, the first conductivity type may be p-type, and the second conductivity type may be n-type.
- the collector layer, the base layer, and the emitter layer are formed of group II-VI or II-V compound semiconductors.
- the light emitting transistor further comprises an activation layer formed at the interface between the collector layer and the base layer or at the interface between the base layer and the emitter layer.
- the activation layer has a nanorod structure with a plurality of nanorods and is formed of a group II-VI or II-V compound semiconductor.
- FIG. 1 is a perspective view illustrating the structure of a light emitting transistor according to an embodiment of the invention
- FIG. 2A is a diagram showing an equivalent circuit of the light emitting transistor according to an embodiment of the invention.
- FIG. 2B is a diagram showing an I-V curve of the light emitting transistor.
- FIGS. 3 to 8 are perspective views illustrating modifications of the light emitting transistor according to an embodiment of the invention.
- FIG. 1 is a perspective view illustrating the structure of a light emitting transistor according to an embodiment of the invention.
- the light emitting transistor according to the invention basically has a bipolar junction structure.
- the light emitting transistor includes a substrate 100 , a first conductivity-type collector layer 110 formed on the substrate, a second conductive-type base layer 120 formed on the collector layer 110 , and a first conductivity-type emitter layer 130 formed on the base layer 120 , the first conductivity-type emitter layer 130 having the same conductivity type as the first conductivity-type collector layer 110 .
- the collector layer 110 , the base layer 120 , and the emitter layer 130 may be formed of group II-VI or III-V compound semiconductors.
- group II-VI compound semiconductors ZnSe, ZnTe, ZnSeTe, ZnS, ZnO, CdSe, CdS, CdTe, ZnCdS, ZnCdSe, ZnCdSeTe, ZnCdSTe and the like can be used.
- group III-V compound semiconductors GaAs, GaAlAs, GaInAs, InAs, InP, InSb, GaSb, GaInSb, GaN, GaInN and the like can be used.
- the first conductivity type is n-type
- the second conductivity type is p-type
- the collector layer 110 and the emitter layer 130 may be formed of n-type semiconductors
- the base layer 120 may be formed of a p-type semiconductor.
- the n-type semiconductor may be doped with Si, Se, Sn or the like
- the p-type semiconductor may be doped with Mg, Zn, Be or the like.
- the first conductivity type may be p-type
- the second conductivity type may be n-type
- the collector layer 110 and the emitter layer 130 may be formed of p-type semiconductors
- the base layer 120 may be formed of an n-type semiconductor.
- the emitter layer 130 is a region to which holes or electrons are injected
- the collector layer 110 is a region in which the injected holes or electrons are focused
- the base layer 120 is an intermediate region between the emitter layer 130 and the collector layer 110 .
- At least one of the collector layer 110 , the base layer 120 , and the emitter layer 130 has a nanorod structure with a plurality of nanorods.
- the collector layer 110 when at least one of the collector layer 110 , the base layer 120 , and the emitter layer 130 has a nanorod structure, which is a low-dimensional nano-structure such as a quantum point and a quantum well, electrons within the nanorod structure can be effectively captured, and light emission efficiency by recombination can be enhanced.
- a nanorod structure which is a low-dimensional nano-structure such as a quantum point and a quantum well
- FIG. 1 shows a state where the emitter layer 130 among the collector layer 110 , the base layer 120 , and the emitter layer 130 has a nanorod structure with a plurality of nanorods.
- FIGS. 3 to 8 are perspective views illustrating modifications of the light emitting transistor according to an embodiment of the invention.
- FIG. 3 shows a state where the base layer 120 among the collector layer 110 , the base layer 120 , and the emitter layer 130 has a nanorod structure with a plurality of nanorods.
- FIG. 4 shows a state where the collector layer 110 among the collector layer 110 , the base layer 120 , and the emitter layer 130 has a nanorod structure with a plurality of nanorods.
- FIG. 5 shows a state where the collector layer 110 and the emitter layer 130 among the collector layer 110 , the base layer 120 , and the emitter layer 130 has a nanorod structure with a plurality of nanorods.
- FIG. 3 shows a state where the base layer 120 among the collector layer 110 , the base layer 120 , and the emitter layer 130 has a nanorod structure with a plurality of nanorods.
- FIG. 4 shows a state where the collector layer 110 among the collector layer 110 , the base layer 120
- FIG. 6 shows a state where the base layer 120 and the emitter layer 130 among the collector layer 110 , the base layer 120 , and the emitter layer 130 have a nanorod structure with a plurality of nanorods.
- FIG. 7 shows a state where the collector layer 110 and the base layer 120 among the collector layer 110 , the base layer 120 , and the emitter layer 130 have a nanorod structure with a plurality of nanorods.
- FIG. 8 shows a state where all of the collector layer 110 , the base layer 120 , and the emitter layer 130 have a nanorod structure with a plurality of nanorods.
- the light emitting transistor according to the invention further includes an activation layer formed at the interface between the collector layer 110 and the base layer 120 or between the base layer 120 and the emitter layer 130 . That is, the activation layer may be formed at the interface between the collector layer 110 and the base layer 120 and at the interface between the base layer 120 and the emitter layer 130 . Alternately, the activation layer may be formed only at the interface between the collector layer 110 and the base layer 120 or only at the interface between the base layer 120 and the emitter layer 130 .
- the activation layer as well as the collector layer 110 , the base layer 120 , and the emitter layer 130 may be formed of group II-VI or III-V compound semiconductors.
- FIG. 2A is a diagram showing an equivalent circuit of the light emitting transistor according to an embodiment of the invention
- FIG. 2B is a diagram showing an I-V curve of the light emitting transistor.
- the light emitting transistor including three terminals of a collector C, a base B, and an emitter E can adjust the intensity of light generated from the activation layer by the adjustment of the base B, and the magnitude of a collector current is adjusted by a base voltage.
- carriers flowing in the emitter E and the collector C are electrons and holes.
- the barrier of the base B is reduced in height such that carriers easily move from the emitter E to the collector C. Then, a current flowing in the collector C is amplified.
- the light emitting transistor according to the invention has a bipolar junction structure including the collector layer 110 , the base layer 120 , and the emitter layer 130 . Further, at least one of the collector layer 110 , the base layer 120 , and the emitter layer 130 is formed with a nanorod structure with a plurality of nanorods. Therefore, an optical and electrical output can be amplified or can be switched from on-state to off-state or from off-state to on-state, in accordance with the bias direction of each terminal.
- the light emitting transistor has a bipolar junction structure including the collector layer, the base layer, and the emitter layer. Further, at least one of the collector layer, the base layer, and the emitter layer is formed with a nanorod structure with a plurality of nanorods. Therefore, it is possible to obtain optical and electrical characteristics at the same time.
- the intensity of light can be adjusted by the adjustment of the base terminal, and an optical and electrical output can be amplified or can be switched from on-state to off-state or from off-state to on-state, in accordance with the bias direction of each terminal.
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060113886A KR100793336B1 (en) | 2006-11-17 | 2006-11-17 | Light emitting transistor |
KR10-2006-0113886 | 2006-11-17 |
Publications (2)
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US20080116465A1 US20080116465A1 (en) | 2008-05-22 |
US7675071B2 true US7675071B2 (en) | 2010-03-09 |
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US11/878,680 Expired - Fee Related US7675071B2 (en) | 2006-11-17 | 2007-07-26 | Light emitting transistor |
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KR (1) | KR100793336B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100051986A1 (en) * | 2008-09-04 | 2010-03-04 | Samsung Electronics Co., Ltd. | Light-emitting diodes using nano-rods and methods of manufacturing a light-emitting diode |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007105405A1 (en) * | 2006-03-10 | 2007-09-20 | Matsushita Electric Industrial Co., Ltd. | Method and device for mounting anisotropically-shaped member, method of manufacturing electronic device, electronic device, and display |
KR101530379B1 (en) * | 2006-03-29 | 2015-06-22 | 삼성전자주식회사 | Method for Producing Silicon Nanowire Using Porous Glass Template and Device Comprising Silicon Nanowire Formed by the Same |
US8030729B2 (en) * | 2008-01-29 | 2011-10-04 | Hewlett-Packard Development Company, L.P. | Device for absorbing or emitting light and methods of making the same |
FR3011381B1 (en) * | 2013-09-30 | 2017-12-08 | Aledia | OPTOELECTRONIC DEVICE WITH LIGHT EMITTING DIODES |
EP3435428B1 (en) * | 2017-07-26 | 2019-11-27 | ams AG | Light emitting semiconductor device for generation of short light pulses |
CN111463659B (en) * | 2019-01-21 | 2021-08-13 | 华为技术有限公司 | Quantum dot semiconductor optical amplifier and preparation method thereof |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4707216A (en) * | 1986-01-24 | 1987-11-17 | University Of Illinois | Semiconductor deposition method and device |
US6646282B1 (en) * | 2002-07-12 | 2003-11-11 | Hon Hai Precision Ind. Co., Ltd. | Field emission display device |
KR20050001582A (en) | 2003-06-26 | 2005-01-07 | 학교법인 포항공과대학교 | P-n heterojunction structure of zinc oxide nanorod with semiconductive substrate, preparation thereof, and device using same |
US6891191B2 (en) * | 2003-09-02 | 2005-05-10 | Organic Vision Inc. | Organic semiconductor devices and methods of fabrication |
JP2005197612A (en) | 2004-01-09 | 2005-07-21 | Sony Corp | Integrated quantum thin-line transistor, manufacturing method thereof, integrated thin-line transistor, manufacturing method thereof, and electronic application device |
KR20050098540A (en) | 2004-04-07 | 2005-10-12 | 삼성전자주식회사 | Nanowire light emitting device |
KR20050116925A (en) | 2004-06-09 | 2005-12-14 | 학교법인 포항공과대학교 | Electric device comprising schottky electrode using semiconductor nano-structure, and fabrication thereof |
US7132677B2 (en) * | 2004-02-13 | 2006-11-07 | Dongguk University | Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same |
US20070201523A1 (en) * | 2006-02-27 | 2007-08-30 | The Board Of Trustees Of The University Of Illinois | PNP light emitting transistor and method |
-
2006
- 2006-11-17 KR KR1020060113886A patent/KR100793336B1/en not_active IP Right Cessation
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2007
- 2007-07-26 US US11/878,680 patent/US7675071B2/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4707216A (en) * | 1986-01-24 | 1987-11-17 | University Of Illinois | Semiconductor deposition method and device |
US6646282B1 (en) * | 2002-07-12 | 2003-11-11 | Hon Hai Precision Ind. Co., Ltd. | Field emission display device |
KR20050001582A (en) | 2003-06-26 | 2005-01-07 | 학교법인 포항공과대학교 | P-n heterojunction structure of zinc oxide nanorod with semiconductive substrate, preparation thereof, and device using same |
US6891191B2 (en) * | 2003-09-02 | 2005-05-10 | Organic Vision Inc. | Organic semiconductor devices and methods of fabrication |
JP2005197612A (en) | 2004-01-09 | 2005-07-21 | Sony Corp | Integrated quantum thin-line transistor, manufacturing method thereof, integrated thin-line transistor, manufacturing method thereof, and electronic application device |
US7132677B2 (en) * | 2004-02-13 | 2006-11-07 | Dongguk University | Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same |
KR20050098540A (en) | 2004-04-07 | 2005-10-12 | 삼성전자주식회사 | Nanowire light emitting device |
KR20050116925A (en) | 2004-06-09 | 2005-12-14 | 학교법인 포항공과대학교 | Electric device comprising schottky electrode using semiconductor nano-structure, and fabrication thereof |
US20070201523A1 (en) * | 2006-02-27 | 2007-08-30 | The Board Of Trustees Of The University Of Illinois | PNP light emitting transistor and method |
Non-Patent Citations (1)
Title |
---|
Y. Zhang et al., "Heterostructures of Singlewalled carbon Nanotubes and Carbide Nanorods", Science Magazine, Sep. 1999, pp. 1719-1722. * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100051986A1 (en) * | 2008-09-04 | 2010-03-04 | Samsung Electronics Co., Ltd. | Light-emitting diodes using nano-rods and methods of manufacturing a light-emitting diode |
US8183576B2 (en) * | 2008-09-04 | 2012-05-22 | Samsung Electronics Co., Ltd. | Light-emitting diodes including perpendicular-extending nano-rods |
Also Published As
Publication number | Publication date |
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KR100793336B1 (en) | 2008-01-11 |
US20080116465A1 (en) | 2008-05-22 |
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