US7525767B2 - System for low profile termination with robust alignment for wireless suspension in hard disk drive - Google Patents
System for low profile termination with robust alignment for wireless suspension in hard disk drive Download PDFInfo
- Publication number
- US7525767B2 US7525767B2 US11/359,123 US35912306A US7525767B2 US 7525767 B2 US7525767 B2 US 7525767B2 US 35912306 A US35912306 A US 35912306A US 7525767 B2 US7525767 B2 US 7525767B2
- Authority
- US
- United States
- Prior art keywords
- suspension
- pad
- pads
- termination
- cable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 239000000725 suspension Substances 0.000 title claims abstract description 120
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 238000011900 installation process Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
Definitions
- the present invention relates generally to electrically connecting wireless suspensions to arm electronics (AE) cables.
- wireless suspension There are currently three prevalent types of wireless suspension used in the hard disk drive industry. They are Circuit Integrated Suspension (CIS), Flex on Suspension (FOS), and Integrated Lead Suspension (ILS). All differ in the manner in which they are fabricated. For the purpose of this disclosure and brevity, they will all be referred to as wireless suspensions. The embodiments in accordance with the disclosed invention are not limited by the manner in which the wireless suspension is fabricated.
- solder re-flow The technologies used for terminating the wireless suspensions to the AE flex cable have been predominantly either solder re-flow, or ultrasonic (US) bonding.
- Solder re-flow technology has two approaches in use today. They are a right-angle fillet joint and a lap joint. In both approaches the wireless suspension termination pads and the AE flex cable termination pads are pre-coated, or tinned, with solder.
- the fillet joint for solder termination technology relies on flattened solder pads to meet the flex cable pads at right angles. When heated the flattened solder pads of the wireless suspension become spherical and make contact with the flex cable solder pads, thus forming a right-angle fillet joint.
- the lap joint for solder termination technology involves the wireless suspension termination pads being exposed on all sides and overlapping the AE flex cable termination pads. Heat is applied to the wireless suspension pads and the tinned leads are fused together.
- Ultrasonic termination technology is similar in design and configuration as lap joint solder re-flow technology. The primary difference is rather than being coated with solder, the wireless suspension and AE flex cable termination pads are plated, or coated with gold. The wireless suspension and AE cable termination pads are overlapped, pressed together and US energy is applied to fuse and join the termination pads.
- the present invention recognizes a problem or a deficiency that arises from these termination methods. Specifically, these termination methods are detrimental to data rate. They also make it difficult to increase the number of terminations in the confined space allowed. In the case of the right-angle fillet joint, a large mound of solder results from the solder re-flow process thus creating undesirable capacitive coupling to adjacent fillet joints. Also, the pad size required to make an appropriate solder termination pad creates a discontinuity in the conductor width of the wireless suspension and the flex cable. Such discontinuities create reflection points for the data signals, which result in increased line impedance and degraded data rate performance.
- the pad size required to absorb assembly tolerances creates the aforementioned problem of discontinuity in the conductor widths.
- the large pad size also creates large amounts of solder, which creates a similar problem with the fillet joint of capacitive coupling.
- the disclosed invention targets the lap joint type of termination. This idea is applicable to both solder re-flow and US bonding.
- the core of the invention is to have the wireless suspension termination pads meet the AE flex cable termination pads at an intersecting angle. The width of these pads is approximately the same width as the conductor widths. Alignment robustness is attained by choosing an intersection angle that coincides to the arc that the wireless suspension termination pad array, or tail, normally traverses during alignment.
- a wireless suspension termination system includes a wireless suspension that in turn includes termination pads which are oriented tangentially to an arc swung by the wireless suspension tail during alignment of the wireless suspension termination pads to the AE cable termination pads.
- An AE cable is provided with termination pads oriented at an angle that is approximately equal and opposite to the orientation of the wireless suspension termination pads.
- Each wireless suspension termination pad may have a width that is substantially equal to the width of a trace on the suspension that is connected to and that leads away from the wireless suspension termination pad.
- each AE cable termination pad can have a width that is substantially equal to the width of the corresponding trace on the AE cable.
- wireless suspension termination pads and AE cable termination pads are narrow and elongated.
- a method for connecting a suspension of a hard disk drive to an AE cable includes forming electrically conductive suspension traces on the suspension, with the suspension defining an arc of motion. The method further includes forming, for each suspension trace, a respective suspension termination pad. Each such pad is tangential to the arc of motion at the location the arc passes through the suspension pad. Moreover, the method includes orienting the AE cable termination pads, with each AE cable termination pad being associated with a respective AE cable trace. Each AE cable termination pad is oriented to cross a respective wireless suspension termination pad. Each AE cable termination pad is then engaged with a respective wireless suspension termination pad.
- a hard disk drive in still another aspect, includes a suspension having a slider, a suspension trace on the suspension and electrically connected to the slider, and an AE cable that includes at least one AE cable trace terminating in an AE cable pad. Means are oriented tangentially to an arc through which the suspension moves for electrically connecting the suspension trace to the cable pad.
- FIG. 1 is an exploded perspective view of a non-limiting hard disk drive
- FIG. 2 is a perspective view of a wireless suspension head gimbal assemblies (HGA) tail joined to the AE cable according to present principles;
- HGA wireless suspension head gimbal assemblies
- FIG. 3 a is a plan view of a wireless suspension tail (which in an exemplary non-limiting embodiment may be an ILS suspension) with all of its layers depicted transparently;
- FIG. 3 b is a plan view of the steel layer of the wireless suspension tail
- FIG. 3 c is a plan view of the polyimide layer of the wireless suspension tail
- FIG. 3 d is a plan view of the copper layer of the wireless suspension tail
- FIG. 3 e is a plan view of the cover layer of the wireless suspension tail
- FIG. 3 f is a plan view of the wireless suspension tail, the copper layer facing foremost;
- FIG. 3 g is a plan view of the wireless suspension tail, the steel layer facing foremost;
- FIG. 3 h is a plan view of the AE cable, depicting the termination pads transparently;
- FIG. 3 i is a plan view of the AE cable, facing the termination side;
- FIG. 4 is a plan view showing the suspension terminated to the AE cable and shoving the termination pads with respect to the center of rotation of the suspension pad array;
- FIG. 5 is a flow chart of a method for making a non-limiting embodiment of the invention.
- FIG. 1 for a general overview of one non-limiting environment in which the present invention can be used, a rotary actuator is shown, although the invention described herein is also applicable to linear actuators.
- a disk drive 310 includes a housing 312 , and a housing cover 314 which, after assembly, is mounted within a frame 316 .
- Rotatably attached within the housing 312 on an actuator shaft 318 is an actuator and assembly 320 .
- One end of the actuator and assembly 320 may include an E block or comb like structure 322 having a plurality of actuator arms 323 .
- Attached to the separate arms 323 on the comb or E block 322 are spring suspensions 324 , and at the end of each spring suspension is a slider 326 which carries a magnetic transducer.
- a voice coil 328 On the other end of the actuator arm assembly opposite the spring suspensions 324 and the sliders 326 is a voice coil 328 .
- a pair of magnets 330 Attached within the housing 312 are a pair of magnets 330 .
- the pair of magnets 330 and the voice coil 328 are parts of a voice coil motor which applies a force to the actuator assembly 320 to rotate it about the actuator shaft 318 .
- a spindle shaft 332 Also mounted within the housing 312 is a spindle shaft 332 .
- Rotatably attached to the spindle shaft 332 are a number of disks 334 . In FIG. 1 eight disks are attached to the spindle shaft 332 .
- the disks 334 are attached to the spindle shaft 332 in spaced apart relation.
- Each suspension 324 can be a laminated suspension made of multiple layers of material etched using photolithographic techniques, as are well known in the industry, to create the suspension. These layers include a base layer preferably of stainless steel, an insulating layer preferably of polyimide, and a patterned conductive layer preferably of a copper alloy.
- This multilayered suspension may be formed by laminating three very thin sheets of different materials together, and consequently has two metal layers formed on either side of an insulating layer of polyimide that are processed using photolithographic techniques. Referring to FIGS.
- each suspension 324 electrically interconnects its attached slider with an AE cable.
- FIGS. 2-4 the details of the present invention can be seen. Owing to the structure shown, data signal reflection points are reduced or eliminated by keeping the width of wireless suspension termination pads 200 constant with (equal to) the width of the wireless suspension traces 200 a (best shown in FIG. 3 d ) in each suspension tail 202 that lead to the wireless suspension termination pads 200 . Also, the widths of the termination pads 204 on the AE cable 206 are approximately equal to the widths of the traces 204 a of the cable. Referring to FIG. 2 , the minimum space “A” between AE termination pads 204 that can be manufactured limits the distance “B” between termination pad pair 205 .
- FIGS. 3 a - 3 i show various components of the suspension tail 202 and AE cable 206 .
- FIG. 3 a shows all of the layers of the present suspension tail 202
- FIGS. 3 b - 3 e respectively show the steel, polyimide, copper, and cover layers of the suspension tail 202 shown in FIG. 3 a . As discussed above, these layers can be laminated together.
- FIGS. 3 f and 3 g respectively show the suspension with the copper layer facing foremost, and the steel layer facing foremost.
- the present wireless suspension termination pads 200 are formed during etching of the copper layer (refer to FIG. 3 d ).
- FIG. 3 h shows the AE cable termination pads 204 and, in FIG. 3 i, the AE cable 204 is shown facing the termination side.
- the pads 200 , 204 are narrow and elongated, and the alignment of such narrow pads 200 , 204 is made possible by having the suspension pads 200 oriented along a tangent to the arc that the termination pad array normally traverses during the alignment process.
- the alignment operation is primarily accomplished by a rotating motion of the suspension tail 202 about a center point 209 defined by features in the wireless suspension steel.
- the resulting arcs of motion are shown at 210 in FIG. 4 .
- each suspension pad 200 lies along, i.e., essentially describes, a tangent to the arc 210 at the point where the arc 210 passes through the location occupied by the suspension pad 200 .
- Alignment tolerance in the x and y directions is still achieved, despite the narrow pads 200 , 204 by orienting the AE pads 204 at angles that intersect the suspension pads 200 as shown.
- the AE cable termination pads 204 are oriented at an angle in an opposite sense relative to that of the pads 200 of the wireless suspension tail.
- FIG. 5 a non-limiting method for making the invention can be seen.
- electrically conductive suspension traces on the suspension are formed.
- a respective suspension termination pad is formed, with each pad being tangential to the arc of motion at the location the arc passes through the suspension pad.
- cable termination pads are oriented on the AE cable such that each cable termination pad is associated with a respective AE cable trace and each cable termination pad is oriented to cross a respective suspension termination pad.
- each cable termination pad is engaged with a respective suspension termination pad.
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- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
Description
Claims (17)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/359,123 US7525767B2 (en) | 2006-02-21 | 2006-02-21 | System for low profile termination with robust alignment for wireless suspension in hard disk drive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/359,123 US7525767B2 (en) | 2006-02-21 | 2006-02-21 | System for low profile termination with robust alignment for wireless suspension in hard disk drive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20070195463A1 US20070195463A1 (en) | 2007-08-23 |
| US7525767B2 true US7525767B2 (en) | 2009-04-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/359,123 Expired - Fee Related US7525767B2 (en) | 2006-02-21 | 2006-02-21 | System for low profile termination with robust alignment for wireless suspension in hard disk drive |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US7525767B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100134925A1 (en) * | 2008-12-03 | 2010-06-03 | Eun Kyu Jang | Apparatus minimizing impedance in flex-to-printed circuit board connection through the disk base of a hard disk drive |
| US8279560B1 (en) | 2009-03-04 | 2012-10-02 | Western Digital Technologies, Inc. | Head stack assembly with suspension tail bond alignment by solder pin |
| US8611052B1 (en) * | 2012-03-27 | 2013-12-17 | Western Digital Technologies, Inc. | Systems and methods for aligning components of a head stack assembly of a hard disk drive |
| US8934199B1 (en) | 2014-03-31 | 2015-01-13 | Western Digital Technologies, Inc. | Disk drive head suspension tail with bond pad edge alignment features |
| US9214174B1 (en) | 2010-10-29 | 2015-12-15 | Western Digital Technologies, Inc. | Method of manufacturing a disk drive head gimbal assembly having a flexure tail with folded bond pads |
| US9330695B1 (en) | 2013-12-10 | 2016-05-03 | Western Digital Technologies, Inc. | Disk drive head suspension tail with a noble metal layer disposed on a plurality of structural backing islands |
| US9633680B2 (en) | 2010-10-29 | 2017-04-25 | Western Digital Technologies, Inc. | Head suspension having a flexure tail with a covered conductive layer and structural layer bond pads |
| US11924958B2 (en) | 2021-06-23 | 2024-03-05 | Western Digital Technologies, Inc. | Flexible printed circuit copper overlay for temperature management |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11430474B1 (en) * | 2021-04-23 | 2022-08-30 | Western Digital Technologies, Inc. | Hard disk drive suspension tail having narrowing tip |
| US11818834B2 (en) * | 2021-06-23 | 2023-11-14 | Western Digital Technologies, Inc. | Flexible printed circuit finger layout for low crosstalk |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5074029A (en) * | 1990-10-02 | 1991-12-24 | International Business Machines Corporation | Method for stringing wire on an actuator arm |
| US5600515A (en) | 1993-06-30 | 1997-02-04 | Matsushita Electric Industrial Co., Ltd. | Sliding type magnetic head assembly having a spherical contact surface offset from a magnetic pole |
| US5661896A (en) * | 1995-05-19 | 1997-09-02 | International Business Machines Corporation | Method of manufacturing a termination pad manipulator for a laminated suspension in a data storage system |
| US5956209A (en) | 1996-10-04 | 1999-09-21 | International Business Machines Corporation | Integrated suspension flexure having a compliant tip termination platform |
| JP2001057040A (en) | 1999-08-13 | 2001-02-27 | Sony Corp | Head suspension, head gimbals assembly and actuator |
| US6477014B1 (en) | 1994-05-19 | 2002-11-05 | International Business Machines Corporation | Multilayered suspension with conductive lead structure extending beyond base layer |
| US20050018356A1 (en) | 2001-08-28 | 2005-01-27 | Hernandez Manuel A. | Wireless suspension design to accommodate multiple drive designs |
| US20050078415A1 (en) * | 2001-10-11 | 2005-04-14 | Tatsumi Tsuchiya | Integrated lead suspension and method of construction |
| US20060118330A1 (en) * | 2004-12-07 | 2006-06-08 | Nitto Denko Corporation | Wired circuit board and connecting structure thereof |
-
2006
- 2006-02-21 US US11/359,123 patent/US7525767B2/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5074029A (en) * | 1990-10-02 | 1991-12-24 | International Business Machines Corporation | Method for stringing wire on an actuator arm |
| US5600515A (en) | 1993-06-30 | 1997-02-04 | Matsushita Electric Industrial Co., Ltd. | Sliding type magnetic head assembly having a spherical contact surface offset from a magnetic pole |
| US6477014B1 (en) | 1994-05-19 | 2002-11-05 | International Business Machines Corporation | Multilayered suspension with conductive lead structure extending beyond base layer |
| US5661896A (en) * | 1995-05-19 | 1997-09-02 | International Business Machines Corporation | Method of manufacturing a termination pad manipulator for a laminated suspension in a data storage system |
| US5956209A (en) | 1996-10-04 | 1999-09-21 | International Business Machines Corporation | Integrated suspension flexure having a compliant tip termination platform |
| JP2001057040A (en) | 1999-08-13 | 2001-02-27 | Sony Corp | Head suspension, head gimbals assembly and actuator |
| US20050018356A1 (en) | 2001-08-28 | 2005-01-27 | Hernandez Manuel A. | Wireless suspension design to accommodate multiple drive designs |
| US20050078415A1 (en) * | 2001-10-11 | 2005-04-14 | Tatsumi Tsuchiya | Integrated lead suspension and method of construction |
| US20060118330A1 (en) * | 2004-12-07 | 2006-06-08 | Nitto Denko Corporation | Wired circuit board and connecting structure thereof |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100134925A1 (en) * | 2008-12-03 | 2010-06-03 | Eun Kyu Jang | Apparatus minimizing impedance in flex-to-printed circuit board connection through the disk base of a hard disk drive |
| US8120877B2 (en) * | 2008-12-03 | 2012-02-21 | Eun Kyu Jang | Apparatus minimizing impedance in flex-to-printed circuit board connection through the disk base of a hard disk drive |
| US8279560B1 (en) | 2009-03-04 | 2012-10-02 | Western Digital Technologies, Inc. | Head stack assembly with suspension tail bond alignment by solder pin |
| US9214174B1 (en) | 2010-10-29 | 2015-12-15 | Western Digital Technologies, Inc. | Method of manufacturing a disk drive head gimbal assembly having a flexure tail with folded bond pads |
| US9633680B2 (en) | 2010-10-29 | 2017-04-25 | Western Digital Technologies, Inc. | Head suspension having a flexure tail with a covered conductive layer and structural layer bond pads |
| US9953667B2 (en) | 2010-10-29 | 2018-04-24 | Western Digital Technologies, Inc. | Disk drive system |
| US8611052B1 (en) * | 2012-03-27 | 2013-12-17 | Western Digital Technologies, Inc. | Systems and methods for aligning components of a head stack assembly of a hard disk drive |
| US9330695B1 (en) | 2013-12-10 | 2016-05-03 | Western Digital Technologies, Inc. | Disk drive head suspension tail with a noble metal layer disposed on a plurality of structural backing islands |
| US9881640B2 (en) | 2013-12-10 | 2018-01-30 | Western Digital Technologies, Inc. | Disk drive head suspension tail with a noble metal layer disposed on a plurality of structural backing islands |
| US8934199B1 (en) | 2014-03-31 | 2015-01-13 | Western Digital Technologies, Inc. | Disk drive head suspension tail with bond pad edge alignment features |
| US11924958B2 (en) | 2021-06-23 | 2024-03-05 | Western Digital Technologies, Inc. | Flexible printed circuit copper overlay for temperature management |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070195463A1 (en) | 2007-08-23 |
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