US714861A

US714861A - Process of electrolytic separation of copper and nickel.

Info

Publication number: US714861A
Application number: US12408099A
Authority: US
Inventors: David H Browne
Original assignee: CANADIAN COPPER Co
Current assignee: CANADIAN COPPER Co
Priority date: 1899-01-27
Filing date: 1899-01-27
Publication date: 1902-12-02
Anticipated expiration: 1919-12-02

Description

No. 714,86I. Patented Dec. 2, 1902.

n. H. anowua.

PROCESS OF ELECTROLYTIC SEPARATION OF COPPER AND NICKEL.

(Appucation filed Jan. 27, 1899. Renewed Sept. 19, 1902.) I (No Modal.)

Witnesses,

THE norms Pzrza; co. PHOTO-LITHQ, wAsmuc'rnn, o. c

UNITED STATES DAVID H. BROWNE, OF CLEVELAND,

COPPER COMPANY, OF

PATENT OFFICE.

OHIO, ASSIGNOR TO THE CANADIAN PROCESS OF ELECTROLYTIC SEPARATION OF COPPER AND NICKEL.

SPECIFICATION forming part of Letters Patent No. 714,861, dated December 2, 1902.

Application filed January 27, 1899. Renewed September 19, 1902. Serial No. 124,080.

T aZZ whom, it may concern.-

Be it known that I, DAVID H. BROWNE, a citizen on the United States, and a resident of Cleveland, county of Cuyahoga, and Stateof Ohio, have invented a new and useful Improvement in Processes for the Electrolytic Separation of Copper and Nickel, of which the following is a specification, the principle of the invention being herein explained and the best mode in which I have contemplated applying that principle, so as to distinguish it from other inventions.

My invention has for its object the improved separation of copper and nickel by electrolysis on a commercial scale; and it consists of a process hereinafter fully described.

In the annexed drawing is represented diagrammatically one form of apparatus adapted to be used in my process.

Copper-nickel matte is treated by any suitable process to form copper-nickel alloy substantially free from sulfur. From the coppernickel alloy so procured are made in proportions dependent upon the relative amount of copper and nickel therein contained coppernickel anodes and copper-nickel fragments or powder.

The copper-nickel fragments or powder are placed in a receptacle A, which I shall designate the shot-tower and which is provided with apertures a a a Such subject-matter is there subjected simultaneously to the action of a stream of a solvent for cuprous chlorid, such as salt Water, introduced into the top of the tower at a and a stream of free chlorin introduced at the side of the tower through the aperture a. The combinediactions of the salt Water and of the heat produced by the combination of the chlorin with the copper-nickel alloy form a solution of cuprous and nickel chlorids,the reaction being prous chlorid is decomposed, the copper platin g out upon the cathode, and the chlorin com- (No specimens.)

bining with the copper and the nickel of the anode, forming cuprous chlorid and additional nickel chlorid, the reaction being 2ouNi+sc1=ou,o1,+2Nio1,. The cuprous chlorid so formed is also decomposed in the same manner as was that of the original solution, cuprous and nickel ohlorids being formed from the anode as before and copper plating out. In this manner all the copper is plated out and only nickel chlorid remains, which nickel chlorid is permitted to emerge from the cell, as at 6 The nickel chlorid is now freed from any impurities, 5 such as iron or traces of copper, the iron being precipitated by any alkali, which neutralizes the liquor, the reaction being Said liquor is then heated to a temperature of between 30 and 60 centigrade and is also increased in strength, preferably to a density of from 30 to 50 Baum. It is thereupon introduced into a nickel-plating apparatus, which may consist of a series of cells, such as C, each of which may have a porous diaphragm c, an anode-cap c, a carbon anode 0 a nickel cathode 0 a chlorin-escape 0 connecting with aperture a of the shot-tower A. On the passage of an electric current through this latter solution nickel is plated upon the cathode and chlorin gas is liberated at the anode, the reaction being NiCl, electric current Ni+2OL Said chlorin gas is thence conducted to the shot-tower A and is utilized, as previously described, to form the solution of copper and 9o nickel chloride, the reaction being 2CuNi+6Ol=Cu,Cl +2NiCl,.

Other modes of applying the principle of my invention may be employed instead of the one explained, change being made as regards the steps herein disclosed, provided the means covered by any one of the following claims be employed.

I therefore particularly point out and dis- I00 tinctly claim as my invention 1. In the art of copper separation, the process which consists in: first, treating coppernickel matte to form copper-nickel alloy substantially free from sulfur; then, treating said alloy with chlorin and a solvent for enprous chlorid, substantially as set forth.

2. In the art of copper separation, the process which consists in: subjecting a' mass of cupriferous material to chlorin introduced at one point of said mass, and concurrently subjecting said mass to a solvent for cuprous chlorid introduced at another point of said mass, substantially as set forth.

3. In the art, of copper separation, the process which consists in: treating copper-nickel matte to form copper-nickel alloy substantially free from sulfur; subjecting a mass of said alloy to chlorin introduced at one point of said mass, and concurrently subjecting said mass to a solvent for cuprous chlorid introduced at another point of said mass, substantially as set forth.

4. In the art of copper sepa ration, the process which consists in: subjecting a mass of cupriferous material to chlorin introduced therein below the top of said mass, and concurrently subjecting said inass to a solvent for cuprous chlorid introduced therein at a higher level than said chlorin is introduced, substantially as set forth.

5. In the art of copper separation, the process which consists in: treating copper-nickel matte to form copper-nickel alloy substantially free from sulfur; subjecting a mass of said alloy to chlorin introduced therein below the top of said mass, and concurrently subjecting said mass to a solvent for cuprous chlorid introduced therein at a higher level than said chlorin isintroduced, substantially as set forth.

6. In the art of copper separation, the process which consists in: subjecting coppernickel alloy to chlorin and a solvent for cuprous chlorid, thereby forming a solution of copper chlorid and nickel chlorid; electrolyzing said solution, plating out copper therefrom, and forming a residuary. solution of nickel chlorid; electrolyzing said solution of nickel chlorid, plating out nickel therefrom, and separating chlorin therefrom, substantially as set forth.

'7. In the art of copper separation, the process which consists in: treating copper-nickel matte to form copper-nickel alloy substan tially free from sulfur; subjecting said alloy to chlorin and a solvent for cuprous chlorid, thereby forming a solution of copper chlorid and nickel chlorid; electrolyzing said solution, plating out copper therefrom, and forming a residuary solution of nickel chlorid; electrolyzing said solution of nickel chlorid, plating out nickel therefrom, and separating chlorin therefrom, substantially as set forth.

8. In the art of, copper separation, the process which consists in: electrolyzing a solution of copper chlorid and nickel chlorid, plating out copper therefrom, and forming aresiduary solution of nickel chlorid; electrolyzing said nickel-chlorid solution,plating out nickel therefrom,'and separating chlorin therefrom;

subjecting cupriferous material to the concurrent action of said chlorin and a solvent for cuprous chlorid, substantially as set forth.

9. In the art of copper separation, the process which consists in: electrolyzing a solution of copper chlorid and nickel chlorid, plating out copper therefrom, and forming a residuary solution of nickel chlorid; electrolyzing said nickel-chlorid solution,plating out nickel therefrom, and separating chlorin therefrom; treating copper-nickel matte to form coppernickel alloy substantially free from sulfur; subjecting said alloy to the concurrent action of said chlorin and a solvent for cuprous chlorid, substantially as set forth.

10. In the art of copper separation, the process which consists in: electrolyzing a solution of nickel chlorid, plating out nickel there from, and separating chlorin therefrom; subjecting cupriferous material concurrently to said chlorin and a solvent for cuprous chlorid, substantiallyas set forth.

11. In the art of copper separation,the process which consists in: electrolyzing a solution of nickel chlorid, plating out nickel therefrom, and separating chlorin therefrom; treating copper-nickel matte to form coppernickel alloy substantially free from sulfur; subjecting said alloy concurrently to said chlorin and a solvent for cuprous chlorid, substantially as set forth.

12. In the art of copper separation, the process which consists in electrolyzing a solution of nickel chlorid, plating out nickel therefrom,.and separating chlorin therefrom; subjecting copper-nickel alloy concurrently to said chlorin and a solvent for cuprous chlorid; electrolyzing the residuary solution of copper chlorid and nickel chlorid, plating out copper therefrom, and leaving nickel-chlorid solution, substantially as set forth.

13. In the art of copper separation, the process which consists in: electrolyzing a solution of nickel chlorid, plating out nickel therefrom, and separating chlorin therefrom; treating copper-nickel matte to form coppernickel alloy substantially free from sulfur; subjecting said alloy concurrently to said chlorin and a solvent for cuprous chlorid; electrolyzing the residuary solution of copper chlorid and nickel chlorid, plating out copper therefrom, and leaving nickel-chlorid solution, substantially as set forth.

Signed by me this 13th day of January, 1899.

DAVID H. BROWNE.

Attest:

D. T. DAVIES, A. E. MERKEL.

IIO