US7077189B1 - Liquid cooled thermosiphon with flexible coolant tubes - Google Patents
Liquid cooled thermosiphon with flexible coolant tubes Download PDFInfo
- Publication number
- US7077189B1 US7077189B1 US11/040,321 US4032105A US7077189B1 US 7077189 B1 US7077189 B1 US 7077189B1 US 4032105 A US4032105 A US 4032105A US 7077189 B1 US7077189 B1 US 7077189B1
- Authority
- US
- United States
- Prior art keywords
- tubes
- housing
- heat
- lower portion
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the subject invention is related to the inventions disclosed in co-pending applications DP-311409 (H&H 60408-566) and DP-312789 (H&H 60408-597), filed concurrently herewith.
- a fluid heat exchanger assembly for cooling an electronic device for cooling an electronic device.
- Heat exchangers and heat sink assemblies have been used that apply natural or forced convection cooling methods to cool the electronic devices. These heat exchangers typically use air to directly remove heat from the electronic devices. However, air has a relatively low heat capacity. Such heat sink assemblies are suitable for removing heat from relatively low power heat sources with power density in the range of 5 to 15 W/cm 2 . The increased computing speeds result in corresponding increases in the power density of the electronic devices in the order of 20 to 35 W/cm 2 thus requiring more effective heat sink assemblies.
- liquid-cooled units called LCUs employing a cold plate in conjunction with high heat capacity fluids, like water and water-glycol solutions, have been used to remove heat from these types of high power density heat sources.
- LCU liquid-cooled units
- One type of LCU circulates the cooling liquid so that the liquid removes heat from the heat source, like a computer chip, affixed to the cold plate, and is then transferred to a remote location where the heat is easily dissipated into a flowing air stream with the use of a liquid-to-air heat exchanger and an air moving device such as a fan or a blower.
- LCUs are characterized as indirect cooling units since they remove heat from the heat source indirectly by a secondary working fluid, generally a single-phase liquid, which first removes heat from the heat source and then dissipates it into the air stream flowing through the remotely located liquid-to-air heat exchanger.
- secondary working fluid generally a single-phase liquid
- thermosiphon cooling units Such TCUs perform better than LCUs above 45 W/cm 2 heat flux at the cold plate.
- a typical TCU absorbs heat generated by the electronic device by vaporizing the captive working fluid on a boiler plate of the unit. The boiling of the working fluid constitutes a phase change from liquid-to-vapor state and as such the working fluid of the TCU is considered to be a two-phase fluid.
- the vapor generated during boiling of the working fluid is then transferred to an air-cooled condenser, in close proximity to the boiler plate, where it is liquefied by the process of film condensation over the condensing surface of the TCU.
- the heat is rejected into an air stream flowing over a finned external surface of the condenser.
- the condensed liquid is returned back to the boiler plate by gravity to continue the boiling-condensing cycle.
- heat generated by an electronic device is transferred to the lower portion of a housing having a refrigerant therein for liquid-to-vapor transformation as coolant liquid flows through a plurality of flexible tubes in an upper portion of the housing to vary the volume of the tubes for modulating the flow of coolant liquid through the tubes in response to heat transferred by the electronic device to the lower portion of the housing.
- the invention employs an array of flexible tubes to separate the secondary two-phase fluid from the single-phase working fluid of the LCU.
- the flexible tubes perform the useful function of changing the volume of the upper portion or boiling chamber depending on the chip heat flux. As the chip heat flux increases, the flexible tubes contract decreasing the tube volume thereby increasing the coolant flow velocity and the heat transfer. As the chip heat flux decreases, the flexible tubes expand increasing the tube volume thereby decreasing the coolant flow velocity and the heat transfer. Thus the flexible tubes continuously regulate the working fluid flow velocity through the tubes thereby adjusting the heat transfer rate in response to computer cooling demand.
- the present invention utilizes a captive secondary fluid capable of undergoing liquid-to-vapor transformation within the boiling chamber to remove heat by ebullition from the cold plate.
- the resulting vapor surrounds the flexible tubes through which flows the working fluid of the TCU without coming in direct contact with the secondary fluid vapor.
- the secondary fluid vapor is condensed by the working liquid coolant flowing to the interior of the flexible tubes.
- the boiling chamber with the secondary two-phase fluid functions as a thermosiphon with superincumbent flexible tubes with working fluid flowing them serving as the condenser tubes.
- the heat transfer rate of the two-phase secondary fluid is inherently higher than that of the single-phase working fluid. Therefore, besides enhancing the cooling capacity of the TCU, the invention solves the problem of corrosion and leakage that plagues the LCU with highly aggressive working fluid flowing directly over the cold plate.
- the captive two-phase secondary fluid in direct contact with the cold plate is not as aggressive as the working fluid of the LCU.
- FIG. 1 is a perspective view of the heat exchanger of the subject invention showing the housing cutaway;
- FIG. 2 is a cross sectional view of the heat exchanger shown in FIG. 1 ;
- FIG. 3 is a schematic of a liquid cooling system in which the heat exchanger of the subject invention may be utilized.
- a fluid heat exchanger comprises a housing 20 having an inlet 22 and an outlet 24 and an upper portion 26 and a lower portion 28 extending between the inlet 22 and the outlet 24 for establishing a direction of flow from the inlet 22 to the outlet 24 .
- the assembly is used to cool an electronic device 30 engaging or secured to the lower portion 28 of the housing 20 , as by being adhesively held in a recess (not shown) in the bottom of the housing 20 .
- a plurality of tubes 32 extend between a pair of header tanks 34 in fluid communication with the inlet 22 and the outlet 24 for establishing a flow of coolant liquid from the inlet 22 to the outlet 24 in the upper portion 26 of the housing 20 .
- the inlet 22 and outlet 24 header tanks 34 are in fluid communication with opposite ends of the tubes 32 for feeding coolant liquid to the various tubes 32 from the inlet 22 and for collecting coolant liquid from the various tubes 32 for feeding the coolant liquid to the outlet 24 .
- the inlet 22 feeds cooling fluid into the header tank 34 at the inlet 22 of the housing 20 and the outlet 24 conveys the coolant away from the header tank 34 at the outlet 24 of the housing 20 .
- the housing 20 is hermetically sealed about the tubes 32 to contain a refrigerant in the lower portion 28 for liquid-to-vapor transformation.
- the tubes 32 are radially flexible to vary the volume of the tubes 32 for modulating the flow of coolant liquid through the tubes 32 in response to heat transferred by the electronic device 30 to the lower portion 28 of the housing 20 .
- Each of the tubes 32 defines a cross section having a generally hour-glass shape with a waisted middle whereby the concave sides of each tube 32 move in and out in response to the pressure of coolant flow through the tubes 32 .
- the tubes 32 may comprise a thin gage metal, although various materials may be utilized that are inert to the coolant and the refrigerant.
- the tubes 32 may be made by impact extrusion like tooth paste containers.
- a plurality of fins 36 extend from the bottom of the housing 20 for increasing heat transfer from the electronic device 30 to the interior of the lower portion 28 of the housing 20 .
- the fins 36 extend linearly in the direction of flow under the tubes 32 and between the header tanks 34 .
- the heat transfer fins 36 are disposed in the lower portion 28 of the housing 20 for transferring heat from the electronic device 30 disposed on the exterior of the lower portion 28 of the housing 20 by boiling the refrigerant in the lower portion 28 of the housing 20 .
- the fins 36 could be of the type disclosed in U.S. Pat. No. 6,588,498.
- the upper portion 26 of the housing 20 is generally rectangular and the lower portion 28 of the housing 20 is generally rectangular and the upper portion 26 has a larger periphery to overhang the lower portion 28 by the width of the header tanks 34 .
- the housing 20 is generally a square in both the upper 26 and lower portions 28 but the header tanks 34 extend in one direction or along one axis from opposite sides of the upper portion 26 to overhang the lower portion 28 .
- the upper portion 26 has the same footprint as the lower portion 28 except when the header tanks 34 are included with the upper portion 26 , the upper portion 26 has a larger footprint than the lower portion 28 in one direction or along one axis.
- the housing 20 actually comprises a top wall 38 extending between the header tanks 34 and spaced from and over the tubes 32 and a bottom wall 40 to which the electronic element is adhesively attached.
- a pair of oppositely disposed side walls 42 extend vertically between the top wall 38 and the bottom wall 40 and spaced laterally from the side-most tubes 32 and a pair of oppositely disposed end walls 44 extend vertically between the bottom wall 40 and the bottoms of the header tanks 34 .
- the joints between the various walls and between the side walls 42 , the end walls 44 and the header tanks 34 are all hermetically sealed, as by brazing, or the like.
- the upper portion 26 of the housing 20 completely surrounds, i.e. is spaced from, the tubes 32 so that the tubes 32 are surrounded by refrigerant vapor.
- the operation of the heat exchanger housing 20 is incorporated into a liquid cooling system as illustrated in FIG. 3 .
- the electronic device 30 generates an amount of heat to be dissipated and the heat is transferred from the electronic device 30 to the bottom of the heat exchanger housing 20 .
- the heat is then conducted from the bottom to the fins 36 and thence to the cooling fluid.
- a working fluid mover such as a pump P, moves a fluid, usually a liquid, through a working fluid storage vessel T, that stores excess working fluid.
- the pump P moves the cooling fluid through a heat extractor or radiator assembly to dissipate heat from the cooling fluid, the heat extractor or radiator assembly including a fan F and radiator R.
- the radiator R can be of the well known type including tubes 32 with cooling fins 36 between the tubes 32 to exchange heat between the cooling fluid passing through the tubes 32 and air forced through the fins 36 by the fan F.
- the invention therefore provides a method of cooling an electronic device 30 by disposing a refrigerant in the lower portion 28 of the housing 20 for liquid-to-vapor transformation and transferring the heat generated by the electronic device 30 to the lower portion 28 of a housing 20 .
- the method is distinguished by flowing coolant liquid through the plurality of flexible tubes 32 in an upper portion 26 of the housing 20 and varying the volume of the tubes 32 for modulating the flow of coolant liquid through the tubes 32 in response to heat transferred by an electronic device 30 to the lower portion 28 of the housing 20 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/040,321 US7077189B1 (en) | 2005-01-21 | 2005-01-21 | Liquid cooled thermosiphon with flexible coolant tubes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/040,321 US7077189B1 (en) | 2005-01-21 | 2005-01-21 | Liquid cooled thermosiphon with flexible coolant tubes |
Publications (2)
Publication Number | Publication Date |
---|---|
US7077189B1 true US7077189B1 (en) | 2006-07-18 |
US20060162898A1 US20060162898A1 (en) | 2006-07-27 |
Family
ID=36658977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/040,321 Active US7077189B1 (en) | 2005-01-21 | 2005-01-21 | Liquid cooled thermosiphon with flexible coolant tubes |
Country Status (1)
Country | Link |
---|---|
US (1) | US7077189B1 (en) |
Cited By (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050243520A1 (en) * | 2004-04-28 | 2005-11-03 | Kentaro Tomioka | Pump and electronic device having the pump |
US20050265001A1 (en) * | 2004-05-31 | 2005-12-01 | Tomonori Saito | Cooling system and projection-type image display apparatus using the same |
US20070230120A1 (en) * | 2003-05-26 | 2007-10-04 | Yukihiko Hata | Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components |
US20080259558A1 (en) * | 2004-04-28 | 2008-10-23 | Kabushiki Kaisha Toshiba | Heat-Receiving Apparatus and Electronic Equipment |
US20090284925A1 (en) * | 2008-05-14 | 2009-11-19 | Abb Research Ltd | Evaporator for a cooling circuit |
US20100018678A1 (en) * | 2004-12-01 | 2010-01-28 | Convergence Technologies Limited | Vapor Chamber with Boiling-Enhanced Multi-Wick Structure |
US20100128436A1 (en) * | 2008-11-26 | 2010-05-27 | General Electric Company | Method and apparatus for cooling electronics |
US20100214740A1 (en) * | 2005-07-30 | 2010-08-26 | Articchoke Enterprises | Phase-Separated Evaporator, Blade-Thru Condenser and Heat Dissipation System Thereof |
US20100270010A1 (en) * | 2009-04-28 | 2010-10-28 | Abb Research Ltd | Twisted tube thermosyphon |
US20100277870A1 (en) * | 2009-04-29 | 2010-11-04 | Abb Research Ltd | Multi-row thermosyphon heat exchanger |
US20100290188A1 (en) * | 2007-09-17 | 2010-11-18 | International Business Machines Corporation | Integrated circuit stack |
US20100328889A1 (en) * | 2009-06-25 | 2010-12-30 | International Business Machines Corporation | Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling |
US20100328890A1 (en) * | 2009-06-25 | 2010-12-30 | International Business Machines Corporation | Condenser structures with fin cavities facilitating vapor condensation cooling of coolant |
US20100328891A1 (en) * | 2009-06-25 | 2010-12-30 | International Business Machines Corporation | Condenser block structures with cavities facilitating vapor condensation cooling of coolant |
US20100326628A1 (en) * | 2009-06-25 | 2010-12-30 | International Business Machines Corporation | Condenser fin structures facilitating vapor condensation cooling of coolant |
US20110122583A1 (en) * | 2009-11-23 | 2011-05-26 | Delphi Technologies, Inc. | Immersion cooling apparatus for a power semiconductor device |
US20110232882A1 (en) * | 2010-03-29 | 2011-09-29 | Zaffetti Mark A | Compact cold plate configuration utilizing ramped closure bars |
US20120120604A1 (en) * | 2010-11-11 | 2012-05-17 | Mingliang Hao | Heat dissipation device |
US20130044431A1 (en) * | 2011-08-18 | 2013-02-21 | Harris Corporation | Liquid cooling of stacked die through substrate lamination |
US8869877B2 (en) | 2010-10-11 | 2014-10-28 | Hamilton Sundstrand Space Systems International, Inc. | Monolithic cold plate configuration |
US8893513B2 (en) | 2012-05-07 | 2014-11-25 | Phononic Device, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
US20150060009A1 (en) * | 2013-02-01 | 2015-03-05 | Dell Products L.P. | Techniques for Controlling Vapor Pressure in an Immersion Cooling Tank |
US8991194B2 (en) | 2012-05-07 | 2015-03-31 | Phononic Devices, Inc. | Parallel thermoelectric heat exchange systems |
US9593871B2 (en) | 2014-07-21 | 2017-03-14 | Phononic Devices, Inc. | Systems and methods for operating a thermoelectric module to increase efficiency |
US10156385B1 (en) | 2017-08-15 | 2018-12-18 | Christopher Kapsha | Multistage refrigeration system |
US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
US10744603B2 (en) | 2015-03-16 | 2020-08-18 | Dana Canada Corporation | Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same |
US10966349B1 (en) * | 2020-07-27 | 2021-03-30 | Bitfury Ip B.V. | Two-phase immersion cooling apparatus with active vapor management |
US20210315130A1 (en) * | 2020-04-07 | 2021-10-07 | Abb Schweiz Ag | Cooling Element And Method Of Manufacturing A Cooling Element |
US11201103B2 (en) * | 2019-05-31 | 2021-12-14 | Microsoft Technology Licensing, Llc | Vapor chamber on heat-generating component |
US20220046824A1 (en) * | 2019-09-10 | 2022-02-10 | Furukawa Electric Co., Ltd. | Cooling device and cooling system using cooling device |
US11326836B1 (en) * | 2020-10-22 | 2022-05-10 | Asia Vital Components Co., Ltd. | Vapor/liquid condensation system |
US20220217871A1 (en) * | 2019-12-30 | 2022-07-07 | Gm Cruise Holdings Llc | Embedded and immersed heat pipes in automated driving system computers |
US11466190B2 (en) * | 2018-06-25 | 2022-10-11 | Abb Schweiz Ag | Forced air cooling system with phase change material |
US20230041910A1 (en) * | 2019-12-05 | 2023-02-09 | Provides Metalmeccanica S.R.L. | Cooling system of electronic systems, in particular for data centre |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8850816B2 (en) * | 2010-05-11 | 2014-10-07 | Dell Products L.P. | Power regeneration for an information handling system |
AU2012232967B2 (en) | 2011-10-31 | 2015-01-15 | Abb Technology Ag | Cabinet with modules having a thermosiphon cooler arrangement |
AU2012232968B2 (en) * | 2011-10-31 | 2014-11-13 | Abb Technology Ag | Thermosiphon cooler arrangement in modules with electric and/or electronic components |
JP5824662B2 (en) * | 2011-11-08 | 2015-11-25 | パナソニックIpマネジメント株式会社 | Cooling device for cooling rack servers and data center equipped with the same |
ES2873090T3 (en) * | 2011-12-13 | 2021-11-03 | Alcatel Lucent | Thermal management of photonic arrays |
ES2638857T3 (en) * | 2012-03-28 | 2017-10-24 | Abb Research Ltd. | Heat exchanger for traction converters |
US8941994B2 (en) | 2012-09-13 | 2015-01-27 | International Business Machines Corporation | Vapor condenser with three-dimensional folded structure |
JP6794769B2 (en) * | 2016-10-21 | 2020-12-02 | 富士通株式会社 | Information processing device |
US20220232736A1 (en) * | 2019-05-21 | 2022-07-21 | Antpool Technologies Limited | Cooling device and data processing apparatus |
TWI708038B (en) * | 2019-08-27 | 2020-10-21 | 邁萪科技股份有限公司 | Heat dissipating device using phase changes to transmit heat |
US11125507B2 (en) | 2019-11-21 | 2021-09-21 | Taiwan Microloops Corp. | Heat dissipating apparatus using phase change heat transfer |
US11259447B2 (en) * | 2019-12-27 | 2022-02-22 | Baidu Usa Llc | Composite liquid cooling device |
Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2083611A (en) * | 1931-12-05 | 1937-06-15 | Carrier Corp | Cooling system |
US3415315A (en) * | 1966-06-29 | 1968-12-10 | Borg Warner | Heat exchanger |
US3511310A (en) * | 1968-04-15 | 1970-05-12 | Varian Associates | Integral vapor cooling system |
US3906261A (en) * | 1973-06-12 | 1975-09-16 | Mitsubishi Electric Corp | Linear acceleration apparatus with cooling system |
US4020399A (en) * | 1974-03-15 | 1977-04-26 | Mitsubishi Denki Kabushiki Kaisha | Vapor cooling device for dissipating heat of semiconductor elements |
US4138692A (en) | 1977-09-12 | 1979-02-06 | International Business Machines Corporation | Gas encapsulated cooling module |
US4153921A (en) * | 1978-02-06 | 1979-05-08 | General Electric Company | Thermally stabilized metal oxide varistors |
US4173996A (en) * | 1978-09-05 | 1979-11-13 | General Electric Company | Heat exchanger arrangement for vaporization cooled transfomers |
US4246597A (en) * | 1979-06-29 | 1981-01-20 | International Business Machines Corporation | Air cooled multi-chip module having a heat conductive piston spring loaded against the chips |
US4260014A (en) * | 1979-04-09 | 1981-04-07 | International Telephone And Telegraph Corporation | Ebullient cooled power devices |
US4620900A (en) * | 1983-12-13 | 1986-11-04 | Nitto Electric Industrial Company Ltd. | Thermopervaporation apparatus |
US4704658A (en) | 1985-04-30 | 1987-11-03 | Fujitsu Limited | Evaporation cooling module for semiconductor devices |
US5150274A (en) * | 1990-07-11 | 1992-09-22 | Hitachi, Ltd. | Multi-chip-module |
US5198889A (en) | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
US5304846A (en) | 1991-12-16 | 1994-04-19 | At&T Bell Laboratories | Narrow channel finned heat sinking for cooling high power electronic components |
US5529115A (en) | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
US5704416A (en) | 1993-09-10 | 1998-01-06 | Aavid Laboratories, Inc. | Two phase component cooler |
US6062302A (en) | 1997-09-30 | 2000-05-16 | Lucent Technologies Inc. | Composite heat sink |
US6410982B1 (en) | 1999-11-12 | 2002-06-25 | Intel Corporation | Heatpipesink having integrated heat pipe and heat sink |
US6422307B1 (en) | 2001-07-18 | 2002-07-23 | Delphi Technologies, Inc. | Ultra high fin density heat sink for electronics cooling |
US20030034148A1 (en) | 2001-08-16 | 2003-02-20 | Nec Corporation | Telecommunication device including a housing having improved heat conductivity |
US6808015B2 (en) | 2000-03-24 | 2004-10-26 | Denso Corporation | Boiling cooler for cooling heating element by heat transfer with boiling |
-
2005
- 2005-01-21 US US11/040,321 patent/US7077189B1/en active Active
Patent Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2083611A (en) * | 1931-12-05 | 1937-06-15 | Carrier Corp | Cooling system |
US3415315A (en) * | 1966-06-29 | 1968-12-10 | Borg Warner | Heat exchanger |
US3511310A (en) * | 1968-04-15 | 1970-05-12 | Varian Associates | Integral vapor cooling system |
US3906261A (en) * | 1973-06-12 | 1975-09-16 | Mitsubishi Electric Corp | Linear acceleration apparatus with cooling system |
US4020399A (en) * | 1974-03-15 | 1977-04-26 | Mitsubishi Denki Kabushiki Kaisha | Vapor cooling device for dissipating heat of semiconductor elements |
US4138692A (en) | 1977-09-12 | 1979-02-06 | International Business Machines Corporation | Gas encapsulated cooling module |
US4153921A (en) * | 1978-02-06 | 1979-05-08 | General Electric Company | Thermally stabilized metal oxide varistors |
US4173996A (en) * | 1978-09-05 | 1979-11-13 | General Electric Company | Heat exchanger arrangement for vaporization cooled transfomers |
US4260014A (en) * | 1979-04-09 | 1981-04-07 | International Telephone And Telegraph Corporation | Ebullient cooled power devices |
US4246597A (en) * | 1979-06-29 | 1981-01-20 | International Business Machines Corporation | Air cooled multi-chip module having a heat conductive piston spring loaded against the chips |
US4620900A (en) * | 1983-12-13 | 1986-11-04 | Nitto Electric Industrial Company Ltd. | Thermopervaporation apparatus |
US4704658A (en) | 1985-04-30 | 1987-11-03 | Fujitsu Limited | Evaporation cooling module for semiconductor devices |
US5198889A (en) | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
US5150274A (en) * | 1990-07-11 | 1992-09-22 | Hitachi, Ltd. | Multi-chip-module |
US5304846A (en) | 1991-12-16 | 1994-04-19 | At&T Bell Laboratories | Narrow channel finned heat sinking for cooling high power electronic components |
US5704416A (en) | 1993-09-10 | 1998-01-06 | Aavid Laboratories, Inc. | Two phase component cooler |
US5529115A (en) | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
US6062302A (en) | 1997-09-30 | 2000-05-16 | Lucent Technologies Inc. | Composite heat sink |
US6410982B1 (en) | 1999-11-12 | 2002-06-25 | Intel Corporation | Heatpipesink having integrated heat pipe and heat sink |
US6808015B2 (en) | 2000-03-24 | 2004-10-26 | Denso Corporation | Boiling cooler for cooling heating element by heat transfer with boiling |
US6422307B1 (en) | 2001-07-18 | 2002-07-23 | Delphi Technologies, Inc. | Ultra high fin density heat sink for electronics cooling |
US20030034148A1 (en) | 2001-08-16 | 2003-02-20 | Nec Corporation | Telecommunication device including a housing having improved heat conductivity |
Cited By (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070230120A1 (en) * | 2003-05-26 | 2007-10-04 | Yukihiko Hata | Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components |
US7280357B2 (en) * | 2004-04-28 | 2007-10-09 | Kabushiki Kaisha Toshiba | Pump and electronic device having the pump |
US20080259558A1 (en) * | 2004-04-28 | 2008-10-23 | Kabushiki Kaisha Toshiba | Heat-Receiving Apparatus and Electronic Equipment |
US7548425B2 (en) | 2004-04-28 | 2009-06-16 | Kabushiki Kaisha Toshiba | Heat-Receiving apparatus and electronic equipment |
US20050243520A1 (en) * | 2004-04-28 | 2005-11-03 | Kentaro Tomioka | Pump and electronic device having the pump |
US20050265001A1 (en) * | 2004-05-31 | 2005-12-01 | Tomonori Saito | Cooling system and projection-type image display apparatus using the same |
US7275833B2 (en) | 2004-05-31 | 2007-10-02 | Kabushiki Kaisha Toshiba | Cooling system and projection-type image display apparatus using the same |
US20100018678A1 (en) * | 2004-12-01 | 2010-01-28 | Convergence Technologies Limited | Vapor Chamber with Boiling-Enhanced Multi-Wick Structure |
US20100214740A1 (en) * | 2005-07-30 | 2010-08-26 | Articchoke Enterprises | Phase-Separated Evaporator, Blade-Thru Condenser and Heat Dissipation System Thereof |
US20100290188A1 (en) * | 2007-09-17 | 2010-11-18 | International Business Machines Corporation | Integrated circuit stack |
US8659898B2 (en) * | 2007-09-17 | 2014-02-25 | International Business Machines Corporation | Integrated circuit stack |
US8363402B2 (en) * | 2007-09-17 | 2013-01-29 | International Business Machines Corporation | Integrated circuit stack |
US8134833B2 (en) * | 2008-05-14 | 2012-03-13 | Abb Research Ltd | Evaporator for a cooling circuit |
US20090284925A1 (en) * | 2008-05-14 | 2009-11-19 | Abb Research Ltd | Evaporator for a cooling circuit |
US20100128436A1 (en) * | 2008-11-26 | 2010-05-27 | General Electric Company | Method and apparatus for cooling electronics |
US7796389B2 (en) * | 2008-11-26 | 2010-09-14 | General Electric Company | Method and apparatus for cooling electronics |
US20100270010A1 (en) * | 2009-04-28 | 2010-10-28 | Abb Research Ltd | Twisted tube thermosyphon |
US9964362B2 (en) | 2009-04-28 | 2018-05-08 | Abb Research Ltd. | Twisted tube thermosyphon |
US20100277870A1 (en) * | 2009-04-29 | 2010-11-04 | Abb Research Ltd | Multi-row thermosyphon heat exchanger |
US9007771B2 (en) * | 2009-04-29 | 2015-04-14 | Abb Research Ltd. | Multi-row thermosyphon heat exchanger |
US8490679B2 (en) | 2009-06-25 | 2013-07-23 | International Business Machines Corporation | Condenser fin structures facilitating vapor condensation cooling of coolant |
US20100326628A1 (en) * | 2009-06-25 | 2010-12-30 | International Business Machines Corporation | Condenser fin structures facilitating vapor condensation cooling of coolant |
US9303926B2 (en) | 2009-06-25 | 2016-04-05 | International Business Machines Corporation | Condenser fin structures facilitating vapor condensation cooling of coolant |
US8059405B2 (en) * | 2009-06-25 | 2011-11-15 | International Business Machines Corporation | Condenser block structures with cavities facilitating vapor condensation cooling of coolant |
US20100328890A1 (en) * | 2009-06-25 | 2010-12-30 | International Business Machines Corporation | Condenser structures with fin cavities facilitating vapor condensation cooling of coolant |
US8014150B2 (en) | 2009-06-25 | 2011-09-06 | International Business Machines Corporation | Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling |
US8018720B2 (en) | 2009-06-25 | 2011-09-13 | International Business Machines Corporation | Condenser structures with fin cavities facilitating vapor condensation cooling of coolant |
US20100328889A1 (en) * | 2009-06-25 | 2010-12-30 | International Business Machines Corporation | Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling |
US20100328891A1 (en) * | 2009-06-25 | 2010-12-30 | International Business Machines Corporation | Condenser block structures with cavities facilitating vapor condensation cooling of coolant |
US8094454B2 (en) * | 2009-11-23 | 2012-01-10 | Delphi Technologies, Inc. | Immersion cooling apparatus for a power semiconductor device |
US20110122583A1 (en) * | 2009-11-23 | 2011-05-26 | Delphi Technologies, Inc. | Immersion cooling apparatus for a power semiconductor device |
US20110232882A1 (en) * | 2010-03-29 | 2011-09-29 | Zaffetti Mark A | Compact cold plate configuration utilizing ramped closure bars |
US8869877B2 (en) | 2010-10-11 | 2014-10-28 | Hamilton Sundstrand Space Systems International, Inc. | Monolithic cold plate configuration |
US8737071B2 (en) * | 2010-11-11 | 2014-05-27 | Huawei Technologies Co., Ltd. | Heat dissipation device |
US20120120604A1 (en) * | 2010-11-11 | 2012-05-17 | Mingliang Hao | Heat dissipation device |
US20130044431A1 (en) * | 2011-08-18 | 2013-02-21 | Harris Corporation | Liquid cooling of stacked die through substrate lamination |
US9341394B2 (en) | 2012-05-07 | 2016-05-17 | Phononic Devices, Inc. | Thermoelectric heat exchange system comprising cascaded cold side heat sinks |
US9234682B2 (en) | 2012-05-07 | 2016-01-12 | Phononic Devices, Inc. | Two-phase heat exchanger mounting |
US8991194B2 (en) | 2012-05-07 | 2015-03-31 | Phononic Devices, Inc. | Parallel thermoelectric heat exchange systems |
US9310111B2 (en) | 2012-05-07 | 2016-04-12 | Phononic Devices, Inc. | Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system |
US8893513B2 (en) | 2012-05-07 | 2014-11-25 | Phononic Device, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
US10012417B2 (en) | 2012-05-07 | 2018-07-03 | Phononic, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
US9103572B2 (en) | 2012-05-07 | 2015-08-11 | Phononic Devices, Inc. | Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system |
US20150060009A1 (en) * | 2013-02-01 | 2015-03-05 | Dell Products L.P. | Techniques for Controlling Vapor Pressure in an Immersion Cooling Tank |
US9464854B2 (en) * | 2013-02-01 | 2016-10-11 | Dell Products, Lp | Techniques for controlling vapor pressure in an immersion cooling tank |
US9844166B2 (en) | 2013-02-01 | 2017-12-12 | Dell Products, L.P. | Techniques for controlling vapor pressure in an immersion cooling tank |
US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
US9593871B2 (en) | 2014-07-21 | 2017-03-14 | Phononic Devices, Inc. | Systems and methods for operating a thermoelectric module to increase efficiency |
US10744603B2 (en) | 2015-03-16 | 2020-08-18 | Dana Canada Corporation | Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same |
US10156385B1 (en) | 2017-08-15 | 2018-12-18 | Christopher Kapsha | Multistage refrigeration system |
US11466190B2 (en) * | 2018-06-25 | 2022-10-11 | Abb Schweiz Ag | Forced air cooling system with phase change material |
US11201103B2 (en) * | 2019-05-31 | 2021-12-14 | Microsoft Technology Licensing, Llc | Vapor chamber on heat-generating component |
US20220046824A1 (en) * | 2019-09-10 | 2022-02-10 | Furukawa Electric Co., Ltd. | Cooling device and cooling system using cooling device |
US20230041910A1 (en) * | 2019-12-05 | 2023-02-09 | Provides Metalmeccanica S.R.L. | Cooling system of electronic systems, in particular for data centre |
US11871546B2 (en) * | 2019-12-05 | 2024-01-09 | Wieland Provides SRL | Cooling system of electronic systems, in particular for data centre |
US20220217871A1 (en) * | 2019-12-30 | 2022-07-07 | Gm Cruise Holdings Llc | Embedded and immersed heat pipes in automated driving system computers |
US11737244B2 (en) * | 2019-12-30 | 2023-08-22 | Gm Cruise Holdings Llc | Embedded and immersed heat pipes in automated driving system computers |
US20210315130A1 (en) * | 2020-04-07 | 2021-10-07 | Abb Schweiz Ag | Cooling Element And Method Of Manufacturing A Cooling Element |
US10966349B1 (en) * | 2020-07-27 | 2021-03-30 | Bitfury Ip B.V. | Two-phase immersion cooling apparatus with active vapor management |
US20220196328A1 (en) * | 2020-10-22 | 2022-06-23 | Asia Vital Components Co., Ltd. | Vapor/liquid condensation system |
US11555653B2 (en) * | 2020-10-22 | 2023-01-17 | Asia Vital Components Co. Ltd. | Vapor/liquid condensation system |
US11326836B1 (en) * | 2020-10-22 | 2022-05-10 | Asia Vital Components Co., Ltd. | Vapor/liquid condensation system |
Also Published As
Publication number | Publication date |
---|---|
US20060162898A1 (en) | 2006-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7077189B1 (en) | Liquid cooled thermosiphon with flexible coolant tubes | |
US20060162903A1 (en) | Liquid cooled thermosiphon with flexible partition | |
US7604040B2 (en) | Integrated liquid cooled heat sink for electronic components | |
US7506682B2 (en) | Liquid cooled thermosiphon for electronic components | |
US7204299B2 (en) | Cooling assembly with sucessively contracting and expanding coolant flow | |
US7509995B2 (en) | Heat dissipation element for cooling electronic devices | |
US6508301B2 (en) | Cold plate utilizing fin with evaporating refrigerant | |
EP1143778B1 (en) | Pumped liquid cooling system using a phase change refrigerant | |
EP1383170B1 (en) | Thermosiphon for electronics cooling with nonuniform airflow | |
US5427174A (en) | Method and apparatus for a self contained heat exchanger | |
US5168919A (en) | Air cooled heat exchanger for multi-chip assemblies | |
US7556089B2 (en) | Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant | |
US7650928B2 (en) | High performance compact thermosiphon with integrated boiler plate | |
US20050121180A1 (en) | Use of graphite foam materials in pumped liquid, two phase cooling, cold plates | |
EP3089210A1 (en) | Cooling module, water-cooled cooling module and cooling system | |
US6826923B2 (en) | Cooling device for semiconductor elements | |
US20070227701A1 (en) | Thermosiphon with flexible boiler plate | |
US20070151275A1 (en) | Methods and apparatus for microelectronic cooling using a miniaturized vapor compression system | |
US10874034B1 (en) | Pump driven liquid cooling module with tower fins | |
US20050183848A1 (en) | Coolant tray of liquid based cooling device | |
US10907910B2 (en) | Vapor-liquid phase fluid heat transfer module | |
WO2010096355A2 (en) | Cooling system utilizing multiple cold plates | |
EP1906447A2 (en) | Cooling of the power components of a frequency converter | |
WO2012161002A1 (en) | Flat plate cooling device, and method for using same | |
US20050092468A1 (en) | Water tray of liquid based cooling device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: DELPHI TECHNOLOGIES, INC., MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:REYZIN, ILYA;BHATTI, MOHINDER SINGH;REEL/FRAME:016213/0474 Effective date: 20050113 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
AS | Assignment |
Owner name: COOLIT SYSTEMS INC., CANADA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DELPHI TECHNOLOGIES INC.;REEL/FRAME:022604/0514 Effective date: 20090424 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FEPP | Fee payment procedure |
Free format text: PAT HOLDER CLAIMS SMALL ENTITY STATUS, ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: LTOS); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
AS | Assignment |
Owner name: COMERICA BANK, A TEXAS BANKING ASSOCIATION AND AUT Free format text: SECURITY AGREEMENT;ASSIGNOR:COOLIT SYSTEMS INC.;REEL/FRAME:029586/0197 Effective date: 20121107 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2553) Year of fee payment: 12 |
|
AS | Assignment |
Owner name: VISTARA TECHNOLOGY GROWTH FUND III LIMITED PARTNERSHIP, BY ITS GENERAL PARTNER, VISTARA GENERAL PARTNER III INC., CANADA Free format text: SECURITY INTEREST;ASSIGNOR:COOLIT SYSTEMS INC.;REEL/FRAME:047264/0570 Effective date: 20181019 Owner name: VISTARA TECHNOLOGY GROWTH FUND III LIMITED PARTNER Free format text: SECURITY INTEREST;ASSIGNOR:COOLIT SYSTEMS INC.;REEL/FRAME:047264/0570 Effective date: 20181019 |
|
AS | Assignment |
Owner name: VISTARA TECHNOLOGY GROWTH FUND III LIMITED PARTNERSHIP, BY ITS GENERAL PARTNER, VISTARA GENERAL PARTNER III INC., CANADA Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS FOR THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 047264 FRAME 0570. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE ADDRESS IS: SUITE 680, 1285 WEST BROADWAY,VANCOUVER, BRITISH COLUMBIA, CANADA V6H 3X8;ASSIGNOR:COOLIT SYSTEMS INC.;REEL/FRAME:047312/0966 Effective date: 20181019 Owner name: VISTARA TECHNOLOGY GROWTH FUND III LIMITED PARTNER Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS FOR THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 047264 FRAME 0570. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE ADDRESS IS: SUITE 680, 1285 WEST BROADWAY,VANCOUVER, BRITISH COLUMBIA, CANADA V6H 3X8;ASSIGNOR:COOLIT SYSTEMS INC.;REEL/FRAME:047312/0966 Effective date: 20181019 |
|
AS | Assignment |
Owner name: KLINE HILL PARTNERS FUND II LP, CONNECTICUT Free format text: SECURITY INTEREST;ASSIGNOR:COOLIT SYSTEMS INC;REEL/FRAME:052820/0146 Effective date: 20200421 |
|
AS | Assignment |
Owner name: COOLIT SYSTEMS INC., CANADA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:KLINE HILL PARTNERS FUND II LP;REEL/FRAME:059381/0437 Effective date: 20210301 Owner name: COOLIT SYSTEMS INC., CANADA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:VISTARA TECHNOLOGY GROWTH FUND III LIMITED PARTNERSHIP, BY ITS GENERAL PARTNER, VISTARA GENERAL PARTNER III INC.;REEL/FRAME:059381/0126 Effective date: 20201215 |