US7074316B2 - Functional water, method and apparatus of producing the same, and method and apparatus of rinsing electronic parts therewith - Google Patents
Functional water, method and apparatus of producing the same, and method and apparatus of rinsing electronic parts therewith Download PDFInfo
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- US7074316B2 US7074316B2 US10/402,990 US40299003A US7074316B2 US 7074316 B2 US7074316 B2 US 7074316B2 US 40299003 A US40299003 A US 40299003A US 7074316 B2 US7074316 B2 US 7074316B2
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/46109—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/20—Treatment of water, waste water, or sewage by degassing, i.e. liberation of dissolved gases
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/46109—Electrodes
- C02F2001/46133—Electrodes characterised by the material
- C02F2001/46138—Electrodes comprising a substrate and a coating
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/46109—Electrodes
- C02F2001/46133—Electrodes characterised by the material
- C02F2001/46138—Electrodes comprising a substrate and a coating
- C02F2001/46147—Diamond coating
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
- C02F2001/46185—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water only anodic or acidic water, e.g. for oxidizing or sterilizing
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/46115—Electrolytic cell with membranes or diaphragms
Definitions
- the present invention relates to a functional water having high rinsing ability, a method and apparatus for producing the same, and a method and apparatus for rinsing electronic parts such as semi-conductor with the same.
- hydrofluoric acid HF
- ammonium fluoride N-fluoride
- silicone in industrial fields necessitating these rinsings, hydrofluoric acid (HF) or ammonium fluoride (NH4F) is preferable chemicals, and especially, in semi-conductor industries, those are indispensable chemicals because of enabling to etch silicone.
- HF hydrofluoric acid
- NHS ammonium fluoride
- an electrolytically functional water (hereinafter referred to as “functional water” for brevity) having an oxidizing property or a reducing property generated by electrolyzing the water may be applied to various fields such as medical cares, foods and others, and in many cases, hydrochloric acid, ammonium chloride or pure water is electrolyzed.
- An electrolytic method for producing the functional water uses a clean electric energy to control chemical reaction on the surfaces of the electrodes, thereby generating hydrogen, oxygen, ozone, or hydrogen peroxide, so that it is possible to indirectly dissolve substances to be treated, or directly electrolyze the substances adsorbed to the electrodes.
- oxidants available chlorine, or ozone
- active seeds as OH radical partially generate, and they are widely used under names of active water, functional water, ionic water or sterilizing water (see, e.g., “Elementary knowledge of Strong acidic electrolytic water” issued by Ohm Co.).
- an ozone water dissolved with ozone gas or a hydrogen water dissolved with hydrogen gas have strong oxidizing power or reducing power, and because of being safe in dissolved products, these waters and oxygen are broadly used.
- ferrite, lead oxide, stannic oxide, platinum, DSA, graphite, or amorphous carbon is used as an anode at which oxidizing reaction proceeds, and iron, platinum, titanium or carbon is used as a cathode of performing reduction.
- materials that can be used as electrodes desirably have corrosion resistance from the standpoints of a long life and that pollution does not occur on treated surfaces.
- current suppliers of anodes are substantially limited to valve metals such as titanium or its alloys
- electrode catalysts are substantially limited to noble metals such as platinum, iridium, or their alloys. It is known that even if using such expensive materials, catalysts or substrates are inevitably consumed, and elute into the solution. Therefore, electrodes of more excellent corrosion resistance are demanded.
- the invention intends to put a fluorine-containing rinsing water into practice.
- One object of the invention is to provide a functional water having excellent rinsing ability comprising fluoride ions a main raw material by using special electrodes, and a method and apparatus of producing the same.
- the invention also intends to put the fluorine-containing rinsing water as the above water for rinsing electronic parts into practice.
- Another object of the invention to provide a method and apparatus of rinsing electronic parts using the rinsing water having high rinsing ability comprising fluoride ions as a main raw material by using special electrodes.
- the functional water according to the invention comprises a fluorine-containing component obtained by electrolyzing an aqueous solution containing fluoride ions using electrodes having conductive diamonds.
- the method of producing a functional water comprises supplying an aqueous solution containing fluoride ions into an anode chamber of an electrolytic cell which is divided into at least an anode chamber accommodating an anode having conductive diamonds and a cathode chamber by a separator, passing electricity between both electrodes, and producing the functional water containing fluorine-containing component in the anode chamber.
- the apparatus of producing a functional water comprises an electrolytic cell which is divided into at least an anode chamber for accommodating an anode having conductive diamonds and a cathode chamber by a separator, an aqueous solution containing fluoride ions being supplied in the anode chamber and electricity being passed between both electrodes, thereby producing the functional water containing fluorine-containing component in the anode chamber.
- the method of rinsing electronic parts according to the invention comprises rinsing electronic parts using a rinsing water containing a fluorine-containing component obtained by electrolyzing an aqueous solution containing fluoride ions using electrodes having conductive diamonds.
- Further method of rinsing electronic parts comprises rinsing electronic parts using a rinsing water containing a fluorine-containing component and a sulfur-containing component, obtained by electrolyzing an aqueous solution containing fluoride ions and sulfate ions using electrodes having conductive diamonds.
- the apparatus of rinsing electronic parts comprises an electrolytic cell which is divided into at least an anode chamber for accommodating anode having conductive diamonds and a cathode chamber, an aqueous solution containing fluoride ions being supplied to the anode chamber, electricity being passed between both electrodes, thereby producing a functional water containing fluorine-containing component in the anode chamber, and means for jetting the rinsing water to the electronic parts or immersing the electronic parts in the rinsing water.
- FIG. 1 is a schematic view showing an electrolytic cell for producing the functional water according to the invention
- FIG. 2 is a schematic view showing a flow of functional water production of a one pass type using the electrolytic cell of FIG. 1 ;
- FIG. 3 is a schematic view showing a flow of functional water production of a circulation type using the electrolytic cell of FIG. 1 ;
- FIG. 4 is a schematic view showing a flow of functional water production of a batch type using the electrolytic cell of FIG. 1 .
- rinsing water containing a fluorine-containing component of high activity is generated and this rinsing water has considerably high rinsing ability as compared with other rinsing waters.
- Anodic reaction in the electrolytic cell of the invention is as follows because of being the aqueous solution.
- Oxygen generates preferentially in an equilibrium theory, but due to existence of activated overvoltage, generation of ozone and hydrogen peroxide is possible.
- oxygen fluoride compound is generated, and the oxygen fluoride compound is generically expressed by F 2 O (oxygen difluoride) and F 2 O 2 (dioxygen difluoride).
- fluorine gas may be generated.
- 2F ⁇ F 2 +2 e (2.87V)
- fluoride ion is anion and will be easy to be adsorbed to the anode surface even at low potential.
- Compounds of fluoride ion applicable in the invention include NH 4 F (ammonium fluoride), HF (hydrofluoric acid), or H 2 SiF 6 (silicic acid fluoride).
- concentration of fluoride ion is preferably 0.0001M or higher, and from the viewpoint of a selecting property of reactions, the high concentration is desirable, while from economics and stability of materials of electrodes, the low concentration is desirable, and therefore, 0.01M is preferable.
- the upper limit is not particularly limited, and arbitrary densities until saturation are usable.
- anode catalysts for oxidation and substrates are necessary to have corrosion resistance from viewpoint of a long life and no contaminations on treated surfaces.
- the anode of the invention is a material which is difficult to proceed the oxidizing reaction of the water at a theoretically generated potential of oxygen fluoride compound. This is assumed that since the conductive diamond electrodes show large overvoltage to the oxidizing reaction of the water, which is in a range where the formation reaction of, for example, the oxygen fluoride compound, can proceed potentially, the highly functional water is produced.
- the substrate of the electrode where the actual conductive diamond is the catalyst has no problem so long as it is a conductive material.
- the substrate is preferably plates, stamped plate, meshes, power sintered body, or metal fabric sintered body of titanium, niobium, tantalum, zirconium, silicon, silicon carbide, carbon, tungsten carbide or the like, which are stable in the diamond synthesis conditions described hereinafter. It is also preferable to form an intermediate layer for purpose of adhesion and protection of the substrate.
- the intermediate layer includes carbides or oxides of the above metals.
- the surface is preferably polished to increase adhesion and reacting areas.
- the diamond particles are used as nuclei and adhered to the substrate, it is effective to growth of uniform diamond layers.
- a hot filament CVD, a microwave plasma CVD, a plasma arc jet method, or a PVD method is developed as a diamond forming method.
- Synthetic diamond particles by conventional super high pressure method can be used if using a bonding material such as resins. Especially, if using hydrophobic components such fluorine resin to the electrode surfaces, substances to be treated are easily trapped, so that the reaction efficiency can be improved.
- the hot filament method CVD as a typical diamond production.
- An organic substance such as alcohol becoming a carbon source is kept in a reducing atmosphere such as hydrogen gas, and heated to temperature of 1,800 to 2,400° C. at which carbon radicals generate.
- the electrode substrates are installed in a temperature range (750 to 950° C.) at which diamonds precipitate.
- the gas concentration of the organic compound to hydrogen is 0.1 to 10 vol %, and rate of feed is 0.01 to 10 liter/min, although depending on sizes of reaction vessels, and pressure is 0.001 to 0.1 MPa.
- Fine diamond particles have diameters of 0.01 to 10 ⁇ m, so that a coating thickness of the conductive diamond is preferably 0.1 to 50 ⁇ m, more preferably 1 to 10 ⁇ m, for the purpose of preventing permeation of a liquid into the substrate. It is indispensable to add a slight amount of elements having different valences in order to obtain good conductivity.
- the content of boron or phosphorus is preferably 1 to 100,000 ppm, more preferably 100 to 10,000 ppm. Boron oxide or diphosphorus pentaoxide of less toxicity are preferably used as raw compounds.
- the electrolytic cell used desirably has at least two chambers of anode and cathode chambers partitioned by a separator.
- the separator is desirably used.
- an ion-exchange membrane is preferably used for increasing conductivity.
- the ion-exchange membrane can be any of fluorine resin type or hydrocarbon resin type, but the former is preferable in the point of corrosion resistance.
- Commercially available membranes are Nafion, Aciplex and Flemion.
- the solution between the electrodes is preferably agitated and circulated.
- Current density is preferably 0.001 to 100 A/dm 2 .
- the cathode includes a hydrogen generating electrode and an oxygen gas electrode, but the cathode is not particularly limited so long as it has corrosion resistance.
- the former is significant in view of using the conductive diamond. In the latter, if using carbon or a gold catalyst, hydrogen peroxide can be concurrently generated by oxygen reduction at the cathode.
- the supplying amount of oxygen is 1.2 to 10 times of a theoretical amount.
- Temperature of the electrolytic solution is preferably 5 to 40° C. Since a boiling point of hydrogen fluoride is around 20° C., it is preferable to operate the cell at room temperature in order to increase efficiency of applying to the electrolysis.
- the pressure in such a case is preferably 0.1 to 1 MPa.
- Another electrolyte than the fluoride ion can be added, and according to purposes, hydrochloric acid, sulfuric acid, nitric acid or acetic acid other than the fluoride ion may be added. This can expect an effect such that in the case that the concentration of the fluoride ion is low, voltage of electrolytic cell can be avoided from increasing, and an effect of an electrolytically synthesized oxidizing substance can be utilized.
- Materials for the electrolytic cell preferable are quartz, quartz-lined materials, carbon, titanium, stainless steels or PTFE resins from the standpoint of durability.
- oxygen generates as a side reaction. If air bubbles remain in the rinsing water during rinsing, they are adhered to treated surfaces and disturb cleanliness on the surfaces. Accordingly, degassing (bubble separation) before application to the rinsing process is desirable.
- degassing if the functional water produced is once received in a tank, moderating a flowing rate, and is allowed to stand for a certain period of time, the separation can be carried out by the difference in specific gravity. Thus, the degassing is simplified.
- the functional water according to the invention maintains the rinsing ability during storage for several days, it is possible to operate the electrolytic cell at time other than serving, and store the functional water.
- rinsing method electronic parts to be rinsed are immersed in the electrolytic functional water, or jetted therewith. High temperature at rinsing is effective to increase the rinsing efficiency. It is further possible to use a pump for circulating the rinsing water between the electrolytic cell and the rinsing water tank, and then use it for rinsing.
- the functional water of the invention is used to rinsing electronic parts which include, for example, liquid crystal materials, magnetic storage media, light disks, IC circuits, and their production containers, as well as semiconductors.
- FIG. 1 is a schematic view showing the electrolytic cell for producing the functional water according to the invention.
- the electrolytic cell A comprises a pair of an anode cell press 1 a and a cathode cell press 1 b at both sides; and an anode insulating plate 2 a , an anode supply plate 3 a , a conductive diamond anode 4 a , an anode gasket 5 a , an anode spacer and waste liquid exit 6 a , a membrane 7 , a cathode spacer and waste liquid exit 6 b , a cathode gasket 5 b , a cathode 4 b , a cathode supply plate 3 b , and a cathode insulating plate 2 b , which are laminated in the order of from the anode cell press 1 a toward the cathode cell press 1 b.
- FIG. 2 is a schematic view showing a flow of the functional water production of one pass type using the electrolytic cell of FIG. 1
- FIG. 3 is a schematic view showing a flow of the functional water production of a circulation type using the electrolytic cell of FIG. 1
- FIG. 4 is a schematic view showing a flow of the functional water production of a batch type using the electrolytic cell of FIG. 1 .
- 11 is a DC source which may be any of a switching type or a thyristor type.
- the water containing fluoride ion in a raw aqueous solution tank 12 is supplied to the electrolytic cell A via a raw chemical solution pump 15 .
- the functional water produced in the electrolytic cell A is sent to a point (electronic parts) using the functional water by a functional water supply pump 16 after removing air bubbles from the functional water by a gas-liquid separator 14 .
- the functional water produced in the electrolytic cell A is stored in a functional water tank 17 after removing air bubbles from the functional water by the gas-liquid separator 14 , and a part thereof is, similar to FIG. 2 , sent to the point using the functional water by the functional water supply pump 16 , and a rest balance is circulated to the electrolytic cell A via a functional water circulating pump 18 and is again electrolyzed.
- the functional water produced in the electrolytic cell A is directly supplied to an immersion typed rinsing cell 19 for rinsing an apparatus to be rinsed (electronic parts).
- liquid contacting parts in pipe arrangements of the electrolytic cell and other parts are desirably constituted of pipes or tanks stable against fluoride ion, and chemically stable resins of less impurities, such as PP, PE, PFA or PTFE. Are preferable.
- Supply pumps include such types as magnet, magnet determination, tube, or bellows, and a liquid contacting part is desirably formed of resins stable against fluoride ion.
- the raw medicine liquid may be poured into a pure water supply line, or directly supplied into the electrolytic cell. In this case, sufficient circulation or agitation is necessary.
- the functional water produced is stored in a tank made of quartz or PTFE, and is preferably prevented from the air contact until immediately before using.
- the rinsing cell is constituted of similar materials. Nozzles for rinsing objectives are made of PTFE or quartz. Objectives are placed in the rinsing container of the functional water via a transportation apparatus.
- Two sheets of silicones plates (3 mm thickness) were used, which were formed with the conductive diamonds (boron doping concentration: 1,500 ppm) to be 10 ⁇ m thickness as an anode and a cathode, and Nafion 350 (made by Du pont) of the anode ion exchanging membrane was placed between the silicone plates.
- the distances between the electrode membranes were 5 mm respectively to constitute an electrolytic cell having an electrolytic available area of 80 cm 2 as shown in FIG. 1 .
- APM rinsing solution (functional water), in which aqueous ammonia having a concentration of 29%, hydrogen peroxide having a concentration of 31% and pure water were adjusted to a volume ratio of 1:1:5, was mixed with impurities of Al, Fe and Cu. Pure silicone wafer was dipped in the resulting solution at 80° C. for 5 minutes. The silicone wafer was rinsed in pure water for 5 minutes to confirm the hydrophilic property on the surface. The silicon wafer was dried with a spin dryer. In the following, this method is called as an IAP contamination. By the IAP contamination, impurities of heavy metals were adhered to the wafer surface. Thus, the surface was contaminated with impurities.
- Contaminating metals on the wafer surface were recovered with a mixture of hydrofluoric acid and nitric acid, and metal concentration in the recovered solution was determined by the frameless atomic absorption analysis method, and calculated in terms of the surface contaminating concentration.
- the concentrations of metals adhered to the wafer surfaces by the IAP contamination treatment were at levels that Al was 1 ⁇ 10 12 atoms/cm 2 , Fe was 1 ⁇ 10 11 atoms/cm 2 , Ni was 5 ⁇ 10 11 atoms/cm 2 , Zn was 3 ⁇ 10 12 atoms/cm 2 , and Cu was 3 ⁇ 10 11 atoms/cm 2 .
- the thus-prepared IAP contaminated wafers were rinsed with various kinds of functional waters for 5 minutes, rinsed with pure water for 5 minutes, and then dried by a spin dryer.
- the contaminating metals were recovered from the wafer surfaces after rinsing treatment by the above-described manner, and the metal concentrations in the recovered solution were determined by the frameless atomic absorption analysis method.
- Electrolysis was conducted at 6 standards that the concentrations of hydrofluoric acid as the raw material were 0.0001M (Example 1), 0.001M (Example 2), 0.01M (Example 3), 0.1M (Example 4), and 1M (Examples 5 and 6), and the rinsing tests were then conducted.
- Example 5 the current density was 10 A/dm 2
- Example 6 the current density was 20 A/dm 2 .
- the concentration of hydrofluoric acid was 0.01 M or lower
- the current density was tried to increase up to 10 A/dm 2 .
- Example 1 was increased up to only 0.15 A/dm 2
- the current density of Example 2 was increased up to only 1 A/dm 2
- the current density of Example 3 was increased up to only 2 A/dm 2 . Therefore, the electrolyses were performed at their respective electric densities.
- aqueous solutions having the concentration of hydrofluoric acid as the raw material of 0.0001M (Example 7), 0.001M (Example 8), 0.01M (Example 9), 0.1M (Example 10), and 1M (Example 11) were prepared.
- Sulfuric acid was added to the respective aqueous solutions such that the concentration of sulfuric acid was 1M, and the respective resulting solutions were electrolyzed to obtain functional waters. Rinsing tests were conducted at such 5 standards. Because sulfuric acid was added, the electric conductivity of the solution was sufficiently high, and electrolyses at a current density of 20 A/dm 2 were all possible.
- Example 7 As a result, in Example 7 (0.0001M-HF) that the concentration of diluted hydrofluoric acid was most low, all the metals could be removed until less than the detecting limits, except that Al and Cu remained slightly, as shown in the Table. Regarding Example 7, the removing level was sufficiently high.
- the rinsing test was conducted in the same manner as in Example 9, except that unelectrolyzed hydrofluoric acid was used in place of the electrolyzed hydrofluoric acid. Specifically, the rinsing test was conducted using an aqueous solution obtained by adding unelectrolyzed hydrofluoric acid to 1M sulfuric acid in the same manner as in Comparative Example 1. As a result, it is apparent that the concentration of the remaining metals was low as a whole, but was higher than Example 9 where all the metal concentrations were decreased to less than the detecting limit, as shown in the Table. This fact suggests that a fluorine activated species are generated by electrolyzing hydrofluoric acid, and the metal removing ability is increased.
- Silicone wafer was rinsed at about 100° C., using a sulfuric acid-hydrogen peroxide mixed solution (SPM) which is the typical sulfuric acid-based rinsing chemical solution in rinsing electronic parts.
- SPM sulfuric acid-hydrogen peroxide mixed solution
- SPM is known as the rinsing solution having high metal removing ability. It is apparent that the functional waters (rinsing solution) of Examples 1 to 12 have higher metal removing ability, as shown in the Table.
- Example 10 The functional water (rinsing solution) before use of Example 10 was allowed to stand in the rinsing tank for about 40 hours, and then used for the rinsing test. The results obtained are shown in the Table. Slight amounts of Fe and Zn were detected, but there was no substantial difference as compared with the metal removing ability of the functional water of Example 10. It is apparent from this fact that the functional water obtained by electrolyzing the mixed solution of hydrofluoric acid and sulfuric acid had a considerably long life of the rinsing ability.
- Functional water was produced under the same conditions as in Example 4, except that the ion exchanging membrane was not placed between the anode and the cathode of the electrolysis apparatus. In this method, the functional water mixing the anode solution and the cathode solution was produced, and as shown in the Table. It is apparent that the concentration of the residual metals was somewhat higher than that of Example 4 (Fe and Cu could be detected), and the functional water had sufficient metal removing ability.
- the invention provides the functional water containing a fluorine-containing component obtained by electrolyzing an aqueous solution containing fluoride ion using electrodes having conductive diamonds.
- the fluorine-containing component (assumed as oxygen difluoride or dioxygen difluoride) generated by electrolyzing the fluoride ion using the conductive diamonds has the stronger rinsing effect than that of the fluorine-containing component obtained by electrolyzing the fluoride ion itself before electrolyzing or the fluoride ion using other electrodes, and the effect thereof is especially remarkable when the concentration of the fluoride ion is 0.0001M or more. In addition, the amount of hydrofluoric acid used can largely be saved.
- the electrodes are very stable during use and at stopping, a protecting current circuit, a power source or a battery, for preventing catalyst deterioration, can be omitted, and the production costs can be decreased as the electrolyzed functional water generating apparatus.
- the functional water further contains, as the raw material, sulfuric acid ion other than the fluoride ion, the rinsing effect is more increased.
- the fluorine-containing component generated at the anode contacts with the cathode, thereby preventing decomposition.
- the generated rinsing water for electronic parts may be performed to rinsing the electronic parts by jetting to or immersing them in the rinsing water after removing air bubbles in the rinsing water through the air bubble separator.
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Abstract
Description
- A: Electrolytic cell
- 1 a, 1 b: Cell press
- 2 a, 2 b: Insulating plates
- 3 a, 3 b: Electric supply plates
- 4 a: Conductive diamond electrode
- 4 b: Cathode
- 5 a, 5 b: Gaskets
- 6 a, 6 b: Spacer and waste solution exit
- 7: Separator
- 11: DC source
- 12: Raw aqueous solution tank
- 14: Gas-liquid separator
- 15: Raw chemical solution supply pump
- 16: Functional water supply pump
- 17: Functional water storage tank
- 18: Functional water circulating pump
- 19: Immersion type rinsing chamber
2H2O=O2+4H++4e (1.23V)
3H2O=O3+6H++6e (1.51V)
2H2O=H2O2+2H++2e (1.78V)
2HF+H2O=F2O+4H++2e (2.12V)
HF2 −+H2O=F2O+3H++2e (2.21V)
2F−=F2+2e (2.87V)
2SO4 2−=S2O8 2−+2e (2.01V)
TABLE | ||||||||||
Sulfuric | ||||||||||
HF | acid | Electro- | ||||||||
Concent- | concent- | Current | lysis | |||||||
ration | ration | density | time | |||||||
Sample | (M) | (M) | (A/dm3) | (min) | Al | Fe | Ni | Zn | Cu | |
Ex. 1 | Hydrofluoric | 0.0001 | 0 | 0.75 | 30 | 1.9 | 0.4 | 1.1 | 0.4 | 1.8 |
acid | ||||||||||
Electrolysis | ||||||||||
Ex. 2 | Hydrofluoric | 0.001 | 0 | 1 | 30 | 0.5 | 0.1 | 0.2 | 0.1 | 0.8 |
acid | ||||||||||
Electrolysis | ||||||||||
Ex. 3 | Hydrofluoric | 0.01 | 0 | 2 | 30 | 0.2 | 0.1 | ND | ND | 0.3 |
acid | ||||||||||
Electrolysis | ||||||||||
Ex. 4 | Hydrofluoric | 0.1 | 0 | 10 | 30 | ND | ND | ND | ND | ND |
acid | ||||||||||
Electrolysis | ||||||||||
Ex. 5 | Hydrofluoric | 1 | 0 | 10 | 30 | ND | ND | ND | ND | ND |
acid | ||||||||||
Electrolysis | ||||||||||
Ex. 6 | Hydrofluoric | 1 | 0 | 20 | 30 | ND | ND | ND | ND | ND |
acid | ||||||||||
Electrolysis | ||||||||||
Ex. 7 | (Hydrofluoric | 0.0001 | 1 | 20 | 30 | 0.7 | ND | ND | ND | 0.4 |
acid and | ||||||||||
sulfuric acid) | ||||||||||
Electrolysis | ||||||||||
Ex. 8 | (Hydrofluoric | 0.001 | 1 | 20 | 30 | ND | ND | ND | ND | ND |
acid and | ||||||||||
sulfuric acid) | ||||||||||
Electrolysis | ||||||||||
Ex. 9 | (Hydrofluoric | 0.01 | 1 | 20 | 30 | ND | ND | ND | ND | ND |
acid and | ||||||||||
sulfuric acid) | ||||||||||
Electrolysis | ||||||||||
Ex. 10 | (Hydrofluoric | 0.1 | 1 | 20 | 30 | ND | ND | ND | ND | ND |
acid and | ||||||||||
sulfuric acid) | ||||||||||
Electrolysis | ||||||||||
Ex. 11 | (Hydrofluoric | 1 | 1 | 20 | 30 | ND | ND | ND | ND | ND |
acid and | ||||||||||
sulfuric acid) | ||||||||||
Electrolysis | ||||||||||
Ex. 12 | Allowing to | 0.1 | 1 | 20 | 30 | ND | 0.1 | ND | ND | ND |
stand Example | ||||||||||
10 for 40 hours | ||||||||||
Ex. 13 | Hydrofluoric | 0.1 | 0 | 10 | 30 | ND | 0.1 | ND | 0.1 | 0.5 |
acid | ||||||||||
Electrolysis | ||||||||||
(No separator) | ||||||||||
Com. | Hydrofluoric | 0.01 | 0 | 13.2 | 0.3 | 1.8 | 0.2 | 10.5 | ||
Ex. 1 | acid | |||||||||
Com | Hydrofluoric | 0.1 | 0 | 18.8 | 7.7 | 1.6 | 0.2 | 8.4 | ||
Ex. 2 | acid | |||||||||
Com. | Sulfuric acid | 0 | 1 | 8.3 | 0.1 | 0.3 | 0.2 | 21.6 | ||
Ex. 3 | ||||||||||
Com. | Hydrofluoric | |||||||||
Ex. 4 | acid and | 0.01 | 1 | 0.7 | 0.7 | 0.2 | 0.1 | 23.4 | ||
sulfuric acid | ||||||||||
Com. | Sulfuric acid | 0 | 1 | 20 | 30 | 8.4 | 0.1 | 0.2 | 0.4 | 1.7 |
Ex. 5 | Electrolysis | |||||||||
Com. | Hydrofluoric | |||||||||
Ex. 6 | acid | 0.01 | 1 | 20 | 30 | 0.7 | 0.1 | 0.3 | 0.2 | 0.8 |
(Sulfuric acid | ||||||||||
Electrolysis) | ||||||||||
Com. | Sulfuric acid- | |||||||||
Ex. 7 | hydrogen | |||||||||
peroxide mixed | 1.9 | 1.5 | 1.0 | 0.3 | 0.9 | |||||
aqueous solution | ||||||||||
Contamination level at | 100 | 10 | 50 | 30 | 30 | ||
initial period | |||||||
Limit value of | 0.18 | 0.05 | 0.14 | 0.07 | 0.16 | ||
determination | |||||||
Note: | |||||||
Concentration of Al, Fe, Ni, Zn and Cu is all ″×1010 atoms/cm2″. |
Claims (3)
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JPP.2002-099553 | 2002-04-02 | ||
JP2002099554A JP4071980B2 (en) | 2002-04-02 | 2002-04-02 | Method and apparatus for cleaning electronic parts |
JP2002099553A JP4053805B2 (en) | 2002-04-02 | 2002-04-02 | Functional water, production method and production apparatus thereof |
JPP.2002-099554 | 2002-04-02 |
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US10/402,990 Expired - Fee Related US7074316B2 (en) | 2002-04-02 | 2003-04-01 | Functional water, method and apparatus of producing the same, and method and apparatus of rinsing electronic parts therewith |
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US (1) | US7074316B2 (en) |
KR (2) | KR100684064B1 (en) |
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US20090032409A1 (en) * | 2005-05-03 | 2009-02-05 | Juan Horn | Method for cleaning, sterilising and disinfecting dishes and other kitchen utensils and cleaning device |
US8980079B2 (en) | 2010-12-03 | 2015-03-17 | Electrolytic Ozone, Inc. | Electrolytic cell for ozone production |
US8992691B2 (en) | 2011-04-05 | 2015-03-31 | International Business Machines Corporation | Partial solution replacement in recyclable persulfuric acid cleaning systems |
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- 2003-04-01 US US10/402,990 patent/US7074316B2/en not_active Expired - Fee Related
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US5900127A (en) * | 1996-04-02 | 1999-05-04 | Permelec Electrode Ltd. | Electrode for electrolysis and electrolytic cell using the electrode |
US6235186B1 (en) * | 1998-05-26 | 2001-05-22 | Permelec Elctrode Ltd. | Apparatus for producing electrolytic water |
JP2000204492A (en) * | 1999-01-11 | 2000-07-25 | Japan Science & Technology Corp | Electrode for electrolytic fluorination reaction and organic electrolytic fluorination |
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Cited By (8)
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US20090032409A1 (en) * | 2005-05-03 | 2009-02-05 | Juan Horn | Method for cleaning, sterilising and disinfecting dishes and other kitchen utensils and cleaning device |
US8980079B2 (en) | 2010-12-03 | 2015-03-17 | Electrolytic Ozone, Inc. | Electrolytic cell for ozone production |
US8992691B2 (en) | 2011-04-05 | 2015-03-31 | International Business Machines Corporation | Partial solution replacement in recyclable persulfuric acid cleaning systems |
US9165801B2 (en) | 2011-04-05 | 2015-10-20 | International Business Machines Corporation | Partial solution replacement in recyclable persulfuric acid cleaning systems |
DE102014203372A1 (en) | 2014-02-25 | 2015-08-27 | Condias Gmbh | Electrode arrangement for an electrochemical treatment of a liquid |
DE102014203374A1 (en) | 2014-02-25 | 2015-08-27 | Condias Gmbh | Process for the electrochemical production of electrolyzed water |
WO2015128076A1 (en) | 2014-02-25 | 2015-09-03 | Condias Gmbh | Method for electrochemically producing electrolyzed water |
DE102014203374B4 (en) | 2014-02-25 | 2018-05-03 | Condias Gmbh | Electrode assembly and method for electrochemically producing electrolyzed water |
Also Published As
Publication number | Publication date |
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US20030188764A1 (en) | 2003-10-09 |
KR100684064B1 (en) | 2007-02-16 |
KR100712389B1 (en) | 2007-05-02 |
TWI252216B (en) | 2006-04-01 |
TW200306284A (en) | 2003-11-16 |
KR20060119840A (en) | 2006-11-24 |
KR20030079726A (en) | 2003-10-10 |
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