US7061697B2 - Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device - Google Patents
Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device Download PDFInfo
- Publication number
- US7061697B2 US7061697B2 US10/895,012 US89501204A US7061697B2 US 7061697 B2 US7061697 B2 US 7061697B2 US 89501204 A US89501204 A US 89501204A US 7061697 B2 US7061697 B2 US 7061697B2
- Authority
- US
- United States
- Prior art keywords
- lens
- holder
- lens holder
- support
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 44
- 230000003287 optical effect Effects 0.000 title claims abstract description 33
- 238000003466 welding Methods 0.000 claims abstract description 47
- 238000002604 ultrasonography Methods 0.000 claims abstract description 12
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 238000003384 imaging method Methods 0.000 claims 11
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000523 sample Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/62—Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
Definitions
- the present invention relates generally to a method for fixing an optical group lens with respect to an optical sensor in an image acquisition device.
- the invention also relates to an image acquisition device comprising an optical sensor placed in a housing and an optical group comprising in turn a lower holder fixed to said housing and an upper holder wherein a lens of said optical group is placed.
- the invention relates particularly, but not exclusively, to a method for fixing a lens in a plastic package of a camera having such functional characteristics as to allow that fixing to be stable in the following assembly steps of the camera itself and the following description is made with reference to this field of application for convenience of illustration only.
- portable image acquisition devices such as cameras or cell-phones provided with photographic equipment, are equipped with image acquisition sensors 1 being placed in a housing 2 provided with a housing cavity 3 and fixed to the housing 2 by interposition of an adhesive layer 1 a , as shown in FIG. 1 .
- the housing cavity 3 is then closed by a sealing lid 4 by interposition of an adhesive layer 4 a .
- the lid 4 is for example glass made as shown in FIG. 3 .
- optical group 5 is then fixed on the housing 2 .
- the optical group 5 comprises a lens holder 6 and a lens barrel 7 wherein a lens 8 is placed and fixed to the holder 6 , as shown in FIG. 4 .
- the holder 6 is integrally fixed to the housing 2 and the barrel 7 is shifted with respect to the holder 6 in order to find the right optical group 5 focusing point, as shown in FIG. 5 .
- the barrel 7 can be rotated, horizontally and/or vertically shifted until the best focusing point position of the lens 8 is reached with respect to the sensor 1 .
- FIG. 6 A first known technical solution to lock the barrel 7 to the holder 6 is shown in FIG. 6 .
- an adhesive layer 9 is interposed between the barrel 7 and the holder 6 .
- mutually cooperating barrel 7 and holder 6 portions, during the fixing step, are provided with grooves 10 allowing the adhesive layer 9 to be better supported.
- this kind of solution is essentially based on manual production, since it is difficult to control the dispensing of this adhesive layer 9 between the barrel 7 and the holder 6 in automatic production tools.
- the lens 8 can easily lose the alignment with the sensor 1 , since it has been verified that the barrel 7 is attracted in the direction where there is a higher quantity of adhesive layer.
- a second solution to lock the barrel 7 to the holder 6 provides instead the use of a metallic undulated ring or made of materials being different from the ones forming the barrel 7 and the holder 6 , which is interposed between the barrel 7 and the holder 6 .
- the pressure exerted by the ring tends to keep the barrel 7 in position with respect to the holder 6 .
- the image acquisition devices manufactured with these known techniques are affected by repetitiveness problems, limiting the application thereof at industrial level, and increasing the production costs thereof.
- shifting the lens focusing axis and/or point by a few microns with respect to the sensor the image detected by the sensor itself is no longer uniform.
- an image portion detected in correspondence with the lens edges is of considerably different quality than an image portion detected in correspondence with the lens center.
- An embodiment of the present invention provides a method for fixing an optical lens with respect to an optical sensor in electronic devices capable of acquiring images.
- This embodiment has such functional characteristics as to allow a stable fixing, thus overcoming limits and drawbacks still affecting prior-art methods.
- this embodiment of the present invention fixes by welding an upper holder containing an optical lens to a lower holder integrally connected to a housing containing an optical sensor, just after finding the alignment between the lens and the sensor.
- this welding may be performed on one or more points by means of ultrasound.
- FIGS. 1 to 6 are vertical section views of an image acquisition device during the focusing and fixing operations according to the prior art.
- FIG. 7 is a vertical section view of an image-acquisition device during a welding step of a method according to an embodiment of the invention.
- FIG. 8 is a vertical section view of an alternative embodiment of an image acquisition device during a welding step of a method according to the invention.
- FIG. 9 is a perspective view of the image acquisition device obtained with a method according to an embodiment of the invention during the welding step.
- FIG. 10 is a side view of an image acquisition device obtained with a method according to an embodiment of the invention after the welding step.
- an image acquisition sensor 1 is placed in an housing 2 provided with a housing cavity 3 and it is fixed to the housing 2 by interposition of an adhesive layer 1 a as shown in FIG. 1 .
- the housing cavity 3 is closed by a sealing lid 4 by interposition of an adhesive layer 4 a .
- the lid 4 is for example glass made.
- an optical group 11 is then fixed on the housing 2 .
- the optical group 11 comprises a lower holder 12 called a lens holder and an upper holder 13 called a lens barrel wherein a lens 8 is placed and which is fixed to the lower holder 12 .
- the upper holder 13 has at least a retention portion 13 a , corresponding to a holding area of the lens 8 , having such a size as to be placed in the lower holder 12 .
- the lower holder 12 is integrally fixed to the housing 2 and the upper holder 13 is shifted with respect to the lower holder 12 .
- the upper holder 13 can be rotated, horizontally and/or vertically shifted until an optimum focusing point position of the lens 8 is reached with respect to the sensor 1 .
- this focusing step is performed by acquiring a series of images caught by the sensor 1 through the lens 8 and locking the upper holder 13 in the position wherein an image is detected as being perfectly or nearly perfectly in focus in the desired points.
- the upper holder 13 is locked to the lower holder 12 .
- the upper holder 13 is fixed to the lower holder 12 by welding. Particularly, a plurality of energy rays are incident on the upper holder 13 so as to weld the upper holder 13 to the lower holder 12 .
- the lower holder 12 is thinner in correspondence with the incident points of those energy rays.
- Laser energy can be used for the welding.
- the use of laser energy has some drawbacks in this particular field of application.
- the laser may produce dust or soot which can fall into the image acquisition device and thus deposit on the lid 4 protecting the sensor 1 or on the lens 8 , preventing a correct operation and an accurate image acquisition.
- the particles forming these dusts can be “mobile” in the cavity formed by the lid 4 and the group comprising the lower holder 12 and the upper holder 13 , jeopardizing the stability of the final image acquisition.
- a beam of ultrasound is used to perform the welding.
- an ultrasonic transducer 15 which vibrates at high frequency and turns the vibration energy into thermal energy.
- This ultrasonic transducer 15 is put into contact with the upper holder 13 , and melts the interfaces between the upper holder 13 and the lower holder 12 in the area concerned only.
- the energy lost by the vibrating ultrasonic transducer 15 when it is in contact with the surface to be welded is transformed into heat by melting together the two plastic interfaces forming the upper holder 13 and the lower holder 12 .
- ultrasonic transducers For a more uniform fixing several different ultrasonic transducers can be used to perform the welding, these ultrasonic transducers being located in a single plane and being arranged with each other so as to be symmetrically distributed along the lower holder 12 perimeter. In a preferred embodiment there are three ultrasonic transducers and they are located at 120° from each other, as shown in FIG. 9 by arrows and the transducer 15 .
- a stiffening portion 14 of the ultrasonic transducer 15 can be part of a module which is incorporated in the welding itself, thus stiffening the weld.
- the stiffening portion 14 not only melts the two interfaces, but also locks them together mechanically.
- the stiffening portion 14 can melt an opening in the holders 12 and 13 as the transducer 15 pushes it against and then into these holders. Once inserted into the holders 12 and 13 , the portion 14 can further melt the holders to weld the holders to each other and to the portion 14 .
- the portion 14 remains in the hole to strengthen the attachment of the holder 12 to the holder 13 in that region.
- the frequency range used for the ultrasound welding goes from 20 to 80 kHz in one embodiment of the invention.
- the welding can be performed by means of a thermal probe.
- a thermal probe Particularly, one or more ultrasonic transducers are used, which are heated to a higher temperature than the melting temperature(s) of the material forming the upper holder 13 and the lower holder 12 , and which are put into contact with the upper holder 13 . The heat is then transferred from the thermal probe to the material, melting it and thus forming a welding among the interfaces between the upper holder 13 and the lower holder 12 .
- the ultrasound welding as well as the thermal welding, can be easily controlled since the energy is better distributed in the welding itself and dusts are typically not produced, which dust might degrade the performance of the image acquisition final device as discussed above in conjunction with the use of laser energy.
- these fixing methods are not limited to the fixing of the retention portion sides 13 a to the holder 12 , because any part of the holder 13 can be welded to any adjacent part of the lower holder 12 .
- the fixing methods according to the above-described embodiments of the invention do not require threads for fixing the upper holder 13 to the lower holder 12 .
- the interfaces between the lower holder 12 and the upper holder 13 do not need to be threaded and thus may be of simple construction.
- the fixing methods according to the above-described embodiments of the invention can be easily automated. That is, the steps and the material used can be easily integrated in a traditional manufacturing process of protective packages.
- the methods according to embodiments of the invention allow an ultrasound or thermal welding to be performed, or a combination thereof, i.e., of the thermosonic type, to fix an optical lens of an optical group with respect to a sensor, the welding being easily controllable in terms of quality and in real time.
- This control is available by feedback of the ultrasound or thermosound signals and of the energy used on the welding: for example amplitude, frequency, impedance, energy and other parameters not directly linked to the transducer or probe, to control, for example, the penetration speed, the final welding point, and the starting and final ultrasound points.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Lens Barrels (AREA)
Abstract
Description
Claims (39)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03291781A EP1498756A1 (en) | 2003-07-17 | 2003-07-17 | Method for fixing a lens with respect to an optical sensing device in an image pickup device |
EP03291781.7 | 2003-07-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20050046973A1 US20050046973A1 (en) | 2005-03-03 |
US7061697B2 true US7061697B2 (en) | 2006-06-13 |
Family
ID=33462252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/895,012 Expired - Lifetime US7061697B2 (en) | 2003-07-17 | 2004-07-19 | Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device |
Country Status (2)
Country | Link |
---|---|
US (1) | US7061697B2 (en) |
EP (1) | EP1498756A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080174684A1 (en) * | 2007-01-23 | 2008-07-24 | Nec Electronics Corporation | Solid-state imaging device |
US20080309807A1 (en) * | 2007-06-15 | 2008-12-18 | Sharp Kabushiki Kaisha | Solid-state image pickup device and electronic apparatus including same |
US20080309814A1 (en) * | 2007-06-15 | 2008-12-18 | Sharp Kabushiki Kaisha | Solid-state image pickup device and electronic apparatus including same |
US20090129034A1 (en) * | 2007-11-20 | 2009-05-21 | Hon Hai Precision Industry Co., Ltd. | Imaging device |
US20110063493A1 (en) * | 2009-09-14 | 2011-03-17 | Samsung Electro-Mechanics Co., Ltd. | Camera module, method of focusing the same, and device for focusing the same |
US20180315894A1 (en) * | 2017-04-26 | 2018-11-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006013164A1 (en) | 2006-03-22 | 2007-09-27 | Robert Bosch Gmbh | Method for mounting a camera module and camera module |
FR3086766B1 (en) * | 2018-09-27 | 2024-06-21 | Valeo Systemes Dessuyage | DEVICE FOR PROTECTING AN OPTICAL SENSOR OF A DRIVING ASSISTANCE SYSTEM FOR A MOTOR VEHICLE |
Citations (17)
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DE3705408C1 (en) | 1987-02-20 | 1988-08-11 | Ant Nachrichtentech | Device for optically coupling an element which emits light to an element which receives light |
JPH0522640A (en) | 1991-07-16 | 1993-01-29 | Fuji Photo Film Co Ltd | Attachment method for image pickup element |
JP2001111155A (en) | 1999-10-07 | 2001-04-20 | Minolta Co Ltd | Light source device and optical beam scanner |
JP2001188155A (en) | 1999-12-28 | 2001-07-10 | Kuurii Components Kk | Imaging device fixing means |
US6266197B1 (en) * | 1999-12-08 | 2001-07-24 | Amkor Technology, Inc. | Molded window array for image sensor packages |
JP2001218088A (en) | 2000-02-04 | 2001-08-10 | Casio Comput Co Ltd | Image pickup device |
US20020012178A1 (en) | 2000-05-30 | 2002-01-31 | Kazuhiro Noguchi | Lens barrel and optical apparatus having lens barrel |
US6462895B2 (en) * | 2000-04-25 | 2002-10-08 | Hewlett-Packard Company | Optical assembly mounting |
US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
JP2003057496A (en) | 2001-08-10 | 2003-02-26 | Mitsubishi Electric Corp | Method and device for alignment and fixation |
US20030123808A1 (en) | 2001-12-31 | 2003-07-03 | Texas Instruments Inc. | Tilt-in-place alignment system and method |
US6627872B1 (en) * | 1998-12-09 | 2003-09-30 | Fuji Electric Co., Ltd. | Semiconductor optical sensing apparatus with reliable focusing means and casing structure |
US6683298B1 (en) * | 2000-11-20 | 2004-01-27 | Agilent Technologies Inc. | Image sensor packaging with package cavity sealed by the imaging optics |
US6842300B2 (en) * | 2001-06-14 | 2005-01-11 | Stmicroelectronics S.R.L. | Optical device with objective slidable engaged with support structure |
US6900913B2 (en) * | 2001-01-23 | 2005-05-31 | Wen-Ching Chen | Image pickup module |
US6940058B2 (en) * | 2003-02-04 | 2005-09-06 | Kingpak Technology, Inc. | Injection molded image sensor module |
US6946316B2 (en) * | 1999-12-08 | 2005-09-20 | Amkor Technology, Inc. | Method of fabricating and using an image sensor package |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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GB2258968B (en) * | 1991-04-17 | 1994-08-31 | Gec Ferranti Defence Syst | A method of fixing an optical image sensor in alignment with the image plane of a lens assembly |
-
2003
- 2003-07-17 EP EP03291781A patent/EP1498756A1/en not_active Ceased
-
2004
- 2004-07-19 US US10/895,012 patent/US7061697B2/en not_active Expired - Lifetime
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DE3705408C1 (en) | 1987-02-20 | 1988-08-11 | Ant Nachrichtentech | Device for optically coupling an element which emits light to an element which receives light |
JPH0522640A (en) | 1991-07-16 | 1993-01-29 | Fuji Photo Film Co Ltd | Attachment method for image pickup element |
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US6683298B1 (en) * | 2000-11-20 | 2004-01-27 | Agilent Technologies Inc. | Image sensor packaging with package cavity sealed by the imaging optics |
US6900913B2 (en) * | 2001-01-23 | 2005-05-31 | Wen-Ching Chen | Image pickup module |
US6842300B2 (en) * | 2001-06-14 | 2005-01-11 | Stmicroelectronics S.R.L. | Optical device with objective slidable engaged with support structure |
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US6940058B2 (en) * | 2003-02-04 | 2005-09-06 | Kingpak Technology, Inc. | Injection molded image sensor module |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080174684A1 (en) * | 2007-01-23 | 2008-07-24 | Nec Electronics Corporation | Solid-state imaging device |
US8031244B2 (en) * | 2007-01-23 | 2011-10-04 | Renesas Electronics Corporation | Device for releasing heat generated in the amplifier unit of a solid-state image sensing element |
US20080309807A1 (en) * | 2007-06-15 | 2008-12-18 | Sharp Kabushiki Kaisha | Solid-state image pickup device and electronic apparatus including same |
US20080309814A1 (en) * | 2007-06-15 | 2008-12-18 | Sharp Kabushiki Kaisha | Solid-state image pickup device and electronic apparatus including same |
US7929045B2 (en) * | 2007-06-15 | 2011-04-19 | Sharp Kabushiki Kaisha | Solid-state image pickup device and electronic apparatus including same |
US20090129034A1 (en) * | 2007-11-20 | 2009-05-21 | Hon Hai Precision Industry Co., Ltd. | Imaging device |
US7990730B2 (en) * | 2007-11-20 | 2011-08-02 | Hon Hai Precision Industry Co., Ltd. | Imaging device |
US20110063493A1 (en) * | 2009-09-14 | 2011-03-17 | Samsung Electro-Mechanics Co., Ltd. | Camera module, method of focusing the same, and device for focusing the same |
US8139146B2 (en) * | 2009-09-14 | 2012-03-20 | Samsung Electro-Mechanics Co., Ltd. | Camera module, method of focusing the same, and device for focusing the same |
US20180315894A1 (en) * | 2017-04-26 | 2018-11-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
US20050046973A1 (en) | 2005-03-03 |
EP1498756A1 (en) | 2005-01-19 |
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