US659380A - Means for applying fluid metals. - Google Patents

Description

No. 659,380. 7 Patented Oct. 9; I900.

' W. H. SMYTH.

MEANS FOR APPLYING FLUID METALS.

(Application filed 001:.29, was.

' 2 Sheets-Shoat I.

Fig.1

(No Model.)

No. 659,380. Patented Oct. 0,1900.

w. H. SMYT-H.

MEANS FOR APPLYING FLUID METALS.

(Application filed Oct. 29 1.896.) (No Model.)

2 Shqets-Shot 2. J J

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U IT D STATES PATENT OFFICE.

wILLIAMnENn'Y sMYrH; o BERKELEY, CALIFORNIA.

"MEANS*FoR-AP LYiNe FLUID METALS;

SPECIFICATION forming part of Letters Patent No. 659,380, dated October 9, 1900.

' Application filed Ottoher 29,1396. Serial Np. 610,509. (No model.)

To all whom, it may concern! Be it known that I,W1LLIAM HENRY SMYTH, mechanical engineer, a citizen of. the United States, residing at Berkeley, in the county of Alameda and State of California, have in.

vented certain new and useful Improvements in Means for Applying Fluid Metals, of which the following is a specification.

This invention relates to improvements in means for applying fluid metal. to objects. Heretofore one or the other of two broad prin-.

' ciples have generally been involved indevices for applying fluid metals. These devices are therefore divisible into two distinct classes. The first employs stationary fluid metal and means adapted to move the. object against the fluid resistance in contact therewith. The second effects the flow or bodily movement of fluid metal and interpo sition of the object in the path of flow. The present invention is outside of these two categories and is based upon a principle Whose application is wholly new in the art and distinct from those just referred to. the utilization of a moving surface'portionor wave on the surface of a body of fluid metal, which is practically quiet or inert, except for the very slight movement imparted to its par tic-les by reason of the agitation of said surface portion or waves. A new class of machines is the resultviz., the. third, which effect and utilize a moving form or contourc'. e.., the wave on the surface of stationary molten metal.

body of fluid metal to apply it to a stationary.

or moving object. I therefore claim this invention, broadly, unrestricted to any particular form of construction.

Both of the two classes of devices referred to have inherent defects, limitations, and objections, which it is the object of thepresent invention to supply or overcome.

The object of the invention may therefore be stated to be to provide more rapid, eflicient, and economical means of applying fluid metal. p

It comprises, stated generally and inv con-.

nection with what has already been. said,

meansadapted to effect on the surface of molten metal a swell moving relatively to the receptacle containing the fluid and means whereby the swell is utilized to apply the It involves It also consists in novel combinations and constructions hereinafter described and claimed.

I will proceed to describe one characteristic form whereby my invention may be carried into effect in soldering cans in the process of their. manufacture.

Other ways willreadily suggest themselves to skilled mechanics for utilizing this invenjtion and applying it to other purposes than soldering cans.

Referring'to the drawings, Figure 1 shows a side view of the wave-former employed in the device illustrated in Figs. 3 and 4. Fig. 2 is an end view of the wave-formers shown in Fig. 1. Fig. 3 is a sectional elevation of a can-head-soldering machine employing an annular solder-bath. Fig. 4 shows a plan view of a machine shown in Fig. 3.

The machine illustrated in the drawings herein is intended particularly to show the application of this invention in soldering the top and bottom joints of cans of large diameter, from which, owing to their size, the heads are apt to fall off during the process of soldering... It consists, described generally, of a series of endwise clamps arranged in a circle on a rotary frame over an annular solderbath and means for raising and lowering the cans held in the clamps toward and from the solder-surface. Therotary frame is provided with suitable wave-formers adapted to engage with the solder to perform their functions. It is also provided with suitable de- I-v'ices for heating and skimming the solder and finishing rolls to remove the excess of solder from the cans and return it to the solder-pot, ,A cancooling blast-pipe and dire'cting-hoodps provided to set the solder on the cans. Suitable means are arranged for feeding and discharging the cans. Power connections and intermediate mechanisms are provided to operate and cause the performanceof the function of the various parts whereby they automatically perform their various duties in proper order and time- Referring more particularly to the drawings, A indicates asolder-bath provided with a suitable heating arrangement, shown as gas-pipes and burners a.

B is a carrier-frame secured upon the ver vticalshaft b, which is provided with suitable power connections, shown here as bevel-gears 1) b shaft b and tight and loose belt-pulleys b. The shaftbis journalcd in the stand or frame D, which is provided upon its upper side with a large bevel-gear or rack D and also with a circumferential cam-groove E and cam-track- F. (Shown in Figs. 3 and 4:.)

C O C O are can-carriers loosely journalcd upon radial bearings c c c c on frame B. These carriers consist of a frame or bracket 0 and rotatable clamps c and c journaled therein, the clamp 0 being provided with a gear 0 which meshes with another gear 0 secured upon ahollow shaft 0 passing through the bearing 0. In the frame C upon the other end of shaft 0 is a gear which meshes with the large gearD of the stand. The clamp c is loosely journaled in a supplementary arm 0, which is secured upon a rod 0 passing through hollow shaft 0 and having endwise motion which passes also through bearing 0. The innerend of rod 0 is provided with roller 0 which rolls upon cam-track F, against which it is pressed by a spring 0 encircling the rod 0 The frame 0 extends backward from the can-clamps with a tailpiece provided with a cam roller or pin 0, which ongages with cam-groove E on the stand D. All this relating to the clamp-frame is shown in the drawings.

Concentrically surrounding the stand or frame D and adjustably supported by it is solder-pot A, which though shown as a complete annulus may extend but a portion of the circumference, as from the point of discharge to that of feeding where soldering is usually done. To feed the unsoldered and discharge the finished cans, the feed-chute G and discharge-runway H are provided.

Depending from the carrier-frame O are suitable wave-formers J J. In the path of travel of the can may be placed suitable wiping devices (shown as rotating brushes K K) inclosed in a casing so arranged that when the can is raised from contact with the solder its lower portion is in contact with the upper portion of the rotating brushes for a short part of its journey. The surrounding casing forms a guide or means suitable in shape and position to direct the excess solder removed from the can back into the solder-pot. Above the path of the can, in such a position as to direct a blast of air against the upper part of the raised can when deemed necessary, is an air-blast pipe L, provided with a confining and directing hood M, suitably placed, so that the upper portions of each can will enter when raised. The hood M is constructed to conform to the path of the traveling can and provides practically a stratum of cold air moving parallel to the horizontal path of the can, into which the can is raised for being soldered. N is a solder-skimming device consisting of a plate adjustably secured to any suitable moving part to travel in the path of the cans, the part being so constructed and located as to permit its passage between the solder-bath and brushes K. It depends into the solder and is set at any suitable angle.

The operation of the device is as follows: The unsoldered cans are fed by rolling down the feed-chute. The lowermost can rests on the bottom of the chute, as shown in Fig. 3 at G. The machine is then put in motion by the driving-belt through the pulley b,shaftb and bevel-gears b b. The lowermost can is in position to be taken by the can-carrier clamps C and C and is so taken by the clamps closing radially upon it through the action of roller 0 advancing olf the high part of the camtrack F, permitting the spring 0 to pull the clamp c endwise upon the can. The can being now secureiy held between clamps c" and c is rotated thereby through engagement with the bevel-gear D by the intermediate geartrain, ending with 0 attached to clamp 0 The can is now ready for the application of solder, which is the next operation. The cam-groove E is of such character that as soon as the can is fairly clamped the pivoted carrier-bracket C is partly rotated upon its hearing by the cam-pin c traveling therein. Thus the can is brought to within a short distance of the surface of the solder in the receptacle, the can always advancing and rotating upon its axis, which is horizontal. The partialrotation of the carrier-bracket C, while depressing the can into close proximity with the solder, also dips the wave-formersJJ below the surface of the solder, so that this advance mounds the solder up against the can, which being in rotation on its own axis the solder is brought into contact with the whole circumference to a limited width, Figs. 1 and 2. By the time the can has made the circuit of the bath, or possibly a partial circuit, it is thoroughly soldered and is ready to be discharged, which is accomplished by the reverse rotation of bracket 0 to its original position in which it took the can in connection with the opening of the clamps (J and C by the action of cam-track F just as the can reaches the projecting discharge H,into which the can is rolled by the combined advance motion and opening of the can-clamps. Before being discharged and while the solder is still molten on the can it passes in contact with the rapidly-rotating wipers K K, which remove the surplus solder, which in the form of fine grains drops back into the solder-pot and is remelted.

Having tints disclosed this invention and described and shown characteristic forms in which it may be carried into effect, I claim 1. A soldering-machine comprising a bath of solder and traveling mechanism therein whereby, through their relative travel, solder is applied to objects.

2. A soldering-machine comprising a bath of solder and traveling mechanism therein adapted, through the relative travel of said bath and mechanism, to apply solder to a can.

3. Asoldering-machinc, comprising a bath of solder and traveling mechanism therein adapted to solder the top and bottom coverjoints of a can, simultaneously.

4. A machine comprising, asolder-bath and traveling means, whereby solder is applied to a can traveling above its surface and means to effect the rotation and travel of the can.

5. A machine comprising, a solder-bath, means adapted to effect the relative travel and rotation of a can above its surface, and:

a device adapted to apply solder thereto while traveling. I

6. A machine comprising, a solder'bath and traveling mechanism therein, whereby solder is applied to both cover-joints of a can, sim ultaneously, and means adapted to effect the travel and rotation of the can.

7. A solder-bath, a non rotative device therein, adapted to efiect a molten solder mound and means whereby said mound and object to be soldered are brought into contact."-

8. A solderbath, a non rotative device therein adapted through its travel to effect a molten-solder mound, and means whereby the mound and object to be soldered are brought into contact.

9,, A solder-bath, a non-rotative device depending thereinto adapted to effect a wave of solder, and means whereby the wave and object to be soldered are brought into contact.

10. A solder-bath, a nonrotative device depending thereinto, adapted through its travel to effect a wave of solder, and means whereby said wave and object to be soldered are brought into contact.

11. A solder-bath, a 'non-rotative device therein adapted to effect a molten -so1der mound, and means whereby said mound and the seam of a can are brought into contact.

12. Abath, means adapted to efiect a liquid wave (the form of which advances more than its particles) therein, and means adapted to apply an object in contact with said wave.

13. A bath, means adapted to effect a liquid wave (the form of which advances more than its particles) therein, means adapted to applya traveling object in contact with said wave. 14. A bath, means adapted to effect a liquid wave (the form of which advances more than its particles) therein, and means adapted to apply a rotating traveling can in contact with said wave.

15. A bath, means adapted to effect a multiplicity of liquid waves (the forms of which advance more than their particles) therein, and means adapted to apply the joints of cans in contact with said waves.

16. Abath, means adapted to effect a multiplicity of liquid waves, (the forms of which advance more than their particles) therein, and means adapted to apply a multiplicity of cans simultaneously thereto.

17. A bath, means adapted to effect a multiplicity of liquid waves (the forms of which advance more than their particles) therein, and means adapted to apply the top and bottom can-joints simultaneouslyof each of a multiplicity of rotating cans thereto.

wave with an object above the normal surface of the solder.

19. A bath, means adapted to effect a multiplicity of liquid waves, (the forms of which advance more than their particles) therein, and means adapted to efiect the travel of an.

object above the normal surface in contact therewith.

20. A device adapted to form a solder wave, (the form of which ad vances more than its particles) in contact with a traveling object above the normal surface of the solder.

21. A solder-bath and a device depending therein adapted to effect a solder wave, the form of which advances more than its particles.

22. A solder-bath, a non-rotative waveformer, and means for utilizing the wave formed whereby solder is applied to an article.

23. A bath, means adapted to effect a liquid wave (the form of which advances more than its particles) therein, and means adapted to utilize the wave, whereby solder is applied to an object.

24:. A bath, means adapted to efiect a liquid wave (the form of which advances more than its particles) therein and means adapted to utilize the wave, whereby solder is applied to a can. I

25. A bath, means adapted to effect liquid waves (the form of which advances more than their particles) therein,- and means adapted to utilize the waves, whereby solder is applied to the top and bottom cover-joint,simultaneously of a can. 7

26. A device, comprising means adapted to effect an advancing swell upon the surface of molten solder and means whereby the swell is utilized to apply solder to objects above the normal surface of the solder.

27. A device, comprising means adapted to effect an advancing swell upon the surface of molten solder,and means whereby the swell is r effect advancing swells upon the surface of molten solder and means whereby the swells are utilized to apply solder to a multiplicity of can-joints, simultaneously.

29. A device, comprising means adapted to efiect an advancing swell uponthe surface of molten solder and means adapted to apply objects in'eontact therewith, above the normal surface of the solder.

30. A device, comprising means adapted to effect an advancing swell upon the surface of molten solder and means adapted to effect the travel of an object in contact therewith,above the normal surface of the solder.

81. A device, comprising means adapted to elfect an advancing swell upon the surface of molten solder and means adapted to effect the travel of a can in contact therewith, above the normal surface of the solder.

32. A device, comprising means adapted to effect an advancing swell upon the surface of molten solder and means adapted to effect the travel and rotation of a can in contact therewith, above the normal surface of the solder.

33. A soldering-machine, comprising a solder-bath, a traveling device provided with means depending into the bath, adapted to effect a wave of solder and means whereby objects are fed into contact with said wave and discharged therefrom.

34. A soldering-machine, comprising a solder-bath and a traveling conveyer provided with a device adapted to effect the contact of solder with a can traveling above the normal level of the solder.

35. A soldering-machine, comprising a solder-bath and a traveling conveyer adapted to efiect the travel and rotation of a can, above the surface of the, solder and the contact of the solder with the traveling can.

36. In combination with a bath adapted to contain solder, means for heating the same, of mechanism traveling longitudinally of said bath, by which a wave of solder is raised above the normal surface of the solder in said bath, and means adapted to apply an object in contact with the raised portion of solder.

37. In combination with a bath adapted to contain solder, means for heating the same, of mechanism traveling longitudinally of said bath, by which a wave of solder is raised above the normal surface of the solder in said bath, and means adapted to apply a can in contact with the raised portion of solder.

38. In combination with a bath adapted to contain solder, means for heating the same, of mechanism traveling longitudinally of said bath, by which a wave of solder is raised above the normal surface of the solder in said bath, and means adapted to apply a traveling can in contact with the raised portion of solder.

39. In combination with a bath adapted to contain solder, means for heating the same, of mechanism traveling longitudinally of said bath by which solder is raised above its normal surface, and means adapted to apply a rotating can in contact with said raised portion of solder.

40. In combination with a bath adapted to contain solder, means for heating the same, of mechanism traveling longitudinally of said bath, adapted to effect and utilize a wave of solder.

41. In combination with a bath, adapted to contain solder, means for heating the same, of mechanism traveling longitudinally of said bath adapted to effect and utilize a series of solder waves, whereby solder is applied to an object.

42. In combination with a bath, adapted to contain solder, means for heating the same, of mechanism traveling longitudinally of said bath, adapted to effect and utilize a multiple series of solder waves, whereby solder is ap plied to a multiplicity of objects, simultaneously.

43. In combination with a bath, adapted to contain solder, means for heating the same, of mechanism traveling longitudinally of said bath, adapted to effect and utilize a multiple series of solder waves, whereby solder is applied to a multiplicity of cans simultaneously.

44. In combination witha bath, adapted to contain solder, means for heating the same, of mechanism traveling longitudinally of said bath, adapted to effect and utilize a multiple series of solder waves whereby solder is applied to a multiplicity of traveling cans simultaneously.

45. In combination with a bath, adapted to contain solder, means for heating the same, of mechanism traveling longitudinally of said bath adapted to effect and utilize a multiple series of solder waves, whereby solder is applied to the top and bottom joint simultaneously of each of a multiplicity of rotating cans.

46. In combination with a bath adapted to contain solder, means for heating the same, of mechanism traveling relatively to said bath adapted to effect a liquid mound therein, and means by which said mound and object to be soldered are brought into contact.

47. A device comprising a solder-bath and traveling mechanism therein whereby solder is applied to an object above the surface of the solder.

48. Means adapted to efifect, on the surface of fluid, a swell moving relatively to the receptacle containing the fluid, and means whereby the swell is utilized to apply fluid to an object.

49. Means adapted to efiect a contour constantly changing location on the surface of fluid and means adapted to apply an object in contact therewith above the normal surface.

50. A machine comprising a solder-bath and traveling mechanism adapted to clamp a can endwise and apply solder continuous with that of the bath to a can above the normal surface of the solder.

51. A machine comprising a solder-bath and traveling means for clamping endwise and applying solder continuous with that in the bath to a rotating can.

52. A machine comprising a'solder-bath and means for clamping endwise and rotating a can adapted to apply simultaneously to both cover-joints, solder continuous with that in the bath.

53. A machine comprising a solder-bath and means adapted to clamp endwise, efiect the travel of, and apply solder to a can while traveling above the solder-surface.

54. A machine comprising a solder-bath and means adapted to clamp endwise, effect the rotation and horizontal travel of a can, its axis horizontal and apply solder from said bath thereto.

55. A machine comprising a solder-bath and IIO means adapted to clamp endwise, efiect its travel and apply solder from said hat l1 sim ultaneously to both ends of a can.

56. A machine comprising means adapted to clamp endwise,effect the rotation and horizontal travel of a can, its axis horizontal, and apply solder thereto while traveling.

57. A machine comprising means adapted to'clamp endwise, effect the rotation and horizontal travel of a multiplicity of cans, their axes horizontal, and apply solder thereto.

58. A machine comprisingasolder-bath and a revolving carrier adapted to effect the horizontal travel of, and apply solder to, a can, its axis horizontal.

59. A machine comprising a solder-bath, a multiple series of carriers adapted to effect the horizontal travel in a circular path, of a multiplicity of cans, their axes horizontal and means for applying solder to said multiplicity of cans simultaneously.

60. A machine comprising a solder-bath, a revolving carrier adapted to efiect the rotation and horizontal travel in a circular path, of a can, its axis horizontal, and apply solder thereto While traveling.

61. A machine comprising a solder-bath, a revolving carrier to effect the rotation and horizontal travel in a circular path, ofa multiplicity of cans their axes horizontal and means adapted to apply solder thereto.

62. A machine comprising a solder-bath and means for effecting the travel of cans in a circular path'above the normal surface and means for applying solder therefrom to said cans while so traveling.

63. A machine comprising a solder-bath, means for effecting the rotation and travel of cans in a circular path above its normal surface and means adapted to apply solder to said cans therefrom while so traveling. I

64. A machine comprising a solder-bath and means for effecting the rotation and travel of a can above its surface in a circular path and means for applying solder to the top and bottom coverjoints of said can simultaneously.

65. A machine comprising a solder-bath and means for effecting the rotation and travel of a multiplicity of cans above its surface in a circular path also devices adapted to apply solder to the top and bottom cover-joints simultaneously of said cans.

66. A machine comprising a solder-bath, means adapted to clamp endwise, effect the rotation and horizontal travel of cans their axeshorizontal above its surface and means adapted to apply solder to the cans from said bath.

67. A machine comprising a moving carrier-frame with clamps adapted to grasp a can endwise, its'axis horizontal, pivoted eccentrically to said can.

68. A carrier adapted to effect the travel of a can, its axis horizontal, comprising endwise clamps pivoted eccentrically to the can.

69. A carrier adapted to effect the axial rotation and travel of a can with its axis hori- 72. A machine comprisinga carrier adapted to efiect the travel of a can, its axis horizontal, also its partial revolution around a moving center eccentric to said can and a solderapplying device.

73. A machine comp'risingacarrier adapted to effect the travel of a can, its axis horizontal also its partial revolution around the moving center eccentric to itself, a solder-bath and means whereby solder therefrom is applied to the can.

74. A machine comprising a can carrier provided with endwise opposing clamps adapted to efiect the axial rotation and travel of a can in a circular path and its partial revolution around a traveling center eccentric to itself, and a traveling device adapted to apply solder to both cover-joints simultaneously of the traveling can.

75. A machine comprising a rotating frame having a m ultiplicity of radial, endwise opposing clamps adapted to effect the axial rotation and travel of a multiplicity of cans, their axes horizontal, and suitably arranged to raise and lower each can by a partial revolution around a center eccentric to its axis.

76. A machine comprising a rotating frame having a-multiplicity of radial end wise opposing clamps adapted to eifect the axial rotation and travel of a multiplicity of cans, their axes horizontal, suitably arranged to raise and lower each can by a partial revolution around a moving center eccentric to its axis.

77. A machine comprising a rotating frame having a multiplicity of radial end wise opposing clamps adapted to effect the axial rotation and travel of a multiplicity of cans their axes horizontal, suitably arranged to raise and lower each can by a partial revolution around a center eccentric to its axis and means adapted to apply solder to said can. I

78. A machine comprising a solder-bath and a rotatable frame having endwise clamps pivoted on a radial journal and means for effecting opposing endwise movement of the clamps and their pivotal motion whereby a can is received between said clamps and carried to a position to receive solder.

79. A machine comprising a solder-bath, means for efiecting the travel of cans in a circular path above its normal surface, means for applying solder therefrom to said cans While so traveling and means to remove excess of solder therefrom.

80. A machine com prising a solder-bath, means adapted to apply solder therefrom to a can above the surface of the bath and a device adapted to remove excess solder from the can and automatically return it to the solder-bath. 81. A can-soldering machine comprising an endwiseclamp can-carrier, a solder-bath and means traveling therein for applying solder therefrom to said can its axis horizontal, and means for directing a cold-air current upon said can while being carried by the clamp.

82. A machine comprising devices adapted to apply solder to cans, their axes horizontal and an air-blast pipe provided with a directing-hood above the path of the soldered cans. 83. A can-soldering machine comprising an endwise-clamp can-carrier adapted to eflect the axial rotation and travel of a can, its axis horizontal, a solder-bath, means for applying solder therefrom to said can, and a hood above the path of the soldered can provided with an air-inlet whereby a current of air is directed upon the can while still grasped bythe clamps.

84. A solder-bath, a device adapted to effect a molten-solder mound therein and means for skimming the surface.

85. A solder-bath, a device adapted to effect a molten-solder mound therein, means for applying the objects in contact with the mound and automatic means for skimming the surface.

86. A solder-bath, a' moving can -carrier adapted to effect the travel of cans above the surface of the solder, means for applying solder to the cans while so traveling and a device adapted to travel with the carrier and skim the surface of the solder.

87. A solder-hath, a moving can -carrier adapted to effect the rotation and travel of cans above the surface of the solder, means for applying solder to the cans while so traveling and a plate traveling therewith set at an angle to its direction of travel adapted to be broughtinto contact with the solder.

88. A device adapted to apply the top and bottom coverjoint-, simultaneously, of a can to waves on a fluid-surface, the forms of which waves advance more than their particles.

89. A device adapted to eifect the contact of a horizontal surface at two or more separated points therein to waves formed on the surface of astationary hodyof fluid, the forms of which waves advance more than their particles.

WILLIAM HENRY SMYTH.

\Vitnesses:

JOHN S. PRELL,

lHAS. E. MASON.

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