US6414869B1 - Quad in-line memory module - Google Patents
Quad in-line memory module Download PDFInfo
- Publication number
- US6414869B1 US6414869B1 US09/614,639 US61463900A US6414869B1 US 6414869 B1 US6414869 B1 US 6414869B1 US 61463900 A US61463900 A US 61463900A US 6414869 B1 US6414869 B1 US 6414869B1
- Authority
- US
- United States
- Prior art keywords
- memory
- connector
- memory module
- circuit board
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime, expires
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Definitions
- the invention relates to the field of computer systems and memory hardware and, more particularly, to a quad in-line memory module having connectors along two long edges of the module's circuit board.
- SIMMs and DIMMs are compact circuit boards, typically 10 cm ⁇ 2 cm, with integrated circuit memory chips mounted on one or both sides of the board and electrical connectors along one edge of the board.
- SIMMs have a row of connectors along one side of one edge of the memory module's circuit board.
- DIMMs have connectors along both sides of one edge of the memory module's circuit board.
- FIG. 1 illustrates a computer system 100 in which SIMMs and DIMMs can be used and includes a central processing unit (CPU) 105 , system memory 110 , a video controller card 115 and display 120 , a disk controller card 125 and disk drive 130 , a system bus 135 used to communicate data and control signals between the computer system's 100 different components, a bridge circuit 140 used to couple the system bus 135 to a secondary bus 145 , input/output (I/O) control circuitry 150 , serial 155 and parallel 160 I/O ports, a keyboard 165 , and one or more slots 170 through which additional devices such as an audio card could be connected.
- CPU central processing unit
- system memory 110 includes a central processing unit (CPU) 105 , system memory 110 , a video controller card 115 and display 120 , a disk controller card 125 and disk drive 130 , a system bus 135 used to communicate data and control signals between the computer system's 100 different components, a bridge circuit 140 used to couple the system bus
- system bus could be a Peripheral Component Interconnect (PCI) bus and the secondary bus 145 could be an expansion bus such as the Industry Standard Architecture (ISA) bus or the Extended Industry Standard Architecture (EISA) bus.
- PCI Peripheral Component Interconnect
- EISA Extended Industry Standard Architecture
- SIMMs and DIMMs are generally mounted with their circuit boards at a right angle to the computer system's motherboard and populated with dynamic random access memory (DRAM), static random access memory (SRAM), or video random access memory (VRAM) chips.
- DRAM dynamic random access memory
- SRAM static random access memory
- VRAM video random access memory
- DRAMs the SIMM/DIMM can be used to implement system memory 110 .
- SRAMs the SIMM/DIMM can implement a cache 175 such as found in a disk controller card 125 .
- VRAMs the SIMM/DIMM can implement video memory 180 such as found in a video controller card 115 .
- a quad in-line memory module composed of a circuit board having top and bottom connectors and a number of memory devices mounted on one or both sides of the circuit board is described.
- the memory devices may be mounted onto the circuit board via any convenient technique such as surface mount or flip-chip. Additionally, packaged memory devices (e.g., dual in-line packages or DIPs) may also be mounted on the circuit board. Mounted devices may be electrically coupled to the top and bottom edge connectors via conductive paths both on the surface of the circuit board and between the circuit board's top and bottom surfaces.
- a quad in-line memory module in accordance with the invention can provide one or more of the following advantages: (1) increase chip density in a given computer system without requiring additional motherboard area; (2) simplify routing of conductive paths in a memory module for a given number of chips; (3) provide wider data paths to/from a memory module; and (4) reduce line density for a given size of memory module.
- FIG. 1 illustrates a computer system
- FIG. 2 shows a quad in-line memory module (QIMM) having two rows of memory devices on each side of its circuit board.
- QIMM quad in-line memory module
- FIG. 3 illustrates how a QIMM could be used to simultaneously implement a disk controller cache and system. memory.
- FIG. 4 is a block diagram representation of FIG. 3 .
- FIG. 5 shows a QIMM having a single row of memory devices on each side of its circuit board.
- quad in-line memory module QIMM
- QIMM quad in-line memory module
- a quad in-line memory module includes a circuit board 200 having top connector tabs 205 , bottom connector tabs 210 , alignment slots 215 , and a number of memory devices such as front-top 1 (FT 1 ) and back-bottom 2 (BB 2 ).
- Each of the top memory devices FT 1 through FTN and BT 1 through BTN are connected through conductive paths to the top connector tabs 205 .
- Each of the bottom memory devices FB 1 through FBN and BB 1 through BBN are connected through conductive paths to the bottom connector tabs 210 .
- Conductive paths from the QIMM's memory devices to the edge connectors can be on the surface of the circuit board 200 and/or through conductive layers within the circuit board 200 .
- connections are made by layers within the circuit board 200 , vias must be provided to mechanically link the memory devices to the appropriate conductive layer and connector tab.
- One edge of the QIMM (for example the bottom edge) can plug into a socket connected directly to a computer system's main memory bus while the other edge (the top) can be connected to another component in the computer system through any convenient means such as a flex connector cable.
- the QIMM's bottom connector can plug directly into a computer system's system bus while its top connector could plug into the computer system's video bus, or into a SRAM bus to provide disk cache memory.
- a QIMM's connector tabs ( 205 and 210 ) can form a standard 168 contact connector.
- edge connectors 205 and 210 are gold coated and the circuit board is composed of an epoxy based compound known as FR 4 and/or BT resin (bismaleimide triazine).
- Memory devices may be mounted on the QIMM's circuit board 200 using surface mount or flip-chip technology or any other suitable means capable of mechanically coupling the devices to the board. Memory devices encapsulated within packaged chips may also be mounted on the QIMM's circuit board.
- a computer system's motherboard 300 includes a host CPU 305 , a system bus 310 , a connector 315 connected to at least a part of the system bus 310 , a QIMM 320 , a disk controller card 325 , and a connective cable 330 .
- the QIMM's bottom row of conductor tabs are connected, via connector 315 , to the system bus.
- the QIMM's top row of connector tabs are connected to the disk controller 325 via connector 345 and cable 330 .
- the QIMM 320 has SRAM devices on its top portion 335 (i.e., FT 1 through FTN and BT 1 through BTN) and DRAM devices on its bottom portion 340 (i.e., FB 1 through FBN and BB 1 through BBN).
- SRAM devices on its top portion 335 (i.e., FT 1 through FTN and BT 1 through BTN) and DRAM devices on its bottom portion 340 (i.e., FB 1 through FBN and BB 1 through BBN).
- FIG. 4 includes a disk 400 not shown in FIG. 3.
- a single quad in-line memory module can implement both system memory and disk cache memory.
- the QIMM's SRAM could be replaced with VRAM which could then be connected to a video controller.
- a QIMM's bottom portion could be populated with SRAM and its top portion with VRAM.
- the QIMM could them be used to implement both a cache memory and a video memory.
- a QIMM can be populated with a single type of memory device (e.g., all SRAM or all DRAM).
- the QIMM can be used in a system having double the data bus width of a system that uses standard DIMMs and four times the bus width of a system using standard SIMMs.
- a QIMM includes a circuit board 500 having top connector tabs 505 , bottom connector tabs 510 , alignment slots 515 , and a single row of memory devices on each side of the circuit board 500 such as front 1 (F 1 ) and back 2 (B 2 ).
- Half of the QIMM's memory devices for example all those on the front side of the circuit board 500 , are connected through conductive paths to the top connector tabs 505 , and the other half to the bottom connector tabs 510 .
- integrated circuits could be mounted to only a single side of the circuit board while still utilizing both the top and bottom edge connectors.
- the density of the conductive paths on, and within, the circuit board 500 are reduced over SIMM/DIMM designs making the QIMM's layout simpler, less costly, and less prone to manufacturing error.
- Another benefit of this embodiment is that the number of layers needed in the circuit board 500 to carry conductive paths can be reduced compared to SIMM/DIMM designs having the same number and type of memory devices. This too can reduce the cost and complexity of the memory module.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dram (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/614,639 US6414869B1 (en) | 1997-12-02 | 2000-07-12 | Quad in-line memory module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/982,930 US6108228A (en) | 1997-12-02 | 1997-12-02 | Quad in-line memory module |
US09/614,639 US6414869B1 (en) | 1997-12-02 | 2000-07-12 | Quad in-line memory module |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/982,930 Continuation US6108228A (en) | 1997-12-02 | 1997-12-02 | Quad in-line memory module |
Publications (1)
Publication Number | Publication Date |
---|---|
US6414869B1 true US6414869B1 (en) | 2002-07-02 |
Family
ID=25529657
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/982,930 Expired - Lifetime US6108228A (en) | 1997-12-02 | 1997-12-02 | Quad in-line memory module |
US09/614,639 Expired - Lifetime US6414869B1 (en) | 1997-12-02 | 2000-07-12 | Quad in-line memory module |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/982,930 Expired - Lifetime US6108228A (en) | 1997-12-02 | 1997-12-02 | Quad in-line memory module |
Country Status (1)
Country | Link |
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US (2) | US6108228A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040260859A1 (en) * | 2000-06-09 | 2004-12-23 | Samsung Electronics Co., Ltd. | Memory module with improved data bus performance |
CN1542839B (en) * | 2003-05-02 | 2010-08-25 | 三星电子株式会社 | Memory system mounted directly on board and associated method |
US20110299316A1 (en) * | 2002-06-24 | 2011-12-08 | Choi Jung-Hwan | Memory module, method and memory system having the memory module |
US20130271910A1 (en) * | 2008-11-13 | 2013-10-17 | Mosaid Technologies Incorporated | System including a plurality of encapsulated semiconductor chips |
US8753138B2 (en) | 2012-10-09 | 2014-06-17 | International Business Machines Corporation | Memory module connector with auxiliary power |
US8856417B2 (en) | 2012-10-09 | 2014-10-07 | International Business Machines Corporation | Memory module connector with auxiliary power cable |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4569913B2 (en) * | 2000-03-10 | 2010-10-27 | エルピーダメモリ株式会社 | Memory module |
JP4159415B2 (en) * | 2002-08-23 | 2008-10-01 | エルピーダメモリ株式会社 | Memory module and memory system |
TWI259941B (en) * | 2005-04-29 | 2006-08-11 | Via Tech Inc | Motherboard and bridge module therefor |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5181167A (en) * | 1991-12-02 | 1993-01-19 | Sun Microsystems, Inc. | Stacking heatpipe for three dimensional electronic packaging |
US5513135A (en) * | 1994-12-02 | 1996-04-30 | International Business Machines Corporation | Synchronous memory packaged in single/dual in-line memory module and method of fabrication |
US5532954A (en) * | 1992-05-19 | 1996-07-02 | Sun Microsystems, Inc. | Single in-line memory module |
US5745426A (en) * | 1995-12-28 | 1998-04-28 | Fujitsu Limited | Memory card and circuit board used therefor |
US5748912A (en) * | 1995-06-13 | 1998-05-05 | Advanced Micro Devices, Inc. | User-removable central processing unit card for an electrical device |
US5758100A (en) * | 1996-07-01 | 1998-05-26 | Sun Microsystems, Inc. | Dual voltage module interconnect |
US5790447A (en) * | 1995-05-15 | 1998-08-04 | Silicon Graphics, Inc. | High-memory capacity DIMM with data and state memory |
US6097883A (en) * | 1997-07-08 | 2000-08-01 | International Business Machines Corporation | Dual state memory card having combined and single circuit operation |
-
1997
- 1997-12-02 US US08/982,930 patent/US6108228A/en not_active Expired - Lifetime
-
2000
- 2000-07-12 US US09/614,639 patent/US6414869B1/en not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5181167A (en) * | 1991-12-02 | 1993-01-19 | Sun Microsystems, Inc. | Stacking heatpipe for three dimensional electronic packaging |
US5532954A (en) * | 1992-05-19 | 1996-07-02 | Sun Microsystems, Inc. | Single in-line memory module |
US5513135A (en) * | 1994-12-02 | 1996-04-30 | International Business Machines Corporation | Synchronous memory packaged in single/dual in-line memory module and method of fabrication |
US5790447A (en) * | 1995-05-15 | 1998-08-04 | Silicon Graphics, Inc. | High-memory capacity DIMM with data and state memory |
US5748912A (en) * | 1995-06-13 | 1998-05-05 | Advanced Micro Devices, Inc. | User-removable central processing unit card for an electrical device |
US5745426A (en) * | 1995-12-28 | 1998-04-28 | Fujitsu Limited | Memory card and circuit board used therefor |
US5758100A (en) * | 1996-07-01 | 1998-05-26 | Sun Microsystems, Inc. | Dual voltage module interconnect |
US6097883A (en) * | 1997-07-08 | 2000-08-01 | International Business Machines Corporation | Dual state memory card having combined and single circuit operation |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040260859A1 (en) * | 2000-06-09 | 2004-12-23 | Samsung Electronics Co., Ltd. | Memory module with improved data bus performance |
US6990543B2 (en) * | 2000-06-09 | 2006-01-24 | Samsung Electronics, Co., Ltd. | Memory module with improved data bus performance |
US20110299316A1 (en) * | 2002-06-24 | 2011-12-08 | Choi Jung-Hwan | Memory module, method and memory system having the memory module |
CN1542839B (en) * | 2003-05-02 | 2010-08-25 | 三星电子株式会社 | Memory system mounted directly on board and associated method |
US20130271910A1 (en) * | 2008-11-13 | 2013-10-17 | Mosaid Technologies Incorporated | System including a plurality of encapsulated semiconductor chips |
US8908378B2 (en) * | 2008-11-13 | 2014-12-09 | Conversant Intellectual Property Management Inc. | System including a plurality of encapsulated semiconductor chips |
US8753138B2 (en) | 2012-10-09 | 2014-06-17 | International Business Machines Corporation | Memory module connector with auxiliary power |
US8856417B2 (en) | 2012-10-09 | 2014-10-07 | International Business Machines Corporation | Memory module connector with auxiliary power cable |
Also Published As
Publication number | Publication date |
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US6108228A (en) | 2000-08-22 |
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