US630246A - Preparation of aluminium for electroplating. - Google Patents
Preparation of aluminium for electroplating. Download PDFInfo
- Publication number
- US630246A US630246A US69021098A US1898690210A US630246A US 630246 A US630246 A US 630246A US 69021098 A US69021098 A US 69021098A US 1898690210 A US1898690210 A US 1898690210A US 630246 A US630246 A US 630246A
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- US
- United States
- Prior art keywords
- aluminium
- bath
- ounces
- acid
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Definitions
- the object of my invention is to electroplate aluminium with other metals, an object which, although often" tried, has not hitherto been accomplished satisfactorily.
- the hydrofluoric acid is preferably dilute, made by adding, say, twenty-fi ve cubic centimeters strong acid to two thousand cubic centimeters water.
- the aluminium having first been cleansed to remove grease, dirt, 8m.
- Thequicking solution into which the aluminiumis put after treatment in theh'ydrofiuoric acid is preferably composed of fifty '6. grams mercury dissolved in, say, onefhun-j; d-redcubic centimeters strong nitric acid, this being added to two thousand cubic centimefters water and thirty grams potassium cya'nid. The time of immersion of the alumini um in the quicking bath shoulddepend upon the strength of the bath. With a bath comsuflice. Otherquickingsolutionsof mercury may be used. 1
- the hydrofluoric-acid aluminium is introduced after its removal from the quicking-bath may be constitutedin the same manner as the acid-bath above gas.
- aluminium is put after its second acid treatment is an alkaline or neutral solution, which when copper is to. be deposited is preferably constituted as follows, and used hot-say at a thick paste with water and add eight ounces sodium carbonate dissolved in two quarts of water.
- I dissolve eight ounces sodium bisulfite in two quarts water and add this sodium-bisulfite solution to the I also dissolve six ounces potassium cyanid in three quarts water and add it to the previous mixture, and then add five quarts water, making it up to three gallons, when the bath is ready for use.
- I connect a copper the negative wire objects to be plated.
- Io plate'with silver the following is'a good bath: three ounces silver chlorid, eight ounces potassium cyanid, and eight ounces sodium I v carbonate dissolved in, say, one gallon water.
Description
UNITED PATENT OFFICE;
FRANK s. LoEB, or NEW, KENsINGToN, rENNsYLvA IA.'
PREPARATION OIFYALUMINIUM FOR ELlEci'I oP'LA'nNc.
SPECIFICATION ramiig sa'orneaers Patent No; 030,246, datedAugusir 1 1899. pp at qd September 8,1898. Serial lie-690.210. (a al a To all whom it may concern:
. Be it known that I,FRANK S. LOEB, of New Kensington, in the county of Allegheny and State of Pennsylvania, have iiivented a new and useful Improvement in the Preparation of Aluminium forElectroplating, of which the following is a specification.
The object of my invention is to electroplate aluminium with other metals, an object which, although often" tried, has not hitherto been accomplished satisfactorily.
To prepare the aluminium to receive the electrodeposit, I treat it with one of the acids of the halogen group, preferably hydrofluoric acid, which I have discovered to be much the best and to which I intend to vmake specific claims in addition to the broader claims. Then I quick the aluminium with a mercury solution, preferablyrassolution composed. of nitrate of mercury, to whichis added-a cyanid. Then after the quicking I treat thealuminium again in the acid-bath, after which it is ready to receive the electrodeposit. By thus treating the aluminium with acid after it has been quicked the plating of metal subsequently deposited thereon is rendered very adherent and durable, much more so than would'be the case if the guicked aluminium were put in the plating-bath without such retreatment with acid.
-I shall now describe the preferable compositions and preferable proportions which I have used in this preparatory'treatment and in electroplating, promising that within the scope of my claims the same may be variedby the skilled electrometallurgist in many way.
The hydrofluoric acid is preferably dilute, made by adding, say, twenty-fi ve cubic centimeters strong acid to two thousand cubic centimeters water. The aluminium, having first been cleansed to remove grease, dirt, 8m.
and preferably rinsed in .hot water, is immersed in the hydrofluoric acid until were gen gas is freely evolved from it.
Thequicking solution into which the aluminiumis put after treatment in theh'ydrofiuoric acid is preferably composed of fifty '6. grams mercury dissolved in, say, onefhun-j; d-redcubic centimeters strong nitric acid, this being added to two thousand cubic centimefters water and thirty grams potassium cya'nid. The time of immersion of the alumini um in the quicking bath shoulddepend upon the strength of the bath. With a bath comsuflice. Otherquickingsolutionsof mercury may be used. 1
The hydrofluoric-acid aluminium is introduced after its removal from the quicking-bath may be constitutedin the same manner as the acid-bath above gas.
' aluminium is put after its second acid treatment is an alkaline or neutral solution, which when copper is to. be deposited is preferably constituted as follows, and used hot-say at a thick paste with water and add eight ounces sodium carbonate dissolved in two quarts of water. In a separate vessel I dissolve eight ounces sodium bisulfite in two quarts water and add this sodium-bisulfite solution to the I also dissolve six ounces potassium cyanid in three quarts water and add it to the previous mixture, and then add five quarts water, making it up to three gallons, when the bath is ready for use. When used, I connect a copper the negative wire objects to be plated. When in'a suitable manner-say by'rinsing in run sawdust. polished, or bufied without injuring the de- For electrodepositingbrassbn aluminium an "alkaline brass, both of composition analogous v2 ,to thos'e'above described,m ay be used. A good b'rassfplating bath is made of five ounces cop-r grac'etate and'fiv-e ounces zinc chlorid fused,
ved inwater. To this are added ten dinm bisulfite, th'e'ni'sev'en ounces potassium cyauid and waterenough to make up, say,
three gallons. 'i p a pounded as just stated about five seconds will anode to the positive wire and suspend from 5 sufliciently plated, the article may be cleaned bath into which the described,and the length of immersion should be sufiieient to' cause evolution of hydrogen j The electroplating solution into which the temperaturaoffnomliifl, v1191.180. Fa renhe I make eight ounces of copper acetate to a is iv copper-acetate and sodium-carbonate solution.
ning water, then in hot water, and dried in It can then be scratch-brushed, y 0 posited film, which is strong and adherent, so
and forth repeatedly without cracking the 1 n s'sodiumcarbonate and five ounces so- I g; r V 630,246
'1 i "Io plate'with silver, the following is'a good bath: three ounces silver chlorid, eight ounces potassium cyanid, and eight ounces sodium I v carbonate dissolved in, say, one gallon water.
The foregoing plating-baths are i-llus'trm tive, and as the essence of my invention is' not the depositing of any particular metal or 'of depositing a metal from any particular alkaline; solution I deem it unnecessary further "toelaborate onthis point. v E Icla'im-.
; 1.- The methodrot preparing aluminium for electroplating, which consists intreatin'g the aluminium with hydrofluoric acid-,then quickaluminium and then treating the quicked aluminium with hydrofluoric acid; substantially as described. 1
1 In testimony whereof I'havehereunto set my hand.
r "FRANK S. LOEB,
Witnesses:- I I j GEORGE B. BL MMI G, s
' G.I.'H0 1)sH1P. f
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69021098A US630246A (en) | 1898-09-03 | 1898-09-03 | Preparation of aluminium for electroplating. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69021098A US630246A (en) | 1898-09-03 | 1898-09-03 | Preparation of aluminium for electroplating. |
Publications (1)
Publication Number | Publication Date |
---|---|
US630246A true US630246A (en) | 1899-08-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US69021098A Expired - Lifetime US630246A (en) | 1898-09-03 | 1898-09-03 | Preparation of aluminium for electroplating. |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2798843A (en) * | 1953-10-29 | 1957-07-09 | Rohr Aircraft Corp | Plating and brazing titanium |
US4122314A (en) * | 1976-12-23 | 1978-10-24 | Sony Corporation | Loudspeaker having a laminate diaphragm of three layers |
US5306526A (en) * | 1992-04-02 | 1994-04-26 | Ppg Industries, Inc. | Method of treating nonferrous metal surfaces by means of an acid activating agent and an organophosphate or organophosphonate and substrates treated by such method |
-
1898
- 1898-09-03 US US69021098A patent/US630246A/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2798843A (en) * | 1953-10-29 | 1957-07-09 | Rohr Aircraft Corp | Plating and brazing titanium |
US4122314A (en) * | 1976-12-23 | 1978-10-24 | Sony Corporation | Loudspeaker having a laminate diaphragm of three layers |
US5306526A (en) * | 1992-04-02 | 1994-04-26 | Ppg Industries, Inc. | Method of treating nonferrous metal surfaces by means of an acid activating agent and an organophosphate or organophosphonate and substrates treated by such method |
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