US6225851B1 - Temperature level detection circuit - Google Patents
Temperature level detection circuit Download PDFInfo
- Publication number
- US6225851B1 US6225851B1 US09/552,248 US55224800A US6225851B1 US 6225851 B1 US6225851 B1 US 6225851B1 US 55224800 A US55224800 A US 55224800A US 6225851 B1 US6225851 B1 US 6225851B1
- Authority
- US
- United States
- Prior art keywords
- temperature
- generating
- detection circuit
- signal
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K3/00—Thermometers giving results other than momentary value of temperature
- G01K3/005—Circuits arrangements for indicating a predetermined temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/20—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer in a specially-adapted circuit, e.g. bridge circuit
- G01K7/206—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer in a specially-adapted circuit, e.g. bridge circuit in a potentiometer circuit
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/34—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using capacitative elements
- G01K7/346—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using capacitative elements for measuring temperature based on the time delay of a signal through a series of logical ports
Definitions
- the present invention concerns a temperature level detection circuit.
- the present invention relates to a detection circuit generating a temperature signal representative of a temperature greater than or less than a determined temperature threshold.
- the detection circuit according to the present invention is intended in particular to be used in a battery protection circuit.
- the voltage level detector circuit disclosed in this Patent compares an input voltage, namely the voltage across the battery terminals, to a reference level, and includes, on the one hand, means for generating a first, second and third diode voltage, formed by bipolar diode-connected transistors, in series with current sources, and on the other hands calculating means including capacitive elements and switching elements for selectively and sequentially connecting, during a first and second phase, the capacitive elements to the means generating the diode voltages and to an circuit input to which the input voltage is applied.
- the calculating means provide, during the second phase, a signal representative of the difference between the input voltage and the reference level defined from the sum of the first diode voltage and the product of the difference between the second and third diode voltages by a determined coefficient.
- An object of the present invention is to provide a temperature threshold detection circuit allowing a voltage representative of the circuit temperature to a reference level to be compared.
- the present invention therefore concerns a temperature level detection circuit the features of which are listed in claim 1 .
- One advantage of the present invention lies in the fact that the temperature threshold of the detection circuit according to the present invention can be adjusted easily and accurately.
- FIG. 1 is a diagram of the evolution of a diode voltage as a function of the temperature enabling the general operating principle of the detection circuit according to the invention to be explained;
- FIG. 2 is an embodiment example of the detection circuit according to the invention.
- FIG. 3 is an evolution diagram as a function of the temperature enabling the operation of the detection circuit of FIG. 2 to be explained.
- FIG. 4 is another embodiment example of the detection circuit according to the invention.
- FIG. 1 shows the evolution, as a function of the temperature, of voltage V D across the terminals of a diode formed by the base-emitter junction of a bipolar transistor for three values I 1 , I 2 and I 3 of the current passing through it.
- This voltage thus has a linear evolution feature with a negative temperature .coefficient, i.e. it decreases in a linear manner when the temperature increases.
- T tends towards 0° K.
- the diode voltage tends towards a value V BG denominated the bandgap value.
- this bandgap value is equal to approximately 1,205 volts.
- This diode voltage is substantially equal to:
- V D V BG ⁇ kT/e In (I 0 /I) (1)
- k is the Boltzman constant
- e the charge of the electron
- I 0 a value depending in particular on the surface of the device and equivalent concentrations of the conduction and valence states of the doped material.
- I 0 is much greater than that of the current which passes through the diode; although it depends on the transistor manufacturing technology and slightly on the temperature, it may be considered that the factor In (I 0 /I) remains substantially constant for a given current I.
- This difference is directly dependent on the temperature and has a positive or negative temperature coefficient according to whether current I 2 is greater than or less than current I 1 .
- V 3 + ⁇ V 21 V BG ⁇ kT/e (In (I 0 /I 3 ) ⁇ In (I 2 /I 1 )) (3)
- the quantity V 3 + ⁇ V 21 can thus be made independent of the temperature and then equals bandgap value V BG .
- FIG. 2 shows a first embodiment example of the temperature level detection circuit according to the present invention.
- This circuit includes three bipolar PNP type transistors B 1 , B 2 , B 3 connected in diode, i.e. whose base and collector are connected to each other, themselves connected to one of the supply terminals of the circuit onto which is applied a potential V ss which will be considered, in the following description, as forming the detection circuit earth.
- Bipolar transistors B 2 and B 3 are chosen to be substantially identical.
- First and second current sources 11 and 12 respectively generating currents I 1 and I 2 are arranged between the emitter of transistor B 1 and the other supply terminal of the circuit onto which a positive potential V dd is applied. These current sources 11 and 12 are selectively connected to the emitter of transistor B 1 by means of a switch SW 1 so that currents I 1 or I 2 selectively pass through the base-emitter junction of transistor B 1 when switch SW 1 is in position “I”, indicated by the full lines, or in position “II” indicated by the dotted lines. First and second diode voltages V BE1 and V BE2 are thus successively generated.
- a third current source 21 is arranged between the emitter of transistor B 2 and the supply terminal of the circuit onto which potential V dd is applied. This current source 21 maintains a constant current I 3 through the base-emitter junction of transistor B 2 .
- a switch SW 2 is further arranged between the emitter of transistor B 2 and the circuit's earth. When this switch SW 2 is in position “I”, the emitter of transistor B 2 is thus connected to the circuit's earth. In the opposite case, when this switch is in position “II”, current I 3 passes through the base-emitter junction and a third diode voltage V BE3 is generated.
- Fourth and fifth current sources 31 and 32 respectively generating currents I 4 and I 5 are also arranged between terminal V dd of the circuit and the emitter of transistor B 3 . These current sources 31 and 32 are selectively connected to the emitter of transistor B 3 by means of a switch SW 3 so that currents I 4 or I 5 selectively pass through the base-emitter junction of transistor B 3 when switch SW 3 is in position “I” or “II”. Fourth and fifth diode voltages V BE4 and V BE5 are thus successively generated.
- the circuit of FIG. 2 further includes three capacitive elements 51 , 52 and 53 respectively connected by one of their terminals to the emitter of transistors B 1 , B 2 and B 3 .
- the other terminals of capacitive elements 51 , 52 and 53 are together connected to a node A at the inverting input of a very high gain amplifier 9 .
- a switch SW 4 allows the output of amplifier 9 to be connected to or disconnected from its input.
- Capacitive elements 51 , 52 , 53 have respectively capacitance values C1, C2, C3.
- switches SW 1 , SW 2 , SW 3 , SW 4 are placed in position “I” shown in a full line in the Figure.
- Amplifier 9 is then subjected to a total counter-reaction and automatically polarises at a stable operating point, its input voltage V E being then equal to its output voltage and its maximum gain.
- Capacitive elements 51 , 52 , 53 are thus respectively charged at voltages (V E ⁇ V BE1 ), V E , and (V E ⁇ V BE4 ).
- the total charge injected into node A can be expressed in the following form:
- Equation (5) can then be expressed as follows:
- ⁇ is a positive defined temperature coefficient essentially determined by the logarithmic ratio of currents I 1 and I 2 passing through the base-emitter junction of transistor B 1 and having the value:
- FIG. 3 shows a diagram illustrating the evolution of the charge transmitted into input node A of amplifier 9 as a function of the temperature T corresponding to the above equation (6).
- the circuit according to the present invention has the advantage of being able to adjust temperature threshold T LIMIT of the detection circuit easily and accurately. In fact it is very easy with MOS technology to make very precise capacitance ratios for capacitive elements.
- the circuit according to the present invention further operates very quickly, the time necessary to calculate and compare being essentially consecrated to the phase of charging the capacitive elements and polarising the amplifier.
- amplifier 9 is only used to amplify sufficiently the signal appearing at input node A so that the output signal can properly drive another circuit.
- FIG. 4 shows an example of such a circuit in which transistor B 2 and the associated current source 21 have been omitted.
- capacitive element 52 is thus connected, via switch SW 2 first of all to the circuit's earth during the first phase then, during the second phase, to the emitter of transistor B 3 .
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measurement Of Current Or Voltage (AREA)
- Amplifiers (AREA)
Abstract
The invention concerns a temperature level detection circuit including means (B1, B2, B3, 11, 12, 21, 31, 32) for generating diode voltages (VBE1 to VBE5) and calculating means including capacitive elements (51, 52, 53) and switching means (SW1 to SW4) arranged to connect selectively and sequentially, during first and second phases, the capacitive elements (51, 52, 53) to the means generating said diode voltages (VBE1 to VBE5). During the second phase, the calculating means generating a temperature signal representative of the temperature level being greater than or less than a determined temperature threshold (Tlimit) defined as the temperature value for which the equation α1(VBE2−VBE1)+α2(VBE3+α3 (VBE5−VBE4)) becomes zero, where α1, α2, and α3 are first, second and third proportionality coefficients determined by the values of the capacitive elements.
Description
The present invention concerns a temperature level detection circuit. In particular, the present invention relates to a detection circuit generating a temperature signal representative of a temperature greater than or less than a determined temperature threshold.
The detection circuit according to the present invention is intended in particular to be used in a battery protection circuit.
Circuits comparing a voltage to a reference voltage, which is stable in temperature, are known to those skilled in the art. In particular Swiss Patent No. 639 521 discloses a voltage level detection circuit used particularly to indicate the nearing of the end of life of batteries for electronic or electromechanical timepieces.
The voltage level detector circuit disclosed in this Patent compares an input voltage, namely the voltage across the battery terminals, to a reference level, and includes, on the one hand, means for generating a first, second and third diode voltage, formed by bipolar diode-connected transistors, in series with current sources, and on the other hands calculating means including capacitive elements and switching elements for selectively and sequentially connecting, during a first and second phase, the capacitive elements to the means generating the diode voltages and to an circuit input to which the input voltage is applied. The calculating means provide, during the second phase, a signal representative of the difference between the input voltage and the reference level defined from the sum of the first diode voltage and the product of the difference between the second and third diode voltages by a determined coefficient.
An object of the present invention is to provide a temperature threshold detection circuit allowing a voltage representative of the circuit temperature to a reference level to be compared.
The present invention therefore concerns a temperature level detection circuit the features of which are listed in claim 1.
One advantage of the present invention lies in the fact that the temperature threshold of the detection circuit according to the present invention can be adjusted easily and accurately.
Other features and advantages of the invention will appear more clearly upon reading the following detailed description, made with reference to the annexed drawings given by way of non-limiting examples and in which:
FIG. 1 is a diagram of the evolution of a diode voltage as a function of the temperature enabling the general operating principle of the detection circuit according to the invention to be explained;
FIG. 2 is an embodiment example of the detection circuit according to the invention;
FIG. 3 is an evolution diagram as a function of the temperature enabling the operation of the detection circuit of FIG. 2 to be explained; and
FIG. 4 is another embodiment example of the detection circuit according to the invention.
The general operating principle of the detection circuit of the invention will be briefly explained by means of the diagram of FIG. 1 which shows the evolution, as a function of the temperature, of voltage VD across the terminals of a diode formed by the base-emitter junction of a bipolar transistor for three values I1, I2 and I3 of the current passing through it.
This voltage thus has a linear evolution feature with a negative temperature .coefficient, i.e. it decreases in a linear manner when the temperature increases. When T tends towards 0° K., the diode voltage tends towards a value VBG denominated the bandgap value. In the case of silicon, this bandgap value is equal to approximately 1,205 volts. This diode voltage is substantially equal to:
where k is the Boltzman constant, e the charge of the electron and I0 a value depending in particular on the surface of the device and equivalent concentrations of the conduction and valence states of the doped material.
Value I0 is much greater than that of the current which passes through the diode; although it depends on the transistor manufacturing technology and slightly on the temperature, it may be considered that the factor In (I0/I) remains substantially constant for a given current I.
If two different currents I1 and I2 are passed in succession in the same diode or in two identical diodes, at a same temperature, the difference between the voltages which appear across its terminals or across their terminals is equal to:
This difference is directly dependent on the temperature and has a positive or negative temperature coefficient according to whether current I2 is greater than or less than current I1.
Moreover, by adding a voltage proportional to this difference to diode voltage V3 generated by the passage of a current I3, for a same temperature one obtains:
V3+αΔV21=VBG−kT/e (In (I0/I3)−αIn (I2/I1)) (3)
By a suitable choice of proportionality coefficient α so that:
the quantity V3+αΔV21 can thus be made independent of the temperature and then equals bandgap value VBG.
FIG. 2 shows a first embodiment example of the temperature level detection circuit according to the present invention. This circuit includes three bipolar PNP type transistors B1, B2, B3 connected in diode, i.e. whose base and collector are connected to each other, themselves connected to one of the supply terminals of the circuit onto which is applied a potential Vss which will be considered, in the following description, as forming the detection circuit earth. Bipolar transistors B2 and B3 are chosen to be substantially identical.
First and second current sources 11 and 12 respectively generating currents I1 and I2 are arranged between the emitter of transistor B1 and the other supply terminal of the circuit onto which a positive potential Vdd is applied. These current sources 11 and 12 are selectively connected to the emitter of transistor B1 by means of a switch SW1 so that currents I1 or I2 selectively pass through the base-emitter junction of transistor B1 when switch SW1 is in position “I”, indicated by the full lines, or in position “II” indicated by the dotted lines. First and second diode voltages VBE1 and VBE2 are thus successively generated.
A third current source 21 is arranged between the emitter of transistor B2 and the supply terminal of the circuit onto which potential Vdd is applied. This current source 21 maintains a constant current I3 through the base-emitter junction of transistor B2. A switch SW2 is further arranged between the emitter of transistor B2 and the circuit's earth. When this switch SW2 is in position “I”, the emitter of transistor B2 is thus connected to the circuit's earth. In the opposite case, when this switch is in position “II”, current I3 passes through the base-emitter junction and a third diode voltage VBE3 is generated.
Fourth and fifth current sources 31 and 32 respectively generating currents I4 and I5 are also arranged between terminal Vdd of the circuit and the emitter of transistor B3. These current sources 31 and 32 are selectively connected to the emitter of transistor B3 by means of a switch SW3 so that currents I4 or I5 selectively pass through the base-emitter junction of transistor B3 when switch SW3 is in position “I” or “II”. Fourth and fifth diode voltages VBE4 and VBE5 are thus successively generated.
Currents I1 and I5 are determined so that they are respectively greater than currents I2 and I4.
The circuit of FIG. 2 further includes three capacitive elements 51, 52 and 53 respectively connected by one of their terminals to the emitter of transistors B1, B2 and B3. The other terminals of capacitive elements 51, 52 and 53 are together connected to a node A at the inverting input of a very high gain amplifier 9. A switch SW4 allows the output of amplifier 9 to be connected to or disconnected from its input. Capacitive elements 51, 52, 53 have respectively capacitance values C1, C2, C3.
In a first phase, switches SW1, SW2, SW3, SW4 are placed in position “I” shown in a full line in the Figure. Amplifier 9 is then subjected to a total counter-reaction and automatically polarises at a stable operating point, its input voltage VE being then equal to its output voltage and its maximum gain. Capacitive elements 51, 52, 53 are thus respectively charged at voltages (VE−VBE1), VE, and (VE−VBE4).
In a second phase, when switches SW1, SW2, SW3, SW4 are placed in position “II” shown in a dotted line in the Figure, capacitive elements 51, 52, 53 inject into input node A of amplifier 9, left floating, electric charges respectively equal to C1(VBE2−VBE1), C2 VBE3 and C3 (VBE5−VBE4), the charge injected by element 51 being of the opposite sign to the charges injected by elements 52 and 53.
The total charge injected into node A can be expressed in the following form:
where α1=C1, α2=C2 and α3=C3/C2.
By a suitable choice of values C2 and C3 of capacitive elements 52 and 53, according to the principle described hereinbefore (according to equations (3) and (4) with α=α3=C3/C2), the second part of the equation can be made independent of the temperature and equal to the value α2 VBG. Equation (5) can then be expressed as follows:
where β is a positive defined temperature coefficient essentially determined by the logarithmic ratio of currents I1 and I2 passing through the base-emitter junction of transistor B1 and having the value:
β=α1k/e In (I1/I2) (7)
FIG. 3 shows a diagram illustrating the evolution of the charge transmitted into input node A of amplifier 9 as a function of the temperature T corresponding to the above equation (6).
It will be noted in this diagram that the total charge transmitted into node A of amplifier 9 becomes zero at a temperature TLIMIT defined by coefficients α1 and α2, namely values C1 and C2 of capacitive elements 51 and 52, the value of bandgap VBG and coefficient β defined hereinbefore which depend, as was already mentioned on the logarithmic ratio of currents I1 and I2 passing through the base-emitter junction of transistor B1. Consequently, no signal appears at the input of amplifier 9 when the temperature is equal to TLIMIT.
Conversely, if the temperature differs from that of threshold temperature TLIMIT, a voltage variation appears at the amplifier input the polarity of which is representative of the sign of the total charge injected into input node A. This signal is amplified and inverted by amplifier 9 which provides an amplitude output signal much greater than that of the signal applied to its input. This output signal from amplifier 9, of logic level, can thus be used as control signal, in order, for example, to protect a circuit against damage caused by too high operating temperatures.
Moreover, it is be noted from the foregoing that the circuit according to the present invention has the advantage of being able to adjust temperature threshold TLIMIT of the detection circuit easily and accurately. In fact it is very easy with MOS technology to make very precise capacitance ratios for capacitive elements.
On the other hand, as is clear from equations (6) and (7) above, it is also possible to adjust temperature threshold TLIMIT by acting on the ratio of currents I1 and I2. Indeed, the value of coefficient β appearing in equation (6) above depends directly on the logarithmic ratio of currents I1 and I2 delivered by current sources 11 and 12. It is thus possible, as long as the current delivered by one of current sources 11 or 12 can be adjusted, to adapt temperature threshold TLIMIT, even after having programmed capacitive elements 51, 52 and 53. Thus, with the detection circuit according to the present invention one has great flexibility to adjust the value of temperature threshold TLIMIT.
The circuit according to the present invention further operates very quickly, the time necessary to calculate and compare being essentially consecrated to the phase of charging the capacitive elements and polarising the amplifier.
Moreover, amplifier 9 is only used to amplify sufficiently the signal appearing at input node A so that the output signal can properly drive another circuit. One can thus simply use a single stage amplifier formed, in the manner of an inverter, by two complementary transistors mounted with a common source whose drains are connected to each other.
It may to noted in the foregoing that it is not necessary to actually generate the three voltages VBE3, VBE4 and VBE5, two voltages being sufficient. It is thus possible to omit transistor B2, and to use diode voltage VBE5 generated by transistor B3 during the second phase as third diode voltage VBE3.
FIG. 4 shows an example of such a circuit in which transistor B2 and the associated current source 21 have been omitted. In this example, capacitive element 52 is thus connected, via switch SW2 first of all to the circuit's earth during the first phase then, during the second phase, to the emitter of transistor B3.
Claims (7)
1. A temperature level detection circuit arranged to generate a temperature signal representative of said temperature level being greater than or less than a determined temperature threshold TLIMIT, wherein said circuit includes:
means for generating diode voltages; and
calculating means for generating said temperature signal, these calculating means including capacitive elements and switching means arranged to connect selectively and sequentially, during a first and a second phase, said capacitive elements to said means for generating said diode voltages so that said calculating means generate said temperature signal during said second phase, said temperature threshold Tlimit being defined as the temperature value for which the equation α1(VBE2−VBE1) +α2(VBE3+α3(VBE5−VBE4)) becomes zero, where at, α2, and α3 are first, second and third proportionality coefficients determined by the values of said capacitive elements and VBE1 to VBE5 are first, second, third, fourth and fifth diode voltages, the third diode voltage being able to be equal to any one of the other diode voltages.
2. The detection circuit according to claim 1, wherein said calculating means are arranged to generate:
a first signal dependent of the temperature representative of the product by said first proportionality coefficient of the difference between the first and second diode voltages, and
a second signal independent of the temperature representative of the product by said second proportionality coefficient of the sum of said third diode voltage and the product by said third proportionality coefficient of the difference between said fourth and fifth diode voltages.
3. The detection circuit according to claim 2, wherein said calculating means are arranged to generate:
a third signal representative of the product of said third diode voltage by said second proportionality coefficient, and
a fourth signal representative of the product of the difference between said fourth and fifth diode voltages by said second and third proportionality coefficients; these third and fourth signals being added to generate said second signal.
4. The detection circuit according to claim 3, wherein said calculating means include:
for generating said first signal, a first capacitive element of substantially equal capacitance to said first proportionality coefficient,
for generating said third signal, a second capacitive element of substantially equal capacitance to said second proportionality coefficient, and
for generating said fourth signal, a third capacitive element of substantially equal capacitance to the product of said second and third proportionality coefficients.
5. The detection circuit according to claim 1, wherein said means for generating said diode voltages include bipolar transistors connected in series with current sources and whose base is connected to the collector.
6. The detection circuit according to claim 4, wherein said means for generating said diode voltages include three bipolar transistors whose base is connected to the collector, a first and second of said transistors being each successively connected in series with two current sources, a third of said transistors being connected in series with a current source, the second and third transistor being substantially identical.
7. The detection circuit according to claim 4, wherein said means for generating said diode voltages include two bipolar transistors whose base is connected to the collector, each of said transistors being connected successively in series with two current sources.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0728/99 | 1999-04-21 | ||
CH72899 | 1999-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
US6225851B1 true US6225851B1 (en) | 2001-05-01 |
Family
ID=4193805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/552,248 Expired - Lifetime US6225851B1 (en) | 1999-04-21 | 2000-04-19 | Temperature level detection circuit |
Country Status (5)
Country | Link |
---|---|
US (1) | US6225851B1 (en) |
KR (1) | KR20000071745A (en) |
CA (1) | CA2305885A1 (en) |
SG (1) | SG86389A1 (en) |
TW (1) | TW446812B (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020014675A1 (en) * | 2000-08-04 | 2002-02-07 | Toru Matsumoto | Semiconductor temperature detecting method and its circuit |
US6630754B1 (en) * | 1993-09-21 | 2003-10-07 | Intel Corporation | Temperature-based cooling device controller apparatus and method |
US20040145021A1 (en) * | 2001-06-08 | 2004-07-29 | Rohm Co., Ltd. | Semiconductor integrated circuit device |
US20050232333A1 (en) * | 2004-04-14 | 2005-10-20 | Franch Robert L | On chip temperature measuring and monitoring circuit and method |
EP1843139A2 (en) | 2003-06-06 | 2007-10-10 | Microchip Technology Incorporated | Ultra-low power programmable timer and low voltage detection circuits |
US20080061761A1 (en) * | 2006-09-11 | 2008-03-13 | Samsung Electronics Co., Ltd. | Temperature sensing circuit |
US20080061863A1 (en) * | 2006-07-31 | 2008-03-13 | Freescale Semiconductor, Inc. | Temperature sensor device and methods thereof |
US20080123238A1 (en) * | 2006-08-30 | 2008-05-29 | Freescale Semiconductor, Inc. | Multiple sensor thermal management for electronic devices |
EP2028465A1 (en) * | 2007-08-20 | 2009-02-25 | Winbond Electronics Corporation | Transistor circuit with estimating parameter error and temperature sensing apparatus using the same |
US20100109752A1 (en) * | 2007-11-08 | 2010-05-06 | Rohm Co., Ltd | Semiconductor Device, and Power Source and Processor Provided with the Same |
US20120013364A1 (en) * | 2003-04-10 | 2012-01-19 | Schnaitter William N | System for on-chip temperature measurement in integrated circuits |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101958485B1 (en) * | 2012-10-12 | 2019-03-14 | 현대모비스 주식회사 | System and Method for measuring the temperature of power semiconductor, and Storage medium thereof |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3825778A (en) | 1973-02-09 | 1974-07-23 | Rca Corp | Temperature-sensitive control circuit |
US4331888A (en) * | 1978-08-24 | 1982-05-25 | Hochiki Corporation | Temperature detecting apparatus |
US5039878A (en) * | 1988-11-14 | 1991-08-13 | U.S. Philips Corporation | Temperature sensing circuit |
US5159520A (en) * | 1990-08-03 | 1992-10-27 | Sharp Kabushiki Kaisha | Semiconductor integrated circuit having function of preventing rise of surface temperature |
US5195827A (en) * | 1992-02-04 | 1993-03-23 | Analog Devices, Inc. | Multiple sequential excitation temperature sensing method and apparatus |
GB2292221A (en) | 1994-08-09 | 1996-02-14 | Texas Instruments Ltd | Hottest temperature sensor |
US5686858A (en) * | 1994-08-31 | 1997-11-11 | Sgs-Thomson Microelectronics S.A. | Temperature detector on an integrated circuit |
US5982221A (en) * | 1997-08-13 | 1999-11-09 | Analog Devices, Inc. | Switched current temperature sensor circuit with compounded ΔVBE |
US6019058A (en) * | 1997-06-19 | 2000-02-01 | Fmc Corporation | Looped mooring line and method of installation |
-
2000
- 2000-04-14 SG SG200002165A patent/SG86389A1/en unknown
- 2000-04-17 TW TW089107185A patent/TW446812B/en not_active IP Right Cessation
- 2000-04-17 CA CA002305885A patent/CA2305885A1/en not_active Abandoned
- 2000-04-19 US US09/552,248 patent/US6225851B1/en not_active Expired - Lifetime
- 2000-04-20 KR KR1020000020845A patent/KR20000071745A/en not_active Application Discontinuation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3825778A (en) | 1973-02-09 | 1974-07-23 | Rca Corp | Temperature-sensitive control circuit |
US4331888A (en) * | 1978-08-24 | 1982-05-25 | Hochiki Corporation | Temperature detecting apparatus |
US5039878A (en) * | 1988-11-14 | 1991-08-13 | U.S. Philips Corporation | Temperature sensing circuit |
US5159520A (en) * | 1990-08-03 | 1992-10-27 | Sharp Kabushiki Kaisha | Semiconductor integrated circuit having function of preventing rise of surface temperature |
US5195827A (en) * | 1992-02-04 | 1993-03-23 | Analog Devices, Inc. | Multiple sequential excitation temperature sensing method and apparatus |
GB2292221A (en) | 1994-08-09 | 1996-02-14 | Texas Instruments Ltd | Hottest temperature sensor |
US5686858A (en) * | 1994-08-31 | 1997-11-11 | Sgs-Thomson Microelectronics S.A. | Temperature detector on an integrated circuit |
US6019058A (en) * | 1997-06-19 | 2000-02-01 | Fmc Corporation | Looped mooring line and method of installation |
US5982221A (en) * | 1997-08-13 | 1999-11-09 | Analog Devices, Inc. | Switched current temperature sensor circuit with compounded ΔVBE |
Non-Patent Citations (2)
Title |
---|
Coughlin R F et al: "A System Approach to Linear Sensor Circuit Design" Electronic Engineering, vol. 65, No. 797, May. 1, 1993, p. 38 XP000362497; ISSN: 0013-4902. |
Freire R C S F et al: "A Highley Linear Single P-N Junction Temperature Sensor" IEEE Transactions on Instrumentation and Measurement, vol. 43, No. 2, Apr. 1, 1994, pp. 127-131, XP000438867; ISSN: 0018-9456. |
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7228508B1 (en) | 1993-09-21 | 2007-06-05 | Intel Corporation | Fail-safe thermal sensor apparatus and method |
US6630754B1 (en) * | 1993-09-21 | 2003-10-07 | Intel Corporation | Temperature-based cooling device controller apparatus and method |
US20030212474A1 (en) * | 1993-09-21 | 2003-11-13 | Intel Corporation | Method and apparatus for programmable thermal sensor for an integrated circuit |
US7587262B1 (en) | 1993-09-21 | 2009-09-08 | Intel Corporation | Temperature averaging thermal sensor apparatus and method |
US6975047B2 (en) | 1993-09-21 | 2005-12-13 | Intel Corporation | Temperature-based cooling device controller apparatus and method |
US7216064B1 (en) | 1993-09-21 | 2007-05-08 | Intel Corporation | Method and apparatus for programmable thermal sensor for an integrated circuit |
US7761274B1 (en) | 1993-09-21 | 2010-07-20 | Intel Corporation | Temperature-based clock frequency controller apparatus and method |
US6733174B2 (en) * | 2000-08-04 | 2004-05-11 | Nippon Precision Circuits Inc. | Semiconductor temperature detecting method and its circuit |
US20020014675A1 (en) * | 2000-08-04 | 2002-02-07 | Toru Matsumoto | Semiconductor temperature detecting method and its circuit |
US20040145021A1 (en) * | 2001-06-08 | 2004-07-29 | Rohm Co., Ltd. | Semiconductor integrated circuit device |
US7009830B2 (en) * | 2001-06-08 | 2006-03-07 | Rohm Co., Ltd. | Semiconductor integrated circuit device |
US9222843B2 (en) * | 2003-04-10 | 2015-12-29 | Ic Kinetics Inc. | System for on-chip temperature measurement in integrated circuits |
US20120013364A1 (en) * | 2003-04-10 | 2012-01-19 | Schnaitter William N | System for on-chip temperature measurement in integrated circuits |
EP1843139A2 (en) | 2003-06-06 | 2007-10-10 | Microchip Technology Incorporated | Ultra-low power programmable timer and low voltage detection circuits |
EP1843139A3 (en) * | 2003-06-06 | 2007-11-07 | Microchip Technology Incorporated | Ultra-low power programmable timer and low voltage detection circuits |
US20080025371A1 (en) * | 2004-04-14 | 2008-01-31 | International Business Machines Corperation | On chip temperature measuring and monitoring circuit and method |
US7645071B2 (en) | 2004-04-14 | 2010-01-12 | International Business Machines Corporation | On chip temperature measuring and monitoring method |
US20070206656A1 (en) * | 2004-04-14 | 2007-09-06 | International Business Machines Corperation | On chip temperature measuring and monitoring circuit and method |
US20080186035A1 (en) * | 2004-04-14 | 2008-08-07 | International Business Machines Corperation | On chip temperature measuring and monitoring method |
US20080187024A1 (en) * | 2004-04-14 | 2008-08-07 | International Business Machines Corperation | On chip temperature measuring and monitoring method |
US7452128B2 (en) | 2004-04-14 | 2008-11-18 | International Business Machines Corporation | On chip temperature measuring and monitoring circuit and method |
US20080291970A1 (en) * | 2004-04-14 | 2008-11-27 | International Business Machines Corperation | On chip temperature measuring and monitoring circuit and method |
US7780347B2 (en) | 2004-04-14 | 2010-08-24 | International Business Machines Corporation | On chip temperature measuring and monitoring circuit and method |
US7762721B2 (en) | 2004-04-14 | 2010-07-27 | International Business Machines Corporation | On chip temperature measuring and monitoring method |
US7255476B2 (en) * | 2004-04-14 | 2007-08-14 | International Business Machines Corporation | On chip temperature measuring and monitoring circuit and method |
US20050232333A1 (en) * | 2004-04-14 | 2005-10-20 | Franch Robert L | On chip temperature measuring and monitoring circuit and method |
US20080061863A1 (en) * | 2006-07-31 | 2008-03-13 | Freescale Semiconductor, Inc. | Temperature sensor device and methods thereof |
US7579898B2 (en) * | 2006-07-31 | 2009-08-25 | Freescale Semiconductor, Inc. | Temperature sensor device and methods thereof |
US20080123238A1 (en) * | 2006-08-30 | 2008-05-29 | Freescale Semiconductor, Inc. | Multiple sensor thermal management for electronic devices |
US7531998B2 (en) | 2006-09-11 | 2009-05-12 | Samsung Electronics Co., Ltd. | Temperature sensing circuit |
US20080061761A1 (en) * | 2006-09-11 | 2008-03-13 | Samsung Electronics Co., Ltd. | Temperature sensing circuit |
EP2028465A1 (en) * | 2007-08-20 | 2009-02-25 | Winbond Electronics Corporation | Transistor circuit with estimating parameter error and temperature sensing apparatus using the same |
US20100109752A1 (en) * | 2007-11-08 | 2010-05-06 | Rohm Co., Ltd | Semiconductor Device, and Power Source and Processor Provided with the Same |
US7965128B2 (en) * | 2007-11-08 | 2011-06-21 | Rohm Co., Ltd. | Semiconductor device, and power source and processor provided with the same |
Also Published As
Publication number | Publication date |
---|---|
SG86389A1 (en) | 2002-02-19 |
TW446812B (en) | 2001-07-21 |
KR20000071745A (en) | 2000-11-25 |
CA2305885A1 (en) | 2000-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR0147368B1 (en) | Temperature threshold sensing circuit | |
US4450367A (en) | Delta VBE bias current reference circuit | |
US7170336B2 (en) | Low voltage bandgap reference (BGR) circuit | |
US6052020A (en) | Low supply voltage sub-bandgap reference | |
US6075407A (en) | Low power digital CMOS compatible bandgap reference | |
US7948304B2 (en) | Constant-voltage generating circuit and regulator circuit | |
US4714872A (en) | Voltage reference for transistor constant-current source | |
KR101829416B1 (en) | Compensated bandgap | |
US6225851B1 (en) | Temperature level detection circuit | |
US20040062292A1 (en) | Temperature sensing apparatus and methods | |
EP0369530A2 (en) | Temperature sensing circuit | |
CA1093164A (en) | Biasing and scaling circuit for transducers | |
US6377429B1 (en) | Protective circuit for battery | |
US6507238B1 (en) | Temperature-dependent reference generator | |
USRE37778E1 (en) | Current limiting circuit | |
JP4662603B2 (en) | Temperature level detection circuit | |
US4424457A (en) | Voltage level detecting circuit | |
CN212007570U (en) | Temperature sensor and integrated circuit | |
US4249123A (en) | Temperature compensated reference voltage regulator | |
JPH03242715A (en) | Band gap reference voltage generating circuit | |
US4396889A (en) | Nonadjusting battery life detector | |
JP2000065872A (en) | Voltage detection circuit | |
RU2115099C1 (en) | Source of electric signal proportional to absolute temperature | |
JP2810933B2 (en) | IC temperature detector | |
GB2111223A (en) | Voltage level detecting circuit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: EM MICROELECTRONIC - MARIN SA, SWITZERLAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DESCOMBES, ARTHUR;REEL/FRAME:010726/0457 Effective date: 20000328 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
CC | Certificate of correction | ||
REMI | Maintenance fee reminder mailed | ||
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
SULP | Surcharge for late payment | ||
FPAY | Fee payment |
Year of fee payment: 8 |
|
FPAY | Fee payment |
Year of fee payment: 12 |