US5473247A - Apparatus for discriminating defects in top and bottom surfaces of objects - Google Patents

Apparatus for discriminating defects in top and bottom surfaces of objects Download PDF

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Publication number
US5473247A
US5473247A US08/043,181 US4318193A US5473247A US 5473247 A US5473247 A US 5473247A US 4318193 A US4318193 A US 4318193A US 5473247 A US5473247 A US 5473247A
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United States
Prior art keywords
platform
magnetic flux
location
plate
coil
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Expired - Lifetime
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US08/043,181
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English (en)
Inventor
Zhongging You
Robert A. Brooks
Richard Colman
Paul J. Bebick
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Magnetic Analysis Corp
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Magnetic Analysis Corp
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Application filed by Magnetic Analysis Corp filed Critical Magnetic Analysis Corp
Priority to US08/043,181 priority Critical patent/US5473247A/en
Assigned to MAGNETIC ANALYSIS CORPORATION reassignment MAGNETIC ANALYSIS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: BEBICK, PAUL J., BROOKS, ROBERT B., COLMAN, RICHARD, YOU, ZHONGQING
Priority to EP94103610A priority patent/EP0619487A3/fr
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Publication of US5473247A publication Critical patent/US5473247A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
    • G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
    • G01N27/9013—Arrangements for scanning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws

Definitions

  • the probe apparatus further includes first sensor means for receiving the generator means signal for inducing eddy currents in the specimen and thereby inducing eddy currents therein and for sensing eddy currents in the specimen and second sensor means for sensing flux leakage from the specimen, the first and second sensor means being fixedly supported by the probe apparatus platform to rotate therewith.
  • the first sensor means includes first and second coils differentially connected to one another and the second sensor means includes at least one coil.
  • the probe apparatus further includes a core member having end courses extending into proximity with the specimen and an intermediate course disposed interiorly of the second sensor means coil.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
US08/043,181 1993-04-06 1993-04-06 Apparatus for discriminating defects in top and bottom surfaces of objects Expired - Lifetime US5473247A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US08/043,181 US5473247A (en) 1993-04-06 1993-04-06 Apparatus for discriminating defects in top and bottom surfaces of objects
EP94103610A EP0619487A3 (fr) 1993-04-06 1994-03-09 Système et procédé de contÔle non-déstructif des plaques.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/043,181 US5473247A (en) 1993-04-06 1993-04-06 Apparatus for discriminating defects in top and bottom surfaces of objects

Publications (1)

Publication Number Publication Date
US5473247A true US5473247A (en) 1995-12-05

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ID=21925898

Family Applications (1)

Application Number Title Priority Date Filing Date
US08/043,181 Expired - Lifetime US5473247A (en) 1993-04-06 1993-04-06 Apparatus for discriminating defects in top and bottom surfaces of objects

Country Status (2)

Country Link
US (1) US5473247A (fr)
EP (1) EP0619487A3 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172501B1 (en) 1996-06-28 2001-01-09 Tokyo Rope Mfg. Co., Ltd. Method and apparatus for measuring the degree of cable corrosion
US20040002171A1 (en) * 2002-06-28 2004-01-01 Lam Research Corporation Method and apparatus for real time metal film thickness measurement
US20040011462A1 (en) * 2002-06-28 2004-01-22 Lam Research Corporation Method and apparatus for applying differential removal rates to a surface of a substrate
US20040058545A1 (en) * 2002-09-25 2004-03-25 Lam Research Corporation Enhancement of eddy current based measurement capabilities
US6741074B2 (en) 2002-03-01 2004-05-25 General Electric Company Method and apparatus for separating electrical runout from mechanical runout
US20040119469A1 (en) * 2002-12-23 2004-06-24 Lam Corporation System, method and apparatus for thin-film substrate signal separation using eddy current
US20040206455A1 (en) * 2002-06-28 2004-10-21 Lam Research Corporation Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties
US6808590B1 (en) 2002-06-28 2004-10-26 Lam Research Corporation Method and apparatus of arrayed sensors for metrological control
US20050066739A1 (en) * 2003-09-26 2005-03-31 Lam Research Corporation Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring
US20050072528A1 (en) * 2002-06-28 2005-04-07 Lam Research Corporation Integration of sensor based metrology into semiconductor processing tools
US20050093536A1 (en) * 2002-10-15 2005-05-05 General Electric Company Manual probe carriage system and method of using the same
US20140002069A1 (en) * 2012-06-27 2014-01-02 Kenneth Stoddard Eddy current probe

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6198280B1 (en) * 1998-04-27 2001-03-06 Siemens Westinghouse Power Corporation Eddy current flexible field probe deployed through a loading platform
WO2003029805A1 (fr) * 2001-09-28 2003-04-10 Em-Tech Llc Effet lenticulaire magnetique
CN110108788B (zh) * 2019-05-15 2023-04-07 上海市特种设备监督检验技术研究院 基于脉冲涡流的管道漏磁内检测集成探头及检测方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3343079A (en) * 1963-07-01 1967-09-19 American Mach & Foundry Apparatus and method for electromagnetically distinguishing between outside and inside flaws in magnetizable members utilizing a leakage field detector
US3538433A (en) * 1968-07-15 1970-11-03 American Mach & Foundry Apparatus for discriminating between inside and outside defects using a combined leakage field and eddy current test system
US3940689A (en) * 1974-05-14 1976-02-24 Schlumberger Technology Corporation Combined eddy current and leakage field detector for well bore piping using a unique magnetizer core structure
US4445088A (en) * 1980-05-10 1984-04-24 Institut Dr. Friedrich Forster Prufgeratebau Method and arrangement for evaluating a defect signal by comparing the ratio of maximum signal rise and maximum signal magnitude to a predetermined value
US4602212A (en) * 1982-06-14 1986-07-22 Sumitomo Metal Industries, Ltd. Method and apparatus including a flux leakage and eddy current sensor for detecting surface flaws in metal products
US4751460A (en) * 1986-06-02 1988-06-14 Western Atlas International, Inc. Method and apparatus for nondestructive inspection of magnetic piping
US4878180A (en) * 1985-11-18 1989-10-31 Western Atlas International, Inc. Method of evaluating the condition of tubular goods
US4992735A (en) * 1989-08-01 1991-02-12 Westinghouse Electric Corp. System and method for inspecting metallic plugs in heat exchanger tubes using a radially extendible probe

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61213667A (ja) * 1985-03-20 1986-09-22 Mitsubishi Heavy Ind Ltd 磁気探傷装置
JP2681673B2 (ja) * 1988-11-30 1997-11-26 原電子測器株式会社 平面探傷用交流漏洩磁束探傷装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3343079A (en) * 1963-07-01 1967-09-19 American Mach & Foundry Apparatus and method for electromagnetically distinguishing between outside and inside flaws in magnetizable members utilizing a leakage field detector
US3538433A (en) * 1968-07-15 1970-11-03 American Mach & Foundry Apparatus for discriminating between inside and outside defects using a combined leakage field and eddy current test system
US3940689A (en) * 1974-05-14 1976-02-24 Schlumberger Technology Corporation Combined eddy current and leakage field detector for well bore piping using a unique magnetizer core structure
US4445088A (en) * 1980-05-10 1984-04-24 Institut Dr. Friedrich Forster Prufgeratebau Method and arrangement for evaluating a defect signal by comparing the ratio of maximum signal rise and maximum signal magnitude to a predetermined value
US4602212A (en) * 1982-06-14 1986-07-22 Sumitomo Metal Industries, Ltd. Method and apparatus including a flux leakage and eddy current sensor for detecting surface flaws in metal products
US4878180A (en) * 1985-11-18 1989-10-31 Western Atlas International, Inc. Method of evaluating the condition of tubular goods
US4751460A (en) * 1986-06-02 1988-06-14 Western Atlas International, Inc. Method and apparatus for nondestructive inspection of magnetic piping
US4992735A (en) * 1989-08-01 1991-02-12 Westinghouse Electric Corp. System and method for inspecting metallic plugs in heat exchanger tubes using a radially extendible probe

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172501B1 (en) 1996-06-28 2001-01-09 Tokyo Rope Mfg. Co., Ltd. Method and apparatus for measuring the degree of cable corrosion
US6741074B2 (en) 2002-03-01 2004-05-25 General Electric Company Method and apparatus for separating electrical runout from mechanical runout
US20050072528A1 (en) * 2002-06-28 2005-04-07 Lam Research Corporation Integration of sensor based metrology into semiconductor processing tools
US20040002171A1 (en) * 2002-06-28 2004-01-01 Lam Research Corporation Method and apparatus for real time metal film thickness measurement
US20040011462A1 (en) * 2002-06-28 2004-01-22 Lam Research Corporation Method and apparatus for applying differential removal rates to a surface of a substrate
US7309618B2 (en) 2002-06-28 2007-12-18 Lam Research Corporation Method and apparatus for real time metal film thickness measurement
US7205166B2 (en) 2002-06-28 2007-04-17 Lam Research Corporation Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties
US7128803B2 (en) 2002-06-28 2006-10-31 Lam Research Corporation Integration of sensor based metrology into semiconductor processing tools
US20040206455A1 (en) * 2002-06-28 2004-10-21 Lam Research Corporation Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties
US6808590B1 (en) 2002-06-28 2004-10-26 Lam Research Corporation Method and apparatus of arrayed sensors for metrological control
US20050000653A1 (en) * 2002-06-28 2005-01-06 Lam Research Corporation Method and apparatus of arrayed sensors for metrological control
US6951624B2 (en) * 2002-06-28 2005-10-04 Lam Research Corporation Method and apparatus of arrayed sensors for metrological control
US7084621B2 (en) 2002-09-25 2006-08-01 Lam Research Corporation Enhancement of eddy current based measurement capabilities
US20040058545A1 (en) * 2002-09-25 2004-03-25 Lam Research Corporation Enhancement of eddy current based measurement capabilities
US20050093536A1 (en) * 2002-10-15 2005-05-05 General Electric Company Manual probe carriage system and method of using the same
US7208971B2 (en) * 2002-10-15 2007-04-24 General Electric Company Manual probe carriage system and method of using the same
US6788050B2 (en) * 2002-12-23 2004-09-07 Lam Research Corp. System, method and apparatus for thin-film substrate signal separation using eddy current
WO2004059313A1 (fr) * 2002-12-23 2004-07-15 Lam Research Corporation Systeme, procede et dispositif pour la separation de signal en substrat a film mince reposant sur l'utilisation de courants de foucault
US20040119469A1 (en) * 2002-12-23 2004-06-24 Lam Corporation System, method and apparatus for thin-film substrate signal separation using eddy current
CN102269566A (zh) * 2002-12-23 2011-12-07 兰姆研究有限公司 用于使用涡流的薄膜基板信号分离的系统、方法及设备
CN102269566B (zh) * 2002-12-23 2014-05-14 兰姆研究有限公司 用于使用涡流的薄膜基板信号分离的系统、方法及设备
US20050066739A1 (en) * 2003-09-26 2005-03-31 Lam Research Corporation Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring
US20140002069A1 (en) * 2012-06-27 2014-01-02 Kenneth Stoddard Eddy current probe

Also Published As

Publication number Publication date
EP0619487A2 (fr) 1994-10-12
EP0619487A3 (fr) 1996-07-17

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