US4966787A - Method of creating isolated plates on the inside surface of a metallized substrate - Google Patents
Method of creating isolated plates on the inside surface of a metallized substrate Download PDFInfo
- Publication number
- US4966787A US4966787A US07/367,919 US36791989A US4966787A US 4966787 A US4966787 A US 4966787A US 36791989 A US36791989 A US 36791989A US 4966787 A US4966787 A US 4966787A
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- US
- United States
- Prior art keywords
- tube
- coating
- areas
- tabs
- scribe tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J3/00—Details of electron-optical or ion-optical arrangements or of ion traps common to two or more basic types of discharge tubes or lamps
- H01J3/26—Arrangements for deflecting ray or beam
- H01J3/28—Arrangements for deflecting ray or beam along one straight line or along two perpendicular straight lines
- H01J3/30—Arrangements for deflecting ray or beam along one straight line or along two perpendicular straight lines by electric fields only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
Definitions
- This invention relates, in general, to a method of forming electrically isolated areas on a metallized substrate and is particularly directed to a method of making an electrostatic deflector for use in controlling an electron beam in an electron beam lithography machine.
- an electron beam lithography machine there is a beam column with a centrally located electron beam which is controlled to perform a writing operation on a substrate, such as a wafer or mask, located below the beam column.
- the electron beam is within a central tube which has a section, called a minor field deflector, with electrostatic plates which deflect the beam +/-32 microns at a very high speed by electrostatics as part of the writing operation.
- the electrostatic plates In order to achieve this high speed, the electrostatic plates must have a very low capacitance and must be such that the electron beam is not adversely affected by exposed substrate.
- One such deflector is actually a glass tube approximately 6.3 inches long and about 0.6 inches ID and 0.75 inches OD.
- the tube is coated on the insides and the outsides with a thin film of gold approximately 10 to 20 microinches (0.25 to 0.50 microns) in thickness.
- the inside surface of this tube is divided into eight areas that are equally spaced, equal in area, and electrically isolated from one another to form electrostatic metal plates.
- each of these eight plates is electrically connected in pairs of opposite plates to a voltage source to create an electrostatic field to control the electron beam.
- Opposing plates have the same voltage value but of opposite polarity.
- the deposited thin metal film on the inner surface of the substrate (glass) is divided into areas (plates) by scribing lines of a specific width and depth on the inner surface of the tube.
- the preo-coated glass tube was mounted in a holder and a reciprocating boring bar with a diamond scribe tip was inserted into the inner bore of the tube and withdrawn along a major portion of the length of the tube, while in engagement with the coating, to scribe lines which separated the coating into separate areas.
- the scribe tip was held against the inner wall by the bias of a spring during the scribing step, and after each scribing step, the tube was rotated and the drawing step repeated to form the eight separate plates.
- the method of this invention for forming an electrostatic deflector for use in an electron beam machine comprises the use of a reciprocating rigid boring bar with a diamond scribe tip and a rigid holder for a coated deflector tube.
- the scribe tip is positioned within the bore of the tube and the boring bar is stroked in a direction parallel to the tube axis, while in engagement with the inner surface coating, to scribe very narrow lines on the thin film. These lines are formed along a major portion of the length of the tube and of a width less than 0.001 inch.
- the tip or tube surface are separated and then the tube (or the boring bar and the scribe tip as the case may be) is incrementally rotated to form a number of separate isolated areas which form electrostatic plates.
- Dial position indicators with digital readouts locate the scribe tip to within a few ten thousandths of an inch and optical and resistance means are used to determine the integrity of each scribed line.
- FIG. 1 is a schematic illustration of an electron beam lithography machine incorporating the electrostatic field deflector of this invention
- FIG. 2 is a schematic illustration of the electrostatic field deflector apart from the electron beam lithography machine simply to illustrate the deflection of the electron beam by the deflector of this invention
- FIG. 3 is a partial view of the inside of the deflector tube as if the tube were cut and flattened out to illustrate more clearly the electrostatic plates
- FIG. 4 is a perspective view of the top of the deflector tube to illustrate the electrical connections to charge the electrostatic plates
- FIG. 5 is a schematic illustration of the tool including a reciprocating boring bar and diamond scribe tip as it moved relative to the deflector.
- FIG. 6 is a schematic illustration of a cross section of the deflector tube with the scribe tip relative to the inner wall of the tube
- FIG. 7 is an enlarged schematic illustration of the scribe tip engaging the deflector tube and a finally scribed line.
- the electron beam lithography machine incorporating this invention is identified in its entirety as 10.
- the machine includes an electron beam column 12 and a workholding apparatus 14 upon which a workpiece 16 is loaded, processed and unloaded.
- the workpiece 16 is a semiconductor wafer or mask and is referred to as a substrate or simply a wafer.
- an electron beam source 20 demagnification, projection and deflection optics which generate a finely focused beam 22.
- the optics may also include illumination and shaping objects when a shaped beam is used.
- a central tube 24 (a part of which is shown in phantom) is within the column 12, is traversed by the beam 22 and maintained at a high vacuum by a high vacuum pump 26 coupled to the column 12.
- the beam 22 passes through an aperture 28 in the column and impinges on the workpiece 16 for processing the latter.
- the complete lithography machine further includes a computer (controller) and associated binary electronics which controls the beam 22, controls a drive system for driving the workholding apparatus 14, stores pattern data and provides beam control signals; all identified by block diagrams 30 and 32.
- the workholding apparatus 14 includes a stage 34 which is driven in the x-y direction and in the z direction by conventional drives and its position sensed by a sensing system; all identified by block diagram 36.
- the central tube 24 will include the electrostatic field deflector 50 of this invention to deflect the beam electrostatically as demonstrated schematically in FIG. 2.
- This deflector 50 comprises a tube of glass 52, or other suitable insulating material, with a plurality of separated areas forming electrostatic plates 54, as shown in FIG. 3. These plates 54 are electrically isolated so as to function as electrostatic deflection plates to deflect beam 22 in response to the voltage applied to each of the plates in opposite pairs.
- the glass tube 52 is coated on both its inner sidewall 56 and outer sidewall 58 with a suitable thin metallic film 60, such as gold, (shown stippled) except for one end which is masked during coating to provide tabs 62.
- the coating is gold approximately 10 to 20 microinches in thickness and, as illustrated in FIG. 4, there are eight such tabs connected to eight electrostatic plates.
- These tabs 62 are formed of the coated material and spaced circumferentially around the inner and outer walls 56 and 58 of the tube 50 so as to have areas 62a of insulating material therebetween on both the inner and outer walls of the tube.
- These tabs 62 are part of the coated material 60 on the inner sidewall 56 by having the coating extend over the end of the tube as shown at 62b.
- These tabs 62 are connected by conductors 64 to apply an electronic charge to each of the metal plates but in diametrically opposite pairs for the purpose of controlling the electron beam 22.
- the isolated plates 54 extend lengthwise of a substantial portion of the tube and terminate at a ring 68, as shown in FIG. 3, which separates the plates from the ground plane 70.
- Ground plane 70 is of the same coated material 60.
- the ground plane 70 is connected to the coating 60 on the outside of the tube by having the coating extend over the end of the tube.
- each of the plates be isolated from one another and from the ground plane 70 yet separated only enough that the electron beam is not exposed to the glass insulating material between each of the plates. This requires a precise fabrication of the longitudinal lines separating the isolated plates and how this is accomplished will now be described in detail.
- the electrostatic deflector tube 50 (also called a deflector tube) is mounted in a tool 80 which may be a lathe, a milling machine, or other suitable machine tool.
- the selected tool in this instance is a milling machine with a tube holder (divider head) 82 fastened in a mill bed 84, a collet 86 within the holder 82 to firmly hold the deflector tube 50, and a rigid boring bar 88 with a diamond scribe tip 90 held within a bar holder (mill arbor) 92.
- the boring bar 88 with the scribe tip 90 is moved into the bore of the deflector tube 50 and positioned by suitable instruments represented by block diagram 94 and the tube is rotated while the scribe tip 90 is in engagement with the coating to form the space 68 separating the ground plane 70 from the ends of the electrostatic plates 54. Aftr the space 68 is formed, the scribe tip 90 is positioned over the space 68 where the scribe tip 90 is then moved into engagement with the coating 60 on the inside of the tube and withdrawn axially, scribing a longitudinal line 66 to provide the spacing between the plates.
- the position of the scribe tip 90 is known within +/-0.0002 in.
- the position of the inner coated surface is known within +/-0.0002 in.
- the scribe tip 90 is first advanced to the coating 60 and then advanced approximately 0.0015 in. more.
- a line less than 0.001 in. wide is scribed.
- the longitudinal scribing step is repeated so as to form the isolated electrostatic plates 54. This, of course, assumes the selection of a tube whose concentricity is within +/-0.0005 in and which is straight along the length of the tube to within +/-0.0005 in.
- Firts cut one line 66 approximately centered between the tabs 62 to extend from the space 68 to the tabbed end and inspect this cut by optics. Cut a second line 66 of the same length 360/n degrees from the first vertical line to form n plates and before rotating the tube, perform a resistance test across both lines 66. If the inspection shows a defective cut, the cutting step is repeated. This can be done since the positions of the tube and the tip are known. Compensation can also be made for tip wear, and
- the preferred scribing operation is to hold the tube 50 fixed while the scribe tip 90 is moved to cut the lines 66.
- steps 1, 2 and 3 describe the cutting of the lines 66 after the space 68 has been cut, the cutting of the space 68 first is not necessary.
- the lines 66 may be cut according to the steps 2, 3 and 4 and then the step of cutting space 68 may be performed. However, all integrity tests such as performed in each of the steps 2, 3 and 4 could not be performed until all cuttings have been performed.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Beam Exposure (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/367,919 US4966787A (en) | 1989-06-19 | 1989-06-19 | Method of creating isolated plates on the inside surface of a metallized substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/367,919 US4966787A (en) | 1989-06-19 | 1989-06-19 | Method of creating isolated plates on the inside surface of a metallized substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US4966787A true US4966787A (en) | 1990-10-30 |
Family
ID=23449156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/367,919 Expired - Fee Related US4966787A (en) | 1989-06-19 | 1989-06-19 | Method of creating isolated plates on the inside surface of a metallized substrate |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US4966787A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5464581A (en) * | 1993-08-02 | 1995-11-07 | The Regents Of The University Of California | Flow cytometer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4390789A (en) * | 1981-05-21 | 1983-06-28 | Control Data Corporation | Electron beam array lithography system employing multiple parallel array optics channels and method of operation |
-
1989
- 1989-06-19 US US07/367,919 patent/US4966787A/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4390789A (en) * | 1981-05-21 | 1983-06-28 | Control Data Corporation | Electron beam array lithography system employing multiple parallel array optics channels and method of operation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5464581A (en) * | 1993-08-02 | 1995-11-07 | The Regents Of The University Of California | Flow cytometer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: PERKIN-ELMER CORPORATION, THE, 761 MAIN AVE., NORW Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:YOUNG, LYDIA J.;REEL/FRAME:005113/0383 Effective date: 19890602 |
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| AS | Assignment |
Owner name: MNC CREDIT CORP., 502 WASHINGTON AVE., STE. 700, T Free format text: SECURITY INTEREST;ASSIGNOR:ETEC, A CORP. OF NV;REEL/FRAME:005262/0967 Effective date: 19900223 |
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| AS | Assignment |
Owner name: ETEC, A CORP. OF NV, NEVADA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:PERKIN-ELMER CORPORATION, THE;REEL/FRAME:005366/0501 Effective date: 19900315 |
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| AS | Assignment |
Owner name: ETEC SYSTEMS, INC., A CORP. OF NV Free format text: CHANGE OF NAME;ASSIGNOR:ETEC, A CORP. OF NV;REEL/FRAME:005475/0559 Effective date: 19900814 |
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| FEPP | Fee payment procedure |
Free format text: PAT HOLDER CLAIMS SMALL ENTITY STATUS - SMALL BUSINESS (ORIGINAL EVENT CODE: SM02); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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| AS | Assignment |
Owner name: CONNECTICUT NATIONAL BANK, THE Free format text: SECURITY INTEREST;ASSIGNOR:ETEC SYSTEMS, INC.;REEL/FRAME:005949/0850 Effective date: 19911115 |
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| AS | Assignment |
Owner name: ETEC, A CORP. OF NEVADA, CALIFORNIA Free format text: RELEASED BY SECURED PARTY;ASSIGNOR:MNC CREDIT CORP., A MD CORP.;REEL/FRAME:006014/0078 Effective date: 19911220 |
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Year of fee payment: 4 |
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Year of fee payment: 8 |
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| AS | Assignment |
Owner name: APPLIED MATERIALS, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ETEC SYSTEMS, INC.;REEL/FRAME:011934/0895 Effective date: 20010615 |
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| AS | Assignment |
Owner name: ETEC SYSTEMS, INC., CALIFORNIA Free format text: SECURITY INTEREST;ASSIGNOR:FLEET NATIONAL BANK SUCCESSOR-IN-INTEREST TO THE CONNECTICUT NATIONAL BANK;REEL/FRAME:012350/0755 Effective date: 20011030 |
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| REMI | Maintenance fee reminder mailed | ||
| LAPS | Lapse for failure to pay maintenance fees | ||
| STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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| FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20021030 |