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Moldable/foldable radio housing

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Publication number
US4939792A
US4939792A US07121323 US12132387A US4939792A US 4939792 A US4939792 A US 4939792A US 07121323 US07121323 US 07121323 US 12132387 A US12132387 A US 12132387A US 4939792 A US4939792 A US 4939792A
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US
Grant status
Grant
Patent type
Prior art keywords
housing
circuit
printed
battery
surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US07121323
Inventor
Glenn F. Urbish
John M. McKee
Martin J. McKinley
Anthony B. Suppelsa
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Motorola Solutions Inc
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Motorola Solutions Inc
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Filing date
Publication date
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/06Receivers
    • H04B1/08Constructional details, e.g. cabinet
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/0278Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/119Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0191Dielectric layers wherein the thickness of the dielectric plays an important role
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/042Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09045Locally raised area or protrusion of insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/0999Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10037Printed or non-printed battery
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10053Switch
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display
    • H05K2201/10136Liquid Crystal display [LCD]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Abstract

A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing. A switch (136) and battery contact (152) are integrally formed with the housing and an integrally molded structural support means strenghthens the housing members. The housing is manufactured "opened up" and, at the final assembly stage, the cover member is rotated about the hinge until it contacts the upper surface of the peripheral wall (108B). Snap-fit connectors (e.g., 110) join the cover to the base.

Description

BACKGROUND OF THE INVENTION

This invention pertains to housings for electronic devices, and more particularly, to a molded housing for a radio receiver that includes printed circuit patterns directly disposed on the surface of the housing.

The typical prior art housing for an electronic device comprises a multiplicity of parts. These parts may be manufactured at different locations by different manufacturers using a variety of processes and materials. These parts are then shipped to a point of final assembly, assembled, tested and shipped to their next destination.

There are several disadvantages to the prior art housing. First, the large number of individual parts, and the variety of manufacturing processes and materials necessary to manufacture these parts elevates manufacturing costs. Since the parts must be assembled, and the assembly process is usually labor or machine intensive, final assembly represents a significant percentage of total manufacturing costs. The large number of individual parts also creates reliability, quality control and inventory problems.

Accordingly, it would be advantageous of a housing could be developed that reduced the total number of individual parts and processes necessary for its manufacture. The housing described below accomplishes this objective.

SUMMARY of the INVENTION

Briefly, the invention is a moldable and foldable housing for an electronic device. The housing includes first and second housing members joined by a hinge. The housing members and the hinge are integrally molded. A solderable printed circuit pattern is disposed directly on a surface of the first housing member.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of the preferred moldable/foldable radio housing. The housing is illustrated "opened up" wherein the cover has been rotated 180 degrees about the connecting hinge, such that the interior surface of the housing cover faces up in the figure.

FIG. 2 is a cross-sectional view illustrating the integral switch, as seen along line 2--2 of FIG. 1.

FIG. 3 is a cross-sectional view illustrating the battery contact, as seen along line 3--3 of FIG. 1.

FIG. 4 is a partial perspective view of the housing base illustrating an optional integrally molded structural reinforcing means. The exterior surface of the housing base faces "up" in the figure.

FIG. 5 is a partial perspective view of the housing base illustrating an optional integrally molded reinforcing bar structure.

DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIG. 1, a moldable/foldable housing 100 includes a base member 102, a cover member 104, and a living hinge 106 joining the base and cover members. Base member 102 has opposing interior and exterior surfaces 102A and B and, similarly, cover member 104 has opposing interior and exterior surfaces 104A and B (the interior surfaces face "up" in FIG. 1 and only the edges of exterior surfaces 102B and 104B are visible in the figure). Base member 102 includes a peripheral wall 108 which extends around the perimeter of the base. Peripheral wall 108 has interior, upper and exterior surfaces 108A-C, respectively. The exterior surface 108D of the peripheral wall adjacent hinge 106, and the interior surfaces 108A are sloped at an angle relative to interior surface 102A, preferably 70 degrees. These sloping surfaces 108A and D facilitate the depositing of the printed circuit patterns described below.

Housing 100 is illustrated unassembled in FIG. 1. To complete the assembly, cover 104 is rotated about hinge 106 until the interior surface 104A of the cover contacts the upper surface 108B of the peripheral wall. Snap-fit connectors, e.g. 110, are preferably integrally molded with housing 100 and provide a means for fastening cover 104 to base 102. For certain applications, for example, when housing 100 is extremely thin, it may be preferable to eliminate the snap-fit connectors and ultrasonically weld cover 104 to upper surface 108B. Other well known shapes of snap-fit connectors may also be suitable and other fastening means, for example, screws, could also be used to fasten cover 104 to base 102.

Housing 100 is preferably injection molded from a thermoplastic material, preferably polyetherimide (PEI). Other thermoplastic materials may also be suitable, although high temperature thermoplastic materials are preferred because the housing is usually exposed to soldering temperatures. Examples of suitable high temperature thermoplastic materials include polysulfone, polyethersulfone, polyamideimide, polyarylsulfone, polyarylate, polyetheretherketone, polybutyleneterephthalate, and blended combinations thereof. It is preferred that all housing parts, including base 102, cover 104, hinge 106, peripheral wall 108, snap-fit connectors 110, and the switch 136 and battery contact 152 described below, be injection molded from the same mold (i.e., integrally molded). If there are no printed circuit patterns on cover 104, however, hinge 106 could be eliminated and the cover manufactured separately from the base. The manufacture of a living hinge is well known in the art of injection molded plastics.

Solderable printed circuit patterns 112 and 114 are respectively disposed directly on interior 102A and exterior 102B surfaces of the base, and similarly, solderable printed circuit patterns 116 and 118 are respectively disposed directly on the interior 104A and exterior 104B surfaces of the cover. Conductive through-holes interconnect opposing printed circuit patterns. For example, conductive through-hole 120 is electrically connected between printed circuit patterns 112 and 114, and through-hole 122 is electrically connected between printed circuit patterns 116 and 118. An interconnecting printed circuit pattern 124 is disposed directly on hinge 106 and is electrically connected between printed circuit patterns 112 and 116. A printed circuit loop antenna pattern is directly disposed on the exterior surface 104B of the cover. Conductive through-holes 128 and another interconnecting printed circuit pattern 130 disposed on hinge 106 provide a means to connect antenna 126 to printed circuit pattern 112. To protect the external printed circuit patterns 114 and 116, including antenna pattern 126, thin sheets of mylar or other insulative material 132 are adhesively bonded over the printed circuit patterns.

All printed circuit patterns are preferably vacuum deposited onto the various surfaces of housing 100, as described in a co-pending application entitled, "High Temperature Thermoplastic Substrate Having A Vacuum Deposited Solderable Electrical Circuit Pattern and Method of Manufacture" that was filed on the same date as the present application and which is wholly incorporated by a reference herein. Since housing 100 is three dimensional, the photolithographic definition of the printed circuit patterns is accomplished as described in another co-pending application entitled, "Photoimaged Three Dimensional Printed Circuit Substrate and Method of Manufacture" that was also filed on the same date as the present application and which is wholly incorporated by a reference herein. It is preferred that the printed circuit patterns be directly disposed (i.e., without any intervening structure between the printed circuit conductor and the housing, such as a layer of adhesive, or a conventional rigid or flexible printed circuit board) on the housing surfaces, and other methods of depositing printed circuit patterns directly onto a molded thermoplastic substrate, such as electroless plating, are also suitable. Electrical components, for example 134, are soldered directly to the interior printed circuit patterns 112 and 116.

Housing 100 also includes an integrally molded switch, which is illustrated in cross-section in FIG. 2 (in FIG. 2, housing 100 is illustrated fully assembled with cover 104 attached to base 102). Referring to FIGS. 1 and 2, switch 136 includes a thin, flexible wall 138 onto which a first printed circuit switch contact 140 is directly disposed. The diameter of flexible wall 138 is approximately 10 millimeters and the thickness of the wall is approximately 125 microns. Cover 104 includes an integrally molded pillar 142 on its interior surface onto which two printed circuit switch contacts 144 and 146 are directly disposed. To facilitate the photolithographic definition of printed circuit switch contacts 144 and 146, pillar 142 is partially conical in shape with sloping side walls that form an angle of approximately 70 degrees with the interior surface 104A of the cover. In operation, pressure is applied to the exterior surface of flexible wall 138 causing it to deflect towards pillar 142, whereupon switch contact 140 shorts contact 144 to contact 146.

A slideable battery compartment 148 includes an aperture 148A suitable for receiving a thin, disc shaped battery (the battery is not illustrated in FIG. 1). battery compartment 148 slides into housing 100C through an aperture 150 in peripheral wall 108, whereupon one of the battery's terminals contacts battery contact 152 on the interior of base member 102. Battery contact 152 is connected to printed circuit pattern 112. In the alternative, the battery can be mounted internally (i.e., without the benefit of slideable battery compartment 148) by retaining the battery within an arcuate wall 156, which completes slightly more than 180 degrees of a circle.

In FIG. 3, a detailed cross-sectional view of battery contact 152 is illustrated. Referring to this figure, battery contact 152 includes a thin flexible wall 302 with a protuberance 304 attached to the thin wall. Thin wall 302 and protuberance 304 are preferrably integrally molded with base member 102. A printed circuit battery contact 306 is directly disposed on the upper surface of protuberance 304 and is electrically connected to the printed circuit pattern 112 on the interior surface of the base. When a battery is installed in in housing 100 (either directly, or through the use of a battery compartment 148), printed circuit battery contact 306 is forcibly engaged with the battery terminal 308A on the battery, causing thin wall 302 to flex downward and apply pressure on terminal 308A. A similar battery contact 154 (see FIG. 1) is located on the interior of cover 104, but is not illustrated in FIG. 3. Battery contact 154 applys a force to a second battery terminal 308B, equal in magnitude but opposite in direction to the force exerted on battery terminal 308A by battery contact 152. Thin wall 302 and protuberance 304 are similar in design to wall 138 and pillar 142 of switch 136.

A liquid crystal display (LCD) 158 is positioned in an aperture 160 in the base. Electrical contacts, e.g. 158A, on the LCD are connected to contacts, e.g. 112A, by the use of a well known heat seal connector, such as those available from Nipon Graphite Industries. When housing 100 includes LCD 158, mylar sheet 132 requires a transparent window centered over the viewing surface of the LCD.

To strengthen base and cover members 102 and 104, an integrally molded structure 402, such as the one illustrated in FIG. 4, can be used on the external surface of the member (this precludes, however, the use of a printed circuit pattern on the exterior surface). In the alternative, a pattern of reinforcing rods 502, such as the one illustrated in FIG. 5, can be integrally molded into the base and cover members.

Other shapes of moldable/foldable housings, besides the one illustrated in FIG. 1, are also possible, and the invention can be practiced with more than two flexibly interconnected housing members (i.e., base 102 and cover 104). For example, hinged sides could be substituted for the rigid peripheral wall 108, and flat, printed circuit substrates (also integrally molded with the housing) could be flexibly attached to one of the housing members and folded into the housing cavity (the space between surfaces 102A and 104A) at final assembly, but after electronic components have been attached to these additional hinged substrates.

Claims (13)

We claim as our invention:
1. A moldable/foldable housing for an electronic device comprising in combination:
first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded;
a first solderable printed circuit pattern disposed directly on a first surface of said first housing member;
a second printed circuit pattern disposed on a second surface of said first housing member, said second surface opposing said first surface; and
a conductive through-hole connected between said first and second printed circuit patterns.
2. The moldable/foldable housing of claim 1, wherein said second surface of said first housing member includes an exterior surface of said housing, and said housing includes an insulating sheet disposed over said second printed circuit pattern.
3. A moldable/foldable housing for an electronic device comprising in combination:
first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded;
a first solderable printed circuit pattern disposed directly on a first surface of said first housing member; and
a switch, integrally formed with said housing, said switch including:
a thin, flexible wall integrally molded into said first housing member;
a first printed circuit switch contact disposed directly on a surface of said thin wall;
a second printed circuit switch contact disposed directly on said second housing member.
4. A moldable/foldable housing for an electronic device comprising in combination:
first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded;
a first solderable printed circuit pattern disposed directly on a first surface of said first housing member;
structural means, integrally molded with said housing, for strengthening said housing member, said structural means including reinforcing rods molded into said housing.
5. A moldable/foldable housing for an electronic device comprising in combination:
first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded;
a first solderable printed circuit pattern disposed directly on a first surface of said first housing member; and
a battery contact, said battery contact including:
a thin, flexible wall integrally molded in said first housing member;
a protuberance attached to said thin wall;
a printed circuit battery contact disposed on said protuberance;
said housing being constructed and arranged such that when a battery in installed in said housing, said printed circuit battery contact is forcibly engaged with a terminal on said battery, causing said thin wall to flex.
6. A moldable/foldable housing for an electronic device comprising in combination:
first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded from a thermoplastic material;
a first solderable printed circuit pattern vacuum deposited on a first surface of said first housing member;
a second solderable printed circuit pattern vacuum deposited on a second surface of said first housing member, said second surface opposing said first surface; and
a conductive through-hole connected between said first and second printed circuit patterns.
7. The moldable/foldable housing in claim 6, wherein said second surface of said first housing member includes an exterior surface of said housing, and said housing includes an insulating sheet disposed over said second printed circuit pattern.
8. A moldable/foldable housing for an electronic device comprising in combination:
first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded from a thermoplastic material;
a first solderable printed circuit pattern vacuum deposited on a first surface of said first housing member; and
a switch, integrally formed with said housing, said switch including;
a thin, flexible wall integrally molded into said first housing member;
a first printed circuit switch contact vacuum deposited on a surface of said thin wall; and
a second printed circuit switch contact vacuum deposited on said second housing member;
9. A moldable/foldable housing for an electronic device, comprising in combination:
first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded from a thermosplastic material;
a first solderable printed circuit pattern vacuum deposited on a first surface of said first housing member; and
structural means, integrally molded with said housing, for strengthening said housing member, the structural means including reinforcing rods molded into said housing.
10. A moldable/foldable housing for an electronic device comprising in combination:
first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded from a thermoplastic material;
a first solderable printed circuit pattern vacuum deposited on a first surface of said first housing member; and
a battery contact, said battery contact including:
a thin, flexible wall integrally molded in said first housing member;
a protuberance attached to said thin wall; and
a printed circuit battery contact vacuum deposited on said protuberance;
said housing being constructed and arranged such that when a battery is installed in said housing, said printed circuit battery contact is forcibly engaged with a mating contact on said battery, causing said thin wall to flex.
11. A moldable/foldable housing for an electronic device, comprisinq in combination:
first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded from a thermoplastic material;
first and second solderable printed circuit patterns vacuum deposited on opposing surfaces of said first housing member;
conductive through-holes connected between said first and second printed circuit patterns;
a third solderable printed circuit pattern vacuum deposited on a surface of said second housing member;
an interconnecting printed circuit pattern vacuum deposited on said hinge and connected between said first and third printed circuit patterns.
12. The moldable/foldable housing of claim 11, further comprising a switch, said switch including:
a thin, flexible wall integrally molded into said first housing member;
a first printed circuit switch contact vacuum deposited on a surface of said flexible wall; and
a second printed circuit switch contact vacuum deposited on said second housing member.
13. The moldable/foldable housing of claim 11, further comprising a battery contact, said battery contact including:
a thin, flexible wall integrally molded in said first housing member;
a protuberance attached to said thin wall; and
a printed circuit battery contact vacuum deposited on said protuberance;
said housing being constructed and arranged such that when a battery is installed in said housing, said printed circuit battery contact is forcibly engaged with a terminal on said battery, causing said thin wall to flex.
US07121323 1987-11-16 1987-11-16 Moldable/foldable radio housing Expired - Fee Related US4939792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US07121323 US4939792A (en) 1987-11-16 1987-11-16 Moldable/foldable radio housing

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US07121323 US4939792A (en) 1987-11-16 1987-11-16 Moldable/foldable radio housing
CA 578413 CA1316574C (en) 1987-11-16 1988-09-26 Moldable/foldable radio housing
DE19883853292 DE3853292T2 (en) 1987-11-16 1988-10-17 Foldable radio housing.
PCT/US1988/003586 WO1989005066A1 (en) 1987-11-16 1988-10-17 Moldable/foldable radio housing
DE19883853292 DE3853292D1 (en) 1987-11-16 1988-10-17 Foldable radio housing.
EP19890900954 EP0389559B1 (en) 1987-11-16 1988-10-17 Foldable radio housing
JP50084089A JPH07114380B2 (en) 1987-11-16 1988-10-17 Integrally molded possible and collapsible radio housing

Publications (1)

Publication Number Publication Date
US4939792A true US4939792A (en) 1990-07-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
US07121323 Expired - Fee Related US4939792A (en) 1987-11-16 1987-11-16 Moldable/foldable radio housing

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US5007849A (en) * 1989-03-27 1991-04-16 Brother Kogyo Kabushiki Kaisha Signal line connecting structure for a keyboard of electronic apparatus
US5164887A (en) * 1990-09-03 1992-11-17 Citizen Watch Co., Ltd. Pocket size electronic device having x- and y-drivers separately arranged in cover and body
US5241695A (en) * 1991-11-26 1993-08-31 Motorola, Inc. Molded shield with integral key switch circuitry
US5198961A (en) * 1992-01-13 1993-03-30 White Consolidated Industries, Inc. Control module for electrical appliance
US5606326A (en) * 1992-01-29 1997-02-25 Nec Corporation High gain portable radio selective call receiver
US6078791A (en) * 1992-06-17 2000-06-20 Micron Communications, Inc. Radio frequency identification transceiver and antenna
US7746230B2 (en) 1992-08-12 2010-06-29 Round Rock Research, Llc Radio frequency identification device and method
US8018340B2 (en) 1992-08-12 2011-09-13 Round Rock Research, Llc System and method to track articles at a point of origin and at a point of destination using RFID
US5469178A (en) * 1992-09-30 1995-11-21 Motorola, Inc. Low profile antenna system for a cardlike communication receiver
US5507038A (en) * 1993-04-09 1996-04-09 Motorola, Inc. Heat seal connector with integral parting agent
US5767813A (en) * 1993-05-27 1998-06-16 Raytheon Ti Systems, Inc. Efficient electrically small loop antenna with a planar base element
US5710458A (en) * 1993-12-20 1998-01-20 Kabushiki Kaisha Toshiba Card like semiconductor device
US5727408A (en) * 1994-11-14 1998-03-17 Kabushiki Kaisha Tokai Rika Denki Seisakusho Signal processing device with magnetism antenna and key device with the signal processing device
WO1996017391A1 (en) * 1994-12-01 1996-06-06 Motorola Inc. Battery device with integrated circuit substrate packaging
US5472804A (en) * 1994-12-01 1995-12-05 Motorola, Inc. Battery device with integrated circuit substrate packaging
US5521794A (en) * 1995-02-21 1996-05-28 Motorola, Inc. Radio comprised of flexible elements
US6690796B1 (en) 1995-05-17 2004-02-10 The Chamberlain Group, Inc. Rolling code security system
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US8194856B2 (en) 1995-05-17 2012-06-05 The Chamberlain Group, Inc. Rolling code security system
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US20040066936A1 (en) * 1995-05-17 2004-04-08 The Chamberlain Group, Ltd. Rolling code security system
US8633797B2 (en) 1995-05-17 2014-01-21 The Chamberlain Group, Inc. Rolling code security system
US6154544A (en) 1995-05-17 2000-11-28 The Chamberlain Group, Inc. Rolling code security system
US20040243813A1 (en) * 1995-05-17 2004-12-02 The Chamberlain Group, Inc. Rolling code security system
US5736965A (en) * 1996-02-07 1998-04-07 Lutron Electronics Co. Inc. Compact radio frequency transmitting and receiving antenna and control device employing same
US5835852A (en) * 1996-02-09 1998-11-10 Plantronics, Inc. Integated electronic communication device and clip
US6088241A (en) * 1997-07-26 2000-07-11 Kiekert Ag Foil-type connector for motor-vehicle subassemblies
US7839285B2 (en) 1997-08-20 2010-11-23 Round Rock Resarch, LLC Electronic communication devices, methods of forming electrical communication devices, and communications methods
US7948382B2 (en) 1997-08-20 2011-05-24 Round Rock Research, Llc Electronic communication devices, methods of forming electrical communication devices, and communications methods
US6372543B1 (en) 1997-12-19 2002-04-16 Stmicroelectronics, Inc. Wrap-around interconnect for fine pitch ball grid array
US6121678A (en) * 1997-12-19 2000-09-19 Stmicroelectronics, Inc. Wrap-around interconnect for fine pitch ball grid array
US6301468B1 (en) 1998-04-08 2001-10-09 Ericsson Inc. Electrical connector for a removable flip
WO2000044066A3 (en) * 1999-01-22 2000-11-23 Lear Automotive Dearborn Inc Remote entry integrally molded transmitter
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US6233155B1 (en) 1999-06-03 2001-05-15 Telefonaktiebolaget Lm Ericsson (Publ) Encapsulation of printed circuit boards
US7998065B2 (en) * 2001-06-18 2011-08-16 Given Imaging Ltd. In vivo sensing device with a circuit board having rigid sections and flexible sections
EP1280390A2 (en) * 2001-07-23 2003-01-29 HUF HÜLSBECK & FÜRST GMBH & CO. KG Electronic key for vehicle
EP1280390A3 (en) * 2001-07-23 2004-12-29 HUF HÜLSBECK & FÜRST GMBH & CO. KG Electronic key for vehicle
US7389127B2 (en) * 2002-02-07 2008-06-17 Mitsubishi Denki Kabushiki Kaisha Radio communication apparatus
US20040104855A1 (en) * 2002-02-07 2004-06-03 Yasuhiko Nomiyama Radio communication apparatus
WO2004016055A1 (en) * 2002-08-05 2004-02-19 Koninklijke Philips Electronics N.V. An electronic product, a body and a method of manufacturing
US7833151B2 (en) 2002-12-26 2010-11-16 Given Imaging Ltd. In vivo imaging device with two imagers
US20050171398A1 (en) * 2002-12-26 2005-08-04 Given Imaging Ltd. In vivo imaging device and method of manufacture thereof
US7889051B1 (en) 2003-09-05 2011-02-15 The Watt Stopper Inc Location-based addressing lighting and environmental control system, device and method
US7274117B1 (en) 2003-09-05 2007-09-25 The Watt Stopper, Inc. Radio wall switch
US8500630B2 (en) 2004-06-30 2013-08-06 Given Imaging Ltd. In vivo device with flexible circuit board and method for assembly thereof
US20060004257A1 (en) * 2004-06-30 2006-01-05 Zvika Gilad In vivo device with flexible circuit board and method for assembly thereof
NL1026806C2 (en) * 2004-08-09 2006-02-13 Electrische App Nfabriek Capax A device for the provision of electrical or electronic components.
US7440246B2 (en) 2004-10-15 2008-10-21 Leviton Manufacturing Co., Inc. Circuit interrupting apparatus with remote test and reset activation
US20060152867A1 (en) * 2004-10-15 2006-07-13 Gaetano Bonasia Circuit interrupting apparatus with remote test and reset activation
US8199446B2 (en) 2004-10-15 2012-06-12 Leviton Manufacturing Company, Inc. Circuit interrupting system with remote test and reset activation
US20090212967A1 (en) * 2004-10-15 2009-08-27 Leviton Manufacturing Company, Inc Circuit Interrupting System with Remote Test And Reset Activation
US20060104057A1 (en) * 2004-10-28 2006-05-18 Jerome Avron Device and method for in-vivo illumination
US20070162536A1 (en) * 2005-11-18 2007-07-12 Michael Ostrovsky Communication network for controlling devices
US8386661B2 (en) 2005-11-18 2013-02-26 Leviton Manufacturing Co., Inc. Communication network for controlling devices
US20070118012A1 (en) * 2005-11-23 2007-05-24 Zvika Gilad Method of assembling an in-vivo imaging device
US20090247797A1 (en) * 2006-03-30 2009-10-01 Yuichi Katoh Process for Producing Gas Hydrate Pellet
US20070254714A1 (en) * 2006-05-01 2007-11-01 Martich Mark E Wireless access point
US7886338B2 (en) 2006-10-06 2011-02-08 Control4 Corporation System and method for controlling access to local services without losing failover capibilty
US20080091285A1 (en) * 2006-10-06 2008-04-17 Control4 Corporation System and method for controlling access to local services without losing failover capibility
US7756556B2 (en) 2006-11-14 2010-07-13 Leviton Manufacturing Company, Inc. RF antenna integrated into a control device installed into a wall switch box
US20090260966A1 (en) * 2006-11-14 2009-10-22 Leviton Manufacturing Company, Inc. Electrical control device
US20090102677A1 (en) * 2006-11-14 2009-04-23 Leviton Manufacturing Company, Inc. Rf antenna integrated into a control device installed into a wall switch box
US8138435B2 (en) 2006-11-14 2012-03-20 Leviton Manufacturing Company, Inc. Electrical control device
US20080220722A1 (en) * 2007-02-22 2008-09-11 Control4 Corporation System and method for using a wired network to send response messages in an automation system
US8107946B2 (en) 2007-02-22 2012-01-31 Control4 Corporation System and method for using a wired network to send response messages in an automation system
US20080231544A1 (en) * 2007-03-22 2008-09-25 Control4 Corporation System and method for automated audio visual system control
US8436943B2 (en) 2007-03-22 2013-05-07 Control4 Corporation System and method for automated audio visual system control
US20080238668A1 (en) * 2007-03-28 2008-10-02 Control4 Corporation System and method for security monitoring between trusted neighbors
US20080237010A1 (en) * 2007-03-30 2008-10-02 Leviton Manufacturing Company, Inc. Electrical control device
US7538285B2 (en) 2007-03-30 2009-05-26 Leviton Manufacturing Company, Inc. Electrical control device
US20100321151A1 (en) * 2007-04-04 2010-12-23 Control4 Corporation Home automation security system and method
US20080253386A1 (en) * 2007-04-10 2008-10-16 Control4 Corporation System and method for distributing communications through a dense mesh network
US8588103B2 (en) 2007-04-10 2013-11-19 Control4 Corporation System and method for distributing communications through a dense mesh network
US20090028372A1 (en) * 2007-07-23 2009-01-29 Leviton Manufacturing Co., Inc. Light fixture with sound capability
US8468165B2 (en) 2007-12-02 2013-06-18 Leviton Manufacturing Company, Inc. Method for discovering network of home or building control devices
US20090150356A1 (en) * 2007-12-02 2009-06-11 Leviton Manufacturing Company, Inc. Method For Discovering Network of Home or Building Control Devices
US8193510B2 (en) * 2009-03-31 2012-06-05 Fujifilm Corporation Radiation detector
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DE3853292D1 (en) 1995-04-13 grant
EP0389559A4 (en) 1991-11-13 application
JPH03501195A (en) 1991-03-14 application
DE3853292T2 (en) 1995-10-12 grant
JPH07114380B2 (en) 1995-12-06 grant
CA1316574C (en) 1993-04-20 grant
EP0389559B1 (en) 1995-03-08 grant
EP0389559A1 (en) 1990-10-03 application
WO1989005066A1 (en) 1989-06-01 application

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