US4504849A - Semiconductor devices and a solder for use in such devices - Google Patents

Semiconductor devices and a solder for use in such devices Download PDF

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US4504849A
US4504849A US06/398,124 US39812482A US4504849A US 4504849 A US4504849 A US 4504849A US 39812482 A US39812482 A US 39812482A US 4504849 A US4504849 A US 4504849A
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solder
silver
indium
lead
content
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US06/398,124
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Neil A. Davies
Edward T. E. Hughes
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USPHILIPS Corp 100 EAST 42ND ST NEW YORK NY A CORP OF
US Philips Corp
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US Philips Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/29111—Tin [Sn] as principal constituent
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/29116—Lead [Pb] as principal constituent
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
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    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Definitions

  • This invention relates to a semiconductor device comprising a semiconductor body having a metallized contact area soldered to a metallic member with a solder which comprises at least 80% lead, the balance of the solder being substantially all indium and silver.
  • the invention also relates to a solder for use in such devices.
  • solder for bonding a semiconductor body to a metallic member is common in the semiconductor industry, particularly in the manufacture of non-hermetic power semiconductor devices where it is important that the bond can withstand mechanical and thermal stress as well as corrosion.
  • the solder itself must be capable of providing a strong bond, as well as having the ability to resist rupture and corrosion due to either environmental influences or fatigue resulting from cyclic thermal stress.
  • solder should have good wetting characteristics relative to the surfaces to be joined in order to achieve optimum surface contact for strong bonding.
  • the contact areas of the semiconductor body in which the device is formed are metallised with a system of two or more different metal layers, the outermost being a thin layer of gold typically 0.45 micrometers thick.
  • solders consisting of lead and tin have been widely used for bonding metallic contact members to power silicon rectifiers.
  • solders containing tin exhibit the phenomenon of gold scavenging. That is to say, the tin tends to dissolve the gold, removing it from the metallized contact areas. Thus the contact areas can become denuded of their gold metallization.
  • the gold can react with the tin and form hard intermetallics which cause brittleness of the bond when the solder cools. Having scavenged the gold, the tin can also alloy with the semiconductor material of the rectifier, thus impairing it both electrically and mechanically.
  • lead-indium-silver alloy has become widely used in the manufacture of power semiconductor devices and slight variants are available from different solder manufacturers.
  • Semi-Alloys Inc. Of Mount Vernon, N.Y., U.S.A., in their 1980 catalog offer alloys with the following ratios of lead, indium and silver respectively, namely 93%, 5%, 2% and 90%, 5%, 5%.
  • a semiconductor device having the features mentioned above is characterized in that the indium content of the solder is at least four and at most ten times as great as the silver content.
  • the indium to silver ratio of this solder is at least 4:1. Comparing this to the prior art solders containing lead, indium and silver, the ratio of 4:1 (In:Ag) can be achieved by increasing the indium content, or reducing the silver content or both.
  • solder in accordance with the invention has improved wetting characteristics while maintaning it's resistance to corrosion and to mechanical and thermal stress.
  • the present invention is based on the recognition of the fact that silver and indium tend to separate out from the bulk of the solder as nodules, but that this need not be a problem if the indium-silver ratio is such that the indium-silver alloy will melt at a temperature lower than that to which the solder is normally heated.
  • the indium-silver ratio is such that the indium-silver alloy will melt at a temperature lower than that to which the solder is normally heated.
  • lead-indiun-silver solders having a lead content of more than 80% it is usual to heat them to temperatures of say approximately 370° C. Now the alloy comprising four times as much indium as silver melts at approximately 340° C. In other words at normal soldering temperatures the indium-silver alloy which might otherwise separate out from the bulk of the solder is molten and so it does not impair the solder's wetting action.
  • a solder in accordance with the invention may contain at least 5% indium and at most 2% silver. Because the percentage of silver is less than in the known lead-indium-silver solders mentioned above it can be made more cheaply.
  • the solder contains seven times as much indium as silver.
  • One such solder which contains approximately 92% lead, 7% indium, and 1% silver has a melting point in the region of 290° C. to 300° C.
  • the melting point of indium-silver having a ratio of 7:1 is approximately 250° C. and so the whole solder will be molten at normal soldering temperatures of say 370° C.
  • FIGURE is a cross-sectional view of a semiconductor body having a metallized contact area soldered to a metallic member.
  • the silicon rectifier which may be, for example a thyristor, is formed in a silicon body 1.
  • the silicon body will comprise various layers and regions of different conductivity types depending on the particular type of rectifier.
  • a thyristor is essentially a four layer p-n-p-n device, the outermost p-region forming the anode of the device.
  • the structure of thyristors as well as other semiconductor rectifier devices is well-known and consequently no further details will be given here.
  • the semiconductor body 1 in which the rectifier is formed is represented as a simple block.
  • the major surface 2 of the semiconductor body is the contact area of the rectifier. In the case of a thyristor, for example, this would be the anode contact area.
  • the contact area is metallized with a metal layer system 3, which may be for example a three layer system of gold on nickel on chrome, the outermost layer being gold.
  • the gold, nickel and chrome layers can be provided by evaporation in conventional manner and may have a thickness of 0.45 micrometer, 0.25 micrometer, and 0.05 micrometer respectively.
  • the FIGURE does not show the individual metal layers, but instead of the layer system 3 is shown as single entity.
  • the silicon body 1 is bonded to a metallic member 4 by a solder 5.
  • the metallic member 4 may be, for example a plinth made of a material such as molybdenum which has a similar thermal coefficient of expansion to that of silicon.
  • the use of such a plinth which is common in the manufacture of power rectifiers, protects the silicon body 1 from stresses which might otherwise occur as a result of differential thermal expansion of the components which are soldered together.
  • the plinth 5 may itself be in thermal and electrical contact with a base member (not shown).
  • solder preforms themselves are well known to those working in the art of power semiconductor devices. Basically, a preform is a pre-shaped piece of solder whose shape is tailored to the particular soldering operation to be performed. In the present example the preform may be 100 micrometers thick.
  • the solder preform is made of an alloy containing approximately 92% lead, 7% indium and 1% silver. It should be noted that the percentages specified here are intended to allow for impurities which, in practice, may well be present in the alloy. The melting point of this solder is approximately in the range of 295° C. to 305° C.
  • the preform Before assembling the components to be soldered, the preform is cleaned for approximately 60 seconds in a bath of Dynabrite (Trade Mark) available from Dynachem International Limited. The preform is then placed on the plinth 5 and the silicon rectifier is placed on the preform with its contact area 2 facing the solder.
  • the contact area 2 of the rectifier has previously been metallized with the metal layer system of gold on nickel on chromium in known manner as mentioned above.
  • the assembly is held secure using conventional jigs before it is introduced into a belt furnace in which the peak temperature is approximately 370° C.
  • the atmosphere in the furnace consists of hydrogen which acts as a flux for the solder. Typically the assembly moves through the furnace so that the solder is held at a temperature above its melting point for about 5 to 7 minutes.
  • the plinth 5 On cooling, the plinth 5 is strongly bonded to the silicon body and, moreover, the soldered joint is highly resistive to corrosion as well as to thermal and mechanical stress.
  • solder in accordance with the invention can be used for bonding other metallic members to metallized contact areas of a semiconductor body.
  • a solder can be used to bond a copper contact wire to the metallized gate contact area of a thyristor.
  • the contact areas may be metallized with a system of more or less than three different metallic layers.
  • the outermost layer may be a metal other than gold, for example, silver.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
US06/398,124 1981-07-31 1982-07-14 Semiconductor devices and a solder for use in such devices Expired - Lifetime US4504849A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8123478A GB2102833B (en) 1981-07-31 1981-07-31 Lead-indium-silver alloy for use in semiconductor devices
GB8123478 1981-07-31

Publications (1)

Publication Number Publication Date
US4504849A true US4504849A (en) 1985-03-12

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US06/398,124 Expired - Lifetime US4504849A (en) 1981-07-31 1982-07-14 Semiconductor devices and a solder for use in such devices

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US (1) US4504849A (fr)
EP (1) EP0071314B1 (fr)
JP (1) JPS5825894A (fr)
DE (1) DE3271833D1 (fr)
GB (1) GB2102833B (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5027189A (en) * 1990-01-10 1991-06-25 Hughes Aircraft Company Integrated circuit solder die-attach design and method
US5051316A (en) * 1989-05-25 1991-09-24 Taiho Kogyo Co., Ltd. Overlay alloy or plain bearing
US5384090A (en) * 1987-01-30 1995-01-24 Tanaka Denshi Kogyo Kabushiki Kaisha Fine wire for forming bump electrodes using a wire bonder
US5773898A (en) * 1996-05-27 1998-06-30 Mitsubishi Denki Kabushiki Kaisha Hybrid integrated circuit with a spacer between the radiator plate and loading portion of the IC
US5982038A (en) * 1997-05-01 1999-11-09 International Business Machines Corporation Cast metal seal for semiconductor substrates
US20070228112A1 (en) * 2006-03-31 2007-10-04 Wei Shi Method and arrangement for forming a microelectronic package
US20080232030A1 (en) * 2007-03-20 2008-09-25 Avx Corporation Wet electrolytic capacitor containing a plurality of thin powder-formed anodes

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AU591231B2 (en) * 1986-02-18 1989-11-30 Parker Chemical Company Aluminum cleaning process
JPH01259547A (ja) * 1988-04-08 1989-10-17 Sumitomo Electric Ind Ltd 半導体装置用部品

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US3820152A (en) * 1973-04-24 1974-06-25 Du Pont Circuit package with fugitive shorting bar
US3878442A (en) * 1970-05-26 1975-04-15 Harshad J Bhatt Electrical conductor having a high resistance to electromigration
US3913120A (en) * 1973-12-28 1975-10-14 Ibm Thin film resistors and contacts for circuitry
US3986255A (en) * 1974-11-29 1976-10-19 Itek Corporation Process for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials therein
JPS5578536A (en) * 1978-12-08 1980-06-13 Mitsubishi Electric Corp Semiconductor device

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GB1149606A (en) * 1967-02-27 1969-04-23 Motorola Inc Mounting for a semiconductor wafer which is resistant to fatigue caused by thermal stresses
US3601667A (en) * 1968-12-09 1971-08-24 Gen Electric A semiconductor device with a heat sink having a foot portion
US3706915A (en) * 1970-03-09 1972-12-19 Gen Electric Semiconductor device with low impedance bond

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US3878442A (en) * 1970-05-26 1975-04-15 Harshad J Bhatt Electrical conductor having a high resistance to electromigration
US3771211A (en) * 1970-09-18 1973-11-13 Ppg Industries Inc Method of fabricating transparent electroconductive window
US3820152A (en) * 1973-04-24 1974-06-25 Du Pont Circuit package with fugitive shorting bar
US3913120A (en) * 1973-12-28 1975-10-14 Ibm Thin film resistors and contacts for circuitry
US3986255A (en) * 1974-11-29 1976-10-19 Itek Corporation Process for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials therein
JPS5578536A (en) * 1978-12-08 1980-06-13 Mitsubishi Electric Corp Semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
C. E. T. White et al., "Proforma on Preforms", Solid State Technology, (Sep. 1975) pp. 45-48.
C. E. T. White et al., Proforma on Preforms , Solid State Technology, (Sep. 1975) pp. 45 48. *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5384090A (en) * 1987-01-30 1995-01-24 Tanaka Denshi Kogyo Kabushiki Kaisha Fine wire for forming bump electrodes using a wire bonder
US5514912A (en) * 1987-01-30 1996-05-07 Tanaka Denshi Kogyo Kabushiki Kaisha Method for connecting semiconductor material and semiconductor device used in connecting method
US5514334A (en) * 1987-01-30 1996-05-07 Tanaka Denshi Kogyo Kabushiki Kaisha Fine lead alloy wire for forming bump electrodes
US5051316A (en) * 1989-05-25 1991-09-24 Taiho Kogyo Co., Ltd. Overlay alloy or plain bearing
US5027189A (en) * 1990-01-10 1991-06-25 Hughes Aircraft Company Integrated circuit solder die-attach design and method
US5773898A (en) * 1996-05-27 1998-06-30 Mitsubishi Denki Kabushiki Kaisha Hybrid integrated circuit with a spacer between the radiator plate and loading portion of the IC
US5982038A (en) * 1997-05-01 1999-11-09 International Business Machines Corporation Cast metal seal for semiconductor substrates
US20070228112A1 (en) * 2006-03-31 2007-10-04 Wei Shi Method and arrangement for forming a microelectronic package
US20080232030A1 (en) * 2007-03-20 2008-09-25 Avx Corporation Wet electrolytic capacitor containing a plurality of thin powder-formed anodes

Also Published As

Publication number Publication date
GB2102833B (en) 1984-08-01
EP0071314A3 (en) 1984-04-25
JPS5825894A (ja) 1983-02-16
JPH0133278B2 (fr) 1989-07-12
EP0071314A2 (fr) 1983-02-09
EP0071314B1 (fr) 1986-06-25
GB2102833A (en) 1983-02-09
DE3271833D1 (en) 1986-07-31

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