US4420535A - Bondable polyamide - Google Patents

Bondable polyamide Download PDF

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Publication number
US4420535A
US4420535A US06/311,385 US31138581A US4420535A US 4420535 A US4420535 A US 4420535A US 31138581 A US31138581 A US 31138581A US 4420535 A US4420535 A US 4420535A
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Prior art keywords
polyester
imide
insulated wire
wire according
bondable
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US06/311,385
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George A. Walrath
Scott D. Smith
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SI Group Inc
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Schenectady Chemicals Inc
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Assigned to SCHENECTADY CHEMICALS, INC., A CORP. OF N.Y. reassignment SCHENECTADY CHEMICALS, INC., A CORP. OF N.Y. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: SMITH, SCOTT D., WALRATH, GEORGE A.
Priority to US06/311,385 priority Critical patent/US4420535A/en
Priority to AU89236/82A priority patent/AU8923682A/en
Priority to ZA827382A priority patent/ZA827382B/en
Priority to CA000413202A priority patent/CA1211248A/en
Priority to JP57179203A priority patent/JPS5896620A/en
Priority to GB08229405A priority patent/GB2108982B/en
Priority to US06/514,035 priority patent/US4501883A/en
Priority to US06/557,964 priority patent/US4461805A/en
Publication of US4420535A publication Critical patent/US4420535A/en
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Priority to JP61173960A priority patent/JPS6211777A/en
Priority to AU77699/87A priority patent/AU614721B2/en
Assigned to SCHENECTADY INTERNATIONAL, INC. reassignment SCHENECTADY INTERNATIONAL, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHENECTADY CHEMICALS, INC.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y10T428/2942—Plural coatings
    • Y10T428/2947—Synthetic resin or polymer in plural coatings, each of different type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Definitions

  • the present invention relates to a novel self bondable aromatic aliphatic polyamide.
  • An all-aromatic polyamide as made in accordance with Allard U.S. Pat. No. 3,642,715 does not exhibit self-bonding characteristics even when tested via the NEMA Bonding Test No. 57.1.1.2. at temperatures up to 260° C.
  • the all-aliphatic polyamides as described by the work of Otis U.S. Pat. No. 4,216,263 and Kawaguchi U.S. Pat. No. 4,163,826 are thermoplastic in nature and exhibit good bonding characteristics but do not offer the excellent humidity resistance and resistance to attack by refrigerants as do the aromatic-aliphatic polyamides of the present invention.
  • Gilman U.S. Pat. No. 2,268,586 has a broad teaching of making polyamides by reacting a dibasic acid with a diisocyanate but does not show self-bondable polyamides.
  • Onder U.S. Pat. No. 4,072,665 discloses a novel copolymer of the formula ##STR1## where R is 60 to 85 percent of an aliphatic dibasic carboxylic acid with (CH 2 ) x recurring units and x being an integer of 7 to 12 inclusive, the remaining 15 to 40 percent of R being m-phenylene. The proportions are indicated to be critical in Onder. Onder also indicates on column 6, lines 43-52 that a portion of the recurring units up to 10% can have R from a different dicarboxylic acid, e.g. terephthalic acid. Onder uses his products for many things including wire coatings, column 6, lines 11-22. However, Onder makes no mention of a solution cast film which is baked and yet retains self-sealing or adhesive properties.
  • AL is the divalent hydrocarbon residue of an unsubstituted aliphatic dicarboxylic acid having 6 to 36 carbon atoms or more, usually AL is (CH 2 ) x where x is 4 to 34, preferably 6 to 12, most preferably 10.
  • AL can be the residue of an unsaturated dicarboxylic acid, e.g. dimerized linoleic acid or dimerized oleic acid or dimerized tall oil.
  • R is tolylene, phenyl, ##STR3## where F is O, CH 2 or SO 2 .
  • R can be cycloaliphatic, e.g. cyclohexylene or methylenedicyclohexyl
  • Ar is p-phenylene
  • y is 35 to 80% of the recurring units
  • z is 65 to 20% of the recurring units.
  • y is 40 to 70% of the recurring units and preferably y is about 60 to 70%, most preferably 65% of the recurring units. If y is above 70% there is a tendency to gel on standing.
  • the copolyamides can be prepared in conventional manner by reacting a mixture of the dicarboxylic acids, e.g. dodecanedioic acid and terephthalic acid with a diisocyanate, e.g. toluene diisocyanate or methylene diphenyldiisocyanate, or with the corresponding diamine, e.g. toluene diamine, 4,4'-methylene diphenyl diamine (methylene dianiline), oxydianiline, phenylene diamine, diaminodiphenyl sulfone, or a mixture of such diisocyanates or of such diamines.
  • a dicarboxylic acids e.g. dodecanedioic acid and terephthalic acid
  • a diisocyanate e.g. toluene diisocyanate or methylene diphenyldiisocyanate
  • the corresponding diamine e.g.
  • acylating agents e.g. the dichloride or dibromide of dodecandioic acid or the lower alkyl esters, e.g. dimethyl dodecandioate, diethyl dodecandioate, and dibutyl dodecanedioate.
  • R has the mole percent ratio of 4-methyl-m-phenylene/2-methyl-m-phenylene/4,4'-methylene diphenylene in the range of 40/10/50 to 80/20/0.
  • the reaction is carried out in an amide solvent such as N-methyl-2-pyrrolidone (NMP).
  • NMP N-methyl-2-pyrrolidone
  • copolyamides of the invention are useful as a self-bonding coating for magnet wire.
  • This coating is usually applied in an amide based solvent system, e.g., N-methyl pyrrolidone or a mixture of N-methyl pyrrolidone and an aromatic hydrocarbon.
  • amide based solvent system e.g., N-methyl pyrrolidone or a mixture of N-methyl pyrrolidone and an aromatic hydrocarbon.
  • the coating is resistant to attack by refrigerants.
  • the coating has improved humidity resistance.
  • the coating has improved chemical resistance.
  • the bond coat offers obvious ecological advantages.
  • the novel, self-bonding wire coating provides the magnet wire user an economical and ecological alternative with significant improvements in bond strengths, hermetic resistance, and chemical resistance when compared to other self-bond wire coatings.
  • This novel coating also offers the motor manufacturer an option to eliminate secondary insulations as the self-bonding wire coating will produce results equivalent to or better than those achieved with the secondary insulations currently used.
  • copolyamides of the present invention are superior, in humidity resistance and resistance to attack by refrigerants, to the products of Otis U.S. Pat. No. 4,216,263.
  • a sample of a polyamide as described in Otis is subjected to a 100 percent humidity at 70° C., it exhibits an initial resistance of about 370,000 megohms. After aging one week, the megohm resistance was about 280,000 megohms; after two weeks, the resistance had dropped to about 160,000 megohms.
  • aromatic-aliphatic polyamide of the present invention (based on Mondur TD-80, 4,4-methylene diphenylenediisocyanate, terephthalic acid and dodecanedioic acid), when submitted to this test, gave the following results:
  • the dielectrics of the all-aliphatic polyamides of Otis were reduced by 50 percent after two weeks at 100 percent relative humidity and 70° C.
  • the aromatic-aliphatic polyamides of this invention did not significantly change after the two-week aging.
  • the all-aliphatic nylons are true thermoplastics, unlike the aromatic-aliphatic polyamides of the invention which, when initially bonded at 200° C., retain good bond strength at 200° C.
  • the aromatic-aliphatic polyamides of the invention when coated over a polyester of the type described by Meyer in U.S. Pat. Nos. 3,201,276 and 3,211,585, will upgrade the base polyester to a NEMA Class 155° C. or greater magnet wire coating system.
  • the entire disclosure of the Meyer patents are hereby incorporated by reference and relied upon.
  • the aliphatic-aromatic polyamides of this invention will self-bond at temperatures of 170° C. or greater when tested in accordance with NEMA Test Specification 57.1.1.2 with resulting bond strengths of greater than seven pounds when broken at 180° C.
  • this novel enamel is coated over a self-supporting, high-temperature film, such as a polyimide, polyparabanic acid, polyamide, or polyamide-imide film, then baked to dry, the film may then be self-bonded and will exhibit outstanding inner laminar adhesion.
  • a self-supporting, high-temperature film such as a polyimide, polyparabanic acid, polyamide, or polyamide-imide film
  • a polyamide, in 70/30 nmp/xylene is made from 100% of an alkanedioic acid such as dodecanedioic acid and a mixture of toluene diisocyanate and methylene diphenyl diisocyanate, then the enamel product gels on standing. In fact there is a tendency for gelation to occur if the amount of dodecanedioic acid goes above 70 mole percent and especially above 78 mole percent based on the total of dodecanedioic acid and terephthalic acid.
  • an alkanedioic acid such as dodecanedioic acid and a mixture of toluene diisocyanate and methylene diphenyl diisocyanate
  • the wire coating is bondable at 200° C. and yet retains good bond strength at 180° C. However, once the polymer is "Heat Set" above the apparent glass transition temperature of the aromatic-aliphatic polyamide, the apparent glass transition temperature increases, thus giving some thermoset properties to the coating.
  • the aromatic-aliphatic polyamide system of the invention is the only amide bonding system offered which is not in part a physical blend of an all aliphatic amide such as Nylon 6;6,6; 11 or 12.
  • the aromatic-aliphatic polyamide is, however, an in situ reaction product of an aromatic diacid and an aliphatic diacid, preferably with a blend of aromatic diisocyanates to yield a random aromatic-aliphatic polymer.
  • the preferred reactants are terephthalic acid and dodecanedioic acid with toluene diisocyanate and methylenediphenyl diisocyanate in a 70:30 mole ratio.
  • the reaction is carried out in an amide-type solvent such as N-methyl-2-pyrrolidone.
  • the enamels of the invention exhibit good bond strengths when coated over ISONEL 200 and ISOMID wire enamel. Thus when bonded at 200° C. for 20 minutes they have shown bond strengths of 1 to 6.2 lbs. and even up to 7.4 pounds at 180° C. without degrading other wire properties by application of the bond coat.
  • the heat-bondable copolyamide film of the invention can be applied by conventional wire coating techniques to give a wire that may be wound into coils, armatures, stators, etc., and heat bonded, thereby eliminating the need for an impregnating varnish, to give a wire-insulation system of unusual thermal resistance.
  • a varnish dip In the process of eliminating the need for a varnish dip, the need for expensive dipping apparatus ovens, lengthy cure cycles, and high energy costs are eliminated.
  • the bondable copolyamide of the invention can be employed, for example, as a top coat over a wire having a base coat or coats of, for example:
  • glycerine or other aliphatic polyhydric alcohol polyester e.g. glycerineethylene glycol terephthalate polymer as in Precopio U.S. Pat. No. 2,936,296,
  • tris(2-hydroxyethyl)isocyanurate polyester e.g. tris(2-hydroxyethyl) isocyanurate(THEIC)ethylene glycol-terephthalate polymer as in Meyer U.S. Pat. No. 3,342,780,
  • a polyester coated with an amide-imide polymer e.g. the polyester of Precopio or Meyer 3,342,780 coated with an amide-imide polymer as shown in Koerner U.S. Pat. No. 3,022,200 and Standard Oil British Pat. No. 1,056,564.
  • polyester-imide which is the reaction product of THEIC, ethylene glycol, terephthalic acid (or isophthalic acid), methylene dianiline (or oxydianiline) and trimellitic anhydride, e.g. as in Meyer U.S. Pat. No. 3,426,098.
  • THEIC ethylene glycol, terephthalic acid (or isophthalic acid), methylene dianiline (or oxydianiline) and trimellitic anhydride
  • glycerine e.g. as in the polyester-imides of Schmidt U.S. Pat. No. 3,697,471.
  • the base coat the diethylene glycol or triethylene glycol monoether modified polyester-imide resins of Keating U.S. Pat. No. 4,119,608,
  • polyimide such as Pyre ML as in Edwards U.S. Pat. Nos. 3,179,634; 3,179,630; 3,179,631; 3,179,632, and 3,179,633,
  • the wire enamels can be applied to either bare or base coated copper, aluminum, silver, or other wires using conventional coating procedures and wire speeds, e.g., 30-150 ft/min. and curing the wire is carried out at conventional temperatures. The speed is adjusted according to wire size and enamel to obtain optimum cure as is known in the art.
  • copolyamides of the invention are also useful as bondable coatings over film wrapped wire, e.g.
  • Nomex--a DuPont aromatic polyamide (isophthalic acid with an aromatic diamine).
  • copolyamides of the invention can be used as adhesives to apply over self-supporting films, e.g. used in printed circuit boards and capacitors.
  • Typical self-supported films include Kapton polyimide, Mylar (polyethylene terephthalate) polyester, Nomex, polytetrafluoroethylene and perfluoroethylene-perfluoropropylene copolymer.
  • copolyamides of the invention can be employed as cast films for adhesive use.
  • the film is cast from solution and can then be used as an adhesive.
  • strand or filament form the copolyamide can be used as a substitute for Dacron in wrapped glass cloth.
  • Dacron is not high temperature resistant. Hence replacing the Dacron filaments by filaments of the copolyamide of the invention gives higher temperature resistant products.
  • Nomex is available as cast or sheet insulation.
  • the heat bondable copolyamide of the invention can be used as a wrapping therefore to hold the Nomex together.
  • FIG. 1 is a graph of bond strength vs. percent of aliphatic dibasic acid (dodecanedioic acid).
  • FIG. 2 is a graph comparing the bond strength of the copolyamide with that of Nylon 11.
  • composition can comprise, consist essentially of, or consist of the materials set forth.
  • This example is a working example of the present invention.
  • Parts four and five were added at room temperature with agitation and a blanket of nitrogen was applied over the reaction. The temperature was raised slowly by use of an electric heating mantel to approximately 75° C. when carbon dioxide evolution began.
  • the external heat was then reduced and the temperature of the batch was allowed to rise over a four-hour time period to approximately 170° C. At about 80° C., the batch became clear. After an approximate four-hour hold at 170° to 175° C., the reaction was allowed to cool slowly to room temperature over night. The next morning the reaction mixture was sampled and a 60 percent solution in N-methyl-2-pyrrolidone was determined to have a viscosity at 25° C. on the Gardner-Holdt scale of W 1/2. Parts six and seven were then added. The final viscosity of the solution at 25° C. was Z on the Gardner-Holdt scale, or 2,500 centipoises as measured by a Brookfield RVT Viscometer.
  • the percent non-volatiles of the solution were determined to be 27 percent by baking a two-gram sample for two hours at 200° C.
  • the specific gravity of the solution was determined to be 1.025 at 25° C.
  • This solution was then used to overcoat a commercially available polyester (ISONEL 200)**.
  • the test properties were as shown in Table One. It was also coated over a commercially available polyester-imide (ISOMID)*** and tested as shown in Table One.
  • the temperature of coating the wires in all of the examples was 370°-480° C.
  • the reaction was carried out much in the same fashion as described in example one, with the exception of the over night cooling step.
  • the reaction medium was sampled after a three-hour hold at 165° to 180° C. at 60 percent in N-methyl-2-pyrrolidone and found to have a viscosity of V 1/2 at 25° C. on the Gardner-Holdt Scale.
  • the batch was then reduced with six and seven to a final viscosity of Y 1/4 at 25° C. on the Gardner-Holdt Scale at 28.45 percent non-volatiles determined as described in Example One.
  • the material was then coated over a polyester (ISONEL 200), a polyester imide (ISOMID), a polyester overcoated with a polyamide-imide, (ISONEL 200 overcoated with trimellitic anhydride-methylene dianiline polymer), a polyamide-imide (trimellitic anhydride-methylene dianiline polymer) wire coating and as a monolithic enamel.
  • the results of the testing on the coated conductors are as shown in Table one.
  • Examples Three through Eight describe the effects of the mole percent ratio of aliphatic diacid to aromatic diacid.
  • the effects on bond strength are shown on Graph Number One. (Bond strength versus percent aliphatic diacid). Also shown on Graph Number One is the relationship of bond strength to breaking temperature.
  • the other properties of the coated conductors are as displayed in Table One.
  • This example describes the use of an aliphatic acid as described in the disclosure where X equals four.
  • This example was prepared as described in Example One.
  • This example describes the use of an aliphatic diacid as described in the disclosure where X equals seven.
  • Example One This example was prepared in the same fashion as Example One. This enamel was applied on 18-AWG copper wire over ISOMID. The electrical test properties are as shown in Table one.
  • This example demonstrates the use of a diabasic acid where X equals eight.
  • This example indicates that the allowable number of methylene groups between the two carboxyl groups of the aliphatic diacid may not have an upper limit.
  • This working example demonstrates the use of a cyclic aliphatic diisocyanate to replace a portion of the aromatic diisocyanate.
  • This enamel was prepared as described in Example One. It was then applied as an overcoat to ISOMID-coated copper wire. The test results obtained from this construction are as shown in Table One.
  • This example shows the use of all toluene diisocyanate to make an acceptable bond coat.
  • This example was prepared using the procedure described in Example One. However, as indicated no 4,4'-methylene diphenyl diisocyanate was employed. When coated over 18-AWG ISOMID coated wire, the bond coat gave the properties as shown in Table One.
  • This example defines the lower preferred limit of toluene diisocyanate in the bond coat.
  • This enamel was also cooked as described in Example One. It was then applied to ISOMID coated 18-AWG copper wire giving the test results as reported in Table One.
  • a commercial solution of Nylon 66 was coated over a polyester wire enamel, namely, ISONEL 200.
  • the resulting magnet wire exhibited the properties shown in Table One.
  • Nylon 11 was prepared in accordance with U.S. Pat. No. 4,216,263 by Otis. The viscosity of this solution was approximately Z5 1/2 on the Gardner-Holdt Scale at 25° C. The percent non-volatiles of the solution was determined to be 16.1 percent by baking a two-gram sample for two hours at 200° C. This enamel solution was coated over a polyester-imide of the ISOMID type on AWG-24 copper wire. The electrical and bonding test results are shown in Table One.
  • Nylon 11 was prepared in accordance with U.S. Pat. No. 4,216,263 by Otis. The viscosity of the solution was approximately Z2 3/4 on the Gardner-Holdt Scale at 25° C. at approximately 16.1 percent non-volatiles determined as in Example One. This enamel was coated over a polyesterimide wire coating, namely ISOMID on 18-AWG copper wire. The test results are shown on Table One. A comparison of the bond strength of this example to the preferred composition of this disclosure as described by Example One is shown on Graph Number Two.
  • Nylon 11 was prepared in accordance with U.S. Pat. No. 4,216,263 Otis. The viscosity of this solution was approximately Z3 1/2 on the Gardner-Holdt Scale at 25° C. The percent non-volatiles determined as in Example One were 16.8 percent. This enamel was coated over a polyester wire coating, namely ISONEL 200 on 18-AWG copper wire. The electrical and bonding test results are as shown in Table One.
  • terephthalic acid in copolyamides of the invention.
  • isophthalic acid in whole or in part as taught by Onder U.S. Pat. No. 4,072,665, the bond strength is reduced.
  • Example 2 The procedure was similar to Example 1 but there were used as reactants a 70/30 molar ratio mixture of toluene diisocyanate and methylene diisocyanate and there was used a 65/25/10 molar mixture of dodecanedioic acid, isophthalic acid and terephthalic acid.
  • Examples 1 and 3 which are within the present invention both employ a 65/35 molar mixture of dodecanedioic acid and terephthalic acid.
  • the bond strength of Comparative Example 5, Comparative Example 6, Example 1, and Example 3 were tested by coating their resultant enamel solutions on top of ISOMID-coated wire at 50 ft./min., followed by bonding at 200° C. for 20 minutes under 1-kg load. The results were as set forth in Table 2:

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Abstract

Self-bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms. These self-bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g. a polyester, polyester-imide, or polyamideimide.

Description

BACKGROUND OF THE INVENTION
The present invention relates to a novel self bondable aromatic aliphatic polyamide.
An all-aromatic polyamide as made in accordance with Allard U.S. Pat. No. 3,642,715 does not exhibit self-bonding characteristics even when tested via the NEMA Bonding Test No. 57.1.1.2. at temperatures up to 260° C. The all-aliphatic polyamides as described by the work of Otis U.S. Pat. No. 4,216,263 and Kawaguchi U.S. Pat. No. 4,163,826 are thermoplastic in nature and exhibit good bonding characteristics but do not offer the excellent humidity resistance and resistance to attack by refrigerants as do the aromatic-aliphatic polyamides of the present invention.
Gilman U.S. Pat. No. 2,268,586 has a broad teaching of making polyamides by reacting a dibasic acid with a diisocyanate but does not show self-bondable polyamides.
Onder U.S. Pat. No. 4,072,665 discloses a novel copolymer of the formula ##STR1## where R is 60 to 85 percent of an aliphatic dibasic carboxylic acid with (CH2)x recurring units and x being an integer of 7 to 12 inclusive, the remaining 15 to 40 percent of R being m-phenylene. The proportions are indicated to be critical in Onder. Onder also indicates on column 6, lines 43-52 that a portion of the recurring units up to 10% can have R from a different dicarboxylic acid, e.g. terephthalic acid. Onder uses his products for many things including wire coatings, column 6, lines 11-22. However, Onder makes no mention of a solution cast film which is baked and yet retains self-sealing or adhesive properties.
SUMMARY OF THE INVENTION
There have now been prepared random aromatic-aliphatic copolyamides having the recurring unit ##STR2## where AL is the divalent hydrocarbon residue of an unsubstituted aliphatic dicarboxylic acid having 6 to 36 carbon atoms or more, usually AL is (CH2)x where x is 4 to 34, preferably 6 to 12, most preferably 10. However, AL can be the residue of an unsaturated dicarboxylic acid, e.g. dimerized linoleic acid or dimerized oleic acid or dimerized tall oil. R is tolylene, phenyl, ##STR3## where F is O, CH2 or SO2. Less preferably all or a part of R can be cycloaliphatic, e.g. cyclohexylene or methylenedicyclohexyl, Ar is p-phenylene, y is 35 to 80% of the recurring units and z is 65 to 20% of the recurring units. Usually y is 40 to 70% of the recurring units and preferably y is about 60 to 70%, most preferably 65% of the recurring units. If y is above 70% there is a tendency to gel on standing.
The copolyamides can be prepared in conventional manner by reacting a mixture of the dicarboxylic acids, e.g. dodecanedioic acid and terephthalic acid with a diisocyanate, e.g. toluene diisocyanate or methylene diphenyldiisocyanate, or with the corresponding diamine, e.g. toluene diamine, 4,4'-methylene diphenyl diamine (methylene dianiline), oxydianiline, phenylene diamine, diaminodiphenyl sulfone, or a mixture of such diisocyanates or of such diamines. As indicated there can also be employed a minor amount of 4,4'-methylene diphenyl diamine or cyclohexyl diamine. In reacting with the diamine rather than the diisocyanate it is of course possible to employ other acylating agents than the acid, e.g. there can be used the acyl halides, e.g. the dichloride or dibromide of dodecandioic acid or the lower alkyl esters, e.g. dimethyl dodecandioate, diethyl dodecandioate, and dibutyl dodecanedioate.
Preferably in the formula R has the mole percent ratio of 4-methyl-m-phenylene/2-methyl-m-phenylene/4,4'-methylene diphenylene in the range of 40/10/50 to 80/20/0. The reaction is carried out in an amide solvent such as N-methyl-2-pyrrolidone (NMP).
The copolyamides of the invention are useful as a self-bonding coating for magnet wire. This coating is usually applied in an amide based solvent system, e.g., N-methyl pyrrolidone or a mixture of N-methyl pyrrolidone and an aromatic hydrocarbon. The major advantages offered by this novel enamel are:
(1) High temperature retention of bond strength.
(2) The quality of the base coat is not lessened, and in some cases, the quality of the base coat is improved by the bonding overcoat.
(3) The coating is resistant to attack by refrigerants.
(4) The coating has improved humidity resistance.
(5) The coating has improved chemical resistance.
(6) The coating is less costly than commercially available alternatives.
(7) The end user's cost is reduced by elimination of a costly secondary insulation.
(8) By eliminating the solvent-borne secondary insulation requirement, the bond coat offers obvious ecological advantages.
(9) Good adhesion to self-supporting high-temperature films.
Thus, the novel, self-bonding wire coating provides the magnet wire user an economical and ecological alternative with significant improvements in bond strengths, hermetic resistance, and chemical resistance when compared to other self-bond wire coatings. This novel coating also offers the motor manufacturer an option to eliminate secondary insulations as the self-bonding wire coating will produce results equivalent to or better than those achieved with the secondary insulations currently used.
It was previously pointed out that the copolyamides of the present invention are superior, in humidity resistance and resistance to attack by refrigerants, to the products of Otis U.S. Pat. No. 4,216,263. Thus when a sample of a polyamide as described in Otis is subjected to a 100 percent humidity at 70° C., it exhibits an initial resistance of about 370,000 megohms. After aging one week, the megohm resistance was about 280,000 megohms; after two weeks, the resistance had dropped to about 160,000 megohms. The aromatic-aliphatic polyamide of the present invention (based on Mondur TD-80, 4,4-methylene diphenylenediisocyanate, terephthalic acid and dodecanedioic acid), when submitted to this test, gave the following results:
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            After          After                                          
Initial     One Week       Two Weeks                                      
______________________________________                                    
422,000 megohms                                                           
            900,000 megohms                                               
                           820,000 megohms                                
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The dielectrics of the all-aliphatic polyamides of Otis were reduced by 50 percent after two weeks at 100 percent relative humidity and 70° C. The aromatic-aliphatic polyamides of this invention, however, did not significantly change after the two-week aging. The all-aliphatic nylons are true thermoplastics, unlike the aromatic-aliphatic polyamides of the invention which, when initially bonded at 200° C., retain good bond strength at 200° C. The aromatic-aliphatic polyamides of the invention, when coated over a polyester of the type described by Meyer in U.S. Pat. Nos. 3,201,276 and 3,211,585, will upgrade the base polyester to a NEMA Class 155° C. or greater magnet wire coating system. The entire disclosure of the Meyer patents are hereby incorporated by reference and relied upon. When coated over other wire enamels or wire enamel systems, the inherent properties of the coated wire are not adversely effected. The aliphatic-aromatic polyamides of this invention will self-bond at temperatures of 170° C. or greater when tested in accordance with NEMA Test Specification 57.1.1.2 with resulting bond strengths of greater than seven pounds when broken at 180° C.
When this novel enamel is coated over a self-supporting, high-temperature film, such as a polyimide, polyparabanic acid, polyamide, or polyamide-imide film, then baked to dry, the film may then be self-bonded and will exhibit outstanding inner laminar adhesion.
If a polyamide, in 70/30 nmp/xylene, is made from 100% of an alkanedioic acid such as dodecanedioic acid and a mixture of toluene diisocyanate and methylene diphenyl diisocyanate, then the enamel product gels on standing. In fact there is a tendency for gelation to occur if the amount of dodecanedioic acid goes above 70 mole percent and especially above 78 mole percent based on the total of dodecanedioic acid and terephthalic acid.
Among the advantages of the copolyamides of the invention, in addition to or in amplification of those set forth above are:
(1) The wire coating is bondable at 200° C. and yet retains good bond strength at 180° C. However, once the polymer is "Heat Set" above the apparent glass transition temperature of the aromatic-aliphatic polyamide, the apparent glass transition temperature increases, thus giving some thermoset properties to the coating.
(2) The aromatic-aliphatic polyamide system of the invention is the only amide bonding system offered which is not in part a physical blend of an all aliphatic amide such as Nylon 6;6,6; 11 or 12. The aromatic-aliphatic polyamide is, however, an in situ reaction product of an aromatic diacid and an aliphatic diacid, preferably with a blend of aromatic diisocyanates to yield a random aromatic-aliphatic polymer. The preferred reactants are terephthalic acid and dodecanedioic acid with toluene diisocyanate and methylenediphenyl diisocyanate in a 70:30 mole ratio. The reaction is carried out in an amide-type solvent such as N-methyl-2-pyrrolidone.
(3) The aromatic-aliphatic polyamide, when coated over ISONEL 200, yields a Class 155° C. magnet wire; and, with the exception of the heat shock, displays Class 180° C. properties.
When coated over ISOMID, excellent properties as a Class 180° C. magnet wire are observed.
(4) The aromatic-aliphatic polyamide coated over ISONEL 200 pases the A. O. Smith Freon Blister Test; conventional Nylon 6,6 coated over ISONEL 200 fails this test.
(5) The moisture resistance of the aromatic-aliphatic polyamide is also superior to the Nylon 11 types.
(6) The aromatic-aliphatic polyamides offer a significant cost advantage over the systems based upon Nylon 11 or 12.
As indicated above the enamels of the invention exhibit good bond strengths when coated over ISONEL 200 and ISOMID wire enamel. Thus when bonded at 200° C. for 20 minutes they have shown bond strengths of 1 to 6.2 lbs. and even up to 7.4 pounds at 180° C. without degrading other wire properties by application of the bond coat.
The heat-bondable copolyamide film of the invention can be applied by conventional wire coating techniques to give a wire that may be wound into coils, armatures, stators, etc., and heat bonded, thereby eliminating the need for an impregnating varnish, to give a wire-insulation system of unusual thermal resistance. In the process of eliminating the need for a varnish dip, the need for expensive dipping apparatus ovens, lengthy cure cycles, and high energy costs are eliminated.
The bondable copolyamide of the invention can be employed, for example, as a top coat over a wire having a base coat or coats of, for example:
1. a glycerine or other aliphatic polyhydric alcohol polyester, e.g. glycerineethylene glycol terephthalate polymer as in Precopio U.S. Pat. No. 2,936,296,
2. tris(2-hydroxyethyl)isocyanurate polyester, e.g. tris(2-hydroxyethyl) isocyanurate(THEIC)ethylene glycol-terephthalate polymer as in Meyer U.S. Pat. No. 3,342,780,
3. a polyester coated with an amide-imide polymer, e.g. the polyester of Precopio or Meyer 3,342,780 coated with an amide-imide polymer as shown in Koerner U.S. Pat. No. 3,022,200 and Standard Oil British Pat. No. 1,056,564.
4. a polyester-imide which is the reaction product of THEIC, ethylene glycol, terephthalic acid (or isophthalic acid), methylene dianiline (or oxydianiline) and trimellitic anhydride, e.g. as in Meyer U.S. Pat. No. 3,426,098. In place of THEIC, there can be used glycerine, e.g. as in the polyester-imides of Schmidt U.S. Pat. No. 3,697,471. Likewise, there can be used as the base coat the diethylene glycol or triethylene glycol monoether modified polyester-imide resins of Keating U.S. Pat. No. 4,119,608,
5. amide-imide coated polyester-imide as in the Koerner and Standard Oil patents,
6. monolithic amide-imide as in the Standard Oil patent,
7. polyimide such as Pyre ML as in Edwards U.S. Pat. Nos. 3,179,634; 3,179,630; 3,179,631; 3,179,632, and 3,179,633,
8. as a coating over an acrylic (acrylic-methacrylic acid ester) top coated polyimide of the type of Lecton (DuPont),
9. conventional Formvar (polyvinyl formal), epoxy (e.g. bisphenol A-epichlorohydrin), urethane, and nylon top coated urethane. The entire disclosures of the Meyer Pat. No. 3,342,780, Precopio, Koerner, Standard Oil, Keating, Meyer U.S. Pat. No. 3,426,098, and the Edwards patents are hereby incorporated by reference and relied upon.
The wire enamels can be applied to either bare or base coated copper, aluminum, silver, or other wires using conventional coating procedures and wire speeds, e.g., 30-150 ft/min. and curing the wire is carried out at conventional temperatures. The speed is adjusted according to wire size and enamel to obtain optimum cure as is known in the art.
The copolyamides of the invention are also useful as bondable coatings over film wrapped wire, e.g.
1. Kapton--a polyimide film of DuPont as in the Edwards patents
2. Nomex--a DuPont aromatic polyamide (isophthalic acid with an aromatic diamine).
The copolyamides of the invention can be used as adhesives to apply over self-supporting films, e.g. used in printed circuit boards and capacitors. Typical self-supported films include Kapton polyimide, Mylar (polyethylene terephthalate) polyester, Nomex, polytetrafluoroethylene and perfluoroethylene-perfluoropropylene copolymer.
The copolyamides of the invention can be employed as cast films for adhesive use. The film is cast from solution and can then be used as an adhesive.
In film, strand or filament form the copolyamide can be used as a substitute for Dacron in wrapped glass cloth. Dacron is not high temperature resistant. Hence replacing the Dacron filaments by filaments of the copolyamide of the invention gives higher temperature resistant products.
Nomex is available as cast or sheet insulation. The heat bondable copolyamide of the invention can be used as a wrapping therefore to hold the Nomex together.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a graph of bond strength vs. percent of aliphatic dibasic acid (dodecanedioic acid); and
FIG. 2 is a graph comparing the bond strength of the copolyamide with that of Nylon 11.
The composition can comprise, consist essentially of, or consist of the materials set forth.
EXAMPLE 1
This example is a working example of the present invention.
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                          Load                                            
Raw Materials             in Grams                                        
______________________________________                                    
(1)   N--methyl-2-pyrrolidone 4168                                        
(2)   Toluene diisocyanate (Mondur TD-80)*                                
                              1033                                        
(3)   4,4' Methylene diphenyldiisocyanate                                 
                               637                                        
(4)   Terephthalic Acid        494                                        
(5)   Dodecanedioic Acid      1267                                        
(6)   Xylene                  2243                                        
(7)   N--methyl-2-pyrrolidone 1050                                        
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 *Mondur TD80 is a 80/20 blend of 4methyl-m-phenylene diisocyanate and    
 2methyl-m-phenylene diisocyanate and is commercially available from Mobay
 Chemical Company, Pittsburgh, Pennsylvania.
Parts one through three charged at room temperature into a 12-liter, round-bottom reaction flask, equipped with an agitator, a thermometer, an inert gas purge, and a water-cooled condenser fitted with a flexible tube which was immersed in a flask containing a mixture of water and denatured ethyl alcohol. (The reaction by-products carried through the condenser by the carbon dioxide and nitrogen are trapped in the water-alcohol solution). Parts four and five were added at room temperature with agitation and a blanket of nitrogen was applied over the reaction. The temperature was raised slowly by use of an electric heating mantel to approximately 75° C. when carbon dioxide evolution began. The external heat was then reduced and the temperature of the batch was allowed to rise over a four-hour time period to approximately 170° C. At about 80° C., the batch became clear. After an approximate four-hour hold at 170° to 175° C., the reaction was allowed to cool slowly to room temperature over night. The next morning the reaction mixture was sampled and a 60 percent solution in N-methyl-2-pyrrolidone was determined to have a viscosity at 25° C. on the Gardner-Holdt scale of W 1/2. Parts six and seven were then added. The final viscosity of the solution at 25° C. was Z on the Gardner-Holdt scale, or 2,500 centipoises as measured by a Brookfield RVT Viscometer.
The percent non-volatiles of the solution were determined to be 27 percent by baking a two-gram sample for two hours at 200° C. The specific gravity of the solution was determined to be 1.025 at 25° C. This solution was then used to overcoat a commercially available polyester (ISONEL 200)**. The test properties were as shown in Table One. It was also coated over a commercially available polyester-imide (ISOMID)*** and tested as shown in Table One.
The temperature of coating the wires in all of the examples was 370°-480° C.
EXAMPLE 2 
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                          Load                                            
Raw Materials             in Grams                                        
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(1)   N--methyl-2-pyrrolidone 4168                                        
(2)   Toluene diisocyanate (Mondur TD-80)                                 
                              1033                                        
(3)   4,4-Methylene diphenyldiisocyanate                                  
                               637                                        
(4)   Terephthalic Acid        494                                        
(5)   Dodecanedioic Acid      1267                                        
(6)   Xylene                  1982                                        
(7)   N--methyl-2-pyrrolidone  910                                        
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The reaction was carried out much in the same fashion as described in example one, with the exception of the over night cooling step. The reaction medium was sampled after a three-hour hold at 165° to 180° C. at 60 percent in N-methyl-2-pyrrolidone and found to have a viscosity of V 1/2 at 25° C. on the Gardner-Holdt Scale. The batch was then reduced with six and seven to a final viscosity of Y 1/4 at 25° C. on the Gardner-Holdt Scale at 28.45 percent non-volatiles determined as described in Example One.
The material was then coated over a polyester (ISONEL 200), a polyester imide (ISOMID), a polyester overcoated with a polyamide-imide, (ISONEL 200 overcoated with trimellitic anhydride-methylene dianiline polymer), a polyamide-imide (trimellitic anhydride-methylene dianiline polymer) wire coating and as a monolithic enamel. The results of the testing on the coated conductors are as shown in Table one.
EXAMPLES 3 THROUGH 8
Examples Three through Eight describe the effects of the mole percent ratio of aliphatic diacid to aromatic diacid. The effects on bond strength are shown on Graph Number One. (Bond strength versus percent aliphatic diacid). Also shown on Graph Number One is the relationship of bond strength to breaking temperature. The other properties of the coated conductors are as displayed in Table One.
The general procedure for making these enamels is as described in Example One.
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Example     3       4      5     6    7     8                             
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Reactants    Batch weight                                                 
______________________________________                                    
(1) N--methyl-2-                                                          
                644     611  623   633  655   664                         
    pyrrolidone                                                           
(2) Toluene     159     159  159   159  159   159                         
    diisocyanate                                                          
(3) 4,4'-methylene                                                        
                 98      98   98    98   98    98                         
    diphenyl                                                              
    diisocyanate                                                          
(4) Terephthalic                                                          
                 76     141  118    97   54    32                         
    Acid                                                                  
(5) Dodecanedioic                                                         
                194     104  135   164  224   254                         
    Acid                                                                  
(6) Xylene      327     382  346   331  335   366                         
(7) N--methyl-2-                                                          
                119     140  241   140  126   210                         
    pyrrolidone                                                           
    Gardner-Holdt                                                         
                Y3/4    X1/2 Y+    Z+   Y1/4  Y                           
    Viscosity @ 25° C.                                             
    Percent Non-                                                          
                27.8    24.9 25.2  26.8 23.8  25.7                        
    Volatiles                                                             
    Determined                                                            
    2 gm., 2 hr.,                                                         
    200° C.                                                        
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EXAMPLE 9
This example describes the use of an aliphatic acid as described in the disclosure where X equals four.
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Reactants               Batch Weight                                      
______________________________________                                    
(1)  N--methyl-2-pyrrolidone                                              
                            600                                           
(2)  Toluene diisocyanate   171                                           
(3)  4,4' Methylene diphenyldiisocyanate                                  
                            105                                           
(4)  Terephthalic Acid       81                                           
(5)  Adipic Acid            133                                           
(6)  Xylene                 257                                           
     Gardner-Holdt Viscosity (25° C.)                              
                            W1/2                                          
     Determined Percent Non-Volatiles                                     
                            32.4                                          
     (2 grams, 2 hours, 200° C.)                                   
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This example was prepared as described in Example One.
The properties of this enamel when used to overcoat ISOMID are as described in Table One.
EXAMPLE 10
This example describes the use of an aliphatic diacid as described in the disclosure where X equals seven.
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Reactants               Batch Weight                                      
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(1)  N--methyl-2-pyrrolidone                                              
                            622                                           
(2)  Toluene diisocyanate   165                                           
(3)  4,4' Methylene diphenyl diisocyanate                                 
                            161                                           
(4)  Terephthalic Acid       78                                           
(5)  Azelaic Acid           165                                           
(6)  N--methyl-2-pyrrolidone                                              
                            198                                           
(7)  Xylene                 412                                           
     Gardner-Holdt Viscosity (@ 25° C.)                            
                            X3/4                                          
     Determined percent Non-Volatiles                                     
                            22.9                                          
     (2 grams, 2 hours, 200° C.)                                   
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This example was prepared in the same fashion as Example One. This enamel was applied on 18-AWG copper wire over ISOMID. The electrical test properties are as shown in Table one.
EXAMPLE 11
This example demonstrates the use of a diabasic acid where X equals eight.
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Reactants               Batch Weight                                      
______________________________________                                    
(1)  N--methyl-2-pyrrolidone                                              
                            560                                           
(2)  Toluene diisocyanate   145                                           
(3)  4,4' Methylene diphenyl diisocyanate                                 
                             89                                           
(4)  Terephthalic Acid       69                                           
(5)  Sebacic Acid           156                                           
(6)  N--methyl-2-pyrrolidone                                              
                            207                                           
(7)  Xylene                 411                                           
     Gardner-Holdt Viscosity (@ 25° C.)                            
                            X1/2                                          
     Determined percent Non-Volatiles                                     
                            24.2                                          
     (2 grams, 2 hours, 200° C.)                                   
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This example was prepared in accordance with the procedure described in Example One. The test results obtained when this enamel was applied over 18-AWG copper wire coated with ISOMID are shown in Table One.
EXAMPLE 12
This example indicates that the allowable number of methylene groups between the two carboxyl groups of the aliphatic diacid may not have an upper limit.
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Reactants               Batch Weight                                      
______________________________________                                    
(1)  N--methyl-2-pyrrolidone                                              
                            585                                           
(2)  Toluene diisocyanate    94                                           
(3)  4,4' methylene diphenyl diisocyanate                                 
                             68                                           
(4)  Terephthalic Acid       45                                           
(5)  Empol 1010*            283                                           
(6)  N--methyl-2-pyrrolidone                                              
                            140                                           
(7)  Xylene                 310                                           
     Gardner-Holdt Viscosity (@ 25° C.)                            
                            Y1/4                                          
     Determined percent Non-Volatiles                                     
                            29.4                                          
     (2 grams, 2 hours, 200° C.)                                   
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 *Empol 1010 is a C.sub.36 dimerized fatty acid available from Emery      
 Industries, Inc., Cincinnati, Ohio.
This reaction was cooked in accordance with the procedure outlined in Example One. The test results obtained when this enamel was applied over 18-AWG copper wire coated with ISOMID are shown in Table One.
EXAMPLE 13
This working example demonstrates the use of a cyclic aliphatic diisocyanate to replace a portion of the aromatic diisocyanate.
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Reactants               Batch Weight                                      
______________________________________                                    
(1)  N--methyl-2-pyrrolidone                                              
                            600                                           
(2)  Toluene diisocyanate   146                                           
(3)  Desmondur W*            97                                           
(4)  Dodecanedioic Acid     179                                           
(5)  Terephthalic Acid       76                                           
(6)  N--methyl-2-pyrrolidone                                              
                            155                                           
(7)  Xylene                 323                                           
     Gardner-Holdt Viscosity (@ 25° C.)                            
                            Z1/4                                          
     Determined Percent Non-Volatiles                                     
                            27.5                                          
     (2 grams, 2 hours, 200° C.)                                   
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 *Desmondur W is a cycloaliphatic diisocyanate available from Mobay       
 Chemical Company, Pittsburgh, Pennsylvania.
This enamel was prepared as described in Example One. It was then applied as an overcoat to ISOMID-coated copper wire. The test results obtained from this construction are as shown in Table One.
EXAMPLE 14
This example shows the use of all toluene diisocyanate to make an acceptable bond coat.
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Reactants               Batch Weight                                      
______________________________________                                    
(1)  N--methyl-2-pyrrolidone                                              
                            606                                           
(2)  Toluene diisocyanate   226                                           
(3)  Dodecanedioic Acid     194                                           
(4)  Terephthalic Acid       76                                           
(5)  N--methyl-2-pyrrolidone                                              
                            210                                           
(6)  Xylene                 350                                           
     Gardner-Holdt Viscosity (@ 25° C.)                            
                            X1/4                                          
     Determined percent Non-Volatiles                                     
                            27.2                                          
     (2 grams, 2 hours, 200° C.)                                   
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This example was prepared using the procedure described in Example One. However, as indicated no 4,4'-methylene diphenyl diisocyanate was employed. When coated over 18-AWG ISOMID coated wire, the bond coat gave the properties as shown in Table One.
EXAMPLE 15
This example defines the lower preferred limit of toluene diisocyanate in the bond coat.
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Reactants               Batch Weight                                      
______________________________________                                    
(1)  N--methyl-2-pyrrolidone                                              
                            615                                           
(2)  Toluene diisocyanate   150                                           
(3)  4,4' Methylene diphenyl diisocyanate                                 
                            179                                           
(4)  Dodecanedioic Acid      70                                           
(5)  Terephthalic Acid      140                                           
(6)  N--methyl-2-pyrrolidone                                              
                             35                                           
(7)  Xylene                 280                                           
     Gardner-Holdt Viscosity (@ 25° C.)                            
                            Y                                             
     Determined Percent Non-Volatiles                                     
                            31.4                                          
     (2 grams, 2 hours, 220° C.)                                   
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This enamel was also cooked as described in Example One. It was then applied to ISOMID coated 18-AWG copper wire giving the test results as reported in Table One.
COMPARATIVE EXAMPLE 1
A commercial solution of Nylon 66 was coated over a polyester wire enamel, namely, ISONEL 200. The resulting magnet wire exhibited the properties shown in Table One.
COMPARATIVE EXAMPLE 2
A solution of Nylon 11 was prepared in accordance with U.S. Pat. No. 4,216,263 by Otis. The viscosity of this solution was approximately Z5 1/2 on the Gardner-Holdt Scale at 25° C. The percent non-volatiles of the solution was determined to be 16.1 percent by baking a two-gram sample for two hours at 200° C. This enamel solution was coated over a polyester-imide of the ISOMID type on AWG-24 copper wire. The electrical and bonding test results are shown in Table One.
COMPARATIVE EXAMPLE 3
A solution of Nylon 11 was prepared in accordance with U.S. Pat. No. 4,216,263 by Otis. The viscosity of the solution was approximately Z2 3/4 on the Gardner-Holdt Scale at 25° C. at approximately 16.1 percent non-volatiles determined as in Example One. This enamel was coated over a polyesterimide wire coating, namely ISOMID on 18-AWG copper wire. The test results are shown on Table One. A comparison of the bond strength of this example to the preferred composition of this disclosure as described by Example One is shown on Graph Number Two.
COMPARATIVE EXAMPLE 4
A solution of Nylon 11 was prepared in accordance with U.S. Pat. No. 4,216,263 Otis. The viscosity of this solution was approximately Z3 1/2 on the Gardner-Holdt Scale at 25° C. The percent non-volatiles determined as in Example One were 16.8 percent. This enamel was coated over a polyester wire coating, namely ISONEL 200 on 18-AWG copper wire. The electrical and bonding test results are as shown in Table One.
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Abbreviation Key for Table 1                                              
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F.O.M.      Figure of Merit                                               
Hrs.        Hours                                                         
FPM         Feet per Minute                                               
VPM         Volts per Mil                                                 
Base Coat:                                                                
PE          Polyester of the ISONEL ® 200 type                        
PEI         Polyester-imide of the ISOMID ® type                      
PAI         Aromatic polyamide-imide                                      
PAI/PE      Polyamide imide based upon                                    
            4,4' methylene diphenyl diisocyanate                          
            and trimellitic anhydride over-                               
            coated over a polyester of the                                
            ISONEL ® 200 type                                         
None        Indicates the bond coat was applied                           
            in eight passes to obtain a three-                            
            mil build                                                     
Build       total increase in the wire diameter                           
            as a result of the coating.                                   
Wire Size   All AWG sizes                                                 
Speed       The rate the wire traveled as it                              
            was coated in multiple passes and baked                       
            in a 15-foot, gas-fired oven. -Appearance:                    
G           Indicates good or smooth surface.                             
VSW         Indicates smooth surface with a                               
            very slight wave.                                             
SW          Indicates minor flaws in the coating                          
            surface                                                       
Heavy Grain Indicates a rough surface without                             
            blisters                                                      
Rough       Is an indication the coating is                               
            unacceptable as it may contain                                
            blisters, or a very heavy grain,                              
            or an extreme wave.                                           
(+)         Indicates slightly better than given                          
            rating                                                        
(-)         Indicates slightly worse than given                           
            rating                                                        
Snap        Measured in accordance with NEMA                              
            Standards Publication Part 3,                                 
            paragraph 3.1.1.                                              
Mandrel After Snap                                                        
            Smallest mandrel around which wire                            
            which has been "snapped" as above can                         
            be wound without exhibiting surface                           
            cracks.                                                       
Abrasion    Measured in accordance with NEMA                              
Unilateral  Standard Publication Part 3,                                  
Scrape      paragraph 59.1.1.                                             
Windability 1500 volts are passed through a                               
            six foot long wire sample which is                            
            wrapped around a specified mandrel.                           
            The mandrel moves along the wire                              
            at fixed rate elongating and                                  
            abrading the wire. Failure is                                 
            described when three shorts occur                             
            along the surface of the sample.                              
Cut Through Measured in accordance with NEMA                              
            Standards Publication Part 3,                                 
            paragraph 50.1.1.2.                                           
Heat Shock  Tested in accordance with NEMA                                
            Standards Publication, Part 3,                                
            paragraph 4.1.1.                                              
Burn Out    Tested in accordance with NEMA                                
            Standards Publication, Part 3,                                
            paragraph 53.1.1.4. F.O.M. is                                 
            Figure of Merit calculated as                                 
            described in NEMA Standards                                   
            Publication, Part 3, paragraph                                
            53.1.1.3.                                                     
A. O. Smith A five-foot sample of wire is                                 
Freon Blister                                                             
            wound into a coil which produces                              
Test        four to six percent stretch, baked for                        
            two hours at 150° C., then cooled                      
            to room temperature. The samples                              
            are then placed in a freon bomb                               
            charged with Freon 22 ® and the                           
            pressure in the bomb is brought up                            
            to 600 pounds per square inch by                              
            heating and held six hours. After                             
            the six-hour hold, the pressure is                            
            immediately released and coils are                            
            placed in an oven at 150° C. for                       
            four hours. The coils are then                                
            removed from the oven and checked                             
            for blistering. One large blister,                            
            or two medium, or five small blister                          
            constitutes a failure. The wire is                            
            then wrapped around a five times                              
            mandrel for ten turns and checked                             
            for cracks or peeling. If the                                 
            coating cracks or peels, it is                                
            a failure. Finally, the wire is                               
            made into a twisted pair and                                  
            dielectrics are determined in                                 
            accordance with NEMA Standards                                
            Publication, Part 3, paragraph                                
            7.1.1.3.                                                      
Dielectrics:                                                              
Dry         Determined in accordance with NEMA                            
            Standards Publication, Part 3,                                
            paragraph 7.1.1.3.                                            
Wet         After soaking in water for 24 hours,                          
            the samples are tested as described                           
            above.                                                        
Bonding     Determined following the procedure                            
            described in NEMA Standards Publication                       
            Part 3, paragraph 57.1.1.2. at the                            
            temperature stated under Bonding                              
            Temperature.                                                  
Dissipation Factor                                                        
            Tested in accordance with NEMA                                
            Standards Publication, Part 3,                                
            Paragraph 9.1.1.2.                                            
Heat Aging  Number of hours up to 168 (at 180° C.)                 
at 180° C.                                                         
            required for a sample to be baked                             
            to fail a post winding of around a                            
            one times mandrel.                                            
______________________________________                                    

TABLE 1
  Exam- Exam- Exam- Exam- Exam- Exam- Exam- Exam- ple ple ple ple ple ple
 ple ple 1 2 3 4 5 6 7 8
         PAI/ Basecoat PE PEI PE PEI PEI PEI PE PAI None None PEI PEI PEI P
 EI PEI PEI Build (mils) bondcoat/basecoat 1.0/2.0 1.0/2.0 1.0/2.1
 0.9/1.9 1.0/2.0 1.0/2.0 1.1/ 1.0/2.0   1.0/2.0 1.0/2.0 1.0/2.0 1.0/2.0
 1.0/2.0 1.0/2.1        0.7/2.3 Wire Size (AWG) 18 18 18 24 24 24 18 18
 18 18 18 18 18 18 18 18 Wire Speed (fpm) 50 50 50 100 120 130 50 50 40
 50 50 50 50 50 50 50 Appearance, bondcoat/basecoat VSW/ VSW/ VSW/ VSW/
 VSW/ VSW-/ VSW/ VSW/   VSW/ VSW/ VSW/ VSW/ VSW/ VSW-/  VSW VSW VSW+ VSW
 VSW VSW VSW/ VSW   VSW VSW VSW VSW VSW VSW        VSW MECHANICAL
 PROPERTIES Mandrel, before snap 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X
 1X 1X 1X Snap (OK or Fail) OK OK OK OK OK OK OK OK OK OK OK OK OK OK OK
 OK Mandrel, after snap 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X
 Abrasion (gms.) 2000+ 2000+ 1933 1000+ 1000+ 1000+ 2000+ 1816 2000+
 2000+ 1883 1866 1800 1950 2000+ 1933 Windability 25 20     17 14 Helical
 Coil Bonding; Bond Temp., °C. 200 200  200 200 200 200 200 200
 200 200 200 200 200 200 200 Bond Str., lbs. @ 25° C. 10.63 16.09
 6.6 9.7 9.2 19.80 18.65  --  -- 21.7 0.4 1.0 2.9 16.2 12.5 150°
 C. 6.40 10.88  4.9 5.2 5.6  --  --  --  -- 10.9 0.0 1.0 2.0 8.0 5.2
 180° C. 3.52 5.87  1.7 0.9 0.8 4.3 3.43 7.4 3.68 6.2 0.0 0.0 1.4
 4.7 1.5 200° C. 2.09 2.64  0.4 0.4 0.2   --  --  --  -- 3.2 0.0
 0.0 1.4 2.2 1.1 THERMAL PROPERTIES Cut Through Temp., °C. 365 340
 355 342 318 316 385 325 280 260 Heat Shock, 1X 50 80 70 80 60 70 80 70
 80 80 (1/2 Hr. at test, 2X 80 90 80 90 80 80 90 90 90 90 temp., 20%, 3X
 100 100 100 100 100 100 100 100 100 100 pre-stretch), 4X 100 100 100 100
 100 100 100 100 100 100 Heat Shock Test Temp., °C. 175 200 175
 200 200 200 260 260 260 260 Burnout (F.O.M.) 5.4 6.67      8.51 2.46
 1.13 Heat Aging (hrs.) 168-OK ELECTRICAL PROPERTIES Dielectric Strength,
 dry 14.6 15.6     15.9 11.5 (vpm), wet 11.1 11.1     14.5 11.2 Dissipatio
 n Factor 11.5 4.92  3.34 3.16 5.45 28.72 22.26 453.0 1874.0 CHEMICAL
 PROPERTIES A. O. Smith Freon Test; appearance/flexibility Fail OK/OK
 dielectric after test (VPM)
   Compara- Compara- Compara- Compara- tive tive tive tive Exam- Exam-
 Exam- Exam- Exam- Exam- Exam-  Exam- Exam- Exam- Exam- ple ple ple ple
 ple ple ple ple ple ple ple 9 10 11 12 13 14 15 1 2 3 4
   Basecoat PEI PEI PEI PEI PEI PEI PEI PE PEI PEI PEI PE Build (mils)
 bondcoat/basecoat 1.0/2.0 1.0/2.0 1.0/2.0 1.0/2.1 1.0/2.1 1.0/2.1
 1.0/2.1 1.0/2.0 1.0/2.0 1.0/2.0 1.0/2.1 1.0/2.0 Wire Size (AWG) 18 18 18
 18 18 18 18 18 18 24 18 18 Wire Speed (fpm) 50 50 50 50 50 50 50 50 50
 90 50 50 Appearance, bondcoat/basecoat Wavy/ VSW/ VSW/ VSW-/ SW/ Hvy.
 Grain/ Hvy. Grain/ VSW-/ VSW-/ SW/ VSW-/ SW/  VSW VSW VSW+ VSW VSW VSW
 VSW VSW VSW VSW VSW VSW MECHANICAL PROPERTIES Mandrel, before snap  1X
 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X Snap (OK or Fail) Fail OK OK OK OK OK OK
 OK OK OK OK OK Mandrel, after snap  -- 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X 1X
 Abrasion (gms.)  -- 1833 1808 1708 1950 2000+ 2000+ 2000+  1916 1000+
 1750 1608 Windability Helical Coil Bonding; Bond Temp., °C. 200
 200 200 200 200 200 200 200 200 200 200 200 Bond Str., lbs. @ 25°
 C.  --  --  --  --  --  --  -- 0.0 0.0 4.7 22.4 21.7 150° C.  --
 --  --  --  --  --  --  --  -- 0.8 11.0 180° C. 0.4 6.2 2.8 1.25
 6.3 5.5 3.6 0.0 0.0 0.2 2.8 200° C.  --  --  --  --  --  --  --
 --  --  -- 0.4 THERMAL PROPERTIES Cut Through Temp., °C.
 280 285 334 315 395 Heat Shock, 1X        80 90 50 90 20 (1/2Hr. at
 test, 2X        90 100 70 100 30 Temp., 20%, 3X        100 100 80 100 40
 pre-stretch), 4X        100 100 100 100 40 Heat Shock Test Temp.,
 °C.        175 200 200 175 175 Burnout (F.O.M.)           5.97
 5.46 Heat Aging (hrs.) ELECTRICAL PROPERTIES Dielectric Strength, dry
        11.1 (vpm), wet Dissipation Factor CHEMICAL PROPERTIES A. O.
 Smith Freon Test; appearance/flexibility   OK/OK dielectric after test
 (VPM)
It is critical to use terephthalic acid in copolyamides of the invention. Thus if in place of terephthalic acid there is used isophthalic acid in whole or in part as taught by Onder U.S. Pat. No. 4,072,665, the bond strength is reduced.
Thus there were prepared copolyamides similar to Example 1 replacing the terephthalic acid in whole or in part by isophthalic acid.
COMPARATIVE EXAMPLE 5
The procedure was similar to Example 1 but there were used as reactants a 70/30 molar ratio mixture of toluene diisocyanate and methylene diisocyanate and there was used a 65/25/10 molar mixture of dodecanedioic acid, isophthalic acid and terephthalic acid.
COMPARATIVE EXAMPLE 6
The procedure was the same as in Comparative Example 5 except the dibasic acids employed was 65/35 molar mixture of dodecanedioic acid and isophthalic acid.
Examples 1 and 3 which are within the present invention both employ a 65/35 molar mixture of dodecanedioic acid and terephthalic acid. The bond strength of Comparative Example 5, Comparative Example 6, Example 1, and Example 3 were tested by coating their resultant enamel solutions on top of ISOMID-coated wire at 50 ft./min., followed by bonding at 200° C. for 20 minutes under 1-kg load. The results were as set forth in Table 2:
              TABLE 2                                                     
______________________________________                                    
Test              Bond Strength,                                          
Specimen          Lbs. at 180° C.                                  
______________________________________                                    
Comparative Example 5                                                     
                  4.75                                                    
Comparative Example 6                                                     
                  3.2                                                     
Example 1         5.9                                                     
Example 3         6.2                                                     
______________________________________
It can be seen from Table 2 that the greater the replacement of terephthalic acid by isophthalic acid the greater the reduction in bond strength.

Claims (73)

What is claimed is:
1. A self bondable insulated wire comprising a conductor and an insulating layer of a copolyamide having the recurring unit ##STR4## where AL is the divalent hydrocarbon residue of an unsubstituted aliphatic dicarboxylic acid having at least 6 carbon atoms, R is tolylene, phenylene, ##STR5## where F is O, CH2, or SO2 or is a cycloaliphatic hydrocarbon, Ar is p-phenylene, y is 35 to 80% of the recurring units and z is 65 to 20% of the recurring units.
2. A self-bondable insulated wire according to claim 1 where the conductor is copper.
3. A self-bondable insulated wire according to claim 1 where the copolyamide is directly on the bare wire.
4. A self-bondable insulated wire according to claim 1 where the copolyamide is a topcoat over an insulating basecoat.
5. A self-bondable insulated wire according to claim 4 wherein the basecoat is a polyester, polyester-imide, or an amide-imide.
6. An insulated wire according to claim 1 where y is 35 to 70% of the recurring units.
7. An insulated wire according to claim 6 where y is 40 to 70% of the recurring units.
8. An insulated wire according to claim 7 where y is 60 to 70% of the recurring units.
9. An insulated wire according to claim 8 where y is about 65% of the recurring units.
10. An insulated wire according to claim 1 where R is tolylene, 4,4'-methylene diphenylene or a mixture thereof.
11. An insulated wire according to claim 10 where R has the mole percent ratio of 4-methyl-m-phenylene, 2-methyl-m-phenylene, 4,4'-methylene diphenylene of 40/10/50 to 80/20/0.
12. An insulated wire according to claim 8 where R has the mole percent ratio of 4-methyl-m-phenylene, 2-methyl-m-phenylene, 4,4'-methylene diphenylene of 40/10/50 to 80/20/0.
13. An insulated wire according to claim 1 where AL is (CH2)x where x is 4 to 34.
14. An insulated wire according to claim 13 where y is 35 to 70% of the recurring units.
15. An insulated wire according to claim 14 where y is 40 to 70% of the recurring units.
16. An insulated wire according to claim 15 where y is 60 to 70% of the recurring units.
17. An insulated wire according to claim 16 where y is about 65% of the recurring units.
18. An insulated wire according to claim 17 where R is tolylene, 4,4'-methylene diphenylene or a mixture thereof.
19. An insulated wire according to claim 18 where R has the mole percent ratio of 4-methyl-m-phenylene, 2-methyl-m-phenylene, 4,4'-methylene diphenylene of 40/10/50 to 80/20/0.
20. An insulated wire according to claim 16 where R has the mole percent ratio of 4-methyl-m-phenylene, 2-methyl-m-phenylene, 4,4'-methylene diphenylene of 40/10/50 to 80/20/0.
21. An insulated wire according to claim 13 where x is 6 to 12.
22. An insulated wire according to claim 21 where y is 35 to 70% of the recurring units.
23. An insulated wire according to claim 22 where y is 40 to 70% of the recurring units.
24. An insulated wire according to claim 23 where y is 60 to 70% of the recurring units.
25. An insulated wire according to claim 24 where y is about 65% of the recurring units.
26. An insulated wire according to claim 25 where R is tolylene, 4,4'-methylene diphenylene or a mixture thereof.
27. An insulated wire according to claim 26 where R has the mole percent ratio of 4-methyl-m-phenylene, 2-methyl-m-phenylene, 4,4'-methylene diphenylene of 40/10/50 to 80/20/0.
28. An insulated wire according to claim 24 where R has the mole percent ratio of 4-methyl-m-phenylene, 2-methyl-m-phenylene, 4,4'-methylene diphenylene of 40/10/50 to 80/20/0.
29. An insulated wire according to claim 21 where x is 10.
30. An insulated wire according to claim 29 where y is 35 to 70% of the recurring units.
31. An insulated wire according to claim 30 where y is 40 to 70% of the recurring units.
32. An insulated wire according to claim 31 where y is 60 to 70% of the recurring units.
33. An insulated wire according to claim 32 where y is about 65% of the recurring units.
34. An insulated wire according to claim 33 where R is tolylene, 4,4'-methylene diphenylene or a mixture thereof.
35. An insulated wire according to claim 34 where R has the mole percent ratio of 4-methyl-m-phenylene, 2-methyl-m-phenylene, 4,4'-methylene diphenylene of 40/10/50 to 80/20/0.
36. An insulated wire according to claim 32 where R has the mole percent ratio of 4-methyl-m-phenylene, 2-methyl-m-phenylene, 4,4'-methylene diphenylene of 40/10/50 to 80/20/0.
37. A self-bondable insulated wire according to claim 6 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
38. A self-bondable insulated wire according to claim 7 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
39. A self-bondable insulated wire according to claim 8 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
40. A self-bondable insulated wire according to claim 9 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
41. A self-bondable insulated wire according to claim 10 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
42. A self-bondable insulated wire according to claim 11 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
43. A self-bondable insulated wire according to claim 12 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
44. A self-bondable insulated wire according to claim 13 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
45. A self-bondable insulated wire according to claim 14 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
46. A self-bondable insulated wire according to claim 15 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
47. A self-bondable insulated wire according to claim 16 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
48. A self-bondable insulated wire according to claim 17 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
49. A self-bondable insulated wire according to claim 18 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
50. A self-bondable insulated wire according to claim 19 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
51. A self-bondable insulated wire according to claim 20 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
52. A self-bondable insulated wire according to claim 21 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
53. A self-bondable insulated wire according to claim 22 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
54. A self-bondable insulated wire according to claim 23 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
55. A self-bondable insulated wire according to claim 24 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
56. A self-bondable insulated wire according to claim 25 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
57. A self-bondable insulated wire according to claim 26 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
58. A self-bondable insulated wire according to claim 27 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
59. A self-bondable insulated wire according to claim 28 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
60. A self-bondable insulated wire according to claim 29 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
61. A self-bondable insulated wire according to claim 30 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
62. A self-bondable insulated wire according to claim 31 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
63. A self-bondable insulated wire according to claim 32 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
64. A self-bondable insulted wire according to claim 33 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
65. A self-bondable insulated wire according to claim 34 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
66. A self-bondable insulated wire according to claim 35 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
67. A self-bondable insulated wire according to claim 36 comprising the copolyamide as a topcoat over an insulating basecoat which is a polyester, polyester-imide, or an amide-imide.
68. A self-bondable insulated wire according to claim 67 wherein the basecoat is a polyester of tris(2-hydroxyethyl)isocyanurate, ethylene glycol, and terephthalic acid.
69. A self-bondable insulated wire according to claim 67 wherein the basecoat is a polyester-imide made of tris(2-hydroxyethyl) isocyanurate, ethylene glycol, terephthalic acid, methylene dianiline or methylene diphenyl diisocyanate, and trimellitic anhydride.
70. A self-bondable insulated wire coating to claim 67 wherein the basecoat is a polyamide-imide made of trimellitic anhydride and methylene diphenyl diisocyanate or methylenedianiline.
71. A self-bondable insulated wire according to claim 67 wherein the basecoat is a polyester of tris(2-hydroxyethyl isocyanurate, ethylene glycol and terephthalic acid overcoated with a polyamide-imide.
72. A self-bondable insulated wire according to claim 1 which is film wrapped wire and the bondable copolyamide is a coating over the film.
73. An insulated wire according to claim 1 where the copolyamide has the recurring unit ##STR6## where AL is the divalent hydrocarbon residue of an unsubstituted aliphatic dicarboxylic acid having at least 6 carbon atoms, R is tolylene, phenylene or ##STR7## where F is O, CH2, or SO2, Ar is p-phenylene, y is 35 to 80% of the recurring units and z is 65 to 20% of the recurring units.
US06/311,385 1981-10-14 1981-10-14 Bondable polyamide Expired - Lifetime US4420535A (en)

Priority Applications (10)

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US06/311,385 US4420535A (en) 1981-10-14 1981-10-14 Bondable polyamide
AU89236/82A AU8923682A (en) 1981-10-14 1982-10-08 Aromatic-aliphatic-polyamide
ZA827382A ZA827382B (en) 1981-10-14 1982-10-08 Bondable polyamides
CA000413202A CA1211248A (en) 1981-10-14 1982-10-12 Bondable polyamides
JP57179203A JPS5896620A (en) 1981-10-14 1982-10-14 Melt adhesive polyamide
GB08229405A GB2108982B (en) 1981-10-14 1982-10-14 Bondable polymides
US06/514,035 US4501883A (en) 1981-10-14 1983-07-15 Bondable polyamide
US06/557,964 US4461805A (en) 1981-10-14 1983-12-05 Bondable polyamide
JP61173960A JPS6211777A (en) 1981-10-14 1986-07-25 Self-meltable insulating wire
AU77699/87A AU614721B2 (en) 1981-10-14 1987-08-28 Bondable polyamides

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US5206381A (en) * 1989-08-07 1993-04-27 Westinghouse Electric Corp. Ultraviolet radiation curable polyamideimide oligomers
US5219658A (en) * 1988-11-24 1993-06-15 Sumitomo Electric Industries, Ltd. Self-bonding insulated wire and coils formed therefrom
US5554443A (en) * 1990-03-20 1996-09-10 Texas Instruments Incorporated Bonding wire with heat and abrasion resistant coating layers
US5606152A (en) * 1992-10-28 1997-02-25 The Furukawa Electric Co., Ltd. Multilayer insulated wire and a manufacturing method therefor
US5750257A (en) * 1995-06-29 1998-05-12 Optec Dai-Itchi Denko Co., Ltd. Insulated electric wire
US5786086A (en) * 1996-01-02 1998-07-28 Union Camp Corporation Conductive wire coating
DE19951709A1 (en) * 1999-10-27 2001-05-03 Alcatel Sa Electrical conductor with a rectangular or quadratic cross section
US6680120B1 (en) * 1999-01-27 2004-01-20 Nexans Baked enamel
US20110227691A1 (en) * 2008-10-20 2011-09-22 Hideo Fukuda Multilayer insulated electric wire and transformer using the same
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US4072665A (en) * 1976-03-08 1978-02-07 The Upjohn Company Polyamide from arylene diamine, isophthalic acid and alkylene dicarboxylic acid
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US4163826A (en) * 1977-02-28 1979-08-07 Sumitomo Electric Industries, Ltd. Self-bonding magnet wires and coils made therefrom
US4238603A (en) * 1977-05-19 1980-12-09 Monsanto Company Polyamides derived from hexamethylene diamine, terephthalic acid, isophthalic acid and a C5 to C10 aliphatic dibasic acid
US4216263A (en) * 1979-05-04 1980-08-05 Rea Magnet Wire Co., Inc. Magnet wire

Cited By (19)

* Cited by examiner, † Cited by third party
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US4505978A (en) * 1982-09-28 1985-03-19 Schenectady Chemicals, Inc. Bondable polyamide
US4743413A (en) * 1986-07-23 1988-05-10 Galichon Jean P Method of manufacturing thermostable pieces made from composite materials and the pieces thus obtained
US4876316A (en) * 1987-07-27 1989-10-24 Essex Group, Inc. High temperature magnet wire bond coat polyamide/aldehyde/aromatic alcohol reaction product
US5219658A (en) * 1988-11-24 1993-06-15 Sumitomo Electric Industries, Ltd. Self-bonding insulated wire and coils formed therefrom
US5059660A (en) * 1989-05-26 1991-10-22 Basf Aktiengesellschaft Self-bonding enamel solution for heat-resistant coatings
US5206381A (en) * 1989-08-07 1993-04-27 Westinghouse Electric Corp. Ultraviolet radiation curable polyamideimide oligomers
US5554443A (en) * 1990-03-20 1996-09-10 Texas Instruments Incorporated Bonding wire with heat and abrasion resistant coating layers
US5202187A (en) * 1990-04-12 1993-04-13 E. I. Du Pont De Nemours And Company Coated wire
US5606152A (en) * 1992-10-28 1997-02-25 The Furukawa Electric Co., Ltd. Multilayer insulated wire and a manufacturing method therefor
US5750257A (en) * 1995-06-29 1998-05-12 Optec Dai-Itchi Denko Co., Ltd. Insulated electric wire
US5786086A (en) * 1996-01-02 1998-07-28 Union Camp Corporation Conductive wire coating
US6680120B1 (en) * 1999-01-27 2004-01-20 Nexans Baked enamel
DE19951709A1 (en) * 1999-10-27 2001-05-03 Alcatel Sa Electrical conductor with a rectangular or quadratic cross section
US20110227691A1 (en) * 2008-10-20 2011-09-22 Hideo Fukuda Multilayer insulated electric wire and transformer using the same
US8188370B2 (en) * 2008-10-20 2012-05-29 Furukawa Electric Co., Ltd. Multilayer insulated electric wire and transformer using the same
CN107428146A (en) * 2015-03-31 2017-12-01 株式会社钟化 Polyimides is laminated the manufacture method of film, the manufacture method of polyimides stacking film, the manufacture method of TPI and flexible metal clad laminate stack
US10798826B2 (en) 2015-03-31 2020-10-06 Kaneka Corporation Polyimide laminate film, method for manufacturing polyimide laminate film, method for manufacturing thermoplastic polyimide, and method for manufacturing flexible metal-clad laminate
CN108353494A (en) * 2015-11-13 2018-07-31 舍弗勒技术股份两合公司 Multilayer circuit board with printed coils and method for producing same
US20180317313A1 (en) * 2015-11-13 2018-11-01 Schaeffler Technologies AG & Co. KG Multi-layer printed circuit board having a printed coil and method for the production thereof

Also Published As

Publication number Publication date
AU7769987A (en) 1987-12-24
JPH0137425B2 (en) 1989-08-07
JPS6240365B2 (en) 1987-08-27
ZA827382B (en) 1983-11-30
AU614721B2 (en) 1991-09-12
JPS6211777A (en) 1987-01-20
JPS5896620A (en) 1983-06-08

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