US4386021A - Voltage-dependent resistor and method of making the same - Google Patents
Voltage-dependent resistor and method of making the same Download PDFInfo
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- US4386021A US4386021A US06/210,394 US21039480A US4386021A US 4386021 A US4386021 A US 4386021A US 21039480 A US21039480 A US 21039480A US 4386021 A US4386021 A US 4386021A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
- H01C7/108—Metal oxide
- H01C7/112—ZnO type
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49101—Applying terminal
Definitions
- This invention relates to a voltage-dependent resistor (varistor) having non-ohmic properties (voltage-dependent property) due to the bulk thereof and a process for making it.
- This invention relates more particularly to a voltage-dependent resistor, which is suitable for a lightning arrester and a surge absorber.
- V is the voltage across the resistor
- I is the current flowing through the resistor
- C is a constant corresponding to the voltage at a given current
- exponent n is a numerical value greater than 1.
- the value of n is calculated by the following equation: ##EQU2## where V 1 and V 2 are the voltage at given currents I 1 and I 2 , respectively. Usually I 1 is 0.1 mA and I 2 is 1 mA.
- the desired volue of C depends upon the kind of application to which the resistor is to be put.
- C value is expressed by the voltage at 1 mA per mm. It is ordinarily desirable that the value of C is between several scores of volts and several hundreds volts.
- the value of n is desired to be as large as possible because this exponent determines the extent to which the resistors depart from ohmic characteristics.
- n-value defined by I 1 , I 2 , V 1 and V 2 as shown in equation (2) is expressed by 1 n 2 for distinguishing from n-value calculated by other currents or voltages.
- the residual (clamp) voltage ratio (which is expressed by the ratio of the voltage at xA (V xA ) and the voltage at 1 mA (V 1 mA); V xA /V 1 mA) be small since this ratio determines the ability to protect the equipment and components in electrical circuits against surges.
- x is 100
- the residual voltage ratio is evaluated by V 100 A /V 1 mA.
- the change rate of C-value after impulse application be as close to zero as possible. This characteristic is called surge withstand capability and is usually expressed by the change rate of C value after two applications of impulse current of 1000 A whose wave form is 8 ⁇ 20 ⁇ s.
- silicon carbide varistors and zinc oxide voltage-dependent resistors are known.
- the silicon carbide varistors have nonlinearity due to the contacts among the individual grains of silicon carbide bonded together by a ceramic binding material, i.e. to the bulk, and the C-value is controlled by changing a dimension in the direction in which the current flows through the varistors.
- the silicon carbide varistors have good surge withstand capability thus rendering them suitable e.g. as surge absorbers and as characteristic elements of lightning arresters.
- the characteristic elements are used usually by connecting them in series with discharging gaps and determine the level of the discharging voltage and the follow current.
- the silicon carbide varistors have a relatively low n-value ranging from 3 to 7 which results in a poor suppression of lightning surge or increase in the follow current.
- Another defect of the arrester with a discharging gap is slow response to surge voltage and a very short rise time such as below 1 ⁇ s. It is desirable for the arrester to suppress the lightning surge and the follow current to a level as low as possible and respond to surge voltage instantaneously.
- the silicon carbide varistors however, have a relatively low n-value ranging from 3 to 7 which results in poor surge suppression.
- These zinc oxide voltage-dependent resistors of the bulk type contain, as additives, one or more combinations of oxides or fluorides of bismuth, cobalt, manganese, barium, boron, berylium, magnesium, calcium, strontium, titanium, antimony, germanium, chromium and nickel, and the C-value is controlled by changing, mainly, the compositions of said sintered body and the distance between electrodes and they have excellent voltage-dependent properties in n-value.
- the lightning arresters In Japan, they usually have 10 to 30 thunderstorm days a year, though it depends on district. On those days, the lightning arresters are subjected to lightning surges. If the number of lightning surges are assumed to be about 10 per thunderstorm day, the lightning arresters must be subjected to 100 to 300 lightning surges a year. The lightning arresters are usually used for more than 20 years, so that they must withstand at least 2000 to 6000 lightning surges with the voltage stress of 60 kV for 20 years. The average impulse current flowing through the zince oxide voltage-dependent resistors in the lightning arresters is about 100 A (in the waveform of 8 ⁇ 20 ⁇ s).
- the zinc oxide voltage-dependent resistor in the lightning arresters without series discharging gaps must have thermal run away life of more than 20 years under the continuous voltage stress of 60 kV with 2000 to 6000 lightning surges of 100 A of the waveform of 8 ⁇ 20 ⁇ s.
- Conventional zinc oxide voltage-dependent resistors show fairly good surge withstand capability and stability for the change of environment in a separate condition. That is, they show a fairly good surge withstand capability without continuous voltage stress at the same time or they show a fairly good stability against voltage stress for a long term without the shooting of impulse currents at the same time.
- the conventional zinc oxide voltage-dependent resistors do not show a sufficient thermal run away life over a long term under a condition where they have both a voltage stress of 80 to 50 percent of the varistor voltage and 2000 to 6000 surges of impulse currents of 100 A at the same time.
- the development of the voltage-dependent resistors having a sufficient thermal run away life under continuous voltage stress with surges has been required for the application to lightning arresters without series discharging gaps.
- An object of the present invention is to provide a voltage-dependent resistor, and a method for making it, having a high n-value, a low residual voltage ratio, a good surge withstand capability and a long thermal run away life under continuous voltage stress with surges.
- the characteristics of high n-value, low residual voltage ratio and good surge withstand capability is indispensable for the application of lightning arresters.
- the last one, the long thermal run away life under continuous voltage stress with surges, is one of the most important characteristics which should be improved for that application.
- FIGURE is a cross-sectional view of a voltage-dependent resistor in accordance with this invention.
- reference numeral 10 designates, as whole, a voltage-dependent resistor comprising, as its active element, a sintered body having a pair of electrodes 2 and 3 in an ohmic contact with two opposite surfaces thereof.
- the sintered body 1 is prepared in a manner hereinafter set forth and is in any form such as circular, square of rectangular plate form.
- This invention also provides a process for making a bulk-type voltage-dependent resistor comprising a sintered body consisting essentially of, as a major part, zinc oxide (ZnO), and additives, and having electrodes to the opposite surfaces of said sintered body, characterized by a high n-value, a low residual voltage ratio, a good surge withstand capability and especially a long thermal run away life under continuous voltage stress with surges.
- a sintered body consisting essentially of, as a major part, zinc oxide (ZnO), and additives
- a voltage-dependent resistor comprising a sintered body of a composition which comprises, as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi 2 O 3 ), 0.1 to 3 mole percent of cobalt oxide (Co 2 O 3 ), 0.1 to 3 mole percent of manganese oxide (MnO 2 ), 0.1 to 3.0 mole percent of antimony oxide (Sb 2 O 3 ), 0.05 to 1.5 mole percent of chromium oxide (Cr 2 O 3 ), at least one member selected from the group consisting of 0.1 to 10 mole percent of silicon oxide (SiO 2 ) and 0.1 to 3 mole percent of nickel oxide (NiO), at least one member selected from the group consisting of 0.0005 to 0.025 mole percent of aluminum oxide (Al 2 O 3 ) and 0.005 to 0.025 mole percent of gallium oxide (Ga 2 O 3 ), and 0.005 to 0.3 mole percent of boron oxide (B 2 O 3 ),
- a voltage-dependent resistor has a high n-value, a small residual voltage ratio, a good surge withstand capability and a long thermal run away life under continuous voltage stress with surges.
- the n-value and the thermal run away life under continuous voltage stress with surges are improved by adding as additives the entire amount of boron oxide and silver oxide and a part of the cobalt oxide and silicon oxide in glass frit form.
- Zinc oxide and additives as shown in Tables 1 and 2 were mixed in a wet will for 24 hours. Each of the mixtures was dried and pressed in a mold disc of 17.5 mm in diameter and 2 mm in thickness at a pressure of 250 kg/cm 2 . The pressed bodies were sintered in air at 1230° C. for 2 hours, and then furnace-cooled to room temperature. Each sintered body was lapped at the opposite surfaces thereof into the thickness of 1.5 mm by silicon carbide abrasive in particle size of 30 ⁇ m in mean diameter. The opposite surfaces of the sintered body were provided with spray metallized films of aluminum by a per se well known technique.
- Tables 1 and 2 show that C-values of unit thickness (1 mm), n-values defined between 0.1 mA and 1 mA according to the equation (2), residual voltage ratios of V 100 A to V 1 mA, change rates of C-values after the impulse test and thermal run away lives under continuous voltage stress with surges.
- the voltage at 100 A (V 100 A) is measured by using a waveform expressed by 8 ⁇ 20 ⁇ s.
- the change rate against surge is evaluated measuring the change rate of C-value of the voltage-dependent resistor after applying 2 impulse currants of 1000 A whose waveform is expressed by 8 ⁇ 20 ⁇ s.
- the thermal run away life was evaluated by the time until a thermal run away occurs under conditions such that both the AC voltage (60 Hz) whose amplitude is 80 percent of C-value and the impulse current of 100 A, 8 ⁇ 20 ⁇ s are applied at the same time at a constant temperature of 100° C.
- Tables 3 and 4 show that an n-value above 40, a residual voltage ratio velow 1.60, a surge withstand capability below -5.0 percent, a thermal run away life under voltage stress with surges more than 50 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi 2 O 3 ), 0.1 to 3.0 mole percent of cobalt oxide (Co 2 O 3 ), 0.1 to 3.0 mole percent of manganese oxide (MnO 2 ), 0.1 to 3.0 mole percent of antimony oxide (Sb 2 O 3 ), 0.05 to 1.5 mole percent of chromium oxide (Cr 2 O 3 ), 0.005 to 0.3 mole percent of boron oxide (B 2 O 3 ), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al 2 O 3 ) and 0.0005 to 0.025 mole percent of gallium oxide (Ga
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 3 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 4 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 4 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 20 hours.
- Table 4 shows that the n-value is improved from above 40 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 50 to more than 70 hours by adding as an additive, the entire amount of boron oxide (B 2 O 3 ) in the form of borosilicate glass.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 5 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 6 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse test and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 6 shows an improvement of the n-value of more than 20 and an improvement in the thermal run away life of more than 30 hours.
- Table 6 shows that the thermal run away life under voltage stress with surges is improved from more than 50 to more than 80 hours by adding as additives, the entire amount of boron oxide (B 2 O 3 ) and a part of bismuth oxide (Bi 2 O 3 ) in the form of borosilicate bismuth glass.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 7 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 8 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 8 shows an improvement of the n-value of more than 20 and an improvement in the thermal run away life of more than 30 hours.
- Table 8 shows that the n-value is improved from above 40 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 50 to more than 80 by adding as additives, the entire amount of boron oxide (B 2 O 3 ), a part of bismuth oxide (Bi 2 O 3 ) and a part of cobalt oxide (Co 2 O 3 ) in the form of borosilicate bismuth glass with cobalt oxide.
- Zinc oxide and additives of Table 9 and 10 were fabricated into voltage-dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Tables 9 and 10 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are shown.
- Tables 9 and 10 show that an n-value above 50, a residual voltage ratio below 1.60, a surge withstand capability below -5.0 percent, a thermal run away life under voltage stress with surges of more than 100 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi 2 O 3 ), 0.1 to 3.0 mole percent of cobalt oxide (Co 2 O 3 ), 0.1 to 3.0 mole percent of manganese oxide (MnO 2 ), 0.1 to 3.0 mole percent of antimony oxide (Sb 2 O 3 ), 0.05 to 1.5 mole percent of chromium oxide (Cr 2 O 3 ), 0.005 to 0.3 mole percent of boron oxide (B 2 O 3 ), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al 2 O 3 ) and 0.0005 to 0.025 mole percent of gallium oxide (Ga 2
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 11 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 12 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges shown.
- Table 12 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 20 hours.
- Table 12 shows that the n-value is improved from above 50 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 120 hours by adding as additives, the entire amount of boron oxide (B 2 O 3 ) and all amount of silver oxide (Ag 2 O), in the form of borosilicate glass with silver oxide.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 13 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 14 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse test and the thermal run away lives under continuous voltage stress with surges.
- Table 14 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 30 hours.
- Table 14 shows that the n-value is improved from above 50 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 130 by adding as additives the entire amount of boron oxide (B 2 O 3 ), the entire amount of silver oxide (Ag 2 O) and a part of bismuth oxide (Bi 2 O 3 ) in the form of borosilicate bismuth glass.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 15 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 16 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 16 shows an improvement of n-value of more than 20 and an improvement in the thermal run away life of more than 30 hours.
- Table 16 shows that the n-value is improved from above 50 to above 70 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 130 by adding as additives the entire amount of boron oxide (B 2 O 3 ), the entire amount of silver oxide (Ag 2 O), a part of the bismuth oxide (Bi 2 O 3 ) and a part of the cobalt oxide (Co 2 O 3 ) in the form of borosilicate bismuth glass with silver oxide and cobalt oxide.
- Zinc oxide and additives of Table 17 and 18 were fabricated into voltage-dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Tables 17 and 18 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are shown.
- Tables 17 and 18 show that an n-value above 30, a residual voltage ratio below 1.70, a surge withstand capability below -4.0 percent, a thermal run away life under voltage stress with surges of more than 50 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi 2 O 3 ), 0.1 to 3.0 mole percent of cobalt oxide (Co 2 O 3 ), 0.1 to 3.0 mole percent of manganese oxide (MnO 2 ), 0.1 to 3.0 mole percent of antimony oxide (Sb 2 O 3 ), 0.05 to 1.5 mole percent of chromium oxide (Cr 2 O 3 ), 0.005 to 0.03 mole percent of boron oxide (B 2 O 3 ), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al 2 O 3 ) and 0.0005 to 0.025 mole percent of gallium oxide (Ga 2 O
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 17 and 18 glass frits whose composition is shown in Table 3 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 19 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 19 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 20 hours.
- Table 19 shows that the n-value is improved from above 30 to above 40 and the thermal run away life under voltage stress with surges is improved from more than 50 to more than 70 by adding as additives, the entire amount of boron oxide (B 2 O 3 ), in the form of borosilicate glass.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 17 and 18 and glass frits whose composition is shown in Table 5 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 20 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 20 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 30 hours.
- Table 20 shows that the n-value is improved from above 30 to above 40 and the thermal run away life under voltage stress with surges is improved from more than 50 to more than 80 hours by adding as additives, the entire amount of boron oxide (B 2 O 3 ), and a part of the bismuth oxide (Bi 2 O 3 ) in the form of borosilicate bismuth glass.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 17 and 18 and glass frits whose composition is shown in Table 9 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 21 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 21 shows an improvement of the n-value of more than 20 and in the thermal run away life of more than 30 hours.
- Table 21 shows that the n-value is improved from above 30 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 50 to more than 80 hours by adding as additives the entire amount of boron oxide (B 2 O 3 ), the entire amount of silver oxide (Ag 2 O), a part of the bismuth oxide (Bi 2 O 3 ) and a part of the cobalt oxide (Co 2 O 3 ) in the form of borosilicate bismuth glass with cobalt oxide.
- Zinc oxide and additives of Table 22 and 23 were fabricated into voltage-dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Tables 22 and 23 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are shown.
- Tables 22 and 23 show that an n-value above 40, a residual voltage ratio below 1.70, a surge withstand capability below -4.0 percent, and a thermal run away life under voltage stress with surges more than 100 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi 2 O 3 ), 0.1 to 3.0 mole percent of cobalt oxide (Co 2 O 3 ), 0.1 to 3.0 mole percent of manganese oxide (MnO 2 ), 0.1 to 3.0 mole percent of antimony oxide (Sb 2 O 3 ), 0.05 to 1.5 mole percent of chromium oxide (Cr 2 O 3 ), 0.005 to 0.3 mole percent of boron oxide (B 2 O 3 ), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al 2 O 3 ) and 0.0005 to 0.025 mole percent of gallium oxide (Ga 2
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 17 and 18 and glass frits whose composition is shown in Table 11 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 24 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges.
- Table 24 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life more than 20 hours.
- the n-value is improved from above 40 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 120 hours by adding as additives, the entire amount of boron oxide (B 2 O 3 ) and the entire amount of silver oxide (Ag 2 O) in the form of boro-silicate glass with silver oxide.
- Zinc oxide and additives of No. 17 or No. 18 in Table 17 and 18 and glass frits whose composition is shown in Table 13 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 25 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth .
- Table 25 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 30 hours.
- Table 25 shows that the n-value is improved from above 40 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 130 hours by adding as additives, the entire amount of boron oxide (B 2 O 3 ), the entire amount of silver oxide (Ag 2 O), and a part of the bismuth oxide (Bi 2 O 3 ) in the form of borosilicate bismuth glass with silver oxide.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 17 and 18 and glass frits whose composition is shown in Table 15 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 26 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 26 shows an improvement of the n-value of more than 20 and an improvement in the thermal run away life more than 30 hours.
- Table 26 shows that the n-value is improved from above 40 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 130 hours by adding as additives, the entire amount of boron oxide (B 2 O 3 ), the entire amount of silver oxide (Ag 2 O), a part of the bismuth oxide (BiO 3 ) and a part of cobalt oxide (Co 2 O 3 ) in the form of borosilicate glass with silver oxide and cobalt oxide.
- Zinc oxide and additives of Table 27 and 28 were fabricated into voltage-dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Tables 27 and 28 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are shown.
- Tables 27 and 28 show that an n-value above 40, a residual voltage ratio below 1.60 , a surge withstand capability below -3.0 percent, a thermal run away life under voltage stress with surges of more than 150 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi 2 O 3 ), 0.1 to 3.0 mole percent of cobalt oxide (Co 2 O 3 ), 0.1 to 3.0 mole percent of manganese oxide (MnO 2 ), 0.1 to 3.0 mole percent of antimony oxide (Sb 2 O 3 ), 0.05 to 1.5 mole percent of chromium oxide (Cr 2 O 3 ), 0.005 to 0.3 mole percent of boron oxide (B 2 O 3 ), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al 2 O 3 ) and 0.0005 to 0.025 mole percent of gallium oxide (G
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 3 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 29 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 29 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 10 hours.
- Table 29 shows that the n-value is improved from above 40 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 150 to more than 160 hours by adding as additives, the entire amount of boron oxide (B 2 O 3 ), and a part of the silicon oxide (SiO 2 ) in the form of borosilicate glass.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 5 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 30 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 30 shows an improvement of the n-value of more than 10 and improvement in the thermal run away life of more than 20 hours.
- Table 30 shows that the n-value is improved from above 40 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 150 to more than 170 hours by adding as additives, the entire amount of boron oxide (B 2 O 3 ), and a part of the bismuth oxide (Bi 2 O 3 ) in the form of the borosilicate bismuth glass.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 7 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 31 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 31 shows that the improvement of n-value of more than 20 and the improvement of the thermal run away life more than 20 hours.
- Table 31 shows that the n-value is improved from above 40 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 150 to more than 170 by adding the additives of all amount of boron oxide (B 2 O 3 ), a part of bismuth oxide (Bi 2 O 3 ) and a part of cobalt oxide (Co 2 O 3 ) in the form of borosilicate bismuth glass with cobalt oxide.
- B 2 O 3 boron oxide
- Bi 2 O 3 bismuth oxide
- Co 2 O 3 cobalt oxide
- Zinc oxide and additives of Table 32 and 33 were fabricated into voltage-dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Tables 32 and 33 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are shown.
- Tables 32 and 33 show that an n-value above 50, a residual voltage ratio below 1.60, a surge withstand capability below -3.0 percent, a thermal run away life under voltage stress with surges for more than 190 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi 2 O 3 ), 0.1 to 3.0 mole percent of cobalt oxide (Co 2 O 3 ), 0.1 to 3.0 mole percent of manganese oxide (MnO 2 ), 0.1 to 3.0 mole percent of antimony oxide (Sb 2 O 3 ), 0.05 to 1.5 mole percent of chromium oxide (Cr 2 O 3 ), 0.005 to 0.3 mole percent of boron oxide (B 2 O 3 ), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al 2 O 3 ) and 0.0005 to 0.025 mole percent of gallium oxide (G
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 15 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 34 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 34 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life more than 20 hours.
- Table 34 shows that the n-value is improved from above 50 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 190 to more than 210 hours by adding as additives, the entire amount of boron oxide (B 2 O 3 ) and the entire amount of the silver oxide (Ag 2 O) in the form of borosilicate glass with silver oxide.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 13 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 35 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 35 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away of life more than 30 hours.
- Table 35 shows that the n-value is improved from above 50 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 190 to more than 220 by adding as additives, the entire amount of the boron oxide (B 2 O 3 ), the entire amount of the silver oxide (Ag 2 O) and a part of the bismuth oxide (Bi 2 O 3 ) in the form of borosilicate bismuth glass with silver oxide.
- Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 19 were fabricated into voltage dependent resistors by the same process as that of Example 1-1.
- the electrical properties of the resultant resistors are shown in Table 36 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V 100 A to V 1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth.
- Table 36 shows an improvement of n-value of more than 20 and an improvement in the thermal run away life more than 30 hours.
- Table 36 shows that the n-value is improved from above 50 to above 70 and the thermal run away life under voltage stress with surges is improved from more than 190 to more than 220 hours by adding as additives, the entire amount of the boron oxide (B 2 O 3 ), the entire amount of the silver oxide (Ag 2 O), a part of bismuth oxide (Bi 2 O 3 ) and a part of the cobalt oxide (Co 2 O 3 ) in the form of borosilicate bismuth glass with silver oxide and cobalt oxide.
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Abstract
The present invention provides a voltage-dependent resistor of the bulk-type in which zinc oxide (ZnO) powder and additives are admixed to form a sintered body composition having as the main constituent, zinc oxide, and in which the mixture is formed into a resistor body, the body is sintered, and electrodes are applied to the opposite surfaces of the sintered body, the improvement comprising the step of, prior to sintering and admixture with said zinc oxide, admixing all amount of boron oxide (B2 O3) with other additives in the form of a borosilicate glass, which is composed of 5 to 30 weight percent of boron oxide (B2 O3) and 70 to 95 weight percent of silicon oxide (SiO2). A process for the production of said resistor is also provided.
Description
This invention relates to a voltage-dependent resistor (varistor) having non-ohmic properties (voltage-dependent property) due to the bulk thereof and a process for making it. This invention relates more particularly to a voltage-dependent resistor, which is suitable for a lightning arrester and a surge absorber.
Various voltage-dependent resistors have been widely used for suppression of abnormally high surges induced in electrical circuits. The electrical characteristics of such voltage-dependent resistors are expressed by the relation: ##EQU1## where V is the voltage across the resistor, I is the current flowing through the resistor, C is a constant corresponding to the voltage at a given current and exponent n is a numerical value greater than 1. The value of n is calculated by the following equation: ##EQU2## where V1 and V2 are the voltage at given currents I1 and I2, respectively. Usually I1 is 0.1 mA and I2 is 1 mA. The desired volue of C depends upon the kind of application to which the resistor is to be put. Usually C value is expressed by the voltage at 1 mA per mm. It is ordinarily desirable that the value of C is between several scores of volts and several hundreds volts. The value of n is desired to be as large as possible because this exponent determines the extent to which the resistors depart from ohmic characteristics. Conveniently, n-value defined by I1, I2, V1 and V2 as shown in equation (2) is expressed by 1 n2 for distinguishing from n-value calculated by other currents or voltages. For application to a surge absorber and a lightning arrester, it is desirable that the residual (clamp) voltage ratio (which is expressed by the ratio of the voltage at xA (VxA) and the voltage at 1 mA (V1 mA); VxA /V1 mA) be small since this ratio determines the ability to protect the equipment and components in electrical circuits against surges. Usually x is 100, so the residual voltage ratio is evaluated by V100 A /V1 mA. It is also desirable that the change rate of C-value after impulse application be as close to zero as possible. This characteristic is called surge withstand capability and is usually expressed by the change rate of C value after two applications of impulse current of 1000 A whose wave form is 8×20 μs.
As voltage-dependent resistors for a lightning arrester, silicon carbide varistors and zinc oxide voltage-dependent resistors are known. The silicon carbide varistors. have nonlinearity due to the contacts among the individual grains of silicon carbide bonded together by a ceramic binding material, i.e. to the bulk, and the C-value is controlled by changing a dimension in the direction in which the current flows through the varistors. In addition, the silicon carbide varistors have good surge withstand capability thus rendering them suitable e.g. as surge absorbers and as characteristic elements of lightning arresters. The characteristic elements are used usually by connecting them in series with discharging gaps and determine the level of the discharging voltage and the follow current.
However, the silicon carbide varistors have a relatively low n-value ranging from 3 to 7 which results in a poor suppression of lightning surge or increase in the follow current. Another defect of the arrester with a discharging gap is slow response to surge voltage and a very short rise time such as below 1 μs. It is desirable for the arrester to suppress the lightning surge and the follow current to a level as low as possible and respond to surge voltage instantaneously. The silicon carbide varistors, however, have a relatively low n-value ranging from 3 to 7 which results in poor surge suppression.
There have been known, on the other hand, voltage-dependent resistors of the bulk type comprising a sintered body of zinc oxide with additives, as seen in U.S. Pat. Nos. 3,633,458, 3,632,529, 3,634,337, 3,598,763, 3,682,841, 3,642,664, 3,658,725, 3,687,871, 3,723,175, 3,778,743, 3,806,765, 3,811,103, 3,936,396, 3,863,193, 3,872,582 and 3,953,373. These zinc oxide voltage-dependent resistors of the bulk type contain, as additives, one or more combinations of oxides or fluorides of bismuth, cobalt, manganese, barium, boron, berylium, magnesium, calcium, strontium, titanium, antimony, germanium, chromium and nickel, and the C-value is controlled by changing, mainly, the compositions of said sintered body and the distance between electrodes and they have excellent voltage-dependent properties in n-value.
Conventional zinc oxide voltage-dependent resistors have such a large n-value that they were expected to be used without series discharging gaps as characteristic elements in lightning arresters. However, zinc oxide voltage-dependent resistors still have a big problem to be solved in order to be applied to lightning arresters without series discharging gaps. The problem is the thermal run away life under continuous voltage stress, especially with application of surges. This is one of the most important problems to be solved in practice. When a zinc oxide voltage-dependent resistor is applied to the lightning arrester without a series discharging gap, the voltage of the circuit or the distribution line is designed to be in the range from 50 to 80 percent of the varistor voltage (the voltage between electrodes at 1 mA) of the zinc oxide voltage-dependent resistor. Accordingly, the total varistor voltage of zinc oxide voltage-dependent resistors which is connected in series is designed to be in the range from 120 kV to 75 kV for the application to the lightning arrestor in a 60 kV electric power transmission line.
In Japan, they usually have 10 to 30 thunderstorm days a year, though it depends on district. On those days, the lightning arresters are subjected to lightning surges. If the number of lightning surges are assumed to be about 10 per thunderstorm day, the lightning arresters must be subjected to 100 to 300 lightning surges a year. The lightning arresters are usually used for more than 20 years, so that they must withstand at least 2000 to 6000 lightning surges with the voltage stress of 60 kV for 20 years. The average impulse current flowing through the zince oxide voltage-dependent resistors in the lightning arresters is about 100 A (in the waveform of 8×20 μs). Accordingly, the zinc oxide voltage-dependent resistor in the lightning arresters without series discharging gaps must have thermal run away life of more than 20 years under the continuous voltage stress of 60 kV with 2000 to 6000 lightning surges of 100 A of the waveform of 8×20 μs.
Conventional zinc oxide voltage-dependent resistors show fairly good surge withstand capability and stability for the change of environment in a separate condition. That is, they show a fairly good surge withstand capability without continuous voltage stress at the same time or they show a fairly good stability against voltage stress for a long term without the shooting of impulse currents at the same time. However, the conventional zinc oxide voltage-dependent resistors do not show a sufficient thermal run away life over a long term under a condition where they have both a voltage stress of 80 to 50 percent of the varistor voltage and 2000 to 6000 surges of impulse currents of 100 A at the same time. The development of the voltage-dependent resistors having a sufficient thermal run away life under continuous voltage stress with surges has been required for the application to lightning arresters without series discharging gaps.
An object of the present invention is to provide a voltage-dependent resistor, and a method for making it, having a high n-value, a low residual voltage ratio, a good surge withstand capability and a long thermal run away life under continuous voltage stress with surges. The characteristics of high n-value, low residual voltage ratio and good surge withstand capability is indispensable for the application of lightning arresters. The last one, the long thermal run away life under continuous voltage stress with surges, is one of the most important characteristics which should be improved for that application.
This and other objects and features of this invention will become apparent upon consideration of the following detailed description taken together with the accompanying drawing in which the single FIGURE is a cross-sectional view of a voltage-dependent resistor in accordance with this invention.
Before proceeding with a detailed description of the manufacturing process of the voltage-dependent resistor contemplated by this invention, its construction will be described with reference to the single FIGURE, wherein reference numeral 10 designates, as whole, a voltage-dependent resistor comprising, as its active element, a sintered body having a pair of electrodes 2 and 3 in an ohmic contact with two opposite surfaces thereof. The sintered body 1 is prepared in a manner hereinafter set forth and is in any form such as circular, square of rectangular plate form. This invention also provides a process for making a bulk-type voltage-dependent resistor comprising a sintered body consisting essentially of, as a major part, zinc oxide (ZnO), and additives, and having electrodes to the opposite surfaces of said sintered body, characterized by a high n-value, a low residual voltage ratio, a good surge withstand capability and especially a long thermal run away life under continuous voltage stress with surges.
It has been discovered according to the invention that a voltage-dependent resistor comprising a sintered body of a composition which comprises, as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3 mole percent of cobalt oxide (Co2 O3), 0.1 to 3 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), at least one member selected from the group consisting of 0.1 to 10 mole percent of silicon oxide (SiO2) and 0.1 to 3 mole percent of nickel oxide (NiO), at least one member selected from the group consisting of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.005 to 0.025 mole percent of gallium oxide (Ga2 O3), and 0.005 to 0.3 mole percent of boron oxide (B2 O3), and if necessary, 0.00005 to 0.3 mole percent of silver oxide (Ag2 O), and the remainder being zinc oxide (ZnO) as a main constituent, with electrodes applied to opposite surfaces of the sintered body, has a non-ohmic property (voltage-dependent property) due to the bulk itself. Therefore, its C-value can be changed without impairing its n-value by changing the distance between the electrodes at opposite surfaces.
According to this invention, a voltage-dependent resistor has a high n-value, a small residual voltage ratio, a good surge withstand capability and a long thermal run away life under continuous voltage stress with surges. According to this invention, the n-value and the thermal run away life under continuous voltage stress with surges are improved by adding as additives the entire amount of boron oxide and silver oxide and a part of the cobalt oxide and silicon oxide in glass frit form.
Zinc oxide and additives as shown in Tables 1 and 2 were mixed in a wet will for 24 hours. Each of the mixtures was dried and pressed in a mold disc of 17.5 mm in diameter and 2 mm in thickness at a pressure of 250 kg/cm2. The pressed bodies were sintered in air at 1230° C. for 2 hours, and then furnace-cooled to room temperature. Each sintered body was lapped at the opposite surfaces thereof into the thickness of 1.5 mm by silicon carbide abrasive in particle size of 30 μm in mean diameter. The opposite surfaces of the sintered body were provided with spray metallized films of aluminum by a per se well known technique.
The electrical characteristics of the resultant sintered bodies are shown in Tables 1 and 2, which show that C-values of unit thickness (1 mm), n-values defined between 0.1 mA and 1 mA according to the equation (2), residual voltage ratios of V100 A to V1 mA, change rates of C-values after the impulse test and thermal run away lives under continuous voltage stress with surges.
The voltage at 100 A (V100 A) is measured by using a waveform expressed by 8×20 μs. The change rate against surge is evaluated measuring the change rate of C-value of the voltage-dependent resistor after applying 2 impulse currants of 1000 A whose waveform is expressed by 8×20 μs. The thermal run away life was evaluated by the time until a thermal run away occurs under conditions such that both the AC voltage (60 Hz) whose amplitude is 80 percent of C-value and the impulse current of 100 A, 8×20 μs are applied at the same time at a constant temperature of 100° C.
Tables 3 and 4 show that an n-value above 40, a residual voltage ratio velow 1.60, a surge withstand capability below -5.0 percent, a thermal run away life under voltage stress with surges more than 50 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), and 0.1 to 10.0 mole percent of silicon oxide (SiO2).
Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 3 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 4 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 4 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 20 hours.
Table 4 shows that the n-value is improved from above 40 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 50 to more than 70 hours by adding as an additive, the entire amount of boron oxide (B2 O3) in the form of borosilicate glass.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 5 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 6 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse test and the thermal run away lives under continuous voltage stress with surges are set forth. Table 6 shows an improvement of the n-value of more than 20 and an improvement in the thermal run away life of more than 30 hours.
Table 6 shows that the thermal run away life under voltage stress with surges is improved from more than 50 to more than 80 hours by adding as additives, the entire amount of boron oxide (B2 O3) and a part of bismuth oxide (Bi2 O3) in the form of borosilicate bismuth glass.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 7 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 8 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 8 shows an improvement of the n-value of more than 20 and an improvement in the thermal run away life of more than 30 hours.
Table 8 shows that the n-value is improved from above 40 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 50 to more than 80 by adding as additives, the entire amount of boron oxide (B2 O3), a part of bismuth oxide (Bi2 O3) and a part of cobalt oxide (Co2 O3) in the form of borosilicate bismuth glass with cobalt oxide.
Zinc oxide and additives of Table 9 and 10 were fabricated into voltage-dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Tables 9 and 10 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are shown.
Tables 9 and 10 show that an n-value above 50, a residual voltage ratio below 1.60, a surge withstand capability below -5.0 percent, a thermal run away life under voltage stress with surges of more than 100 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), 0.1 to 10.0 mole percent of silicon oxide (SiO2) and 0.0005 to 0.3 mole percent of silver oxide (Ag2 O).
Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 11 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 12 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges shown. Table 12 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 20 hours.
Table 12 shows that the n-value is improved from above 50 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 120 hours by adding as additives, the entire amount of boron oxide (B2 O3) and all amount of silver oxide (Ag2 O), in the form of borosilicate glass with silver oxide.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 13 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 14 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse test and the thermal run away lives under continuous voltage stress with surges. Table 14 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 30 hours.
Table 14 shows that the n-value is improved from above 50 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 130 by adding as additives the entire amount of boron oxide (B2 O3), the entire amount of silver oxide (Ag2 O) and a part of bismuth oxide (Bi2 O3) in the form of borosilicate bismuth glass.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 1 and 2 and glass frits whose composition is shown in Table 15 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 16 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 16 shows an improvement of n-value of more than 20 and an improvement in the thermal run away life of more than 30 hours.
Table 16 shows that the n-value is improved from above 50 to above 70 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 130 by adding as additives the entire amount of boron oxide (B2 O3), the entire amount of silver oxide (Ag2 O), a part of the bismuth oxide (Bi2 O3) and a part of the cobalt oxide (Co2 O3) in the form of borosilicate bismuth glass with silver oxide and cobalt oxide.
Zinc oxide and additives of Table 17 and 18 were fabricated into voltage-dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Tables 17 and 18 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are shown.
Tables 17 and 18 show that an n-value above 30, a residual voltage ratio below 1.70, a surge withstand capability below -4.0 percent, a thermal run away life under voltage stress with surges of more than 50 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.03 mole percent of boron oxide (B2 O3), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), and 0.1 to 3.0 mole percent of nickel oxide (NiO).
Zinc oxide and additives of No. a-1 or No. b-1 in Table 17 and 18 glass frits whose composition is shown in Table 3 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 19 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 19 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 20 hours.
Table 19 shows that the n-value is improved from above 30 to above 40 and the thermal run away life under voltage stress with surges is improved from more than 50 to more than 70 by adding as additives, the entire amount of boron oxide (B2 O3), in the form of borosilicate glass.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 17 and 18 and glass frits whose composition is shown in Table 5 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 20 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 20 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 30 hours.
Table 20 shows that the n-value is improved from above 30 to above 40 and the thermal run away life under voltage stress with surges is improved from more than 50 to more than 80 hours by adding as additives, the entire amount of boron oxide (B2 O3), and a part of the bismuth oxide (Bi2 O3) in the form of borosilicate bismuth glass.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 17 and 18 and glass frits whose composition is shown in Table 9 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 21 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 21 shows an improvement of the n-value of more than 20 and in the thermal run away life of more than 30 hours.
Table 21 shows that the n-value is improved from above 30 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 50 to more than 80 hours by adding as additives the entire amount of boron oxide (B2 O3), the entire amount of silver oxide (Ag2 O), a part of the bismuth oxide (Bi2 O3) and a part of the cobalt oxide (Co2 O3) in the form of borosilicate bismuth glass with cobalt oxide.
Zinc oxide and additives of Table 22 and 23 were fabricated into voltage-dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Tables 22 and 23 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are shown.
Tables 22 and 23 show that an n-value above 40, a residual voltage ratio below 1.70, a surge withstand capability below -4.0 percent, and a thermal run away life under voltage stress with surges more than 100 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), 0.1 to 3.0 mole percent of nickel oxide (NiO) and 0.0005 to 0.3 mole percent of silver oxide (Ag2 O).
Zinc oxide and additives of No. a-1 or No. b-1 in Table 17 and 18 and glass frits whose composition is shown in Table 11 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 24 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges. Table 24 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life more than 20 hours.
It has been discovered according to the present invention that the n-value is improved from above 40 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 120 hours by adding as additives, the entire amount of boron oxide (B2 O3) and the entire amount of silver oxide (Ag2 O) in the form of boro-silicate glass with silver oxide.
Zinc oxide and additives of No. 17 or No. 18 in Table 17 and 18 and glass frits whose composition is shown in Table 13 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 25 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth . Table 25 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 30 hours.
Table 25 shows that the n-value is improved from above 40 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 130 hours by adding as additives, the entire amount of boron oxide (B2 O3), the entire amount of silver oxide (Ag2 O), and a part of the bismuth oxide (Bi2 O3) in the form of borosilicate bismuth glass with silver oxide.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 17 and 18 and glass frits whose composition is shown in Table 15 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 26 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 26 shows an improvement of the n-value of more than 20 and an improvement in the thermal run away life more than 30 hours.
Table 26 shows that the n-value is improved from above 40 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 100 to more than 130 hours by adding as additives, the entire amount of boron oxide (B2 O3), the entire amount of silver oxide (Ag2 O), a part of the bismuth oxide (BiO3) and a part of cobalt oxide (Co2 O3) in the form of borosilicate glass with silver oxide and cobalt oxide.
Zinc oxide and additives of Table 27 and 28 were fabricated into voltage-dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Tables 27 and 28 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are shown.
Tables 27 and 28 show that an n-value above 40, a residual voltage ratio below 1.60 , a surge withstand capability below -3.0 percent, a thermal run away life under voltage stress with surges of more than 150 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), and both of 0.1 to 3.0 mole percent of nickel oxide (NiO) and 0.1 to 10.0 mole percent of silicon oxide (SiO2).
Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 3 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 29 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 29 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life of more than 10 hours.
Table 29 shows that the n-value is improved from above 40 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 150 to more than 160 hours by adding as additives, the entire amount of boron oxide (B2 O3), and a part of the silicon oxide (SiO2) in the form of borosilicate glass.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 5 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 30 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 30 shows an improvement of the n-value of more than 10 and improvement in the thermal run away life of more than 20 hours.
Table 30 shows that the n-value is improved from above 40 to above 50 and the thermal run away life under voltage stress with surges is improved from more than 150 to more than 170 hours by adding as additives, the entire amount of boron oxide (B2 O3), and a part of the bismuth oxide (Bi2 O3) in the form of the borosilicate bismuth glass.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 7 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 31 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 31 shows that the improvement of n-value of more than 20 and the improvement of the thermal run away life more than 20 hours.
Table 31 shows that the n-value is improved from above 40 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 150 to more than 170 by adding the additives of all amount of boron oxide (B2 O3), a part of bismuth oxide (Bi2 O3) and a part of cobalt oxide (Co2 O3) in the form of borosilicate bismuth glass with cobalt oxide.
Zinc oxide and additives of Table 32 and 33 were fabricated into voltage-dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Tables 32 and 33 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are shown.
Tables 32 and 33 show that an n-value above 50, a residual voltage ratio below 1.60, a surge withstand capability below -3.0 percent, a thermal run away life under voltage stress with surges for more than 190 hours can be obtained when said sintered body comprises, as a main constituent, zinc oxide (ZnO), and as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), and at least one member selected from the group of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), and both 0.1 to 3.0 mole percent of nickel oxide (NiO) and 0.1 to 10.0 mole percent of silicon oxide (SiO2) and 0.0005 to 0.3 mole percent of silver oxide (Ag2 O).
Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 15 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 34 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 34 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away life more than 20 hours.
Table 34 shows that the n-value is improved from above 50 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 190 to more than 210 hours by adding as additives, the entire amount of boron oxide (B2 O3) and the entire amount of the silver oxide (Ag2 O) in the form of borosilicate glass with silver oxide.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 13 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 35 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 35 shows an improvement of the n-value of more than 10 and an improvement in the thermal run away of life more than 30 hours.
Table 35 shows that the n-value is improved from above 50 to above 60 and the thermal run away life under voltage stress with surges is improved from more than 190 to more than 220 by adding as additives, the entire amount of the boron oxide (B2 O3), the entire amount of the silver oxide (Ag2 O) and a part of the bismuth oxide (Bi2 O3) in the form of borosilicate bismuth glass with silver oxide.
Zinc oxide and additives of No. a-1 or No. b-1 in Table 27 and 28 and glass frits whose composition is shown in Table 19 were fabricated into voltage dependent resistors by the same process as that of Example 1-1. The electrical properties of the resultant resistors are shown in Table 36 in which the C-values of unit thickness (1 mm), the n-values defined between 0.1 mA and 1 mA, and the residual voltage ratios of V100 A to V1 mA, the change rates of C-value after impulse testing and the thermal run away lives under continuous voltage stress with surges are set forth. Table 36 shows an improvement of n-value of more than 20 and an improvement in the thermal run away life more than 30 hours.
Table 36 shows that the n-value is improved from above 50 to above 70 and the thermal run away life under voltage stress with surges is improved from more than 190 to more than 220 hours by adding as additives, the entire amount of the boron oxide (B2 O3), the entire amount of the silver oxide (Ag2 O), a part of bismuth oxide (Bi2 O3) and a part of the cobalt oxide (Co2 O3) in the form of borosilicate bismuth glass with silver oxide and cobalt oxide.
TABLE 1 __________________________________________________________________________ Change rate Thermal after run C- Impulse away Additives (mole %) Value n- test life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 SiO.sub.2 Al.sub.2 O.sub.3 B.sub.2 O.sub.3 (V/mm) Value --V.sub.100A /--V.sub.1mA (%) (hr) __________________________________________________________________________ a-1 0.5 0.5 0.5 1.0 0.5 0.5 0.0025 0 212 50 1.47 -5.2 9 a-2 " " " " " " " 0.005 211 53 1.45 -3.9 52 a-3 " " " " " " " 0.3 211 55 1.46 -4.5 58 a-4 " " " " " " 0 0.1 211 54 1.71 -6.5 7 a-5 " " " " " " 0.0005 " 210 53 1.47 -2.9 53 a-6 " " " " " " 0.025 " 221 45 1.53 -2.9 55 a-7 " " " " " 0 0.0025 " 149 51 1.53 -5.3 43 a-8 " " " " " 0.1 " " 175 59 1.49 -4.5 53 a-9 " " " " " 10.0 " " 433 59 1.45 -2.8 55 a-10 " " " " 0 0.5 " " 185 52 1.54 -6.1 47 a-11 " " " " 0.05 " " " 190 53 1.52 -3.5 53 a-12 " " " " 1.5 " " " 232 45 1.56 -4.4 53 a-13 " " " 0 0.5 " " " 174 42 1.53 -6.5 45 a-14 " " " 0.1 " " " " 188 51 1.48 -3.5 52 a-15 " " " 3.0 " " " " 251 55 1.49 -3.4 54 a-16 " " 0 1.0 " " " " 149 27 1.73 -6.3 41 a-17 " " 0.1 " " " " " 202 50 1.52 -4.1 51 a-18 " " 3.0 " " " " " 210 48 1.53 -4.0 52 a-19 " 0 0.5 " " " " " 132 29 1.73 -6.5 42 a-20 " 0.1 " " " " " " 178 43 1.56 -3.8 51 a-21 " 3.0 " " " " " " 221 56 1.56 -3.9 53 a-22 0 0.5 " " " " " " 96 6 3.60 -6.5 35 a-23 0.1 " " " " " " " 175 43 1.51 -3.8 52 a-24 1.0 " " " " " " " 205 59 1.51 -4.2 56 a-25 3.0 " " " " " " " 204 58 1.52 -4.3 58 a-26 0.5 " " " " " " " 210 53 1.50 -4.5 57 __________________________________________________________________________
TABLE 2 __________________________________________________________________________ Change rate Thermal after run C- Impulse away Additives (mole %) Value n- test life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 SiO.sub.2 Al.sub.2 O.sub.3 B.sub.2 O.sub.3 (V/mm) Value --V.sub.100A /--V.sub.1mA (%) (hr) __________________________________________________________________________ b-1 0.5 0.5 0.5 1.0 0.5 0.5 0.0025 0 211 51 1.47 -5.3 8 b-2 " " " " " " " 0.005 211 53 1.47 -4.0 53 b-3 " " " " " " " 0.3 210 54 1.47 -4.6 58 b-4 " " " " " " 0 0.1 212 54 1.70 - 6.7 8 b-5 " " " " " " 0.0005 " 210 53 1.47 -3.3 53 b-6 " " " " " " 0.025 " 222 43 1.52 -3.3 56 b-7 " " " " " 0 0.0025 " 150 51 1.52 -5.5 44 b-8 " " " " " 0.1 " " 173 58 1.49 -4.6 53 b-9 " " " " " 10.0 " " 431 58 1.44 -2.9 53 b-10 " " " " 0 0.5 " " 183 51 1.53 -6.1 48 b-11 " " " " 0.05 " " " 191 52 1.52 -3.7 52 b-12 " " " " 1.5 " " " 230 44 1.55 -4.4 52 b-13 " " " 0 0.5 " " " 173 42 1.53 -6.3 44 b-14 " " " 0.1 " " " " 189 50 1.48 -3.5 51 b-15 " " " 3.0 " " " " 252 53 1.48 -3.5 53 b-16 " " 0 1.0 " " " " 150 25 1.72 -6.3 41 b-17 " " 0.1 " " " " " 201 49 1.51 -4.1 50 b-18 " " 3.0 " " " " " 210 47 1.53 -4.1 50 b-19 " 0 0.5 " " " " " 131 26 1.73 -6.5 41 b-20 " 0.1 " " " " " " 178 41 1.56 -3.8 50 b-21 " 3.0 " " " " " " 219 53 1.56 -3.7 50 b-22 0 0.5 " " " " " " 97 6 3.55 -6.0 37 b-23 0.1 " " " " " " " 173 43 1.51 -3.8 51 b-24 1.0 " " " " " " " 206 57 1.51 -4.1 56 b-25 3.0 " " " " " " " 203 57 1.52 -4.5 57 b-26 0.5 " " " " " " " 212 54 1.50 -4.7 55 __________________________________________________________________________
TABLE 3 ______________________________________ Glass compo- sition No. B.sub.2 O.sub.3 SiO.sub.2 ______________________________________ A.sub.1 5 95 A.sub.2 15 85 A.sub.3 30 70 (Wt. %) ______________________________________
TABLE 4 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 A.sub.1 233 63 1.46 -4.2 77 A.sub.2 226 63 1.46 -4.1 77 A.sub.3 221 64 1.46 -3.8 78 b-1 A.sub.1 235 64 1.46 -4.1 77 A.sub.2 227 64 1.46 -4.1 77 A.sub.3 220 64 1.46 -4.0 78 ______________________________________
TABLE 5 ______________________________________ Glass Compo- sition No. B.sub.2 O.sub.3 SiO.sub.2 Bi.sub.2 O.sub.3 ______________________________________ B.sub.1 5 5 90 B.sub.2 20 10 70 B.sub.3 30 30 40 (Wt. %) ______________________________________
TABLE 6 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 B.sub.1 211 64 1.46 -4.1 88 B.sub.2 212 64 1.46 -3.8 88 B.sub.3 213 63 1.46 -3.6 88 b-1 B.sub.1 210 64 1.47 -4.1 87 B.sub.2 211 64 1.46 -3.9 88 B.sub.3 213 64 1.46 -3.9 88 ______________________________________
TABLE 7 ______________________________________ Glass Compo- sition No. B.sub.2 O.sub.3 SiO.sub.2 Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 ______________________________________ E.sub.1 5 8 85 2 E.sub.2 10 5 75 10 E.sub.3 10 15 70 5 E.sub.4 25 25 40 10 (Wt. %) ______________________________________
TABLE 8 ______________________________________ Addi- Change tives Glass rate Thermal compo- compo- C- after run away sition sition Value n- --V.sub.100A / impulse life no. No. (V/mm) Value --V.sub.1mA test (%) (hr) ______________________________________ a-1 E.sub.1 211 75 1.46 -3.7 88 E.sub.2 211 73 1.46 -3.7 88 E.sub.3 211 74 1.47 -3.6 89 E.sub.4 213 74 1.46 -3.6 89 b-1 E.sub.1 211 74 1.47 -3.8 88 E.sub.2 211 74 1.47 -3.7 88 E.sub.3 212 74 1.47 -3.7 89 E.sub.4 213 74 1.47 -3.8 88 ______________________________________
TABLE 9 __________________________________________________________________________ Change Thermal rate run C- after away Additives (mole %) Value n- --V.sub.100A / Impulse life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 SiO.sub.2 Al.sub.2 O.sub.3 B.sub.2 O.sub.3 Ag.sub.2 O (V/mm) Value --V.sub.1mA test (hr) __________________________________________________________________________ c-1 0.5 0.5 0.5 1.0 0.5 0.5 0.0025 0.1 0 210 53 1.50 -4.5 57 c-2 " " " " " " " " 0.0005 211 58 1.48 -4.3 103 c-3 " " " " " " " " 0.1 211 63 1.49 -4.4 105 c-4 " " " " " " " " 0.3 213 65 1.48 -4.7 107 c-5 " " " " " " " 0 0.1 211 55 1.47 -5.2 19 c-6 " " " " " " " 0.005 " 211 58 1.45 -4.0 102 c-7 " " " " " " " 0.3 " 211 59 1.45 -4.4 107 c-8 " " " " " " 0 0.1 " 210 58 1.73 -6.6 18 c-9 " " " " " " 0.0005 " " 210 55 1.48 -3.0 100 c-10 " " " " " " 0.025 " " 222 51 1.53 -3.0 105 c-11 " " " " " 0 0.0025 " " 150 53 1.53 -5.2 53 c-12 " " " " " 0.1 " " " 177 62 1.48 -4.5 104 c-13 " " " " " 10.0 " " " 440 62 1.46 -2.9 106 c-14 " " " " 0 0.5 " " " 183 55 1.54 -5.8 49 c-15 " " " " 0.05 " " " " 191 55 1.54 -3.5 102 c-16 " " " " 1.5 " " " " 233 50 1.57 -4.3 103 c-17 " " " 0 0.5 " " " " 170 51 1.54 -6.4 49 c-18 " " " 0.1 " " " " " 185 56 1.49 -3.3 103 c-19 " " " 3.0 " " " " " 252 59 1.49 -3.3 105 c-20 " " 0 1.0 " " " " " 151 29 1.72 -6.7 39 c-21 " " 0.1 " " " " " " 205 53 1.52 -4.0 100 c-22 " " 3.0 " " " " " " 213 54 1.51 -4.0 101 c-23 " 0 0.5 " " " " " " 135 28 1.74 -6.3 45 c-24 " 0.1 " " " " " " " 181 51 1.55 -3.9 103 c-25 " 3.0 " " " " " " " 221 59 1.55 -3.8 103 c-26 0 0.5 " " " " " " " 99 6 3.58 -6.4 43 c-27 0.1 " " " " " " " " 174 50 1.53 -3.8 103 c-28 1.0 " " " " " " " " 204 53 1.53 - 4.0 107 c-29 3.0 " " " " " " " " 205 62 1.53 -4.1 109 c-30 0.5 " " " " " " " " 211 55 1.51 -4.7 106 __________________________________________________________________________
TABLE 10 __________________________________________________________________________ Change rate Thermal after run C- Impulse away Additives (mole %) Value n- --V.sub.100A / test life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 SiO.sub.2 Ga.sub.2 O.sub.3 B.sub.2 O.sub.3 Ag.sub.2 O (V/mm) Value --V.sub.1mA (%) (hr) __________________________________________________________________________ d-1 0.5 0.5 0.5 1.0 0.5 0.5 0.0025 0.1 0 212 54 1.50 -4.7 55 d-2 " " " " " " " " 0.0005 211 58 1.49 -4.3 104 d-3 " " " " " " " " 0.1 211 62 1.49 -4.4 106 d-4 " " " " " " " " 0.3 211 64 1.49 -4.6 108 d-5 " " " " " " " 0 0.1 211 53 1.48 -5.3 19 d-6 " " " " " " " 0.005 " 210 57 1.46 -4.1 101 d-7 " " " " " " " 0.3 " 210 57 1.46 -4.4 106 d-8 " " " " " " 0 0.1 " 210 57 1.73 -6.5 21 d-9 " " " " " " 0.0005 " " 211 54 1.48 -3.3 101 d-10 " " " " " " 0.025 " " 224 51 1.53 -3.0 106 d-11 " " " " " 0 0.0025 " " 153 53 1.52 -5.5 51 d-12 " " " " " 0.1 " " " 181 60 1.48 -4.3 105 d-13 " " " " " 10.0 " " " 437 61 1.47 -3.1 108 d-14 " " " " 0 0.5 " " " 182 54 1.55 -6.2 47 d-15 " " " " 0.05 " " " " 190 55 1.55 -3.9 102 d-16 " " " " 1.5 " " " " 225 51 1.57 -4.8 104 d-17 " " " 0 0.5 " " " " 172 51 1.54 -6.5 47 d-18 " " " 0.1 " " " " " 186 57 1.50 -3.3 103 d-19 " " " 3.0 " " " " " 253 59 1.50 -3.4 106 d-20 " " 0 1.0 " " " " " 150 27 1.73 -6.8 38 d-21 " " 0.1 " " " " " " 205 52 1.52 -4.2 102 d-22 " " 3.0 " " " " " " 213 52 1.52 -4.2 102 d-23 " 0 0.5 " " " " " " 1.35 27 1.74 -6.3 44 d-24 " 0.1 " " " " " " " 181 50 1.55 -3.9 104 d-25 " 3.0 " " " " " " " 221 57 1.55 -3.8 104 d-26 0 0.5 " " " " " " " 95 6 3.65 -6.5 43 d-27 0.1 " " " " " " " " 175 51 1.54 -3.8 103 d-28 1.0 " " " " " " " " 203 62 1.53 -4.1 108 d-29 3.0 " " " " " " " " 206 62 1.54 -4.1 109 d-30 0.5 " " " " " " " " 210 54 1.50 -4.5 107 __________________________________________________________________________
TABLE 11 ______________________________________ Glass compo- sition No. B.sub.2 O.sub.3 SiO.sub.2 Ag.sub.2 O ______________________________________ F.sub.1 5 90 5 F.sub.2 17 80 3 F.sub.3 30 45 25 (Wt. %) ______________________________________
TABLE 12 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 F.sub.1 228 73 1.46 -3.9 127 F.sub.2 223 73 1.46 -3.8 127 F.sub.3 215 73 1.46 -3.9 127 b-1 F.sub.1 227 74 1.46 -3.9 127 F.sub.2 223 75 1.47 -3.8 127 F.sub.3 214 74 1.46 -3.9 127 ______________________________________
TABLE 13 ______________________________________ Glass Compo- sition No. B.sub.2 O.sub.3 SiO.sub.2 Bi.sub.2 O.sub.3 Ag.sub.2 O ______________________________________ G.sub.1 5 7 85 3 G.sub.2 20 10 50 20 G.sub.3 25 25 45 5 G.sub.4 10 10 55 25 (Wt. %) ______________________________________
TABLE 14 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 G.sub.1 211 74 1.47 -4.1 137 G.sub.2 211 73 1.47 -4.0 139 G.sub.3 210 73 1.47 -4.0 139 G.sub.4 210 74 1.46 -4.0 137 b-1 G.sub.1 211 75 1.47 -4.2 137 G.sub.2 210 74 1.47 -4.3 138 G.sub.3 211 74 1.48 -4.3 138 G.sub.4 211 75 1.46 -4.3 137 ______________________________________
TABLE 15 ______________________________________ Glass Compo- sition No. B.sub.2 O.sub.3 SiO.sub.2 Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 Ag.sub.2 O ______________________________________ J.sub.1 5 5 85 2 3 J.sub.2 10 10 60 10 10 J.sub.3 25 25 45 2 3 J.sub.4 10 10 50 5 25 (Wt. %) ______________________________________
TABLE 16 ______________________________________ Addi- Change tives Glass rate Thermal compo- compo- C- after run away sition sition Value n- --V.sub.100A / impulse life no. No. (V/mm) Value --V.sub.1mA test (%) (hr) ______________________________________ a-1 J.sub.1 211 83 1.46 -3.5 137 J.sub.2 211 84 1.46 -3.5 138 J.sub.3 214 84 1.47 -3.7 137 J.sub.4 212 85 1.46 -3.8 139 b-1 J.sub.1 211 84 1.46 -3.8 138 J.sub.2 212 85 1.47 -3.7 138 J.sub.3 214 86 1.47 -3.9 138 J.sub.4 212 86 1.47 -4.1 139 ______________________________________
TABLE 17 __________________________________________________________________________ Change rate Thermal after run C- Impulse away Additives (mole %) Value n- --V.sub.100A / test life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 NiO Al.sub.2 O.sub.3 B.sub.2 O.sub.3 (V/mm) Value --V.sub.1mA (%) (hr) __________________________________________________________________________ a-1 0.5 0.5 0.5 1.0 0.5 1.0 0.0025 0 151 46 1.55 -5.8 8 a-2 " " " " " " " 0.005 151 46 1.52 -3.0 52 a-3 " " " " " " " 0.3 152 47 1.53 -2.9 53 a-4 " " " " " " 0 0.1 151 47 1.83 -6.8 7 a-5 " " " " " " 0.0005 " 151 44 1.63 -2.0 53 a-6 " " " " " " 0.025 " 157 38 1.64 -2.0 52 a-7 " " " " " 0 0.0025 " 150 48 1.58 -4.6 43 a-8 " " " " " 0.1 " " 151 49 1.60 -3.5 51 a-9 " " " " " 3.0 " " 165 40 1.63 -2.5 54 a-10 " " " " 0 1.0 " " 135 51 1.63 -6.8 43 a-11 " " " " 0.05 " " " 141 51 1.60 -3.5 53 a-12 " " " " 1.5 " " " 173 40 1.63 -3.6 51 a-13 " " " 0 0.5 " " " 126 37 1.63 -7.3 44 a-14 " " " 0.1 " " " " 134 49 1.58 -3.4 53 a-15 " " " 3.0 " " " " 193 53 1.58 -3.3 55 a-16 " " 0 1.0 " " " " 103 25 1.84 -7.3 41 a-17 " " 0.1 " " " " " 123 46 1.60 -3.4 52 a-18 " " 3.0 " " " " " 144 48 1.62 -3.4 54 a-19 " 0 0.5 " " " " " 102 25 1.88 -7.2 35 a-20 " 0.1 " " " " " " 143 31 1.63 -3.1 57 a-21 " 3.0 " " " " " " 163 45 1.64 -3.5 56 a-22 0 0.5 " " " " " " 84 6 3.62 -7.3 38 a-23 0.1 " " " " " " " 153 38 1.61 -3.3 57 a-24 1.0 " " " " " " " 153 55 1.62 -3.3 56 a-25 3.0 " " " " " " " 148 54 1.62 -3.4 55 a-26 0.5 " " " " " " " 153 52 1.53 -3.3 55 __________________________________________________________________________
TABLE 18 __________________________________________________________________________ Change rate Thermal after run C- Impulse away Additives (mole %) Value n- test life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 NiO Ga.sub.2 O.sub.3 B.sub.2 O.sub.3 (V/mm) Value --V.sub.100A /--V.sub.1mA (%) (hr) __________________________________________________________________________ b-1 0.5 0.5 0.5 1.0 0.5 1.0 0.0025 0 150 47 1.54 -5.5 7 b-2 " " " " " " " 0.005 150 46 1.54 -3.1 51 b-3 " " " " " " " 0.3 151 47 1.54 -3.1 53 b-4 " " " " " " 0 0.1 152 46 1.82 -6.5 7 b-5 " " " " " " 0.0005 " 153 43 1.65 -2.1 54 b-6 " " " " " " 0.025 " 155 39 1.65 -2.1 52 b-7 " " " " " 0 0.0025 " 150 44 1.59 -4.7 41 b-8 " " " " " 0.1 " " 150 45 1.61 -3.6 52 b-9 " " " " " 3.0 " " 163 40 1.63 -2.5 55 b-10 " " " " 0 1.0 " " 134 51 1.62 -6.5 42 b-11 " " " " 0.05 " " " 140 50 1.61 -3.4 54 b-12 " " " " 1.5 " " " 172 42 1.62 -3.4 52 b-13 " " " 0 0.5 " " " 123 36 1.62 -7.1 45 b-14 " " " 0.1 " " " " 136 48 1.59 -3.3 55 b-15 " " " 3.0 " " " " 191 53 1.59 -3.3 57 b-16 " " 0 1.0 " " " " 102 26 1.83 -7.2 42 b-17 " " 0.1 " " " " " 121 47 1.61 -3.5 52 b-18 " " 3.0 " " " " " 139 47 1.61 -3.4 55 b-19 " 0 0.5 " " " " " 101 26 1.83 -7.0 33 b-20 " 0.1 " " " " " " 143 32 1.63 -3.0 57 b-21 " 3.0 " " " " " " 165 46 1.65 -3.4 56 b-22 0 0.5 " " " " " " 85 6 3.55 -7.5 38 b-23 0.1 " " " " " " " 153 38 1.62 -3.3 57 b-24 1.0 " " " " " " " 152 53 1.61 -3.4 55 b-25 3.0 " " " " " " " 150 53 1.63 -3.4 55 b-26 0.5 " " " " " " " 150 51 1.56 -3.7 55 __________________________________________________________________________
TABLE 19 ______________________________________ Addi- Glass Change tives Com- rate Thermal Compo- posi- n- after run away sition tion C-Value Val- --V.sub.100A / impulse life No. No. (V/mm) ue --V.sub.1mA test (%) (hr) ______________________________________ a-1 A.sub.1 158 62 1.53 -3.4 75 A.sub.2 155 63 1.53 -3.3 77 A.sub.3 159 63 1.53 -3.2 77 b-1 A.sub.1 159 62 1.56 -3.6 76 A.sub.2 155 63 1.56 -3.5 76 A.sub.3 153 63 1.56 -3.3 76 ______________________________________
TABLE 20 ______________________________________ Addi- Glass Change tive Com- rate Thermal Compo- posi- n- after run away sition tion C-Value Val- --V.sub.100A / impulse life No. No. (V/mm) ue -- V.sub.1mA test (%) (hr) ______________________________________ a-1 B.sub.1 151 63 1.54 -3.3 86 B.sub.2 153 63 1.53 -3.3 87 B.sub.3 153 64 1.53 -3.2 88 b-1 B.sub.1 151 63 1.57 -3.6 86 B.sub.2 153 63 1.56 -3.6 87 B.sub.3 153 64 1.56 -3.6 88 ______________________________________
TABLE 21 ______________________________________ Addi- Change tives Glass rate Thermal compo- compo- C- after run away sition sition Value n- --V.sub.100A / impulse life no. No. (V/mm) Value --V.sub.1mA test (%) (hr) ______________________________________ a-1 E.sub.1 151 73 1.53 -3.3 86 E.sub.2 152 74 1.54 -3.3 86 E.sub.3 153 74 1.54 -3.3 86 E.sub.4 154 73 1.54 -3.4 88 b-1 E.sub.1 151 73 1.55 -3.6 85 E.sub.2 152 74 1.56 -3.6 86 E.sub.3 153 74 1.56 -3.6 87 E.sub.4 153 74 1.56 -3.7 88 ______________________________________
TABLE 22 __________________________________________________________________________ Change rate Thermal after run C- Impulse away Additives (mole %) Value n- test life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 NiO Al.sub.2 O.sub.3 B.sub.2 O.sub.3 Ag.sub.2 O (V/mm) Value .sup.--V.sub.100A /.sup.--V. sub.1mA (%) (hr) __________________________________________________________________________ C-1 0.5 0.5 0.5 1.0 0.5 1.0 0.0025 0.1 0 153 52 1.53 -3.3 55 C-2 " " " " " " " " 0.0005 152 50 1.52 -3.6 106 C-3 " " " " " " " " 0.1 153 52 1.53 -3.3 105 C-4 " " " " " " " " 0.3 152 50 1.52 -3.8 109 C-5 " " " " " " " 0 0.1 151 50 1.54 -5.4 18 C-6 " " " " " " " 0.005 " 151 52 1.53 -3.2 108 C-7 " " " " " " " 0.3 " 153 53 1.53 -3.2 108 C-8 " " " " " " 0 0.1 " 150 55 1.81 -6.4 17 C-9 " " " " " " 0.0005 " " 153 53 1.65 -2.0 105 C-10 " " " " " " 0.025 " " 157 43 1.65 -2.0 108 C-11 " " " " " 0 0.0025 " " 151 57 1.59 -4.6 42 C-12 " " " " " 0.1 " " " 151 56 1.59 -3.5 101 C-13 " " " " " 3.0 " " " 167 49 1.62 -2.5 105 C-14 " " " " 0 1.0 " " " 136 56 1.62 -6.4 42 C-15 " " " " 0.05 " " " " 140 55 1.62 -3.5 102 C-16 " " " " 1.5 " " " " 175 51 1.61 -3.4 103 C-17 " " " 0 0.5 " " " " 127 37 1.61 -7.0 47 C-18 " " " 0.1 " " " " " 134 51 1.58 -3.2 103 C-19 " " " 3.0 " " " " " 195 56 1.59 -3.2 105 C-20 " " 0 1.0 " " " " " 105 26 1.81 -7.0 45 C-21 " " 0.1 " " " " " " 125 51 1.62 -3.4 102 C-22 " " 3.0 " " " " " " 145 53 1.61 -3.2 106 C-23 " 0 0.5 " " " " " " 104 26 1.85 -6.8 35 C-24 " 0.1 " " " " " " " 145 51 1.62 -2.8 101 C-25 " 3.0 " " " " " " " 165 55 1.63 -3.4 107 C-26 0 0.5 " " " " " " " 84 6 3.53 -7.3 39 C-27 0.1 " " " " " " " " 155 41 1.61 -3.1 105 C-28 1.0 " " " " " " " " 153 56 1.62 -3.2 106 C-29 3.0 " " " " " " " " 1.49 55 1.63 -3.2 106 __________________________________________________________________________
TABLE 23 __________________________________________________________________________ Change Thermal rate run C- after away Additives (mole %) Value n- --V.sub.100A / Impulse life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 NiO Ga.sub.2 O.sub.3 B.sub.2 O.sub.3 Ag.sub.2 O (V/mm) Value --V.sub.1mA test (hr) __________________________________________________________________________ d-1 0.5 0.5 0.5 1.0 0.5 1.0 0.0025 0.1 0 150 51 1.56 -3.7 55 d-2 " " " " " " " " 0.0005 153 51 1.54 -3.6 105 d-3 " " " " " " " " 0.1 155 51 1.52 -3.5 106 d-4 " " " " " " " " 0.3 153 51 1.52 -3.8 108 d-5 " " " " " " " 0 0.1 152 50 1.54 -5.3 16 d-6 " " " " " " " 0.005 " 152 52 1.53 -3.2 106 d-7 " " " " " " " 0.3 " 155 54 1.80 -3.2 106 d-8 " " " " " " 0 0.1 " 151 56 1.64 -6.3 17 d-9 " " " " " " 0.0005 " " 153 53 1.64 -2.1 106 d-10 " " " " " " 0.025 " " 158 43 1.65 -2.1 108 d-11 " " " " " 0 0.0025 " " 152 56 1.60 -4.6 42 d-12 " " " " " 0.1 " " " 152 55 1.59 -3.6 102 d-13 " " " " " 3.0 " " " 169 48 1.61 -2.5 106 d-14 " " " " 0 1.0 " " " 138 55 1.62 -6.3 41 d-15 " " " " 0.05 " " " " 141 55 1.62 -3.5 103 d-16 " " " " 1.5 " " " " 172 52 1.62 -3.6 103 d-17 " " " 0 0.5 " " " " 129 38 1.62 -6.9 45 d-18 " " " 0.1 " " " " " 136 51 1.58 -3.2 104 d-19 " " " 3.0 " " " " " 197 55 1.58 -3.1 106 d-20 " " 0 1.0 " " " " " 106 26 1.80 -6.8 43 d-21 " " 0.1 " " " " " " 126 50 1.62 -3.3 103 d-22 " " 3.0 " " " " " " 147 53 1.61 -3.2 107 d-23 " 0 0.5 " " " " " " 105 27 1.82 -6.8 37 d-24 " 0.1 " " " " " " " 147 51 1.61 -2.8 101 d-25 " 3.0 " " " " " " " 167 55 1.63 -3.3 107 d-26 0 0.5 " " " " " " " 85 6 3.48 -7.2 38 d-27 0.1 " " " " " " " " 155 42 1.61 -3.0 106 d-28 1.0 " " " " " " " " 153 57 1.61 -3.0 106 d-29 3.0 " " " " " " " " 151 55 1.61 -3.2 106 __________________________________________________________________________
TABLE 24 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 F.sub.1 158 73 1.54 -3.4 124 F.sub.2 155 73 1.55 -3.4 122 F.sub.3 153 73 1.55 -3.4 126 b-1 F.sub.1 160 73 1.56 -3.6 123 F.sub.2 154 73 1.57 -3.6 122 F.sub.3 153 73 1.57 -3.7 125 ______________________________________
TABLE 25 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 G.sub.1 151 74 1.53 -3.4 131 G.sub.2 151 74 1.53 -3.2 136 G.sub.3 153 73 1.53 -3.2 132 G.sub.4 151 73 1.53 -3.3 135 b-1 G.sub.1 150 73 1.56 -3.5 132 G.sub.2 150 73 1.56 -3.5 137 G.sub.3 153 73 1.56 -3.5 132 G.sub.4 150 73 1.56 -3.6 135 ______________________________________
TABLE 26 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 J.sub.1 150 84 1.53 -3.4 133 J.sub.2 150 85 1.53 -3.4 135 J.sub.3 153 85 1.53 -3.3 133 J.sub.4 151 84 1.54 -3.3 136 b-1 J.sub.1 151 83 1.56 -3.7 133 J.sub.2 151 83 1.56 -3.7 135 J.sub.3 153 84 1.56 -3.7 132 J.sub.4 151 85 1.57 -3.6 135 ______________________________________
TABLE 27 __________________________________________________________________________ Change Thermal rate run C- after away Additives (mole %) Value n- --V.sub.100A / Impulse life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 NiO SiO.sub.2 Al.sub.2 O.sub.3 B.sub.2 O.sub.3 (V/mm) Value --V.sub.1mA test (hr) __________________________________________________________________________ a-1 0.5 0.5 0.5 1.0 0.5 1.0 0.5 0.0025 0 211 51 1.45 -5.1 9 a-2 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ 0.005 211 52 1.43 -2.9 151 a-3 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↓ 0.3 211 53 1.45 -2.7 159 a-4 ↑ ↑ ↑ ↑ ↑ ↑ ↑ 0 0.1 210 55 1.75 -6.7 8 a-5 ↑ ↑ ↑ ↑ ↑ ↑ ↓ 0.0005 ↑ 210 53 1.45 -1.9 153 a-6 ↑ ↑ ↑ ↑ ↑ ↓ ↓ 0.025 ↑ 222 43 1.53 -1.9 155 a-7 ↑ ↑ ↑ ↑ ↑ ↓ 0 0.0025 ↑ 151 50 1.55 -3.8 57 a-8 ↑ ↑ ↑ ↑ ↓ ↓ 0.1 ↑ ↑ 176 58 1.48 -2.8 151 a-9 ↑ ↑ ↑ ↓ ↓ ↓ 10.0 ↑ ↑ 435 59 1.45 -1.5 154 a-10 ↑ ↑ ↑ ↓ ↓ 0 0.5 ↑ ↑ 210 53 1.50 -4.5 57 a-11 ↑ ↑ ↓ ↓ ↓ 0.1 ↑ ↑ ↑ 211 52 1.52 -2.5 156 a-12 ↑ ↓ ↓ ↓ ↓ 3.0 ↑ ↑ ↑ 233 45 1.55 -1.5 157 a-13 ↑ ↓ ↓ ↓ 0 1.0 ↑ ↑ ↑ 187 53 1.53 -6.0 63 a-14 ↓ ↓ ↓ ↓ 0.05 ↑ ↑ ↑ ↑ 191 53 1.51 -2.7 151 a-15 ↓ ↓ ↓ ↓ 1.5 ↑ ↑ ↑ ↑ 235 45 1.55 -2.7 156 a-16 ↓ ↓ ↓ 0 0.5 ↑ ↑ ↑ ↑ 176 43 1.53 -6.8 55 a-17 ↓ ↓ ↓ 0.1 ↑ ↑ ↑ ↑ ↑ 185 52 1.48 -2.5 152 a-18 ↓ ↓ ↓ 3.0 ↑ ↑ ↑ ↑ ↓ 245 55 1.49 -2.3 150 a-19 ↓ ↓ 0 1.0 ↑ ↑ ↑ ↓ ↓ 148 28 1.75 -6.5 55 a-20 ↓ ↓ 0.1 ↑ ↑ ↑ ↑ ↓ ↓ 201 51 1.51 -2.5 153 a-21 ↓ ↓ 3.0 ↑ ↑ ↑ ↑ ↓ ↓ 210 53 1.52 -2.5 152 a-22 ↓ 0 0.5 ↑ ↑ ↓ ↓ ↓ ↓ 133 28 1.75 -6.5 56 a-23 ↓ 0.1 ↑ ↑ ↑ ↓ ↓ ↓ ↓ 178 40 1.55 -2.3 151 a-24 ↓ 3.0 ↑ ↑ ↓ ↓ ↓ ↓ ↓ 217 55 1.55 -2.8 155 a-25 0 0.5 ↑ ↓ ↓ ↓ ↓ ↓ ↓ 95 6 3.51 -6.7 65 a-26 0.1 ↑ ↑ ↓ ↓ ↓ ↓ ↓ ↓ 177 41 1.50 -2.3 153 a-27 1.0 ↑ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 205 59 1.51 -2.5 155 a-28 3.0 ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 203 58 1.52 -2.7 155 a-29 0.5 ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 211 52 1.44 -1.7 158 __________________________________________________________________________ ##STR1##
TABLE 28 __________________________________________________________________________ Change rate Thermal after run C- Impulse away Additives (moles %) Value n- --V.sub.100A / test life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub. 2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 NiO SiO.sub.2 Ga.sub.2 O.sub.3 B.sub.2 O.sub.3 (V/mm) Value --V.sub.1mA (%) (hr) __________________________________________________________________________ G-1 0.5 0.5 0.5 1.0 0.5 1.0 0.5 0.0025 0 212 51 1.45 -5.2 9 G-2 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ 0.005 212 51 1.45 -2.8 152 G-3 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↓ 0.3 212 52 1.45 -2.8 158 G-4 ↑ ↑ ↑ ↑ ↑ ↑ ↓ 0 0.1 209 55 1.73 -6.9 8 G-5 ↑ ↑ ↑ ↑ ↑ ↑ ↓ 0.0005 ↑ 209 53 1.43 -1.9 153 G-6 ↑ ↑ ↑ ↑ ↑ ↓ ↓ 0.025 ↑ 219 43 1.52 -1.8 153 G-7 ↑ ↑ ↑ ↑ ↓ ↓ 0 0.0025 ↑ 150 51 1.56 -3.7 55 G-8 ↑ ↑ ↑ ↑ ↓ ↓ 0.1 ↑ ↑ 178 59 1.49 -2.8 152 G-9 ↑ ↑ ↑ ↓ ↓ ↓ 10.0 ↑ ↑ 426 59 1.46 -1.7 153 G-10 ↑ ↑ ↓ ↓ ↓ 0 0.5 ↑ ↑ 212 54 1.50 -4.7 55 G-11 ↑ ↑ ↓ ↓ ↓ 0.1 ↑ ↑ ↑ 213 52 1.50 -2.3 156 G-12 ↑ ↓ ↓ ↓ ↓ 3.0 ↑ ↑ ↑ 233 44 1.54 -1.8 157 G-13 ↓ ↓ ↓ ↓ 0 1.0 ↑ ↑ ↑ 175 50 1.54 -6.1 63 G-14 ↓ ↓ ↓ ↓ 0.05 ↑ ↑ ↑ ↑ 186 51 1.51 -2.8 150 G-15 ↓ ↓ ↓ ↓ 1.5 ↑ ↑ ↑ ↑ 249 43 1.56 -2.8 155 G-16 ↓ ↓ ↓ 0 0.5 ↑ ↑ ↑ ↑ 173 43 1.53 -6.9 54 G-17 ↓ ↓ ↓ 0.1 ↑ ↑ ↑ ↑ ↓ 183 50 1.49 -2.5 151 G-18 ↓ ↓ ↓ 3.0 ↑ ↑ ↑ ↓ ↓ 255 50 1.49 -2.1 155 G-19 ↓ ↓ 0 1.0 ↑ ↑ ↑ ↓ ↓ 149 27 1.75 -6.6 54 G-20 ↓ ↓ 0.1 ↑ ↑ ↑ ↓ ↓ ↓ 203 51 1.51 -2.5 152 G-21 ↓ ↓ 3.0 ↑ ↑ ↑ ↓ ↓ ↓ 213 53 1.51 -2.3 152 G-22 ↓ 0 0.5 ↑ ↑ ↓ ↓ ↓ ↓ 132 28 1.77 -6.2 56 G-23 ↓ 0.1 ↑ ↑ ↓ ↓ ↓ ↓ ↓ 178 41 1.55 -2.3 152 G-24 ↓ 3.0 ↑ ↑ ↓ ↓ ↓ ↓ ↓ 221 51 1.54 -2.8 153 G-25 0 0.5 ↑ ↓ ↓ ↓ ↓ ↓ ↓ 90 6 3.31 -6.5 67 G-26 0.1 ↑ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 178 40 1.51 -2.1 152 G-27 1.0 ↑ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 207 58 1.51 -2.3 152 G-28 3.0 ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 203 58 1.51 -2.5 152 G-29 0.5 ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 210 51 1.45 -1.8 157 __________________________________________________________________________ ##STR2##
TABLE 29 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 A.sub.1 282 63 1.45 -1.9 168 A.sub.2 225 63 1.45 -1.9 168 A.sub.3 221 62 1.44 -1.8 169 b-1 A.sub.1 231 62 1.44 -1.8 168 A.sub.2 225 63 1.44 -1.9 168 A.sub.3 219 63 1.44 -1.8 168 ______________________________________
TABLE 30 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 B.sub.1 210 64 1.45 -1.8 179 B.sub.2 213 63 1.45 -1.8 178 B.sub.3 213 65 1.44 -1.8 178 b-1 B.sub.1 210 63 1.44 -1.7 178 B.sub.2 211 63 1.44 -1.8 178 B.sub.3 211 63 1.44 -1.8 178 ______________________________________
TABLE 31 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 E.sub.1 211 75 1.45 -1.8 178 E.sub.2 211 73 1.45 -1.8 177 E.sub.3 211 75 1.45 -1.7 177 E.sub.4 213 75 1.45 -1.7 177 b-1 E.sub.1 210 74 1.45 -1.7 178 E.sub.2 211 74 1.45 -1.8 177 E.sub.3 211 73 1.45 -1.7 177 E.sub.4 212 75 1.44 -1.9 177 ______________________________________
TABLE 32 __________________________________________________________________________ Change rate Thermal after run C- Impulse away Additives (mole %) Value n- --V.sub.100A / test life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 NiO SiO.sub.2 Al.sub.2 O.sub.3 B.sub.2 O.sub.3 Ag.sub.2 O (V/mm) Value --V.sub.1mA (%) (hr) __________________________________________________________________________ C-1 0.5 0.5 0.5 1.0 0.5 1.0 0.5 0.0025 0.1 0 211 51 1.45 -1.8 155 C-2 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ 0.0005 210 58 1.44 -1.6 191 C-3 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ 0.1 210 59 1.44 -1.5 198 C-4 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↓ 0.3 211 59 1.44 -1.6 198 C-5 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↓ 0 0.1 211 58 1.45 -2.5 18 C-6 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↓ 0.005 ↑ 210 55 1.43 -2.8 192 C-7 ↑ ↑ ↑ ↑ ↑ ↑ ↓ ↓ 0.3 ↑ 210 55 1.44 -2.7 197 C-8 ↑ ↑ ↑ ↑ ↑ ↓ ↓ 0 0.1 ↑ 211 55 1.76 -6.5 17 C-9 ↑ ↑ ↑ ↑ ↑ ↓ ↓ 0.0005 ↑ ↑ 211 58 1.46 -1.9 191 C-10 ↑ ↑ ↑ ↑ ↓ ↓ ↓ 0.025 ↑ ↑ 224 50 1.53 -1.9 195 C-11 ↑ ↑ ↑ ↓ ↓ ↓ 0 0.0025 ↑ ↑ 153 52 1.53 -3.3 185 C-12 ↑ ↑ ↑ ↓ ↓ ↓ 0.1 ↑ ↑ ↑ 177 59 1.48 -2.9 192 C-13 ↑ ↑ ↓ ↓ ↓ ↓ 10.0 ↑ ↑ ↑ 433 59 1.46 -1.5 193 C-14 ↑ ↓ ↓ ↓ ↓ 0 0.5 ↑ ↑ ↑ 211 55 1.51 -4.7 106 C-15 ↑ ↓ ↓ ↓ ↓ 0.1 ↑ ↑ ↑ ↑ 211 55 1.51 -2.6 193 C-16 ↓ ↓ ↓ ↓ ↓ 3.0 ↑ ↑ ↑ ↑ 235 51 1.56 -1.5 195 C-17 ↓ ↓ ↓ ↓ 0 1.0 ↑ ↑ ↑ ↑ 188 55 1.54 -6.3 72 C-18 ↓ ↓ ↓ ↓ 0.05 ↑ ↑ ↑ ↑ ↓ 192 55 1.51 -2.7 192 C-19 ↓ ↓ ↓ ↓ 1.5 ↑ ↑ ↑ ↑ ↓ 236 53 1.55 -2.6 193 C-20 ↓ ↓ ↓ 0 0.5 ↑ ↑ ↑ ↑ ↓ 177 51 1.53 -6.9 64 C-21 ↓ ↓ ↓ 0.1 ↑ ↑ ↑ ↑ ↓ ↓ 185 53 1.49 -2.1 193 C-22 ↓ ↓ ↓ 3.0 ↑ ↑ ↑ ↓ ↓ ↓ 246 57 1.48 -2.1 197 C-23 ↓ ↓ 0 1.0 ↑ ↑ ↓ ↓ ↓ ↓ 149 29 1.77 -6.3 65 C-24 ↓ ↓ 0.1 ↑ ↑ ↑ ↓ ↓ ↓ ↓ 200 52 1.52 -2.4 193 C-25 ↓ ↓ 3.0 ↑ ↑ ↓ ↓ ↓ ↓ ↓ 211 54 1.52 -2.4 197 C-26 ↓ 0 0.5 ↑ ↑ ↓ ↓ ↓ ↓ ↓ 135 29 1.76 -6.3 66 C-27 ↓ 0.1 ↑ ↑ ↓ ↓ ↓ ↓ ↓ ↓ 179 52 1.56 -2.1 195 C-28 ↓ 3.0 ↑ ↑ ↓ ↓ ↓ ↓ ↓ ↓ 218 56 1.55 -2.8 198 C-29 0 0.5 ↑ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 86 6 3.43 -6.5 75 C-30 0.1 ↑ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 178 53 1.51 -2.1 192 C-31 1.0 ↑ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 200 59 1.53 -2.1 196 C-32 3.0 ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 205 59 1.53 -2.5 198 __________________________________________________________________________ ##STR3##
TABLE 33 __________________________________________________________________________ Change rate Thermal after run C- Impulse away Additives (mole %) Value n- --V.sub.100A / test life No. Bi.sub.2 O.sub.3 Co.sub.2 O.sub.3 MnO.sub.2 Sb.sub.2 O.sub.3 Cr.sub.2 O.sub.3 NiO SiO.sub.2 Ga.sub.2 O.sub.3 B.sub.2 O.sub.3 Ag.sub.2 O (V/mm) Value --V.sub.1mA (%) (hr) __________________________________________________________________________ d-1 0.5 0.5 0.5 1.0 0.5 1.0 0.5 0.0025 0.1 0 211 52 1.44 -1.9 153 d-2 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ 0.0005 209 57 1.44 -1.6 192 d-3 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ 0.1 209 57 1.44 -1.5 179 d-4 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↓ 0.3 211 59 1.44 -1.7 196 d-5 ↑ ↑ ↑ ↑ ↑ ↑ ↑ ↓ 0 0.1 211 58 1.45 -2.3 18 d-6 ↑ ↑ ↑ ↑ ↑ ↑ ↓ ↓ 0.005 ↑ 210 55 1.43 -2.6 192 d-7 ↑ ↑ ↑ ↑ ↑ ↓ ↓ ↓ 0.3 ↑ 211 54 1.44 -2.6 145 d-8 ↑ ↑ ↑ ↑ ↑ ↓ ↓ 0 0.1 ↑ 211 54 1.75 -6.7 17 d-9 ↑ ↑ ↑ ↑ ↓ ↓ ↓ 0.0005 ↑ ↑ 211 55 1.46 -2.0 192 d-10 ↑ ↑ ↑ ↓ ↓ ↓ ↓ 0.025 ↑ ↑ 223 51 1.52 -2.0 195 d-11 ↑ ↑ ↑ ↓ ↓ ↓ 0 0.0025 ↑ ↑ 155 51 1.52 -3.5 106 d-12 ↑ ↑ ↓ ↓ ↓ ↓ 0.1 ↑ ↑ ↑ 177 58 1.48 -2.8 192 d-13 ↑ ↓ ↓ ↓ ↓ ↓ 10.0 ↑ ↑ ↑ 438 58 1.45 -1.8 194 d-14 ↓ ↓ ↓ ↓ ↓ 0 0.5 ↑ ↑ ↑ 210 51 1.50 -4.5 107 d-15 ↓ ↓ ↓ ↓ ↓ 0.1 ↑ ↑ ↑ ↑ 210 55 1.50 -2.7 193 d-16 ↓ ↓ ↓ ↓ ↓ 3.0 ↑ ↑ ↑ ↑ 237 51 1.56 -1.6 196 d-17 ↓ ↓ ↓ ↓ 0 1.0 ↑ ↑ ↑ ↑ 186 53 1.54 -6.4 73 d-18 ↓ ↓ ↓ ↓ 0.05 ↑ ↑ ↑ ↑ ↑ 190 54 1.51 -2.7 193 d-19 ↓ ↓ ↓ ↓ 1.5 ↑ ↑ ↑ ↑ ↑ 230 54 1.55 -2.7 194 d-20 ↓ ↓ ↓ 0 0.5 ↑ ↑ ↑ ↑ ↓ 176 52 1.53 -7.0 15 d-21 ↓ ↓ ↓ 0.1 ↑ ↑ ↑ ↑ ↑ ↓ 184 52 1.49 -2.0 194 d-22 ↓ ↓ ↓ 3.0 ↑ ↑ ↑ ↑ ↓ ↓ 243 57 1.48 -2.0 197 d-23 ↓ ↓ 0 1.0 ↑ ↑ ↑ ↓ ↓ ↓ 145 26 1.76 -6.2 65 d-24 ↓ ↓ 0.1 ↑ ↑ ↑ ↑ ↓ ↓ ↓ 201 52 1.51 -2.4 193 d-25 ↓ ↓ 3.0 ↑ ↑ ↓ ↓ ↓ ↓ ↓ 212 53 1.51 -2.4 197 d-26 ↓ 0 0.5 ↑ ↑ ↓ ↓ ↓ ↓ ↓ 136 28 1.77 -6.1 67 d-27 ↓ 0.1 ↑ ↑ ↓ ↓ ↓ ↓ ↓ ↓ 183 50 1.56 -2.0 195 d-28 ↓ 3.0 ↑ ↑ ↓ ↓ ↓ ↓ ↓ ↓ 219 57 1.55 -2.6 198 d-29 0 0.5 ↑ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 95 6 3.51 -6.0 75 d-30 0.1 ↑ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 179 51 1.50 -2.2 192 d-31 1.0 ↑ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 206 59 1.50 -2.2 192 d-32 3.0 ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ 206 58 1.50 -2.5 197 __________________________________________________________________________ ##STR4##
TABLE 34 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 F.sub.1 230 73 1.44 -1.8 217 F.sub.2 224 72 1.44 -1.9 218 F.sub.3 218 72 1.44 -1.9 217 b-1 F.sub.1 230 72 1.44 -1.8 217 F.sub.2 223 71 1.44 -1.8 217 F.sub.3 217 71 1.44 -1.8 217 ______________________________________
TABLE 35 ______________________________________ Change Addi- rate tives Glass after Thermal compo- compo- C- impulse run away sition sition Value n- --V.sub.100A / test life no. No. (V/mm) Value --V.sub.1mA (%) (hr) ______________________________________ a-1 G.sub.1 210 73 1.44 -1.8 228 G.sub.2 211 73 1.44 -1.8 227 G.sub.3 211 73 1.44 -1.8 228 G.sub.4 211 72 1.44 -1.9 228 b-1 G.sub.1 210 73 1.44 -1.8 228 G.sub.2 211 73 1.44 -1.8 227 G.sub.3 211 73 1.44 -1.8 227 G.sub.4 211 72 1.44 -1.9 227 ______________________________________
TABLE 36 ______________________________________ Addi- Change tives Glass rate Thermal compo- compo- after run away sition sition C-Value n- --V.sub.100A / impulse life no. No. (V/mm) Value -- V.sub.1mA test (%) (hr) ______________________________________ a-1 J.sub.1 210 84 1.44 -1.5 228 J.sub.2 211 85 1.44 -1.4 228 J.sub.3 213 85 1.44 -1.4 229 J.sub.4 211 84 1.44 -1.5 229 b-1 J.sub.1 210 83 1.44 -1.5 229 J.sub.2 211 83 1.44 -1.4 229 J.sub.3 213 83 1.44 -1.5 228 J.sub.4 211 83 1.44 -1.5 228 ______________________________________
Claims (6)
1. In a process for making a bulk-type voltage-dependent resistor consisting essentially of:
(a) admixing, as the main constituent, zinc oxide (ZnO) and, as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), at least one member selected from the group consisting of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), and at least one member selected from the group consisting of 0.1 to 3.0 mole percent of nickel oxide (NiO) and 0.1 to 10.0 mole percent of silicon oxide (SiO2), to form a mixture consisting essentially of said zinc oxide and said additives;
(b) pressing said mixture into a resistor body;
(c) sintering said resistor body; and,
(d) applying electrodes to the opposite surfaces of the sintered body,
the improvement comprising the step of, prior to pressing, admixing the entire amount of boron oxide (B2 O3) in the form of borosilicate glass, which is composed of 5 to 30 weight percent of boron oxide (B2 O3) and 70 to 95 weight percent of silicon oxide (SiO2) with the other additives and zinc oxide.
2. In a process for making a bulk-type voltage-dependent resistor consisting essentially of:
(a) admixing, as the main constituent, zinc oxide (ZnO) and, as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), at least one member selected from the group consisting of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), and at least one member selected from the group consisting of 0.1 to 3.0 mole percent of nickel oxide (NiO) and 0.1 to 10.0 mole percent of silicon oxide (SiO2), to form a mixture consisting essentially of zinc oxide and said additives;
(b) pressing said mixture into a resistor body;
(c) sintering said resistor body; and,
(d) applying electrodes to the opposite surfaces of the sintered body,
the improvement comprising the step of, prior to pressing, admixing the entire amount of boron oxide (B2 O3) and a part of bismuth oxide (Bi2 O3) in the form of borosilicate bismuth glass, which is composed of 5 to 30 weight percent of boron oxide (B2 O3), 5 to 30 weight percent of silicon oxide (SiO2) and 40 to 90 weight percent of bismuth oxide (Bi2 O3) with the other additives and zinc oxide.
3. In a process for making a bulk-type voltage-dependent resistor consisting essentially of:
(a) admixing as the main constituent, zinc oxide (ZnO) and, as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), at least one member selected from the group consisting of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), and at least one member selected from the group consisting of 0.1 to 3.0 mole percent of nickel oxide (NiO) and 0.1 to 10.0 mole percent of silicon oxide (SiO2), to form a mixture consisting essentially of said zinc oxide and said additives;
(b) pressing said mixture into a resistor body;
(c) sintering said resistor body; and
(d) applying electrodes to the opposite surfaces of the sintered body,
the improvement comprising the step of, prior to pressing, admixing the entire amount of boron oxide (B2 O3) and a part of bismuth oxide (Bi2 O3) and cobalt oxide (Co2 O3) in the form of borosilicate bismuth glass including cobalt oxide, which is composed of 5 to 25 weight percent of boron oxide (B2 O3), 5 to 25 weight percent of silicon oxide (SiO2), 40 to 85 weight percent of bismuth oxide (Bi2 O3) and 2 to 10 weight percent of cobalt oxide (Co2 O3) with the other additives and zinc oxide.
4. In a process for making a bulk-type voltage-dependent resistor consisting essentially of:
(a) admixing as the main constituent, zinc oxide (ZnO) and, as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), at least one member selected from the group consisting of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), and at least one member selected from the group consisting of 0.1 to 3.0 mole percent of nickel oxide (NiO) and 0.1 to 10.0 mole percent of silicon oxide (SiO2), and 0.0005 to 0.3 mole percent of silver oxide (Ag2 O), to form a mixture consisting essentially of zinc oxide and said additives;
(d) pressing said mixture into a resistor body;
(c) sintering said resistor body; and,
(d) applying electrodes to the opposite surfaces of the sintered body,
the improvement comprising the step of, prior to pressing, admixing the entire amount of boron oxide (B2 O3) and silver oxide (Ag2 O) in the form of borosilicate glass including silver oxide (Ag2 O), which is composed of 5 to 30 weight percent of boron oxide (B2 O3), 40 to 90 weight percent of silicon oxide (SiO2) and 3 to 25 weight percent of silver oxide (Ag2 O) with the other additives and zinc oxide.
5. In a process for making a bulk-type voltage-dependent resistor consisting essentially of:
(a) admixing as the main constituent, zinc oxide (ZnO) and, as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.0 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), at least one member selected from the group consisting of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), and at least one member selected from the group consisting of 0.1 to 3.0 mole percent of nickel oxide (NiO) and 0.1 to 10.0 mole percent of silicon oxide (SiO2), and 0.005 to 0.3 mole percent of silver oxide (Ag2 O), to form a mixture consisting essentially of zinc oxide and said additives;
(b) pressing said mixture into a resistor body;
(c) sintering said resistor body; and,
(d) applying electrodes to the opposite surfaces of the sintered body,
the improvement comprising the step of, prior to pressing, admixing the entire amount of boron oxide (B2 O3) and silver oxide (Ag2 O) and a part of bismuth oxide (Bi2 O3) in the form of borosilicate bismuth glass including silver oxide (Ag2 O), which is composed of 5 to 25 weight percent of boron oxide (B2 O3), 5 to 25 weight percent of silicon oxide (SiO2), 45 to 85 weight percent of bismuth oxide (Bi2 O3) and 3 to 25 weight percent of siliver oxide (Ag2 O) with the other additives and zinc oxide.
6. In a process for making a bulk-type voltage-dependent resistor consisting essentially of:
(a) admixing, as the main constituent, zinc oxide (ZnO) and the balance as additives, 0.1 to 3.0 mole percent of bismuth oxide (Bi2 O3), 0.1 to 3.0 mole percent of cobalt oxide (Co2 O3), 0.1 to 3.0 mole percent of manganese oxide (MnO2), 0.1 to 3.1 mole percent of antimony oxide (Sb2 O3), 0.05 to 1.5 mole percent of chromium oxide (Cr2 O3), 0.005 to 0.3 mole percent of boron oxide (B2 O3), at least one member selected from the group consisting of 0.0005 to 0.025 mole percent of aluminum oxide (Al2 O3) and 0.0005 to 0.025 mole percent of gallium oxide (Ga2 O3), and at least one member selected from the group consisting of 0.1 to 3.0 mole percent of nickel oxide (NiO) and 0.1 to 10.0 mole percent of silicon oxide (SiO2), and 0.0005 to 0.3 mole percent of silver oxide (Ag2 O), to form a mixture consisting essentially of zinc oxide and said additives;
(b) pressing said mixture to form a resistor body; and,
(c) sintering said resistor body; and,
(d) applying electrodes to the opposite surfaces of the sintered body,
the improvement comprising the step of, prior to pressing, admixing the entire amount of boron oxide (B2 O3) and silver oxide (Ag2 O) and a part of bismuth oxide (Bi2 O3) and cobalt oxide (Co2 O3) in the form of borosilicate bismuth glass including silver oxide (Ag2 O) and cobalt oxide (Co2 O3), which is composed of 5 to 25 weight percent of boron oxide (B2 O3), 5 to 25 weight percent of silicon oxide (SiO2), 45 to 85 weight percent of bismuth oxide (Bi2 O3), 3 to 25 weight percent of silver oxide (Ag2 O) and 2 to 10 weight percent of cobalt oxide (Co2 O3) with the other additives and zinc oxide.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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JP54154085A JPS5941285B2 (en) | 1979-11-27 | 1979-11-27 | Voltage nonlinear resistance element and its manufacturing method |
JP54154087A JPS604563B2 (en) | 1979-11-27 | 1979-11-27 | Voltage nonlinear resistance element and its manufacturing method |
JP54-154086 | 1979-11-27 | ||
JP54-154087 | 1979-11-27 | ||
JP54154086A JPS5941286B2 (en) | 1979-11-27 | 1979-11-27 | Voltage nonlinear resistance element and its manufacturing method |
JP54-154085 | 1979-11-27 |
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US06/465,678 Division US4551268A (en) | 1979-11-27 | 1983-02-10 | Voltage-dependent resistor and method of making the same |
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US4386021A true US4386021A (en) | 1983-05-31 |
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US06/210,394 Expired - Lifetime US4386021A (en) | 1979-11-27 | 1980-11-25 | Voltage-dependent resistor and method of making the same |
US06/465,678 Expired - Lifetime US4551268A (en) | 1979-11-27 | 1983-02-10 | Voltage-dependent resistor and method of making the same |
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US06/465,678 Expired - Lifetime US4551268A (en) | 1979-11-27 | 1983-02-10 | Voltage-dependent resistor and method of making the same |
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US (2) | US4386021A (en) |
EP (1) | EP0029749B1 (en) |
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GB1346851A (en) * | 1971-05-21 | 1974-02-13 | Matsushita Electric Ind Co Ltd | Varistors |
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JPS5147293A (en) * | 1974-10-21 | 1976-04-22 | Matsushita Electric Ind Co Ltd | Denatsuhichokusenteikoki |
US4147670A (en) * | 1975-12-04 | 1979-04-03 | Nippon Electric Co., Ltd. | Nonohmic ZnO ceramics including Bi2 O3, CoO, MnO, Sb2 O.sub.3 |
JPS5364752A (en) * | 1976-11-19 | 1978-06-09 | Matsushita Electric Ind Co Ltd | Method of manufacturing voltage nonlinear resistor |
US4180483A (en) * | 1976-12-30 | 1979-12-25 | Electric Power Research Institute, Inc. | Method for forming zinc oxide-containing ceramics by hot pressing and annealing |
IE47121B1 (en) * | 1977-07-29 | 1983-12-28 | Gen Electric | Stabilized varistor |
US4157527A (en) * | 1977-10-20 | 1979-06-05 | General Electric Company | Polycrystalline varistors with reduced overshoot |
US4111851A (en) * | 1977-10-21 | 1978-09-05 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Electrically conductive thermal control coatings |
US4452729A (en) * | 1982-11-03 | 1984-06-05 | Westinghouse Electric Corp. | Voltage stable nonlinear resistor containing minor amounts of aluminum and boron |
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1980
- 1980-11-25 AU AU64695/80A patent/AU524277B2/en not_active Expired
- 1980-11-25 US US06/210,394 patent/US4386021A/en not_active Expired - Lifetime
- 1980-11-26 CA CA000365566A patent/CA1144658A/en not_active Expired
- 1980-11-27 EP EP80304263A patent/EP0029749B1/en not_active Expired
- 1980-11-27 DE DE8080304263T patent/DE3068909D1/en not_active Expired
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1983
- 1983-02-10 US US06/465,678 patent/US4551268A/en not_active Expired - Lifetime
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US4086189A (en) * | 1975-11-14 | 1978-04-25 | Otowa Electric Company, Ltd. | Resistive element having voltage non-linearity and method of making same |
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US4146677A (en) * | 1977-08-18 | 1979-03-27 | Trw Inc. | Resistor material, resistor made therefrom and method of making the same |
US4285839A (en) * | 1978-02-03 | 1981-08-25 | General Electric Company | Varistors with upturn at high current level |
US4254070A (en) * | 1978-12-25 | 1981-03-03 | Tdk Electronics Company, Limited | Process for producing sintered body of ceramic composition for voltage non-linear resistor |
US4272411A (en) * | 1979-03-08 | 1981-06-09 | Electric Power Research Institute | Metal oxide varistor and method |
US4265844A (en) * | 1979-05-16 | 1981-05-05 | Marcon Electronics Co. Ltd. | Method of manufacturing a voltage-nonlinear resistor |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4527146A (en) * | 1982-12-24 | 1985-07-02 | Tokyo Shibaura Denki Kabushiki Kaisha | Varistor |
US4575440A (en) * | 1984-02-21 | 1986-03-11 | Gte Laboratories Incorporated | Process for the preparation of homogeneous metal oxide varistors |
US4736183A (en) * | 1984-06-22 | 1988-04-05 | Hitachi, Ltd. | Oxide resistor |
US4724416A (en) * | 1986-04-09 | 1988-02-09 | Ngk Insulators, Ltd. | Voltage non-linear resistor and its manufacture |
US4719064A (en) * | 1986-11-28 | 1988-01-12 | Ngk Insulators, Ltd. | Voltage non-linear resistor and its manufacture |
US4730179A (en) * | 1986-11-28 | 1988-03-08 | Ngk Insulators, Ltd. | Voltage non-linear resistor and its manufacture |
US4855708A (en) * | 1987-08-21 | 1989-08-08 | Ngk Insulators, Ltd. | Voltage non-linear resistor |
US4933659A (en) * | 1988-11-08 | 1990-06-12 | Ngk Insulators, Ltd. | Voltage non-linear resistor and method of producing the same |
US5096620A (en) * | 1990-02-19 | 1992-03-17 | Schott Glaswerke | Lead-zinc-borosilicate glass |
US5107242A (en) * | 1990-08-20 | 1992-04-21 | Ngk Insulators, Ltd. | Voltage non-linear resistor for gapped lightning arrestors and method of producing the same |
US20040183647A1 (en) * | 2003-03-13 | 2004-09-23 | Nobutoshi Arai | Resistance-changing function body, memory element, manufacturing method therefor, memory device, semiconductor device and electronic equipment |
US7030456B2 (en) * | 2003-03-13 | 2006-04-18 | Sharp Kabushiki Kaisha | Resistance-changing function body, memory element, manufacturing method therefor, memory device, semiconductor device and electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
AU6469580A (en) | 1981-06-25 |
CA1144658A (en) | 1983-04-12 |
DE3068909D1 (en) | 1984-09-13 |
US4551268A (en) | 1985-11-05 |
AU524277B2 (en) | 1982-09-09 |
EP0029749A1 (en) | 1981-06-03 |
EP0029749B1 (en) | 1984-08-08 |
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