US3841852A - Abraders, abrasive particles and methods for producing same - Google Patents

Abraders, abrasive particles and methods for producing same Download PDF

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Publication number
US3841852A
US3841852A US00220351A US22035172A US3841852A US 3841852 A US3841852 A US 3841852A US 00220351 A US00220351 A US 00220351A US 22035172 A US22035172 A US 22035172A US 3841852 A US3841852 A US 3841852A
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Prior art keywords
metal
abrasive
encapsulated
particles
tungsten
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A Wilder
H Bridwell
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Norton Christensen Inc
Baker Hughes Oilfield Operations LLC
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Christensen Diamond Products Co
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Priority to US00220351A priority Critical patent/US3841852A/en
Priority to FR7242482A priority patent/FR2169576A5/fr
Priority to JP12445472A priority patent/JPS5318755B2/ja
Priority to DE2302595A priority patent/DE2302595C3/de
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Assigned to EASTMAN CHRISTENSEN COMPANY reassignment EASTMAN CHRISTENSEN COMPANY ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: NORTON CHRISTENSEN, INC., NORTON COMPANY
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C09K3/1445—Composite particles, e.g. coated particles the coating consisting exclusively of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/08—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for close-grained structure, e.g. using metal with low melting point
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor

Definitions

  • Superior abraders may be formed by metal bonding such encapsulated abrasives with a metal matrix which forms a continuous phase in which the abrasive particles may be positioned.
  • the abrader is formed from a mixture of the bonding metal and a single type of abrasive particle, the specific gravity of the abrasive particle may be adjusted to match more closely that of the metal.
  • the encapsulated abrasive particle may form the primary abrasive together with a secondary abrasive which is not as hard as the primary abrasive and which may or may not be encapsulated with a metal.
  • one or the other or both may be adjusted in density by employing an encapsulating metal of suitable specific gravity.
  • Abrasive particles are improved in function as abrasives, in addition to having the specific gravity adjusted by encapsulating them with a metallic envelope; preferably the envelope is made of a pure metal in dendritic crystalline form.
  • the abrasive substrate is placed in contraction by the envelope which is heat shrunk onto the abrasive substrate.
  • the preferred method is to deposit the metal on the substrate at an elevated temperature by contacting a vapor of the metallic compound with the substrate particle .under reducing conditions.
  • the preferred primary abrasive is a diamond, and it is preferably etched before coating.
  • PATENTEDUCT 1 5 I974 SHEET 5 OF 6- This invention relates to abraders formed of a plural ity of different abrasive particles bonded in a continuous phase matrix.
  • Abrasive, grinding, cutting and earthboring tools hereinafter referred to as abraders, have bound abrasivc particles into an abrader structure, using a binder such as an organic polymer resin and, in some cases, metal, which acts as the matrix to hold the abrasive particles in thc abrader structure.
  • a binder such as an organic polymer resin and, in some cases, metal, which acts as the matrix to hold the abrasive particles in thc abrader structure.
  • a plurality of different abrasive particles are employed.
  • particles of high hardness values which act as the primary abraders there is distributed in the continuous phase of the metal matrix binder a secondary abrasive of lower hardness value.
  • the purpose of the secondary abrasive particles is to wear away preferentially thus exposing new abrasive faces of the primary abrasive particles.
  • the primary abrasive and the secondaryabrasive be uniforrnally distributed throughout the matrix. If the primary abrasive is not uniformally distributed, the abrader structure will not be uniformally worn away and the result will be that at wearing areas of high concentrations of primary abrasive the abrader wears away less than in the area of low primary abrasives concentration.
  • the accelerated erosion of the secondary abrasive particle and the accompanying local wearing away of the bonding matrix results in a larger loading on the areas of higher primary abrasive particle concentration since the abrader structure will ride up on these areas.
  • the load being concentrated on these reduced areas causes an increased load per unit area on the localized pressure areas and on the underlying abrader structure, such as a saw blade on which the abrader structure may be mounted.
  • this increased load may fracture the primary abrasive and cause it to be torn out of the ma: trix resulting in excessive wear.
  • the cutting rate may not be uniform and it is necessary to either reduce the loading or the cutting rate.
  • This invention provides for the aforementioned uniform distribuition of the primary and secondary abrasive if used by first forming an intimate mixture of particles of the primary and secondary abrasive in which the particles are as closely as is practically feasible of substantially the same density. Additionally, the uniformity may also be reinforced by using all particles in the same mesh size range and using them in as narrow a mesh size range as is practically convenient.
  • abrader structure is to be used as a cutter or abrader, for example in oil well drill bits or other boring, shaping tools or saws suitable, for example, in sawing concrete, masonry, rocks, ceramics, bricks,
  • abrasive materials preferably .those having hardness in excess of about 2,500 kg/mm (Knoop or Vickers) and the harder the better.
  • An additional useful criteria is that thc abrasive material should have a melting or softening point in excess of the highest tempterature reached in the process by which the abrader structure is formed, such as is described hereinbelow.
  • abrasive material preferring among them diamonds, either natural or synthetic.
  • diamonds we may use any one of the following abrasive particles shown in Table l. The values reported in the table are taken from the available literature.
  • Table 1 lists suitable materials from which may be chosen the primary and accompanying similar abra- SlVeS.
  • the totalweight of the particles is increased and as the increase in volume of the particles is the less the greater is the densitiy of the envelope and vice versa. Since the metal envelope is chosen so that the specific gravity of the metal envelope be greater or less than that of the underlying substrate particle, the density of the composite coated particles is increased or decreased.
  • Creamery abrasive i particle may or may not be coated and may be chosen to match the particle size of accompanying particle.
  • weprfaiifirafia a '5' Saarinen-teenagerto employ as encapsulating metals, those listed in Table 2. The values are obtained from available literature.
  • the encapsulation of the abrasive particles with a metallic envelope according to our invention has values in addition to permitting of a uniform distribution of the particles as described above.
  • metal is used as a matrix to bind the abrasive particles in the abarader structure
  • encapsulation of the abrasive particles increases the grip of the metal matrix on the abrasive particle.
  • the bond is weak, the particles are torn out of the metal matrix, causing excessive wear.
  • the interrnetallic bond between the metal matrix and the primary or secondary abrasive increases the retention of the abrasive particle until its cutting life is ended by wearing away of the particle or breaking away of fragments thereof from the portion of the abrasive particle which has become free of the encapsulation at the fer from the abrasive particle resulting from the more intimate contact surface between the envelope and the substrate particle and the envelope and the metal matrix.
  • Heat generated at the abrading surfaces if not readily transmitted to and absorbed in the metal matrix, acting as a heat sink, will cause a local rise in temperature which may have a deleterious effect upon the life of the abrasive particle.
  • any convenient method for deposit of the metal envelope on the particle substrate may be employed.
  • electrochemical or electrolytic methods which have been previously employed in coating abrasive particles for use in abrader structure with organic resin will permit of some adjustment of the apparent density of the coated particle. They will also, when used together with a metal bonding agent in our novel abrader structure, result in an improved bond between the metal matrix and the coated particle, due to the improved wetting by the molten metal.
  • the use of the coated particle in a composite structure employing a metal matrix is an improvement over the use of an abrasive particle coated by an electrochemical or electrolytic process where used with a resin binder. It is similarly an improvement over the use of uncoated abrasive particles with resin or metal binders acting as a matrix for the abrasive particles.
  • Abrasive particles coated by procedures such as electrochemical and electrolytic processes may result in deposits which are contaminated by intergranular inclusions of impurities from their aqueous environment. Furthermore, the deposits particularly in the case of electrolytic deposits have intergranular planes of weakness and the coating has a relatively low tensile and bending strength. They thus do not improve in any substantial degree the physical properties of the coated particle as compared with the uncoated particle.
  • metal envelopes which constitute the abrasive particles of our invention employed in the novel abrader structure of our invention differ from the foregoing coatings in composition and crystalline nature.
  • the deposits according to our preferred procedure constitute a pure metal envelope substantially free of intergranular inclusions.
  • the preferred metallic envelope is formed of allotrimorphic crystal dendrite grains which start at and extend from the substrate surface in statistical orientation
  • a metal for the envelope having a substantially greater coefficient of expansion than the substrate.
  • the metal sheath will contract more than the substrate, putting the substrate under compression.
  • the linear coefficient of thermal expansion of suitable abrasives are in the range of about I to about 5 X 10* inches per inch per degree Fahrenheit
  • metal sheaths having a higher coefficient of expansion than the substrate For example, we select metals having linear coefficients of expansion of about 2 X l0" to about 10 inches per inch per degree Fahrenheit. By matching the coefficients of expansion, as described above, a useful encapsulation may be obtained.
  • the coefficients of cubic expansion may, for the above purposes, be taken as about three times the linear coefficient of expansion.
  • the distruptive force sufficient to fragment the substrate particle must be greater than that which would fracture the unencapuslated particle, since it must overcome initially the compressive force "which places the underlying substrate in compression.
  • the coefficient of linear expansion of the metal is substantially greater than that of diamond, and their use would have the advantage of adding a compressive force upon the diamonds to help in overcoming the tensile forces which would tend to fracture the diamond when used in an abrader structure as the abrasive particle.
  • metals may be selected, depending on the stress desired to be imparted, for example, for the metals listed in Table 2 and the abrasives of Table 1, metals having a coefficient greater than the substrate coefficient by about to percent or more of the value of the coefficient of the substrate. That is, the coefficient of the metal should be about 1.05 or more, for example, up to about seven times the coefficient of the substrate.
  • the metal encapsulating material when employing diamonds as a substrate, when we employ carbide-forming metals, we prefer to employ those which have only a limited reaction rate at the temperatures of deposition, as hereinafter described.
  • tungsten, tantalum, niobium (columbium) and molybdenum we prefer to employ diamonds, either the natural or synthetic forms, and prefer to employ tungsten as the encapsulating material, deposited under conditions to produce pure tungsten of the crystal form as described herein.
  • the metal encapsulated abrasive in abrader structures formed by metal bonding the encapsulated abrasive in a metal continuous phase matrix
  • a metal having a significantly lower melting point than the metal sheath of the abrasive substrate we prefer to limit the melting point of the metal matrix to a temperature below about 2,800 F. in order not to expose the diamonds to excessive temperature which may impair the mechanical strength of the diamonds.
  • the coefficient of thermal expansion of the metal matrix used as bonding agent is the coefficient of thermal expansion of the metal matrix used as bonding agent. Since, in general, the low melting metals and materials have a high thermal expansion, in the absence of an encapsulating metal which is wetted by the molten metal, the mass of matrix on cooling would tend to pull away from the abrasive material, thus impairing the bond. It is one advantage of the encapsulating metal that the thermal expansion of the metal sheath matches more closely the thermal expansion of the metal matrix and that the interfacial tensions will tend to prevent the pulling away of the metal matrix from the metal sheath. Such metals having melting points so as to be fluid-in the formation of the abrader structure, for example, at temperatures below about 2,800 F. when employing diamonds are suitable.
  • the metal chosen should be fluid at the temperature at which it is desired to employ the molten metal in forming the composite abrader structure and desirably should have, when. solid, ductility as measured in the terms of micro-hardness of below about 400 kglmm Desirably, also, it should have a compressive strength above about 150,000 p.s.i., a transverse rupture strength above about 90,000 p.s.i. and an impact strength above about 5 foot pounds.
  • copper-based alloys such as brass and bronze alloys and copper-based alloys containing various amounts of nickel, cobalt, tin, zinc, manganese, iron and silver.
  • the diamond Since when using encapsulated diamonds the diamond is protected from attack by the metal. we may use cobalt-based, nickel-based, and iron-based alloys of suitable properties. These alloys are excluded from use as metal matrixes when using unencapsulated diamonds because under molten conditions they attack the diamond excessively. Thus we may with the encapsulated diamond, for example, employ the nickel-copper-aluminum-silicon alloy having a melting point below 2,000 F.; cast iron, cobalt, chromium, and tungsten alloys having melting points below about 2,800 F. may be used.
  • the abrasive particle is a tungsten carbide or diamond particle which is attacked by nickel, cobalt or iron-based alloys
  • the encapsulation of the tungsten carbide or diamond by a metal envelope of substantially higher melting point according to our invention will prevent the attack which the unencapsulated particle would otherwise suffer under the conditions of fabrication of the abrader structure.
  • the procedure we prefer because it produces the superior envelope when applied to produce our novel encapsulated abrasive particle is the conversion of a volatile compound of the metal into the metal deposited on the substrate and a gaseous or vaporous reaction product which may be removed from contact with the encapsulated metal. This leaves an envelope substantially free of included impurities.
  • halides or the carbonyls of the metals Preferably for convenience of operation, we prefer to employ those compounds having a boiling point at atmospheric pressure below the reaction temperature.
  • Tantalum Pentachloride (TaCl 242 Tantalum Pentafluoride [Tall] 229.5 Titanium Tetraboride [TiBrd 230 Titanium Hexafluoride ITiF 35.5 Titanium Tetrachloride [TiCh] 136.4 Columbium Pentabromide [CbBr 361.6 Columbium Pentafluotide [CbF 1 236 Columbium Pentachloride [CbCl 236 Nickel Hexafluoride (NiF l 4 at 25 mm. Vanadium Tetrachloride [VaCL] 148+ Vanadium Pentafluoride [VaCl I 1.1 1+
  • tungsten as an encapsulating metal because of its high density and high melting point (See Table 2). It gives under the conditions of fabrication according to our invention a coating of exceptional high strength. It is readily wetted by the molten metal matrixes described above and forms a strong metallurgical bond with the metal matrixes employed in our invention. It is particularly useful where the substrate is diamond or other substrates which will react with the tungsten such as those which form cermets with tungsten.
  • Our preferred primary abrasive is diamond. Where encasulated with a metal under the preferred conditions as described herein, it will produce a superior abrader structure of longer life. Where encapsulated with tungsten or other suitable metals as described above, it will after the exposed metal sheath in contact with the work has been worn away be exposed to the work but will otherwise be gripped by the encapsulating envelope which is in turn gripped by the metal matrix.
  • encapsulated diamond in place of or in addition to the encapsulated diamond, we may use the other abrasives as described above, preferring among them encapsulated alumina but may also use the other abrasives described above, particularly encapsulated tungsten carbide or silicon carbide as is more fully described below.
  • FIG. 1 is a diagrammatic flow sheet of our preferred process of encapsulation.
  • FIG. 2 is a section through a mold for use in the infiltrant technique of forming abraders according to one form of our invention.
  • FIG. is a sectional view taken on 5-5 of FIG. 2.
  • FIG. 3 is a schematic showing of a mold for use in a hot press technique employed in forming an abrader element.
  • FIG. 4 is a sectional view taken on line 44 of FIG. 3.
  • FIG. 6 shows one application of a shaped abrader according to our invention to a saw.
  • FIGS. 7-12 are photomicrographs of an etched section of a coated abrasive particle contained in a metal matrix according to our invention.
  • FIG. 1 illustrated a flow sheet of our preferred process for producing the novel encapsulated abrasive of our invention.
  • the particles to be coated are placed in the reactor 1, whose cap 2 has been removed.
  • the reactor has a perforated bottom to support the particles of selected mesh size.
  • the vacuum pump is started to de-aerate the system.
  • Valve 7 is closed and the system is back filled with hydrogen from hydrogen storage lll, valve 5 being open.
  • the reactor is heated by the furnace 9 to the reaction temperature, for example, from about l,000 to about 1,200F. while purging slowly with hydrogen.
  • the hydrogen flow rate is increased until a fluidized bed is established.
  • Hydrogen prior to inroduction into the reactor passes through a conventional palladium catalyst to remove any impurities, subh as oxygen in the hydrogen.
  • Vaporized metallic compound is discharged from the vaporizing chamber 10, which may if necessary be heated by furnace 14, together with an inert gas, for example, argon from argon storage 6 into the reaction chamber.
  • the reaction forms hydrogen halide, which is passed through the bubble traps and is absorbed in the absorber.
  • the volatile compound employed is a fluoride
  • the product formed is a hydrogen fluoridc. and we may use sodium fluoride for that absorption.
  • the reaction deposits metal on the substrate and the effluent material, being in the vapor state is discharged, leaving no contaminants on or in the metal.
  • the metal is formed in its pure state.
  • the rate of metal deposition depends on the temperature, and flow rate of the reactants, being the greater the higher the temperature and the greater the flow rate of the hydrogen and volatile metals compound.
  • valves 4 and 5 are closed and argon is continued to pass into the reactor and the metal encapsulated abrasive is allowed to cool to room temperature in the non-oxidizing condition of the argon environment.
  • reaction products and the carrier gases and excess hydrogen enter the upper space termed the disengaging space where they are separated from any entrained particles.
  • the diamond particle is smooth as, for example, in the case of snythetic diamonds
  • the etching of the diamonds will also have an advantage where the metal envelope is produced by other processes such as electrochemical or electrolytic deposition methods.
  • the product produced by the process of vapor deposition described above is superior and is preferred by us.
  • EXAMPLE I To etch the diamonds, we immerse them in a molten bath of an alkali metal nitrate or alkaline earth nitrate at a temperature below the decomposition temperature; thus in using potassium nitrate, temperature would range from 630+ F. and under 750 F.; sodium nitrate, about 580 F. and under about 700 F.; barium nitrate, at or above 1,100 F. and below its decomposition temperaure. We prefer to employ potassium nitrate at about 630 F. for about an hour. The bath is contained in a nitrogen or other inert gas atmosphere.
  • the molten bath is cooled and the cooled bath is then leached with water to dissolve the salt, leaving the etched diamonds which may then be separated and dried.
  • the degree of etching depends upon the immersion time and a suitable time will be about an hour under which conditions the particles will lose from about /2 to 2 percent of their weight.
  • the surface of the diamonds is roughened and pitted and forms a desirable and improved substrate base.
  • hydrogen flow is established at a low flow rate of about 100 ml/min and as described above, the temperatures in the reactor 1 having been adjusted to 1,150 E, as measured by the thermocouples, the hydrogen flow is increased to about 1,2001,350 ml/min, and the flow of the tungsten fluoride vapor to about 150 ml/min and the argon gas is adjusted to about 285 ml/min, all as measured by the flow meters as indicated in FIG. 1, the hydrogen being in stoichiometric excess over the tungsten hexafluoride.
  • the thickness of the coat of the tungsten on the diamond depends on the duration of the treatment and suitably for the 40 to 50 mesh diamonds described above, the coat will be 1 mil. thick in about 1 hour. Suitable thickness deposit will run from about 0.1 to about 1 mil. thick.
  • the thickness of the coat will also determine the apparent density (d,,) of the particle as described above.
  • the formula given above will indicate the weight percent of the coating metal required to adjust the apparent density of the diamonds to the desired amount by regulating the rate of reaction by adjusting the temperature and the concentration of the reactants and duration of treatment such desired deposits of encapsulating metal may be achieved.
  • EXAMPLE 3 instead of diamonds, we may use alumina. The mesh size, temperature, and procedure as described in Example 1 may be followed to produce a tungsten coat of the weight percent described. Since the alumina and diamonds are of analagous density, what has been stated with regard to the required weight percent (in the case of diamonds) of the encapsulating metal applies here as well.
  • a tungsten carbide may be coated with tantalum to adjust the weight percent as has been described above, following the procedure described in Example 1.
  • Example 5 The process of Example 2 was employed in coating silicon carbide particles of 80 100 mesh.
  • the density of silicon carbide approximates that of diamonds; what has been said of the required percent of tungsten carbide to adjust the apparent density of the coated diamonds applies as well to the silicon carbide.
  • the substrate surface is completely coated, indicating that the process of vacuum chemical vapor deposition has great throwing power.
  • the outer surface of the coated particles is topographically congruent to the outer surface of the underlying substrate and reproduces it.
  • the interlocked structure produces a coating of high tensile and bending strength. Since the coating is produced at high temperature, on cooling the contraction of some 1,100F. will be substantially in excess of the contraction of the substrate as described and the resultant eventual contraction will produce a compression of the underlying abrasive particle.
  • the metal coated particles may be employed in producing improved abrader structures from mixtures of primary and secondary abrasives by techniques previouslyused with such mixtures employing unencapsulated abrasive particles. These include what have become known as infiltration, hot pressing, and flame metallizing procedures.
  • the abrader is made up of a single type of abrasive particle, for example, any of the suitable particles of Table 1 selected as described above and having a specific gravity less than the metal used as a matrix where the abrader is to be formed from a mixture of the abrasive and metal powder, we may wish to adjust the specific gravity of the abrasive to bring it more closely to that of the metal.
  • the apparent densities of the primary and secondary particles may be adjusted so that the difference in the apparent densities after adjustment according to our invention shall be equal to about 40 percent to 80 percent or less of the difference in the specific gravity of the unencapsulated abrasives. More preferably we may reduce the difference between the particles to under about 25 percent.
  • a coat of tungsten metal (19.3 sp.g.) of about 98.7 percent by weight of a coated diamond particle 3.5 sp.g. will match the specific gravity of a eutectic carbide of specific gravity.
  • the tungsten carbide By coating the tungsten carbide with titanium sp.g. 4.54, we may reduce the apparent density of the tungsten carbide and thus require a lesser coat on the diamond particle to match.
  • the primary abrasive is diamond and the secondary abrasive is tungsten carbide
  • the encapsulation of the abrasive particles with a metallic envelope according to our invention has values in addition to permitting of a uniform distribution of the particles as described above.
  • the secondary abrasive used in the above construction may be usefully a tungsten carbide ranging from WC having 6.12 weight percent of carbon to W C having a carbon content about3. 16 weight percent.
  • a useful material is so-called sintered tungsten carbide and consists of microsized WC crystals and cobalt metal bonded by liquid phase sintering at high temperature. The cobalt content varies from 3 weight percent to over weight percent. This material has a hardness of about 1250 to 1350 kg/mm (Knoop). Another form of eutectic alloy containing about 4 percent by weight of carbon having a hardness in the range of 1,900 to 2,000 kg/mm (Knoop) may also be used.
  • FIGS. 2 and 5 show a suitable graphite mold for use with the infiltrant technique for producing saw blade segments to be brazed to a saw blade.
  • the mold is composed of a base 101, the mold proper 102, with an anchor 103, carrying a funnel 104, clamped by clamp bolt 105, and covered with a furnace cap 106.
  • the mold proper consists of circumferentially space mold cavities having substantially smaller circumferential extension than their radial length.
  • the primary abrasive for example, a mix of tungsten encapsulated diamond particlcs 20 45 or 45 60 screen having a density of about 7 and titanium encapsulated powdered tungsten carbide with a density of about 7 is tamped into the mold 102.
  • the funnel contains a bronze-copper-tin alloy powder through a 200 mesh screen.
  • the diamonds form about 25 percent by volume of the mixture of metal and diamond finally formed in the mold cavity 103.
  • the mold is heated to about 2,0002,100 F. to melt the alloy which percolates through the interstices between the diamond particles in the mold cavity, i.e. infiltrates the pores filling them to form the continuous phase binding the coated diamond particles and the tungsten carbide in the continuous metal matrix.
  • Tungsten carbide may be coated, for example, with molybdenum, tungsten, titanium or niobium.
  • molybdenum or titanium or columbium we prefer to employ molybdenum or titanium or columbium and to encapsulate the secondary abrasive by the process previously described.
  • coated tungsten carbide may be replaced by coated secondary abrasive as described above, for example, tungsten coated alumina or silicon carbide.
  • .metal envelope may be tungsten or any other metal chosen as described above.
  • the mixture in the mold is a mixture of abrasive particles and powdered metal which is to form the continuous metal matrix to bond the abrasive particles.
  • EXAMPLE 7 The mold employed is shown in FIGS. 3 and 4. The mold is similar to that of FIG. 2 except that no funnel is employed and the nut is now a plug 107 and the funnel 104 is replaced by the cap 108 in place of cap 106. The mold is formed for the insertion of the cap as shown.
  • the secondary abrasive may be coated abrasive as described in connection with Example 6.
  • an intimate mixture of titanium encapsulated tungsten carbide and tungsten coated diamond of -35 50 mesh which has been coated with a tungsten metal envelope to a density of about 7 to match the density of the encapsulated tungsten carbide as described above and a -200 mesh bronze-tin alloy are tamped into the mold of FIGS. 4 and 5.
  • the concentration of diamonds in the mix may suitably be the same as described in connection with Example 7.
  • the mold is heated to about 1,600F. at about 3,000 p.s.i. pressure to produce a saw blade element as described above.
  • sections of about l-7/8 inches long, oneeighth inch wide, and about five thirty-seconds inch thick may be formed suitably by introducing about 3,500 stones of mesh size -45 60 grit or about 1.1 carats of diamond grit.
  • the abrader will be in the form suitable to be mounted by brazing to a saw blade as shown in FIG. 6.
  • metal coated tungsten carbide we may use another metal coated secondary abrasive described above, for example, metal coated alumina or silicon carbide as described above.
  • the higher melting metals as binder matrix such as iron, cobalt, nickel or alloys of these metals and heat the hot press mold to temperatures as high as above l,5 35 F. depending on the melting point of the metal selected to form the binder.
  • Example 2 In producing the encapsulated abrasives employed in the processes of Examples 7 and 8, we prefer to employ the process of encapsulation described in Example 2 and where diamonds are referred to we prefer, where they are synthetic diamonds having a smooth face, that this be etched, for example, by the procedure of Example 1.
  • FIG. 7 shows a 0.025 inch tungsten coat on an alumina particle in the metal matrix at 140 X magnification.
  • FIG. 8 shows a similar tungsten coated alumina particle in a metal matrix at 280 X magnification.
  • FIG. 9 shows a micron tungsten coated diamond particle hot pressed into a metal matrix at 210 X magnification and FIG. 10 shows a portion of the particle at 840 X magnification.
  • FIG. 1 1 shows -80 100 mesh silicon carbide particle coated with tungsten, hot pressed into a metal matrix at 280 X magnification.
  • FIG. 12 shows tungsten coated A1 0 hot pressed in a metal matrix at l,700 polished and etched to show the allotriomorphic dendrite crystals. 2 It will be seen the excellent throwing power of the process and the intimate coating produced. The metal sheath is congruent to the substrate surface coproducing it faithfully. The resultant intimate bond produces the advantages of compression and hot transfer referred to above.
  • the cyystal forms will be seen to be allotriomorphic with the interlocked dendrites as described above.
  • a shaped abrader comprising a continuous phase of a metal matrix, primary abrasive particles and secondary abrasive particles, said primary and secondary abrasive particles being of different densities, the primary abrasive particles having a hardness more than 2,000 kg/mm and said secondary abrasive particles having a hardness of above about 1,250 kg/rnm and less than the hardness of the primary abrasive particles, the particles of lower density, being encapsulated in a metal envelope, the densities of said encapsulated particles of lower density being greater than the density of the unencapsulated particles of lower density, said encapsulated particles having a density more than 30 percent of the density of highest density, and said particles being substantially uniformly distributed in said metal matrix.
  • the-secondary abrasive is metal encapsulated with a member of the group consisting of tungsten carbide and alumina and silicon carbide.
  • the primary abrasive is metal encapsulated diamonds and the secondary abrasive is a member of the group consisting of metal encapsulated tungsten carbide, metal encapsw lated alumina and metal encapsulated silicon carbide.
  • the abrader of claim 1 in which the primary abrasive is diamond encapsulated with tungsten and the secondary abrasive is silicon carbide encapsulated with tungsten.
  • the abrader of claim 1 in which the primary abrasive is diamond encapsulated with tungsten and the secondary abrasive is tungsten carbide encapsulated with a metal having a specific gravity less than the specific gravity 'of the tungsten'carbide.
  • the abrader of claim 10 in which the metal encapsulating the tungsten carbide is a metal having a specific gravity less than l5.
  • a hot press process for producing a shaped abrasive in which an intimate mixture of primary and secondary abrasive particles and a powderedmetal is positioned in a mold which is heated and subjected to elevated pressure on said mixture, the improvement in which said particles are composed of a primary abrasive having a hardness of above about 2,000 kg/mm and said secondary abrasive particle having a hardness in excess of about 1,250 kglmm and less than the hardness of the primary abrasive particles, the primary abrasive particles'having a different specific gravity from the specific gravity of the secondary abrasive particles, the primary or the secondary abrasive particles being encapsulated in a metal envelope, the densities of the encapsulated particles of lower density being more than 30 percent of the density of the particles of highest density and said particles being substantially uniformally distributed in said metal matrix.
  • said primary abrasive is diamond and said secondary abrasive is an inorganic compound having a hardness of at least about 2,000 kglmm 15.
  • the encapsulating metal is chosen from the group consisting of tungsten, or tantalum, columbium (niobium) molybdenum and titanium.
  • the secondary abrasive is chosen from the group consisting of metal encapsulated tungsten carbide metal encapsulated alumina and metal encapsulated silicon carbide.
  • the primary abrasive is metal encapsulated diamonds and the secondary abrasive is chosen from the group consisting of metal encapsulatedtungsten carbide, metal encapsulated alumina and metal encapsulated silicon carbide.
  • abrasive is diamond encapsulated with tungsten and the secondary abrasive is alumina encapsulated with tungsten.
  • the encapsulating metal is chosen from the group consisting of molybdenum, columbium, and titanium.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Powder Metallurgy (AREA)
US00220351A 1972-01-24 1972-01-24 Abraders, abrasive particles and methods for producing same Expired - Lifetime US3841852A (en)

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US00220351A US3841852A (en) 1972-01-24 1972-01-24 Abraders, abrasive particles and methods for producing same
FR7242482A FR2169576A5 (pt) 1972-01-24 1972-11-29
JP12445472A JPS5318755B2 (pt) 1972-01-24 1972-12-13
DE2302595A DE2302595C3 (de) 1972-01-24 1973-01-19 Schleifmittelkorper und Verfahren zu seiner Herstellung

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Cited By (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3929432A (en) * 1970-05-29 1975-12-30 De Beers Ind Diamond Diamond particle having a composite coating of titanium and a metal layer
US3973925A (en) * 1973-03-20 1976-08-10 Toshio Asaeda Manufacturing process for a metal bonded grinding tool and the metal bonded grinding tool produced thereby
US3975568A (en) * 1972-04-12 1976-08-17 Union Carbide Corporation Low-friction, wear-resistant material and process for making the same
US4062660A (en) * 1973-04-16 1977-12-13 Nicholas Michael G Method of producing nickel coated diamond particles
US4063909A (en) * 1974-09-18 1977-12-20 Robert Dennis Mitchell Abrasive compact brazed to a backing
US4102085A (en) * 1976-09-02 1978-07-25 Kaman Sciences Corporation Abrasive coated sharpening tool and method of making it
US4108614A (en) * 1976-04-14 1978-08-22 Robert Dennis Mitchell Zirconium layer for bonding diamond compact to cemented carbide backing
US4124401A (en) * 1977-10-21 1978-11-07 General Electric Company Polycrystalline diamond body
US4234661A (en) * 1979-03-12 1980-11-18 General Electric Company Polycrystalline diamond body/silicon nitride substrate composite
US4943488A (en) * 1986-10-20 1990-07-24 Norton Company Low pressure bonding of PCD bodies and method for drill bits and the like
US5011514A (en) * 1988-07-29 1991-04-30 Norton Company Cemented and cemented/sintered superabrasive polycrystalline bodies and methods of manufacture thereof
US5030276A (en) * 1986-10-20 1991-07-09 Norton Company Low pressure bonding of PCD bodies and method
US5062865A (en) * 1987-12-04 1991-11-05 Norton Company Chemically bonded superabrasive grit
US5096465A (en) * 1989-12-13 1992-03-17 Norton Company Diamond metal composite cutter and method for making same
US5116568A (en) * 1986-10-20 1992-05-26 Norton Company Method for low pressure bonding of PCD bodies
US5126207A (en) * 1990-07-20 1992-06-30 Norton Company Diamond having multiple coatings and methods for their manufacture
WO1996004862A1 (en) 1994-08-12 1996-02-22 U.S. Synthetic Prosthetic joint with diamond coated interfaces
WO1997006339A1 (en) * 1995-08-03 1997-02-20 Dresser Industries, Inc. Hardfacing with coated diamond particles
US5637123A (en) * 1994-02-19 1997-06-10 Kozo Ishizaki Porous metal bond grinder and method of manufacturing the same
US5871060A (en) * 1997-02-20 1999-02-16 Jensen; Kenneth M. Attachment geometry for non-planar drill inserts
US5885149A (en) * 1994-11-16 1999-03-23 Gillet; Thierry Homogenous abrasive tool
WO1999036590A1 (en) * 1998-01-16 1999-07-22 Dresser Industries, Inc. Hardfacing having coated ceramic particles or coated particles of other hard materials
US5979579A (en) * 1997-07-11 1999-11-09 U.S. Synthetic Corporation Polycrystalline diamond cutter with enhanced durability
WO2000007773A1 (de) * 1998-08-03 2000-02-17 Tyrolit Schleifmittelwerke Swarovski Kg Abrasivwerkzeug
WO2000015942A1 (en) * 1998-09-16 2000-03-23 Baker Hughes Incorporated Reinforced abrasive-impregnated cutting elements, drill bits including same and methods
US6068071A (en) * 1996-05-23 2000-05-30 U.S. Synthetic Corporation Cutter with polycrystalline diamond layer and conic section profile
US6098730A (en) * 1996-04-17 2000-08-08 Baker Hughes Incorporated Earth-boring bit with super-hard cutting elements
US6102140A (en) * 1998-01-16 2000-08-15 Dresser Industries, Inc. Inserts and compacts having coated or encrusted diamond particles
US6170583B1 (en) 1998-01-16 2001-01-09 Dresser Industries, Inc. Inserts and compacts having coated or encrusted cubic boron nitride particles
US6361403B1 (en) * 1998-12-18 2002-03-26 Tosoh Corporation Abrasive member, abrasive disc provided with same, and polishing process
US6524357B2 (en) 2000-06-30 2003-02-25 Saint-Gobain Abrasives Technology Company Process for coating superabrasive with metal
US6596225B1 (en) * 2000-01-31 2003-07-22 Diamicron, Inc. Methods for manufacturing a diamond prosthetic joint component
US20030192259A1 (en) * 2000-12-04 2003-10-16 D'evelyn Mark Philip Abrasive diamond composite and method of making thereof
US6663682B2 (en) 2000-06-30 2003-12-16 Saint-Gobain Abrasives Technology Company Article of superabrasive coated with metal
US20050109545A1 (en) * 2003-11-25 2005-05-26 Greg Lockwood Barrier Coated Granules for Imporve Hardfacing Material
US20050260939A1 (en) * 2004-05-18 2005-11-24 Saint-Gobain Abrasives, Inc. Brazed diamond dressing tool
US20070032877A1 (en) * 2005-08-05 2007-02-08 Whiteside Leo A Coated ceramic total joint arthroplasty and method of making same
US20070093181A1 (en) * 2005-10-20 2007-04-26 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
US20070267820A1 (en) * 2006-05-16 2007-11-22 Skf Usa Inc. Mechanical end face seal with ultrahard face material
US20080128176A1 (en) * 2005-11-10 2008-06-05 Heeman Choe Silicon carbide composite materials, earth-boring tools comprising such materials, and methods for forming the same
US20080187769A1 (en) * 2006-04-13 2008-08-07 3M Innovative Properties Metal-coated superabrasive material and methods of making the same
US20080202821A1 (en) * 2007-02-23 2008-08-28 Mcclain Eric E Multi-Layer Encapsulation of Diamond Grit for Use in Earth-Boring Bits
US20090120008A1 (en) * 2007-11-09 2009-05-14 Smith International, Inc. Impregnated drill bits and methods for making the same
US20100064594A1 (en) * 2008-09-16 2010-03-18 Diamond Innovations, Inc. Abrasive grains having unique features
WO2010073198A3 (en) * 2008-12-22 2010-10-14 Element Six (Production) (Pty) Ltd Ultra hard/hard composite materials
US20100263938A1 (en) * 2009-04-21 2010-10-21 Baker Hughes Incorporated Impregnated Bit with Increased Binder Percentage
US20130081334A1 (en) * 2011-09-29 2013-04-04 Marc Linh Hoang Bonded abrasives formed by uniaxial hot pressing
EP3464786A4 (en) * 2016-05-27 2020-02-26 Baker Hughes, a GE company, LLC METHOD FOR MODIFYING THE SURFACES OF DIAMOND PARTICLES, AND RELATED DIAMOND PARTICLES AND EARTH DRILLING TOOLS

Families Citing this family (2)

* Cited by examiner, † Cited by third party
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JPS5950864B2 (ja) * 1977-11-26 1984-12-11 日産自動車株式会社 自動車用エンジン
RU2749789C1 (ru) * 2020-10-01 2021-06-16 Государственное Научное Учреждение "Объединенный Институт Машиностроения Национальной Академии Наук Беларуси" Способ получения порошка для магнитно-абразивной обработки

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US3293012A (en) * 1962-11-27 1966-12-20 Exxon Production Research Co Process of infiltrating diamond particles with metallic binders
US3574579A (en) * 1968-05-24 1971-04-13 Carborundum Co Bronze-iron metal-bonded diamond abrasive articles containing boron nitride particles
US3650714A (en) * 1969-03-04 1972-03-21 Permattach Diamond Tool Corp A method of coating diamond particles with metal
US3650715A (en) * 1969-04-04 1972-03-21 Du Pont Abrasive compositions
US3664819A (en) * 1969-11-14 1972-05-23 Norton Co Resin bonded metal-coated diamond or cubic boron nitride abrasive tools containing an inorganic crystalline filler and graphite

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Publication number Priority date Publication date Assignee Title
US3293012A (en) * 1962-11-27 1966-12-20 Exxon Production Research Co Process of infiltrating diamond particles with metallic binders
US3574579A (en) * 1968-05-24 1971-04-13 Carborundum Co Bronze-iron metal-bonded diamond abrasive articles containing boron nitride particles
US3650714A (en) * 1969-03-04 1972-03-21 Permattach Diamond Tool Corp A method of coating diamond particles with metal
US3650715A (en) * 1969-04-04 1972-03-21 Du Pont Abrasive compositions
US3664819A (en) * 1969-11-14 1972-05-23 Norton Co Resin bonded metal-coated diamond or cubic boron nitride abrasive tools containing an inorganic crystalline filler and graphite

Cited By (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3929432A (en) * 1970-05-29 1975-12-30 De Beers Ind Diamond Diamond particle having a composite coating of titanium and a metal layer
US3975568A (en) * 1972-04-12 1976-08-17 Union Carbide Corporation Low-friction, wear-resistant material and process for making the same
US3973925A (en) * 1973-03-20 1976-08-10 Toshio Asaeda Manufacturing process for a metal bonded grinding tool and the metal bonded grinding tool produced thereby
US4062660A (en) * 1973-04-16 1977-12-13 Nicholas Michael G Method of producing nickel coated diamond particles
US4063909A (en) * 1974-09-18 1977-12-20 Robert Dennis Mitchell Abrasive compact brazed to a backing
US4108614A (en) * 1976-04-14 1978-08-22 Robert Dennis Mitchell Zirconium layer for bonding diamond compact to cemented carbide backing
US4102085A (en) * 1976-09-02 1978-07-25 Kaman Sciences Corporation Abrasive coated sharpening tool and method of making it
US4124401A (en) * 1977-10-21 1978-11-07 General Electric Company Polycrystalline diamond body
US4234661A (en) * 1979-03-12 1980-11-18 General Electric Company Polycrystalline diamond body/silicon nitride substrate composite
US4943488A (en) * 1986-10-20 1990-07-24 Norton Company Low pressure bonding of PCD bodies and method for drill bits and the like
US5030276A (en) * 1986-10-20 1991-07-09 Norton Company Low pressure bonding of PCD bodies and method
US5116568A (en) * 1986-10-20 1992-05-26 Norton Company Method for low pressure bonding of PCD bodies
US5062865A (en) * 1987-12-04 1991-11-05 Norton Company Chemically bonded superabrasive grit
US5011514A (en) * 1988-07-29 1991-04-30 Norton Company Cemented and cemented/sintered superabrasive polycrystalline bodies and methods of manufacture thereof
US5096465A (en) * 1989-12-13 1992-03-17 Norton Company Diamond metal composite cutter and method for making same
US5126207A (en) * 1990-07-20 1992-06-30 Norton Company Diamond having multiple coatings and methods for their manufacture
US5224969A (en) * 1990-07-20 1993-07-06 Norton Company Diamond having multiple coatings and methods for their manufacture
US5637123A (en) * 1994-02-19 1997-06-10 Kozo Ishizaki Porous metal bond grinder and method of manufacturing the same
WO1996004862A1 (en) 1994-08-12 1996-02-22 U.S. Synthetic Prosthetic joint with diamond coated interfaces
US5885149A (en) * 1994-11-16 1999-03-23 Gillet; Thierry Homogenous abrasive tool
US5755299A (en) * 1995-08-03 1998-05-26 Dresser Industries, Inc. Hardfacing with coated diamond particles
EP0842346A1 (en) * 1995-08-03 1998-05-20 Dresser Industries Inc. Hardfacing with coated diamond particles
US5755298A (en) * 1995-08-03 1998-05-26 Dresser Industries, Inc. Hardfacing with coated diamond particles
AU702263B2 (en) * 1995-08-03 1999-02-18 Halliburton Energy Services, Inc. Hardfacing with coated diamond particles
WO1997006339A1 (en) * 1995-08-03 1997-02-20 Dresser Industries, Inc. Hardfacing with coated diamond particles
EP0842346A4 (en) * 1995-08-03 1999-08-11 Dresser Ind RECHARGING USING COATED DIAMOND PARTICLES
US6098730A (en) * 1996-04-17 2000-08-08 Baker Hughes Incorporated Earth-boring bit with super-hard cutting elements
US6068071A (en) * 1996-05-23 2000-05-30 U.S. Synthetic Corporation Cutter with polycrystalline diamond layer and conic section profile
US5871060A (en) * 1997-02-20 1999-02-16 Jensen; Kenneth M. Attachment geometry for non-planar drill inserts
US5979579A (en) * 1997-07-11 1999-11-09 U.S. Synthetic Corporation Polycrystalline diamond cutter with enhanced durability
US6138779A (en) * 1998-01-16 2000-10-31 Dresser Industries, Inc. Hardfacing having coated ceramic particles or coated particles of other hard materials placed on a rotary cone cutter
US6102140A (en) * 1998-01-16 2000-08-15 Dresser Industries, Inc. Inserts and compacts having coated or encrusted diamond particles
WO1999036590A1 (en) * 1998-01-16 1999-07-22 Dresser Industries, Inc. Hardfacing having coated ceramic particles or coated particles of other hard materials
US6170583B1 (en) 1998-01-16 2001-01-09 Dresser Industries, Inc. Inserts and compacts having coated or encrusted cubic boron nitride particles
US6338907B1 (en) 1998-08-03 2002-01-15 Tyrolit Schleifmittelwerke Swarovski K.G. Abrasive tool
WO2000007773A1 (de) * 1998-08-03 2000-02-17 Tyrolit Schleifmittelwerke Swarovski Kg Abrasivwerkzeug
US6458471B2 (en) 1998-09-16 2002-10-01 Baker Hughes Incorporated Reinforced abrasive-impregnated cutting elements, drill bits including same and methods
US6241036B1 (en) 1998-09-16 2001-06-05 Baker Hughes Incorporated Reinforced abrasive-impregnated cutting elements, drill bits including same
US6742611B1 (en) 1998-09-16 2004-06-01 Baker Hughes Incorporated Laminated and composite impregnated cutting structures for drill bits
WO2000015942A1 (en) * 1998-09-16 2000-03-23 Baker Hughes Incorporated Reinforced abrasive-impregnated cutting elements, drill bits including same and methods
US6361403B1 (en) * 1998-12-18 2002-03-26 Tosoh Corporation Abrasive member, abrasive disc provided with same, and polishing process
US6596225B1 (en) * 2000-01-31 2003-07-22 Diamicron, Inc. Methods for manufacturing a diamond prosthetic joint component
US6524357B2 (en) 2000-06-30 2003-02-25 Saint-Gobain Abrasives Technology Company Process for coating superabrasive with metal
US6663682B2 (en) 2000-06-30 2003-12-16 Saint-Gobain Abrasives Technology Company Article of superabrasive coated with metal
US20030192259A1 (en) * 2000-12-04 2003-10-16 D'evelyn Mark Philip Abrasive diamond composite and method of making thereof
US7303030B2 (en) * 2003-11-25 2007-12-04 Smith International, Inc. Barrier coated granules for improved hardfacing material
US20050109545A1 (en) * 2003-11-25 2005-05-26 Greg Lockwood Barrier Coated Granules for Imporve Hardfacing Material
US20080076338A1 (en) * 2004-05-18 2008-03-27 Saint-Gobain Abrasives, Inc. Brazed Diamond Dressing Tool
US8795034B2 (en) * 2004-05-18 2014-08-05 Saint-Gobain Abrasives, Inc. Brazed diamond dressing tool
US20050260939A1 (en) * 2004-05-18 2005-11-24 Saint-Gobain Abrasives, Inc. Brazed diamond dressing tool
US20070032877A1 (en) * 2005-08-05 2007-02-08 Whiteside Leo A Coated ceramic total joint arthroplasty and method of making same
US20070093181A1 (en) * 2005-10-20 2007-04-26 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
US7594845B2 (en) * 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
US7807099B2 (en) 2005-11-10 2010-10-05 Baker Hughes Incorporated Method for forming earth-boring tools comprising silicon carbide composite materials
US20080128176A1 (en) * 2005-11-10 2008-06-05 Heeman Choe Silicon carbide composite materials, earth-boring tools comprising such materials, and methods for forming the same
US8074750B2 (en) 2005-11-10 2011-12-13 Baker Hughes Incorporated Earth-boring tools comprising silicon carbide composite materials, and methods of forming same
US20100326739A1 (en) * 2005-11-10 2010-12-30 Baker Hughes Incorporated Earth-boring tools comprising silicon carbide composite materials, and methods of forming same
US20080187769A1 (en) * 2006-04-13 2008-08-07 3M Innovative Properties Metal-coated superabrasive material and methods of making the same
US20070267820A1 (en) * 2006-05-16 2007-11-22 Skf Usa Inc. Mechanical end face seal with ultrahard face material
US7793940B2 (en) 2006-05-16 2010-09-14 Skf Usa Inc. Mechanical end face seal with ultrahard face material
US7810588B2 (en) 2007-02-23 2010-10-12 Baker Hughes Incorporated Multi-layer encapsulation of diamond grit for use in earth-boring bits
US20080202821A1 (en) * 2007-02-23 2008-08-28 Mcclain Eric E Multi-Layer Encapsulation of Diamond Grit for Use in Earth-Boring Bits
US20090120008A1 (en) * 2007-11-09 2009-05-14 Smith International, Inc. Impregnated drill bits and methods for making the same
US8591613B2 (en) * 2008-09-16 2013-11-26 Diamond Innovations, Inc. Abrasive grains having unique features
US20100064594A1 (en) * 2008-09-16 2010-03-18 Diamond Innovations, Inc. Abrasive grains having unique features
WO2010073198A3 (en) * 2008-12-22 2010-10-14 Element Six (Production) (Pty) Ltd Ultra hard/hard composite materials
US8789626B2 (en) 2008-12-22 2014-07-29 Antionette Can Ultra hard/hard composite materials
US20100263938A1 (en) * 2009-04-21 2010-10-21 Baker Hughes Incorporated Impregnated Bit with Increased Binder Percentage
US8225890B2 (en) * 2009-04-21 2012-07-24 Baker Hughes Incorporated Impregnated bit with increased binder percentage
US20130081334A1 (en) * 2011-09-29 2013-04-04 Marc Linh Hoang Bonded abrasives formed by uniaxial hot pressing
EP3464786A4 (en) * 2016-05-27 2020-02-26 Baker Hughes, a GE company, LLC METHOD FOR MODIFYING THE SURFACES OF DIAMOND PARTICLES, AND RELATED DIAMOND PARTICLES AND EARTH DRILLING TOOLS

Also Published As

Publication number Publication date
DE2302595C3 (de) 1978-09-28
FR2169576A5 (pt) 1973-09-07
DE2302595A1 (de) 1973-08-02
JPS4886190A (pt) 1973-11-14
DE2302595B2 (de) 1978-01-26
JPS5318755B2 (pt) 1978-06-16

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