US3760306A - Dielectric support for high frequency coaxial lines - Google Patents

Dielectric support for high frequency coaxial lines Download PDF

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Publication number
US3760306A
US3760306A US00136841A US3760306DA US3760306A US 3760306 A US3760306 A US 3760306A US 00136841 A US00136841 A US 00136841A US 3760306D A US3760306D A US 3760306DA US 3760306 A US3760306 A US 3760306A
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United States
Prior art keywords
dielectric support
inner conductor
annular
central opening
support member
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Expired - Lifetime
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US00136841A
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English (en)
Inventor
G Spinner
F Pitschi
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H01B11/18—Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
    • H01B11/1834—Construction of the insulation between the conductors
    • H01B11/1856—Discontinuous insulation
    • H01B11/186—Discontinuous insulation having the shape of a disc

Definitions

  • ABSTRACT A coaxial structure employing a dielectric support positioned and secured within an outer conductor and having a central opening for receiving a short conductive member for joining two sections of coaxially aligned inner conductors whose end faces engage the end faces of the dielectric support member adjacent a central opening provided therein for receiving the short conductive member.
  • the diameter of the short conductive member is less than the diameter of the central opening 7 in the dielectric support to form a hollow, annular- 1 Claim, 1 Drawing Figure DIELECTRIC SUPPORT FOR HIGH FREQUENCY COAXIAL LINES
  • the invention relates to a dielectric support for coaxial lines which is supported on a portion of reduced diameter of the inner conductor and is provided with end-face grooves for compensation purposes, the transition to said inner conductor portion from both sides being via a conical surface and an end ring surface bearing on the dielectric support at the end face.
  • the solution adopted has been to provide the internal bore of the dielectric support, consisting for example of ceramic material, with a conductive coating by for example electroplatingmethods, said coating conducting the current over the axial length of the dielectric support.
  • This conductive coating is led outwardly on both sides to an end ring surface at which the support engages axially the end ring surface of the continuing inner conductor.
  • the problem underlying the invention is to avoid the occurrence of damaging peak field strengths without conductive coatings of the dielectric support.
  • the invention is based on the knowledge that in the outer region small air inclusions between the supporting parts of the inner conductor and the dielectric support cannot have a disadvantageous effect because in this cross-sectional plane due to the compensation grooves of the support between the outer and inner conductors there is a long air gap and only relatively short gaps in the dielectric of the support, i.e., in the outer portion and at the inner collar.-Due to this long air gap even small air inclusions in this region cannot produce high peak field intensities. In the region of the supporting wall of the support an air gap is deliberately provided and has such a length that the field intensitiesv cannot assume inadmissibly high values.
  • Thelatter may be provided both in the dielectric support and in the inner conductor portion.
  • the inner conductor portion is provided withinthe axial length of the support with two supporting collars on both sides and a portion. of further reduced diameter therebetween.
  • the annular air gap is advisable for the annular air gap to extend over a greater axial length than the supporting wall of the support.
  • FIGURE of the drawing shows a section of a support constructed accordingto the invention and inserted in a coaxial conductor.
  • a dielectric support 13 Inserted between the outer conductor 10 and inner conductor 12 is a dielectric support 13.
  • the latter lies in a groove 14 of the outer conductor 10 and is supported on a reduced-diameter portion of the inner conductor.
  • the dielectric support comprises for compensation purposes on both sides grooves 15 between which the supporting wall 16 is left with an axial length l.
  • the inner conductor 12 merges via a conical surface 18 into an end ring surface 19 which bears against the dielectric support at the end face and then into a collar 22 whose diameter is matched as accurately as possible to the internal diameter of the inner bore 20 of the dielectric support.
  • the inner conductor is further reduced in diameter, resulting in an annular air gap 26 between the inner conductor and the dielectric support.
  • the axial length of the supporting collars 22 is less than the axial depth of the grooves 15, i.e., the axial length of the annular gap 26 is greater than the axial thickness 1 of the supporting wall 16.
  • This construction results in an acceptable field strength distribution in every cross-sectional plane; any air gaps present in the outer portions do not have a detrimental influence due to the large air gap (small dielectric constant) formed by the grooves 15.
  • an air gap is connected in series with the dielectric of the dielectric support, said gap having radial dimensions large eough to prevent the occurrence of inadmissible peak field strengths.
  • a coaxial structure comprising a tubular outer conductor
  • a disc-shaped dielectric support member having an annular periphery the interior surface of said outer conductor having an annular groove for receiving the periphery of said dielectric support member;
  • said dielectric support member having a central opening axially aligned with the longitudinal axis of said outer conductor;
  • a third inner conductor member having its longitudinal axis coaxial with the longitudinal axis of said outer conductor; said third innerconductor mem her being positioned within the central opening in said dielectric member;
  • the diameter of said central opening being less than the diameter'of said first and second inner conductor sections
  • the diameter of said third inner conductor member being less than the diameter of said central opening whereby the outer surface of said third inner conductor member lies a spaced distance from the surface of said central opening toform a hollow annular shaped air gap;
  • said joining means comprising a supporting collar joined to each end surface'and extending a small distance into said central opening;
  • the grooves in said dielectric support member preventing detrimental influences in the surface of the dielectric support member due to the large air gap formed by the annular grooves and the air gap between the dielectric support member and the third inner conductor member being in series with the dielectric support member to prevent the occurrence of inadmissible peak field strengths.

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  • Waveguides (AREA)
  • Insulators (AREA)
  • Insulating Bodies (AREA)
  • Communication Cables (AREA)
US00136841A 1970-04-24 1971-04-23 Dielectric support for high frequency coaxial lines Expired - Lifetime US3760306A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2020173A DE2020173C3 (de) 1970-04-24 1970-04-24 Isolierstützenanordnung in Koaxialleitungen

Publications (1)

Publication Number Publication Date
US3760306A true US3760306A (en) 1973-09-18

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ID=5769276

Family Applications (1)

Application Number Title Priority Date Filing Date
US00136841A Expired - Lifetime US3760306A (en) 1970-04-24 1971-04-23 Dielectric support for high frequency coaxial lines

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Country Link
US (1) US3760306A (https=)
DE (1) DE2020173C3 (https=)
FR (1) FR2086327B1 (https=)
GB (1) GB1322852A (https=)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4145565A (en) * 1975-07-22 1979-03-20 Compagnie General d'Electricite S.A. Device for maintaining a separation between two electric conductors
US4161704A (en) * 1977-01-21 1979-07-17 Uniform Tubes, Inc. Coaxial cable and method of making the same
US4231003A (en) * 1977-12-21 1980-10-28 The Director-General Of National Laboratory For High Energy Physics Shield-type coaxial vacuum feedthrough
US4370511A (en) * 1981-03-17 1983-01-25 Westinghouse Electric Corp. Flexible gas insulated transmission line having regions of reduced electric field
WO2006065669A1 (en) * 2004-12-13 2006-06-22 Intest Corporation Signal module with reduced reflections
US20080191817A1 (en) * 2006-12-30 2008-08-14 Rohm And Haas Electronic Materials Llc Three-dimensional microstructures and methods of formation thereof
US20100007441A1 (en) * 2008-07-11 2010-01-14 Fujitsu Limited Coaxial connector having a dielectric material for impedance matching
US20100109819A1 (en) * 2006-12-30 2010-05-06 Houck William D Three-dimensional microstructures and methods of formation thereof
US20110115580A1 (en) * 2009-03-03 2011-05-19 Bae Systems Information And Electronic Systems Integration Inc. Two level matrix for embodying disparate micro-machined coaxial components
US20110181377A1 (en) * 2010-01-22 2011-07-28 Kenneth Vanhille Thermal management
US20110181376A1 (en) * 2010-01-22 2011-07-28 Kenneth Vanhille Waveguide structures and processes thereof
US20110210807A1 (en) * 2003-03-04 2011-09-01 Sherrer David W Coaxial waveguide microstructures and methods of formation thereof
US8542079B2 (en) 2007-03-20 2013-09-24 Nuvotronics, Llc Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US9024417B2 (en) 2007-03-20 2015-05-05 Nuvotronics, Llc Integrated electronic components and methods of formation thereof
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9993982B2 (en) 2011-07-13 2018-06-12 Nuvotronics, Inc. Methods of fabricating electronic and mechanical structures
US10310009B2 (en) 2014-01-17 2019-06-04 Nuvotronics, Inc Wafer scale test interface unit and contactors
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10497511B2 (en) 2009-11-23 2019-12-03 Cubic Corporation Multilayer build processes and devices thereof
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
CN111244591A (zh) * 2020-03-19 2020-06-05 潘勤娟 一种同轴传输线共面补偿结构
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2093261B (en) * 1981-02-13 1984-11-28 Pirelli General Plc Electric cable
DE3907299C1 (en) * 1989-03-07 1990-09-06 Spinner Gmbh Elektrotechnische Fabrik, 8000 Muenchen, De Insulating material supporting arrangement between two successive coaxial cable sections

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE27956C (de) * W. RlD-DERSTAD Hauptmann in Stockholm, Blasieholmstorg 11 Karten zu Kriegsspielen
US2623122A (en) * 1947-01-02 1952-12-23 Polytechnic Inst Brooklyn Individually matched bead supports for coaxial cables
US2774944A (en) * 1948-10-01 1956-12-18 Siemens Ag Spacer disk arrangement for coaxial cables or the like
GB776637A (en) * 1954-11-30 1957-06-12 Siemens Ag Improvements in or relating to disc-shaped spacing members for coaxial high-frequency transmission lines
DE1040631B (de) * 1956-03-23 1958-10-09 Georg Spinner Dipl Ing Isolierstuetze fuer koaxiale Leitungen fuer Dezimeter- und Zentimeterwellen
DE1064586B (de) * 1954-09-08 1959-09-03 Siemens Ag Endverschluss- oder UEbergangsstecker fuer koaxiale Hochfrequenzleitungen und Verfahren zur Herstellung derselben
DE1160520B (de) * 1960-02-05 1964-01-02 Georg Spinner Dipl Ing Verfahren zur Herstellung von reflexionsfreien Isolierstuetzen fuer Koaxialleitungen
DE1490633A1 (de) * 1964-08-20 1969-07-03 Siemens Ag Koaxialleitungsabschnitt mit Innenleiterhalterung
US3600709A (en) * 1967-10-06 1971-08-17 Felten & Guilleaume Carlswerk Terminal assembly for the end portion of a fluid-cooled coaxial cable

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE27956C (de) * W. RlD-DERSTAD Hauptmann in Stockholm, Blasieholmstorg 11 Karten zu Kriegsspielen
US2623122A (en) * 1947-01-02 1952-12-23 Polytechnic Inst Brooklyn Individually matched bead supports for coaxial cables
US2774944A (en) * 1948-10-01 1956-12-18 Siemens Ag Spacer disk arrangement for coaxial cables or the like
DE1064586B (de) * 1954-09-08 1959-09-03 Siemens Ag Endverschluss- oder UEbergangsstecker fuer koaxiale Hochfrequenzleitungen und Verfahren zur Herstellung derselben
GB776637A (en) * 1954-11-30 1957-06-12 Siemens Ag Improvements in or relating to disc-shaped spacing members for coaxial high-frequency transmission lines
DE1040631B (de) * 1956-03-23 1958-10-09 Georg Spinner Dipl Ing Isolierstuetze fuer koaxiale Leitungen fuer Dezimeter- und Zentimeterwellen
DE1160520B (de) * 1960-02-05 1964-01-02 Georg Spinner Dipl Ing Verfahren zur Herstellung von reflexionsfreien Isolierstuetzen fuer Koaxialleitungen
DE1490633A1 (de) * 1964-08-20 1969-07-03 Siemens Ag Koaxialleitungsabschnitt mit Innenleiterhalterung
US3600709A (en) * 1967-10-06 1971-08-17 Felten & Guilleaume Carlswerk Terminal assembly for the end portion of a fluid-cooled coaxial cable

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Neubauer et al., Higher Modes in Coaxial RF Lines Microwave Jr. 6 1969 pp. 62 *
Ragan, G.L. Microwave Transmission Circuits, McGraw Hill, 1948, pp. 155 170 *

Cited By (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4145565A (en) * 1975-07-22 1979-03-20 Compagnie General d'Electricite S.A. Device for maintaining a separation between two electric conductors
US4161704A (en) * 1977-01-21 1979-07-17 Uniform Tubes, Inc. Coaxial cable and method of making the same
US4231003A (en) * 1977-12-21 1980-10-28 The Director-General Of National Laboratory For High Energy Physics Shield-type coaxial vacuum feedthrough
US4370511A (en) * 1981-03-17 1983-01-25 Westinghouse Electric Corp. Flexible gas insulated transmission line having regions of reduced electric field
US20110210807A1 (en) * 2003-03-04 2011-09-01 Sherrer David W Coaxial waveguide microstructures and methods of formation thereof
US9312589B2 (en) 2003-03-04 2016-04-12 Nuvotronics, Inc. Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section
US10074885B2 (en) 2003-03-04 2018-09-11 Nuvotronics, Inc Coaxial waveguide microstructures having conductors formed by plural conductive layers
US8742874B2 (en) 2003-03-04 2014-06-03 Nuvotronics, Llc Coaxial waveguide microstructures having an active device and methods of formation thereof
WO2006065669A1 (en) * 2004-12-13 2006-06-22 Intest Corporation Signal module with reduced reflections
US7834718B2 (en) 2004-12-13 2010-11-16 Intest Corporation Signal module with reduced reflections
US20080273201A1 (en) * 2004-12-13 2008-11-06 Intest Corporation Signal Module With Reduced Reflections
US20100109819A1 (en) * 2006-12-30 2010-05-06 Houck William D Three-dimensional microstructures and methods of formation thereof
US9515364B1 (en) 2006-12-30 2016-12-06 Nuvotronics, Inc. Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume
US7649432B2 (en) * 2006-12-30 2010-01-19 Nuvotornics, LLC Three-dimensional microstructures having an embedded and mechanically locked support member and method of formation thereof
US8933769B2 (en) 2006-12-30 2015-01-13 Nuvotronics, Llc Three-dimensional microstructures having a re-entrant shape aperture and methods of formation
US20080191817A1 (en) * 2006-12-30 2008-08-14 Rohm And Haas Electronic Materials Llc Three-dimensional microstructures and methods of formation thereof
US8031037B2 (en) 2006-12-30 2011-10-04 Nuvotronics, Llc Three-dimensional microstructures and methods of formation thereof
US9024417B2 (en) 2007-03-20 2015-05-05 Nuvotronics, Llc Integrated electronic components and methods of formation thereof
US8542079B2 (en) 2007-03-20 2013-09-24 Nuvotronics, Llc Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector
US10431521B2 (en) 2007-03-20 2019-10-01 Cubic Corporation Integrated electronic components and methods of formation thereof
US9000863B2 (en) 2007-03-20 2015-04-07 Nuvotronics, Llc. Coaxial transmission line microstructure with a portion of increased transverse dimension and method of formation thereof
US10002818B2 (en) 2007-03-20 2018-06-19 Nuvotronics, Inc. Integrated electronic components and methods of formation thereof
US9570789B2 (en) 2007-03-20 2017-02-14 Nuvotronics, Inc Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof
US8026774B2 (en) 2008-07-11 2011-09-27 Fujitsu Limited Radio frequency signal transmission method with coaxial connection having a dielectric material for impedance matching
US8269576B2 (en) 2008-07-11 2012-09-18 Fujitsu Limited Coaxial connector having a dielectric material for impedance matching
US20110140800A1 (en) * 2008-07-11 2011-06-16 Fujitsu Limited Radio frequency signal transmission method with coaxial connection having a dielectric material for impedance matching
US7952449B2 (en) * 2008-07-11 2011-05-31 Fujitsu Limited Coaxial connector having a dielectric material for impedance matching
US20100007441A1 (en) * 2008-07-11 2010-01-14 Fujitsu Limited Coaxial connector having a dielectric material for impedance matching
US8659371B2 (en) 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US20110115580A1 (en) * 2009-03-03 2011-05-19 Bae Systems Information And Electronic Systems Integration Inc. Two level matrix for embodying disparate micro-machined coaxial components
US10497511B2 (en) 2009-11-23 2019-12-03 Cubic Corporation Multilayer build processes and devices thereof
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
US8717124B2 (en) 2010-01-22 2014-05-06 Nuvotronics, Llc Thermal management
US20110181377A1 (en) * 2010-01-22 2011-07-28 Kenneth Vanhille Thermal management
US20110181376A1 (en) * 2010-01-22 2011-07-28 Kenneth Vanhille Waveguide structures and processes thereof
US9505613B2 (en) 2011-06-05 2016-11-29 Nuvotronics, Inc. Devices and methods for solder flow control in three-dimensional microstructures
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US9583856B2 (en) 2011-06-06 2017-02-28 Nuvotronics, Inc. Batch fabricated microconnectors
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
US9993982B2 (en) 2011-07-13 2018-06-12 Nuvotronics, Inc. Methods of fabricating electronic and mechanical structures
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9608303B2 (en) 2013-01-26 2017-03-28 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9888600B2 (en) 2013-03-15 2018-02-06 Nuvotronics, Inc Substrate-free interconnected electronic mechanical structural systems
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US10193203B2 (en) 2013-03-15 2019-01-29 Nuvotronics, Inc Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
US10257951B2 (en) 2013-03-15 2019-04-09 Nuvotronics, Inc Substrate-free interconnected electronic mechanical structural systems
US10361471B2 (en) 2013-03-15 2019-07-23 Nuvotronics, Inc Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US10310009B2 (en) 2014-01-17 2019-06-04 Nuvotronics, Inc Wafer scale test interface unit and contactors
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10553511B2 (en) 2017-12-01 2020-02-04 Cubic Corporation Integrated chip scale packages
CN111244591A (zh) * 2020-03-19 2020-06-05 潘勤娟 一种同轴传输线共面补偿结构

Also Published As

Publication number Publication date
FR2086327A1 (https=) 1971-12-31
DE2020173C3 (de) 1981-01-08
FR2086327B1 (https=) 1974-05-31
DE2020173A1 (de) 1971-11-11
DE2020173B2 (de) 1980-04-10
GB1322852A (en) 1973-07-11

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