US3733694A - Procedure for sealing waveguide nozzles - Google Patents

Procedure for sealing waveguide nozzles Download PDF

Info

Publication number
US3733694A
US3733694A US00154281A US3733694DA US3733694A US 3733694 A US3733694 A US 3733694A US 00154281 A US00154281 A US 00154281A US 3733694D A US3733694D A US 3733694DA US 3733694 A US3733694 A US 3733694A
Authority
US
United States
Prior art keywords
waveguide
nozzle
nozzles
polytetrafluoroethylene
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00154281A
Inventor
J Vlietstra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOLLANDSE SIGNAALAPP NV
Nv Hollandse Signaalapp nl
Original Assignee
HOLLANDSE SIGNAALAPP NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOLLANDSE SIGNAALAPP NV filed Critical HOLLANDSE SIGNAALAPP NV
Application granted granted Critical
Publication of US3733694A publication Critical patent/US3733694A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/02Waveguide horns
    • H01Q13/0283Apparatus or processes specially provided for manufacturing horns
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/08Dielectric windows
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/42Housings not intimately mechanically associated with radiating elements, e.g. radome
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making

Definitions

  • ABSTRACT Waveguide nozzles are sealed by means of polytetrafluoroethylene strips, whose dimensions correspond with those of the waveguide nozzles to be sealed.
  • the edges of a polytetrafluoroethylene strip are provided with a film of solderable material. The strip is soldered to a waveguide nozzle using said film.
  • the invention relates to a procedure for sealing waveguide nozzles by means of polytetrafluoroethylene.
  • a third disadvantage of the usual sealing method is that leakage will readily occur when gases are used such as freon to reduce the disruptive voltage in waveguide systems.
  • waveguide nozzles are sealed by soldering a polytetrafluoroethylene strip, whose dimensions correspond with those of the wave guide nozzle to be'sealed and whose edges are provided with a film of solderable material, to the waveguide nozzle using said frame.
  • waveguide and waveguide nozzle are denoted by l and 2 respectively.
  • Waveguide nozzle 2 is sealed by means of polytetrafluoroethylene strip 3, whose dimensions correspond with those of the waveguide nozzle to be sealed and whose edges 4 are provided with a film 5 consisting of solderable material.
  • the polytetrafluoroethylene strip 3 is soldered to the waveguide nozzle 2 using said film 5.
  • Film 5 is constituted by a copper layer which is provided with a lead-tin layer by means of electroplating.
  • the copper under-layer of film 5 can be obtained, starting from polytetrafluoroethylene to which a copper foil is glued and pressed, by removing the central surface by etching.
  • the waveguide nozzle is used in an antenna system located at a platform to be stabilized, it is recommended to manufacture the waveguide nozzle from a material that is as light as possible. Therefore, aluminum was chosen as material for the waveguide nozzle.
  • the edge 6 of the waveguide nozzle should be bronzed and then be provided with a lead-tin layer by means of electroplating. If the heavier copper or brass had been chosen as material for the waveguide nozzle, it would have sufficed to apply a lead-tin layer by means of electroplating.
  • the waveguide nozzle is provided with a soldering flux (resin) and pre-tin plated by immersion in a tin bath of approximately 250C;
  • soldering flux is applied to the polytetrafluoroethylene strip provided with film 5 and the strip is laid down flat;
  • the waveguide nozzle is drawn from the tin bath such that the tin can lead off properly; then it is pressed to the polytetrafluoroethylene strip;
  • the whole is cleaned in a bath, consisting of a mixture of cutting oil, benzene and isopropanol and degreased in freon vapor.
  • the above described way for sealing waveguide nozzles can also be applied for fitting pressure windows in waveguides. It is known to separate waveguide parts containing gas from waveguide parts lacking this gas, which is done by glueing a plastic partition, such as rexolyte, in the waveguide. It is also known to clamp a mica sheet between two waveguide nozzles provided with flanges and to seal the whole gastight using rubber sealing rings. The difficulties and drawbacks occurring with these known ways are similar to those occurring with the sealing of waveguide nozzles. Here too, a solution is offered by soldering a polytetrafluoroethylene strip, whose edges are provided at both sides with a film of solderable material, to both waveguide nozzles.
  • a method for sealing a waveguide nozzle by soldering a polytetrafluoroethylene strip having edge dimensions corresponding with confronting dimensions of said waveguide nozzle comprising forming a copper film along said edges of said polytetrafluoroethylene strip, electroplating a lead-tin layer upon said copper layer, adding solder flux to said lead-tin layer, pretinning the edges of said waveguide nozzle by immersing the same in a tin bath at approximately 250C, removing said waveguide nozzle from said tin bath, allowing the surplus tin to drip off, and pressing the edges of said waveguide nozzle to said polytetrafluoroethylene strip.
  • a method for sealing a waveguide nozzle as waveguide nozzle comprising bronzing the edges of claimed in claim 1, wherein said waveguide nozzle acid waveguide nozzle and electroplating said bronzed sentially consists of aluminum and comprises additional edges with a lead-tin layer. steps prior to the step of pre-tinning the edges of said

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

Waveguide nozzles are sealed by means of polytetrafluoroethylene strips, whose dimensions correspond with those of the waveguide nozzles to be sealed. The edges of a polytetrafluoroethylene strip are provided with a film of solderable material. The strip is soldered to a waveguide nozzle using said film.

Description

nite States Patent [191 Vlietstra [54] PROCEDURE FOR SEALING WAVEGUIDE NOZZLES [75] Inventor: Jan Vlietstra, l-lengelo, Netherlands [73] Assignee: N.V. ,Hollandse Signaalapparaten,
Hengelo, Netherlands [22] Filed: June 18, 1971 [21] Appl. No.: 154,281
[30] Foreign Application Priority Data July 2, 1970 Netherlands ..7009767 [52] US. Cl ..29/600, 29/473.1, 333/98 R [51] Int. Cl....., ..II0lp 11/00, HOlq 13/00 [58] Field of Search ..29/473.1, 600;
[56] References Cited UNITED STATES PATENTS 2,995,806 8/1961 Allison et a1; ..29/600 3,101,460 8/1963 Walker et al..... ....333/98 P 3,201,296 8/1965 Kilduff et a1 333/98 X 3,210,699 10/1965 Fagano ..333/98 P 3,293,065 12/1966 Roetter 29/473 l X 3,372,471 3/1968 Kuhn ..29/600 3,602,979 9/1971 lacona ..29/473.1
FOREIGN PATENTS OR APPLICATIONS 209,032 7/1956 Australia ..333/98 P OTHER PUBLICATIONS Benderly et al., A Teflon Microwave Window, The Microwave Journal, Vol. 4, No. 3, p. 101-106, March, 1961.
Brown, Charles W., Soldering Hookup Wire Insulated With Teflon Resins, The Journal of Teflon, Vol.3, No.4, April, 1962, pp. 1, 4 and 5.
Hodges, August D., Electroplating Parts of Teflon: It Can Be Done, The Journal of Teflon, May-June, 1967, pp. 4-5.
Primary Examiner-J. Spencer Overholser Assistant ExaminerRonald J. Shore Attorney-Frank R. Trifari [57] ABSTRACT Waveguide nozzles are sealed by means of polytetrafluoroethylene strips, whose dimensions correspond with those of the waveguide nozzles to be sealed. The edges of a polytetrafluoroethylene strip are provided with a film of solderable material. The strip is soldered to a waveguide nozzle using said film.
2 Claims, 1 Drawing Figure PAIENIEnmmzmzs 3 733 6 INVENTOR JAN VL ET T M I I s RA AGENT PROCEDURE FOR SEALING WAVEGUIDE NOZZLES The invention relates to a procedure for sealing waveguide nozzles by means of polytetrafluoroethylene.
Before polytetrafluoroethylene was used to seal waveguide nozzles, they were sealed by means of glass fiber reinforced polyester. However, the use of polyester was disadvantageous in that the sealing was not weatherproof; ultra-violet radiation, for instance, appeared to cause a so-called saponification. This saponification process could be prevented by covering the sealing with a coat of paint. However, since paint has a considerable metaloxide content, a coat of paint would cause additional damping of the energy to be radiated by the waveguide nozzle. Another disadvantage, inherent to a polyester waveguide sealing, is that the waveguide nozzle is unfit to a high degree to be used for transmitting relatively with respect to the dimensions of the waveguide nozzle large high-frequency powers.
it was assumed that the above drawbacks could be prevented merely by sealing the waveguide nozzle in the usual way by means of glass fiber reinforced polytetrafluoroethylene. By in the usual way is meant here the procedure whereby a polyester or polytetrafluoroethylene plate is clamped between two rectangular frames using rubber sealing rings and whereby the pressure window thus formed is screwed to a flange provided at the waveguide nozzle by means of screws.
This procedure, however, has the disadvantage that, when a relatively high power is used, a disruptive discharge will occur at those places where the screws through the two frames and the clamped polyester or polytetrafluoroethylene plate are located, such that the polyester will burn and at a considerably higher power even the polytetrafluoroethylene.
Another disadvantage, inherent to the use of a pressure window and flange as above described, lies in the enlargement of the dimensions of the waveguide nozzle. Such an enlargement disturbs the radiation pattern.
A third disadvantage of the usual sealing method is that leakage will readily occur when gases are used such as freon to reduce the disruptive voltage in waveguide systems.
It is the object of the invention to provide a sealing method for waveguide nozzles which fully obviates the above drawbacks; a method which, moreover, appears to be particularly cheap and requiring little work.
According to the invention waveguide nozzles are sealed by soldering a polytetrafluoroethylene strip, whose dimensions correspond with those of the wave guide nozzle to be'sealed and whose edges are provided with a film of solderable material, to the waveguide nozzle using said frame.
The invention will now be explained more fully with reference to the FlGURE.
In the FIGURE waveguide and waveguide nozzle are denoted by l and 2 respectively. Waveguide nozzle 2 is sealed by means of polytetrafluoroethylene strip 3, whose dimensions correspond with those of the waveguide nozzle to be sealed and whose edges 4 are provided with a film 5 consisting of solderable material. The polytetrafluoroethylene strip 3 is soldered to the waveguide nozzle 2 using said film 5.
Film 5 is constituted by a copper layer which is provided with a lead-tin layer by means of electroplating. The copper under-layer of film 5 can be obtained, starting from polytetrafluoroethylene to which a copper foil is glued and pressed, by removing the central surface by etching.
In view of the fact that the waveguide nozzle is used in an antenna system located at a platform to be stabilized, it is recommended to manufacture the waveguide nozzle from a material that is as light as possible. Therefore, aluminum was chosen as material for the waveguide nozzle. In order to be able to solder polytetrafluoroethylene strip 3 to the waveguide nozzle using film 5, the edge 6 of the waveguide nozzle should be bronzed and then be provided with a lead-tin layer by means of electroplating. If the heavier copper or brass had been chosen as material for the waveguide nozzle, it would have sufficed to apply a lead-tin layer by means of electroplating.
The soldering process proper whereby the polytetrafluoroethylene strip 3 is soldered to waveguide nozzle 2 using film 5 proceeds as follows:
the waveguide nozzle is provided with a soldering flux (resin) and pre-tin plated by immersion in a tin bath of approximately 250C;
soldering flux is applied to the polytetrafluoroethylene strip provided with film 5 and the strip is laid down flat;
the waveguide nozzle is drawn from the tin bath such that the tin can lead off properly; then it is pressed to the polytetrafluoroethylene strip;
after the two parts have fused together and cooled off, the whole is cleaned in a bath, consisting of a mixture of cutting oil, benzene and isopropanol and degreased in freon vapor.
It will be clear that apart from the dip method described here other soldering methods are possible, such as the high-frequency soldering method.
The above described way for sealing waveguide nozzles can also be applied for fitting pressure windows in waveguides. It is known to separate waveguide parts containing gas from waveguide parts lacking this gas, which is done by glueing a plastic partition, such as rexolyte, in the waveguide. It is also known to clamp a mica sheet between two waveguide nozzles provided with flanges and to seal the whole gastight using rubber sealing rings. The difficulties and drawbacks occurring with these known ways are similar to those occurring with the sealing of waveguide nozzles. Here too, a solution is offered by soldering a polytetrafluoroethylene strip, whose edges are provided at both sides with a film of solderable material, to both waveguide nozzles.
What we claim is:
1. A method for sealing a waveguide nozzle by soldering a polytetrafluoroethylene strip having edge dimensions corresponding with confronting dimensions of said waveguide nozzle, comprising forming a copper film along said edges of said polytetrafluoroethylene strip, electroplating a lead-tin layer upon said copper layer, adding solder flux to said lead-tin layer, pretinning the edges of said waveguide nozzle by immersing the same in a tin bath at approximately 250C, removing said waveguide nozzle from said tin bath, allowing the surplus tin to drip off, and pressing the edges of said waveguide nozzle to said polytetrafluoroethylene strip.
2. A method for sealing a waveguide nozzle as waveguide nozzle, comprising bronzing the edges of claimed in claim 1, wherein said waveguide nozzle essaid waveguide nozzle and electroplating said bronzed sentially consists of aluminum and comprises additional edges with a lead-tin layer. steps prior to the step of pre-tinning the edges of said

Claims (1)

  1. 2. A method for sealing a waveguide nozzle as claimed in claim 1, wherein said waveguide nozzle essentially consists of aluminum and comprises additional steps prior to the step of pre-tinning the edges of said waveguide nozzle, comprising bronzing the edges of said waveguide nozzle and electroplating said bronzed edges with a lead-tin layer.
US00154281A 1970-07-02 1971-06-18 Procedure for sealing waveguide nozzles Expired - Lifetime US3733694A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7009767A NL7009767A (en) 1970-07-02 1970-07-02

Publications (1)

Publication Number Publication Date
US3733694A true US3733694A (en) 1973-05-22

Family

ID=19810480

Family Applications (1)

Application Number Title Priority Date Filing Date
US00154281A Expired - Lifetime US3733694A (en) 1970-07-02 1971-06-18 Procedure for sealing waveguide nozzles

Country Status (8)

Country Link
US (1) US3733694A (en)
BE (1) BE768500A (en)
CA (1) CA954387A (en)
CH (1) CH519798A (en)
DE (1) DE2132242A1 (en)
FR (1) FR2097132A1 (en)
GB (1) GB1296298A (en)
NL (1) NL7009767A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2405563A1 (en) * 1977-10-05 1979-05-04 Endress Hauser Gmbh Co ANTENNA FOR MICROWAVE
US4591088A (en) * 1983-05-31 1986-05-27 Hughes Aircraft Company Solder reflow process for soldering shaped articles together
EP0457625A2 (en) * 1990-05-18 1991-11-21 Inax Corporation Dustproofing film for waveguide and method for production thereof
EP0222586B1 (en) * 1985-11-05 1995-01-18 Daiso Co., Ltd. Polyether polymer or copolymer, monomer therefor, and process for production thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT210401Z2 (en) * 1987-06-11 1988-12-30 Irte Spa HORN LIGHTING FOR REFLECTOR ANTENNAS WITH RECTANGULAR IRRADIATION DIAGRAM.
DE4140841A1 (en) * 1990-12-20 1992-07-02 Siemens Ag Microwave directional antenna with offset reflector and sub-reflector - is installed with excitation horn in trough-shaped, floor cover of cylindrical collar inclined forwards and downwards
GB2458663B (en) * 2008-03-26 2012-11-21 Thales Holdings Uk Plc Radome

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2995806A (en) * 1957-10-08 1961-08-15 Gen Electric Co Ltd Methods of manufacturing waveguides
US3101460A (en) * 1957-05-07 1963-08-20 Microwave Ass Hermetically sealed waveguide window with non-sputtering iris
US3201296A (en) * 1959-04-09 1965-08-17 Timothy J Kilduff Method of making a waveguide window
US3210699A (en) * 1961-12-21 1965-10-05 Nippon Electric Co Ceramic sealed window
US3293065A (en) * 1965-03-29 1966-12-20 Libbey Owens Ford Glass Co Method of coating glass for subsequent soldering
US3372471A (en) * 1963-10-26 1968-03-12 Int Standard Electric Corp Method of manufacturing microwave components
US3602979A (en) * 1970-01-28 1971-09-07 Nasa Bonding of reinforced teflon to metals

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3101460A (en) * 1957-05-07 1963-08-20 Microwave Ass Hermetically sealed waveguide window with non-sputtering iris
US2995806A (en) * 1957-10-08 1961-08-15 Gen Electric Co Ltd Methods of manufacturing waveguides
US3201296A (en) * 1959-04-09 1965-08-17 Timothy J Kilduff Method of making a waveguide window
US3210699A (en) * 1961-12-21 1965-10-05 Nippon Electric Co Ceramic sealed window
US3372471A (en) * 1963-10-26 1968-03-12 Int Standard Electric Corp Method of manufacturing microwave components
US3293065A (en) * 1965-03-29 1966-12-20 Libbey Owens Ford Glass Co Method of coating glass for subsequent soldering
US3602979A (en) * 1970-01-28 1971-09-07 Nasa Bonding of reinforced teflon to metals

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Benderly et al., A Teflon Microwave Window, The Microwave Journal, Vol. 4, No. 3, p. 101 106, March, 1961. *
Brown, Charles W., Soldering Hookup Wire Insulated With Teflon Resins, The Journal of Teflon, Vol. 3, No. 4, April, 1962, pp. 1, 4 and 5. *
Hodges, August D., Electroplating Parts of Teflon : It Can Be Done, The Journal of Teflon, May June, 1967, pp. 4 5. *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2405563A1 (en) * 1977-10-05 1979-05-04 Endress Hauser Gmbh Co ANTENNA FOR MICROWAVE
US4591088A (en) * 1983-05-31 1986-05-27 Hughes Aircraft Company Solder reflow process for soldering shaped articles together
EP0222586B1 (en) * 1985-11-05 1995-01-18 Daiso Co., Ltd. Polyether polymer or copolymer, monomer therefor, and process for production thereof
EP0457625A2 (en) * 1990-05-18 1991-11-21 Inax Corporation Dustproofing film for waveguide and method for production thereof
EP0457625A3 (en) * 1990-05-18 1992-08-12 Inax Corporation Dustproofing film for waveguide and method for production thereof

Also Published As

Publication number Publication date
BE768500A (en) 1971-11-03
CH519798A (en) 1972-02-29
FR2097132A1 (en) 1972-03-03
NL7009767A (en) 1972-01-04
CA954387A (en) 1974-09-10
DE2132242A1 (en) 1972-02-03
GB1296298A (en) 1972-11-15

Similar Documents

Publication Publication Date Title
US3733694A (en) Procedure for sealing waveguide nozzles
US3296011A (en) Surface treatment of perfluorocarbon polymer structures
US3274089A (en) Surface treatment of polymeric shaped structures
US2923651A (en) Metal-plastic film laminates
US4283259A (en) Method for maskless chemical and electrochemical machining
CA1070263A (en) Preparation of dielectric coatings of variable dielectric constant by plasma polymerization
US4382101A (en) Method for increasing the peel strength of metal-clad polymers
US4364792A (en) Process for the production of adhesive metal layers on non-conductors especially synthetic resins
US3234044A (en) Use of an electron beam for manufacturing conductive patterns
CA2124082A1 (en) Device for the Electrolytic Coating of Small Parts
GB1089375A (en) Electric cables and method for their production
US4652323A (en) Plasma deposition applications for communication cables
JPS6444605A (en) Delay line composed of dielectric waveguide
US20060243379A1 (en) Method and apparatus for lamination by electron beam irradiation
US3666913A (en) Method of bonding a component lead to a copper etched circuit board lead
US3659332A (en) Method of preparing electrical cables for soldering
NO155845C (en) PROCEDURE AND APPARATUS FOR GALVANIC ALUMINUM EXPOSURE.
US2533589A (en) Method of making sealed glass vessels
JP2021054012A (en) Laminate for printed wiring board
CN109640531A (en) A kind of power amplifier radio frequency board manufacturing method and power amplifier rf board
JPS5722852A (en) Treatment of surface for mold copper plate of continuous casting installation
US20090110916A1 (en) Multi-Layered Product for Printed Circuit Boards, and a Process for Continuous Manufacture of Same
JPH02134239A (en) Manufacture of substrate for flexible printed circuit
JPH08222035A (en) Ultraviolet-ray cross-linked foamed insulated wire and its manufacture
JPS5953542A (en) Manufacture of composite