US36469A - Improved sugar-evaporator - Google Patents

Improved sugar-evaporator Download PDF

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US36469A
US36469A US36469DA US36469A US 36469 A US36469 A US 36469A US 36469D A US36469D A US 36469DA US 36469 A US36469 A US 36469A
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pipe
steam
cock
boiling
stop
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D1/00Evaporating

Description

Miren STATES vJOHNlK. LEEDY, OF BLOOMINGTON, ILLINOIS.
IMPRovED SUGAR-EVAPORATOR.
Speciliealion forming part ol' Letlei's Patent No. 36.41659, dated September 1G, 1862.
To LZZ whom. it may' concern.-
Bc it known that I, JOHN K. `LEEDY, of Bloomington, in the county of McLean and State of Illinois, have invented certain new and useful Improvements in Sorghum-Evaporators; and I do hereby declare that the following is a full and exact description thereof, refcrencebeing had to the accompanying drawings, and to the letters of reference thereon marked. Y
In the drawings similar characters refer to like parts.
Figure 1 is a front elevation. Figs. 2 and 3 are elevations of the opposite sides. Fig. 4 is a vertical section through m x, Fig. l.
To enable those skilled in the art to make and use my invention, I will describe its construction and operation.
In the drawings, l is the cold-water reser- Voir.
sorghum is placed at the first stage of the operations.
3 is the steam-heater immediately over and forming the top of the steam-boilers.
4 and 5 are the iirst and second boilingpans.
6 is the evaporating steam-pipe communieating at x with the steam-boiler and passing spirally (having, however, several breaks or pitch-offs, as at WV, Fig. l) around the still 7, communicating with it at z. It will be noticed in the drawings that the pipe G' is so constructed as to have a channel upon the upper side of that portion of it which surrounds the still, for a purpose hereinafter set forth.
7 is the still.
8 are the rire-lines.'
9 are the scum-condensing pipes, which are formed by suitably bending the sheets of metal forming the boilingpans 4 and 5.
Aare the steam-boilers.
B are pipes leading from the top and bottom of scum-condensers 9 up through the sorghumreservoir into the cold-water reservoir.
C are the scum-condensing shield-pipes, and forming each of them one side of the lire-fines.
D are pipes leading from the top and bottom of the pipes or chambers C up through the sorghum-reservoir 2 into the cold-water reservoir l.
2 is the reservoir in which the juice of the E is the pipe connecting the still 7 with the worm in the reservoir. Y
F are the supports of the reservoirs.
G is the pipe forlconveying the juice from the boiling-pan 4 to the boiling-pan 5, and is regulated by a stopcoek, I?.
II is a pipe leading from the water-reservoir l to the. stcam-boilerA, andis controlled by the stop-cock S.
I is a short pipe leading from the sorghumreservoir 2 to the steam-heater 3, and is regulated by stop-cock N.
J is a short pipe for conveying water from the water-reservoir into steam-heater 3 for cleansing it, and is regulated by stop-cock R.v
K is the smoke-stack. A
L is a pipe in continuation of theworm, and passes its distilled contents into the channel of the steam-pipe 6.
M is the lower supporting frame-work.
O is a stop-cock on a short pipe for passing the warm juice from the steamheater 3 to the boiling-pan 4.
Q is a stopeoek on a short pipe for draw; ing off the Sirup from boilingpan 5 into the channel of pipe 6.
T are the steam-boiler gage-coeks.
U are'stop-eocks for drawing oit the water from the boilers and condensing-chambers 9 and G when the machine is not in' use.
V is the stop-cock at the bottom of the still for drawing-oii`- the dregs, &c.
XV shows a step or pitch-off in the channeled steam-pipe 6, which enables me to decant the sirup at any desired point in the course of its passage around the still in the hot channel. A
In the operation of my invention the waterreservoir 1 and the sorghum-reservoir 2arc properly illed. rlhe stop cock S is then opened and a suitable quantity of water is permitted to iow through pipe H from the waterreservoir to the steam-boiler A. The fire then.
. being kindled, the boiler7 s contents are chan ged.
into steaml1eating,to a good degree, the steamheater 3, into which I nowr permit a suitable quantity of the sorghum-j uice to flow from the sorghum-reservoir through pipe I and stopcock N. When the juice becomes sufficiently warmed in the steam-heater 3, it is drawn off through a pipe and stop-cock, O, into the boiling-pan 4 directly over one of the fire-fines 8.
After boiling here a suitable time a'nd after the scuin has been removed, the Sirup is drawn off through pipe G and stop-cock P into the lower boiling-pan, 5. When the Sirup has boiled as long as desired and `all the scum has been removed, it is drawn O through a pipe and stop-cock, Q, into the channel ofthe stea1nheated pipe 6. As the'sirup passes' through the heated channel in its course around the still, it is further heated and evaporated by the heat ofthe steam in the pipe, and may be drawn oft' at any of the several pitch-offs at therst, last, or other, according to the amount Y of heating necessary after leaving the boilingpans. By mcansof this channeled steam-pipe 6 I am enabled to finish the sirup without any danger of scorching. The pipesB B and D D keepthe scum-condensing chanibers Supplied at the top with cold water from the reservoir 1, for as the water in these chambers becomes heated it will rise in the upper pipes B and D, and have its place supplied by colder water through the lower pipes B D. i
I have found that by keeping the outer edges of the boiling- pans 4 and 5 cool by the means of the section-eondcnsers, as abovedescribed, the scum from the boiling sirup is attracted over to the cold side to Such a degree as to become tough and be readily readily removed.
The still 7, which is (in part) operated by the waste steam let into it at Z from the steampipe 6, is intended to distill the saecharine matter out of the scum, and operates simultaneously with the boiling and heating apparatus. The distilled spirits -pass up pipe E through the worm and down out of the pipe L into the Sirup in the finishing-channel of the stcam-pipe 6.
Water for cleansing purposes is admitted into the steam-heater 3 through pipe .I and cock It into boiling-pan 4 from the cock O, which also admits the heated sirup from the through pipe Gr` and cock Pinto the boiling pan 5, whence it -is discharged `through cock Q into the channel of the steam-pipe 6 after .cleansing which it can be thrown away.
Having thus fully described my invention, what I claim as new, and desire to secure by Letters Patent, is-` 1. The water-reservoir l and sorghum-rcs` ervoir 2, constructed and arranged substantially in the manner and for the purposes specified. 2. The construction and arrangement ofthe scum condensing pipes 9 for collecting the scum at the edge of the boiling- pans 4 and 5, substantially as herein specified.
3. `The construction and arrangement of the scunrcondensing shield-pipes C for shielding pipes9 from the action of the fire, substan-v tially as herein set forth.
4. 'Ihe construction and arrangement ofthe water or Steam boilers A and ,fire-fines 8, operating substantially Vas hereinbefore set forth.
5. .The channeled steam-pipe 6, (with or with out the pitch-offs W,) operating substantially as herein set forth.
6. The combination and arrangement of reservoir l, pipe J, and stop-cock R, stop-cock O, and pipe G, and stop-cock I, operating as set forth, for cleansing the steam-heater 3 and boiling- pans 4 and 5, and pipe 6.
7. The combination of the still 7 with the pipe 6, when operating substantiall y in the manner and for the purposes hereinbefore set forth.
In witness that I claim the foregoing I have hereunto set my hand in the presence of wit' nesses.
JOI-IN K. LEEDY.
Witnesses: I
D. H. BROWN,
XVILLiA-M S'rrrT.
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020175399A1 (en) * 2000-08-24 2002-11-28 James Stephen L. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US20030042581A1 (en) * 2001-08-29 2003-03-06 Fee Setho Sing Packaged microelectronic devices and methods of forming same
US20030109083A1 (en) * 2000-08-23 2003-06-12 Ahmad Syed Sajid Interconnecting substrates for electrical coupling of microelectronic components
US20040159921A1 (en) * 2001-12-26 2004-08-19 Stephen Moxham Methods for coupling a flowable conductive material to microelectronic substrates
US20040173899A1 (en) * 2003-03-04 2004-09-09 Peng Neo Chee Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US20070148820A1 (en) * 2005-12-22 2007-06-28 Micron Technology, Inc. Microelectronic devices and methods for manufacturing microelectronic devices
US7807505B2 (en) 2005-08-30 2010-10-05 Micron Technology, Inc. Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US20110169154A1 (en) * 2006-05-12 2011-07-14 Micron Technology, Inc. Microelectronic devices and methods for manufacturing microelectronic devices
US20110233740A1 (en) * 2007-03-13 2011-09-29 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030109083A1 (en) * 2000-08-23 2003-06-12 Ahmad Syed Sajid Interconnecting substrates for electrical coupling of microelectronic components
US20020175399A1 (en) * 2000-08-24 2002-11-28 James Stephen L. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US20030042581A1 (en) * 2001-08-29 2003-03-06 Fee Setho Sing Packaged microelectronic devices and methods of forming same
US20040159921A1 (en) * 2001-12-26 2004-08-19 Stephen Moxham Methods for coupling a flowable conductive material to microelectronic substrates
US20040159946A1 (en) * 2001-12-26 2004-08-19 Stephen Moxham Microelectronic assemblies, electronic devices, and apparatuses for supporting microelectronic substrates
US20040173899A1 (en) * 2003-03-04 2004-09-09 Peng Neo Chee Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US20080233684A1 (en) * 2003-03-04 2008-09-25 Micron Technology, Inc. Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US7807505B2 (en) 2005-08-30 2010-10-05 Micron Technology, Inc. Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US20070148820A1 (en) * 2005-12-22 2007-06-28 Micron Technology, Inc. Microelectronic devices and methods for manufacturing microelectronic devices
US20110169154A1 (en) * 2006-05-12 2011-07-14 Micron Technology, Inc. Microelectronic devices and methods for manufacturing microelectronic devices
US20110233740A1 (en) * 2007-03-13 2011-09-29 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US9812415B2 (en) 2007-03-13 2017-11-07 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

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