US3637902A - Epoxide resins cured with amine-glycidyl ester adducts in admixture with a phenolic accelerator - Google Patents

Epoxide resins cured with amine-glycidyl ester adducts in admixture with a phenolic accelerator Download PDF

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US3637902A
US3637902A US853204A US3637902DA US3637902A US 3637902 A US3637902 A US 3637902A US 853204 A US853204 A US 853204A US 3637902D A US3637902D A US 3637902DA US 3637902 A US3637902 A US 3637902A
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amine
glycidyl ester
phenolic
epoxide
adduct
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Clifford F Dukes
George B Scott
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Hi Tek Polymers Inc
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Celanese Coatings Co
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/56Amines together with other curing agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2618Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing nitrogen
    • C08G65/2621Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing nitrogen containing amine groups
    • C08G65/2624Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing nitrogen containing amine groups containing aliphatic amine groups

Definitions

  • thermosetting resins particularly room temperature curable poyepoxide resins.
  • Amine carbonate formation has been controlled by the use of aryl sulfonamide-aldehyde adducts as polyamine-epoxy accelerators.
  • aryl sulfonamide-aldehyde adducts are often heavy and difiicult to handle, especially at room temperature.
  • This invention relates to the co-reaction of epoxide resins with aliphatic polyamine adducts and phenolic accelerators and to the crosslinked infusible, insoluble products resulting therefrom.
  • this invention pertains to carrying out the above reaction to produce cured compositions having improved physical and surface properties.
  • This invention is directed to room temperature curable compositions made from an epoxide compound having more than one 1,2 epoxide groups per molecule, an amine glycidyl ester adduct and a phenolic accelerator.
  • the amine glycidyl ester adduct is a reaction product of about 3,637,902 Patented Jan. '25, 1972 0.5 to about 0.9 mols of a glycidyl ester having the general formula:
  • R R and R collectively have 5 to 15 carbon atoms and R, has 5 to 10 carbon atoms.
  • the phenolic accelerator is added in the ratio of about 0.55 to 1.0 phenolic OH equivalent of accelerator for each primary amine equivalent of the amine-glycidyl ester adduct.
  • About 40 to about parts of amine-glycidyl ester adduct and phenolic accelerator are blended with about 100 parts of the polyepoxide resin to make up the total composition of this invention.
  • the epoxide resins useful in this invention are epoxide resins which contain more than one 1,2-epoxide group per molecule and no other groups reactive with amines. They can be saturated or unsautrated, aliphatic, cycloaliphatic, aromatic or heterocyclic and can be monomeric or polymeric in nature.
  • Useful epoxide resins include glycidyl ethers of polyhydric phenols obtained by reacting a polyhydric phenol in an excess of epichlorohydrin with sodium hydroxide.
  • polyhydric phenols include bisphenol A (p,p'-dihydroxydiphenyl propane), resorcinol, hydroquinone, 4,4'-dihydroxybenzophenone, bis(4-hydroxyphenyl) ethane, 1,5-dihydroxynaphthalene, 4,4'-dihydroxybiphenyl, and movelak resins containing more than two phenol moieties linked through methylene bridges.
  • glycidyl ethers of polyhydric phenols are polymers prepared by reacting 1.1 up to about 2 mols of epichlorohydrin with 1 mol of dihydric phenol or by reacting diepoxides with added dihydric phenols.
  • Additional epoxide resins are glycidyl ethers of polyhydric alcohols made by reacting a polyhydric alcohol and epichlorohydrin with an acidic catalyst such as boron trifiuoride and subsequently treating the resulting product with an alkaline dehydrohalogenating agent.
  • an acidic catalyst such as boron trifiuoride
  • alkaline dehydrohalogenating agent Included among the polyhydric alcohols that can be used in the preparation of these polyepoxides are glycerine, ethylene glycol, propylene glycol, diethylene glycol, hexanetriol, pentaerythritol, trimethylol ethane and trimethylol propane.
  • Still other epoxide resins include glycidyl esters of polycarboxylic acids, such acids being azelaic acid, adipic acid, isophthalic acid, terephthalic acid, dimerized and trimerized unsaturated fatty acids, etc.
  • the epoxide resins also include epoxidized hydrocarbons such as vinyl cyclohexene dioxide, butadiene dioxide, dicyclopentadiene dioxide, epoxidized polybutadiene and limonene dioxide.
  • epoxide resins are epoxidized esters, for example, epoxidized soybean oil, epoxidized glycerol trilinoleate, and 3,4-epoxy-cyclohexylmethyl-3,4- epoxy-cyclohexane carboxylate.
  • Still other epoxides are polymers and copolymers of vinyl polymerizable monoepoxides, such monoepoxides being allyl glycidyl ether, glycidyl acrylate and glycidyl methacrylate.
  • the preferred epoxide resins are the glycidyl polyethers of polyhydric phenols and polyhydric alcohols, particularly the glycidyl polyether of p,p'-dihydroxydiphenyl propane or bisphenol A as it is commonly named.
  • epoxide resins Most preferred among the epoxide resins is a mixture of epoxide resins, one portion being derived from a polyhydric alcohol and the other portion being derived from a polyhydric phenol.
  • glycidyl esters as used in this invention can be described by the general formula:
  • R R and R collectively have 5 to carbon atoms.
  • esters similar to this is described in US. Patent No. 3,178,454.
  • R R and R consist of more than 15 carbon atoms the resulting films or castings are soft and subject to solvent attack.
  • R R and R are of less than 5 carbon atoms films tend to be brittle and unresilient.
  • Preferred are those glycidyl esters wherein R R and R have from 7 to 9 carbon atoms.
  • the use of the tertiary carbon type ester as illustrated above has several advantages over normal straight chain ethers or esters. In the first place as a glycidyl ester rather than ether the resins prepared are more resistant to attack from sunlight or ultra violet light.
  • R can contain from 5 to 10 carbon atoms. Included among the amines described by this formula are the various branched and straight chained pentyl, hexyl, heptyl, octyl, nonyl, and decyl amines. When the amine carbon content is decreased below 5 carbon atoms film or casting .4 flexibility decreases and the viscosity of the reacted amineglycidyl ester adduct increases above 2000 cps.
  • the viscosity of the amine-glycidyl ester adduct should be less than about 2000 cps. More viscous adducts are difiicult to handle at room temperature and in many cases it is impossible to achieve completely compatible blends when these higher viscosity adducts are mixed with epoxide resins. On the other hand when the carbon chain length is increased above 10 carbon atoms the films or castings become too soft and are subject to marring and scratching.
  • Preferred among the above amines are the C and C carbon diamines, especially 1,6- diaminohexane (hexamethylene diamine). Also of use, however, is trimethyl hexamethylene diamine.
  • adducts of this invention from about 0.5 to 0.9 mols of the selected glycidyl ester are reacted with each mol of the selected amine.
  • the adduct viscosity increases above the preferred 2000 cps. viscosity level.
  • epoxy blend tends to form amine carbonates.
  • Preferred are those adducts formed by reacting from about 0.7 to 0.8 mols of the glycidyl ester with each mol of amine.
  • Preparation of these amine-glycidyl ester adducts is accomplished by heating the desired amine to about 150 F. to 250 F.
  • the heat source usually then can be removed and the particular glycidyl ester added at a rate which maintains the reaction temperature in the 150 F. to 250 F. range. Since the amine glycidyl ester reaction is exothermic the addition of the glycidyl ester to the amine mixture usually produces enough heat to maintain this reaction temperature.
  • the reactants are held at reaction temperature for an additional few minutes to assure complete amineepoxide condensation.
  • products are prepared according to these methods they can be cooled to room temperature and will in most cases remain as free flowing liquids.
  • the final major constituent of the composition of this invention is a phenolic accelerator.
  • This accelerator can have from 6 to 18 carbon atoms per molecule and can be mono, di, or tri functional in phenolic groups. Included among these phenolic accelerators are phenol, the nitro phenols, the 'chlorophenols, the nonyl phenols, paratertiary butyl phenol, the resorcinols, the cresols, the salicylic acids and the various bisphenols. These accelerators can be present either singly or in admixture. Preferred among the above phenolic accelerators are phenol, paratertiary butyl phenol and bisphenol A (p,p'-dihydroxy diphenyl propane).
  • These accelerators are added in the ratio of about 0.55 to 1.0 phenolic OH equivalents for each primary amine equivalent of the above described amine-glycidyl ester adduct.
  • a ratio of phenolic OH equivalent to primary amine equivalents is about 0.6 to 0.8 equivalent of phenolic OH for each primary amine equivalent.
  • compositions of this invention are prepared by blending from 40 to parts by weight of the total weight of phenolic accelerator and amine-glycidyl ester adduct with about 100 parts of the epoxy compound.
  • the accelerator can be added to amine-glycidyl ester adduct and this mixture then added to the epoxide compound, or the adduct can be added to the epoxide compound followed by the addition of the accelerator.
  • the particular phenolic accelerator is solid at room temperature
  • the preferred procedure is to mix the phenolic accelerator with the amine-glycidyl ester adduct at slightly elevated temperature until a homogeneous solution is obtained.
  • the amine-glycidyl ester adduct has a viscosity at 25 C. of higher than about 1000 cps.
  • these diluents can be added in amounts equal to about to 40 percent by weight of the total composition, i.e., epoxide compound plus amine-glycidyl ester adduct plus phenolic accelerator.
  • Preferred among these common diluents are diethyl amino ethanol and N,N-dimethyl caproamide.
  • polyoxypropylene diamine 400 has the general formula:
  • any of these additives preferably should be added in an amount equal to from about 2 to about weight percent of the total composition (epoxide resin'plus glycidyl ester-amine adduct plus phenolic accelerator).
  • compositions of this invention can also be included with the compositions of this invention depending upon their intended end use.
  • These other materials include tillers, such as asbestos, aluminum oxide, sand, etc, pigments, dyes, plasticizers, reactive diluents and the like.
  • solvents such as aromatic hydrocarbons, ketone's, esters, alcohol, ether-alcohols and ether-esters.
  • compositions of this invention can be used in preparing 100% solids tile-like coatings or in solvent thinned maintenance and marine coatings. They can also be used as adhesives and in laminates, plastic tooling and the like.
  • Example I Into a. three necked reaction flask equipped with a mechanical agitator, addition funnel, reflux condenser,
  • HMDA hexamethylene diamine
  • glycidyl ester R R and R together have from 79 carbon atoms.
  • the ester itself has a molecular formula of C I-I O an epoxide equivalent weight of 240-250, a melting point of below 60 C., a density of 0.972 g./ml. and a 25 C. viscosity of 7-8 cps. After all of this glycidyl ester had been added the reaction mixture was held at 200 F. for 30 minutes and then cooled to room temperature.
  • Example IV Using the same procedure as in Example III, an epoxy curing agent was prepared similar to Example III, except that the 10.0 parts of diethyl amino ethanol were replaced with N,N'-dimethyl caproamide giving the blend a total of 15.0 parts of N,N-dimethylcaproamide.
  • Example V 169.8 parts of Example II, 4.1 parts tetraethylene pent amine and 29.7 parts of bisphenol A were heated to 200 F. and held until a homogeneous mixture was formed.
  • Example VI Example VIII-X The following blends were prepared and films were cast on glass using a 5 mil draw down blade:
  • Example X is similar to Example IX except that only 0.5 equivalent of phenol were added for each primary amine equivalent in the preformed glycidyl ester-amine adduct.
  • the resulting films although tougher than those prepared in Example IX, exhibited extreme amine carbonate formation.
  • composition of claim 1 wherein the phenolic accelerator is selected from phenol, para-tertiary butyl phenol, bisphenol A or mixtures thereof.
  • composition of claim 1 wherein about 5 to about 40 weight percent of a diluent is added based upon the total weight of (a) +(b) +(c).
  • composition of claim 1 in admixture with about 2 to 10 weight percent based on the total weight of (a)+(b)+(c) of a long chained diamine having a molecular weight of at least 200.

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  • Health & Medical Sciences (AREA)
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Abstract

ROOM TEMPERATURE CURABLE COMPOSTIONS USEFUL IN COATINGS, FLOOR TOPPING, MOLDINGS, ENCAPSULATIONS AND OTHER PLASTICS APPLICATIONS ARE PREPARED FROM A BLEND OF AN EPOXIDE RESIN, AN AMINE-GLYCIDYL ESTER ADDUCT AND A PHENOLIC ACCELERATOR.

Description

United States Patent F 3,637,902 EPOXIDE RESINS CURED WITH AMINE- GLYCIDYL ESTER ADDUCTS IN ADMIX- TURE WITH A PHENOLIC ACCELERATOR Clifford F. Dukes, Jefiersontown, and George B. Scott,
Louisville, Ky., assignors to Celanese Coatings Company, New York, NY. No Drawing. Filed Aug. 26, 1969, Ser. No. 853,204 Int. Cl. C08g 45/06 US. Cl. 260-830 TW 8 Claims ABSTRACT OF THE DISCLOSURE Room temperature curable compositions useful in coatings, floor topping, moldings, encapsulations and other plastics applications are prepared from a blend of an epoxide resin, an amine-glycidyl ester adduct and a phenolic accelerator.
BACKGROUND OF THE INVENTION The field of art to which this invention pertains is thermosetting resins, particularly room temperature curable poyepoxide resins.
The reaction of epoxide resins with aliphatic polyamines to form cured products is well known and is described in such publications as Epoxy Resins by Lee and Neville, McGraw-Hill Book Company, Inc., New York (1957). Even though aliphatic polyamines are widely used as epoxide resin curing agents, there are some inherent disadvantages in their usage. Castings and coatings made from epoxide resins and aliphatic polyamines, particularly when cured at room temperature and under atmospheric conditions, often have greasy uneven surfaces. Such surface conditions are caused by the reactivity of the amines to atmospheric moisture and carbon dioxide. Amine carbonates form at the surface and these hygroscopic salts absorb moisture from the atmosphere, presenting a wet appearance. This surface phenomenon is often described as being an exudation of the amine to the surface and has been termed sweat-out, blush or bloom. This condition is undesirable not only aesthetically but also functionally in that intercoat and interlaminar adhesion is impaired.
Likewise, the reaction of aliphatic polyamines with mono epoxides to form modified epoxy resin curing agents is well known in the art. However, these reaction products have generally poor flexibility and tend to crater when applied in a thin film. Finally, these previously described polyamine-epoxide adducts offer little improvement over normal polyamine curing agents with regard to amine carbonate formation.
Amine carbonate formation has been controlled by the use of aryl sulfonamide-aldehyde adducts as polyamine-epoxy accelerators. However, these adducts are often heavy and difiicult to handle, especially at room temperature.
SUMMARY OF THE INVENTION This invention relates to the co-reaction of epoxide resins with aliphatic polyamine adducts and phenolic accelerators and to the crosslinked infusible, insoluble products resulting therefrom. In particular, this invention pertains to carrying out the above reaction to produce cured compositions having improved physical and surface properties.
This invention is directed to room temperature curable compositions made from an epoxide compound having more than one 1,2 epoxide groups per molecule, an amine glycidyl ester adduct and a phenolic accelerator. The amine glycidyl ester adduct is a reaction product of about 3,637,902 Patented Jan. '25, 1972 0.5 to about 0.9 mols of a glycidyl ester having the general formula:
R1 0 H O Ra( %O-( l-C CH2 R2 H H and about 1.0 mol of an amine of the general formula: H NR.,,NI-I
In the above formulae R R and R collectively have 5 to 15 carbon atoms and R, has 5 to 10 carbon atoms. The phenolic accelerator is added in the ratio of about 0.55 to 1.0 phenolic OH equivalent of accelerator for each primary amine equivalent of the amine-glycidyl ester adduct. About 40 to about parts of amine-glycidyl ester adduct and phenolic accelerator are blended with about 100 parts of the polyepoxide resin to make up the total composition of this invention.
The use of the amine-glycidyl ester alone in admixture with the epoxide resins hereinafter described fails to produce the sweat-out or bloom free properties which are desired. However, when the above amounts of phenolic accelerator are added to the epoxy amine glycidyl ester adduct, bloom is substantially reduced or eliminated.
It is thought that the above described mixture of the phenolic accelerator and the amine-glycidyl ester adduct acts to reduce amine carbonate formation by reducing the amount of primary amine which is left unreacted after curing of the polyepoxide resin. A portion of the primary amine groups of the aliphatic diamine which is used herein is reacted with the glycidyl ester as below to form 2 amine alcohols.
Similarly it is thought that the reaction of the above product with the phenolic accelerator further eliminates the presence of primary amine groups by the formation of a phenolic salt, or phenolic primary amine complexes. These above reaction products are not sensitive to atmospheric moisture or carbon dioxide, and as a result the surfaces of coatings and castings made from cured blends of epoxide resins and these reaction products are improved by minimizing or preventing sweat-out, bloom, or blush formation. The explanation as stated above is merely theoretical and is included in an attempt to more fully explain the compositions herein described. This discussion is not included as a limitation on these compositions.
The compositions of this invention are useful in seamless flooring applications, tile-like coatings, plastic tooling, laminates and in general purpose room temperature usage. These compositions can also be used in moldings and encapsulation applications where elevated temperatures are normally used to achieve complete cure.
DESCRIPTION OF THE INVENTION The epoxide resins useful in this invention are epoxide resins which contain more than one 1,2-epoxide group per molecule and no other groups reactive with amines. They can be saturated or unsautrated, aliphatic, cycloaliphatic, aromatic or heterocyclic and can be monomeric or polymeric in nature.
Useful epoxide resins include glycidyl ethers of polyhydric phenols obtained by reacting a polyhydric phenol in an excess of epichlorohydrin with sodium hydroxide. Such polyhydric phenols include bisphenol A (p,p'-dihydroxydiphenyl propane), resorcinol, hydroquinone, 4,4'-dihydroxybenzophenone, bis(4-hydroxyphenyl) ethane, 1,5-dihydroxynaphthalene, 4,4'-dihydroxybiphenyl, and movelak resins containing more than two phenol moieties linked through methylene bridges.
Other glycidyl ethers of polyhydric phenols are polymers prepared by reacting 1.1 up to about 2 mols of epichlorohydrin with 1 mol of dihydric phenol or by reacting diepoxides with added dihydric phenols.
Additional epoxide resins are glycidyl ethers of polyhydric alcohols made by reacting a polyhydric alcohol and epichlorohydrin with an acidic catalyst such as boron trifiuoride and subsequently treating the resulting product with an alkaline dehydrohalogenating agent. Included among the polyhydric alcohols that can be used in the preparation of these polyepoxides are glycerine, ethylene glycol, propylene glycol, diethylene glycol, hexanetriol, pentaerythritol, trimethylol ethane and trimethylol propane.
Still other epoxide resins include glycidyl esters of polycarboxylic acids, such acids being azelaic acid, adipic acid, isophthalic acid, terephthalic acid, dimerized and trimerized unsaturated fatty acids, etc.
The epoxide resins also include epoxidized hydrocarbons such as vinyl cyclohexene dioxide, butadiene dioxide, dicyclopentadiene dioxide, epoxidized polybutadiene and limonene dioxide. Other epoxide resins are epoxidized esters, for example, epoxidized soybean oil, epoxidized glycerol trilinoleate, and 3,4-epoxy-cyclohexylmethyl-3,4- epoxy-cyclohexane carboxylate. Still other epoxides are polymers and copolymers of vinyl polymerizable monoepoxides, such monoepoxides being allyl glycidyl ether, glycidyl acrylate and glycidyl methacrylate.
The preferred epoxide resins are the glycidyl polyethers of polyhydric phenols and polyhydric alcohols, particularly the glycidyl polyether of p,p'-dihydroxydiphenyl propane or bisphenol A as it is commonly named.
Most preferred among the epoxide resins is a mixture of epoxide resins, one portion being derived from a polyhydric alcohol and the other portion being derived from a polyhydric phenol.
The glycidyl esters as used in this invention can be described by the general formula:
In this formula R R and R collectively have 5 to carbon atoms. Preparation of esters similar to this is described in US. Patent No. 3,178,454. When R R and R consist of more than 15 carbon atoms the resulting films or castings are soft and subject to solvent attack. Conversely, when R R and R are of less than 5 carbon atoms films tend to be brittle and unresilient. Preferred are those glycidyl esters wherein R R and R have from 7 to 9 carbon atoms. The use of the tertiary carbon type ester as illustrated above has several advantages over normal straight chain ethers or esters. In the first place as a glycidyl ester rather than ether the resins prepared are more resistant to attack from sunlight or ultra violet light. Secondly, as a tertiary ester, alkaline hydrolysis is made more difficult. Finally, as a branched rather than srtaight chained molecule more carbon atoms are packed into each unit area producing tougher castings and films.
Coreacted with this glycidyl ester is an aliphatic poly amine of the general formula:
R can contain from 5 to 10 carbon atoms. Included among the amines described by this formula are the various branched and straight chained pentyl, hexyl, heptyl, octyl, nonyl, and decyl amines. When the amine carbon content is decreased below 5 carbon atoms film or casting .4 flexibility decreases and the viscosity of the reacted amineglycidyl ester adduct increases above 2000 cps.
It is preferable that the viscosity of the amine-glycidyl ester adduct should be less than about 2000 cps. More viscous adducts are difiicult to handle at room temperature and in many cases it is impossible to achieve completely compatible blends when these higher viscosity adducts are mixed with epoxide resins. On the other hand when the carbon chain length is increased above 10 carbon atoms the films or castings become too soft and are subject to marring and scratching. Preferred among the above amines are the C and C carbon diamines, especially 1,6- diaminohexane (hexamethylene diamine). Also of use, however, is trimethyl hexamethylene diamine.
In preparing the amine-glycidyl ester adducts of this invention from about 0.5 to 0.9 mols of the selected glycidyl ester are reacted with each mol of the selected amine. When more than about 0.9 mols of glycidyl ester are used the adduct viscosity increases above the preferred 2000 cps. viscosity level. However, when the glycidyl ester content is reduced below about 0.5 mol level and cured, epoxy blend tends to form amine carbonates. Preferred are those adducts formed by reacting from about 0.7 to 0.8 mols of the glycidyl ester with each mol of amine.
Preparation of these amine-glycidyl ester adducts is accomplished by heating the desired amine to about 150 F. to 250 F. The heat source usually then can be removed and the particular glycidyl ester added at a rate which maintains the reaction temperature in the 150 F. to 250 F. range. Since the amine glycidyl ester reaction is exothermic the addition of the glycidyl ester to the amine mixture usually produces enough heat to maintain this reaction temperature. When all of the glycidyl ester has been added, the reactants are held at reaction temperature for an additional few minutes to assure complete amineepoxide condensation. When products are prepared according to these methods they can be cooled to room temperature and will in most cases remain as free flowing liquids.
The final major constituent of the composition of this invention is a phenolic accelerator. This accelerator can have from 6 to 18 carbon atoms per molecule and can be mono, di, or tri functional in phenolic groups. Included among these phenolic accelerators are phenol, the nitro phenols, the 'chlorophenols, the nonyl phenols, paratertiary butyl phenol, the resorcinols, the cresols, the salicylic acids and the various bisphenols. These accelerators can be present either singly or in admixture. Preferred among the above phenolic accelerators are phenol, paratertiary butyl phenol and bisphenol A (p,p'-dihydroxy diphenyl propane).
These accelerators are added in the ratio of about 0.55 to 1.0 phenolic OH equivalents for each primary amine equivalent of the above described amine-glycidyl ester adduct. For example when /2 mol of the glycidyl ester as described above has been reacted with 1 mol of a di primary amine, there are 1 /2 equivalents of primary amine left in this adduct after the amine-glycidyl ester adduction reaction has been carried out. Preferred as the ratio of phenolic OH equivalent to primary amine equivalents is about 0.6 to 0.8 equivalent of phenolic OH for each primary amine equivalent.
The compositions of this invention are prepared by blending from 40 to parts by weight of the total weight of phenolic accelerator and amine-glycidyl ester adduct with about 100 parts of the epoxy compound.
The order in which the components of this invention are mixed is in most cases immaterial. In other words the accelerator can be added to amine-glycidyl ester adduct and this mixture then added to the epoxide compound, or the adduct can be added to the epoxide compound followed by the addition of the accelerator. However, where the particular phenolic accelerator is solid at room temperature, the preferred procedure is to mix the phenolic accelerator with the amine-glycidyl ester adduct at slightly elevated temperature until a homogeneous solution is obtained.
Likewise when longer pot life is required it is also desirable to add accelerators which are liquid at room temperature to the amine-glycidyl ester adduct before blending with the epoxide resin. If this is not done the separate additions of adduct and accelerator to the epoxide compound can lead to a very high exotherm temperature and a correspondingly shorter pot life.
In cases where the amine-glycidyl ester adduct has a viscosity at 25 C. of higher than about 1000 cps., it is desirable to add to this adduct any of the commonly used epoxy curing agent diluents. Typically these diluents can be added in amounts equal to about to 40 percent by weight of the total composition, i.e., epoxide compound plus amine-glycidyl ester adduct plus phenolic accelerator. Preferred among these common diluents are diethyl amino ethanol and N,N-dimethyl caproamide.
Additional dilution and flexibilization can be accomplished by the addition of various long chained diamines with molecular weights of at least 200. Preferred among the long chained diamines are the polyoxyalkylene diamines. An example of this type of additive is a polypropylene oxide derived additive terminated at either end with a primary amine group. This compound commonly called polyoxypropylene diamine 400, has the general formula:
and an average molecular weight of about 400. Other similar higher or lower molecular weight additives can also be utilized. In addition high molecular weight diamines derived from polyethylene oxide, polybutylene oxide and other aliphatic polyoxides are of use. When present any of these additives preferably should be added in an amount equal to from about 2 to about weight percent of the total composition (epoxide resin'plus glycidyl ester-amine adduct plus phenolic accelerator).
Where added toughness is desired small amounts of various polyalkylene amines can be added to the compositions of this invention. Typical of these amines are ethylene diamine, diethylene triamine, triethylene tetrarnine, and tetraethylene pentamine. These amines can be blended with the previously described glycidyl ester-amine adducts in amounts varying from 0.1 to 4.0 weight percent based upon the total glycidyl ester-amine adduct concentration. Preferred among the polyalkylene amines is tetraethylene pentamine.
Other materials can also be included with the compositions of this invention depending upon their intended end use. These other materials include tillers, such as asbestos, aluminum oxide, sand, etc, pigments, dyes, plasticizers, reactive diluents and the like. When used for surface coatings, these compositions can be dissolved in solvents, such as aromatic hydrocarbons, ketone's, esters, alcohol, ether-alcohols and ether-esters.
Although the compositions of this invention find particular utility when cured at room temperature, their usage is not limited to low temperature cures. They can be cured over a wide range of temperatures from about C. to about 200 C.
The compositions of this invention can be used in preparing 100% solids tile-like coatings or in solvent thinned maintenance and marine coatings. They can also be used as adhesives and in laminates, plastic tooling and the like.
The following examples illustrate the invention described herein. Unless otherwise specified, all parts and percentages are by weight.
Example I Into a. three necked reaction flask equipped with a mechanical agitator, addition funnel, reflux condenser,
and thermometer were added 1624 parts of hexamethylene diamine (HMDA). This amine was heated to about 200 F. and 2576 parts of a glycidyl ester having the formula:
were added over 3 hours and 15 minutes at 200 F. In the above glycidyl ester R R and R together have from 79 carbon atoms. The ester itself has a molecular formula of C I-I O an epoxide equivalent weight of 240-250, a melting point of below 60 C., a density of 0.972 g./ml. and a 25 C. viscosity of 7-8 cps. After all of this glycidyl ester had been added the reaction mixture was held at 200 F. for 30 minutes and then cooled to room temperature.
Example II Using the same procedure as in Example I, 736 parts of the above glycidyl ester were added to 464 parts of HMDA at ZOO-220 F. over 50 minutes. Holding this reaction mixture for 30 additional minutes at 203 F. produced an epoxy amine adduct having a Garner-Holdt (25 C.) viscosity of P, a weight/gal. of 7.82 lbs. and a Gardner color of 45.
Example III Into a suitable container equipped with a mechanical agitator were mixed 56.58 parts of Example I, and 6.28 parts of a diamine terminated polypropylene oxide copolymer having an approximate molecular weight of 400. This mixture was heated to 200 F. and 12.14 parts of bisphenol A and 10.0 parts of phenol were added. After about 5 minutes this mixture became homogenous and was then cooled to room temperature and mixed with 5.0 parts of N,N-dimethylcaproamide and 10.0 parts of diethyl amino ethanol.
Example IV Using the same procedure as in Example III, an epoxy curing agent was prepared similar to Example III, except that the 10.0 parts of diethyl amino ethanol were replaced with N,N'-dimethyl caproamide giving the blend a total of 15.0 parts of N,N-dimethylcaproamide.
Example V 169.8 parts of Example II, 4.1 parts tetraethylene pent amine and 29.7 parts of bisphenol A were heated to 200 F. and held until a homogeneous mixture was formed.
Example VI Example VIII-X The following blends were prepared and films were cast on glass using a 5 mil draw down blade:
Parts of diglycidyl Parts of Example ether of Example bisphenol A 1 No. Amount VIII 25. 00 V- 20. 54 IX 50. 00 VI. 26. 00 X 50. 00 VII 24. 60
1 Having a weight per epoxide of about 190.
The above examples were allowed to cure overnight at room temperature and then were evaluated.
Example VIII represents a blend of an epoxide compound with a glycidyl ester-amine adduct which has been prepared by reacting 0.75 mol of the above described glycidyl ester with each mol of HMDA. This blend was accelerated with bisphenol A. The resulting film exhibited no amine carbonate formation and was not brittle.
Example IX is similar to Example VIII except that a minor amount of tetraethylene pentamine was added to increase cure response and bisphenol A was replaced with one equivalent of phenol for each equivalent of primary amine present in the preformed glycidyl ester-amine adduct. Films prepared from this example were tough, clear and had generally good appearance.
Example X is similar to Example IX except that only 0.5 equivalent of phenol were added for each primary amine equivalent in the preformed glycidyl ester-amine adduct. The resulting films, although tougher than those prepared in Example IX, exhibited extreme amine carbonate formation.
Examples XI-XIV Example XI XII XIII XIV Composition (parts by weight):
Epoxy A 85 85 85 85 Epoxy B 15 15 15 Example III Example IV Working properties at 77 Viscosity (cps.)
Gel time (100 gms.) min 27 27 23 Film properties (2.5 mils cured 3 days at 77 F.):
Mar resistance Good Good Good Good Toughness. Short .do .do Do. Clarity Good ..do .do Do Sweatput None None None None Physical properties at 77 F. gcure schedule: 2 wks. at 77 Tensile strength (p.s.i.) 8, 200 2, 350 2, 230 2, 210 Tensile elongation, percent 2. 5 53 51 62 Flexural strength (p.s.i.)) 12, 700 2, 900 2, 000 1, 150 Flexural modulus (p.s.i.) c 10 08 10 04 10 03x10 Ultimate compressive strength (p.s.i.) 19, 070 32, 330 30, 020 3, 090 Compressive yield str.
(p.s.i.) 12, 530 4, 330 4, 220 Hardness (Shore D) 82 78 75 73 Izod impact (it. lbs/in.
24 hour absorption (5) 111 43 31 36 34 5% acetic acid 9. 7 1. 5 1. 1. 7 Solvent (1) 12. 3 7. 0 8. 8 9. 3
1 50/50 xylene isopropanol.
It is to be understood that the foregoing detailed description is given merely by way of illustration and that many variations can be made therein without departing from the spirit of the invention.
We claim:
1. A room temperature curable composition, comprismg:
(a) an epoxide compound containing more than one 1,2 epoxide group per molecule;
(b) an amine-glycidyl ester adduct which is a reaction product of (i) about 0.5 to about 0.9 mol of a glycidyl ester having the general formula:
wherein R R and R are each substituted alkyl groups and collectively have 5 to 15 carbon atoms and (ii) about 1.0 mol of an aliphatic amine of the general formula:
wherein R; has from 5 to 10 carbon atoms; and
(c) a phenolic accelerator having from 6 to 18 carbon atoms per molecule wherein the ratio of the phenolic OI-I equivalents of (c) to the equivalents of primary amine of (b) is from 0.55 to about 1011.0 and wherein about 40 to parts of (b) and (c) taken together are blended with about 100 parts of (a).
2. The composition of claim 1 wherein the epoxide compound comprises a mixture of glycidyl polyethers of polyhydric phenols and polyhydric alcohols.
3. The composition of claim 1 wherein the amine is hexamethylene diamine.
4. The composition of claim 1 wherein the phenolic accelerator is selected from phenol, para-tertiary butyl phenol, bisphenol A or mixtures thereof.
5. The composition of claim 1 where (i) and (ii) are reacted in the molar ratio of about 0.7 to 0.8 mols of (i) to about 1.0 mol of (ii); and wherein the ratio of equivalents of accelerator (c) to the equivalents of primary amine of (b) is about 0.6 to 0.8 of (c) to 1.0 of (b).
6. The composition of claim 1 wherein about 5 to about 40 weight percent of a diluent is added based upon the total weight of (a) +(b) +(c).
7. The composition of claim 1 in admixture with about 2 to 10 weight percent based on the total weight of (a)+(b)+(c) of a long chained diamine having a molecular weight of at least 200.
8. The composition of claim 1 in admixture with about 0.1 to about 4.0 weight percent based on the weight of the amine-glycidyl ester adduct of a polyalkylene amine.
OTHER REFERENCES Handbook of Epoxy Resins, by Lee et al., 1967 (pp. 169 relied on).
WILLIAM H. SHORT, Primary Examiner T. E. PERTILLA, Assistant Examiner U.S. Cl. X.R.
11716l ZB; l6ll84; 2602 EC, 18 Ep, 32.6 R, 37 Ep, 47 EC, 59, 88.3 A, 78.4 Ep, 94.2
US853204A 1969-08-26 1969-08-26 Epoxide resins cured with amine-glycidyl ester adducts in admixture with a phenolic accelerator Expired - Lifetime US3637902A (en)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3716598A (en) * 1971-10-28 1973-02-13 Gen Electric Hardenable epoxy resin compositions
US3852256A (en) * 1972-07-18 1974-12-03 Western Litho Plate & Supply Photopolymers
US3853812A (en) * 1972-01-07 1974-12-10 Schering Ag Mixed amine-phenol hardeners for epoxy resins
US4102862A (en) * 1976-03-31 1978-07-25 Kenrich Petrochemicals, Inc. Application of cumylphenol and derivatives thereof in plastic compositions
US4668757A (en) * 1984-03-26 1987-05-26 Gus Nichols Use of aromatic amines for setting epoxide resins
EP0596622A2 (en) * 1992-11-02 1994-05-11 Lord Corporation Epoxy resin structural adhesive composition having high temperature resistance
US6248204B1 (en) * 1999-05-14 2001-06-19 Loctite Corporation Two part, reinforced, room temperature curable thermosetting epoxy resin compositions with improved adhesive strength and fracture toughness
US20100168279A1 (en) * 2006-03-30 2010-07-01 Shengqian Kong Thermally curable epoxy-amine barrier sealants
US20120157620A1 (en) * 2009-08-27 2012-06-21 Nagy Gabor Amine-epoxy adducts and their use for preparing polyurea and polyurea-polyurethane coatings

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3716598A (en) * 1971-10-28 1973-02-13 Gen Electric Hardenable epoxy resin compositions
US3853812A (en) * 1972-01-07 1974-12-10 Schering Ag Mixed amine-phenol hardeners for epoxy resins
US3852256A (en) * 1972-07-18 1974-12-03 Western Litho Plate & Supply Photopolymers
US4102862A (en) * 1976-03-31 1978-07-25 Kenrich Petrochemicals, Inc. Application of cumylphenol and derivatives thereof in plastic compositions
US4668757A (en) * 1984-03-26 1987-05-26 Gus Nichols Use of aromatic amines for setting epoxide resins
EP0596622A2 (en) * 1992-11-02 1994-05-11 Lord Corporation Epoxy resin structural adhesive composition having high temperature resistance
EP0596622A3 (en) * 1992-11-02 1995-05-10 Lord Corp Epoxy resin structural adhesive composition having high temperature resistance.
US6248204B1 (en) * 1999-05-14 2001-06-19 Loctite Corporation Two part, reinforced, room temperature curable thermosetting epoxy resin compositions with improved adhesive strength and fracture toughness
US20100168279A1 (en) * 2006-03-30 2010-07-01 Shengqian Kong Thermally curable epoxy-amine barrier sealants
US20120157620A1 (en) * 2009-08-27 2012-06-21 Nagy Gabor Amine-epoxy adducts and their use for preparing polyurea and polyurea-polyurethane coatings

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