US3584130A - Substrate for mounting filaments in close-spaced parallel array - Google Patents
Substrate for mounting filaments in close-spaced parallel array Download PDFInfo
- Publication number
- US3584130A US3584130A US872429A US3584130DA US3584130A US 3584130 A US3584130 A US 3584130A US 872429 A US872429 A US 872429A US 3584130D A US3584130D A US 3584130DA US 3584130 A US3584130 A US 3584130A
- Authority
- US
- United States
- Prior art keywords
- substrate
- wire
- filaments
- close
- parallel array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/04—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using storage elements having cylindrical form, e.g. rod, wire
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/2457—Parallel ribs and/or grooves
Definitions
- thin film magnetic memory devices of the type including filaments such as wires coated with thin films of magnetic material, typically applied by electrolysis or evaporation in vacuuo.
- the filaments are typically about 0.004 to 0.005 inch in diameter, and the thin film magnetic materiai is typically about 1 micron thick.
- the output signals produced in the operation of devices of this type are relatively small, typically on the order of a few millivolts, and it is important to achieve a high degree of uniformity in the spacings between successive wires when they are arranged in parallel array to form a matrix, otherwise variations in coupling between adjacent wires at different points along their lengths may tend to introduce errors into the system. Also, to minimize certain deleterious effects due to magnetostriction, it is desirable to provide firm support for the wires that carry the thin film magnetic material. Finally in the interest of space conservation, it is desirable to space the wires as closely together as possible.
- a substrate in accordance with the invention comprises a replica of the surface formed by winding a soft metal wire upon a fiat mandrel with each successive reach of the wire straightened by stretching and carefully forced against the preceding reach.
- a master mold is made from the mandrel, and the substrates are cast in the master mold.
- more complex replication techniques may be used such as, for example, techniques applied in the production of phonograph records and of optical diffration gratings.
- many of the replicas as desired may be secured together to form'a relatively large substrate.
- the replica is made of an insulating material such as a thermosetting resin, and an electrically conductive plate may be molded into the replica to provide an electrical ground plane.
- FIG. 1 is a fragmentary isometric view of a mandrel partly wound with wire, indicating an initial step in the manufacture of a substrate according to the invention
- FIG. 2 is a cross section taken along the line 2-2 of FIG. 1;
- FIG. 3 is a cross-sectional view of a mold according to the invention, illustrating casting of a substrate
- FIG. 4 is a partly schematic diagram in isometric form of the assembly of individual units according to the invention to form a relatively large substrate;
- FIG. 5 is a perspective view on a larger scale than FIG. 4 of a support according to the invention.
- FIG. 6 is a cross-sectional view of a support generally similar to the one shown in FIG. 5, but without a conductive ground plane;
- FIG. 7 is a cross-sectional view of the support shown in FIG.
- the wire 14 which may be, for example, of copper, is straightened by stretching either just prior to winding or as it is wound. The winding is carefully done, and each turn of the wire is forced againstthe recedin one so that it lies "I abutting engagement with it.
- the mandrel with the wire 14 upon it is carefully inspected to insure that the wires are straight and true, free of foreign matter, and lie flat upon the mandrel.
- the mandrel may be first. coated with a film of an adhesive material to secure the wire 14 firmly upon it. Molds 20 are then made by casting upon the mandrel.
- the molds 20 may be made of any desired casting material such as certain silicone compositions, many of which have been specially developed for use in dentistry, and which are capable of forming accurate negative images of the surface formed by the wire 14.
- the molds 20 are then used to produce replicas 10 of the original master mold 12.
- the replicas 10 are typically cast of an insulating thermosetting resin selected from among those having good dimensional stability.
- a sheet 22 of conductive material is placed in the mold and pushed down until it comes into contact with and rests on the lands 24 of the mold.
- the balance of the mold is then filled with the insulating casting material, which is then hardened to form a rigid substrate for the wires of the magnetic memory or any other filaments.
- the replicas I0 can readily be made with a high degree of accuracy, that is, with very small deviations from the shapes and dimensions of the surface of the wire 14 on the mandrel. For all practical purposes, the replicas are exact copies of the surface. If reasonable care is exercised in winding the wire 14 upon the mandrel 12, a large number of individual replicas 10 may readily be arrayed in uniform registration to form an overall memory plane of any desired size. Each replica 10 is identical to the next one, and alignment and registration problems are, therefore, minimized.
- the grooves are generally V-shaped in cross section so that the wires, or other filaments laid in them are urged toward and held in centered alignment with the grooves with a high degree of uniformity and precision.
- a striated support for electrically conductive filaments or the like comprising a body of stiff insulating material having a striated surface of similar shape to a surface formed by laying down successive lengths of a round wire in straight abutting relationship upon a flat support and a sheet of a conductive material molded integrally within said body lying immediately beneath and substantially coextensive with the striations to constitute a ground plane.
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US87242969A | 1969-10-29 | 1969-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3584130A true US3584130A (en) | 1971-06-08 |
Family
ID=25359558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US872429A Expired - Lifetime US3584130A (en) | 1969-10-29 | 1969-10-29 | Substrate for mounting filaments in close-spaced parallel array |
Country Status (1)
Country | Link |
---|---|
US (1) | US3584130A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2324083A (en) * | 1940-02-27 | 1943-07-13 | Goodrich Co B F | Method of making bearings |
US3241429A (en) * | 1962-05-14 | 1966-03-22 | Pid Corp | Pictorial parallax panoramagram units |
US3371326A (en) * | 1963-06-18 | 1968-02-27 | Sperry Rand Corp | Thin film plated wire memory |
US3414972A (en) * | 1964-06-25 | 1968-12-10 | Sperry Rand Corp | Method for making a memory device |
US3448514A (en) * | 1965-10-01 | 1969-06-10 | Sperry Rand Corp | Method for making a memory plane |
-
1969
- 1969-10-29 US US872429A patent/US3584130A/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2324083A (en) * | 1940-02-27 | 1943-07-13 | Goodrich Co B F | Method of making bearings |
US3241429A (en) * | 1962-05-14 | 1966-03-22 | Pid Corp | Pictorial parallax panoramagram units |
US3371326A (en) * | 1963-06-18 | 1968-02-27 | Sperry Rand Corp | Thin film plated wire memory |
US3414972A (en) * | 1964-06-25 | 1968-12-10 | Sperry Rand Corp | Method for making a memory device |
US3448514A (en) * | 1965-10-01 | 1969-06-10 | Sperry Rand Corp | Method for making a memory plane |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: GENERAL DYNAMICS TELEPHONE SYSTEMS CENTER INC., Free format text: CHANGE OF NAME;ASSIGNOR:GENERAL DYNAMICS TELEQUIPMENT CORPORATION;REEL/FRAME:004157/0723 Effective date: 19830124 Owner name: UNITED TECHNOLOGIES CORPORATION, A DE CORP. Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:GENERAL DYNAMICS TELEPHONE SYSTEMS CENTER INC.;REEL/FRAME:004157/0698 Effective date: 19830519 Owner name: GENERAL DYNAMICS TELEQUIPMENT CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:STROMBERG-CARLSON CORPORATION;REEL/FRAME:004157/0746 Effective date: 19821221 |
|
AS | Assignment |
Owner name: STROMBERG-CARLSON CORPORATION, FLORIDA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:UNITED TECHNOLOGIES CORPORATION A CORPORATION OF DE;REEL/FRAME:005732/0982 Effective date: 19850605 |