US3573670A - High-speed impedance-compensated circuits - Google Patents

High-speed impedance-compensated circuits Download PDF

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Publication number
US3573670A
US3573670A US809350A US3573670DA US3573670A US 3573670 A US3573670 A US 3573670A US 809350 A US809350 A US 809350A US 3573670D A US3573670D A US 3573670DA US 3573670 A US3573670 A US 3573670A
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Prior art keywords
impedance
signal line
ground conductor
board
coupling
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Expired - Lifetime
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US809350A
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English (en)
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John R Skobern
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International Business Machines Corp
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International Business Machines Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Definitions

  • Ziegler ABSTRACT Impedance-compensated circuits for high frequency microstrip signal transmission systems comprising a dielectric board of suitable thickness depending upon the dielectric constant of the material of the board and the frequency of the signals to be transmitted within the system.
  • a ground conductor plate is attached to one planar surface of the dielectric board.
  • the other planar surface of the dielectric board is adapted to receive and have affixed thereto any of a plurality of combinations of signal-conducting elements.
  • the signal-conducting elements have predetermined cross-sectional areas depending upon the signals to be transmitted within the system.
  • the signal-conducting elements may be provided with lead and circult-connecting areas of increased size to facilitate making electrical connections for devices to be attached with the elements.
  • the impedance changes due to the increased size of areas are compensated for by means of slots or apertures in the ground conductor plate opposite or in the vicinity of 'the connecting areas.
  • transmission lines such as coaxial, waveguide, strip, and strip transmission lines in stacked arrays, all particularly adapted to accommodate the transmission of high frequency signals.
  • Transmission lines frequently involve fabrication by printed circuit-wiring techniques.
  • a transmission line may comprise a pair of flat conductors spaced in substantially parallel relation by a flat dielectric board having substantially parallel surfaces.
  • ground conductor is deposited by any of the recognized printed wiring techniques on one surface of the dielectric board, while the signal conductor of considerably narrower width is deposited by similar techniques on the opposite surface of the dielectric board.
  • a suitable frequency band of electromagnetic wave energy can be propagated along the transmission line. It is recognized that where flat conductors are employed, the electric field cannot be entirely confined within the bounds defined by the signal and ground conductors. Such construction of the conductors tends to occasion some transmission losses due to radiation. The mismatching of line impedances increases the transmission line losses and causes undesirable signal reflections.
  • the present day trend in dataprocessing systems is to microminiaturization which involves higher density packaging, a higher speed of operation which necessitates the use of higher signal transmission frequencies with attendant requirements for lower radiation losses, and fewer signal discontinuities.
  • the present day trend introduces problems such as maintaining uniform characteristic impedance when making the component lead connections, corner and interboard coupling connections. Discontinuities and radiation losses in the signals are created at the connecting areas of the signal line conductors.
  • a high frequency transmission line medium with transmission lines such as are used in association with high frequency electronic devices and provided with impedance-compensating means wherever electrical connections are made to the lines in order to maintain a substantially uniform characteristic impedance throughout the entire line.
  • the signal transmission system comprises a solid dielectric having planar insulating layers or board which has one or more elongated signal-conducting strips affixed to one surface and a wide ground plane conductor covering all or substantially all of the other side of the dielectric board, commonly called microstrip transmission line.
  • the signal-conducting strips have predetermined crosssectional areas dependent upon the signals to be transmitted over the transmission lines.
  • the signal-conducting strips may have one or more intermediate electrical lead-connecting areas of increased size to facilitate the connecting of component leads to the signal-conducting strips. Further, the signal-conducting strips may have coupling pads of increased size at the board edge to effect interboard electrical connecting.
  • the gist of the invention resides in the use of apertures and/or elongated slots having predetermined dimensional configurations and placed in the ground conductor plane in the vicinity underlying the electrical coupling area or interboard coupling pad. The apertures or slots function to increase the characteristic impedance of the transmission line and offset the decrease in characteristic impedance caused by the increased dimensional areas which are-used to accommodate electrical coupling devices.
  • FIG. 1 is an amplified isometric view of a circuit board in accordance with the present invention, showing a high-speed transmission line and a compensated line to accommodate the transmission of greater current signals.
  • FIG. 2 is an amplified isometric view of a transmission line on a printed circuit board showing a lead coupling area and the impedance-compensating means therefor.
  • FIG. 3 is an amplified isometric view of a transmission line on a printed circuit board provided with edge-connecting pads and impedance-compensating means therefor.
  • FIG. 4 is a waveform illustration of a test signal propagated down a transmission line and a reflected wave showing the impedance affect caused by a coupling area in the line without compensation.
  • FIGS. 5 and 6 are waveform illustrations of a test signal propagated down a transmission line and a reflected wave showing the affect of impedance-compensating apertures in the vicinity of the electrical coupling area.
  • FIG. 7 is a waveform illustration of a signal transmitted over a signal transmission line and illustrating the affect of a coupling pad located at the edge of the dielectric board and without compensation.
  • FIG. 8 is a waveform illustration showing the improved condition in the reflected wave from the edge-coupling pad of the transmission line when provided with compensation means.
  • FIG. I printed circuit transmission lines in accordance with the invention and comprising a solid dielectric planar insulating board 10 to which is affixed, preferably by printed circuit techniques, a flat layer of conductive material forming a ground conductor plane 11.
  • the flat signalconducting strips or elements 12 and 13, having predetermined cross-sectional areas dependent upon the signals to be transmitted over the strips and formed of conductive material, are affixed to the opposite surface of the dielectric board 10.
  • the dielectric board 10 may be composed of any suitable laminating material such as polystyrene, phenolic resin, ceramic, or glass-fiber reinforced epoxy resins.
  • the thickness of the dielectric board 10 is dependent upon the dielectric constant of the material used and the frequency of the signals to be transmitted over the transmission lines.
  • the signal conductor strip 12 and ground conductor plane 11 together function as a signal transmission line having a uniform characteristic impedance, which in the preferred embodiment is 50 ohms. This is due to the parameters of the transmission line, such as thickness of the dielectric board 10, the cross-sectional area of the signal conductor strips 12, and frequency of the signals to be transmitted over the transmission line. It should be noted that other impedances are possible utilizing a different set of parameters which is within artisan capability.
  • the conductor strip 13 and ground conductor plane 11 together function as a transmission line particularly adapted for transmission of a signal having increased current-carrying capability and/or a decreased resistance requirement.
  • ground plane 11 has an elongated slot or aperture 14 of predetermined area dimensions and underlying the signal conductor strip 13.
  • the slot enables the transmission line to maintain the same characteristic impedance as the transmission line comprising strip 12 and ground plane 11.
  • FIG. 2 there is shown a high-speed transmission line comprising a dielectric board 10, a ground conductor plane 11, and a signal conductor strip 12. Additionally, signal conductor strip 12 includes a lead-connecting area 15 of increased size to facilitate the process of making electrical connections of component leads and the like to the signal conductor strip 12. The electrical affect of the increased connecting area 15 is to decrease the impedance of the transmission line.
  • the characteristic impedance of the section of the transmission line should match the impedance of the other section of the transmission line. To provide these impedance matches, the characteristic impedance of the transmission line is maintained through the medium of impedance-compensated apertures located in the ground conductor plane.
  • the dimensions of the aperture or slot 16 can be determined and then placed in the ground conductor plane 11 underlying the connecting area 15. This will have an impedance-compensating affect and in this manner a transmission line can be designed and manufactured having a substantial unifonn characteristic impedance throughout its length regardless of the number of lead-connecting areas 15 existent in the signal conductor strips 12. It is possible that a signal transmission line on a dielectric board or substrate may have a plurality of lead-connecting areas and each of these areas would have a compensating aperture or slot in the vicinity immediately below the lead-connecting area 15.
  • Another undesirable affect stems from the capacitive coupling of a component device, such as a transistor or the like, to the transmission line. Because of this coupling condition, there is a discontinuity in the characteristic impedance of the transmission line and which provides undesirable reflections on the transmission line. Such capacitive coupling affect may be substantially overcome by means of a properly oriented compensating aperture.
  • FIG. 3 there is shown a high-speed transmission line comprising a dielectric board 10, a ground conductor plane ll, and a signal conductor strip 12.
  • the signal conductor strip 12 includes edge or interboard coupling pads 17 of increased size to facilitate the process of making interboard electrical connections to the signal strips 12.
  • the electrical affect of the increased connecting areas is to decrease the impedance of the transmission line.
  • This change in impedance can be offset through the medium of an aperture or slot 16 being placed in the ground conductor plane 11 and underlying the coupling pad areas.
  • the aperture or slot may be a single-hole item or a combination of holes, but the compensating affect in either case will be substantially the same.
  • a Time Domain Reflectometer such as is available from Hewlett Packard, was used to observe the electrical performance characteristics and enable comparisons when signals were applied to the line.
  • characteristic impedance Z is about 50 ohms.
  • a con necting area of about 0.130 inches long and 0.160 inches wide was introduced into the signal strip, it was necessary to introduce an aperture in the ground conductor plane 11 and underlying the connecting area 15 having a length of 0.150 inches and width of 0.190 inches in order to maintain the characteristic impedance Z, of the microstrip transmission line at about 50 ohms.
  • Tests were conducted on (l) a normal transmission line with a coupling area with and without compensation apertures in the ground plane; and (2) a normal transmission line with an edge-coupling pad with and without compensation apertures in the ground plane.
  • the characteristics observed were: (l) impedance; (2) slope degradation; (3) velocity of propagation using a trombone time delay device; and (4) reflections on the transmission line.
  • FIG. 4 there is shown a waveform which depicts the affect of a single lead-connecting area in a single line strip when a signal pulse is applied to the line and in which the ground plane is devoid of a compensating aperture.
  • a large capacitive discontinuity may be noted at point 20, which represents the location of the lead-connecting area 15. Also the degradation of the rise time 21 may be noted.
  • FIG. 5 there is shown a waveform which depicts the affect of a signal pulse applied to the line but the compensating'aperture 16 in the ground plane 11 is of insufficient size to fully compensate the impedance characteristics caused by the increased size of the connecting area 15.
  • a reduction in the capacitive discontinuity 22, as compared with point 20 in FIG. 4, may be noted.
  • FIG. 7 there is shown a waveform indicating a reflected pulse condition at the dielectric board end of a signal transmission line provided with a coupling pad but without impedance compensation.
  • the degradation of the rise time 25 and the discontinuity 26 may be noted.
  • FIG. 8 there is shown a waveform indicating the pulse condition at the dielectric board end of a signal transmission line having the coupling pads but with impedance compensation apertures 16 of proper dimension and placement.
  • the pulse as shown has an improved rise time 27 and the undesirable reflections on the line have been removed.
  • the characteristics obtained by the signal conductors, connectors, insulating board, and impedance-compensating aper-' tures as used in this invention should be considered illustrative only and not restrictive of either frequency range or dimensional changes as these may be changed by altering the dimensions of the boards, transmission lines, as well as those of the connector areas and impedance-compensating apertures.
  • this invention is of a very simple construction while maintaining a rather close transmission line configuration with substantially uniform impedance'characteristics throughout the length of the transmission line. It will also be evident that the parts are held rigidly together while resulting in a very reliable construction both mechanically and electrically.
  • a high-speed impedance-compensated circuits combination comprising:
  • a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board;
  • a ground conductor plane affixed to the opposite side of the dielectric board; said signal line conductor and the ground conductor plane constituting a transmission line having a predetermined characteristic impedance;
  • Impedance compensation for a high-speed circuits arrangement comprising, in combination:
  • a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board;
  • each of the signal line conductors electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedanced characteristics
  • the signal line conductors being provided with at least one electrical lead-coupling area of increased portions to facilitate lead connections to the signal line;
  • an impedance-compensating aperture in the ground conductor plane opposite each lead-coupling area the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased due to the increased size of the lead-coupling area.
  • a substrate having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the substrate;
  • each of the signal line conductors electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedanced characteristics
  • the signal line conductors being provided with at least one electrical lead-coupling area of increased portions to facilitate lead connections to the signal line;
  • an impedance-compensating aperture in the ground conductor plane opposite each lead-coupling area the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased due to the increased size of the lead-coupling area.
  • Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination:
  • a dielectric board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the board;
  • each of the signal line conductor elements electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedance characteristics
  • the signal line conductors being provided with cornercoupling pads of increased size terminating the signal lines at the edge of the dielectric board and to facilitate electrical connections with other boards;
  • an impedance-compensating aperture in the ground conductor plane opposite each of the corner-coupling pads the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased by the increased size of the cornercoupling pads.
  • Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination:
  • a substrate board having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the substrate;
  • each of the signal line conductor elements electrically in combination with the ground conductor plane adapted to functionally operate as a transmission line possessing uniform impedance characteristics
  • the signal line conductors being provided with cornercoupling pads of increased size terminating the signal lines at the edge of the substrate and to facilitate electrical connection with other boards;
  • an impedance-compensating aperture in the ground conductor plane opposite each of the corner-coupling pads the area of the aperture being predetermined so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedance would be decreased by the increased size of the cornercoupling pads.
  • Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination:
  • each of the signal line conductor elements electrically in combination with the ground conductor planes adapted to functionally operate as a transmission line possessing uniform impedance characteristics
  • the signal line conductor elements being provided with at least one electrical lead-coupling area of increased proportions to facilitate lead connections to the signal line;
  • the signal line conductor elements being provided with corner-coupling pads of increased area terminating the signal lines at the edge of the circuit board to facilitate electrical connections with other boards;
  • impedance-compensating apertures in the ground conductor plane opposite each of the lead-coupling areas and the corner-coupling pads said apertures being of predetermined sizes so as to increase the characteristic impedance of the transmission line by substantially the same amount as the impedances would be decreased by the increased size of the lead-coupling area and the corner-coupling pads.
  • Impedance compensation for a high-speed circuits packaging arrangement comprising, in combination:
  • a substrate having parallel surfaces and a predetermined thickness depending upon the dielectric constant of the material of the substrate;
  • a ground conductor plane affixed to the opposite side of d.
  • the signal line conductor elements being provided with at least one electrical lead-coupling area of increased porportions to facilitate lead connections to the signal line;
  • the signal line conductor elements being provided with comer-coupling pads of increased area terminating the signal lines at the edge of the circuit board to facilitate electrical connections with other boards;
  • impedance-compensating apertures in the ground conductor plane opposite each of the lead-coupling areas and the comer coupling pads said apertures being of predetermined sizes so as to increase the characteristic vimpedance of the transmission line by substantially the same amount as the impedances would be decreased by the increased size of the lead-coupling area and the corner-couplingpads.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Waveguides (AREA)
US809350A 1969-03-21 1969-03-21 High-speed impedance-compensated circuits Expired - Lifetime US3573670A (en)

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US80935069A 1969-03-21 1969-03-21

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US (1) US3573670A (enrdf_load_stackoverflow)
FR (1) FR2035139A1 (enrdf_load_stackoverflow)
GB (1) GB1283148A (enrdf_load_stackoverflow)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729694A (en) * 1971-09-28 1973-04-24 Motorola Inc Strip transmission line broadband 4:1 impedance transformer
US3815055A (en) * 1973-04-20 1974-06-04 Raytheon Co Microwave power divider
US3913040A (en) * 1974-05-03 1975-10-14 Rca Corp Microstrip carrier for high frequency semiconductor devices
US4429289A (en) 1982-06-01 1984-01-31 Motorola, Inc. Hybrid filter
US4602831A (en) * 1983-09-26 1986-07-29 Amp Incorporated Electrical connector and method of making same
US4682840A (en) * 1983-09-26 1987-07-28 Amp Incorporated Electrical connection and method of making same
EP0199289A3 (en) * 1985-04-22 1988-08-31 Tektronix, Inc. Staggered ground-plane microstrip transmission line
US4785135A (en) * 1987-07-13 1988-11-15 International Business Machines Corporation De-coupled printed circuits
FR2616973A1 (fr) * 1987-06-22 1988-12-23 Riviere Luc Ligne de transmission hyperfrequence a deux conducteurs coplanaires
US4879533A (en) * 1988-04-01 1989-11-07 Motorola, Inc. Surface mount filter with integral transmission line connection
US5093640A (en) * 1989-09-29 1992-03-03 Hewlett-Packard Company Microstrip structure having contact pad compensation
US5369380A (en) * 1991-01-04 1994-11-29 The Secretary Of State Of Defence In Her Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Of Defence Research Agency Microwave connector
US5561405A (en) * 1995-06-05 1996-10-01 Hughes Aircraft Company Vertical grounded coplanar waveguide H-bend interconnection apparatus
WO1997044850A1 (en) * 1996-05-22 1997-11-27 E.I. Du Pont De Nemours And Company Open ground transmission line circuits
EP1363350A1 (en) * 2002-05-16 2003-11-19 Corning Incorporated Broadband uniplanar coplanar transition
EP1300905A3 (en) * 2001-10-02 2003-11-26 Sumitomo Electric Industries, Ltd. Electronic component-mounting substrate and electronic components
FR2852743A1 (fr) * 2003-03-21 2004-09-24 Cellon France Sas Agencement pour connecter deux platines electroniques par un connecteur zif ou lif, un troncon en structure coplanaire et un troncon en structure a microruban
US20050083152A1 (en) * 2003-10-17 2005-04-21 Jimmy Hsu Signal transmission structure
US20050083148A1 (en) * 2003-10-17 2005-04-21 Jimmy Hsu Signal transmission structure
US20050270117A1 (en) * 2004-06-08 2005-12-08 Tdk Corporation Signal transmission circuit
US20070024388A1 (en) * 2005-07-27 2007-02-01 Hassan Tanbakuchi Slabline structure with rotationally offset ground
US20070052492A1 (en) * 2005-09-08 2007-03-08 Dahweih Duan Broadband DC block impedance matching network
CN1330221C (zh) * 2003-10-27 2007-08-01 威盛电子股份有限公司 信号传输结构
CN100353818C (zh) * 2004-02-25 2007-12-05 威盛电子股份有限公司 信号传输结构
US20110037178A1 (en) * 2009-08-12 2011-02-17 Sony Corporation Integrated circuit
US11050172B2 (en) * 2019-11-22 2021-06-29 International Business Machines Corporation Insertable stubless interconnect

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JPS5651643B2 (enrdf_load_stackoverflow) * 1974-01-17 1981-12-07
US3961296A (en) * 1975-03-06 1976-06-01 Motorola, Inc. Slotted strip-line

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US2896177A (en) * 1954-12-13 1959-07-21 Sanders Associates Inc High frequency transmission line tuning device
US3265995A (en) * 1964-03-18 1966-08-09 Bell Telephone Labor Inc Transmission line to waveguide junction
US3384842A (en) * 1965-04-23 1968-05-21 Army Usa Right angle coaxial to strip line transition
US3460072A (en) * 1967-06-16 1969-08-05 Amp Inc Transmission line compensation for high frequency devices

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FR885756A (fr) * 1941-10-13 1943-09-24 Lorenz C Ag Condensateur pouvant être compensé
US3104363A (en) * 1960-07-25 1963-09-17 Sanders Associates Inc Strip transmission line crossover having reduced impedance discontinuity
US3402448A (en) * 1966-05-04 1968-09-24 Bunker Ramo Thin film capacitor and method of adjusting the capacitance thereof
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US2896177A (en) * 1954-12-13 1959-07-21 Sanders Associates Inc High frequency transmission line tuning device
US3265995A (en) * 1964-03-18 1966-08-09 Bell Telephone Labor Inc Transmission line to waveguide junction
US3384842A (en) * 1965-04-23 1968-05-21 Army Usa Right angle coaxial to strip line transition
US3460072A (en) * 1967-06-16 1969-08-05 Amp Inc Transmission line compensation for high frequency devices

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729694A (en) * 1971-09-28 1973-04-24 Motorola Inc Strip transmission line broadband 4:1 impedance transformer
US3815055A (en) * 1973-04-20 1974-06-04 Raytheon Co Microwave power divider
US3913040A (en) * 1974-05-03 1975-10-14 Rca Corp Microstrip carrier for high frequency semiconductor devices
US4429289A (en) 1982-06-01 1984-01-31 Motorola, Inc. Hybrid filter
US4602831A (en) * 1983-09-26 1986-07-29 Amp Incorporated Electrical connector and method of making same
US4682840A (en) * 1983-09-26 1987-07-28 Amp Incorporated Electrical connection and method of making same
EP0199289A3 (en) * 1985-04-22 1988-08-31 Tektronix, Inc. Staggered ground-plane microstrip transmission line
FR2616973A1 (fr) * 1987-06-22 1988-12-23 Riviere Luc Ligne de transmission hyperfrequence a deux conducteurs coplanaires
EP0296929A1 (fr) * 1987-06-22 1988-12-28 Luc Rivière Ligne de transmission hyperfréquence de type symétrique et à deux conducteurs coplanaires
US4785135A (en) * 1987-07-13 1988-11-15 International Business Machines Corporation De-coupled printed circuits
US4879533A (en) * 1988-04-01 1989-11-07 Motorola, Inc. Surface mount filter with integral transmission line connection
US5093640A (en) * 1989-09-29 1992-03-03 Hewlett-Packard Company Microstrip structure having contact pad compensation
US5369380A (en) * 1991-01-04 1994-11-29 The Secretary Of State Of Defence In Her Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Of Defence Research Agency Microwave connector
US5561405A (en) * 1995-06-05 1996-10-01 Hughes Aircraft Company Vertical grounded coplanar waveguide H-bend interconnection apparatus
WO1997044850A1 (en) * 1996-05-22 1997-11-27 E.I. Du Pont De Nemours And Company Open ground transmission line circuits
EP1300905A3 (en) * 2001-10-02 2003-11-26 Sumitomo Electric Industries, Ltd. Electronic component-mounting substrate and electronic components
US6734755B2 (en) 2002-05-16 2004-05-11 Corning Incorporated Broadband uniplanar coplanar transition
EP1363350A1 (en) * 2002-05-16 2003-11-19 Corning Incorporated Broadband uniplanar coplanar transition
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Also Published As

Publication number Publication date
GB1283148A (en) 1972-07-26
DE2010098B2 (de) 1977-05-12
FR2035139A1 (enrdf_load_stackoverflow) 1970-12-18
DE2010098A1 (de) 1970-10-01

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