US3516075A - Bistable magnetic thin film rod having a conductive overcoating - Google Patents

Bistable magnetic thin film rod having a conductive overcoating Download PDF

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Publication number
US3516075A
US3516075A US492496A US3516075DA US3516075A US 3516075 A US3516075 A US 3516075A US 492496 A US492496 A US 492496A US 3516075D A US3516075D A US 3516075DA US 3516075 A US3516075 A US 3516075A
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rod
conductive
thin film
magnetic
overcoating
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US492496A
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Ernest M Willer
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NCR Voyix Corp
National Cash Register Co
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NCR Corp
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G11C5/05—Supporting of cores in matrix
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/04—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using storage elements having cylindrical form, e.g. rod, wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/90—Magnetic feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/928—Magnetic property
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12333—Helical or with helical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12931—Co-, Fe-, or Ni-base components, alternative to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/2936—Wound or wrapped core or coating [i.e., spiral or helical]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y10T428/2942—Plural coatings
    • Y10T428/2944—Free metal in coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/298—Physical dimension

Definitions

  • a bistable magnetic rod memory device including a thin film of bistable magnetic material uniformly deposited on a conductive substrate and a thin non-magnetic conductive overcoating uniformly deposited over the magnetic material.
  • a helical solenoid winding having an insulating coating thereon is provided over the conductive overcoating along the rod memory.
  • the conductive overcoating having a thickness of less than 5,000 angstroms, permits a rapid and simple connection to be made between the substrate and the solenoid winding by the simple expedient of dip soldering.
  • the conductive overcoating additionally provides an improvement in the square-loop hysteresis characteristics of the magnetic film.
  • the present invention relates generally to memory devices for use in digital computer systems, and more particularly to improvements in bistable magnetic rod memory devices of the type illustrated, for example, in Pat. No. 3,134,965, issued May 26, 1964 and the commonly assigned copending patent applications Ser. No. 795,934, filed Feb. 27, 1959 and now US. Pat. No. 3,228,012, Ser. No. 268,145, filed Mar. 26, 1963 and now US. Pat. No. 3,341,829, and Ser. No. 373,980, filed June 10, 1964 now Pat. No. 3,418,644.
  • a particularly desirable form of rod memory element is that disclosed in the aforementioned patent applications Ser. No. 268,145 and ,Ser. No. 373,980 in which a continuous solenoidal winding is provided along the length of a rod and is soldered at one end of the rod to the inner conductive substrate so as to thereby permit the conductive substrate to serve as a current return path without having to provide an additional return wire, as would otherwise be required.
  • the use of the inner substrate for a return path in place of a separate return wire provides the further advantages of reducing the magnetic switching field required and of cancelling the circular or transverse field produced by current flowing in the solenoidal winding.
  • a further object of this invention is to provide a mag netic rod construction exhibiting improved square-loop hysteresis characteristics.
  • FIG. 1 is a pictorial schematic view of a solenoid matrix and an illustrative rod in accordance with the invention.
  • FIG. 2 is an enlarged pictorial view illustrating the construction and arrangement of a typical rod in accordance with the invention.
  • FIGS. 3 and 4 are graphs comparing the hysteresis characteristic of a rod with and without gold overplating.
  • FIG. 1 illustrated therein is an exemplary solenoid matrix in which the rod devices of the present invention (only one of which is shown in FIG. 1) may advantageously be inserted to provide the bistable elements therefor.
  • the exemplary solenoid matrix in FIG. 1 may typically comprise a plurality of forty stacked planes or plates P P each plane containing solenoid windings (for Example 10) arranged in series-connected rows, with respectively located windings in different planes aligned so as to provide a continuous bore (for Example 10a) therethrough.
  • the rod 15 comprises an inner conductive substrate 15a which may typically be a six inch long beryllium copper rod of about 0.010 inch in diameter, but preferably less than 0.050 inch, on which is electrodeposited a thin bistable magnetic thin film 15b which may typically be a film of 97% iron and 3% nickel with a thickness of 10,000 angstroms or less so as to exhibit essentially single domain magnetic switching properties.
  • the bistable magnetic thin film 1511 may also be a bilayer film of the type disclosed in the commonly assigned copending patent application Ser.
  • the magnetic thin film 15b in FIG. 2 is overcoated with a very thin non-magnetic conductive layer 16.
  • a very thin non-magnetic conductive layer 16 A 100 to 2,000 angstroms electroplated layer of gold or silver has been found to give excellent results with regard to both hysteresis characteristics and output signal magnitude, as well as providing easy solderability to the rod.
  • a thin protective coating (not shown) of, for example, urethane resin, may be applied over the non-magnetic conductive overcoating 16 to prevent any possibility of atmospheric corrosion.
  • a helical solenoid winding 18 having an insulating coating thereon is provided over the silver or gold overcoating 16 (and protective coating if present), and preferably is formed using an insulated fiat wire 18a helically wound from one end of the rod to the other.
  • This helical winding 18 is electrically and mechanically connected to the substrate 15a at the back end of the rod 15 (as seen in FIG. 2), via the conductive overcoating 16, by the simple expedient of dip soldering, as indicated by the resulting dip soldered connection at the back end of the rod 15.
  • the temperature of the dip solder bath is high enough to remove the insulated coating on the portion of the helical winding 18 which receives the solder.
  • the conductive overcoating 16 is very thin, it nevertheless permits this simple dip soldering operation to form a reliable electrical and mechanical connection between the solenoidal winding 18 and the conductive substrate 15a at the back end of the rod 15.
  • the wire 18a at the front of the rod is not soldered to the rod, since it is to pass to the helical solenoidal winding of another rod (not shown) for connection in dependence on the particular memory organization employed.
  • the rod 15 in FIG. 2 receives a wire 18a from the helical solenoidal winding of another rod (also not shown) which, as illustrated in FIG. 2, is wrapped around the conductive overcoating 16 at the front end of the rod 15 and soldered thereto to form a soldered connection 35 which provides a mechanical and electrical connection between the wire 18a and the substrate 15a at the front end of the rod 15.
  • This soldered connection 35 is ordinarily made after the rods are inserted and secured in their respective bores in the solenoid matrix of FIG. 1.
  • the solenoid matrix shown in FIG. 1, using rods as illustrated in FIG. 2 may be organized, for example, as disclosed in the aforementioned patent application Ser. No. 373,980, filed June 10, 1964, in which the rows of solenoid windings 10 in each array in FIG. I serve as word windings, and the helical solenoid windi'ng on each rod (as illustrated by 18 in FIG. 2) serves both as a sense winding during reading, and as a digit winding during writing.
  • current flow through the solenoidal winding 18 and the rod substrate 15a is as typically illustrated by the arrows I in FIG. 2.
  • the arrows I indicate current flowing to the helical solenoidal winding 18 from another rod (not shown) via wire 18a, then flowing through the helical solenoid winding 18 to the back end of the rod and to the substrate 15:: via the soldered connection 25 at the back end of the rod, and then returning to the front end of the rod via the inner conductive substrate 15a from where the current then flows via the soldered connection at the front end of the rod to the helical solenoidal winding of another rod (not shown).
  • FIGS. 3 and 4 illustrated therein are graphs comparing the hysteresis characteristic of a rod with a 950 angstrom gold overplating on a 97% iron-3% nickel 4,000 angstrom magnetic thin film with a like rod without the gold overplating. It is quite apparent from FIGS. 3 and 4 that a significant improvement in the squareness of the hysteresis characteristic is achieved by the gold overplated rod, the result of which is to permit use of a memory mode with only a 2 to 1 selection ratio instead of a 3 to 1 selection ratio as was previously required.
  • a bistable magnetic device comprising: a conductive rod substrate, a thin film of bistable magnetic material uniformly deposited on said substrate, said thin film having a thickness less than 10,000 angstroms so as to exhibit essentially single domain switching characteristics, a thin non-magnetic conductive overcoating uniformly deposited over said magnetic material and having a thickness no greater than that of said magnetic thin film or 5,000 angstroms, whichever is less, a helical solenoid wound along said rod over said conductive overcoating, and means mechanically and electrically connecting one end of said solenoid to said substrate at one end of said rod via said conductive overcoating.
  • a bistable magnetic device comprising: a conductive rod substrate, a thin film of bistable magnetic material uniformly deposited on said substrate, said thin film having a thickness less than 10,000 angstroms so as to exhibit essentially single domain switching characteristics, a thinnon-magnetic conductive overcoating uniformly deposited over said magnetic material and having a thickness no greater than that of said magnetic thin film or 5,000 angstroms, whichever is less, a helical solenoid wound along the length of said rod over said conductive overcoating, and a soldered connection provided at one end of said rod to electrically connect one end of said solenoid to said substrate at one end of said rod via said conductive overcoating.
  • a bistable magnetic device comprising: a conductive rod substrate, a thin film of bistable magnetic material uniformly deposited on said substrate, said thin film having a thickness less than 10,000 angstroms so as to exhibit essentially single domain switching characteristics, a thin non-magnetic conductive overcoating uniformly deposited over said magnetic material and having a thickness no greater than that of said magnetic thin film or 5,000 angstroms, whichever is less, and a helical solenoid wound along said rod over said conductive overcoating, a soldered connection provided at one end of said rod to electrically connect one end of said solenoid to said substrate at one end of said rod, a soldered connection provided at the other end of said rod to electrically connect to said substrate at said other end of said rod a lead wire from the solenoid of another rod.
  • said thin film magnetic material comprises approximately 93% to 99% iron and approximately 7% to 1% nickel.
  • said thin film magnetic material comprises a first ironnickel layer of approximately 30% to 90% nickel and approximately 70% to 10% iron and a second ironnickel layer composed of approximately 93% to 99% iron approximately 7% to 1% nickel.
  • a bistable magnetic device comprising: a conductive rod substrate having a diameter of less than than 0.1 inch, a thin film of bistable magnetic material uniformly deposited on said substrate, said thin film having a thickness less than 10,000 angstroms so as to exhibit essentiallyl single domain switching characteristics, a thin coating of gold deposited over said magnetic material and having a thickness from approximately 100 to 2,000 angstroms, a helical solenoid Wound along said rod and over said gold overcoating, and a soldered connection provided at one end of said rod for electrically connecting one end of said solenoid to said substrate at said one end of said rod.
  • each bistable magnetic rod comprising a conductive substrate having a thin bistable magnetic film deposited thereon and a thin non-magnetic conductive overcoating deposited over said magnetic film, said conductive overcoating having a thickness less than 5,000 angstroms, and a helical solenoid wound on each rod over its respective conductive overcoating and electrically connected to the substrate at one end of its respective rod via its respective conductive overcoating.
  • each rod has a helical solenoid from another rod electrically connected to the substrate at said other end.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Magnetic Heads (AREA)
US492496A 1965-10-04 1965-10-04 Bistable magnetic thin film rod having a conductive overcoating Expired - Lifetime US3516075A (en)

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US49249665A 1965-10-04 1965-10-04

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US (1) US3516075A (xx)
BE (1) BE687422A (xx)
DE (1) DE1499808A1 (xx)
FR (1) FR1505448A (xx)
GB (1) GB1097630A (xx)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3183492A (en) * 1960-04-28 1965-05-11 Ncr Co Bistable magnetic device and method
US3343145A (en) * 1962-12-24 1967-09-19 Ibm Diffused thin film memory device
US3354447A (en) * 1963-12-09 1967-11-21 Oshima Shintaro Thin film tape recorder
US3364064A (en) * 1962-08-08 1968-01-16 Philips Corp Method of improving the solderability of a nickel surface
US3370979A (en) * 1964-06-05 1968-02-27 Ibm Magnetic films
US3375091A (en) * 1964-03-17 1968-03-26 Siemens Ag Storer with memory elements built up of thin magnetic layers
US3411892A (en) * 1963-11-28 1968-11-19 Nippon Electric Co Ferromagnetic thin film memory element

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3183492A (en) * 1960-04-28 1965-05-11 Ncr Co Bistable magnetic device and method
US3364064A (en) * 1962-08-08 1968-01-16 Philips Corp Method of improving the solderability of a nickel surface
US3343145A (en) * 1962-12-24 1967-09-19 Ibm Diffused thin film memory device
US3411892A (en) * 1963-11-28 1968-11-19 Nippon Electric Co Ferromagnetic thin film memory element
US3354447A (en) * 1963-12-09 1967-11-21 Oshima Shintaro Thin film tape recorder
US3375091A (en) * 1964-03-17 1968-03-26 Siemens Ag Storer with memory elements built up of thin magnetic layers
US3370979A (en) * 1964-06-05 1968-02-27 Ibm Magnetic films

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BE687422A (xx) 1967-03-01
GB1097630A (en) 1968-01-03
DE1499808A1 (de) 1970-04-30

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