US3152938A - Method of making printed circuits - Google Patents

Method of making printed circuits Download PDF

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Publication number
US3152938A
US3152938A US665170A US66517057A US3152938A US 3152938 A US3152938 A US 3152938A US 665170 A US665170 A US 665170A US 66517057 A US66517057 A US 66517057A US 3152938 A US3152938 A US 3152938A
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United States
Prior art keywords
circuit pattern
adhesive
carrier plate
rhodium
plate
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Expired - Lifetime
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US665170A
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English (en)
Inventor
Osifchin Nicholas
Edgar E Wright
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Individual
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Individual
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Priority to BE568197D priority Critical patent/BE568197A/xx
Application filed by Individual filed Critical Individual
Priority to US665170A priority patent/US3152938A/en
Priority to FR1208251D priority patent/FR1208251A/fr
Priority to GB18511/58A priority patent/GB834181A/en
Application granted granted Critical
Publication of US3152938A publication Critical patent/US3152938A/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Definitions

  • FIG. I L 004 APPLY/N6 ADHESIVE A T TO THE c/Rcu/T PATTERN.
  • ALUMINUM BACK/N6 PLA TE APPLY A BACK/N6 L x PLA TE 7'0 THE nvsu LA TING BASE.
  • FIG. 1 In x INSULATING .MOLD/NG THE INSULATING BASE BASE TO THE CARR/ER l2 PLATE. I A
  • FIG. 4a METHOD OF MAKING PRINTED CIRCUITS Filed June 12, 1957 6 Sheets-Sheet 6 ACID-SOLUBLE COA TING 20
  • FIG. 4a METHOD OF MAKING PRINTED CIRCUITS Filed June 12, 1957 6 Sheets-Sheet 6 ACID-SOLUBLE COA TING 20
  • FIG. 4e REMOVING ACID-SOLUBLE COAT/N6 TO LEAVE ADHESIVE ONLY ON THE COPPER BACK/N6 PLATE.
  • This invention relates to printed electric circuits and, more particularly, to an improved process for fabricating a printed electric circuit having circuit elements which are embedded in an insulating base in such a manner that the surfaces of the circuit elements are in precisely the same plane as the surface of the insulating base.
  • This invention is especially useful when it is applied to the fabrication of switch plates used in high-speed rotary switches or commutators in various types of equipments, such as electronic computers, data processing systems, or telephone step-by-step mechanisms. It can be understood that, when it is desired to operate a rotary switch and brush assembly at a high linear speed, such as 720'feet per minute, consideration must be given to such limiting plate, forming an electrically conductive metallic circuit pattern upon the carrier plate by electroplating a coating of a hard wearing metal such as rhodium on the uncovered portions of the surface of the carrier plate, backing this metal coating with successive platings of nickel and cop- I per, removing the remaining portions of the photoresist factors as the flatness and finish of the switching surface which is in contact with the brush.
  • a hard wearing metal such as rhodium
  • switch plates of the type mentioned above be fabricated in such a manner that their electrically conductive surfaces are precisely flush with the surfaces of their insulating bases.
  • the conductive surfaces should have sharp definition at their points of demarcation.
  • the insulating base material be capable of resisting smudging or mechanical tracking, possess good wear-resistance, high insulation-resistance, and have good arc-resistant properties. Another important requirement is that all of the portions of each conductive circuit pattern should be firmly embedded in their.
  • the conductive elements of a circuit pattern should be securely It is also an object of this invention to provide an improved process for fabricating flush-mounted printed electric circuits.
  • Another object of this invention is to provide an improved method for securely bonding the conductive elements of a printed circuit to their insulating base.
  • the carrier coating from the surface of the carrier plate, applying an adhesive to the electroplated circuit pattern, molding a laminate of suitable resin-impregnated paper to the adhesive-covered metallic circuit pattern and to the carrier plate, and then removing the carrier plate.
  • the adhesive which is used for bonding the metallic circuit pattern to the paper laminate is a liquid melamine resin.
  • the adhesive is applied not only to the electroplated circuit pattern but also to the polished surface of the carrier plate.
  • the final step of removing the carrier plate is accomplished by dissolving it in a solution of chromic and sulphuric acids as is more fully explained hereinafter.
  • the insulating base is formed from a pile-up composed of melamine-resinimpregnated paper and phenolic-resin impregnated paper.
  • the paper laminate is bonded to the metallic circuit pattern by means of a suitable bonding agent se lected from the class of adhesives which comprises mixtures of phenolic resin and polyvinyl butyral resin.
  • This bonding agent as in the first process mentioned above, is applied to both the electroplated circuit pattern and to the polished surface of the carrier plate.
  • Another alternative fabricating process following the teachings of this invention restricts the application of the adhesive to only the surface of the electroplated metallic circuit pattern.
  • the adhesive is confined precisely to only the area of the circuit pattern by means 'of a suitable acid-soluble masking coating which is preferably formed upon the other portions of the carrier plate by a photographic printing process.
  • the masking coating is removed by dissolving it in a suitable acid solution, such asacetic acid, thereby leaving the polished surface of the carrier plate clean and free of any adhesive material.
  • FIGS. 1 to 14, inclusive, are enlarged cross-sectional views illustrating diagrammatically the steps followed in fabricating a flush-mounted printed electric circuit in accordance with the first process mentioned above ⁇
  • FIG. 15 is a view of the switching surface of a commutator switch plate constructedbythe method of this invention.
  • FIGS. 16 to 21, inclusive are enlarged cross-sectional views representing diagrammatically steps followed in manufacturing a flush-mounted printed circuit in accordance with the'second process mentioned above;
  • FIGS. 22- to 26, inclusive are enlarged cross-sectional views showing someofthe steps of the above-mentioned third process for making flush-mounted printed circuits.
  • the first step in the process of fabricating flush-mounted printed circuits, such as commutator switch plates, in accordance with this invention is to prepare a metallic carrier or transfer plate for supporting the printed circuit pattern during the various steps of the manufacturing- ,process.
  • This carrier plate should-be made' are that it be sufficiently rigid to maintain aplane surface, be capable of taking a high polish, and be soluble in an etching solution that will not attach rhodium or'nickel. These requirements provide a highly polished plane surface.
  • the Phosphor bronze carrier plate 1 is first carefully polished on one side 2 as is indicated in FIG. 1- so as to This is important because the surface 2 acts as a platen during a subsequent operation of forming thereon the fiush-mount-' ed switching surface of a commutator switch plate-as is described hereinafter. Therefore, the smoothness and flatness of the switching surface of the completed switch plate depend upon the quality of the finish of the surface 2. It is for this reason that hard-drawn Phosphor bronze is a preferred metal for this purpose since, as was stated above, it is capable of taking a high polish and has sufficient rigidity for maintaining a plane surface.
  • the carrier plate 1 is now de-greased by immersing it in a cathodic electrolytic cleaner after which It is next immersed for about fifteen seconds in ten percent hydrochloric acid, rinsed in cold water, and then blown dry with clean air.
  • the next step is to prepare the clean, polishedsurface 2 of the carrier plate 1 for the plating of a circuit pattern thereon during a subsequent operation. Accordingly, the surface 2 is now covered with two sprayed coatings 3 of a suitable photosensitive, acid-resistant material commonly known to those skilled in the art as photoresist. Each of these two coatings 3 should be baked for approximately twenty minutes at 150 degrees Fahrenheit in a dark, dust-free oven. The total thickness of the two coatings of photoresist 3 is of the order of .0005 inch as is in dicated in FIG. 2.
  • a positive transparency film 4 of the desired electric circuit pattern is superimposed, as is shown in FIG. 3, upon the coated carrier plate 1 which is now exposed to an are light for about fifteen minutes. After this exposure, the positive transparency film 4 is removed and the carrier plate 1 is placed in a photo-developing solution for about seven minutes. This removes only those portions of the photoresist 3 that where shielded from the are light by the positive circuit pattern on the film thereby uncovering corresponding portions of the polished surface 2 of the carrier plate 1 so 2 is now scrubbed with Vienna lime inorder to remove that the circuit pattern becomes portrayed thereon as is represented in FIG. 4.
  • the carrier plate 1 can now,.if desired, be immersed in a suitable dye, such as an organic compound, for an appropriate length of time.
  • a suitable dye such as an organic compound
  • the dye will color the masking portions of the photoresist Sremainingon
  • the carrier'plate 1 with the desired circuit pattern area 1 delineated thereon by the photographically exposed masking portions of the-photoresistfi should now be prepared for an electroplating operation by having an electrically conductive wire soldered to one of its corners.
  • the edges all, grease, oil, and finger prints as this is the area which is to be electroplated.
  • the carrier plate-1 is rinsed in cold water and is then immersed for-about thirty secends in ten percent hydrochloric acid after which it, is again rinsed incold water.
  • the carriergplate 1 is now ready to have a metallic-coating electroplated immediately upon the circuit pattern area.
  • a preferred metalfor' thispurpose is rhodium as it is capable of providing a hard, wear-resistant, non-smearing surface for use with the brush of a commutator. Due to its high cost, the rhodium is applied as a thin electrodeposit 5, which, as is represented in FIG. 5, has a thickness of about .000035 inch. As can be seen in FIG. 5, the portions of the photoresist coating 3- that remain on the carrier platel serveas a masking covering to confine the rhodium plating 5 to only the area of the circuit pattern and provide sharp definition at the points of demarcation.
  • Nickel is selected forthis purpose because it provides a'hardbacking material for the rhodiumplating 5 and it is not soluble in the etching solution of chromicand sulphuric acids which is used during a' later step in this process as is described hereinafter.
  • the plating 6 of nickel is backed with an electrodeposit '7 of several thousands of an inch of copper with the'result that the total thickness of the combined deposits of the metallicplatings 5, '6, and Twill'be about .005 inch as is indicated in FIG. 7. It is to be notedthat if the thickness of the metallic deposits exceeds this amount, there will be a tendency during the electroplating operationfor them to creep excessively over the surface. of the photoresistfi which only has a thickness of approximately .0005inch. Therefore, care should be used to prevent the thickness of the metallic deposits from becominggreater than about .005 inch.
  • the carrier plate 1 is lifted out of the plating bath, is rinsed in cold water, and is then dried.
  • the photoresist 3 is now removed by immersing the carrier plate 1 q in a suitable solvent, such as ethylacetate, and by scrubbing it gently witha soft brush.
  • the carrier plate 1 is rinsed in cold water, de-greased in an electrolytic cleaner, rinsed in hot water, rinsed in cold water, immersedfor thirty seconds in ten percent hydrochloric acid, rinsed in cold water, and'finally dried with a blast of clean air.
  • the carrier plate 1 "and the metallic circuit pattern electroplated thereon now appear inthe form. shown in FIG.' 8.
  • the next step in the manufacturing ,process of this invention is to apply a suitable adhesive to the metallic circuit pattern for use during a subsequentoperation of securely bonding'the metallic circuit patternlto its insulating base so as to insure that. the switching surface of the ,metallic circuit pattern will. always remain flush with the surface ofthe insulating base.
  • a suitable adhesive to be used for this purpose is liquid melamineresin which will be cured during a subsequent operation as is describedhereinafter.
  • this material has the additionally advantageous property, after it has been cured, of providing a'hard, longwearing, smudge-resistant, non-smearing arc-resistant,
  • a suitable mold in order to prevent the liquid melamine resin 8 from fiowing off the surface 2 of the carrier plate 1, it should be confined by a suitable mold in a manner Well known to those skilled in the art.
  • An insulating base is now molded over the adhesivecoated metallic circuit pattern.
  • the strength and rigidity of the final form of the insulating base can be increased by arranging the individual sheets of phenolic paper 9 in such a manner that the orientation of the grain of one sheet is in a direction ninety. degrees removed from the direction in which the grain of the adjacent sheets is oriented.
  • a convenient Way of accomplishing this is to provide each sheet with an identifying mark, such as a notch or a colored stripe, for indicating the orientation of its'grain and then to-arrange the sheets so that the marks are disposed in an alternate manner.
  • the rigidityof the final form of theswitch plate can be further improved by employing a backing plate of some suitable metal, such as aluminum.
  • a backing plate of some suitable metal such as aluminum.
  • the top surface of the. phenolic paper pile-up 9 should first be covered with a coating 10 of an appropriate adhesive as is shown in FIG. 11.
  • the backing plate 11 is laid on top of the adhesive coating ltl as is indicated in FIG. 12.
  • an adhesive- 1 that is in the form of a liquid is that it serves to fill completely all the voids in the circuit pattern during the As was stated above, an alternative process for fabricating flush-mounted printed circuits in accordance with this invention employs a different adhesive for bonding the metallic circuit pattern tothe insulating base.
  • This second process in its preferred embodiment follows the above-described steps'of preparing the carrier plate 1, applying the photoresist coating 3, developing thereon the desired circuit pattern, applying successive electroplatings of rhodium 5 backed with nickel 6 followed by copper '7, and then removing the remaining portions of the photoresist coating 3 with the result that the carrier plate 1 and t the metallic circuit pattern electroplated thereon appear in
  • This operation is performed by placing a number of sheets of uncured phenolic This assembly is now molded and curedin a press at about 325 degrees Fahrenheit under a pressure of about 1,500 pounds per square inch for approximately thirty minutes. It is then allowed to cool to room temperature During this operation, both the liquid melamine resin 8 and the phenolic resinimpregnated paper 9 become transformed into a hard,
  • the final step in this manufacturing process is to remove the carrier plate 1 from the remainder of the assembly so as to expose the switching surface of the metallic circuit pattern which is now securely bonded to. the cured melamine-phenolic base 12.
  • a suitable etching bath such as a solution of chromic and sulphuric acids at about 120 degrees Fahrenheit.
  • the acid solution will dissolve the Phosphor bronze carrier plate 1 in about'fifty minutes during which time it is preferable that the solution be stirred.
  • This solution willnotattack the melaminephenol base 12., the aluminum backing plate 11, the rhodium platings, or the nickel plating 6.
  • the copper plating 7 would be soluble in this acid solution, it is completely protected therefrom by the surrounding base 12 and the rhodium-and nickel platings 5 and 6. As soon as the.
  • the completed commutator switch plate will now ap--- pear in the form shown in FIG. 14 with-the surfaces of the rhodium platings 5 on the segments of the metallic circuit pattern lying in precisely the samelplane as the.
  • this second process substitutes therefor a suitable bonding agent selected from the class of adhesives which comprises mixtures of phenolic resin and polyvinyl butyral resin.
  • a thin layer 13 of this adhesive mixture which may be in the form of sheet-film, is applied over both the polished surface 2 of the carrier plate 1 and the metallic circuit pattern as is indicated in FIG. 16.
  • the advantageof using an adhesive that is in the form of sheet-film is that it serves to insure that the adhesive material will be evenly distributed over the underlying metallic surfaces.
  • the next step in this second process is to supply some form of melamine resin which can be used to make the desired long-wearing, arc-resistant, insulating surface of the completed switch plate.
  • This can be done conveniently by superimposing a suitable number of sheets of uncured melamine resin impregnated paperl lover the adhesive coating 13 as is shown in FIG. 17.
  • the individual sheets of melamine paper 14 should be arranged in a cross-grained manner as was described above with respect to the pile-up of phenolic resin impregnated paper 9.
  • a cross-grained pile-up of uncured phenolic resin impregnated paper 15 is laid on top of the pile-up of melamine paper 14- as is represented in FIG. 18. It should be noted that the phenolic paper pile-up 15 is considerably thicker than the melamine paper pile-up 14.
  • an adhesive-coated backing plate may be pile-up 14. This should be followed by a layer 17 of the adhesive film having the same thickness as the first adhesive layer-13. Finally, the adhesive layer 1'7 is covered with a Phosphor bronze balance plate 18 having the same It should benoted that dimensions as the carrier plate 1.
  • the polyvinyl butyralphenolic adhesive mixture 13 will blend with the melamine paper 14, so as not only to provide a secure bond between, the metallic circuit pattern and the melamine paper 14,'
  • the insulating base 19 is constituted by the abovementioned resin materials which have been transformed into a hard, solid mass. It should be noted that, since the :materials used in this assembly have dilierent thermal coefficients of expansion, fplanar distortion of the final.
  • the final step in'this second'process is'th'e removal of the carrier plate 1 and the balance plate 18. This can be accomplished conveniently by dissolving them in a solution of chromic and sulphuric acidsin the'manner described above. After-this operation has been completed, the commutator switch plate will appearin its'final form as is shown in FIG. 21 with the insulating portions 19 and the metallic portions 5 of its switching surface precisely flush with respect to each other.
  • Another alternative process for fabricating flushmounted printed circuits in accordance with this invention differs from the two processes described above in that the adhesive which is used for bonding the metallic circuit pattern to the insulating base is not applied to the surface 2 of :the carrier plate 1 but is applied only to the top of the copper plating? of the metallic circuit pattern.
  • Thisthird process follows the steps that were described above with respect to electroplating the metallic circuit pattern upon-- the carrier plate 1, removing the acid-resistant coating 3, and cleaningthe surface 2 of the carrier'plate 1 and the metalliccircuit pattern so that they appear in the form shown in FIG. 8.
  • the coating 2% may be of any suitablematerial', such as a mixture of glue and egg albumen with a small amount of in it can be seen that the top of the copper'plating' 7' of the'metallic circuit pattern is uncovered'while the surface: 2 of the carrier plate 1 is protected by a mask constituted by the photographically exposed portions of the coating 20:
  • a suitable'bonding agent which may be the same adhesive mixture of polyvinyl butyral and phenolic resins that was used in the second process described above is now sprayed or brushed in liquid form over the uncovered copper surface 7 of the metallic circuit pattern until a coating 22 having the desired thickness'is obtained, as is shown in FIG. 25.
  • the assembly is immersed in dilute acetic acid at room temperature in order to loosen the acid-soluble coating 26) so that it may be brushed away,
  • the next step in this third process is to mold an insulating base over the adhesive-coated metalic circuitpattern.
  • This can be. convenienty accomplished by follow ing the steps ofthe secondprocess that were-described above with respect to.
  • FIGS: 17 and 18 and which comprise the application ofathinpile-up 14'of*melamine resin-impregnated paper followed by a thickpile-up 15 of phenolic resin-impregnatedpaper.
  • a symmetrically balanced assembly may be formed in. the manner described above with'respect'to FIG. 19.
  • Theassembly is now molded and cured in the manner described above so as to provide a hard, solid, insulating base similar to the base 19' that is shown in FIG. 20.
  • the Phosphor bronze material is removed. in any suitable manner, such as by dissolvingit in a solution of chromic and sulphuric acids aswasdescribed above so that the completed commutator switch plate will now appear in the form shown in FIG.' 21.
  • the polyvinyl butyral-phenolic adhesive-coating 22 provides a secure bond between themetallic circuit pattern and theinsulating base 19 as was explained above in the description ofthesecond process; 'This results in the production of a commutator switch plate having unusually high peel strength so that its electrically conductive segments will resist loosening by long-term aging and will also remain intact and undisturbed after 4 long periods of highspeed wiping.
  • said process comprising the steps of delineating a circuit pattern upon a highly polished surface of altemporary-carrier member, applying a coating of electricallyconductive rhodium to thearea of said circuit pattern delineated 'on' saidsurface, electroplating a first backing member of nickel to said rhodium, electroplating a second backing member of copper to.
  • said nickel backing member covering only saidcopper backing member with-adhesive material, molding a hardsolidbase of insulating material'to saidsurface of said carrier member and to said rhodium; and'said first and second backing members while using said adhesive materialas a bonding agent, and chemically-removing saidcarrier member from both said molded insulating base and said rhodium and said first and-second backing members by dissolving it with a solvent for said carrier member whichis substantially inert toward said electrically conductive material and said insulating material.
  • said process also including the step of chemically removing the remaining portions of said acid-soluble coating by dissolving them in a suitable acid solution after the above-mentioned application of said adhesive to said second backing member, said acid solution being substantially inert towards the I other components of the assembly.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Rotary Switch, Piano Key Switch, And Lever Switch (AREA)
  • Manufacture Of Switches (AREA)
US665170A 1957-06-12 1957-06-12 Method of making printed circuits Expired - Lifetime US3152938A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
BE568197D BE568197A (de) 1957-06-12
US665170A US3152938A (en) 1957-06-12 1957-06-12 Method of making printed circuits
FR1208251D FR1208251A (fr) 1957-06-12 1958-05-30 Procédé de fabrication de circuits imprimés
GB18511/58A GB834181A (en) 1957-06-12 1958-06-10 Improvements in or relating to printed electric circuits

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Application Number Priority Date Filing Date Title
US665170A US3152938A (en) 1957-06-12 1957-06-12 Method of making printed circuits

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US3152938A true US3152938A (en) 1964-10-13

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US665170A Expired - Lifetime US3152938A (en) 1957-06-12 1957-06-12 Method of making printed circuits

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BE (1) BE568197A (de)
FR (1) FR1208251A (de)
GB (1) GB834181A (de)

Cited By (30)

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Publication number Priority date Publication date Assignee Title
US3293399A (en) * 1963-12-14 1966-12-20 Balco Filtertechnik G M B H Printed circuit contact arrangement
US3496072A (en) * 1967-06-26 1970-02-17 Control Data Corp Multilayer printed circuit board and method for manufacturing same
US3930857A (en) * 1973-05-03 1976-01-06 International Business Machines Corporation Resist process
DE2528666A1 (de) * 1974-07-19 1976-01-29 Ibm Verfahren zur herstellung einer maske fuer roentgenstrahl-lithographie
US3953924A (en) * 1975-06-30 1976-05-04 Rockwell International Corporation Process for making a multilayer interconnect system
US4022927A (en) * 1975-06-30 1977-05-10 International Business Machines Corporation Methods for forming thick self-supporting masks
US4159222A (en) * 1977-01-11 1979-06-26 Pactel Corporation Method of manufacturing high density fine line printed circuitry
US4306925A (en) * 1977-01-11 1981-12-22 Pactel Corporation Method of manufacturing high density printed circuit
EP0053490A1 (de) * 1980-11-28 1982-06-09 Asahi Kasei Kogyo Kabushiki Kaisha Verfahren zur Herstellung einer fein gemusterten Struktur mit Dickschichtleitern
FR2498412A1 (fr) * 1981-01-16 1982-07-23 Delair Michel Procede de fabrication de circuits imprimes base sur le principe du depot du reseau conducteur sur un outillage specifique reutilisable et du transfert de ce depot sur le support isolant
US4420364A (en) * 1976-11-02 1983-12-13 Sharp Kabushiki Kaisha High-insulation multi-layer device formed on a metal substrate
EP0152634A2 (de) * 1984-01-11 1985-08-28 Hitachi, Ltd. Verfahren zur Herstellung einer gedruckten Leiterplatte
US4816616A (en) * 1987-12-10 1989-03-28 Microelectronics Center Of North Carolina Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes
US4834821A (en) * 1988-01-11 1989-05-30 Morton Thiokol, Inc. Process for preparing polymeric materials for application to printed circuits
US4980016A (en) * 1985-08-07 1990-12-25 Canon Kabushiki Kaisha Process for producing electric circuit board
US5096522A (en) * 1989-06-23 1992-03-17 Meiko Electronics Co., Ltd. Process for producing copper-clad laminate
US5275693A (en) * 1990-03-30 1994-01-04 Yamato Kako Kabushiki Kaisha Film forming process
US5531020A (en) * 1989-11-14 1996-07-02 Poly Flex Circuits, Inc. Method of making subsurface electronic circuits
US6162365A (en) * 1998-03-04 2000-12-19 International Business Machines Corporation Pd etch mask for copper circuitization
US6251248B1 (en) * 1999-10-15 2001-06-26 Ching-Bin Lin Microfabrication process for making microstructures having high aspect ratio
US20030161778A1 (en) * 2000-05-26 2003-08-28 De Waal Jan Christoffel Production of dicalcium phosphate or monocalcium phosphate
US20040137376A1 (en) * 2003-01-15 2004-07-15 Bishop John L. Method and system for replicating film data to a metal substrate and article of manufacture
US20040247920A1 (en) * 2003-06-06 2004-12-09 Formfactor, Inc. Rhodium Electroplated structures and methods of making same
US20090084598A1 (en) * 2007-10-01 2009-04-02 Intel Corporation Coreless substrate and method of manufacture thereof
EP2621253A1 (de) * 2012-01-25 2013-07-31 Shinko Electric Industries Co., Ltd. Verdrahtungssubstrat, lichtemittierende Vorrichtung und Verfahren zur Herstellung eines Verdrahtungssubstrats
DE102013212695A1 (de) * 2013-06-28 2015-01-15 Volker Elsässer Datenträger und Verfahren zu dessen Herstellung
US9000474B2 (en) 2012-01-25 2015-04-07 Shinko Electric Industries Co. Ltd. Wiring substrate, light emitting device, and manufacturing method of wiring substrate
US9084372B2 (en) 2012-01-25 2015-07-14 Shinko Electric Industries Co., Ltd. Wiring substrate, light emitting device, and manufacturing method of wiring substrate
US20150287531A1 (en) * 2012-10-30 2015-10-08 LEAP Co., Ltd Coil element production method
US20150294789A1 (en) * 2012-10-30 2015-10-15 Leap Co., Ltd. Method for producing coil element using resin substrate and using electroforming

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US3293399A (en) * 1963-12-14 1966-12-20 Balco Filtertechnik G M B H Printed circuit contact arrangement
US3496072A (en) * 1967-06-26 1970-02-17 Control Data Corp Multilayer printed circuit board and method for manufacturing same
US3930857A (en) * 1973-05-03 1976-01-06 International Business Machines Corporation Resist process
DE2528666A1 (de) * 1974-07-19 1976-01-29 Ibm Verfahren zur herstellung einer maske fuer roentgenstrahl-lithographie
US3953924A (en) * 1975-06-30 1976-05-04 Rockwell International Corporation Process for making a multilayer interconnect system
US4022927A (en) * 1975-06-30 1977-05-10 International Business Machines Corporation Methods for forming thick self-supporting masks
US4420364A (en) * 1976-11-02 1983-12-13 Sharp Kabushiki Kaisha High-insulation multi-layer device formed on a metal substrate
US4159222A (en) * 1977-01-11 1979-06-26 Pactel Corporation Method of manufacturing high density fine line printed circuitry
US4306925A (en) * 1977-01-11 1981-12-22 Pactel Corporation Method of manufacturing high density printed circuit
EP0053490A1 (de) * 1980-11-28 1982-06-09 Asahi Kasei Kogyo Kabushiki Kaisha Verfahren zur Herstellung einer fein gemusterten Struktur mit Dickschichtleitern
US4401521A (en) * 1980-11-28 1983-08-30 Asahi Kasei Kogyo Kabushiki Kaisha Method for manufacturing a fine-patterned thick film conductor structure
FR2498412A1 (fr) * 1981-01-16 1982-07-23 Delair Michel Procede de fabrication de circuits imprimes base sur le principe du depot du reseau conducteur sur un outillage specifique reutilisable et du transfert de ce depot sur le support isolant
EP0152634A2 (de) * 1984-01-11 1985-08-28 Hitachi, Ltd. Verfahren zur Herstellung einer gedruckten Leiterplatte
EP0152634A3 (en) * 1984-01-11 1986-06-11 Hitachi, Ltd. Method for manufacture of printed wiring board
US4980016A (en) * 1985-08-07 1990-12-25 Canon Kabushiki Kaisha Process for producing electric circuit board
US4816616A (en) * 1987-12-10 1989-03-28 Microelectronics Center Of North Carolina Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes
US4834821A (en) * 1988-01-11 1989-05-30 Morton Thiokol, Inc. Process for preparing polymeric materials for application to printed circuits
US5096522A (en) * 1989-06-23 1992-03-17 Meiko Electronics Co., Ltd. Process for producing copper-clad laminate
US5531020A (en) * 1989-11-14 1996-07-02 Poly Flex Circuits, Inc. Method of making subsurface electronic circuits
US5275693A (en) * 1990-03-30 1994-01-04 Yamato Kako Kabushiki Kaisha Film forming process
US5405676A (en) * 1990-03-30 1995-04-11 Yamato Kako Kabushiki Kaisha Film forming process
US6162365A (en) * 1998-03-04 2000-12-19 International Business Machines Corporation Pd etch mask for copper circuitization
US6251248B1 (en) * 1999-10-15 2001-06-26 Ching-Bin Lin Microfabrication process for making microstructures having high aspect ratio
US20030161778A1 (en) * 2000-05-26 2003-08-28 De Waal Jan Christoffel Production of dicalcium phosphate or monocalcium phosphate
WO2004066276A3 (en) * 2003-01-15 2006-11-09 Norsam Technologies Inc Method and system for replicating film data to a metal substrate and article of manufacture
US20040137376A1 (en) * 2003-01-15 2004-07-15 Bishop John L. Method and system for replicating film data to a metal substrate and article of manufacture
WO2004066276A2 (en) * 2003-01-15 2004-08-05 Norsam Technologies, Inc. Method and system for replicating film data to a metal substrate and article of manufacture
US20080241482A1 (en) * 2003-06-06 2008-10-02 Formfactor, Inc. Rhodium electroplated structures and methods of making same
US7326327B2 (en) * 2003-06-06 2008-02-05 Formfactor, Inc. Rhodium electroplated structures and methods of making same
US20040247920A1 (en) * 2003-06-06 2004-12-09 Formfactor, Inc. Rhodium Electroplated structures and methods of making same
US20090084598A1 (en) * 2007-10-01 2009-04-02 Intel Corporation Coreless substrate and method of manufacture thereof
US8555494B2 (en) * 2007-10-01 2013-10-15 Intel Corporation Method of manufacturing coreless substrate
EP2621253A1 (de) * 2012-01-25 2013-07-31 Shinko Electric Industries Co., Ltd. Verdrahtungssubstrat, lichtemittierende Vorrichtung und Verfahren zur Herstellung eines Verdrahtungssubstrats
US9000474B2 (en) 2012-01-25 2015-04-07 Shinko Electric Industries Co. Ltd. Wiring substrate, light emitting device, and manufacturing method of wiring substrate
US9029891B2 (en) 2012-01-25 2015-05-12 Shinko Electric Industries Co., Ltd. Wiring substrate, light emitting device, and manufacturing method of wiring substrate
US9084372B2 (en) 2012-01-25 2015-07-14 Shinko Electric Industries Co., Ltd. Wiring substrate, light emitting device, and manufacturing method of wiring substrate
EP2882267A3 (de) * 2012-01-25 2015-10-28 Shinko Electric Industries Co., Ltd. Verdrahtungssubstrat, lichtemittierende Vorrichtung und Verfahren zur Herstellung eines Verdrahtungssubstrats
US20150287531A1 (en) * 2012-10-30 2015-10-08 LEAP Co., Ltd Coil element production method
US20150294789A1 (en) * 2012-10-30 2015-10-15 Leap Co., Ltd. Method for producing coil element using resin substrate and using electroforming
DE102013212695A1 (de) * 2013-06-28 2015-01-15 Volker Elsässer Datenträger und Verfahren zu dessen Herstellung

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GB834181A (en) 1960-05-04
FR1208251A (fr) 1960-02-23
BE568197A (de)

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