US3140528A - Multiple lead faceplate - Google Patents

Multiple lead faceplate Download PDF

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Publication number
US3140528A
US3140528A US58743A US5874360A US3140528A US 3140528 A US3140528 A US 3140528A US 58743 A US58743 A US 58743A US 5874360 A US5874360 A US 5874360A US 3140528 A US3140528 A US 3140528A
Authority
US
United States
Prior art keywords
bundle
wires
glass
array
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US58743A
Other languages
English (en)
Inventor
Jr Arthur R Hildebrand
Frank W Martin
Kenneth G Pollock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Glass Works
Original Assignee
Corning Glass Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL130061D priority Critical patent/NL130061C/xx
Priority to NL268953D priority patent/NL268953A/xx
Application filed by Corning Glass Works filed Critical Corning Glass Works
Priority to US58743A priority patent/US3140528A/en
Priority to FR871912A priority patent/FR1298812A/fr
Priority to DE19611414748 priority patent/DE1414748B2/de
Priority to GB33673/61A priority patent/GB1005311A/en
Priority to CH1117661A priority patent/CH391119A/fr
Priority to BE608597A priority patent/BE608597A/fr
Application granted granted Critical
Publication of US3140528A publication Critical patent/US3140528A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B37/00—Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
    • C03B37/10—Non-chemical treatment
    • C03B37/14—Re-forming fibres or filaments, i.e. changing their shape
    • C03B37/15—Re-forming fibres or filaments, i.e. changing their shape with heat application, e.g. for making optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/082—Wires with glass or glass wool
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
    • H01J29/36—Photoelectric screens; Charge-storage screens
    • H01J29/39—Charge-storage screens
    • H01J29/41—Charge-storage screens using secondary emission, e.g. for supericonoscope
    • H01J29/413—Charge-storage screens using secondary emission, e.g. for supericonoscope for writing and reading of charge pattern on opposite sides of the target, e.g. for superorthicon
    • H01J29/416—Charge-storage screens using secondary emission, e.g. for supericonoscope for writing and reading of charge pattern on opposite sides of the target, e.g. for superorthicon with a matrix of electrical conductors traversing the target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/02—Cathode ray tubes; Electron beam tubes having one or more output electrodes which may be impacted selectively by the ray or beam, and onto, from, or over which the ray or beam may be deflected or de-focused
    • H01J31/06—Cathode ray tubes; Electron beam tubes having one or more output electrodes which may be impacted selectively by the ray or beam, and onto, from, or over which the ray or beam may be deflected or de-focused with more than two output electrodes, e.g. for multiple switching or counting
    • H01J31/065—Cathode ray tubes; Electron beam tubes having one or more output electrodes which may be impacted selectively by the ray or beam, and onto, from, or over which the ray or beam may be deflected or de-focused with more than two output electrodes, e.g. for multiple switching or counting for electrography or electrophotography, for transferring a charge pattern through the faceplate

Definitions

  • This invention relates to an electrostatic printing tube and more particularly to a method of manufacturing the multiple lead array comprising the faceplate of the tube.
  • a cathode ray type tube envelope is employed utilizing an array on the faceplate thereof comprising a plurality of leads extending from the inside of the tube to the outside thereof. These leads consist of electrically conductive wires, insulated from each other and all of the uniform length.
  • the evacuated tube with a multiple lead array as its faceplate and an appropriate electron gun in its neck comprises the printing instrument.
  • specially treated paper which will hold an electrostatic charge, is passed transversely along the array.
  • a charge in a given configuration, is deposited on the paper as it passes the particular wire on which the beam falls.
  • means are provided to develop and fix the electrostatic charge deposited on the paper.
  • the encapsulating dielectric material which matches the coefficient expansion of the wires, must also have a low dielectric constant K. It has been found that if an encapsulating material having a high dielectric constant is used, an undesired static charge is produced on the leads adjacent those carrying a charge due to the beam. This due primarily to the fact that a high dielectric constant capacitor is formed between the two adjacent wires which capacitor is very easily charged by the flow of current in one wire to produce an undesirable charge in the adjacent wires. Also, if the K is too high, a static charge is built up over the entire array, which charge may be attributed to the fast moving paper across the lead ends.
  • an electrostatic writing tube may be formed that is noted by its absence of undesired static charges and by its ease of manufacture.
  • Another important object of the present invention is to provide a method of forming a multi-lead array for the faceplate of an electrostatic printing tube wherein the leads, the encapsulating material therefor and the envelope all have matching coefficients of expansion.
  • Still another important object of the present invention is to provide a method of forming a multi-lead array for the faceplate of an electrostatic printing tube that is noted by its ease of manufacture and its adaptability to mass production.
  • FIG. 1 represents a fiow chart of the novel process
  • FIG. 2 represents the bundling step of the flow chart.
  • FIG. 1 depicts a flow chart of our novel process
  • the chosen Wire is first prepared by providing a suitable glass coating thereon and subsequently cutting the coated wire into suitable lengths to fit a die.
  • the coated wires are then stacked in a die and the die is fired to form a bundle of wires.
  • the bundle is then annealed and a slicing operation is performed on the bundle to form an array which is then sealed to an appropriate envelope to form the faceplate of a writing tube.
  • One desirable method of wire coating consists in heating a length of tubing to about -150 C. above the softening point and drawing the wire through the tubing at such a rate that a 1.52.5 mil coating of glass is deposited on the wire. The coated wire is then stored until ready for further use.
  • the bundling die consists of a metallic container 14 having four sides, a bottom and lips 16 for ease of handling.
  • the inside of container 14 is lined with a refractory material 18 to prevent any material from adhering to the walls.
  • Adjacent refractory material 18, the die is further lined with an inner coating 20 consisting of pieces of glass which may be the same material that has been previously utilized to coat the wire.
  • the bundling operation is performed by stacking the coated wires 22 parallel to the major axis of the die, that is, perpendicular to side wall 28 and parallel to end wall 30. After the bundle is assembled, as shown in FIG.
  • a layer of refractory material 32 is then placed over this top covering and a small weight 26 designated as block W is placed thereon to maintain a constant pressure.
  • the bundle is now ready for firing.
  • the major axis of the die is defined in this instance as being a plane parallel to the open top of enclosure 14, that is, parallel to glass covering piece 24 as positioned in FIG. 2.
  • the firing cycle is accomplished in four stages; namely, outgassing, sealing, homogenizing and annealing.
  • the outgassing step or cycle is performed under a vacuum of from 50-200 microns of mercury.
  • the function of this operation is to drive moisture out of the bundle and to remove gases absorbed on what is probably a hydrated layer of glass on the coated wire.
  • the die in a vacuum furnace, has its temperature raised to about 150-200 C. below the softening point of the glass used for coating the wires. It is held at this temperature for about A2 hour to insure complete outgassing. After about /2 hour the bundle is free of absorbed gases.
  • the temperature is then raised at a uniform rate to about 1020 C. below the softening point of the glass at which time the vacuum is broken to prevent foaming of the glass.
  • the remainder of the heat treatment may be conducted at atmospheric pressure.
  • Both the outgassing step and the sealing step which follows are usually carried on in the same furnace.
  • Annealing The temperature of the die is now rapidly lowered to a point somewhat above the annealing point of the glass to exhibit the reformation of any other crystalline phases.
  • the bundle is then removed from the die and placed in a furnace slightly above the annealing temperature of the glass and held there for about two hours to insure complete annealing after which, the bundle is allowed to cool to room temperature.
  • the bundle slicing operation may be accomplished in any one of a number of ways, however, it is preferable that a diamond saw be used since this produces a cleaner cut as well as being capable of producing a thinner array.
  • the bundle is sliced perpendicularly to the axis of the wires so that in the final product the wires extend from one side of the array to the other. After the bundles are sliced and the arrays have been formed, they are ground and, if necessary, polished to the desired thickness which may range from about .050.075 inch. Flatness of both surfaces of the array is essential and care must be exercised to insure that both surfaces are completely parallel.
  • Sealing array to bulb This step is usually accomplished in an open top furnace wherein both the bulb and the array are uniformly heated to a temperature of about 100 C. above the annealing point of the envelope with the array in position on the envelope. It is wise at this point to provide some sort of heat sink on the array during the sealing operation to prevent its sagging.
  • the seal is made by softening the edges of the array with a flame and sealing it to the envelope. If the expansion match between the array and the envelope is conducive to a good seal, then there will be little residual stress in the seal area after the sealed bulb has been annealed.
  • the individual wires in either the single or the multi-row array may be arranged in a plane or planes parallel to the major axis of the enclosure, the wires in each instance may also be arranged to fan out in the manner of spokes radiating from a hub.
  • This latter embodiment finds particular application where it is desired to produce a writing tube having either a domed or curved faceplate or having a fiat faceplate with the electrical features of a dome faceplate.
  • the individual wires will all be parallel to the axis of the beam emanating from the gun in the completed assembly.
  • a method for producing an electrostatic printing member having a matrix of conductors insulated from each other comprising the steps of providing a plurality of wires having a uniform coating of insulating material adhered thereto, arranging said wires in an enclosure wherein said coatings on adjacent wires are contiguous and said wires are parallel to the major axis of said enclosure, outgassing the arranged coated wires by heating under vacuum, fusing said insulating material to form a bundle, homogenizing the insulating material of the bundle so formed, annealing said insulating material, cooling said bundle, and thereafter slicing a relatively thin array from said bundle wherein said conductors extend from one side of said array to the other side thereof.
  • a method for producing an electrostatic printing member having a matrix of conductors insulated from each other comprising the steps of providing a plurality of glass coated wires, the coating glass having a relatively low dielectric constant and a coefiicient of expansion compatible with the coetficient of expansion of said wires, arranging said wires in an enclosure in adjacent and contiguous parallel relationship in at least one row and in at least one plane parallel to the major axis of said enclosure to form a bundle, outgassing said bundle by heating under vacuum and maintaining said condition for about /2 hour, raising said bundle temperature and releasing said vacuum at a point about -20 C. below the softening temperature of said glass, continuing to raise said bundle temperature to about 50-60 C.
  • a method for producing a matrix of conductors insulated from each other comprising the steps of providing a plurality of wires having a uniform coating of insulating material adhered thereto, arranging said wires in an adjacent and contiguous parallel relationship with each other, fusing said insulating material to form a bundle, homogenizing the insulating material of the bundle so formed, annealing said insulating material, and thereafter cooling said bundle.
  • a method for producing a matrix of conductors insulated from each other comprising the steps of providing a plurality of Wires having a uniform coating of glass adhered thereto, arranging said wires in an adjacent and contiguous parallel relationship with each other to form a bundle, outgassing said bundle by heating under vacuum, raising said bundle temperature to about 60 C. above the softening temperature of said glass to fuse said glass, homogenizing said glass, annealing said glass, cooling said bundle and thereafter slicing a relatively thin array from said bundle.
  • a method for producing a matrix of conductors insulated from each other comprising the steps of providing a plurality of Wires having a uniform coating of glass adhered thereto, arranging said Wires in an enclosure in an adjacent and contiguous parallel relationship to form a bundle, outgassing said bundle by heating under vacuum, raising said bundle temperature to about 5060 C. above the softening temperature of said glass to fuse and seal said glass plunging the bundle into a furnace having a temperature of about 50-100" C. above the liquidus temperature of said glass, annealing said glass, cooling said bundle, and slicing a relatively thin array from said bundle wherein said conductors extend from one side of said array to the other side thereof.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Glass Compositions (AREA)
US58743A 1960-09-27 1960-09-27 Multiple lead faceplate Expired - Lifetime US3140528A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL130061D NL130061C (en(2012)) 1960-09-27
NL268953D NL268953A (en(2012)) 1960-09-27
US58743A US3140528A (en) 1960-09-27 1960-09-27 Multiple lead faceplate
FR871912A FR1298812A (fr) 1960-09-27 1961-08-30 Plaque de fond à conducteurs multiples
DE19611414748 DE1414748B2 (de) 1960-09-27 1961-09-20 Verfahren zum Herstellen von Frontplatten für Kathodenstrahlröhren
GB33673/61A GB1005311A (en) 1960-09-27 1961-09-20 Multiple lead faceplate for electrostatic printing devices
CH1117661A CH391119A (fr) 1960-09-27 1961-09-26 Procédé de fabrication d'un ensemble de conducteurs isolés les uns des autres et utilisation de cet ensemble
BE608597A BE608597A (fr) 1960-09-27 1961-09-27 Plaque de fond à conducteurs multiples

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58743A US3140528A (en) 1960-09-27 1960-09-27 Multiple lead faceplate

Publications (1)

Publication Number Publication Date
US3140528A true US3140528A (en) 1964-07-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
US58743A Expired - Lifetime US3140528A (en) 1960-09-27 1960-09-27 Multiple lead faceplate

Country Status (5)

Country Link
US (1) US3140528A (en(2012))
BE (1) BE608597A (en(2012))
CH (1) CH391119A (en(2012))
GB (1) GB1005311A (en(2012))
NL (2) NL268953A (en(2012))

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3240987A (en) * 1961-08-28 1966-03-15 Mosaic Fabrications Inc Metal and glass fiber structures and electrical devices using same
US3241934A (en) * 1961-03-20 1966-03-22 American Optical Corp Method for making electron image transfer device
US3453710A (en) * 1966-06-07 1969-07-08 Stromberg Carlson Corp Method of manufacturing pin faceplate
US3607197A (en) * 1967-11-10 1971-09-21 Barr & Stroud Ltd Manufacture of fiber optic stacks
US3893215A (en) * 1973-07-18 1975-07-08 Bendix Corp Method of manufacturing face plates with large number of conducting paths from one face to the other
US3976463A (en) * 1974-12-10 1976-08-24 Owens-Illinois, Inc. Apparatus for fusion bonding tubular recuperator structures
US4175940A (en) * 1978-06-19 1979-11-27 American Optical Corporation Method for making fiber optics fused arrays with improved blemish quality

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2130195B (en) * 1982-11-12 1987-02-18 English Electric Valve Co Ltd Embedding a plurality of electrical conductors in glass
WO2012158845A2 (en) * 2011-05-16 2012-11-22 Lawrence Livermore National Security, Llc Method of fabricating high-density hermetic electrical feedthroughs using insulated wire bundles

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2189340A (en) * 1938-03-31 1940-02-06 Rca Corp Mosaic electrode manufacture
US2197753A (en) * 1936-06-16 1940-04-23 Liebmann Gerhard Multiple grid structure and method of producing the same
US2619438A (en) * 1945-04-16 1952-11-25 Sperry Corp Method of making a grid structure
US2752731A (en) * 1953-01-06 1956-07-03 Dominion Textile Co Ltd Method of making glass filters

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2197753A (en) * 1936-06-16 1940-04-23 Liebmann Gerhard Multiple grid structure and method of producing the same
US2189340A (en) * 1938-03-31 1940-02-06 Rca Corp Mosaic electrode manufacture
US2619438A (en) * 1945-04-16 1952-11-25 Sperry Corp Method of making a grid structure
US2752731A (en) * 1953-01-06 1956-07-03 Dominion Textile Co Ltd Method of making glass filters

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3241934A (en) * 1961-03-20 1966-03-22 American Optical Corp Method for making electron image transfer device
US3240987A (en) * 1961-08-28 1966-03-15 Mosaic Fabrications Inc Metal and glass fiber structures and electrical devices using same
US3453710A (en) * 1966-06-07 1969-07-08 Stromberg Carlson Corp Method of manufacturing pin faceplate
US3607197A (en) * 1967-11-10 1971-09-21 Barr & Stroud Ltd Manufacture of fiber optic stacks
US3893215A (en) * 1973-07-18 1975-07-08 Bendix Corp Method of manufacturing face plates with large number of conducting paths from one face to the other
US3976463A (en) * 1974-12-10 1976-08-24 Owens-Illinois, Inc. Apparatus for fusion bonding tubular recuperator structures
US4175940A (en) * 1978-06-19 1979-11-27 American Optical Corporation Method for making fiber optics fused arrays with improved blemish quality

Also Published As

Publication number Publication date
CH391119A (fr) 1965-04-30
NL130061C (en(2012))
GB1005311A (en) 1965-09-22
NL268953A (en(2012))
BE608597A (fr) 1962-03-27

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