US3125654A - Electrical contacting surfaces - Google Patents

Electrical contacting surfaces Download PDF

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Publication number
US3125654A
US3125654A US3125654DA US3125654A US 3125654 A US3125654 A US 3125654A US 3125654D A US3125654D A US 3125654DA US 3125654 A US3125654 A US 3125654A
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United States
Prior art keywords
layer
substrate
tin
metal
copper
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English (en)
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/0201—Materials for reed contacts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/929—Electrical contact feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/938—Vapor deposition or gas diffusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12701—Pb-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Definitions

  • FIG. 1 is a front elevational view of an apparatus suitable for use in producing a film of metal by vacuum evaporation in accordance with the present invention
  • FIG. 2 is a front elevational view, partly in section, of a switching element including contacting surfaces in accordance with this invention.
  • FIG. 1 there is shown an apparatus suitable for depositing metal films by vacuum evaporation techniques.
  • the figure depicts a vacuum chamber 11 containing filament 12 and platform 13 which latter is employed as a positioning support for substrate 14.
  • Mask 15 is utilized as shown to restrict the deposition of the film to the desired area.
  • the ends of filament 12 are connected to electrical leads 16 to permit flow of current therethrough from a source not shown.
  • FIG. 2 there is shown a practical application of the novel structure described herein.
  • the figure shows a typical relay spring having deposited thereon electrical contacts comprising copper and tin.
  • contacts 22 which consist essentially of outer tin layer 23 and an inner copper layer 24, each layer having been deposited by vacuum evaporation techniques.
  • the present invention contemplates the use of a substrate upon which the contacting surface is to be deposited.
  • the substrate should he possessed of a smooth surface which is completely free from sharp changes in contours and which is able to withstand temperatures as high as 300-400 C., since such temperatures are often obtained during deposition techniques.
  • temperatures as high as 300-400 C., since such temperatures are often obtained during deposition techniques.
  • a wide range of materials is suitable as substrates, steel being preferred for such purposes.
  • Vacuum evaporation is generally conducted at extremely low pressures (see Vacuum Deposition of Thin ing through the filament.
  • Substrate 14 is first rigorously cleaned.
  • Conventional cleaning agents are suitable, the choice of a particular one being dependent upon the composition of the substrate itself. For example, where the substrate consists of copper, an acid cleaning is required to remove oxide films.
  • Substrate 14 is placed upon platform 13, as shown in FIG. 1, and mask 15 is then suitably positioned.
  • Platform 13 and mask 15 may be fabricated from any refractory material. However, it may be convenient to use a metal, such as aluminum, for such purposes. To obtain a sharply defined deposit it is necessary to have mask 15 bearing against substrate 14 under externally applied pressure.
  • the usual method of heating the metal to be evaporated is to position it in or in proximity to a filament which may be heated electrically. This is conveniently accomplished by using a tungsten filament in the shape of a coil as shown in FIG. 1 and placing the metal to be evaporated within the coil. The required temperature is obtained by controlling the magnitude of the current flow- Alternatively, a filament of the metal to be evaporated may be used in those instances where the metal has a sufficiently high vapor pressure at temperatures below its melting point.
  • Vacuum chamber 11 is evacuated to the prescribed pressure and a current is passed through tungsten filament 12 which becomes heated, thereby causing the metal, not
  • the minimum thickness of the layer deposited on the substrate i.e., the gold, copper, lead or bismuth layer, is of the order of Angstroms. There is no maximum limit on this thickness, although little advantage is gained by the increase above 2000 Angstroms.
  • the coated substrate is again coated by vacuum evaporation techniques with a thin film of essentially pure tin.
  • the considerations discussed above with respect to the thickness of the underlying layer also apply to the tin film.
  • EXAMPLE I This example describes the preparation of switching contacts by vacuum evaporation of tin on steel substrates. For comparative purposes whisker growth studies Were made by depositing film on glass substrates.
  • a vacuum deposition apparatus similar to that shown in FIG. 1 was used to deposit tin coatings, the filament being composed of tungsten.
  • the substrates were cleansed by soaking in hot water containing a wetting agent, such as Tergitol Anionic 08 followed by a rinse in running hot water.
  • the substrates were next drained, dried and mounted on platform 13 approximately centimeters from the source and mask 15 placed atop the substrate.
  • a suitable length of wire of the metal to be deposited was then placed within the tungsten filament and the vacuum chamber evacuated to a pressure of the order of IX 10* millimeters of Hg. Current was caused to flow through the tungsten filament, heating it to incandesccnce and thereby heating the metal wire and causing it to evaporate. The wire was completely evaporated and layers of the desired thickness were produced on the exposed portions of the substrate. Where underlying layers were deposited the procedure was repeated with tin.
  • the finished contacts were next exposed in the presence of phenol fiber at 95 F. and 30 or 95 percent relative humidity for the purpose of whisker study.
  • phenol fiber is considered as an accelerator of whisker growth it is not essential in making such studies.
  • the results of the whisker study are set forth in Table I below.
  • whiskerstudies were made by vacuum deposition of a 1000 Angstroms thick underlay on glass substrates and a 500 Angstroms thick outer layer of tin. After heating at 185 C. for two hours and aging for one year the specimens were examined. The results are set forth below in Table II and indicate that copper, gold, lead and bismuth are suitable for the desired purposes.
  • An electrical contacting surface including successively a substrate, a first layer'in intimate contact with said substrate comprising a thin film of one metal selected from the group consisting of gold, lead, copper and hismuth, and a second layer consisting essentially of tin,
  • said second layer being in intimate contact with said first layer.
  • a switching element including a pair of cooperating make-and-break contacts, at least one of said contacts comprising a contacting surface including successively a substrate, a first layer in intimate contact with said substrate comprising a thin film of one metal selected from the group consisting of gold, lead, copper and bismuth, and a second layer'consisting essentially of tin, said second layer being in intimate contact with said first layer.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Contacts (AREA)
  • Manufacture Of Switches (AREA)
US3125654D 1961-10-31 Electrical contacting surfaces Expired - Lifetime US3125654A (en)

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US14909661A 1961-10-31 1961-10-31

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US3125654A true US3125654A (en) 1964-03-17

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US3125654D Expired - Lifetime US3125654A (en) 1961-10-31 Electrical contacting surfaces

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US (1) US3125654A (US20020051482A1-20020502-M00012.png)
BE (1) BE623487A (US20020051482A1-20020502-M00012.png)
DE (1) DE1180466B (US20020051482A1-20020502-M00012.png)
GB (1) GB1009455A (US20020051482A1-20020502-M00012.png)
NL (1) NL284029A (US20020051482A1-20020502-M00012.png)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3251121A (en) * 1962-08-07 1966-05-17 Bell Telephone Labor Inc Method of making reed-type switch contacts
US3450534A (en) * 1966-04-01 1969-06-17 Gen Electric Tin-lead-tin layer arrangement to improve adherence of photoresist and substrate
US3518390A (en) * 1967-07-21 1970-06-30 Nippon Electric Co Multilayer electric contacts
US3845543A (en) * 1972-03-17 1974-11-05 Sprecher & Schuh Ag Method of producing a vacuum switch contact
US9211851B2 (en) 2012-08-16 2015-12-15 GM Global Technology Operations LLC Method for eliminating electrical short circuits

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1517702A (en) * 1974-09-19 1978-07-12 Fujitsu Ltd Electrical contact
US4790674A (en) * 1987-07-01 1988-12-13 Printronix, Inc. Impact printer having wear-resistant platings on hammer springs and pole piece tips
US5563563A (en) * 1995-12-04 1996-10-08 Ford Motor Company Solenoid with an improved contact design and a system utilizing the solenoid

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2177288A (en) * 1937-11-26 1939-10-24 Chicago Telephone Supply Co Switch terminal construction
US2469878A (en) * 1945-06-23 1949-05-10 Gen Electric Switch contact

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2177288A (en) * 1937-11-26 1939-10-24 Chicago Telephone Supply Co Switch terminal construction
US2469878A (en) * 1945-06-23 1949-05-10 Gen Electric Switch contact

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3251121A (en) * 1962-08-07 1966-05-17 Bell Telephone Labor Inc Method of making reed-type switch contacts
US3450534A (en) * 1966-04-01 1969-06-17 Gen Electric Tin-lead-tin layer arrangement to improve adherence of photoresist and substrate
US3518390A (en) * 1967-07-21 1970-06-30 Nippon Electric Co Multilayer electric contacts
US3845543A (en) * 1972-03-17 1974-11-05 Sprecher & Schuh Ag Method of producing a vacuum switch contact
US9211851B2 (en) 2012-08-16 2015-12-15 GM Global Technology Operations LLC Method for eliminating electrical short circuits

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Publication number Publication date
DE1180466B (de) 1964-10-29
BE623487A (US20020051482A1-20020502-M00012.png)
GB1009455A (en) 1965-11-10
NL284029A (US20020051482A1-20020502-M00012.png)

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