US3051555A - Crucible for melting silicon of highest purity and method of making it - Google Patents

Crucible for melting silicon of highest purity and method of making it Download PDF

Info

Publication number
US3051555A
US3051555A US721895A US72189558A US3051555A US 3051555 A US3051555 A US 3051555A US 721895 A US721895 A US 721895A US 72189558 A US72189558 A US 72189558A US 3051555 A US3051555 A US 3051555A
Authority
US
United States
Prior art keywords
crucible
melt
melting
silicon
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US721895A
Inventor
Rummel Theodor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Original Assignee
Siemens and Halske AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG filed Critical Siemens and Halske AG
Application granted granted Critical
Publication of US3051555A publication Critical patent/US3051555A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • H05B6/22Furnaces without an endless core
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/02Silicon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B9/00General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
    • C22B9/003General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals by induction
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B9/00General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
    • C22B9/16Remelting metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/08Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal halides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/10Crucibles or containers for supporting the melt
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B35/00Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
    • C30B35/002Crucibles or containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/90Apparatus characterized by composition or treatment thereof, e.g. surface finish, surface coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1024Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1032Seed pulling
    • Y10T117/1068Seed pulling including heating or cooling details [e.g., shield configuration]

Definitions

  • the object of the invention is to provide a'crucible suitable for melting silicon of highest purity which completely excludes the danger of contamination resulting from the crucible material.
  • This crucible may always be used when a method is employed for the heating of the melt in which the required heat is not transmitted to the melt by conduction of the crucible wall but in the melt itself, by radiation or by high frequency energy.
  • the crucible according to the invention is primarily intended for the melting of silicon of highest purity; however, it may with sensible modification also be used for melting other highly pure semiconductor material.
  • a crucible made of thermally well conductive material with a melting point lying under that of the melt.
  • the cruciblebody is to'be lined on the inside thereof with a layer or coating of purest silicon (or other semiconductor material to be melted), so thick, and the crucible body is to be exteriorly cooled by means of a cooling agent to such an extent, that the temperature in the material of the crucible and the coating will be under the melting temperature of the coating material and of the material of the crucible body.
  • the crucible body is made of a material of good thermal conductivity, for example, a metal such as copper.
  • the cooling agent acting through the wall of the crucible body therefore, can effectively protect the silicon coating on the interior surface against the action of the molten material. It is most favorable if the crucible body is surrounded with a jacket preferably of the same material, spaced therefrom, with a stationary or circulating cooling agent, for example, water, contained in the intermediate space formed therebetween.
  • FIG. 1 shows an embodiment of a crucible according to the invention
  • FIG. 2 represents a crucible body comprising an induction coil sealed with insulating material of silicon disposed between the individual windings thereof; and- FIGS. 3a and 3b show two views of another embodiment.
  • numeral 11 indicates the copper crucible body provided with a copper jacket connected therewith, numeral 12 indicating the coating or lining of highly pure silicon, 13 indicating the melt in the crucible and 14 indicating a cooling agent.
  • the circulation of the cooling agent or liquid may be controlled, if desired, by means such as a wall 15.
  • the material 13 is heated in known manner, for example, by an electrical gas discharge or by a heat radiator or an electron beam, in a vacuum or in a suitable gas atmosphere, for example, argon, hydrogen, helium, and brought to melting condition.
  • High frequency energy is preferably used for the heating of the material.
  • the metallic crucible body and silicon coating or lining 12 on the inside thereof remain so cool that the silicon lining is not melted by the molten material 13 and that it does not alloy with the metal of the crucible body. It is, therefore, advisable to supervise the temperature of the crucible during the operation. This may be effected by a thermo couple which may be disposed in a bore of the crucible body. The melting point of the silicon is far higher than that of the copper; care must be taken to avoid heating the crucible to the melting point of the copper of which it is made.
  • the crucible body may, in accordance with a feature of the invention, be combined with the required conduction coil.
  • a crucible for melting silicon of highest purity and meeting this requirement is shown in FIG. 2.
  • the corresponding crucible comprises an induction coil having windings 21 wound to form the crucible body.
  • the individual turns or windings may be sealed by means of an insulating material 22, preferably silicon, disposed therebetween.
  • the crucible body thus produced is coated or lined on the inside with a layer 23 of silicon of highest purity, at least throughout portions thereof which will be contacted by the melt 24.
  • the induction coil is suitably Wound from a copper tubing through which is circulated a cooling medium.
  • Material to be melted is introduced into the crucible and the coil is in known manner connected with a suitable high frequency source adapted to deliver sufiicient energy.
  • the dimensions of the copper tubing and of the coil body formed thereby, and the thickness of the silicon coating 23 are correlated with or matched to the temperature of the cooling medium circulating through the tubing, so that the cooling compensates the Joul heat developed inside the crucible body while the fusing of the melt to the silicon layer 23 or melting thereof to the copper tubing is avoided.
  • the insulating material 22 may even be omitted.
  • the surface tension of the melt jointly with the effect of the ponderomotoric forces produced by the field, will prevent flowing off of the melt. If it is, however, desired to seal the windings of the coil body with silicon, such can be done by briefly submerging it in molten silicon. The resulting crucible body after cooling,
  • FIG. 3b is a section along the plane of slot 33 and FIG. 3a is a section perpendicular to such plane.
  • the energy concentrator comprises a cylindrical cop per body 31 provided with means forming a concentric basin 32 for receiving the material to be processed. It is important to provide the crucible body 31 which is made of metal, that is, of a good conductive material, with a longitudinal slot 33 extending preferably to the axis A, so as to prevent formation of an annular shunt for the igh frequency energy, thereby also effecting concentration of the field of the high frequency coil 35 to the inside of the crucible, that is, to the material 36 which is to be processed and melted.
  • This concentrator forms together with the field coil 35,
  • the basin 32 for holding the material 36 is coated with a liner 34 of silicon of highest purity.
  • the body 31 is hollow and adapted to receive a cooling medium which may or may not circulate therethrough. It is not absolutely necessary that the slot 33 and the hole 33 at the bottom of the basin which serves the same purpose as the slot, be sealed, for example, with silicon.
  • the present invention is also concerned with a method of providing on the interior surfaces of the crucible body to be used for melting silicon of highest purity, a coating or liner of purest silicon.
  • the described crucible body is for this purpose introduced into an atmosphere of pure hydrogen and pure silicon halide, such as SiHCl SiCl and heated (to about 900 C.) so as to cause precipitation or deposition of purest silicon, from the gaseous phase, upon the crucible body and particularly upon its inside surfaces thereof. It is thereby particularly suitable to heat the crucible body by the action of high frequency electromagnetic alternating fields.
  • the gas may be held at normal atmospheric pressure of 1 atm.
  • the gas mixture is conducted so as to fiow past the hot crucible body, so as to remove the formed halide-hydrogen from the reaction zone.
  • the silicon separation may, if desired, be effected or supported by an electrical discharge.
  • the pressure of the gas atmosphere is in such a case adjusted so as to ob tain the desired type of discharge.
  • the method of the invention may also be used in making crucibles for the melting of other semiconductor substances, for example, germanium, boron, selenium, etc.
  • other semiconductor substances for example, germanium, boron, selenium, etc.
  • gaseous or volatilizable combinations which decompose in the presence of heat or an electrical discharge, and, if desired, in the presence of a reducing agent such as hydrogen, yielding pure semiconductor material, that may thereupon be processed in a manner analogous to the processing of silicon halides, for the production of semiconductor lining upon the crucible body.
  • a method of producing silicon crystals of highest purity wherein the semiconductor material is melted in a crucible and the crystal obtained by drawing from the melt, comprising the steps of placing the semiconductor material to be melted into a crucible formed of a material which is electrically and thermally of good conductivity, constructed for operation as anelement of an electrical high frequency heating system, lining said crucible on its inside with a highly pure coating, deposited from the gas phase, of the semiconductor material that is to be melted, melting the material to be processed by the action of highfrequency current flowing through the crucible body, the latter being slotted so that the field of the high frequency current is directed into the melt, cooling the crucible during the melting of the processing material to a temperature below the melting temperature of the crucible body and below the temperature of the semiconductor melt, and controlling the cooling to compensate for the foul heat developed inside the crucible body and thereby maintain the semiconductor lining of the crucible in a solidified state and prevent fusing of the melt to the semiconductor lining.
  • a method of producing silicon crystals of highest purity as defined in claim 1, comprising the steps of introducing the crucible body in which such melt is to be formed in a gaseous atmosphere of hydrogen and pure halide of the semiconductor material to be melted, effecting a separation of pure semiconductor material therefrom and deposit of such material upon the inside of said crucible body, withdrawing the crucible from said atmosphere, and introducing the semiconductor material to be processed to form-such melt into said crucible, preparatory to the heatingthereof.
  • a method of producing silicon crystals of highest purity as defined in claim 1, comprising the steps of introducing the crucible body formed from a metal of good electrical and thermal conductivity into a gaseous atmosphere of purest hydrogen and pure halide of the semiconductor material to be melted, subjecting said body in said gaseous atmosphere to the action of an electrical gas discharge deposit from said gaseous atmosphere to deposit purest semiconductor material upon the inside of the crucible body, and introducing the semiconductormaterial to be melted into the crucible preparatory to the heating thereof.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Crucibles And Fluidized-Bed Furnaces (AREA)

Description

T. RUMMEL 3,051,555 CRUCIBLE FOR MELTING SILICON OF HIGHEST PURITY Aug. 28, 1962 T 8 G5 N9 m1 M7 1 F on C D r. 05 umM Ed M 9 ad. NF A Fig. 3b
Fig.3a
mam/@5- Mania/7 T' @0610) W OOOOOIIOOOOOOC...
United States Patent 01 3,051,555 Patented Aug. 28, 1962 ice 3,051,555 CRUCIBLE FOR MELTING SILICON OF HIGHEST PURITY AND METHOD OF MAKING IT Theodor Riimme], Munich, Germany, assignor to Siemens and Halske Aktiengesellschaft Berlin and Munich, a corporation of Germany Filed Mar. 17, 1958, Ser. No. 721,895 Claims priority, application Germany Apr. 15, 1957 3 Claims. (Cl. 23-2235) This invention is concerned with a crucible for melting silicon of highest purity and a method of making it.
Extreme purity of the melt is a basic requirement in the melting of silicon, especially for the production of semiconductor crystals. The use of crucibles introduces the danger of contaminations entering into the melt from the material of the crucible. Socalled crucible-free methods have, therefore, been applied which circumvent this danger. However, these methods call for considerable technical expenditure and it has, accordingly, been the endeavor to construct crucibles which exclude the danger of contamination from the crucible material. Thus, for example, crucibles for melting silicon of highest purity have been tried, made of SiO;, BeO, A1 or made of similar high-melting material indifferent to silicon, such as carbide of titanium or zirconium and the like, or lined on the inside with these materials. However, completely satisfactory results could not be achieved, because these materials always cause contamination of the melt however slight such contamination might be.
The object of the invention is to provide a'crucible suitable for melting silicon of highest purity which completely excludes the danger of contamination resulting from the crucible material. This crucible may always be used when a method is employed for the heating of the melt in which the required heat is not transmitted to the melt by conduction of the crucible wall but in the melt itself, by radiation or by high frequency energy. The crucible according to the invention is primarily intended for the melting of silicon of highest purity; however, it may with sensible modification also be used for melting other highly pure semiconductor material.
It is in accordance with the present invention proposed to use for the melting of highly pure silicon or other semiconductor material, preferably for electrical purposes, for
' example, for rectifiers or transistors, a crucible made of thermally well conductive material with a melting point lying under that of the melt. The cruciblebody is to'be lined on the inside thereof with a layer or coating of purest silicon (or other semiconductor material to be melted), so thick, and the crucible body is to be exteriorly cooled by means of a cooling agent to such an extent, that the temperature in the material of the crucible and the coating will be under the melting temperature of the coating material and of the material of the crucible body.
The crucible body is made of a material of good thermal conductivity, for example, a metal such as copper. The cooling agent acting through the wall of the crucible body, therefore, can effectively protect the silicon coating on the interior surface against the action of the molten material. It is most favorable if the crucible body is surrounded with a jacket preferably of the same material, spaced therefrom, with a stationary or circulating cooling agent, for example, water, contained in the intermediate space formed therebetween.
The various objects and features of the invention will become apparent from the description which will be rendered below with reference to the accompanying drawing. In the drawing,
FIG. 1 shows an embodiment of a crucible according to the invention;
FIG. 2 represents a crucible body comprising an induction coil sealed with insulating material of silicon disposed between the individual windings thereof; and- FIGS. 3a and 3b show two views of another embodiment.
Referring now to FIG. 1, representing an embodiment of a crucible for melting silicon according to the invention, numeral 11 indicates the copper crucible body provided with a copper jacket connected therewith, numeral 12 indicating the coating or lining of highly pure silicon, 13 indicating the melt in the crucible and 14 indicating a cooling agent. The circulation of the cooling agent or liquid may be controlled, if desired, by means such as a wall 15. The material 13 is heated in known manner, for example, by an electrical gas discharge or by a heat radiator or an electron beam, in a vacuum or in a suitable gas atmosphere, for example, argon, hydrogen, helium, and brought to melting condition. High frequency energy is preferably used for the heating of the material. It is in such case, however, necessary to preheat the material to produce therein a sutiicient initial conductivity and to arrange the coil 16, delivering the high frequency electromagnetic energy, in such a manner that the flux delivered thereby can enter into the material without hindrance. The induction coil 16 is for these reasons disposed directly above the surface of the material to be melted.
It is important in this connection that the metallic crucible body and silicon coating or lining 12 on the inside thereof remain so cool that the silicon lining is not melted by the molten material 13 and that it does not alloy with the metal of the crucible body. It is, therefore, advisable to supervise the temperature of the crucible during the operation. This may be effected by a thermo couple which may be disposed in a bore of the crucible body. The melting point of the silicon is far higher than that of the copper; care must be taken to avoid heating the crucible to the melting point of the copper of which it is made.
If the heating of the material is to be effected by high frequency, the crucible body may, in accordance with a feature of the invention, be combined with the required conduction coil. A crucible for melting silicon of highest purity and meeting this requirement is shown in FIG. 2. The corresponding crucible comprises an induction coil having windings 21 wound to form the crucible body. The individual turns or windings may be sealed by means of an insulating material 22, preferably silicon, disposed therebetween. The crucible body thus produced is coated or lined on the inside with a layer 23 of silicon of highest purity, at least throughout portions thereof which will be contacted by the melt 24. The induction coil is suitably Wound from a copper tubing through which is circulated a cooling medium. Material to be melted is introduced into the crucible and the coil is in known manner connected with a suitable high frequency source adapted to deliver sufiicient energy. The dimensions of the copper tubing and of the coil body formed thereby, and the thickness of the silicon coating 23 are correlated with or matched to the temperature of the cooling medium circulating through the tubing, so that the cooling compensates the Joul heat developed inside the crucible body while the fusing of the melt to the silicon layer 23 or melting thereof to the copper tubing is avoided.
It is in the above described embodiment not absolutely necessary that the turns or windings of the coil body are completely sealed elf by the insulating material 22. In case of closely arranged windings, the insulating material 22 may even be omitted. The surface tension of the melt jointly with the effect of the ponderomotoric forces produced by the field, will prevent flowing off of the melt. If it is, however, desired to seal the windings of the coil body with silicon, such can be done by briefly submerging it in molten silicon. The resulting crucible body after cooling,
3 must be provided with the coating or lining 23 of silicon of highest purity.
A variant of a crucible according to the invention may also be obtained by using a socalled energy concentrator, for example, in the form as shown in FlGS. 3a and 3!). FIG. 3b is a section along the plane of slot 33 and FIG. 3a is a section perpendicular to such plane.
The energy concentrator comprises a cylindrical cop per body 31 provided with means forming a concentric basin 32 for receiving the material to be processed. It is important to provide the crucible body 31 which is made of metal, that is, of a good conductive material, with a longitudinal slot 33 extending preferably to the axis A, so as to prevent formation of an annular shunt for the igh frequency energy, thereby also effecting concentration of the field of the high frequency coil 35 to the inside of the crucible, that is, to the material 36 which is to be processed and melted.
This concentrator forms together with the field coil 35,
preferably concentrically surrounding it, and with the material 36 contained in the basin 32 and to be processed, a transformer with close coupling between the field coil 35 and the material 36. The basin 32 for holding the material 36 is coated with a liner 34 of silicon of highest purity. The body 31 is hollow and adapted to receive a cooling medium which may or may not circulate therethrough. It is not absolutely necessary that the slot 33 and the hole 33 at the bottom of the basin which serves the same purpose as the slot, be sealed, for example, with silicon.
The present invention is also concerned with a method of providing on the interior surfaces of the crucible body to be used for melting silicon of highest purity, a coating or liner of purest silicon. The described crucible body is for this purpose introduced into an atmosphere of pure hydrogen and pure silicon halide, such as SiHCl SiCl and heated (to about 900 C.) so as to cause precipitation or deposition of purest silicon, from the gaseous phase, upon the crucible body and particularly upon its inside surfaces thereof. It is thereby particularly suitable to heat the crucible body by the action of high frequency electromagnetic alternating fields. The gas may be held at normal atmospheric pressure of 1 atm. The gas mixture is conducted so as to fiow past the hot crucible body, so as to remove the formed halide-hydrogen from the reaction zone. The silicon separation may, if desired, be effected or supported by an electrical discharge. The pressure of the gas atmosphere is in such a case adjusted so as to ob tain the desired type of discharge.
The method of the invention may also be used in making crucibles for the melting of other semiconductor substances, for example, germanium, boron, selenium, etc. There are in such cases likewise gaseous or volatilizable combinations which decompose in the presence of heat or an electrical discharge, and, if desired, in the presence of a reducing agent such as hydrogen, yielding pure semiconductor material, that may thereupon be processed in a manner analogous to the processing of silicon halides, for the production of semiconductor lining upon the crucible body.
Changes may be made within the scope and spirit of the appended claims.
I claim:
1. A method of producing silicon crystals of highest purity, wherein the semiconductor material is melted in a crucible and the crystal obtained by drawing from the melt, comprising the steps of placing the semiconductor material to be melted into a crucible formed of a material which is electrically and thermally of good conductivity, constructed for operation as anelement of an electrical high frequency heating system, lining said crucible on its inside with a highly pure coating, deposited from the gas phase, of the semiconductor material that is to be melted, melting the material to be processed by the action of highfrequency current flowing through the crucible body, the latter being slotted so that the field of the high frequency current is directed into the melt, cooling the crucible during the melting of the processing material to a temperature below the melting temperature of the crucible body and below the temperature of the semiconductor melt, and controlling the cooling to compensate for the foul heat developed inside the crucible body and thereby maintain the semiconductor lining of the crucible in a solidified state and prevent fusing of the melt to the semiconductor lining.
2. A method of producing silicon crystals of highest purity as defined in claim 1, comprising the steps of introducing the crucible body in which such melt is to be formed in a gaseous atmosphere of hydrogen and pure halide of the semiconductor material to be melted, effecting a separation of pure semiconductor material therefrom and deposit of such material upon the inside of said crucible body, withdrawing the crucible from said atmosphere, and introducing the semiconductor material to be processed to form-such melt into said crucible, preparatory to the heatingthereof.
3. A method of producing silicon crystals of highest purity as defined in claim 1, comprising the steps of introducing the crucible body formed from a metal of good electrical and thermal conductivity into a gaseous atmosphere of purest hydrogen and pure halide of the semiconductor material to be melted, subjecting said body in said gaseous atmosphere to the action of an electrical gas discharge deposit from said gaseous atmosphere to deposit purest semiconductor material upon the inside of the crucible body, and introducing the semiconductormaterial to be melted into the crucible preparatory to the heating thereof.
References Cited in the file of this patent UNITED STATES PATENTS 589,221 Pacet Aug. 31, 1897 2,354,876 Owens Aug. 1, 1944 2,793,103 Emeis May 21, 1957 2,817,509 Solomon Dec. 24, 1957 2,818,248 Kelsey Dec. 31, 1957 2,836,412 Krieger May 27, 1958 2,858,586 Brennan Nov. 4, 1958 2,872,299 Celmer Feb. 3, 1959 2,941,867 Maurer June 21, 1960 FOREIGN PATENTS 14,020 Great Britain June 15, 1912 OTHER REFERENCES Germany $38055 VI/40d dt. 14 June 1956

Claims (1)

1. A METHOD OF PRODUCTING SILCICON CRYSTALS OF HIGHEST PURITY, WHEREIN THE SEMICONDUCTOR MATERIAL IS MELTED IN A CRUCIBLE AND THE CRYSTAL OBTAINED BY DRAWING FROM THE MELT, CONPRISING THE STEPS OF PLACING THE SEMICONDUCTOR MATERIAL TO BE MELTED INTO A CRUCIBLE FORMED OF A MATERIAL WHICH IS ELECTRICALLY AND THERMALLY OF GOOD CONDUCTIVITY, CONSTRUCTED FOR OPERATION AS AN ELEMENT OF AN ELECTRICAL HIGH FREQUENCY HEATING SYSTEM, LINING SAID CRUCIBLE ON ITS INSIDE WITH HIGHLY PURE COATING, DESPOSITED FROM THE GAS PHASE, OF THE SEMICONDUCTOR MATERIAL THAT IS TO BE MELTED, MELTING THE MATERIAL TO BE PROCESSED BY THE ACTION OF HIGHFREQUENCY CURRENT FLOWING THROUGH THE CRUCIBLE BODY, THE LATTER BEING SLOTTED SO THAT THE FIELD OF THE HIGH FREQUENCY CURRENT IS DIRECTED INTO THE MELT, COOLING THE CRUCIBLE DURING THE MELTING OF THE PROCESSING MATERIAL TO A TEMPERATURE BELOW THE MELTING TEMPERATURE OF THE CRUCIBLE BODY AND BELOW THE TEMPERATURE OF THE SEMICONDUCTOR MELT, AND CONTROLLING THE COOLING TO COMPENSATE FOR THE JOUL HEAT DEVELOPED INSIDE THE CRUCIBLE BODY AND THEREBY MAINTAIN THE SEMICONDUCTOR LINING OF THE CRUCIBLE IN A SOLIDIFIED STATE AND PREVENT FUSSING OF THE MELT TO THE SEMICONDUCTOR LINING.
US721895A 1957-04-15 1958-03-17 Crucible for melting silicon of highest purity and method of making it Expired - Lifetime US3051555A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES53137A DE1159903B (en) 1957-04-15 1957-04-15 Device for melting the purest silicon and other pure semiconductor materials

Publications (1)

Publication Number Publication Date
US3051555A true US3051555A (en) 1962-08-28

Family

ID=7489101

Family Applications (1)

Application Number Title Priority Date Filing Date
US721895A Expired - Lifetime US3051555A (en) 1957-04-15 1958-03-17 Crucible for melting silicon of highest purity and method of making it

Country Status (6)

Country Link
US (1) US3051555A (en)
CH (1) CH365545A (en)
DE (1) DE1159903B (en)
FR (1) FR1203822A (en)
GB (1) GB840135A (en)
NL (2) NL112552C (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3404966A (en) * 1964-09-04 1968-10-08 Northeru Electric Company Ltd Melting a ferrous ion containing ferrimagnetic oxide in a ferric ion crucible
US3433602A (en) * 1966-01-29 1969-03-18 Sharp Kk Method for growing single crystals
US3437734A (en) * 1966-06-21 1969-04-08 Isofilm Intern Apparatus and method for effecting the restructuring of materials
US3911994A (en) * 1974-11-08 1975-10-14 Reynolds Metals Co Utilization of silicon fines in casting
US4123229A (en) * 1976-05-07 1978-10-31 John S. Pennish Method and apparatus for making vitreous silica
US4224100A (en) * 1978-06-16 1980-09-23 Litton Systems, Inc. Method and apparatus for making crystals
US4382838A (en) * 1975-02-28 1983-05-10 Wacker-Chemie Gmbh Novel silicon crystals and process for their preparation
US4390379A (en) * 1981-06-25 1983-06-28 Western Electric Company, Inc. Elimination of edge growth in liquid phase epitaxy
US4412502A (en) * 1981-06-25 1983-11-01 Western Electric Co., Inc. Apparatus for the elimination of edge growth in liquid phase epitaxy
US6385230B1 (en) 2001-03-14 2002-05-07 Floswerve Manage Company Homogeneous electrode of a reactive metal alloy for vacuum arc remelting and a method for making the same from a plurality of induction melted charges
US9982334B2 (en) * 2012-02-01 2018-05-29 Jx Nippon Mining & Metals Corporation Polycrystalline silicon sputtering target

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1492063A (en) * 1966-04-05 1967-08-18 Commissariat Energie Atomique Further development of high frequency electric furnaces for the continuous production of electro-cast refractories
JPH04331792A (en) * 1991-04-30 1992-11-19 Osaka Titanium Co Ltd Production of silicon single crystal
US6126742A (en) * 1996-09-20 2000-10-03 Forshungszentrum Karlsruhe Gmbh Method of drawing single crystals
DE19638563C2 (en) * 1996-09-20 1999-07-08 Karlsruhe Forschzent Method of pulling single crystals

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE38055C (en) * J. H. CAMPBELL in New-York, V. St. A Absorption steam engine
GB191214020A (en) * 1911-06-26
US589221A (en) * 1897-08-31 Paul emile placet
US2354876A (en) * 1941-05-20 1944-08-01 Owens Calvin Arthur Method of treating cementitious objects
US2793103A (en) * 1954-02-24 1957-05-21 Siemens Ag Method for producing rod-shaped bodies of crystalline material
US2817509A (en) * 1954-08-19 1957-12-24 Electro Refractories & Abrasiv Lined crucibles
US2818248A (en) * 1955-09-12 1957-12-31 Paul S Kelsey Refractory block and ladle lining construction
US2836412A (en) * 1955-08-22 1958-05-27 Titanium Metals Corp Arc melting crucible
US2858586A (en) * 1954-01-28 1958-11-04 Joseph B Brennan Smelting apparatus and method
US2872299A (en) * 1954-11-30 1959-02-03 Rca Corp Preparation of reactive materials in a molten non-reactive lined crucible
US2941867A (en) * 1957-10-14 1960-06-21 Du Pont Reduction of metal halides

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE903266C (en) * 1941-04-05 1954-02-04 Aeg Electric induction furnace for melting magnesium and its alloys
BE528916A (en) * 1953-05-18

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE38055C (en) * J. H. CAMPBELL in New-York, V. St. A Absorption steam engine
US589221A (en) * 1897-08-31 Paul emile placet
GB191214020A (en) * 1911-06-26
US2354876A (en) * 1941-05-20 1944-08-01 Owens Calvin Arthur Method of treating cementitious objects
US2858586A (en) * 1954-01-28 1958-11-04 Joseph B Brennan Smelting apparatus and method
US2793103A (en) * 1954-02-24 1957-05-21 Siemens Ag Method for producing rod-shaped bodies of crystalline material
US2817509A (en) * 1954-08-19 1957-12-24 Electro Refractories & Abrasiv Lined crucibles
US2872299A (en) * 1954-11-30 1959-02-03 Rca Corp Preparation of reactive materials in a molten non-reactive lined crucible
US2836412A (en) * 1955-08-22 1958-05-27 Titanium Metals Corp Arc melting crucible
US2818248A (en) * 1955-09-12 1957-12-31 Paul S Kelsey Refractory block and ladle lining construction
US2941867A (en) * 1957-10-14 1960-06-21 Du Pont Reduction of metal halides

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3404966A (en) * 1964-09-04 1968-10-08 Northeru Electric Company Ltd Melting a ferrous ion containing ferrimagnetic oxide in a ferric ion crucible
US3433602A (en) * 1966-01-29 1969-03-18 Sharp Kk Method for growing single crystals
US3437734A (en) * 1966-06-21 1969-04-08 Isofilm Intern Apparatus and method for effecting the restructuring of materials
US3911994A (en) * 1974-11-08 1975-10-14 Reynolds Metals Co Utilization of silicon fines in casting
US4382838A (en) * 1975-02-28 1983-05-10 Wacker-Chemie Gmbh Novel silicon crystals and process for their preparation
US4123229A (en) * 1976-05-07 1978-10-31 John S. Pennish Method and apparatus for making vitreous silica
US4224100A (en) * 1978-06-16 1980-09-23 Litton Systems, Inc. Method and apparatus for making crystals
US4390379A (en) * 1981-06-25 1983-06-28 Western Electric Company, Inc. Elimination of edge growth in liquid phase epitaxy
US4412502A (en) * 1981-06-25 1983-11-01 Western Electric Co., Inc. Apparatus for the elimination of edge growth in liquid phase epitaxy
US6385230B1 (en) 2001-03-14 2002-05-07 Floswerve Manage Company Homogeneous electrode of a reactive metal alloy for vacuum arc remelting and a method for making the same from a plurality of induction melted charges
US9982334B2 (en) * 2012-02-01 2018-05-29 Jx Nippon Mining & Metals Corporation Polycrystalline silicon sputtering target

Also Published As

Publication number Publication date
GB840135A (en) 1960-07-06
NL226823A (en) 1900-01-01
CH365545A (en) 1962-11-15
FR1203822A (en) 1960-01-21
NL112552C (en) 1900-01-01
DE1159903B (en) 1963-12-27

Similar Documents

Publication Publication Date Title
US3051555A (en) Crucible for melting silicon of highest purity and method of making it
US3265469A (en) Crystal growing apparatus
US3146123A (en) Method for producing pure silicon
US2686212A (en) Electric heating apparatus
US3157541A (en) Precipitating highly pure compact silicon carbide upon carriers
GB590458A (en) Improvements in or relating to the treatment of silicon
US2972525A (en) Crucible-free zone melting method and apparatus for producing and processing a rod-shaped body of crystalline substance, particularly semiconductor substance
US3258314A (en) Method for interior zone melting of a crystalline rod
EP0308658B1 (en) Apparatus and method for evaporating metallic films
JPH0412083A (en) Production of silicon single crystal
CA2476855C (en) Method and device for coating a substrate
US3492969A (en) Apparatus for indiffusing impurity in semiconductor members
CA1240482A (en) Silicon melting and evaporation method and apparatus for high purity applications
EP0095298A1 (en) Casting
US3351433A (en) Method of producing monocrystalline semiconductor rods
Fan et al. Zone‐melting recrystallization of 3‐in.‐diam Si films on SiO2‐coated Si substrates
US3100250A (en) Zone melting apparatus
US2985519A (en) Production of silicon
GB870408A (en) Treatment of silicon
JPH0317771B2 (en)
US3505025A (en) Jacketed,cooled crucible for crystallizing material
US3039071A (en) Electrical resistance-type heater
US3296036A (en) Apparatus and method of producing semiconductor rods by pulling the same from a melt
US3549353A (en) Method and apparatus for melting reactive materials
JP3203341B2 (en) Semiconductor single crystal rod manufacturing equipment