US3002481A - Electrical component mounting device - Google Patents

Electrical component mounting device Download PDF

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Publication number
US3002481A
US3002481A US511864A US51186455A US3002481A US 3002481 A US3002481 A US 3002481A US 511864 A US511864 A US 511864A US 51186455 A US51186455 A US 51186455A US 3002481 A US3002481 A US 3002481A
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Prior art keywords
eyelet
solder
electrical component
lead
electrical
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Expired - Lifetime
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US511864A
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Eugene W Hutters
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Raytheon Co
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Hughes Aircraft Co
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Definitions

  • This invention relates to devices for mounting electrical components, and particularly to devices for aflixing electrical components to mechanically assembled cir- Accordingly, it is an object of this invention to provide an improved device for mounting electrical components in a circuit board, which device provides a more uniform and reliable structure than the devices of the prior art. It is another object of this invention to provide an improved device, cheaper but at'the same time more reliable than devicesof 'the prior art, for aflixing electrical components to small mechanically assembled wiring boards'whichare useable in wide temperature extremes.
  • an electrical component may be aflixed to a mechanically fabricated circuit board, such as a printed circuit board, by the use of an eyelet made entirely of a solder or of a solder-like material.
  • the eyelet having one flanged end, may be placed in the aperture defined by a conductive circuit pad on the circuit board.
  • the unflanged end of the eye let may then be turned outwardly to restrain the eyelet against the circuit pad.
  • the lead from an electrical component may be entered within the eyelet, and the entire assembly dipped in a solder bath.
  • the resultant structure provides a firm mechanical and uniform electrical coupling between the lead of the electrical component and the conductive circuit pad.
  • FIG. 1 is a plan view of a solder eyelet arrangement which may be employed in practicing the invention
  • FIG. 2 is a side sectional view of the solder eyelet arrangement of FIG. 1, taken along the line 2-2 of FIG. 1 and looking in the direction of the appended arrows;
  • FIG. 3A is a sectional view showing a step in a process practiced in accordance with this invention.
  • FIG. 3B is a section view of another step in the proc-
  • FIG. 3C is a sectional view of still another step in the process.
  • FIG. 4 is a side elevation of an assembly, in accordance with the invention, before dip-soldering.
  • a third step, the insertion of the lead 26 of an I 2 practicing the invention may employ an eyelet 10 made of solder, a solder-like material, or some other conductive material having the property of melting or fusing at a relativelylow temperature.
  • a relatively low temperature means a temperature at which a dip solder process may be carried out without heat damage to the elements of an electrical assembly.
  • the eyelet 10 may. comprise a central cylindrical portion 12 having an opening through which the lead of an electrical component may be placed.
  • One end, here'termed the head portion 14, of the eyelet 10 may be provided with a flange extending outwardlyfrom and normal to the central portion 12.
  • end of theeyelet 10 may be'provided an internal rim 16 defining an opening of smaller diameter than the opening of the central por- 7 tion 12.
  • the inner rim portion 16 is hereafter referred to as the base portion of the eyelet 10.
  • the eyelet 10 maybe constructed, for example, of a composition consisting of approximately 22% tin and'78% lead. If desired, the composition employed may be varied in accordance with well known The manner inwhich the solder eyelet llllmay be employed in aflixingan electrical component'24. to a circuit board 20 is shown. in successivesteps inFIGS. 3A, 3B and 3C.'i -.Assho,wn in FIG. 3A, a circuit board 20 of nonconductivewor dielectric material may be provided with a circuit ,pad22 about the surfacesdefining an aperture in thecircuit board 20.
  • the 'circuit pad 22 may be of conductivematerial and form part of an etched wiring or other printed circuit type electrical component 24 having an external lead 26 is to be mechanically and electrically coupled by its lead 26 to the circuit pad 22.
  • a solder eyelet 10 of suitable dimensions to register with the aperture defined by the circuit pad 22 may be inserted into the circuit board 20, as shown in FIG. 3A.
  • the base portion 16 of the solder eyelet 10 is flanged outwardly, to crimp the eyelet 10 against the circuit pad 22.
  • the flanging of the base portion 16 may be accomplished by restraining the head portion 14 against motion and forcibly inserting an anvil (not shown) or otherwise expanding the base portion 16 outwardly.
  • the base portion 16 is then flattened against the circuit pad 22 to provide a. flange like the flanged head portion 14. The presence of a recess in the base portion 16, as shown in FIG.
  • the electrical component 24 may be held fixed vw'th respect to the circuit board 20, the circuit pad 22, and the eyelet 10, by a sponge rubber sheet (not shown) or other backing Patented Oct. a, 1961 of the solder eyelet.
  • f base portion 16 may of assembly.
  • solder eyelet and additional solder from the dipping process form a fillet 10' between the lead 26 and the circuit pad 22.
  • the eyelet does, not become molten but does flow. After immersion, the eyelet may have the shape shown by the broken lines 11 in the fillet 10.
  • Solder from the bath forms tangential surfaces with the lead 26 and the circuit pad 22.
  • the fillet 10' provides extensive areas of contact with both the lead 26 and the circuit pad 22. Thus a good mechanical coupling and a good electrical coupling result from the same structure. It will be understood that the sizes and shapes shown are illustrative only, and not to scale.
  • solder 22% tin and 78% lead
  • the solder dip is made for only 2 /2 to 3 seconds at 450 to 460 F.
  • the dimensions of the parts are such that the solder eyelets may have a height and head portion diameter of only ,4 of an inch each.
  • the assembly resulting from the process thus undertaken and the structure thus provided is smooth externally, due to melting of the external solder. Internally, however, the solder is fused to the component lead and to the circuit pad. The fusion greatly increases the strength of the assembly. Note also that the use of a solder eyelet decreases the number of joints employed in the assembly. With brass eyelets formerly used, bonding between different types of metals greatly increased the probabilities of faulty construction. Note also that the boards need be dipped for considerably less time than with constructions in prior use, so that much less heat is applied to the circuit board, the wiring structure, and the electrical components.
  • An eyelet member for printed circuit board assemblies comprising a unitary member consisting of approximately 22% tin and approximately 78% lead whereby to enable low temperature melting thereof, and having a cylindrical central portion with a central aperture therein, a flanged head portion at one end of said central portion and comprising a flange of predetermined thickness extending outwardly from and normal to said central portion, and an inner rim base portion at the other end of said central portion, said base portion having a radial thickness approximately equal to that of the thickness of said flange and an aperture therein coaxial with and of a diameter less than said central aperture.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

Oct. 3, 1961 E. w. HUTTERS 3,002,481
ELECTRICAL COMPONENT MOUNTING DEVICE Filed May 31, 1955 k I l 1 444M701. imam 5 M5077: JV
United States Patent l s 002 481 ELECTRICAL coMl oism il r MOUNTINCahf (isslgglivlfiE Eugene W. Butters, anta onica, or o Hughes'Aircraft Company, Culver cit poration of Delaware Filed May 31, 1955, Ser. No. 511,864
1 Claim. ,(Cl. 113-110 g This invention relates to devices for mounting electrical components, and particularly to devices for aflixing electrical components to mechanically assembled cir- Accordingly, it is an object of this invention to provide an improved device for mounting electrical components in a circuit board, which device provides a more uniform and reliable structure than the devices of the prior art. It is another object of this invention to provide an improved device, cheaper but at'the same time more reliable than devicesof 'the prior art, for aflixing electrical components to small mechanically assembled wiring boards'whichare useable in wide temperature extremes.
It is another object of this invention to provide an improved eyelet member for use with printed circuit boards, which eyelet member facilitates rapid, inexpensive, and
uniform fabrication of electrical assemblies.
In accordance with the invention, an electrical component may be aflixed to a mechanically fabricated circuit board, such as a printed circuit board, by the use of an eyelet made entirely of a solder or of a solder-like material. The eyelet, having one flanged end, may be placed in the aperture defined by a conductive circuit pad on the circuit board. The unflanged end of the eye let may then be turned outwardly to restrain the eyelet against the circuit pad. The lead from an electrical component may be entered within the eyelet, and the entire assembly dipped in a solder bath. The resultant structure provides a firm mechanical and uniform electrical coupling between the lead of the electrical component and the conductive circuit pad.
The novel features of the invention, as well as the invention itself, both as to its organization and method of operation, will best be understood in the light of the following description, taken together with the accompanying drawing, in which like reference numerals refer to like parts and in which:
FIG. 1 is a plan view of a solder eyelet arrangement which may be employed in practicing the invention;
FIG. 2 is a side sectional view of the solder eyelet arrangement of FIG. 1, taken along the line 2-2 of FIG. 1 and looking in the direction of the appended arrows;
FIG. 3A is a sectional view showing a step in a process practiced in accordance with this invention;
FIG. 3B is a section view of another step in the proc- FIG. 3C is a sectional view of still another step in the process; and
FIG. 4 is a side elevation of an assembly, in accordance with the invention, before dip-soldering.
Referring now to FIGS. 1 and 2, an arrangement for Callfl, a cor 16 provides tions. A third step, the insertion of the lead 26 of an I 2 practicing the invention may employ an eyelet 10 made of solder, a solder-like material, or some other conductive material having the property of melting or fusing at a relativelylow temperature. A relatively low temperature, asused here, means a temperature at which a dip solder process may be carried out without heat damage to the elements of an electrical assembly. The eyelet 10 may. comprise a central cylindrical portion 12 having an opening through which the lead of an electrical component may be placed. One end, here'termed the head portion 14, of the eyelet 10 may be provided with a flange extending outwardlyfrom and normal to the central portion 12. At the opposite, end of theeyelet 10 may be'provided an internal rim 16 defining an opening of smaller diameter than the opening of the central por- 7 tion 12., The inner rim portion 16 is hereafter referred to as the base portion of the eyelet 10.
=In practice, the eyelet 10 maybe constructed, for example, of a composition consisting of approximately 22% tin and'78% lead. If desired, the composition employed may be varied in accordance with well known The manner inwhich the solder eyelet llllmay be employed in aflixingan electrical component'24. to a circuit board 20 is shown. in successivesteps inFIGS. 3A, 3B and 3C.'i -.Assho,wn in FIG. 3A, a circuit board 20 of nonconductivewor dielectric material may be provided with a circuit ,pad22 about the surfacesdefining an aperture in thecircuit board 20. The 'circuit pad 22 may be of conductivematerial and form part of an etched wiring or other printed circuit type electrical component 24 having an external lead 26 is to be mechanically and electrically coupled by its lead 26 to the circuit pad 22.
As a first step in the process a solder eyelet 10 of suitable dimensions to register with the aperture defined by the circuit pad 22 may be inserted into the circuit board 20, as shown in FIG. 3A. As the second step in the process, the base portion 16 of the solder eyelet 10 is flanged outwardly, to crimp the eyelet 10 against the circuit pad 22. The flanging of the base portion 16 may be accomplished by restraining the head portion 14 against motion and forcibly inserting an anvil (not shown) or otherwise expanding the base portion 16 outwardly. The base portion 16 is then flattened against the circuit pad 22 to provide a. flange like the flanged head portion 14. The presence of a recess in the base portion 16, as shown in FIG. 3B, is the result of the shape of a particular anvil used for the purpose of upsetting the eyelet. Obviously, any type or shape of anvil may be employed without departing from the spirit and scope of the invention. The use of cross sections of like thickness in the head portion 14 and base portion approximate symmetry between these porelectrical component 24 into the central opening of the solder eyelet ,10, is then undertaken. The result, an assembly such as shown in FIG. 4 and in FIG. 3B, is therefore ready for a dip soldering process.
In preparation for a dip solder treatment, the electrical component 24 may be held fixed vw'th respect to the circuit board 20, the circuit pad 22, and the eyelet 10, by a sponge rubber sheet (not shown) or other backing Patented Oct. a, 1961 of the solder eyelet. f base portion 16 may of assembly. A n
material. After a fourth step, consisting of immersion in a solder bath, a completed assembly is provided as.
shown in FIG. 3C. The solder eyelet and additional solder from the dipping process form a fillet 10' between the lead 26 and the circuit pad 22. The eyelet does, not become molten but does flow. After immersion, the eyelet may have the shape shown by the broken lines 11 in the fillet 10. Solder from the bath forms tangential surfaces with the lead 26 and the circuit pad 22. As shown, the fillet 10' provides extensive areas of contact with both the lead 26 and the circuit pad 22. Thus a good mechanical coupling and a good electrical coupling result from the same structure. It will be understood that the sizes and shapes shown are illustrative only, and not to scale.
As an illustration of a combination which may be employed in following this process, the following values are given. The given composition of solder (22% tin and 78% lead) is completely molten at approximately 525 F. The solder dip is made for only 2 /2 to 3 seconds at 450 to 460 F. The dimensions of the parts are such that the solder eyelets may have a height and head portion diameter of only ,4 of an inch each.
The assembly resulting from the process thus undertaken and the structure thus provided is smooth externally, due to melting of the external solder. Internally, however, the solder is fused to the component lead and to the circuit pad. The fusion greatly increases the strength of the assembly. Note also that the use of a solder eyelet decreases the number of joints employed in the assembly. With brass eyelets formerly used, bonding between different types of metals greatly increased the probabilities of faulty construction. Note also that the boards need be dipped for considerably less time than with constructions in prior use, so that much less heat is applied to the circuit board, the wiring structure, and the electrical components.
Thus there has been described a simple, inexpensive method and structure for mounting electrical components in circuit boards. A uniform structure of good mechanical and electrical characteristics is provided although the parts employed may be very small. Because of the strength and reliability of the structure, it may be employed, with temperature extremes of wide variation.
What is claimed is:
An eyelet member for printed circuit board assemblies comprising a unitary member consisting of approximately 22% tin and approximately 78% lead whereby to enable low temperature melting thereof, and having a cylindrical central portion with a central aperture therein, a flanged head portion at one end of said central portion and comprising a flange of predetermined thickness extending outwardly from and normal to said central portion, and an inner rim base portion at the other end of said central portion, said base portion having a radial thickness approximately equal to that of the thickness of said flange and an aperture therein coaxial with and of a diameter less than said central aperture.
References Cited in the file of this patent UNITED STATES PATENTS 364,664 Norton June 14, 1887 1,121,641 Lounsbury Dec. 22, 1914 1,493,076 Hughes May 6, 1924 1,702,234 Goodridge Feb. 12, 1929 1,783,642 Ferguson et al. Dec. 2, 1930 2,244,009 Hiensch et al June. 3, 1941 2,270,166 Hiensch et al. Jan. 13, 1942 2,332,261 Rohrbach Oct. 19, 1943 2,438,075 Smith Mar. 16, 1948 2,474,988 Sargrove July 5, 1949 2,587,568 Eisler Feb. 26, 1952 2,593,479 Nieter Apr. 22, 1952 2,641,748 Peters June 9, 1953 2,671,264 Pessel Mar. 9, 1954 2,680,824 Beggs June 8, 1954 2,756,485 Abrahamson et al. July 13, 1956 2,774,052 Flour Dec. 11, 1956 Welding Handbook, page 516, 3rd ed., copyright 1950,.
Am. Welding Soc., 33 W. 39th St., New York 18, NY.
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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056195A (en) * 1959-06-04 1962-10-02 Western Gold And Platinum Comp Method of brazing
US3122679A (en) * 1959-10-05 1964-02-25 Hubert H Hoeltje Jr Transistor mounting pad
US3157733A (en) * 1962-05-11 1964-11-17 Masi Ernest F M De Electric circuit panel for components
US3213325A (en) * 1962-10-05 1965-10-19 Litton Prec Products Inc Weldable terminal
US3221388A (en) * 1962-11-16 1965-12-07 Vitramon Inc Method of making a stacked capacitor
US3280378A (en) * 1964-07-01 1966-10-18 Cts Corp Means for anchoring and connecting lead wires in an electrical component
US3346774A (en) * 1965-07-30 1967-10-10 Cts Corp Electrical component substrate with cavities for anchoring lead wires therein
US3673680A (en) * 1970-12-14 1972-07-04 California Computer Products Method of circuit board with solder coated pattern
US3744129A (en) * 1972-02-09 1973-07-10 Rogers Corp Method of forming a bus bar
US3849870A (en) * 1971-06-15 1974-11-26 Amp Inc Method of fabricating selectively applied flowable solder joints
US3932934A (en) * 1974-09-16 1976-01-20 Amp Incorporated Method of connecting terminal posts of a connector to a circuit board
US4592137A (en) * 1982-11-27 1986-06-03 Matsushita Electric Industrial Co., Ltd. Method of circuit connection across both surfaces of substrate
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US7478003B2 (en) 1999-08-09 2009-01-13 Cowan Peter C Revenue meter bayonet assembly and method of attachment
US20100090680A1 (en) * 2008-10-10 2010-04-15 Electro Industries/Gauge Tech. Intelligent electronic device having a terminal assembly for coupling to a meter mounting socket
US9897461B2 (en) 2015-02-27 2018-02-20 Electro Industries/Gauge Tech Intelligent electronic device with expandable functionality
US10048088B2 (en) 2015-02-27 2018-08-14 Electro Industries/Gauge Tech Wireless intelligent electronic device
US11009922B2 (en) 2015-02-27 2021-05-18 Electro Industries/Gaugetech Wireless intelligent electronic device

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Publication number Priority date Publication date Assignee Title
US364664A (en) * 1887-06-14 Edwin noeton
US1121641A (en) * 1913-03-17 1914-12-22 Ives D Lounsbury Fastening device.
US1493076A (en) * 1924-05-06 Safety seal fob locks
US1702234A (en) * 1925-10-06 1929-02-12 Bead Chain Mfg Co Method of wiring contact pins
US1783642A (en) * 1928-11-02 1930-12-02 Westinghouse Lamp Co Automatic soldering machine
US2244009A (en) * 1938-09-02 1941-06-03 Philips Nv Electrical apparatus
US2270166A (en) * 1938-09-02 1942-01-13 Rca Corp Method of making electrical connections
US2332261A (en) * 1941-08-30 1943-10-19 Shuron Optical Co Inc Method for securing lenses in ophthalmic mountings
US2438075A (en) * 1945-02-09 1948-03-16 Newell R Smith Contact pin and method of making the same
US2474988A (en) * 1943-08-30 1949-07-05 Sargrove John Adolph Method of manufacturing electrical network circuits
US2587568A (en) * 1943-02-02 1952-02-26 Hermoplast Ltd Manufacture of electric circuit components
US2593479A (en) * 1948-07-07 1952-04-22 Motorola Inc Electrical apparatus using metalized circuits and components therefor
US2641748A (en) * 1949-05-10 1953-06-09 Cinch Mfg Corp Soldering lug
US2671264A (en) * 1952-05-24 1954-03-09 Rca Corp Method of soldering printed circuits
US2680824A (en) * 1950-08-16 1954-06-08 Gen Electric Electric discharge device
US2756485A (en) * 1950-08-28 1956-07-31 Abramson Moe Process of assembling electrical circuits
US2774052A (en) * 1951-04-06 1956-12-11 Stewart Warner Corp Mechanical assembly of electronic circuit components

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1493076A (en) * 1924-05-06 Safety seal fob locks
US364664A (en) * 1887-06-14 Edwin noeton
US1121641A (en) * 1913-03-17 1914-12-22 Ives D Lounsbury Fastening device.
US1702234A (en) * 1925-10-06 1929-02-12 Bead Chain Mfg Co Method of wiring contact pins
US1783642A (en) * 1928-11-02 1930-12-02 Westinghouse Lamp Co Automatic soldering machine
US2244009A (en) * 1938-09-02 1941-06-03 Philips Nv Electrical apparatus
US2270166A (en) * 1938-09-02 1942-01-13 Rca Corp Method of making electrical connections
US2332261A (en) * 1941-08-30 1943-10-19 Shuron Optical Co Inc Method for securing lenses in ophthalmic mountings
US2587568A (en) * 1943-02-02 1952-02-26 Hermoplast Ltd Manufacture of electric circuit components
US2474988A (en) * 1943-08-30 1949-07-05 Sargrove John Adolph Method of manufacturing electrical network circuits
US2438075A (en) * 1945-02-09 1948-03-16 Newell R Smith Contact pin and method of making the same
US2593479A (en) * 1948-07-07 1952-04-22 Motorola Inc Electrical apparatus using metalized circuits and components therefor
US2641748A (en) * 1949-05-10 1953-06-09 Cinch Mfg Corp Soldering lug
US2680824A (en) * 1950-08-16 1954-06-08 Gen Electric Electric discharge device
US2756485A (en) * 1950-08-28 1956-07-31 Abramson Moe Process of assembling electrical circuits
US2774052A (en) * 1951-04-06 1956-12-11 Stewart Warner Corp Mechanical assembly of electronic circuit components
US2671264A (en) * 1952-05-24 1954-03-09 Rca Corp Method of soldering printed circuits

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056195A (en) * 1959-06-04 1962-10-02 Western Gold And Platinum Comp Method of brazing
US3122679A (en) * 1959-10-05 1964-02-25 Hubert H Hoeltje Jr Transistor mounting pad
US3157733A (en) * 1962-05-11 1964-11-17 Masi Ernest F M De Electric circuit panel for components
US3213325A (en) * 1962-10-05 1965-10-19 Litton Prec Products Inc Weldable terminal
US3221388A (en) * 1962-11-16 1965-12-07 Vitramon Inc Method of making a stacked capacitor
US3280378A (en) * 1964-07-01 1966-10-18 Cts Corp Means for anchoring and connecting lead wires in an electrical component
US3346774A (en) * 1965-07-30 1967-10-10 Cts Corp Electrical component substrate with cavities for anchoring lead wires therein
US3673680A (en) * 1970-12-14 1972-07-04 California Computer Products Method of circuit board with solder coated pattern
US3849870A (en) * 1971-06-15 1974-11-26 Amp Inc Method of fabricating selectively applied flowable solder joints
US3744129A (en) * 1972-02-09 1973-07-10 Rogers Corp Method of forming a bus bar
US3932934A (en) * 1974-09-16 1976-01-20 Amp Incorporated Method of connecting terminal posts of a connector to a circuit board
US4592137A (en) * 1982-11-27 1986-06-03 Matsushita Electric Industrial Co., Ltd. Method of circuit connection across both surfaces of substrate
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US7478003B2 (en) 1999-08-09 2009-01-13 Cowan Peter C Revenue meter bayonet assembly and method of attachment
US20100090680A1 (en) * 2008-10-10 2010-04-15 Electro Industries/Gauge Tech. Intelligent electronic device having a terminal assembly for coupling to a meter mounting socket
US8717007B2 (en) 2008-10-10 2014-05-06 Electro Industries/Gauge Tech Intelligent electronic device having a terminal assembly for coupling to a meter mounting socket
US9897461B2 (en) 2015-02-27 2018-02-20 Electro Industries/Gauge Tech Intelligent electronic device with expandable functionality
US10048088B2 (en) 2015-02-27 2018-08-14 Electro Industries/Gauge Tech Wireless intelligent electronic device
US10274340B2 (en) 2015-02-27 2019-04-30 Electro Industries/Gauge Tech Intelligent electronic device with expandable functionality
US10739162B2 (en) 2015-02-27 2020-08-11 Electro Industries/Gauge Tech Intelligent electronic device with surge supression
US11009922B2 (en) 2015-02-27 2021-05-18 Electro Industries/Gaugetech Wireless intelligent electronic device
US11641052B2 (en) 2015-02-27 2023-05-02 El Electronics Llc Wireless intelligent electronic device
US11644341B2 (en) 2015-02-27 2023-05-09 El Electronics Llc Intelligent electronic device with hot swappable battery
US12087998B2 (en) 2015-02-27 2024-09-10 Ei Electronics Llc Wireless intelligent electronic device

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