US2876400A - Composite electrodes for directional crystal devices - Google Patents
Composite electrodes for directional crystal devices Download PDFInfo
- Publication number
- US2876400A US2876400A US407196A US40719654A US2876400A US 2876400 A US2876400 A US 2876400A US 407196 A US407196 A US 407196A US 40719654 A US40719654 A US 40719654A US 2876400 A US2876400 A US 2876400A
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- Prior art keywords
- electrode
- core
- crystal
- coating
- electrodes
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- Expired - Lifetime
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- 239000013078 crystal Substances 0.000 title claims description 25
- 239000002131 composite material Substances 0.000 title description 14
- 238000000576 coating method Methods 0.000 claims description 26
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 24
- 229910052697 platinum Inorganic materials 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 5
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 239000010948 rhodium Substances 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052790 beryllium Inorganic materials 0.000 claims description 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 239000011162 core material Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 12
- 229910000906 Bronze Inorganic materials 0.000 description 10
- 239000010974 bronze Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12729—Group IIA metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12778—Alternative base metals from diverse categories
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/12917—Next to Fe-base component
Definitions
- This invention is concerned with composite electrodes for directional devices comprising semi-conductors, for example, transistors and the like.
- Composite electrodes for the purpose and of the type noted above are generally known. It is likewise known to form on such electrodes preferably point-shaped or knife-edge contacts of a hard core which is provided with a coating of another generally softer material, the latter being more suitable than the core material to form electrical contact engagement with a semi-conductor crystal.
- a known electrode may, for example comprise a tungsten wire plated with platinum.
- the drawback of such structure is that it is impossible to provide upon tungsten a sufliciently uniform platinum coating and that it is consequently impossible to produce such electrodes with the required uniformity in the course of customary mass production processes.
- electrodes of the previously indicated type which comprise at least two different materials, for example, a core or carrier and a coating, are made of metals from the first, fourth, fifth and/or eight groups of the periodic table of elements.
- a hard material as for example niobium, tantalum, iron or alloys of such materials, for example, hard bronze of the type of phosphor-beryllium-bronze or the like may be used primarily for the core of the electrode; and for the coating may be used primarily materials of high output capacity, for example, rhodium, palladium, iridium, also platinum or, under some circumstances alloys of these materials.
- the selection of the material for the surface coating will depend upon whether the electrode is to be employedas a collector or an emitter.
- Fig. 1 shows a germanium crystal coacting with a single point contact electrode
- Fig. 2 illustrates a transistor comprising a germanium crystal coacting with two point contact electrodes.
- numeral 1 indicates the germanium crystal.
- a point electrode comprising a wire 2 of phosphorberyllium-bronze provided with a platinum coating 3.
- the electrode is produced by providing upon the bronze wire, for example, in an alkaline ammonia phosphorous platinum bath of platinum coating in galvanic manner.
- Fig. 2 shows a transistor comprising a germanium crystal 4 coacting with two point contact electrodes 5 2,876,400 Patented Mar. 3, 1.959
- the electrode 5 is made like the electrode of Fig. 1, comprising a bronze core with a platinum coating 3.
- the other electrode 6 comprises a steel core '7 covered by a copper coating 8.
- the coatings may be applied or provided in different manner than galvanic, for example, by vaporization, by cathode vaporization, or in mechanical manner, for example, by spraying or rolling. Burning such as is usually applied in the production of mirrors, ceramics, etc., is recommended for mass production.
- a transistor comprising a crystal, in electrode in point contact with said crystal, said electrode including a core and a coating surrounding said core, said core formed from one or more metals of the group consisting of niobium, tantalum, iron, copper, tin, zinc, phosphorous, beryllium and alloys of the aforesaid metals, said coating formed from one or more metals of the group consisting of rhodium, palladium, iridium, platinum and alloys of the aforesaid metals, and said coating of said electrode in point contact with said crystal.
- a transistor according to'claim 1 wherein said core of the electrode comprises a hard bronze of the type of phosphor-beryllium-bronze.
- a transistor comprising a crystal, at least two electrodes in point contact with said crystal, p-n layer provided in said crystal between the electrodes, one of said electrodes comprising a phosphor-betyllium-bronze core and a platinum coating, the other of said electrodes comprising a steel core and a copper coating, and said coatings of said electrodes in point contact with said crystal.
- a composite electrode for a directional crystal device said electrode provided with a point at one end for point contact with a crystal and comprising a core and a coating surrounding said core, said core formed from one or more materials of the group consisting of tantalum, phosphor-beryllium-bronze and steel, said coating formed from one or more materials of the group consisting of the elements of group eight of the periodic table of elements and consisting of rhodium, palladium, iridium and platinum.
- a composite electrode for a directional crystal device said electrode formed with a point at one end for point contact with a crystal and comprising a steel core and a copper coating surrounding said core.
- a composite electrode for use as a collector comprising a core and a coating surrounding said core, said core formed from one or more materials of the group consisting of tantalum, phosphor-berylliumbronze and steel, and said coating comprising one or more materials of the group consisting of copper and tin.
- a semi-conductor device of the transistor type including a directional crystal, a composite electrode for point contact with said directional crystal, said composite electrode comprising a phosphor beryllium-bronze coreand a platinum coating surrounding saidcore, and
Description
March 3, 1959 P. GUNTHER ET AL COMPOSITE ELECTRODES FOR DIRECTIONAL CRYSTAL DEVICES Filed Feb. 1, 1954 Paul G22 E022 g y S 6 0 m5 %r ne United States Patent O COMPOSITE ELECTRODES FOR DIRECTIONAL CRYSTAL DEVICES Paul Giinther and Franz Kerkhoif, Munich, Germany, assignors to Siemens & Halske Aktiengesellschaft, Munich, Germany, a corporation of Germany Application February 1, 1954, Serial No. 407,196
Claims priority, application Germany February 27, 1953 11 Claims. (Cl. 317235) This invention is concerned with composite electrodes for directional devices comprising semi-conductors, for example, transistors and the like.
Composite electrodes for the purpose and of the type noted above are generally known. It is likewise known to form on such electrodes preferably point-shaped or knife-edge contacts of a hard core which is provided with a coating of another generally softer material, the latter being more suitable than the core material to form electrical contact engagement with a semi-conductor crystal. Such a known electrode may, for example comprise a tungsten wire plated with platinum. The drawback of such structure is that it is impossible to provide upon tungsten a sufliciently uniform platinum coating and that it is consequently impossible to produce such electrodes with the required uniformity in the course of customary mass production processes.
It has been found by research lying in back of the invention that the above mentioned drawbacks can be avoided by using other particular materials. In accordance with the invention, electrodes of the previously indicated type which comprise at least two different materials, for example, a core or carrier and a coating, are made of metals from the first, fourth, fifth and/or eight groups of the periodic table of elements. More specifically a hard material as for example niobium, tantalum, iron or alloys of such materials, for example, hard bronze of the type of phosphor-beryllium-bronze or the like may be used primarily for the core of the electrode; and for the coating may be used primarily materials of high output capacity, for example, rhodium, palladium, iridium, also platinum or, under some circumstances alloys of these materials. In the case of using in a transistor a plurality of electrodes, for example, two or three electrodes, the selection of the material for the surface coating will depend upon whether the electrode is to be employedas a collector or an emitter.
The invention will now be described with reference to the accompanying drawings showing in diagrammatic representation examples thereof. In these drawings,
Fig. 1 shows a germanium crystal coacting with a single point contact electrode; and
Fig. 2 illustrates a transistor comprising a germanium crystal coacting with two point contact electrodes.
In Fig. 1, numeral 1 indicates the germanium crystal. In contact engagement with the surface of the crystal is a point electrode comprising a wire 2 of phosphorberyllium-bronze provided with a platinum coating 3. The electrode is produced by providing upon the bronze wire, for example, in an alkaline ammonia phosphorous platinum bath of platinum coating in galvanic manner.
Fig. 2 shows a transistor comprising a germanium crystal 4 coacting with two point contact electrodes 5 2,876,400 Patented Mar. 3, 1.959
ice.
2 and 6.- Bet'ween the electrodes, a p-n layer is provided in a known manner. The electrode 5 is made like the electrode of Fig. 1, comprising a bronze core with a platinum coating 3. The other electrode 6 comprises a steel core '7 covered by a copper coating 8.
The coatings may be applied or provided in different manner than galvanic, for example, by vaporization, by cathode vaporization, or in mechanical manner, for example, by spraying or rolling. Burning such as is usually applied in the production of mirrors, ceramics, etc., is recommended for mass production.
What is believed to be new and desired to have protected is defined in the appended claims.
We claim:
1. A transistor comprising a crystal, in electrode in point contact with said crystal, said electrode including a core and a coating surrounding said core, said core formed from one or more metals of the group consisting of niobium, tantalum, iron, copper, tin, zinc, phosphorous, beryllium and alloys of the aforesaid metals, said coating formed from one or more metals of the group consisting of rhodium, palladium, iridium, platinum and alloys of the aforesaid metals, and said coating of said electrode in point contact with said crystal.
2. A transistor according to'claim 1, wherein said core of the electrode comprises a hard bronze of the type of phosphor-beryllium-bronze.
3. A transistor according to claim 1, wherein said core of the electrode is formed of a hard bronze of the type of phosphor-beryllium-bronze, and said coating is formed of platinum.
4. A transistor comprising a crystal, at least two electrodes in point contact with said crystal, p-n layer provided in said crystal between the electrodes, one of said electrodes comprising a phosphor-betyllium-bronze core and a platinum coating, the other of said electrodes comprising a steel core and a copper coating, and said coatings of said electrodes in point contact with said crystal.
5. A composite electrode for a directional crystal device, said electrode provided with a point at one end for point contact with a crystal and comprising a core and a coating surrounding said core, said core formed from one or more materials of the group consisting of tantalum, phosphor-beryllium-bronze and steel, said coating formed from one or more materials of the group consisting of the elements of group eight of the periodic table of elements and consisting of rhodium, palladium, iridium and platinum.
6. A composite electrode according to claim 5, wherein said composite electrode may be used in a diode.
7. A composite electrode according to claim 5, wherein said composite electrode may be used as an emitter in a transistor.
' 8. A composite electrode for a directional crystal device said electrode formed with a point at one end for point contact with a crystal and comprising a steel core and a copper coating surrounding said core.
9. A composite electrode for use as a collector, said electrode comprising a core and a coating surrounding said core, said core formed from one or more materials of the group consisting of tantalum, phosphor-berylliumbronze and steel, and said coating comprising one or more materials of the group consisting of copper and tin.
10. A semi-conductor device of the transistor type including a directional crystal, a composite electrode for point contact with said directional crystal, said composite electrode comprising a phosphor beryllium-bronze coreand a platinum coating surrounding saidcore, and
References Cited in the file of this patent UNITED STATES PATENTS Taylor May 5, 1942 Ohl June 25, 1946 Eitel Mar. 18, 1947 Woodyard Nov. 14, 1950 Beck Sept 25, 1951 Carrnan et a1. Dec. 31, 1957
Claims (1)
1. A TRANSISTOR COMPRISING A CRYSTAL, IN ELECTRODE IN POINT CONTACT WITH SAID CRYSTAL, SAID ELECTRODE INCLUDING A CORE AND A COATING SURROUNDING SAID CORE, SAID CORE FORMED FROM ONE OR MORE METALS OF THE GROUP CONSISTING OF NIOBIUM, TANTALUM, IRON, COPPER, TIN, ZINC, PHOSPHOROUS, BERYLLIUM AND ALLOYS OF THE AFORESAID METALS, SAID COATING FORMED FROM ONE OR MORE METALS OF THE GROUP CONSISTING OF RHODIUM, PALLADIUM, IRIDIUM, PLATINUM AND ALLOYS OF THE AFORESAID METALS, AND SAID COATING OF SAID ELECTRODE IN POINT CONTACT WITH SAID CRYSTAL.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2876400X | 1953-02-27 |
Publications (1)
Publication Number | Publication Date |
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US2876400A true US2876400A (en) | 1959-03-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US407196A Expired - Lifetime US2876400A (en) | 1953-02-27 | 1954-02-01 | Composite electrodes for directional crystal devices |
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US (1) | US2876400A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3355638A (en) * | 1963-08-28 | 1967-11-28 | Siemens Ag | Point-contact diode with au-pt point |
US3657617A (en) * | 1970-07-09 | 1972-04-18 | Alpha Ind Inc | Point contact semiconductor device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2282097A (en) * | 1940-03-29 | 1942-05-05 | Warren G Taylor | Nonemitting electrode structure |
US2402839A (en) * | 1941-03-27 | 1946-06-25 | Bell Telephone Labor Inc | Electrical translating device utilizing silicon |
US2417459A (en) * | 1945-05-21 | 1947-03-18 | Eitel Mccullough Inc | Electron tube and electrode for the same |
US2530110A (en) * | 1944-06-02 | 1950-11-14 | Sperry Corp | Nonlinear circuit device utilizing germanium |
US2568705A (en) * | 1948-11-04 | 1951-09-25 | Int Standard Electric Corp | Nonsputtering cathode for electron discharge devices |
US2818536A (en) * | 1952-08-23 | 1957-12-31 | Hughes Aircraft Co | Point contact semiconductor devices and methods of making same |
-
1954
- 1954-02-01 US US407196A patent/US2876400A/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2282097A (en) * | 1940-03-29 | 1942-05-05 | Warren G Taylor | Nonemitting electrode structure |
US2402839A (en) * | 1941-03-27 | 1946-06-25 | Bell Telephone Labor Inc | Electrical translating device utilizing silicon |
US2530110A (en) * | 1944-06-02 | 1950-11-14 | Sperry Corp | Nonlinear circuit device utilizing germanium |
US2417459A (en) * | 1945-05-21 | 1947-03-18 | Eitel Mccullough Inc | Electron tube and electrode for the same |
US2568705A (en) * | 1948-11-04 | 1951-09-25 | Int Standard Electric Corp | Nonsputtering cathode for electron discharge devices |
US2818536A (en) * | 1952-08-23 | 1957-12-31 | Hughes Aircraft Co | Point contact semiconductor devices and methods of making same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3355638A (en) * | 1963-08-28 | 1967-11-28 | Siemens Ag | Point-contact diode with au-pt point |
US3657617A (en) * | 1970-07-09 | 1972-04-18 | Alpha Ind Inc | Point contact semiconductor device |
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