US2834724A - Method of electroplating plastic articles - Google Patents
Method of electroplating plastic articles Download PDFInfo
- Publication number
- US2834724A US2834724A US580964A US58096456A US2834724A US 2834724 A US2834724 A US 2834724A US 580964 A US580964 A US 580964A US 58096456 A US58096456 A US 58096456A US 2834724 A US2834724 A US 2834724A
- Authority
- US
- United States
- Prior art keywords
- gold
- coating
- copper
- plastic
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 39
- 239000004033 plastic Substances 0.000 title claims description 38
- 229920003023 plastic Polymers 0.000 title claims description 38
- 238000009713 electroplating Methods 0.000 title description 9
- 238000000576 coating method Methods 0.000 claims description 38
- 239000011248 coating agent Substances 0.000 claims description 37
- 229910052787 antimony Inorganic materials 0.000 claims description 14
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 14
- 229910052785 arsenic Inorganic materials 0.000 claims description 10
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 10
- 238000004070 electrodeposition Methods 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 description 53
- 239000010931 gold Substances 0.000 description 53
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 38
- 229910052802 copper Inorganic materials 0.000 description 38
- 239000010949 copper Substances 0.000 description 38
- 229910052751 metal Inorganic materials 0.000 description 27
- 239000002184 metal Substances 0.000 description 27
- 238000007747 plating Methods 0.000 description 25
- 229910052797 bismuth Inorganic materials 0.000 description 19
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 19
- 239000010408 film Substances 0.000 description 18
- 239000000243 solution Substances 0.000 description 17
- 229910000510 noble metal Inorganic materials 0.000 description 12
- 150000002739 metals Chemical class 0.000 description 11
- -1 gold ions Chemical class 0.000 description 8
- 239000002991 molded plastic Substances 0.000 description 8
- 238000000151 deposition Methods 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 150000002343 gold Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002199 base oil Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Description
METHOD OF ELECTROPLATING PLASTIC ARTICLES Abraham Piza Mendes, New York, N. Y.
No Drawing. Application April 26, 1956 Serial No. 580,964
6 Claims. (Cl. 204-20) My invention relates to the metal plating of non-metab lic substances and has particular relation to the plating of plastic objects with gold or other precious metal utilizing a vapor-vacuum plating procedure as an intermediate step.
The use of a vapor vacuum chamber for the coating of molded plastic articles with such metals as aluminum or the like is well known and commonly employed in the manufacture of inexpensive novelties, etc. Such process deposits 21 very fine film of metal on the molded plastic, giving the coated article the appearance of being made of solid metal. With conventional methods of plastic molding it is possible to incorporate line and ornate detail of surface configuration in the molded plastic article, and the thin film of metal deposited by the vapor-vacuum method of plating, retains this fine detail.
It is also well-known to apply gold plating to metals by the conventional electrolytic or gold salts dip methods. Such plating is widely used in the manufacture of costume jewelry, for example, to coat a cast base of copper or bronze with gold. It has been found that fine and ornate surface details cannot be achieved in the case of the metal base, and what detail there may be is appreciably lost when the gold plating is applied.
Because of the ability of plastics such as polystyrene to retain fine surface detail in molding, it would be extremely desirable to plate molded plastic articles with precious metals such as gold for the manufacture of costume jewelry or the like. Up to the present time, there has been no method found, to my knowledge, of plating molded plastic articles directly with gold, because gold will not adhere to plastics nor form thereon by conventional gold-plating methods. The deposition of gold or other precious metals by the vapor-vacuum or sputtering methods is of course impractical commercially because of the tremendous Waste of precious materials by this method.
I have found that gold can be deposited on an article of plastic or other non-conductor of electricity, by first coating the article, as by the vapor-vacuum process, with a metal close to gold in the electromotive series. Gold is placed below hydrogen in the electromotive series and has a positive potential in normal metal ion solution; the metal to be applied by the vapor vacuum process must, have a positive potential and it must also be capable of adhering to the surface of the plastic during the deposition of gold.
It is well known that in gold plating, copper alfords an excellent plating surface because of its ability to release metallic gold from the plating solution and to provide a surface to which the gold will adhere. Copper is therefore widely used both in electroplating and in gold solution dipping without electricity. It was found, however, that when a molded, plastic article was .coated with a thin film of copper by the vapor-vacuum method, and then dipped in the gold solution, the copper peeled otf without being replaced by gold. This was the result,
atent ice whether or not current was applied. When current was applied, wide variations in voltage made little difference. The tendency of metallic copper to go into solution, replacing gold ions in that solution, is greater than the adhesion of the metallic copper to the surface with which it is in contact, even when the tendency to go into solution is opposed by an electric current of such direction that it moves metallic (positive) ions to that surface. Furthermore, it was apparent that the copper film was so thin that, having partially replaced the gold ions, there was not sutficient metallic copper remaining to enable the gold ions to lose their charges and become a molecular plating. The gold ions will not lose their charges in contact with the plastic.
Antimony and bismuth which have positive electric potentials on the electromotive table, were tried as base coats upon which to plate gold and have proved satisfactory. These metals were applied to the surface of a polystyrene article by the vapor-vacuum method, and a coating of gold was then applied thereupon by electroplating. The antimony and bismuth fihns adhered to the surface of the plastic article throughout the electroplat ing process and also adhered well to the plated gold coating. Gold can be deposited on these metals, however, only by electroplating. Since arsenic is grouped with antimony and bismuth in the electromotive series and has similar physical properties, it also could presumably be used, if adequate precautions be taken to prevent the formation of compounds deleterious to health.
I have found that the deposition of gold is more rapid, and a coating of better appearance is produced if by the same vapor-vacuum procedure, a coating of copper is applied over the above-stated materials. Conventional electrolytic methods may then be used for the deposition of gold thereon, but the voltage used is preferably lower than that conventionally employed, since high voltages tend to tear or otherwise damage the thin metal films deposited by the vapor-vacuum process.
A film of copper deposited by vapor vacuum over a thin film of metal close to gold in the electromotive series may be used to obtain a coating of gold thereon by any of the conventional methods such as dip, salt bath, tumbling," etc. In these methods, the gold ions in solution partially replace the copper film, since no electric current is applied.
By this procedure, the base coating of metal acts as a bond between the coating of copper and the surface of the plastic article, preventing the copper film from peeling off in the gold solution. At the same time, the base coating acts as a metal surface to enable the gold ions to lose their charges. The gold ions will not lose their charges in contact with the plastic surface.
Other metals were used experimentally for the base coating, but proved unsatisfactory. Lead was used, for example, producing good films on the molded plastic articles. Copper was then deposited on the lead base coating by the same vacuum procedure, forming a fine film coating which retained the surface configuration of the molded plastic. When the coated plastic articles were then placed in a gold plating bath, however, the results were unsatisfactory. Adhesion of the lead to the plastic was insufficient, and copper was removed into the gold solution without being replaced by gold. In the conventional electroplating method, the copper film began to show plated gold at 1% volts, but loosened and began to peel from the plastic within ten to fifteen seconds.
Similar unsatisfactory results were achieved using tin and aluminum in place of lead.
Thus the only metals which appear to serve adequately Patented May 13, 1958 series, namely antimony, bismuth, and arsenic. These metals, in common with copper and the noble metals (gold, silver and platinum); all have positive potentials in contact with solutions in which the metal ion .is normal. The metals, antimony, bismuth and. arsenic are directly above copper in the electromotive series, and are relaely'cl'ose to gold. These metals, therefore, will not react with the. copper film whendipped' in the gold.
solution, so that adhesion to both plastic and copper is maintained, and the coatings do not peel or loosen. In addition, arsenic,.antimony and bismuth have low melting points, so that they may be readily vaporized in the vacuum chamber, and in addition are commercially available and inexpensive.
When arsenic, antimony, or bismuth is used to provide the base coating on the plastic by the vapor vacuum method, it forms a fine adherent film. on the surface of the plastic. Copper is then plated over the base coat by the vapor-vacuum method, forming a film which bonds strongly to the base coat and completely covers the base coating. Since copper is used as the intermediate coat, a final gold plating may then be applied either by-the conventional dip. method or by conventional electroplating methods. In the, dip method, the gold ions replace the outer surface of the copper film and then plate the remainder of the copper film before the latter has gone completely into solution. The metal of the base coatadheres to the remainder of the copper film and prevents it from loosening or peeling.
In Principles of Electroplating and Electroforming by Blum and Hogaboom, published in 1924, the electromoh've series is set forth at page 344. In this series the approximate single potentials of metals toward solutions with normal metal ion concentration, and with a standard based on the normal hydrogen electrode as zero, are listed. The potential of antimony is given as 0.19 volt, arsenic as 0.32 volt, bismuth as 0.33 volt, and copper as 0.34 volt. The metals suitable for use as a base coat on the plastic article thus have positive potentials, but less than 034 volt, the potential of copper. From the potentials given, it would be apparent that bismuth would yield better plating results than antimony, and tests have shown this to be true, although satisfactory results were achieved with both bismuth and antimony.
The following is an example of a specific plating procedure in which optimum results were, achieved:
The plastic form was made of polystyrene and was first cleaned using a commercial: plastic cleaner; The surface of the plastic was then covered with a lacquer compounded to be compatible therewith. Such a lacquer is presently commercially available for vacuum coating withv aluminum, and. provides better adhesion to the plastic as well as scaling in vapor producing agents such as residual plasticizcr.
The metal -for producing the base coat was then applied to the plastic. For this purpose, the plastic article was placed in a vacuum chamber, and pure bismuth contained in a molybdenum crucible was also placed in the chamber. The crucible was heated to a dull red. by the passage of an electric current therethrough. As the bismuth vaporized, a good film was formed on the plastic article, under a vacuum of approximately one-half micron.
A coating of copper was then formed over the bismuth film by the same vacuum chamber procedure just described, except that the vacuum employed to volatilize the copper was approximately micron, and the molybdenum crucible was heated to white heat.
The coated article was then placed in a commercial electrolyte solution of gold salts, and a voltage of 1.5 to 2.0 volts applied to the electrodes. A plating of gold adhered to the copper film with the bismuth film asa base. The gold plate was suflicientl'y adherent to withstand polishing with silver polish.
A plastic article with a base coat of bismuth and a second coat of copper (applied by the vapor vacuum method) was also plated with gold by the conventional salt water process. The article was placed in a porous cup containing a solution of gold salts. The porous cup was placed in a larger vessel containing a solution of sodium chloride and a strip of zinc was suspended in the sodium chloride solution. Gold is then deposited on the article which becomes. the cathode of a cell of which the anode was the zinc strip.
While the invention has been: described heretofore in termsof achieving a gold plating, it applies equally to a plating of any noble metal, namely silver, platinum or gold. In addition to polystyrene, articles made of other rigid plastics, such as acrylic resins, may be plated by the methods described herein.
What is claimed is:
1. A method of coating a plastic article with. a noble metal, which comprises the steps of forming, onsaid plastic article in a vapor vacuum chamber a thin film base oil a metal selected from the group consisting. of antimony, bismuth and arsenic, and then coating said article with thev noble metal, by electrodeposition.
2. A method according to claim 1 in which said noble metal is gold.
3. A method of coating a non-porous plastic article with an outer plating of a noble metal, which comprises the steps of vapor depositing on said plastic article a thin film base coating of metal selected from a group consisting of arsenic, antimony and bismuth, then vapor depositiing over said base coating an adhering thin film coating of copper, and finally plating the copper coating with a coating of noble metal by electrodeposition.
4. A method according to claim 3 in which the noble metal is gold.
5.. A method of coating a molded non-porous plastic article with an outer ornamental plating of a noble metal, which comprises the steps of forming on said plastic article in a vapor-vacuum chamber a thin film base coating of bismuth then forming over said base coating in a vapor-vacuum chamber an adhering thin film coating of copper, and finally plating-the copper coating with a coatingot, gold by electrodeposition, the gold plating adhering to the copper coating.
6. A method of plating a molded plastic article having ornate surface configurations with an adhering outer ornamental coating of a noble metal sufiiciently fine to retain the details of said surface configuration, said method comprising the steps of coating said plastic article by evaporation. with, a fine base coating, of a metal selected from the group consisting of arsenic, antimony, and bismuth, then applying by evaporation an adhering intermediate conductive coating over the base coating. the intermediate coating comprising a thin film of copper, and finally providing the plastic article with a thin outer adhering. coating of the noble metal by elcctrodep-- osition of the noble metal on the intermediate coating.
References Cited in the file of this patent UNITED STATES PATENTS 887,482 Lammers et al May 12, 1908 1,548,432 Belous Aug. 4, 1925 2,133,995 Lukens Oct. 25, 1938 2,333,534 Lang Nov. 2, 1943 2,383,311 Hein Aug. 21, 1945 2,423,476. Billings et a1. July 8,, 1947 2,439,983- Morgan et al. Apr. 20, 1948 2,482,054 Colbert et al. Sept. 13, 1949 2,501,737 Porter Mar. 28, 1950 2,680,699 Rubin June 8, 1954 2,702,259 Sommer Feb. 15, 1955
Claims (1)
1. A METHOD OF COATING A PLASTIC ARTICLE WITH A NOBLE METAL, WHICH COMPRISES THE STPS OF FORMING ON SAID PLASTIC ARTICLE IN A VAPOR VACUUM CHAMBER A THIN FILM BASE OF A METAL SELECTED FROM THE GROUP CONSISTING OF ANTIMONY, BISMUTH AND ARSENIC, AND THEN COATING SAID ARTICLE WITH THE NOBLE METAL BY ELECTRODEPOSITION.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US580964A US2834724A (en) | 1956-04-26 | 1956-04-26 | Method of electroplating plastic articles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US580964A US2834724A (en) | 1956-04-26 | 1956-04-26 | Method of electroplating plastic articles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2834724A true US2834724A (en) | 1958-05-13 |
Family
ID=24323331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US580964A Expired - Lifetime US2834724A (en) | 1956-04-26 | 1956-04-26 | Method of electroplating plastic articles |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2834724A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2993806A (en) * | 1956-12-17 | 1961-07-25 | Gen Tire & Rubber Co | Metal coating of plastics |
| US3162493A (en) * | 1962-08-31 | 1964-12-22 | Ind Tectonics Inc | Reinforcing graphite and plastic separators by electroformed metallic shells |
| US3235473A (en) * | 1961-12-26 | 1966-02-15 | Pullman Inc | Method of producing fuel cell electrodes |
| US3263455A (en) * | 1964-04-27 | 1966-08-02 | Ronson Corp | Lighter construction |
| US3265792A (en) * | 1963-10-04 | 1966-08-09 | Hercules Powder Co Ltd | Process for preparing a grained lithographic plate |
| US3416992A (en) * | 1965-06-28 | 1968-12-17 | Dow Chemical Co | Molded plastic article |
| US3423228A (en) * | 1965-03-22 | 1969-01-21 | Gen Electric | Deposition of catalytic noble metals |
| US4101402A (en) * | 1975-07-25 | 1978-07-18 | Rca Corporation | Adherence of metal films to polymeric materials |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US887482A (en) * | 1907-08-26 | 1908-05-12 | Gustave C Lammers | Electrocosmetic face-mask. |
| US1548432A (en) * | 1925-02-03 | 1925-08-04 | Bruno & Son Inc C | Method of electroplating musical instruments and improved electroplated musical instruments |
| US2133995A (en) * | 1937-12-16 | 1938-10-25 | Howard Hunt Pen Company C | Process for gold plating chromium alloy steels |
| US2333534A (en) * | 1939-06-19 | 1943-11-02 | Sigmund Cohn & Co | First surface mirror |
| US2383311A (en) * | 1942-04-15 | 1945-08-21 | Westinghouse Electric Corp | Contact for copper oxide rectifiers |
| US2423476A (en) * | 1946-03-07 | 1947-07-08 | Polaroid Corp | Bolometer |
| US2439983A (en) * | 1944-01-15 | 1948-04-20 | Libbey Owens Ford Glass Co | Means for thermally evaporating various materials in vacuums for coating purposes |
| US2482054A (en) * | 1944-06-24 | 1949-09-13 | Libbey Owens Ford Glass Co | Mirror structure having a metal to glass adherence increasing interlayer |
| US2501737A (en) * | 1946-09-11 | 1950-03-28 | Jr Ralph W Porter | Solution for plating metals with gold |
| US2680699A (en) * | 1952-04-21 | 1954-06-08 | Milton D Rubin | Method of manufacturing a conductive coated sheet and said sheet |
| US2702259A (en) * | 1951-08-09 | 1955-02-15 | Emi Ltd | Manufacture of electrodes which are sensitized so as to be emitters of photoelectrons or secondary electrons |
-
1956
- 1956-04-26 US US580964A patent/US2834724A/en not_active Expired - Lifetime
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US887482A (en) * | 1907-08-26 | 1908-05-12 | Gustave C Lammers | Electrocosmetic face-mask. |
| US1548432A (en) * | 1925-02-03 | 1925-08-04 | Bruno & Son Inc C | Method of electroplating musical instruments and improved electroplated musical instruments |
| US2133995A (en) * | 1937-12-16 | 1938-10-25 | Howard Hunt Pen Company C | Process for gold plating chromium alloy steels |
| US2333534A (en) * | 1939-06-19 | 1943-11-02 | Sigmund Cohn & Co | First surface mirror |
| US2383311A (en) * | 1942-04-15 | 1945-08-21 | Westinghouse Electric Corp | Contact for copper oxide rectifiers |
| US2439983A (en) * | 1944-01-15 | 1948-04-20 | Libbey Owens Ford Glass Co | Means for thermally evaporating various materials in vacuums for coating purposes |
| US2482054A (en) * | 1944-06-24 | 1949-09-13 | Libbey Owens Ford Glass Co | Mirror structure having a metal to glass adherence increasing interlayer |
| US2423476A (en) * | 1946-03-07 | 1947-07-08 | Polaroid Corp | Bolometer |
| US2501737A (en) * | 1946-09-11 | 1950-03-28 | Jr Ralph W Porter | Solution for plating metals with gold |
| US2702259A (en) * | 1951-08-09 | 1955-02-15 | Emi Ltd | Manufacture of electrodes which are sensitized so as to be emitters of photoelectrons or secondary electrons |
| US2680699A (en) * | 1952-04-21 | 1954-06-08 | Milton D Rubin | Method of manufacturing a conductive coated sheet and said sheet |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2993806A (en) * | 1956-12-17 | 1961-07-25 | Gen Tire & Rubber Co | Metal coating of plastics |
| US3235473A (en) * | 1961-12-26 | 1966-02-15 | Pullman Inc | Method of producing fuel cell electrodes |
| US3162493A (en) * | 1962-08-31 | 1964-12-22 | Ind Tectonics Inc | Reinforcing graphite and plastic separators by electroformed metallic shells |
| US3265792A (en) * | 1963-10-04 | 1966-08-09 | Hercules Powder Co Ltd | Process for preparing a grained lithographic plate |
| US3263455A (en) * | 1964-04-27 | 1966-08-02 | Ronson Corp | Lighter construction |
| US3423228A (en) * | 1965-03-22 | 1969-01-21 | Gen Electric | Deposition of catalytic noble metals |
| US3416992A (en) * | 1965-06-28 | 1968-12-17 | Dow Chemical Co | Molded plastic article |
| US4101402A (en) * | 1975-07-25 | 1978-07-18 | Rca Corporation | Adherence of metal films to polymeric materials |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US1947981A (en) | Plating aluminum | |
| US2834724A (en) | Method of electroplating plastic articles | |
| US2814589A (en) | Method of plating silicon | |
| US2984604A (en) | Platinum plating composition and process | |
| US3554881A (en) | Electrochemical process for the surface treatment of titanium,alloys thereof and other analogous metals | |
| US2658266A (en) | Laminated coating | |
| US2070679A (en) | Process for preparing nonmetallic articles for electro-plating | |
| US2821505A (en) | Process of coating metals with bismuth or bismuth-base alloys | |
| US2811484A (en) | Electrodeposition of zinc on magnesium and its alloys | |
| US2389131A (en) | Electrodeposition of antimony | |
| US3053741A (en) | Deposition of metals | |
| JPS58177494A (en) | Anodically oxidizing bath for aluminum-clad part and anodic oxidation | |
| US3227637A (en) | Method of bonding coatings | |
| US2969295A (en) | Chemical gold plating | |
| US3886051A (en) | Method of making jewelry and the like | |
| US2966448A (en) | Methods of electroplating aluminum and alloys thereof | |
| US2195231A (en) | Art of coating metals | |
| Abd El Rehim et al. | Effect of some plating variables on the electrodeposition of Cu-Zn alloys from alkaline tartrate baths | |
| US1827142A (en) | Process for the treatment of aluminum | |
| JPS5941489A (en) | Method for electroplating particulate material | |
| US3880730A (en) | Electro-galvanic gold plating process | |
| US2817629A (en) | Antimony plating bath | |
| US1566984A (en) | Electroplating method and electroplated articles | |
| US4385968A (en) | Electroplating a simulated bright brass finish | |
| US2819207A (en) | Process for enameling steel |