US2828252A - Electrodeposition of bright zinc, copper, or nickel - Google Patents

Electrodeposition of bright zinc, copper, or nickel Download PDF

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Publication number
US2828252A
US2828252A US425322A US42532254A US2828252A US 2828252 A US2828252 A US 2828252A US 425322 A US425322 A US 425322A US 42532254 A US42532254 A US 42532254A US 2828252 A US2828252 A US 2828252A
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United States
Prior art keywords
bath
copper
bright
nickel
baths
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Expired - Lifetime
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US425322A
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English (en)
Inventor
Fischer Johannes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions

Definitions

  • the present invention relates to an improved electroplating bath for bright plating of metals, such as zinc, nickel and especially copper and copper alloys.
  • urea reaction compounds found suitable for the preparation of the condensation products employed as brighteners according to the invention are of the following general formula R: N C R1 R: ⁇ NH2 in which R is oxygen, sulfur, or an imin group, and R and R are hydrogen, alkyl, alkenyl, aryl, aralkyl, or acyl groups of saturated or unsaturated acids.
  • acrolein or an a substituted acrolein must be present in the aldehyde components of the urea or substituted urea aldehyde resins in order that the condensation products are active as brighteners.
  • the acrolein or a substituted acroleins can be only a minor portion of the aldehyde component of the condensation product.
  • the quantity of the condensation product added as a brightener to the electrolytic baths should be at least 0.5 g./l. and can otherwise vary within wide limits. In general smaller quantities are required in acidic baths than in alkaline baths .in which advantageously 3.5. to 35 g./l. of the condensation products are employed.
  • condensation product added lies between 6 and 15, for examp1e, 10 g./l.
  • other known brighteners such as, for example, potassium thiocyanate.
  • the electroplating baths according to the invention can in addition to the urea condensation products, also contain water soluble polyglycol esters preferably those of fatty acids containing 4 to 15 carbon atoms.
  • the polyglycol radical preferably is one produced from 5 to 25 moles of ethylene oxide.
  • the polyglycol esters should be stable in alkalies up to 70 C. and at pH values up to about 13.
  • the quantities of such polyglycol esters added can be between 2 and 20 g./l., preferably 5 and 10 g./l. of bath.
  • the quantity of such xanthate addition can forexample be 0.01 to 1.0 g./l., preferably, 0.05 to 0.2 g./l. of bath.
  • electrolytic baths containing organic brighteners ordinarily are not suited or only poorly suited for electroplating with periodically reversing current it was unexpectedly found that periodically reversing current can be employed with success in baths according to the invention especially when thick platings are desired. For example, plating periods of about 25 seconds and deplating periods of about 5 seconds can be employed.
  • Example 1 An aqueous potassium cyanide containing copper plating bath of the following composition was prepared:
  • Example 2 An aqueous sodium cyanide containing zinc plating bath of the following composition was prepared:
  • the pH value of such bath was about 3.
  • Example 4 An aqueous acidic copper plating bath of the following composition was prepared:
  • Example 5 An aqueous copper plating bath of the following composition was prepared:
  • Example 6 An aqueous brass plating bath of the following com position was prepared:
  • Example 7 An aqueous copper plating bath of the followingcornposition was prepared:
  • NaCN V 34.0 Na CO 15 of the metal to be deposited which contains as a bright ener at least 0.5 gram per liter of a condensation product of an unsaturated aldehyde selected from the group consisting of acrolein and its alpha substitution products, and a urea of the general formula V R: 02R: R:
  • R is selected from the group consisting of oxygen, sulfur and imin radicals and R, and R are each selected from the group consisting of hydrogen, alkyl, alkenyl, aryl, aralkyl and acyl groups of saturated and unsaturated acids.
  • a bright metal electroplating bath according to claim 1 in which the quantity of said condensation product is 3.5 to 35 grams per liter of bath.
  • a bright metal electroplating bath according to claim 1 comprising in addition 2 to grams per liter of bath of a water soluble polyglycol ester of a fatty acid containing 4 to 15 carbon atoms.
  • a bright metal electroplating bath according to claim 1 comprising in addition 5 to 10 grams per liter of bath of a water soluble polyglycol ester of a fatty acid containing 4 to 15 carbon atoms.
  • a bright metal electroplating bath according to claim 1 comprising in addition 0.01 to 1 gram per liter of bath of an alkali metal xanthate.
  • a bright metal electroplating bath according to claim 1 comprising in addition 0.05 to 0.2 gram per liter of bath of an alkali metal xanthate.
  • a bright metal plating bath according to claim 1' containing at least one other brightener in addition to the condensation product.
  • a method for producing a bright metal electrodeposit of a metal selected from the group consisting of zinc, copper and nickel which comprises electroplating a material in an electroplating bath comprising an aqueous electrolyte of the metal to be deposited which contains as a brightener at least 0.5 gram per liter of a condensation product of an unsaturated aldehyde selected from the group consisting of acrolein and its alpha substitution products, and a urea of the general formula /R: Gilli Ra NH, wherein R is selected from the group consisting of oxygen, sulfur and imin radicals and R and R are each selected from the group consisting of hydrogen, alkyl, alkenyl, aryl, aralkyl and acyl groups of saturated and unsaturated acids.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
US425322A 1953-04-28 1954-04-23 Electrodeposition of bright zinc, copper, or nickel Expired - Lifetime US2828252A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE771683X 1953-04-28

Publications (1)

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US2828252A true US2828252A (en) 1958-03-25

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US (1) US2828252A (en))
BE (1) BE528448A (en))
FR (1) FR1099718A (en))
GB (1) GB771683A (en))
NL (2) NL90899C (en))

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3021266A (en) * 1957-08-12 1962-02-13 Barnet D Ostrow Additive for copper plating bath
US3088887A (en) * 1958-11-03 1963-05-07 Diamond Alkali Co Electropolishing of zinc-copper alloys
US3101305A (en) * 1957-03-16 1963-08-20 Riedel & Co Acid copper plating bath
US3116225A (en) * 1960-07-30 1963-12-31 Dehydag Gmbh Nickel electroplating baths
US3168453A (en) * 1961-06-28 1965-02-02 Debe Anthony Zinc cyanide plating bath
US3227638A (en) * 1961-06-16 1966-01-04 Robert H Burnson Alkali cyanide bath and process for electroplating therewith
US3309293A (en) * 1964-11-16 1967-03-14 Elechem Corp Copper cyanide electroplating bath
US3770599A (en) * 1971-05-24 1973-11-06 Oxy Metal Finishing Corp Acid zinc plating baths
US3923613A (en) * 1972-02-22 1975-12-02 Kampschulte & Cie Dr W Acidic galvanic copper bath
US4218292A (en) * 1979-03-22 1980-08-19 Mcgean Chemical Company, Inc. Bright zinc electroplating bath and method
FR2825721A1 (fr) * 2001-06-12 2002-12-13 Engelhard Clal Sas Melange utilisable comme brillanteur dans un bain de depot electrolytique d'argent, d'or ou d'un de leurs alliages
US9234291B2 (en) 2010-09-09 2016-01-12 Globalfoundries Inc. Zinc thin films plating chemistry and methods

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2101581A (en) * 1936-05-02 1937-12-07 Udylite Company Process for obtaining bright zinc coating
US2146439A (en) * 1934-11-12 1939-02-07 Du Pont Zinc plating
US2451341A (en) * 1945-08-10 1948-10-12 Westinghouse Electric Corp Electroplating
US2457152A (en) * 1943-07-07 1948-12-28 Du Pont Electrodepositing composition and bath
US2677654A (en) * 1951-05-10 1954-05-04 Poor & Co Copper electroplating and compositions therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2146439A (en) * 1934-11-12 1939-02-07 Du Pont Zinc plating
US2101581A (en) * 1936-05-02 1937-12-07 Udylite Company Process for obtaining bright zinc coating
US2457152A (en) * 1943-07-07 1948-12-28 Du Pont Electrodepositing composition and bath
US2451341A (en) * 1945-08-10 1948-10-12 Westinghouse Electric Corp Electroplating
US2677654A (en) * 1951-05-10 1954-05-04 Poor & Co Copper electroplating and compositions therefor

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3101305A (en) * 1957-03-16 1963-08-20 Riedel & Co Acid copper plating bath
US3021266A (en) * 1957-08-12 1962-02-13 Barnet D Ostrow Additive for copper plating bath
US3088887A (en) * 1958-11-03 1963-05-07 Diamond Alkali Co Electropolishing of zinc-copper alloys
US3116225A (en) * 1960-07-30 1963-12-31 Dehydag Gmbh Nickel electroplating baths
US3227638A (en) * 1961-06-16 1966-01-04 Robert H Burnson Alkali cyanide bath and process for electroplating therewith
US3168453A (en) * 1961-06-28 1965-02-02 Debe Anthony Zinc cyanide plating bath
US3309293A (en) * 1964-11-16 1967-03-14 Elechem Corp Copper cyanide electroplating bath
US3770599A (en) * 1971-05-24 1973-11-06 Oxy Metal Finishing Corp Acid zinc plating baths
US3923613A (en) * 1972-02-22 1975-12-02 Kampschulte & Cie Dr W Acidic galvanic copper bath
US4218292A (en) * 1979-03-22 1980-08-19 Mcgean Chemical Company, Inc. Bright zinc electroplating bath and method
FR2825721A1 (fr) * 2001-06-12 2002-12-13 Engelhard Clal Sas Melange utilisable comme brillanteur dans un bain de depot electrolytique d'argent, d'or ou d'un de leurs alliages
WO2002101119A1 (fr) * 2001-06-12 2002-12-19 Metalor Technologies France S.A.S. Melange utilisable comme brillanteur dans un bain de depot electrolytique d'argent, d'or ou d'un de leurs alliages
US9234291B2 (en) 2010-09-09 2016-01-12 Globalfoundries Inc. Zinc thin films plating chemistry and methods

Also Published As

Publication number Publication date
NL90899C (en))
FR1099718A (fr) 1955-09-08
GB771683A (en) 1957-04-03
NL187117B (nl)
BE528448A (en))

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