US2749683A - Lapping plate - Google Patents
Lapping plate Download PDFInfo
- Publication number
- US2749683A US2749683A US460351A US46035154A US2749683A US 2749683 A US2749683 A US 2749683A US 460351 A US460351 A US 460351A US 46035154 A US46035154 A US 46035154A US 2749683 A US2749683 A US 2749683A
- Authority
- US
- United States
- Prior art keywords
- lapping
- plate
- grooves
- plates
- lapping plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B35/00—Disazo and polyazo dyes of the type A<-D->B prepared by diazotising and coupling
- C09B35/02—Disazo dyes
- C09B35/039—Disazo dyes characterised by the tetrazo component
- C09B35/205—Disazo dyes characterised by the tetrazo component the tetrazo component being a derivative of a diaryl- or triaryl- alkane or-alkene
- C09B35/215—Disazo dyes characterised by the tetrazo component the tetrazo component being a derivative of a diaryl- or triaryl- alkane or-alkene of diarylethane or diarylethene
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/02—Wheels in one piece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
Definitions
- lapping plate used, for example, for grinding piezo-electrical crystal wafers, consists of a flat metal plate having grid, or straight-line intersecting, grooved lapping surface.
- the object of the present invention to overcome the disadvantages of such lapping plates and to provide a strengthened or stiffer plate which will not require such periodic maintenance.
- the face of a lapping plate has a multiplicity of non-intersecting annular grooves uniformly distributed over the lapping surface. Such grooves have no exposed sharp edges which can damage the work pieces.
- Fig. l is a plan view of the lapping surface of a plate according to the present invention.
- Fig. 2 is a side elevational view partly in section of a pair of lapping plates of the type shown in Fig. 1.
- annular surface lapping plate 4 having an inner cylindrical surface 5 and a concentric outer surface 6 is provided with a flat lapping surface 7.
- a plurality of non-intersecting annular grooves 8 are cut into and are uniformly distributed over the surface 7.
- the plates 4 (and 11 as seen in Fig. 2) have outside diameters of inches, inner diameters of 3% inches and a thickness d1 of 1 /2 inches.
- a total of 112 annular grooves or holes 8 are provided in the lapping surface 7, the holes being substantially uniformly spaced in four concentric circles, 20 holes being in the smallest circle and 24, 32 and 36 being in the second, third and fourth larger circles.
- the annular grooves have an outer diameter of 7 of an inch, an inner diameter of of an inch and cut initially to a depth of inch as contrasted with an initial cut of inch which is the maximum groove depth feasible for a grid grooved plate of the prior art of similar dimensions.
- the inner and outer peripheral edges 9 and 10 respectively of the lapping surface are rounded to eliminate sharp edges which could break wafers as the plates are moved in their circuitous lapping paths.
- sharp edges cannot be entirely eliminated from the peripheral edges 14 and 15 since the grooves 19 extend through to these edges and some breakage of crystal wafers results when the plates are moved for the lapping operation.
- the top lapping plate 4 of a pair of lapping plates 4 and 11 is provided with a concentric well 16 of depth d3 of about A of an inch and a plurality of ports 17 for supplying abrasive paste to the lapping surfaces thereof.
- the crystal wafers being lapped are held between the two plates 4 and 11 in apertures in a positioning plate 12 located therebetween.
- a lapping plate having a fiat lapping surface with a plurality of deep non-intersecting annular grooves distributed uniformly thereover, the diameters of the grooves being small compared to the radius of the plate and said grooves being spaced apart to provide structural rigidity.
- a lapping plate comprising an annular metal disc having a flat lapping surface with a plurality of annular grooves distributed uniformly thereover, the diameters of the grooves being small compared to the radius of the plate, said grooves being spaced apart to provide structural rigidity and the peripheral edges of the lapping surface being rounded to prevent injury to articles being lapped thereby.
- a lapping plate having a flat lapping surface with a plurality of non-intersecting annular grooves distributed uniformly thereover, all of the grooves being located entirely within the edges of the surface, the diameters of the grooves being small compared to the radius of the plate and said grooves being spaced apart to provide structural rigidity.
- a lapping plate having a fiat lapping surface with a plurality of non-intersecting annular grooves distributed uniformly thereover, the grooves being narrow with respect to the diameter thereof, the diameters of the grooves being small compared to the radius of the plate and said grooves being spaced apart to provide structural rigidity.
- a circular lapping plate having a flat lapping surface with a plurality of non-intersecting annular grooves, spaced apart and distributed uniformly thereover to provide structural rigidity, said grooves being spaced substantially uniformly about concentric circles in the plate and the grooves being narrow with respect to the diameter thereof.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
June 12, 1956 w. SODERMAN 2,749,683
LAPPING PLATE Filed Oct. 5, 1954 INVENTO/Q 6 W 6ODRMHN H T roan/5y United States Patent LAPPING PLATE George W. Soderman, Teaneck, N. J., assignor to Western Electric Company, Incorporated, New York, N. Y., a corporation of New York This invention relates to abrading devices and particularly to an improved surface lapping plate or disc.
One well known type of lapping plate used, for example, for grinding piezo-electrical crystal wafers, consists of a flat metal plate having grid, or straight-line intersecting, grooved lapping surface.
It is customary to make such plates quite thick to allow for wear but the intersecting grooves can be cut to only a limited initial depth without weakening the plate to the point where it tends to warp. As the plate wears, the grooves become too shallow for efficient operation but, due to the reduction in the mass of the plate, the grooves can be deepened without causing it to warp. This groove deepening operation may be repeated until the remaining metal becomes too thin to maintain a flat lapping surface. This procedure involves high maintenance expense, however, and when this type of lap is used thin quartz plates are sometimes chipped or broken by the sharp edges exposed at the ends of the grooves.
It is, therefore, the object of the present invention to overcome the disadvantages of such lapping plates and to provide a strengthened or stiffer plate which will not require such periodic maintenance.
According to the invention, the face of a lapping plate has a multiplicity of non-intersecting annular grooves uniformly distributed over the lapping surface. Such grooves have no exposed sharp edges which can damage the work pieces.
Moreover, since they do not weaken the plate as do the intersecting grid grooves, they may be cut initially to a depth giving a useful life equal to or greater than that obtainable by repeated regrooving of the old type plate.
These and other features of the invention will be more fully understood from the following detailed description taken in conjunction with the accompanying drawing, in which:
Fig. l is a plan view of the lapping surface of a plate according to the present invention;
Fig. 2 is a side elevational view partly in section of a pair of lapping plates of the type shown in Fig. 1.
In the drawing, an annular surface lapping plate 4 having an inner cylindrical surface 5 and a concentric outer surface 6 is provided with a flat lapping surface 7. A plurality of non-intersecting annular grooves 8 are cut into and are uniformly distributed over the surface 7. In a specific embodiment of the present invention designed for lapping quartz crystal Wafers, the plates 4 (and 11 as seen in Fig. 2) have outside diameters of inches, inner diameters of 3% inches and a thickness d1 of 1 /2 inches. A total of 112 annular grooves or holes 8 are provided in the lapping surface 7, the holes being substantially uniformly spaced in four concentric circles, 20 holes being in the smallest circle and 24, 32 and 36 being in the second, third and fourth larger circles. The annular grooves have an outer diameter of 7 of an inch, an inner diameter of of an inch and cut initially to a depth of inch as contrasted with an initial cut of inch which is the maximum groove depth feasible for a grid grooved plate of the prior art of similar dimensions.
The inner and outer peripheral edges 9 and 10 respectively of the lapping surface are rounded to eliminate sharp edges which could break wafers as the plates are moved in their circuitous lapping paths. In the prior art grid-grooved plates sharp edges cannot be entirely eliminated from the peripheral edges 14 and 15 since the grooves 19 extend through to these edges and some breakage of crystal wafers results when the plates are moved for the lapping operation.
As seen in Fig. 2 the top lapping plate 4 of a pair of lapping plates 4 and 11 is provided with a concentric well 16 of depth d3 of about A of an inch and a plurality of ports 17 for supplying abrasive paste to the lapping surfaces thereof. The crystal wafers being lapped are held between the two plates 4 and 11 in apertures in a positioning plate 12 located therebetween.
It is to be understood that the above described arrangements are simply illustrative of the application of the principles of the invention. Numerous other arrangements may be readily devised by those skilled in the art which will embody the principles of the invention and fall within the spirit and scope thereof.
What is claimed is:
l. A lapping plate having a fiat lapping surface with a plurality of deep non-intersecting annular grooves distributed uniformly thereover, the diameters of the grooves being small compared to the radius of the plate and said grooves being spaced apart to provide structural rigidity.
2. A lapping plate comprising an annular metal disc having a flat lapping surface with a plurality of annular grooves distributed uniformly thereover, the diameters of the grooves being small compared to the radius of the plate, said grooves being spaced apart to provide structural rigidity and the peripheral edges of the lapping surface being rounded to prevent injury to articles being lapped thereby.
3. A lapping plate having a flat lapping surface with a plurality of non-intersecting annular grooves distributed uniformly thereover, all of the grooves being located entirely within the edges of the surface, the diameters of the grooves being small compared to the radius of the plate and said grooves being spaced apart to provide structural rigidity.
4. A lapping plate having a fiat lapping surface with a plurality of non-intersecting annular grooves distributed uniformly thereover, the grooves being narrow with respect to the diameter thereof, the diameters of the grooves being small compared to the radius of the plate and said grooves being spaced apart to provide structural rigidity.
5. A circular lapping plate having a flat lapping surface with a plurality of non-intersecting annular grooves, spaced apart and distributed uniformly thereover to provide structural rigidity, said grooves being spaced substantially uniformly about concentric circles in the plate and the grooves being narrow with respect to the diameter thereof.
References Cited in the file of this patent UNITED STATES PATENTS 1,405,424 Maynard Feb. 7, 1922 2,201,410 Simonds May 21, 1940 2,597,187 Roshong May 20, 1952
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US460351A US2749683A (en) | 1954-10-05 | 1954-10-05 | Lapping plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US460351A US2749683A (en) | 1954-10-05 | 1954-10-05 | Lapping plate |
Publications (1)
Publication Number | Publication Date |
---|---|
US2749683A true US2749683A (en) | 1956-06-12 |
Family
ID=23828360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US460351A Expired - Lifetime US2749683A (en) | 1954-10-05 | 1954-10-05 | Lapping plate |
Country Status (1)
Country | Link |
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US (1) | US2749683A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6203407B1 (en) | 1998-09-03 | 2001-03-20 | Micron Technology, Inc. | Method and apparatus for increasing-chemical-polishing selectivity |
USRE37997E1 (en) * | 1990-01-22 | 2003-02-18 | Micron Technology, Inc. | Polishing pad with controlled abrasion rate |
US20150165586A1 (en) * | 2013-12-17 | 2015-06-18 | Fujibo Holdings, Inc. | Resin Lapping Plate and Lapping Method Using the Same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1405424A (en) * | 1920-05-20 | 1922-02-07 | American Optical Corp | Grinding tool |
US2201410A (en) * | 1939-02-15 | 1940-05-21 | Simonds Worden White Company | Grinding wheel |
US2597187A (en) * | 1949-02-26 | 1952-05-20 | Crane Packing Co | Adjustable lap |
-
1954
- 1954-10-05 US US460351A patent/US2749683A/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1405424A (en) * | 1920-05-20 | 1922-02-07 | American Optical Corp | Grinding tool |
US2201410A (en) * | 1939-02-15 | 1940-05-21 | Simonds Worden White Company | Grinding wheel |
US2597187A (en) * | 1949-02-26 | 1952-05-20 | Crane Packing Co | Adjustable lap |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE37997E1 (en) * | 1990-01-22 | 2003-02-18 | Micron Technology, Inc. | Polishing pad with controlled abrasion rate |
US6203407B1 (en) | 1998-09-03 | 2001-03-20 | Micron Technology, Inc. | Method and apparatus for increasing-chemical-polishing selectivity |
US6325702B2 (en) | 1998-09-03 | 2001-12-04 | Micron Technology, Inc. | Method and apparatus for increasing chemical-mechanical-polishing selectivity |
US6893325B2 (en) | 1998-09-03 | 2005-05-17 | Micron Technology, Inc. | Method and apparatus for increasing chemical-mechanical-polishing selectivity |
US20150165586A1 (en) * | 2013-12-17 | 2015-06-18 | Fujibo Holdings, Inc. | Resin Lapping Plate and Lapping Method Using the Same |
US9370853B2 (en) * | 2013-12-17 | 2016-06-21 | Fujibo Holdings, Inc. | Resin lapping plate and lapping method using the same |
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