Classifications

• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D3/00—Electroplating: Baths therefor
  • C25D3/02—Electroplating: Baths therefor from solutions
  • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
  • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
  • C25D3/18—Heterocyclic compounds

Definitions

• Thecompounds of Table I are preferably used at their optimum concentrations, though higher concentrations can be used, for example, if the bath is used at the lower temperatures such as room temperature. In general, the higher the temperature, and the greater the degree ofagitation at the cathode surface,
• one or more of the compounds of Table I preferably is used in an amount falling within a range I from about .001 gram per liter to about .02 gram per liter of solution with one or more of the compounds of Table 111, but excessively high concentrations will produce brittleness.
• the compounds of Table I should not be used in concentrations above about .02 g./l. or else the plate will be made brittle.
• the N-alkyl chain be less than about 8 carbon atoms or it will confer upon the compounds the properties of cationic wetting agents which will then cancel out or agglomerate with any anionic wetting agents that may be present for the prevention of pitting.
• the N- methyl chloracetate or N-ethyl chloracetate (or the betaine form) are desirable (Nos. 11, 12) as they are the least critical to obtain the highest brightness without serious embrittlement or darkening of the lowest current density areas.
• Compounds Nos. 1, 2, 6, 11 and 12 are the best members to use of Table I, from the standpoint of excellent effectiveness and ,least difficulty of preparation. l
• the best buffer to use is boric acid, though other bufiers such as citrates or formates may be used. If the latter are used,
• the nickel baths may contain as much as about 75-100 g./l. of COCl2. 6H2O (or its equivalent as sulfate), or about -g./1; of FeClzAHzO (or its equivalent as sulfate), andthe plates obtained are still very bright and ductile. Higher concentrations of cobalt will tend to dull the plate if-the baths are used too hot and in the case offiron, higher concentrations will tend to dull. and embrittle the plate. 7
• nickelsalts listed in Table II other nickel salts such as nickel sulfamate may be used.
• any acidic nickel bath may be used for the purpose of this invention which is capable of producing thick, adherent, and preferably ductile nickel deposits without the compounds of Tables I and
• the best pH values to use are usually about 3-5, though higher or lower values may be used. At room temperaturesthe higher pH values are usually used. The preferred temperature is from about 122-140 F. Too low pH (below 2.0) tends to slow the. rate of brightening.
• Examples A; B, and C are listed some preferred formulations. It is noteworthy that it is possible to obtain very ductile bright plate from the baths containing high nickelchloride concentrations (overabout 125 g./l. NiC12.6H2O concentrations) with the use of the vinyl and allyl type unsaturated aliphatic sulfonic acids., No lead heatingcoilor lead-lined equipment can be used-with thehigh chloride- (and low sulfate) die-cast, Where it is baths because of the ready solubility of lead in such baths.
• C. D. '10-100 amps/ft.
• Theabove bright plating baths are remarkably free from pitting.
• the compounds of Table I have, a relatively short life in the bath during electrodeposition as compared to the compounds of Table III. Therefore, their concentration should be checked more often and their concentration maintained on an ampere-hour basis and preferably by analysis.
• the alpha or beta unsaturated aliphatic sulfonam'ides and sulfonimides may be used. These compounds show beneficial effects in concentrations as low as .1 g./l. and can be used efiectively in concentrations as high as saturation in the bath.
• a bath for electrodepositing bright nickel consisting essentially of an aqueous acid solution of amaterial selected from the group consisting of nickel chloride, nickel sulfate, a mixture of nickel sulfate and nickel chloride, a mixture of nickel fiuoborate and nickel chloride, 9.
• the method of electrodepositing bright nickel comprising the step of electrodepositing bright nickel from an aqueous acid solution of a material selected from the group consisting essentially of nickel chloride, nickel sulfate, a mixture of nickel sulfate and nickel chloride, a mix ture of nickel fluoborate and nickel chloride, a mixture of nickel fluoborate and nickel sulfate, and a mixture of nickel sulfate, nickel chloride, and nickel fiuoborate, said solution also containing in a concentration falling within a range of from about .1 gram per liter to saturation an organic compound soluble in the solution and selected from the group consisting of allyl sulfonic acids, allyl and vinyl sulfonamides and sulionimides, said solution also containin in a concentration falling within a range of from about .001 gram per liter to .02 gram per liter a compound selected from the group consisting of N-aliphatic pyridinium pyrazoles and N-

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Electrochemistry (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Electroplating And Plating Baths Therefor (AREA)

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Citations (9)

• 0
  • BE BE511322D patent/BE511322A/xx unknown
• 1946
  • 1946-04-20 US US663757A patent/US2550449A/en not_active Expired - Lifetime
• 1947
  • 1947-04-19 GB GB10478/47A patent/GB638867A/en not_active Expired
  • 1947-04-19 GB GB10479/47A patent/GB638868A/en not_active Expired

Patent Citations (9)

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