US2495941A - Electroplating copper on aluminum - Google Patents
Electroplating copper on aluminum Download PDFInfo
- Publication number
- US2495941A US2495941A US717083A US71708346A US2495941A US 2495941 A US2495941 A US 2495941A US 717083 A US717083 A US 717083A US 71708346 A US71708346 A US 71708346A US 2495941 A US2495941 A US 2495941A
- Authority
- US
- United States
- Prior art keywords
- articles
- aluminum
- copper
- article
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 15
- 229910052802 copper Inorganic materials 0.000 title description 11
- 239000010949 copper Substances 0.000 title description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 10
- 238000009713 electroplating Methods 0.000 title description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 5
- 238000007743 anodising Methods 0.000 description 4
- 229940032330 sulfuric acid Drugs 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 241000277306 Esocidae Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
Definitions
- One of the important features of my inis placed at the rig vention is the use of an electrolyte including a moved to the center strong acid b means of which I may form an for th same interval of tim anodic coa in on he al minum an a deposit 10 time the article in the center is again removed, f p r v r he anodlc coating in the same the article at the left side is placedin the center, solution merely y using the aluminum s an and anew article is placed on .theleft side.
- Direct curodes This way taking advantage of rr w rent is applied to the electrodes in the usual way t hrowlng power of the solution, only the side and the anodizing is carried on until the desired which faces cathode will be plated, the other anodic film or coating is formed on the aluminum articlewhich requires. approximately 10 to slde tecewmg no n n i i t minutes. The current flow is then reversed mak- 'ee e l for Successwe hi i if requred' ing the aluminum article the cathode and the cop- 3o one f 99m features y nt? per plate the anode.
- I mm purpose for which it is intended the article is taken out of the bath and rinsed, and the platmerse at least two aluminum articles in the solution and connect them as electrodes or poles to a mg is COmmFtEd' adherence of Copper source of alternating current, preferably of low to T alummum 15 very good"
- the plated frequency In this Step of the Operation I f terlal can be formed, buffed or heated up to the an anodic coating without using direct current. melting point of the aluminum Without any P After the desired anodic coating has formed on 40 mg of the copperthe articles, the alternating current is switched In referring herein "aluminum?
- I n end to include pure aluminum, ordinary commercial aluoff and the aluminum articles are preferably connected in parallel.
- a direct current is then conminum with its usual imp and um n m nected to the articles as cathodes and a copper alloys-
- the main advantages of the method are;
- the method of electroplating copper on aluminum which comprises immersing at least two aluminum articles in a Water solution of sulfuric acid and copper sulfate, applying an alternating current-to the two articles as electrodes and forming an anodic coating thereon, discontinuing the 5 minum articles which comprises placing at least three fiat articles in an aqueous solution of sul furic acid and copper sulfate, in the center and the other anodizing the opposite faces of the anode.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Patented Jan. 31, 1950 1 hireo STATES PATENT OFFICE. ELECTItOPLATINZ ZZ Zi ER N ALIlMIN Lucio 1F. Mondolfo, Sea Cliff, N. Y., assignor to Reynolds Metals Company, Richmond, Va., acorporation of Delaware i No'Drawing. Application December 18, 1946,
Serial No. 717,083, 5 Claims. (01.204-42) anodized at the same time. After an. appropriate interval to minutes being usually This invention relates to the electroplating of ticle in the center is removed aluminum and'has for its object the provision of an improved method of electroplating copper on sufficient), the ar aluminum M n ion pr vides an an d zin and one of the articles at the sides; for example, the one at the right side is movedto the center and electroplating operation carried out with the 5 same sol ti n and advanta eously in the same and made the cathode. A new article to be plated vessel. One of the important features of my inis placed at the rig vention is the use of an electrolyte including a moved to the center strong acid b means of which I may form an for th same interval of tim anodic coa in on he al minum an a deposit 10 time the article in the center is again removed, f p r v r he anodlc coating in the same the article at the left side is placedin the center, solution merely y using the aluminum s an and anew article is placed on .theleft side. This node w le m n h o ng and then as operation is repeated at the end of each time incathode when depositing th copp r terval, moving the articles alternatingly from the 'lneccorda-nce with my invention; the t t to 15 right and left to the center. This way the operabe plated W copper with prehmi' tion is continuous and full advantage is taken of y Clea-11mg: and advantageously Without the the vessel and the current because articles are becareful and expensive preparation heretofore remg anodized and plated a the Same time quiredjs immersed in a water solution of copper If the articles to be plated are relatively flat d Sulfuric acid for anodizing and plat and are to be plated only on one side, the same sulfate an In practlcmg i g i my a arrangement can be used by reversing the cong a 3 55 if o g as nections, so that the article in the center 'is the ca 0 e e a at t e as e anode and the articles at the sides are the cathwhile forming the anodic coating. Direct curodes This way taking advantage of rr w rent is applied to the electrodes in the usual way t hrowlng power of the solution, only the side and the anodizing is carried on until the desired which faces cathode will be plated, the other anodic film or coating is formed on the aluminum articlewhich requires. approximately 10 to slde tecewmg no n n i i t minutes. The current flow is then reversed mak- 'ee e l for Successwe hi i if requred' ing the aluminum article the cathode and the cop- 3o one f 99m features y nt? per plate the anode. In this phase of the operaa I can fm t y desu'ed h n i tion, copper is deposited over the anodic coating P when h Q F plated t m-m on the aluminum article. e? F h l' i nt. i mk i f In another adaptation of my invention, I mm purpose for which it is intended, the article is taken out of the bath and rinsed, and the platmerse at least two aluminum articles in the solution and connect them as electrodes or poles to a mg is COmmFtEd' adherence of Copper source of alternating current, preferably of low to T alummum 15 very good" The plated frequency In this Step of the Operation I f terlal can be formed, buffed or heated up to the an anodic coating without using direct current. melting point of the aluminum Without any P After the desired anodic coating has formed on 40 mg of the copperthe articles, the alternating current is switched In referring herein "aluminum? I n end to include pure aluminum, ordinary commercial aluoff and the aluminum articles are preferably connected in parallel. A direct current is then conminum with its usual imp and um n m nected to the articles as cathodes and a copper alloys- The main advantages of the method are;
body or plate is used as anode. The copper plating is carried out as described above. 1. Very good adhesion of the copper to the Another variation of my invention which is m mparticularly suited for continuous operations is 2. No expensive or careful preparation of e as follows: In a vessel containing the solution surface is required before the article is immersed in the bath. If the article is fairly clean, no pre three articles are suspended in such a way that one is in the middle of the other two. The article treatment at all is required; if it is very dirty in the center is made the cathode and the articles or very greasy, it is better to remove the dirt or at the sides are connected in parallel as anodes. greaseto minimize undue contamination or the When direct current is passed, the article in the electrolyte, but it is not absolutely necessary.
center is plated, the articles at the sides being 3. The article is handled only when it is immersed in the bath and when it is taken out. No careful handling is required.
4. Only one solution is used so that only one tank is required.
The solution to be used for surface and for plating is cheap sity, me, temperature and voltage are not c11tical. Relatively Wide variations can be tolerated. In the following example a sheet of 38 alloy of 0.010 gage was plated in the H temper:
Direct Current Anodizing Plating Volts 25 Volts, v i. 6 Amp/sq ft 12 Amp./sq.ft 15 Time n1i11utes 15 Time "minutes" 15 Temperature 100 Temperature F iOO The solution used contained approximately:
20% Cu sulfate 2% H2804 After plating the sample was annealed at 650- 750 F. for minutes, pickled cracking taking place on the plating.
I claim:
1. The method of electroplating copper on aluminum which comprises immersing at least two aluminum articles in a Water solution of sulfuric acid and copper sulfate, applying an alternating current-to the two articles as electrodes and forming an anodic coating thereon, discontinuing the 5 minum articles which comprises placing at least three fiat articles in an aqueous solution of sul furic acid and copper sulfate, in the center and the other anodizing the opposite faces of the anode.
LUCIO F. MONDOLFO.
REFERENCES CITED The following references are of record in the file of this patent:
UNITED STATES PATENTS OTHER REFERENCES Chemical Abstracts 29 (1935), 24159.
Claims (1)
1. A METHOD OF ELECTROPLIATING COPPER ON ALUMINUM WHICH COMPRISES IMMERSING AT LEAST TWOALUMINUM ARTICLES IN A WATER SOLUTION OF SULFURIC ACID AND COPPER SULFATE, APPLYING AN ALTERNATING CURRENT TO THE TWO ARTICLES AS ELECTRODES AND FORMING AN ANODIC COATING THEREON, DISCONTINUING THE USE OF ALTERNATING CURRENT, CONNECTING THE ARTICLES IN PARALLEL AS CATHODES AND A BODY OF COPPER AS ANODE TO A SOURCE OF DIRECT CURRENT AND DEPOSITING COPPER ON THE ARTICLES.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US717083A US2495941A (en) | 1946-12-18 | 1946-12-18 | Electroplating copper on aluminum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US717083A US2495941A (en) | 1946-12-18 | 1946-12-18 | Electroplating copper on aluminum |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2495941A true US2495941A (en) | 1950-01-31 |
Family
ID=24880649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US717083A Expired - Lifetime US2495941A (en) | 1946-12-18 | 1946-12-18 | Electroplating copper on aluminum |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2495941A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2898490A (en) * | 1957-12-23 | 1959-08-04 | Gen Electric | Target plate |
| US2965551A (en) * | 1956-08-08 | 1960-12-20 | Pechiney Prod Chimiques Sa | Metal plating process |
| WO2011073695A2 (en) | 2009-12-15 | 2011-06-23 | Icr Ioannou Abee | Method of manufacturing rotogravure cylinders with aluminum base |
| DE102016113641A1 (en) | 2016-07-25 | 2018-01-25 | Christian-Albrechts-Universität Zu Kiel | Aluminum-copper connector having a heterostructure and method of making the heterostructure |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1457149A (en) * | 1920-05-10 | 1923-05-29 | Cunningham Harry Douglas | Preparing aluminium or its alloys for electroplating |
| US1534709A (en) * | 1924-05-17 | 1925-04-21 | Francis A Holt | Method of conducting electrolytic operations |
| GB290903A (en) * | 1927-10-25 | 1928-05-24 | Charles Hugh Roberts Gower | A new or improved process for electro-plating the surface of aluminium or aluminium alloys |
| US1735509A (en) * | 1925-10-30 | 1929-11-12 | Zh Rikagaku Kenkyujo | Process of forming an electrically insulating and anticorrosive oxide coating on aluminum material |
| US1933301A (en) * | 1931-01-23 | 1933-10-31 | Gen Electric | Process for the treatment of metals |
| US1947981A (en) * | 1930-11-07 | 1934-02-20 | Siemens Ag | Plating aluminum |
| GB484492A (en) * | 1935-11-05 | 1938-05-05 | Ver Aluminiumwerke A G | An improved process for electrolytically oxidising aluminium and aluminium alloys by means of alternating current |
| US2196018A (en) * | 1935-08-03 | 1940-04-02 | Schering Ag | Cartridge case provided with a nonmetallic surface |
-
1946
- 1946-12-18 US US717083A patent/US2495941A/en not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1457149A (en) * | 1920-05-10 | 1923-05-29 | Cunningham Harry Douglas | Preparing aluminium or its alloys for electroplating |
| US1534709A (en) * | 1924-05-17 | 1925-04-21 | Francis A Holt | Method of conducting electrolytic operations |
| US1735509A (en) * | 1925-10-30 | 1929-11-12 | Zh Rikagaku Kenkyujo | Process of forming an electrically insulating and anticorrosive oxide coating on aluminum material |
| GB290903A (en) * | 1927-10-25 | 1928-05-24 | Charles Hugh Roberts Gower | A new or improved process for electro-plating the surface of aluminium or aluminium alloys |
| US1947981A (en) * | 1930-11-07 | 1934-02-20 | Siemens Ag | Plating aluminum |
| US1933301A (en) * | 1931-01-23 | 1933-10-31 | Gen Electric | Process for the treatment of metals |
| US2196018A (en) * | 1935-08-03 | 1940-04-02 | Schering Ag | Cartridge case provided with a nonmetallic surface |
| GB484492A (en) * | 1935-11-05 | 1938-05-05 | Ver Aluminiumwerke A G | An improved process for electrolytically oxidising aluminium and aluminium alloys by means of alternating current |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2965551A (en) * | 1956-08-08 | 1960-12-20 | Pechiney Prod Chimiques Sa | Metal plating process |
| US2898490A (en) * | 1957-12-23 | 1959-08-04 | Gen Electric | Target plate |
| WO2011073695A2 (en) | 2009-12-15 | 2011-06-23 | Icr Ioannou Abee | Method of manufacturing rotogravure cylinders with aluminum base |
| US8991050B2 (en) | 2009-12-15 | 2015-03-31 | Artio Sarl | High wear durability aluminum gravure cylinder with environmentally safe, thermally sprayed pre-coat layer |
| DE102016113641A1 (en) | 2016-07-25 | 2018-01-25 | Christian-Albrechts-Universität Zu Kiel | Aluminum-copper connector having a heterostructure and method of making the heterostructure |
| WO2018019321A1 (en) | 2016-07-25 | 2018-02-01 | Christian-Albrechts-Universität Zu Kiel | Aluminium-copper connector having a heterostructure, and method for producing the heterostructure |
| US10870924B2 (en) | 2016-07-25 | 2020-12-22 | Christian-Albrechts-Universitaet Zu Kiel | Aluminum-copper connector having a heterostructure, and method for producing the heterostructure |
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