US2435889A - Production of metallic designs on nonmetallic materials - Google Patents
Production of metallic designs on nonmetallic materials Download PDFInfo
- Publication number
- US2435889A US2435889A US538231A US53823144A US2435889A US 2435889 A US2435889 A US 2435889A US 538231 A US538231 A US 538231A US 53823144 A US53823144 A US 53823144A US 2435889 A US2435889 A US 2435889A
- Authority
- US
- United States
- Prior art keywords
- metal
- design
- metallic
- resist
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000000463 material Substances 0.000 title description 4
- 229910052751 metal Inorganic materials 0.000 description 40
- 239000002184 metal Substances 0.000 description 40
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 238000005530 etching Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 239000002585 base Substances 0.000 description 13
- 239000010408 film Substances 0.000 description 13
- 239000003292 glue Substances 0.000 description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 11
- 229910052737 gold Inorganic materials 0.000 description 11
- 239000010931 gold Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 9
- 229910052763 palladium Inorganic materials 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 7
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 7
- 229910052794 bromium Inorganic materials 0.000 description 7
- 239000003153 chemical reaction reagent Substances 0.000 description 7
- 235000019441 ethanol Nutrition 0.000 description 7
- 239000007769 metal material Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 108010010803 Gelatin Proteins 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 229920000159 gelatin Polymers 0.000 description 6
- 239000008273 gelatin Substances 0.000 description 6
- 235000019322 gelatine Nutrition 0.000 description 6
- 235000011852 gelatine desserts Nutrition 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 229910052740 iodine Inorganic materials 0.000 description 5
- 239000011630 iodine Substances 0.000 description 5
- 229910001338 liquidmetal Inorganic materials 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- -1 aliphatic alcohols Chemical class 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 229910052703 rhodium Inorganic materials 0.000 description 4
- 239000010948 rhodium Substances 0.000 description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 239000000341 volatile oil Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- KMZHZAAOEWVPSE-UHFFFAOYSA-N 2,3-dihydroxypropyl acetate Chemical class CC(=O)OCC(O)CO KMZHZAAOEWVPSE-UHFFFAOYSA-N 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000004160 Ammonium persulphate Substances 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- 235000019395 ammonium persulphate Nutrition 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 239000001166 ammonium sulphate Substances 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- OIDPCXKPHYRNKH-UHFFFAOYSA-J chrome alum Chemical compound [K]OS(=O)(=O)O[Cr]1OS(=O)(=O)O1 OIDPCXKPHYRNKH-UHFFFAOYSA-J 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- GXOHBWLPQHTYPF-UHFFFAOYSA-N pentyl 2-hydroxypropanoate Chemical compound CCCCCOC(=O)C(C)O GXOHBWLPQHTYPF-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- KXXXUIKPSVVSAW-UHFFFAOYSA-K pyranine Chemical compound [Na+].[Na+].[Na+].C1=C2C(O)=CC(S([O-])(=O)=O)=C(C=C3)C2=C2C3=C(S([O-])(=O)=O)C=C(S([O-])(=O)=O)C2=C1 KXXXUIKPSVVSAW-UHFFFAOYSA-K 0.000 description 1
- YWFDDXXMOPZFFM-UHFFFAOYSA-H rhodium(3+);trisulfate Chemical compound [Rh+3].[Rh+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O YWFDDXXMOPZFFM-UHFFFAOYSA-H 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/04—Producing precipitations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/04—Chromates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Definitions
- This invention relates to the production of designs in gold, silver or palladium on non-metallic application and may be used also for the production of decorative or other types of designs in metal on glass and non-porous ceramic or natural products.
- the opacity and/or resistance to wear of the metallic design may be improved by:
- the thin coating of precious metal in step (a) may be produced by the known methods of sputtcring or evaporation in a high vacuum. It may also be produced by the use of the materials known commercially as "liquid gold. liquid silver” and liquid palladium, which consist mainly of solutions of sulphoresinates or resinates of the metals in solvents, such as essential oils.
- liquid metals a suitable image in known manner to heating adhere strongly amount of the liquid'is applied to the surface of the base and the latter is spun by rotating it etc. high speed about a central axis in a horizontal plane so as to cause theliquid to spread evenly over the surface of the base and throw of! any excess of liquid.
- the base is then fired at a temperature sufliciently high to decompose the organic constituents of the "liquid metal but not high enough to cause the resulting metal him to to the base.
- a suitable temperature may be between 300 and 600 C.
- the glue or gelatin used in step (b) is preferably one of the glue preparations sold commercially for photo-engraving processes and is rendered light-sensitive by the addition of a soluble chromate or bichromate.
- a wetting agent may be added to assist in even distribution of the glue over the metal.
- a suitable sensitisedglue solution may be composed as follows:
- This image is then converted into a resist (step (0)) for example by heating for 20 minutes at from 250 to 300 C.
- the hardening may be effected by treatment with chemical reagents, such as formaldehyde or chrome alum.
- step (d) The removal of the metal not protected by the resist (step (d)) is effected by an etching process.
- the reagent used in this process must be such that it does'not attack the resist or the underlying metal.
- the usual etching reagents for silver, gold and palladium consist of aqueous solutions of relatively strong acids with or without the addition of oxidising agents, or of alkaline solutions containing cyanides with or without oxidising agents such as hydrogen peroxide or ammonium persulphate.
- etching reagents solutions of bromine or iodine in non-aqueous solvents which do not penetrate the resist and which are not themselves readily attacked by bromine or iodine.
- solvents are, for example, the lower aliphatic alcohols, such as methyl, ethyl, isopropyl, butyl and amyl alcohols polyhydric alcohols, such as ethylene glycol, diethylene glycol and glycerol,
- esters preferably their high boiling esters, such as ethyl lactate, butyl lactate, amyl lactate and the glycol and glycerol acetates.
- the action 01 the etching reagent may be accelerated-by suspending therein a solid, as, for example, fine sawdust or levigated alumina, which exerts a mild scouring action on the metal coating when the etching bath is gently agitated,
- the metal coating in step (a) is produced by the use of a liquid metal
- the adherence of the metal coating to the base is efiected by including bismuth or other metal resinate in the liquid metal.
- a thin film of bismuth, or other metal, oxide may remain adhering to the base. This may be removed by immersing the base in a dilute acid solution which does not attack the resist and in which the metal oxide is soluble, as for example tartaric acid or citric acid, preferably dissolved in a non-aqueous solvent, for the reasons given above. In some cases this acid may be added to the etching reagent, so that the metal and the metal oxide are removed at the same time.
- the metal applied to the design in step (I) may be the same metal as the design, or a different metal.
- the design is rendered more resistant to wear, denser, and more opaque.
- the metals may be applied from appropriate known plating baths, and I will describe the applicatlon of rhodium to a gold design on a glass surface. Other metals may be deposited in a similar manner.
- the glass, with the gold design thereon, is first I cleaned by immersing it for a few seconds in a hot solution of caustic soda and sodium phosphate.
- the design is then electroplated witt rhodium in a plating bath containing, for example, rhodium sulphate, alkali or ammonium sulphate and sulphuric acid at a temperature oi 30 C. at a voltage of 12 and a current density of from 0.1 to 0.8 ampere per square centimetre for from 10 to 60 seconds.
- rhodium is a harder metal than gold, the design is more resistant to wear; it is also more opaq e.
- Figure 1 shows the shape of the desired design and Figures 2-8 are sections showing how the design is built up.
- Figure 2 shows the base i on which it is desired to produce the design.
- Figure 3 shows the base i with a coating 2 oi metal produced by step (a) as hereinbefore described.
- Figure 4 shows the film of glue or gelatin 3 applied to the metal coating 2
- Figure 5 shows the film 3 in the form of the design after exposure to light and removal of the unaffected glue or gelatin.
- Figure 6 shows the article after etching by step (d), the metal not covered by the film 3 having been removed leaving the metal design 2 covered by the film design 3.
- Figure 7 shows the metal design 2 on the base i after firing by step (e) the film 3 having been burned away.
- Figure 8 shows the result of optional step (I) in which the design 2 is made thicker by electrodeposition thereon of the same or another metal 4 which also takes the form of the design.
- a process of producing metallic designs on non-metallic materials comprising the steps: (a) providing a non-metallic material with a thin coating of a precious metal selected from the group consisting of silver, gold and palladium evenly distributed over its surface, (12) coating the resulting metal surface with a film of lightsensitised colloid selected from the group consisting of glue and gelatin and processing said film by photographic methods to produce a positive image in said colloid of the desired design, (0) hardening said image to convert it into a resist, (it) removing the metal not covered by said resist by etching with a solution of a halogen selected from the group consisting of bromine and iodine in a solvent selected from the group consisting of the lower aliphatic alcohols and the esters thereof, thus leaving the design in metal below the resist, and (e) firing the article to burn away the resist and cause the metallic design to adhere firmly to the non-metallic material.
- a process of producing metallic designs on non-metallic materials comprising the steps: (a) providing a non-metallic material with a thin coating of aprecious metal selected from the group consisting of silver, gold and palladium evenly distributed over its surface by spinning a film of a composition selected from the group consisting of the resinates and suiphoresinates of the precious metals dissolved in a solvent therefor, onto the surface of the non-metallic article andthereafter firing to convert said film into a thin coating of the desired metal, (b) coating the resulting metal surface with a film of light-sensitised colloid selected from the group consisting of glue and gelatin and processing said film by photographic methods to produce a positive image in said colloid of the desired design,
- composition comprises a solute selected from the group consisting of resinates and sulphoresinates of a metal chosen from the group consisting of silver, gold and palladium in essential oils diluted with a solvent having a low rate of evaporation.
- step (d) is selected 2 from the group consisting of lower aliphatic monohydroxylic and polyhydroxylic alcohol and esters of the same.
- step (d) is acidified with a weak organic acid.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- ing And Chemical Polishing (AREA)
Description
- Feb. 10, 1948. F. E. KERFQIDGE} I ,435,
PRODUCTION OF METALLIC DESIGNS 0N NONMETALLIC MATERIALS Filed June 1, 1944 FIGJ.
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a Q m FIG 6 xzxmxwmxwx FIG].
Q 7 -zzmn/xxmxmxc FIG.8.
. INVENTOR FHA WK ENOCH KERRIDG'E I). In: fiffornvy:
Patented Feb. 10, 1948 PRODUCTION OF METALLIC DESIGNS ON NONMETALLIC MATERIALS Frank Enoch Kerridge, London,
or to Johnson, Matthey 8: Company England, assign- Limited,
London, England, a British company Application June 1, 1944, Serial No. 538,231 in Great Britain June 2,1943
6 Claims.
This invention relates to the production of designs in gold, silver or palladium on non-metallic application and may be used also for the production of decorative or other types of designs in metal on glass and non-porous ceramic or natural products.
According to this invention I produce a metallic design on a non-metallic material (which I will hereinafter call the base) by a process comprising the following steps, namely: a
(a) Providing the base with a thin coating of silver. gold or palladium evenly distributed over its surface,
lb) Coating the resulting metal surface with a film of light-sensitised glue or gelatin which is then processed by photographic methods so as to take the form of a positive image of the desired design, i
(c) Hardening the produce a resist,
(d) Removing the metal not covered by the resist by etching with a solution of bromine or iodine in a liquid alcohol or ester which is not readily attacked by these halogens, thus leaving the designin metal below the resist, and (e) firing the article at such a temperature, generally from 500 to 900 C., that the resist is burned away and the metallic design is caused to adhere firmly to the base.
If desired, the opacity and/or resistance to wear of the metallic design may be improved by:
(f) Applying an electroplated coating of the same or another metal. Since the additional metal is applied by electrodeposition, it is deposited only on the metallic design, the non-metallic surface remaining unaffected,
The thin coating of precious metal in step (a) may be produced by the known methods of sputtcring or evaporation in a high vacuum. It may also be produced by the use of the materials known commercially as "liquid gold. liquid silver" and liquid palladium, which consist mainly of solutions of sulphoresinates or resinates of the metals in solvents, such as essential oils. When using liquid metals, a suitable image in known manner to heating adhere strongly amount of the liquid'is applied to the surface of the base and the latter is spun by rotating it etc. high speed about a central axis in a horizontal plane so as to cause theliquid to spread evenly over the surface of the base and throw of! any excess of liquid. The base is then fired at a temperature sufliciently high to decompose the organic constituents of the "liquid metal but not high enough to cause the resulting metal him to to the base. A suitable temperature may be between 300 and 600 C.
Commercial liquid metals" contain a considerable quantity of solvents of low boiling point, such as chloroform, or ethyl acetate, and the presence of these may cause deposition of moisture during the spinning operation due to the chilling caused by their rapid evaporation. It is therefore preferred to use in place of these solvents liquids such as cyclohexanol and benzyl alcohol which have a low rate of evaporation.
The glue or gelatin used in step (b) is preferably one of the glue preparations sold commercially for photo-engraving processes and is rendered light-sensitive by the addition of a soluble chromate or bichromate. A wetting agent may be added to assist in even distribution of the glue over the metal.
A suitable sensitisedglue solution may be composed as follows:
Ammonium bichromate grams 28 0.880 ammonia cc '6 Distilled water cc 660 v Wetting agent grams 8 Photoengraving glue cc. 200
image of the design. The parts of the glue film which have remained soluble are then removed by washing in cold water and the whole is dried rapidly, whereby the desired design is left as a glue image on the surface of the metal coating;
This image is then converted into a resist (step (0)) for example by heating for 20 minutes at from 250 to 300 C. Alternatively, the hardening may be effected by treatment with chemical reagents, such as formaldehyde or chrome alum.
The removal of the metal not protected by the resist (step (d)) is effected by an etching process. The reagent used in this process must be such that it does'not attack the resist or the underlying metal. The usual etching reagents for silver, gold and palladium consist of aqueous solutions of relatively strong acids with or without the addition of oxidising agents, or of alkaline solutions containing cyanides with or without oxidising agents such as hydrogen peroxide or ammonium persulphate. All these attack glut resists very readily so that it is difilcult to remove the metal from the parts not covered by the resist without at the same time causing the resist, at least in part, to lift away from the base and thus expose part of the metallic design to the action of the etching reagent.
I have found that this difficulty can be overcome by using a etching reagents solutions of bromine or iodine in non-aqueous solvents which do not penetrate the resist and which are not themselves readily attacked by bromine or iodine. Such solvents are, for example, the lower aliphatic alcohols, such as methyl, ethyl, isopropyl, butyl and amyl alcohols polyhydric alcohols, such as ethylene glycol, diethylene glycol and glycerol,
or their esters, preferably their high boiling esters, such as ethyl lactate, butyl lactate, amyl lactate and the glycol and glycerol acetates.
As examples of suitable etching baths I may mention:
(1) 2 parts of iodine, 4 parts of potassium iodide and 100 parts of ethyl alcohol;
(2) 100 parts of ethylene glycolmonoacetate, parts of acetic acid and 2 parts of bromine; or
(3) 100 parts of ethyl lactate, 10 parts of lactic acid and 2 parts of bromine all parts being by weight.
Solutions containing bromine act more rapidly than those containing iodine,
The action 01 the etching reagent may be accelerated-by suspending therein a solid, as, for example, fine sawdust or levigated alumina, which exerts a mild scouring action on the metal coating when the etching bath is gently agitated,
If the metal coating in step (a) is produced by the use of a liquid metal," the adherence of the metal coating to the base is efiected by including bismuth or other metal resinate in the liquid metal. In this case, when the metal is removed by etching in step (d), a thin film of bismuth, or other metal, oxide may remain adhering to the base. This may be removed by immersing the base in a dilute acid solution which does not attack the resist and in which the metal oxide is soluble, as for example tartaric acid or citric acid, preferably dissolved in a non-aqueous solvent, for the reasons given above. In some cases this acid may be added to the etching reagent, so that the metal and the metal oxide are removed at the same time.
The metal applied to the design in step (I) may be the same metal as the design, or a different metal. For example by electroplating a layer oi rhodium or platinum on to a design in gold, silver or palladium, the design is rendered more resistant to wear, denser, and more opaque.
The metals may be applied from appropriate known plating baths, and I will describe the applicatlon of rhodium to a gold design on a glass surface. Other metals may be deposited in a similar manner.
The glass, with the gold design thereon, is first I cleaned by immersing it for a few seconds in a hot solution of caustic soda and sodium phosphate. The design is then electroplated witt rhodium in a plating bath containing, for example, rhodium sulphate, alkali or ammonium sulphate and sulphuric acid at a temperature oi 30 C. at a voltage of 12 and a current density of from 0.1 to 0.8 ampere per square centimetre for from 10 to 60 seconds. In this way the design becomes thicker without the lines becoming appreciably wider. Since rhodium is a harder metal than gold, the design is more resistant to wear; it is also more opaq e.
. The way in which designs according to this invention may be built up is illustrated diagrammatically in the accompanying drawing in which the dimensions of the various layers are greatly exaggerated.
Figure 1 shows the shape of the desired design and Figures 2-8 are sections showing how the design is built up.
Figure 2 shows the base i on which it is desired to produce the design.
Figure 3 shows the base i with a coating 2 oi metal produced by step (a) as hereinbefore described. Y
Figure 4 shows the film of glue or gelatin 3 applied to the metal coating 2, while Figure 5 shows the film 3 in the form of the design after exposure to light and removal of the unaffected glue or gelatin.
Figure 6 shows the article after etching by step (d), the metal not covered by the film 3 having been removed leaving the metal design 2 covered by the film design 3.
Figure 7 shows the metal design 2 on the base i after firing by step (e) the film 3 having been burned away.
Figure 8 shows the result of optional step (I) in which the design 2 is made thicker by electrodeposition thereon of the same or another metal 4 which also takes the form of the design.
Iclaim:
1. A process of producing metallic designs on non-metallic materials comprising the steps: (a) providing a non-metallic material with a thin coating of a precious metal selected from the group consisting of silver, gold and palladium evenly distributed over its surface, (12) coating the resulting metal surface with a film of lightsensitised colloid selected from the group consisting of glue and gelatin and processing said film by photographic methods to produce a positive image in said colloid of the desired design, (0) hardening said image to convert it into a resist, (it) removing the metal not covered by said resist by etching with a solution of a halogen selected from the group consisting of bromine and iodine in a solvent selected from the group consisting of the lower aliphatic alcohols and the esters thereof, thus leaving the design in metal below the resist, and (e) firing the article to burn away the resist and cause the metallic design to adhere firmly to the non-metallic material.
2. A process of producing metallic designs on non-metallic materials comprising the steps: (a) providing a non-metallic material with a thin coating of aprecious metal selected from the group consisting of silver, gold and palladium evenly distributed over its surface by spinning a film of a composition selected from the group consisting of the resinates and suiphoresinates of the precious metals dissolved in a solvent therefor, onto the surface of the non-metallic article andthereafter firing to convert said film into a thin coating of the desired metal, (b) coating the resulting metal surface with a film of light-sensitised colloid selected from the group consisting of glue and gelatin and processing said film by photographic methods to produce a positive image in said colloid of the desired design,
and iodine in a solvent selected from the group 10 consisting of the lower aliphatic alcohols and the esters thereof, thus leaving the design in metal below the resist, and (e) firing the article to burn away the resist and cause the metallic design to adhere firmly to the non-metallic material.
3. A process as claimed in claim 2 in which the composition comprises a solute selected from the group consisting of resinates and sulphoresinates of a metal chosen from the group consisting of silver, gold and palladium in essential oils diluted with a solvent having a low rate of evaporation.
4. A process as claimed in claim 1 in which the solvent for the halogen in step (d) is selected 2 from the group consisting of lower aliphatic monohydroxylic and polyhydroxylic alcohol and esters of the same.
5. A process as claimed in claim 1 in which the etching bath used in step (d) is acidified with a weak organic acid.
6. A process as claimed in claim 1 in which the etching bath contains a suspended solid.
FRANK ENOGH KERRIDGE.
REFERENCES CITED The following references are of record in th iile of this patent:
UNITED STATES PATENTS Number Name Date 321,244 Philippi June- 30, 1885 468,591 Baynes Feb. 9, 1892 1,205,723 Friedrich Nov. 21, 1916 1,525,107 Spencer Feb. 3, 1925 1,776,535 Bekk Sept. 23, 1930 1,821,561 McFarland Sept. 1, 1931 1,942,686 Colbertet a1. Jan. 9, 1934 2,230,156 Carman Jan. 28, 1941 2,375,355 Fahraeus May 8, 1945 OTHER REFERENCES Mellor, Treatise on Inorganic and Theoretical Chemistry, published by Longmans, Green 8: Co., New York, vol. 3 (1923), pp. 346 and 527, and v01. 15 (1936), p. 627. r
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2435889X | 1943-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2435889A true US2435889A (en) | 1948-02-10 |
Family
ID=10906871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US538231A Expired - Lifetime US2435889A (en) | 1943-06-02 | 1944-06-01 | Production of metallic designs on nonmetallic materials |
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Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2482547A (en) * | 1944-04-18 | 1949-09-20 | Johnson Matthey Co Ltd | Production of designs on nonmetallic heat-resisting bases |
| US2640764A (en) * | 1951-02-12 | 1953-06-02 | Dow Chemical Co | Etching |
| US2649361A (en) * | 1949-05-13 | 1953-08-18 | Enthone | Method of dissolving metals and compostion therefor |
| US2693023A (en) * | 1950-06-20 | 1954-11-02 | Painton & Co Ltd | Electrical resistor and a method of making the same |
| US2736677A (en) * | 1950-12-01 | 1956-02-28 | Technograph Printed Circuits L | Metallized insulators |
| US2881404A (en) * | 1952-06-28 | 1959-04-07 | Lawrence J Kamm | Multiple electrical connector with yieldable contacts |
| US2884508A (en) * | 1956-10-01 | 1959-04-28 | Dresser Ind | Thin metal films and method of making same |
| US2904432A (en) * | 1954-09-29 | 1959-09-15 | Corning Glass Works | Method of producing a photograph in glass |
| US2925524A (en) * | 1956-03-16 | 1960-02-16 | Gen Electric | Methods and structures correcting for beam deflections in a television picture tube |
| US2933387A (en) * | 1957-06-28 | 1960-04-19 | Dudley D Taylor | Method of making a vacuum evaporated strain gage |
| US2947898A (en) * | 1956-03-16 | 1960-08-02 | Gen Electric | Color picture tube screen |
| US2976188A (en) * | 1955-11-25 | 1961-03-21 | Gen Mills Inc | Method of producing a humidity senser |
| US2982626A (en) * | 1959-09-22 | 1961-05-02 | Bell Telephone Labor Inc | Process for etching a glass-containing surface |
| US3003873A (en) * | 1953-12-23 | 1961-10-10 | Rca Corp | Color kinescopes and methods of making the same |
| US3022570A (en) * | 1959-09-21 | 1962-02-27 | Dudley D Taylor | Vacuum deposited strain gage and method of making same |
| US3080231A (en) * | 1953-10-20 | 1963-03-05 | Columbia Broadcasting Syst Inc | Process for photographically forming color screens |
| US3187650A (en) * | 1955-12-30 | 1965-06-08 | Rca Corp | Compensation for vertical component of earth's magnetic field by color triad displacement |
| US3205155A (en) * | 1961-10-19 | 1965-09-07 | Motorola Inc | Method of fabricating thin film resistive elements |
| DE1247905B (en) * | 1963-02-28 | 1967-08-17 | Philips Nv | Process for the production of precious metal samples on heat-resistant carriers |
| US3385702A (en) * | 1962-10-03 | 1968-05-28 | Ibm | Photomechanical method of making metallic patterns |
| US3406068A (en) * | 1951-07-30 | 1968-10-15 | Rca Corp | Photographic methods of making electron-sensitive mosaic screens |
| US4223088A (en) * | 1979-01-26 | 1980-09-16 | Xerox Corporation | Method of forming defined conductive patterns in a thin gold film |
| US4242378A (en) * | 1979-03-29 | 1980-12-30 | Reiko Co., Ltd. | Method of making a decorated film with a metal layer in the form of a given pattern |
| FR2595992A1 (en) * | 1986-03-21 | 1987-09-25 | Dousset Yvette | Photoengraving on silvered mirrors |
| US4941687A (en) * | 1989-11-09 | 1990-07-17 | Crane & Co. | Security paper for currency and bank notes |
| US20050089742A1 (en) * | 2001-12-18 | 2005-04-28 | Honda Giken Kogyo Kabushiki Kaisha | Method of producing fuel cell-use separator and device for producing it |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2482547A (en) * | 1944-04-18 | 1949-09-20 | Johnson Matthey Co Ltd | Production of designs on nonmetallic heat-resisting bases |
| US2649361A (en) * | 1949-05-13 | 1953-08-18 | Enthone | Method of dissolving metals and compostion therefor |
| US2693023A (en) * | 1950-06-20 | 1954-11-02 | Painton & Co Ltd | Electrical resistor and a method of making the same |
| US2736677A (en) * | 1950-12-01 | 1956-02-28 | Technograph Printed Circuits L | Metallized insulators |
| US2640764A (en) * | 1951-02-12 | 1953-06-02 | Dow Chemical Co | Etching |
| US3406068A (en) * | 1951-07-30 | 1968-10-15 | Rca Corp | Photographic methods of making electron-sensitive mosaic screens |
| US2881404A (en) * | 1952-06-28 | 1959-04-07 | Lawrence J Kamm | Multiple electrical connector with yieldable contacts |
| US3080231A (en) * | 1953-10-20 | 1963-03-05 | Columbia Broadcasting Syst Inc | Process for photographically forming color screens |
| US3003873A (en) * | 1953-12-23 | 1961-10-10 | Rca Corp | Color kinescopes and methods of making the same |
| US2904432A (en) * | 1954-09-29 | 1959-09-15 | Corning Glass Works | Method of producing a photograph in glass |
| US2976188A (en) * | 1955-11-25 | 1961-03-21 | Gen Mills Inc | Method of producing a humidity senser |
| US3187650A (en) * | 1955-12-30 | 1965-06-08 | Rca Corp | Compensation for vertical component of earth's magnetic field by color triad displacement |
| US2947898A (en) * | 1956-03-16 | 1960-08-02 | Gen Electric | Color picture tube screen |
| US2925524A (en) * | 1956-03-16 | 1960-02-16 | Gen Electric | Methods and structures correcting for beam deflections in a television picture tube |
| US2884508A (en) * | 1956-10-01 | 1959-04-28 | Dresser Ind | Thin metal films and method of making same |
| US2933387A (en) * | 1957-06-28 | 1960-04-19 | Dudley D Taylor | Method of making a vacuum evaporated strain gage |
| US3022570A (en) * | 1959-09-21 | 1962-02-27 | Dudley D Taylor | Vacuum deposited strain gage and method of making same |
| US2982626A (en) * | 1959-09-22 | 1961-05-02 | Bell Telephone Labor Inc | Process for etching a glass-containing surface |
| US3205155A (en) * | 1961-10-19 | 1965-09-07 | Motorola Inc | Method of fabricating thin film resistive elements |
| US3385702A (en) * | 1962-10-03 | 1968-05-28 | Ibm | Photomechanical method of making metallic patterns |
| DE1247905B (en) * | 1963-02-28 | 1967-08-17 | Philips Nv | Process for the production of precious metal samples on heat-resistant carriers |
| US4223088A (en) * | 1979-01-26 | 1980-09-16 | Xerox Corporation | Method of forming defined conductive patterns in a thin gold film |
| US4242378A (en) * | 1979-03-29 | 1980-12-30 | Reiko Co., Ltd. | Method of making a decorated film with a metal layer in the form of a given pattern |
| FR2595992A1 (en) * | 1986-03-21 | 1987-09-25 | Dousset Yvette | Photoengraving on silvered mirrors |
| US4941687A (en) * | 1989-11-09 | 1990-07-17 | Crane & Co. | Security paper for currency and bank notes |
| US20050089742A1 (en) * | 2001-12-18 | 2005-04-28 | Honda Giken Kogyo Kabushiki Kaisha | Method of producing fuel cell-use separator and device for producing it |
| US7254887B2 (en) * | 2001-12-18 | 2007-08-14 | Honda Giken Kogyo Kabushiki Kaisha | Fuel cell separator manufacturing method and manufacturing apparatus |
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