US2323599A - Art of finishing cut-crystal elements - Google Patents
Art of finishing cut-crystal elements Download PDFInfo
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- US2323599A US2323599A US353031A US35303140A US2323599A US 2323599 A US2323599 A US 2323599A US 353031 A US353031 A US 353031A US 35303140 A US35303140 A US 35303140A US 2323599 A US2323599 A US 2323599A
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- US
- United States
- Prior art keywords
- crystal
- art
- quartz
- frequency
- crystal elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000013078 crystal Substances 0.000 title description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 239000010453 quartz Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 12
- 239000002344 surface layer Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000001464 adherent effect Effects 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 241001547070 Eriodes Species 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002431 foraging effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical class [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S125/00—Stone working
- Y10S125/901—Stone working forming piezoelectric crystals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Definitions
- My present invention relates to the art of finishing cut-crystal elements such, for example, as piezoelectric quartz oscillators and resonators.
- My present invention contemplates, and its practice provides, the removal of the "Beilby surface layers" from freshly ground crystals, whereby the oscillating characteristics of the crystal.
- each freshly cut crystal with a tough coating constituted of a highly adherent preferably flexible material and subsequently strip the coating together with the Beilby surface layers, whichadhere thereto, from the crystal.
- the strip ping operation may be Performed with the fingers, or preferably. with a pair of tweezers or the like.
- Fig. 1 of the accompanying drawing designates a thin quartz piezoelectric element having a strongly adherent flexible coating thereon comprising a film S of silver which has been reinforced by a layer N of nickel or copper applied by electroplating the underlying silver layer.
- Fig. -l as in Fig. 2, which shows the crystal in the process of being stripped of its reinforced coating, the surface of the crystal is shown by an irregular line B to indicate the so-called "Beilby surface layers" which adhere to the metal coating during the stripping process.
- Method of finishing a ground crystalline element which comprises applying to the freshly ground surfaces of said element a strongly adherent coating, and subsequently'stripping said coating.
- Method of finishing a crystalline element which comprises electroplating said element and subsequently stripping the plating therefrom.
- Method of finishing a ground crystalline "element which comprises depositing an electrically conductive film on said element, then electroplating said film to strengthen it, and subsequently stripping said strengthened film.
- Method of stabilizing the frequency of a ground quartz piezoelectric element comprising washing said element, then electroplating said washed element, and subsequently stripping the plating together with the underlying Beilby surfaces" from said element.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
y 1943- a. w. N. HAWK 2,323,599
ART OF FINISHING CUT CRYSTAL ELEMENT Filed Aug. 17, 1940 Fatented .Fuly 6, 3.943
U N if r caries ART OF FINISHING CUT-CRYSTAL ELEMENTS Henry W. N. Hawk, Merchantville, N. J., assignor to Radio Corporation of America, a'corporation of Delaware Application August 17, 1940, Serial No. 353,031
4 Claims. (01. 171-327) My present invention relates to the art of finishing cut-crystal elements such, for example, as piezoelectric quartz oscillators and resonators.
It is a fact known to every manufacturer of piezo-electric crystals that a thin quartz plate which has been cut to respond to a particular (relatively high) frequency may respond to a diiferent and higher frequency several days or weeks after it has been cut and ground. Such changes in frequency, with time, may be asmuch as several kilocycles in the case of very thin quartz plates. It has accordingly been the practice in this art to so out each crystal element that it will respond originally to a frequency, say, .0l% lower than the desired frequency and to then age it, usually in an oven, for a eriod of from several days to several weeks, until the frequency-response of the'element is stabilized. After aging, the element may be touched up" as by edge-grinding or otherwise, if necessary to cause it to respond to the exact frequency desired.
The aging of high frequency piezoelectric crystal elements is an expensive operation not only because of the additional equipment required and because of the capital tied up in semifinished elements during the aging period, but also because of the necessity of making day-t0- day tests to determine whether frequency stability has been achieved. Of perhaps more importance to thecustomer is the fact that he may have to wait from several days to several weeks for an urgently needed crystal.
It is accordingly an object of my invention to provide an improved method of manufacturing piezoelectric crystal elements and one which ensures the production of highly stable elements without-aging them.
Other objects and advantages of my invention will appear from the following specification when read in connectionwith the accompanying drawing wherein Figures 1 and 2 are sectional views of a quartz piezoelectric element during different steps in the method of my invention.
I attribute frequency drift of the character described to the presence and subsequent disintegration of the Beilby surface layers which are formed on a ground crystal during the grinding process. But little is known of the nature of the surfaces of ground quartz. Sir George Beilbys theory that such surfaces comprise a liquid or amphorous glass-like substance appears to be negatived by the fact that quartz has no noticeable plasticity and great cohesive strength. As to this, see X-ray evidence onthe nature of the surface layers of thin ground quartz crystals secured with the Cauchois spectrograph, by F. R. Hirsh, Jr., and J. W. M. Du Mond, Physical Review, vol. 54, pp. 789-793, November 15, 1938. However this may be, I have observed that a thin quartz plate when aged for several days will acquire a readily removable film comprising a very fine white powder which can be shown, by spectroscopic analysis, to be constituted of pure quartz (silica). I thus believe that whatever is the true nature of Beilby surface layers," the grinding operation, which gives rise to such layers, sets up stresses and strains in the crystal and that the energy thus stored in the crystal is subsequently released over a period of time to cause the disintegration of the said surface layers of the quartz. Obviously, the freeing of the surface layers in the form of a powder by molecular movement has the same effect upon a piezoelectric crystal element as would the removal of an equivalent amount of material by grinding or polishing, that is, it raises its frequency.
As above indicated, it is the grinding or other mechanical disturbance which gives rise to Beilby surface layers in quartz. Hence, wherever in this'speciflcation and in the accompanying claims I refer to a Beilby surface layer" I mean a quartz surface which has been subjected to grinding or other mechanical dis' turbance and hence, presumably, is constituted in whole or in part of broken or fractured elemental crystalline particles.
My present invention contemplates, and its practice provides, the removal of the "Beilby surface layers" from freshly ground crystals, whereby the oscillating characteristics of the crystal.
are immediately stabilized and the necessity for aging is obviated. To this end, I provide each freshly cut crystal with a tough coating constituted of a highly adherent preferably flexible material and subsequently strip the coating together with the Beilby surface layers, whichadhere thereto, from the crystal.
In carrying my invention into efiect, I prefer,
first,to thoroughly wash the crystal as with soap and water, or with carbon tetrachloride or other cleansing material. I then deposit a thin film of silver or other conductive material upon the freshly ground and washed crystal and then, in
order to strengthen and thicken this film, I electroplate it as with nickel or copper so that it may the more readily be stripped from the crystal either in a single piece or in ribbons. The strip ping operation may be Performed with the fingers, or preferably. with a pair of tweezers or the like.
I prefer to deposit the underlying conductive film upon the crystal by the well known "Rochelle salts method" though I may employ the "Brasher methodic -4111c subsequent strengthening or reinforcement of the silver layer by electroplating it should; preferably, proceed until the coating is say .0005" (one-half mil) thick. In some cases, as where there is an imperfection in the underlying conductive film the electroplating process may be continued until the plating is so thick (say 1 mil-of an inch) that it curls and peels 01' its own accord.
In Fig. 1 of the accompanying drawing, Q designates a thin quartz piezoelectric element having a strongly adherent flexible coating thereon comprising a film S of silver which has been reinforced by a layer N of nickel or copper applied by electroplating the underlying silver layer. In Fig, -l, as in Fig. 2, which shows the crystal in the process of being stripped of its reinforced coating, the surface of the crystal is shown by an irregular line B to indicate the so-called "Beilby surface layers" which adhere to the metal coating during the stripping process.
While I have described the method of my invention as applied to a thin quartz piezoelectric element, it will be apparent to those skilled in the art to which my invention appertains that it is likewise applicable to crystalline elements intended for optical and other uses. It is to be understood, therefore, that the disclosure in the above respect is to be interpreted as illustrative and not in a limiting sense, except as required by the prior art and by the spirit of the appended c aims.
What is claimed is:
1. Method of finishing a ground crystalline element which comprises applying to the freshly ground surfaces of said element a strongly adherent coating, and subsequently'stripping said coating.
2. Method of finishing a crystalline element which comprises electroplating said element and subsequently stripping the plating therefrom.
3. Method of finishing a ground crystalline "element which comprises depositing an electrically conductive film on said element, then electroplating said film to strengthen it, and subsequently stripping said strengthened film.
4. Method of stabilizing the frequency of a ground quartz piezoelectric element, said method comprising washing said element, then electroplating said washed element, and subsequently stripping the plating together with the underlying Beilby surfaces" from said element.
HENRY W. N. HAWK.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US353031A US2323599A (en) | 1940-08-17 | 1940-08-17 | Art of finishing cut-crystal elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US353031A US2323599A (en) | 1940-08-17 | 1940-08-17 | Art of finishing cut-crystal elements |
Publications (1)
Publication Number | Publication Date |
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US2323599A true US2323599A (en) | 1943-07-06 |
Family
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Family Applications (1)
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US353031A Expired - Lifetime US2323599A (en) | 1940-08-17 | 1940-08-17 | Art of finishing cut-crystal elements |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3080263A (en) * | 1958-06-30 | 1963-03-05 | Eastman Kodak Co | Protection and cleaning of lenses |
US3224904A (en) * | 1963-03-18 | 1965-12-21 | Bell Telephone Labor Inc | Semiconductor surface cleaning |
US20060148243A1 (en) * | 2004-12-30 | 2006-07-06 | Jeng-Ho Wang | Method for fabricating a dual damascene and polymer removal |
-
1940
- 1940-08-17 US US353031A patent/US2323599A/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3080263A (en) * | 1958-06-30 | 1963-03-05 | Eastman Kodak Co | Protection and cleaning of lenses |
US3224904A (en) * | 1963-03-18 | 1965-12-21 | Bell Telephone Labor Inc | Semiconductor surface cleaning |
US20060148243A1 (en) * | 2004-12-30 | 2006-07-06 | Jeng-Ho Wang | Method for fabricating a dual damascene and polymer removal |
US20060246717A1 (en) * | 2004-12-30 | 2006-11-02 | Jeng-Ho Wang | Method for fabricating a dual damascene and polymer removal |
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