US2244009A - Electrical apparatus - Google Patents

Electrical apparatus Download PDF

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Publication number
US2244009A
US2244009A US288351A US28835139A US2244009A US 2244009 A US2244009 A US 2244009A US 288351 A US288351 A US 288351A US 28835139 A US28835139 A US 28835139A US 2244009 A US2244009 A US 2244009A
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Prior art keywords
conductor system
parts
plate
die
apertures
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Expired - Lifetime
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US288351A
Inventor
Hiensch Johannes Nathanael
Lips Eduard Maria Henricus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
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Philips Gloeilampenfabrieken NV
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0388Other aspects of conductors
    • H05K2201/0394Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/128Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder

Definitions

  • the present invention relates to an improved process of producing such an apparatus.
  • the process according to the invention is characterised in that the carrier plate or plates, on which the conductor system is to be arranged, is or are provided with apertures through which are passed the connecting wires or connecting strips of the parts to be secured to the conductor system, whereupon the conductor system is produced by means of the die-casting process and the parts are secured to the conductor system.
  • This process has various advantages.
  • the various parts to be secured to the conductor system are mounted on the carrier plate.
  • This carrier plate consequently serves as an assembly templet.
  • Fln'thermore the conductor system is produced in a die-casting mould on the carrierplate.
  • This mould therefore is only used during the time which is required for producing the conductor system, this in contradlstinction with the process described in the previous application wherein the mould also is utilised as an assembly templet.
  • it is rendered possible with respect to the contents of the previous application, to obtain a greater produc tion with the same number of available die-castm8 moulds.
  • the material used therefor leaks too high a degree between the walls of the apertures in the carrier plate and the connecting wires or connecting strips arranged in these openings.
  • the walls of the apertures in the carrier plate surround the connecting leads passed through these apertures so tightly that in each aperture the distance between the wall of the aperture in the plate and the external side of the wire or strip passed through the opening is approximately at the most 0.2 mm.
  • the connecting wires or strips used for securing the various parts to the conductor system are constituted by the connecting leads ofthe parts.
  • the said connecting strips may be produced, for example, by punching and suitably bending the terminal leads of the various parts.
  • the process according to the invention also permits of the various parts being secured to the conductor system during the die-casting operation. Due to the change in volume of the material of the conductors of the system when cooling down, this material may shrink for example, round the connecting wires or strips. It is alternatively possible that the material of the conductor system is alloyed with the material of the connecting wires, thus establishing the connection of the conductor system to the parts.
  • connections -of the various parts to the conductor system are established by riveting, welding or soldering.
  • solder which has a lower melting point than that of the material of the conductor system and of the connecting wires or strips.
  • the material used for the carrier plate may be. for example, a kind of artificial resin.
  • the conductor system may be constituted, for example. by lead or a lead alloy.
  • Fig. 1 is a plan view of a portion of a carrier plate comprising the conductor system of a radio-receiver according to the invention.
  • Figs. 2 and 3 are partial cross-sectional views taken respectively on lines IIII and IIIIII showing two possibilities of fastening a part to the conductor system.
  • Figs. 4 and 5 show a modification, the former being a plan view, and the latter being a partial cross-section taken on line VV, and Figs. 6 and 7 indicate in plan view the dimensions of the apertures in the carrier plate and of the connecting wires or strips fastened therein.
  • Fig. l For producing the carrier plate of Fig. l at first apertures are provided in this plate at the points 2, 3, 4 and 5, through which are passed the connecting wires 6 and I of a condenser I and the connecting wires 9 and ll of a resistance ll.
  • Figs. 2 and 3 show how the connecting wires 6 and I of the condenser 8 and the connecting wires 8 and ll of the resistance II are passed respectively through the apertures 2 and 3 and I and provided in the carrier plate I.
  • Fig. 1 shows in a plan view the conductors I2, I 3, I4, and ii.
  • the enlarged terminal portions. Na and I211 have been made at the same time with the conductor system.
  • the conductor system and the points are of such a material and of such a constitution that the points of connection during the cooling down subsequent to die-casting enclose the extremities of the connecting wires i and I in a sufficient degree to hold test these wires so as to be immovable. Consequently, in
  • the material of the conductor system has at least partly filled up the space between the connecting wires and the apertures in the carrier plate.
  • the diameters of the various apertures in the carrier plate are chosen as small as possible with respect to the diameters of the connecting wires or strips, as otherwise it would be possible that during die-casting of the conduotor system and of the points or" connection the die-casting mass would flow to an unlimited degree through these openings.
  • the advantage is obtained that the supporting plate may be much smaller, as a result of which the electric apparatus comprising the supporting plate may also be small.
  • the parts are secured to the conductor system through their junction wires or connecting strips the advantage is secured that the supporting plate may serve as a mounting templet for the various parts, so that the mounting of the various parts in the mould described above and in the prior application, which takes a comparatively long time, can be dispensed with.
  • the parts to be secured to the conduotor system have their largest dimension in the direction of the connecting line between the points where the junction wires emerge from the parts.
  • this connecting line is consequently according to the invention, arranged at least substantially normally to the plate supporting the parts. 01 course, it is not necessary that all parts should be mounted in the manner reerred to on the supporting plate. This depends on the available space. the course of the conduotor system or the like.
  • the mounting plate I has mounted on it a condenser 22 and two resistances 2i and 24.
  • the condenser 22 and the resistance 23 are arranged so that the connecting line of the points A and B or C, D at which the junction wires emerge from the parts extends normally to the plane 01' the plate I.
  • the resistance 24 is provided in such a manner that its main direction extends parallel with the plane of the plate I.
  • the various parts are passed with their Junction wires through apertures in the plate I and se cured to the conductor system which is made by die casting and whose various parts are designated by 25, 26, 21, 28, 29 and 30.
  • Fig. 6 shows the diameters of an aperture in the carrier plate and of the connecting wire with circular cross-section arranged in this aperture.
  • the diameter of the connecting wire has a value (11 and that of the aperture 8. value d2.
  • the diameters di and d2 of the apparatus according to the invention are so chosen that the distance between the wall of the aperture in the plate and the external side of the wire passed through this aperture is approximately at the most 0.2 mm.
  • Fig. 7 corresponds to the case that a connection strip with the cross dimensions hi and b1 is passed through an aperture in the form of a slit having the dimensions ha and b2.
  • the various dimensions are so chosen that the distance between the walls of the aperture in the plate and the external side of the strip passed through this aperture is approximately at the most 0.2 mm.
  • a wiring system for the component parts of radio apparatus comprising an insulating base plate having formed therein suitably spaced apertures, the terminal leads of the component parts adapted to be disposed within said plate apertures, and a plurality of wire conductors having enlarged terminal portions die-cast on only one of the surfaces of the base plate, said terminal portions being aligned with and surrounding the terminal leads to form a rigid union therewith, the component part leads and the base plate apertures being so dimensioned as to permit only partial penetration of the wire conductor material during the die-casting process.

Description

June 1941- J. N. HIENSCH ETAL 2,244,009
ELECTRICAL APPARATUS Filed Aug. 4, 1939 2 Sheets-Sheet l s V i Z 1 WI); WYIIIIIIIIIIIIM 1N VEN TORS JOf/ANNES NA THANAEL l-l/EMS' H BY Ali/WW4 HENRICl/S L/PS ATTORNEY.
June 3, 1941. J. N. HIENSCH ETAL ELECTRICAL APPARATUS 2 Shets-Sheet 2 Filed Aug. 4, 1939 l N VEN TO RS .JO/MNA/ES NATHAN/15L H/ENSCW AND 51% HENR/CUS LIPS ATTORNEY.
Patented June 3, [941 ELECTRICAL APPARATUS Johannes Nathanael Bienseh and Eduard Maria llenricus Lina Eindhoven, on to N. V. Philips N l n s. l a Gheilampenfabfleken,
Eindhoven, Netherlands, a corporation of the Netherlands Application A l!! 4. 1939, Serial No. 288,351 In Germany September 2, 1938 lclaim.
In copending application, Serial Number 210.- 803, filed May 28, 1938, there is described an electrical apparatus, for example, a radio-recei ing set, in which the conductor system is produced by die-casting. Such a conductor system has amongother things the advantage that the reproducibility is much greater than that of the usual conductor systems wherein the various conductors between the parts are constituted by loose wires, cables, etc. Besides, as compared with the usual conductor systems, the conductor system according to the above mentioned application is considerably more surveyable and has, in addition, a very rigid appearance.
The present invention relates to an improved process of producing such an apparatus. The process according to the invention is characterised in that the carrier plate or plates, on which the conductor system is to be arranged, is or are provided with apertures through which are passed the connecting wires or connecting strips of the parts to be secured to the conductor system, whereupon the conductor system is produced by means of the die-casting process and the parts are secured to the conductor system.
This process has various advantages. Before producing the conductor system by the die-casting process on the carrier plate, the various parts to be secured to the conductor system are mounted on the carrier plate. This carrier plate consequently serves as an assembly templet. Fln'thermore the conductor system is produced in a die-casting mould on the carrierplate. This mould therefore is only used during the time which is required for producing the conductor system, this in contradlstinction with the process described in the previous application wherein the mould also is utilised as an assembly templet. According to the present invention, it is rendered possible with respect to the contents of the previous application, to obtain a greater produc tion with the same number of available die-castm8 moulds.
In order to avoid that during die-casting of the conductor system the material used therefor leaks too high a degree between the walls of the apertures in the carrier plate and the connecting wires or connecting strips arranged in these openings. the walls of the apertures in the carrier plate surround the connecting leads passed through these apertures so tightly that in each aperture the distance between the wall of the aperture in the plate and the external side of the wire or strip passed through the opening is approximately at the most 0.2 mm.
In the process according to the invention, the connecting wires or strips used for securing the various parts to the conductor system are constituted by the connecting leads ofthe parts. The said connecting strips may be produced, for example, by punching and suitably bending the terminal leads of the various parts. As described in the previous application, the process according to the invention also permits of the various parts being secured to the conductor system during the die-casting operation. Due to the change in volume of the material of the conductors of the system when cooling down, this material may shrink for example, round the connecting wires or strips. It is alternatively possible that the material of the conductor system is alloyed with the material of the connecting wires, thus establishing the connection of the conductor system to the parts.
However, according to the invention it is also possible that, after the conductor system has been provided, the connections -of the various parts to the conductor system are established by riveting, welding or soldering.
In the latter case use is preferably made of a solder which has a lower melting point than that of the material of the conductor system and of the connecting wires or strips.
The material used for the carrier plate may be. for example, a kind of artificial resin. The conductor system may be constituted, for example. by lead or a lead alloy.
The invention will be more clearly understood by reference to the attached drawings showing, by way of example, some embodiments according thereto.
Fig. 1 is a plan view of a portion of a carrier plate comprising the conductor system of a radio-receiver according to the invention. Figs. 2 and 3 are partial cross-sectional views taken respectively on lines IIII and IIIIII showing two possibilities of fastening a part to the conductor system. Figs. 4 and 5 show a modification, the former being a plan view, and the latter being a partial cross-section taken on line VV, and Figs. 6 and 7 indicate in plan view the dimensions of the apertures in the carrier plate and of the connecting wires or strips fastened therein.
For producing the carrier plate of Fig. l at first apertures are provided in this plate at the points 2, 3, 4 and 5, through which are passed the connecting wires 6 and I of a condenser I and the connecting wires 9 and ll of a resistance ll. Figs. 2 and 3 show how the connecting wires 6 and I of the condenser 8 and the connecting wires 8 and ll of the resistance II are passed respectively through the apertures 2 and 3 and I and provided in the carrier plate I. After the parts have been mounted on the carrier plate, the conductor system, together with the enlarged terminal portions secured thereto for connecting the parts to this system, are produced in a mould by the die-casting process.
Fig. 1 shows in a plan view the conductors I2, I 3, I4, and ii. In the form of construction of Fig. 2 the enlarged terminal portions. Na and I211 have been made at the same time with the conductor system. The conductor system and the points are of such a material and of such a constitution that the points of connection during the cooling down subsequent to die-casting enclose the extremities of the connecting wires i and I in a sufficient degree to hold test these wires so as to be immovable. Consequently, in
this case a special iastening of the connecting wires to the conductor system is not necessary. Moreover it appears from the figure that during die-casting the material of the conductor system has at least partly filled up the space between the connecting wires and the apertures in the carrier plate. The diameters of the various apertures in the carrier plate are chosen as small as possible with respect to the diameters of the connecting wires or strips, as otherwise it would be possible that during die-casting of the conduotor system and of the points or" connection the die-casting mass would flow to an unlimited degree through these openings.
In the form of construction of Fig, 3, the material of the conductor system has not the property of adhering to a sufilcient extent to the connection leads. In this construction, therefore, an additional soldering operation is .used, during which the connecting wires 9 and ID are connected in the points a and l5a to the conductors l4 and by the solder drops 56 and H.
In contradistinction to the apparatus described above, in which the largest dimension of the parts extends in a direction parallel with the plate supporting them and in which consequently a comparatively large plate is necessary for providing the various parts, the advantage is obtained that the supporting plate may be much smaller, as a result of which the electric apparatus comprising the supporting plate may also be small. It, according to the invention, the parts are secured to the conductor system through their junction wires or connecting strips the advantage is secured that the supporting plate may serve as a mounting templet for the various parts, so that the mounting of the various parts in the mould described above and in the prior application, which takes a comparatively long time, can be dispensed with.
Generally the parts to be secured to the conduotor system have their largest dimension in the direction of the connecting line between the points where the junction wires emerge from the parts. In this case this connecting line is consequently according to the invention, arranged at least substantially normally to the plate supporting the parts. 01 course, it is not necessary that all parts should be mounted in the manner reerred to on the supporting plate. This depends on the available space. the course of the conduotor system or the like.
An arrangement such as described above is shown in Figs. 4 and 5. The mounting plate I has mounted on it a condenser 22 and two resistances 2i and 24. The condenser 22 and the resistance 23 are arranged so that the connecting line of the points A and B or C, D at which the junction wires emerge from the parts extends normally to the plane 01' the plate I. Thus it is ensured that the mounting plate I is occupied only by a very small part by these comparatively bulky parts. The resistance 24 is provided in such a manner that its main direction extends parallel with the plane of the plate I. The various parts are passed with their Junction wires through apertures in the plate I and se cured to the conductor system which is made by die casting and whose various parts are designated by 25, 26, 21, 28, 29 and 30.
Fig. 6 shows the diameters of an aperture in the carrier plate and of the connecting wire with circular cross-section arranged in this aperture. The diameter of the connecting wire has a value (11 and that of the aperture 8. value d2. In order to avoid that during producing oi the conductor system and of the enlarged terminal portions diecasting material would pass in inadmissible quantities through the space between the internal wall of the aperture and the connecting wire, the diameters di and d2 of the apparatus according to the invention are so chosen that the distance between the wall of the aperture in the plate and the external side of the wire passed through this aperture is approximately at the most 0.2 mm.
Fig. 7 corresponds to the case that a connection strip with the cross dimensions hi and b1 is passed through an aperture in the form of a slit having the dimensions ha and b2. In this case also the various dimensions are so chosen that the distance between the walls of the aperture in the plate and the external side of the strip passed through this aperture is approximately at the most 0.2 mm.
What we claim is A wiring system for the component parts of radio apparatus comprising an insulating base plate having formed therein suitably spaced apertures, the terminal leads of the component parts adapted to be disposed within said plate apertures, and a plurality of wire conductors having enlarged terminal portions die-cast on only one of the surfaces of the base plate, said terminal portions being aligned with and surrounding the terminal leads to form a rigid union therewith, the component part leads and the base plate apertures being so dimensioned as to permit only partial penetration of the wire conductor material during the die-casting process.
JOHANNES NATHANAEL HIENSCH. EDUARD MARIA HENRICUS LIPS.
US288351A 1938-09-02 1939-08-04 Electrical apparatus Expired - Lifetime US2244009A (en)

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Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2450153A (en) * 1944-10-09 1948-09-28 Prime Mfg Co Voltage indicator for electric fences
US2474988A (en) * 1943-08-30 1949-07-05 Sargrove John Adolph Method of manufacturing electrical network circuits
US2502291A (en) * 1946-02-27 1950-03-28 Lawrence H Taylor Method for establishing electrical connections in electrical apparatus
US2512162A (en) * 1946-06-13 1950-06-20 Hartford Nat Bank & Trust Co Electrical apparatus comprising a wiring cast by extrusion
US2542726A (en) * 1945-06-30 1951-02-20 Herbert W Sullivan Method of forming inductor coils
US2544325A (en) * 1947-07-30 1951-03-06 Bell Telephone Labor Inc Telephone substation apparatus
US2553287A (en) * 1946-04-23 1951-05-15 Harold P Yates Electrically insulating mounting support strip
US2581967A (en) * 1947-04-11 1952-01-08 Motorola Inc Simplified chassis for electronic equipment
US2636919A (en) * 1953-04-28 Ground connection for ultrahigh
US2695351A (en) * 1950-01-12 1954-11-23 Beck S Inc Electric circuit components and methods of preparing the same
US2703377A (en) * 1951-06-05 1955-03-01 Donald L Hings Molded wiring circuit
US2707272A (en) * 1954-05-21 1955-04-26 Sanders Associates Inc Mounting device for electric components
US2777192A (en) * 1952-12-03 1957-01-15 Philco Corp Method of forming a printed circuit and soldering components thereto
US2777193A (en) * 1952-07-17 1957-01-15 Philco Corp Circuit construction
US2778977A (en) * 1952-05-22 1957-01-22 Underwood Corp Component mounting assemblage
US2872625A (en) * 1956-08-07 1959-02-03 Liebscher Arthur Terminal connections for printed wiring assemblies
US2880378A (en) * 1954-07-30 1959-03-31 Clinton O Lindseth Shaped processed circuitry
US2898521A (en) * 1956-09-28 1959-08-04 Cyrus J Creveling Electric circuit component
US2902629A (en) * 1954-11-22 1959-09-01 Ibm Printed circuit connection and method of making same
US2927251A (en) * 1955-04-28 1960-03-01 Burroughs Corp Arrangement and method for connecting electrical circuit elements
US2929964A (en) * 1955-03-29 1960-03-22 Plessey Co Ltd Construction of electrical apparatus
US2929965A (en) * 1956-07-02 1960-03-22 Alonzo F Oden Mounting structures for electrical assemblies and methods of forming same
US2985709A (en) * 1957-08-06 1961-05-23 Joseph P Mammola Means and method of mounting electronic components
US2998475A (en) * 1959-12-03 1961-08-29 Raymond C Grimsinger Printed electrical circuit panel having angularly disposed sections
US3002481A (en) * 1955-05-31 1961-10-03 Hughes Aircraft Co Electrical component mounting device
US3013188A (en) * 1958-01-16 1961-12-12 Harry A Kohler Mechanically integrated circuit board and a method of making same by die forms
US3016588A (en) * 1957-04-05 1962-01-16 Robert A Weinhardt Contact bands for rockets
DE975642C (en) * 1953-03-06 1962-03-22 Blaupunkt Werke Gmbh Method for contacting two-dimensional circuits or switching elements that are printed or copied on carrier plates or carrier foils, preferably made of thermoplastics, and covered with an electrically insulating layer
US3042741A (en) * 1959-05-29 1962-07-03 Gen Electric Electric circuit board
US3042998A (en) * 1957-05-06 1962-07-10 Sperry Gyroscope Co Ltd Slip ring assembly
US3044151A (en) * 1954-09-03 1962-07-17 Myron A Coler Method of making electrically conductive terminals
US3059152A (en) * 1959-02-05 1962-10-16 Globe Union Inc Plug-in electronic circuit units and mounting panels
US3107414A (en) * 1959-12-24 1963-10-22 Ibm Method of forming circuit cards
US3142783A (en) * 1959-12-22 1964-07-28 Hughes Aircraft Co Electrical circuit system
US3165672A (en) * 1959-06-15 1965-01-12 Burroughs Corp Printed circuit baseboard
US3275895A (en) * 1964-08-11 1966-09-27 Gen Motors Corp Electronic assembly with butt welded auxiliary standard leads supporting components
US3723590A (en) * 1971-03-31 1973-03-27 Corning Glass Works Method for terminating an electrical component
US4908586A (en) * 1987-09-30 1990-03-13 Amp Incorporated Compact encapsulated filter assembly for printed circuit boards and method of manufacture thereof

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2636919A (en) * 1953-04-28 Ground connection for ultrahigh
US2474988A (en) * 1943-08-30 1949-07-05 Sargrove John Adolph Method of manufacturing electrical network circuits
US2450153A (en) * 1944-10-09 1948-09-28 Prime Mfg Co Voltage indicator for electric fences
US2542726A (en) * 1945-06-30 1951-02-20 Herbert W Sullivan Method of forming inductor coils
US2502291A (en) * 1946-02-27 1950-03-28 Lawrence H Taylor Method for establishing electrical connections in electrical apparatus
US2553287A (en) * 1946-04-23 1951-05-15 Harold P Yates Electrically insulating mounting support strip
US2512162A (en) * 1946-06-13 1950-06-20 Hartford Nat Bank & Trust Co Electrical apparatus comprising a wiring cast by extrusion
US2581967A (en) * 1947-04-11 1952-01-08 Motorola Inc Simplified chassis for electronic equipment
US2544325A (en) * 1947-07-30 1951-03-06 Bell Telephone Labor Inc Telephone substation apparatus
US2695351A (en) * 1950-01-12 1954-11-23 Beck S Inc Electric circuit components and methods of preparing the same
US2703377A (en) * 1951-06-05 1955-03-01 Donald L Hings Molded wiring circuit
US2778977A (en) * 1952-05-22 1957-01-22 Underwood Corp Component mounting assemblage
US2777193A (en) * 1952-07-17 1957-01-15 Philco Corp Circuit construction
US2777192A (en) * 1952-12-03 1957-01-15 Philco Corp Method of forming a printed circuit and soldering components thereto
DE975642C (en) * 1953-03-06 1962-03-22 Blaupunkt Werke Gmbh Method for contacting two-dimensional circuits or switching elements that are printed or copied on carrier plates or carrier foils, preferably made of thermoplastics, and covered with an electrically insulating layer
US2707272A (en) * 1954-05-21 1955-04-26 Sanders Associates Inc Mounting device for electric components
US2880378A (en) * 1954-07-30 1959-03-31 Clinton O Lindseth Shaped processed circuitry
US3044151A (en) * 1954-09-03 1962-07-17 Myron A Coler Method of making electrically conductive terminals
US2902629A (en) * 1954-11-22 1959-09-01 Ibm Printed circuit connection and method of making same
US2929964A (en) * 1955-03-29 1960-03-22 Plessey Co Ltd Construction of electrical apparatus
US2927251A (en) * 1955-04-28 1960-03-01 Burroughs Corp Arrangement and method for connecting electrical circuit elements
US3002481A (en) * 1955-05-31 1961-10-03 Hughes Aircraft Co Electrical component mounting device
US2929965A (en) * 1956-07-02 1960-03-22 Alonzo F Oden Mounting structures for electrical assemblies and methods of forming same
US2872625A (en) * 1956-08-07 1959-02-03 Liebscher Arthur Terminal connections for printed wiring assemblies
US2898521A (en) * 1956-09-28 1959-08-04 Cyrus J Creveling Electric circuit component
US3016588A (en) * 1957-04-05 1962-01-16 Robert A Weinhardt Contact bands for rockets
US3042998A (en) * 1957-05-06 1962-07-10 Sperry Gyroscope Co Ltd Slip ring assembly
US2985709A (en) * 1957-08-06 1961-05-23 Joseph P Mammola Means and method of mounting electronic components
US3013188A (en) * 1958-01-16 1961-12-12 Harry A Kohler Mechanically integrated circuit board and a method of making same by die forms
US3059152A (en) * 1959-02-05 1962-10-16 Globe Union Inc Plug-in electronic circuit units and mounting panels
US3042741A (en) * 1959-05-29 1962-07-03 Gen Electric Electric circuit board
US3165672A (en) * 1959-06-15 1965-01-12 Burroughs Corp Printed circuit baseboard
US2998475A (en) * 1959-12-03 1961-08-29 Raymond C Grimsinger Printed electrical circuit panel having angularly disposed sections
US3142783A (en) * 1959-12-22 1964-07-28 Hughes Aircraft Co Electrical circuit system
US3107414A (en) * 1959-12-24 1963-10-22 Ibm Method of forming circuit cards
US3275895A (en) * 1964-08-11 1966-09-27 Gen Motors Corp Electronic assembly with butt welded auxiliary standard leads supporting components
US3723590A (en) * 1971-03-31 1973-03-27 Corning Glass Works Method for terminating an electrical component
US4908586A (en) * 1987-09-30 1990-03-13 Amp Incorporated Compact encapsulated filter assembly for printed circuit boards and method of manufacture thereof

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