US20240002708A1 - Admixed modifiers for adhesives - Google Patents
Admixed modifiers for adhesives Download PDFInfo
- Publication number
- US20240002708A1 US20240002708A1 US18/228,174 US202318228174A US2024002708A1 US 20240002708 A1 US20240002708 A1 US 20240002708A1 US 202318228174 A US202318228174 A US 202318228174A US 2024002708 A1 US2024002708 A1 US 2024002708A1
- Authority
- US
- United States
- Prior art keywords
- adhesive
- monomer
- modifier
- improved
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 111
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 111
- 239000003607 modifier Substances 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 15
- 238000006467 substitution reaction Methods 0.000 claims abstract description 13
- -1 aromatic polyol Chemical class 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 229920005862 polyol Polymers 0.000 claims abstract description 8
- 239000000178 monomer Substances 0.000 claims description 39
- VYFYYTLLBUKUHU-UHFFFAOYSA-N dopamine Chemical compound NCCC1=CC=C(O)C(O)=C1 VYFYYTLLBUKUHU-UHFFFAOYSA-N 0.000 claims description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 16
- 229920001577 copolymer Polymers 0.000 claims description 13
- 239000004593 Epoxy Substances 0.000 claims description 12
- 229960003638 dopamine Drugs 0.000 claims description 11
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 10
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- 238000009472 formulation Methods 0.000 claims description 8
- WEUOQDZYWFACEV-UHFFFAOYSA-N O=C1NC(=O)C=C1.NCCc1ccc(O)c(O)c1 Chemical compound O=C1NC(=O)C=C1.NCCc1ccc(O)c(O)c1 WEUOQDZYWFACEV-UHFFFAOYSA-N 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000007983 Tris buffer Substances 0.000 claims description 5
- 235000013877 carbamide Nutrition 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229940106691 bisphenol a Drugs 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- FGTSEJPJBUNITK-UHFFFAOYSA-N prop-2-enoic acid;pyrrole-2,5-dione Chemical compound OC(=O)C=C.O=C1NC(=O)C=C1 FGTSEJPJBUNITK-UHFFFAOYSA-N 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 150000003672 ureas Chemical class 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- 150000003384 small molecules Chemical class 0.000 claims description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 12
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 9
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 8
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical class CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- WTDRDQBEARUVNC-LURJTMIESA-N L-DOPA Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C(O)=C1 WTDRDQBEARUVNC-LURJTMIESA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 125000005250 alkyl acrylate group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000012512 characterization method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 2
- 150000005206 1,2-dihydroxybenzenes Chemical group 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- AMFGWXWBFGVCKG-UHFFFAOYSA-N Panavia opaque Chemical compound C1=CC(OCC(O)COC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCC(O)COC(=O)C(C)=C)C=C1 AMFGWXWBFGVCKG-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- VVWYHYUIFMUTOH-UHFFFAOYSA-N benzene-1,2-diol;pyrrole-2,5-dione Chemical group O=C1NC(=O)C=C1.OC1=CC=CC=C1O VVWYHYUIFMUTOH-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- DCFKHNIGBAHNSS-UHFFFAOYSA-N chloro(triethyl)silane Chemical compound CC[Si](Cl)(CC)CC DCFKHNIGBAHNSS-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229920001690 polydopamine Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- WTFAGPBUAGFMQX-UHFFFAOYSA-N 1-[2-[2-(2-aminopropoxy)propoxy]propoxy]propan-2-amine Chemical compound CC(N)COCC(C)OCC(C)OCC(C)N WTFAGPBUAGFMQX-UHFFFAOYSA-N 0.000 description 1
- LVJZCPNIJXVIAT-UHFFFAOYSA-N 1-ethenyl-2,3,4,5,6-pentafluorobenzene Chemical compound FC1=C(F)C(F)=C(C=C)C(F)=C1F LVJZCPNIJXVIAT-UHFFFAOYSA-N 0.000 description 1
- XIRPMPKSZHNMST-UHFFFAOYSA-N 1-ethenyl-2-phenylbenzene Chemical group C=CC1=CC=CC=C1C1=CC=CC=C1 XIRPMPKSZHNMST-UHFFFAOYSA-N 0.000 description 1
- LRZPQLZONWIQOJ-UHFFFAOYSA-N 10-(2-methylprop-2-enoyloxy)decyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCOC(=O)C(C)=C LRZPQLZONWIQOJ-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- TZYNBBKNRGRCLN-UHFFFAOYSA-N 2-(4-formylphenoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=C(C=O)C=C1 TZYNBBKNRGRCLN-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
- ARJUGLWKXOLVIN-UHFFFAOYSA-N 4-[2-(2-methylprop-2-enoyloxy)ethoxy]benzoic acid Chemical compound CC(=C)C(=O)OCCOC1=CC=C(C(O)=O)C=C1 ARJUGLWKXOLVIN-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- CTENFNNZBMHDDG-UHFFFAOYSA-N Dopamine hydrochloride Chemical compound Cl.NCCC1=CC=C(O)C(O)=C1 CTENFNNZBMHDDG-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229940123457 Free radical scavenger Drugs 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- OFIMLDVVRXOXSK-UHFFFAOYSA-N [4-(2-methylprop-2-enoyloxy)cyclohexyl] 2-methylprop-2-enoate Chemical class CC(=C)C(=O)OC1CCC(OC(=O)C(C)=C)CC1 OFIMLDVVRXOXSK-UHFFFAOYSA-N 0.000 description 1
- FPPZQGWDBRTKFZ-UHFFFAOYSA-N [N].O=C1CCC(=O)N1 Chemical compound [N].O=C1CCC(=O)N1 FPPZQGWDBRTKFZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- NLCKLZIHJQEMCU-UHFFFAOYSA-N cyano prop-2-enoate Chemical class C=CC(=O)OC#N NLCKLZIHJQEMCU-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010511 deprotection reaction Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 229960001149 dopamine hydrochloride Drugs 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- XMJHPCRAQCTCFT-UHFFFAOYSA-N methyl chloroformate Chemical compound COC(Cl)=O XMJHPCRAQCTCFT-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 125000006239 protecting group Chemical group 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000010512 thermal transition Effects 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/02—Polyureas
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
Definitions
- the present invention is drawn to a method for improving interfacial adhesion of an adhesive to unprimed substrates.
- the method is drawn towards the use of adhesive modifiers with particular characteristics with the adhesive to improve adhesion without requiring priming a substrate's surface.
- the adhesive may be an epoxy (for example a diglycidyl ether of Bisphenol-A (DGEBA)-based resin), an acrylate-based adhesive, a thermoplastic elastomer (TPE), or a thermoplastic urethane or ureas (TPU).
- an epoxy for example a diglycidyl ether of Bisphenol-A (DGEBA)-based resin
- DGEBA diglycidyl ether of Bisphenol-A
- TPE thermoplastic elastomer
- TPU thermoplastic urethane or ureas
- the adhesive modifier may include a dopamine, a maleimide-dopamine monomer, tris, or a derivative thereof.
- the adhesive modifier is a copolymer of a monomer having an ortho-hydroxyl substitution on a benzene ring, such as a maleimide-dopamine monomer or derivative, and an acrylate monomer, such as an acrylate with a branched or straight alkyl side chain of between 1 and 12 carbons.
- the copolymer is a polymeric acrylate-maleimide or derivative thereof.
- copolymers where the mole fraction of the monomer having an ortho-hydroxyl substitution on a benzene ring in the copolymer is between 0.1 and 0.5. It is also advantageous for the adhesive modifier to be present in the total formulation mass in an amount less than 0.5% by weight, and when present in a two-part epoxy including a curing agent, for the adhesive modifier to be mixed into the curing agent.
- an improved adhesive which includes a baseline adhesive formulation and an adhesive modifier present in an amount less than 2% by weight of the total weight of the improved adhesive, where the adhesive modifier utilizes a copolymer of a monomer having an ortho-hydroxyl substitution on a benzene ring and an acrylate monomer.
- the monomer having an ortho-hydroxyl substitution on a benzene ring may be a dopamine monomer, a maleimide-dopamine monomer, or a derivative thereof.
- the acrylate monomer may be a branched or straight alkyl side chain of between 1 and 12 carbons.
- the mole fraction of the monomer having an ortho-hydroxyl substitution on a benzene ring in the copolymer may be between 0.1 and 0.5.
- the baseline adhesive may be selected from the group consisting of an epoxy, an acrylate-based adhesive (to also include methacrylates, more broadly alkyl-acrylates, cyanoacrylates, hydroxyl-ethyl methacrylates, etc.), a thermoplastic elastomers (TPE), and a thermoplastic urethane or urea (TPU).
- an epoxy an acrylate-based adhesive (to also include methacrylates, more broadly alkyl-acrylates, cyanoacrylates, hydroxyl-ethyl methacrylates, etc.), a thermoplastic elastomers (TPE), and a thermoplastic urethane or urea (TPU).
- the adhesive modifier may be present in an amount less than 2% by weight of the total weight of the improved adhesive, and more advantageous when it is present in an amount less than 1.0% by weight of the total weight of the improved adhesive, and still more advantageous when it is present in an amount between 0.1% and 0.6% by weight of the total weight of the improved adhesive.
- FIG. 1 is a flowchart describing a method for producing an improved adhesive.
- FIGS. 2 A- 2 C are molecular structures of various adhesive modifiers that can be utilized in the present invention.
- FIGS. 3 A- 3 D are embodiments of a method for producing an adhesive modifier.
- FIG. 4 A is an example reaction forming a polymeric adhesive.
- FIG. 4 B is an example reaction forming an improved polymeric adhesive utilizing one embodiment of a small molecule additive.
- FIG. 5 A is a graph showing lap-shear performance of adhesives varying with increasing concentrations of various adhesive modifiers under dry conditions.
- FIG. 5 B is a graph showing lap-shear performance of adhesives varying with increasing concentrations of various adhesive modifiers under hot/wet conditions.
- FIG. 6 is a flowchart describing a method for utilizing the improved adhesive.
- the present invention is drawn to an adhesive having an improved interfacial adhesion to unprimed substrates.
- the method ( 100 ) begins by providing ( 110 ) at least one adhesive and an adhesive modifier.
- the adhesive may be an epoxy, including but not limited to those having a diglycidyl ether of Bisphenol-A (DGEBA)-based resin.
- the adhesive may utilize an acrylate-based adhesive, a thermoplastic elastomer (TPE), or a thermoplastic urethane or ureas (TPU).
- the adhesive modifier must be at least partially soluble in the adhesive. Further, the adhesive modifier should include a non-aromatic polyol or a molecule having at least one ortho-hydroxyl substitution on a benzene ring.
- the polyol contains a primary amine. In other embodiments, the polyol contains between 2 and 4 hydroxyl groups. And in still more preferred embodiments, the polyol is tris.
- FIGS. 2 A- 2 C Structures of various non-limiting embodiments of molecules having at least one ortho-hydroxyl substitution on a benzene ring that can be used as adhesive modifiers can be seen in FIGS. 2 A- 2 C .
- the modifiers include dopamine ( 202 ) (“dopa”) and a dimethyl analog to dopa ( 201 ), 2-(3,4-Dimethylphenyl)ethanaminne (“M-control”).
- the modifiers include maleimnide-dopamine ( 203 ) (“maleimide” in FIGS. 5 A and 5 B ) and tris ( 204 ).
- FIG. 2 A the modifiers include dopamine ( 202 ) (“dopa”) and a dimethyl analog to dopa ( 201 ), 2-(3,4-Dimethylphenyl)ethanaminne (“M-control”).
- the modifiers include maleimnide-dopamine ( 203 ) (“maleimide” in FIGS. 5 A and 5 B
- FIG. 2 C shows several polymeric adhesive modifiers, based on polymeric acrylate-maleimides (PAMs), that incorporate the maleimide-catechol residue or analog in a copolymer with acrylates with varying length of alkyl side chain.
- PAMs polymeric acrylate-maleimides
- a variant using a methyl group and the dopamine analog residue ( 205 ) (“P-control”) is shown alongside dopamine residue variants with methyl ( 206 ) (“P-methyl”) and hexyl ( 207 ) (“P-hexyl”) groups.
- R 1 is a branched or straight alkyl side chain of between 1 and 12 carbons, typically a methyl, ethyl, butyl, hexyl, or 2-ethylhexyl
- R 2 is typically either a methyl, hydroxyl, or methoxy group, or a fluorine.
- R 2 is a hydroxyl group.
- Other polymeric structures are also envisioned.
- some non-limiting examples of the polymerizable acrylate monomers which may be used include acrylic acid, methacrylic acid; alkyl acrylates (e.g., methyl acrylate, ethyl acrylate, etc.); cycloaliphatic acrylates (e.g.
- isobornyl acrylate ); typical alkyl methacrylates (e.g., methyl methacrylate, butyl methacrylate); functional methacrylates (e.g., acrylic acid, hydroxy-ethyl methacrylate (HEMA)); cycloaliphatic methacrylates (e.g., cyclohexyl methacrylate; iso-bornyl methacrylate); aryl methacrylates (e.g., phenyl methacrylate; benzyl methacrylate; bisphenol dimethacrylates); functional methacrylates (e.g., 2-hydroxyethyl methacrylate; 4-methacryloxyethoxybenzaldehyde; 4-methacryloxyethoxybenzoic acid); ethylene glycol dimethacrylate; diethylene glycol dimethacrylate; triethylene glycol dimethacrylate; tetraethylene glycol dimethacrylate; polyethylene glycol and polypropylene glycol dimethacryl
- bis-GMA bis-GMA
- various nonhydroxylated homologs of bis-GMA e.g. 2,2-bis[p-(2′-methacryloxyethoxy)phenyl]propane
- various diurethane dimethacrylates e.g., the diadduct of 2-hydroxyethyl methacrylate and trimethylhexamethylene diisocyanate
- oligomeric urethanes with multifunctional methacrylate groups e.g.
- urethane derivatives of bis-GMA and aliphatic and cycloaliphatic diisocyanates and other prepolymer types of monomers (e.g., siloxane multifunctional methacrylates; polyfluorinated oligomeric multifunctional methacrylates) and the like.
- monomers e.g., siloxane multifunctional methacrylates; polyfluorinated oligomeric multifunctional methacrylates
- Mixtures of the above and other acrylate monomers or other copolymerizable monomers such as any vinyl monomer capable of free radical polymerization, e.g., styrene, ⁇ -methylstyrene, vinyl biphenyl, vinyl acetate, pentafluorostyrene, and similar olefinic monomers
- vinyl monomer capable of free radical polymerization e.g., styrene, ⁇ -methylstyrene, vinyl biphenyl, vinyl acetate, pentafluorost
- FIG. 3 A- 3 D One example method for producing such a structure is illustrated in FIG. 3 A- 3 D .
- the maleimide intermediate component ( FIG. 3 A , Reference “1”) is produced ( FIG. 3 A ) by reacting maleimide in the presence of methylchloroformate and triethylamine (TEA).
- TEA methylchloroformate and triethylamine
- the dopamine intermediate component is protected by trialkyl silanes
- FIG. 3 B Reference “2”
- FIG. 3 C Reference “M 1 ”).
- the PAMs were precipitated into water from THF three times.
- the pH of the precipitate solution was measured to ensure a range between 6-7.
- the PAMs were dried under vacuum (0.17 Torr) for a minimum of five (5) hours to afford off white powders in good to moderate yields.
- yields are of deprotected polymers over two steps.
- Mn and PDIs were taken of silyl-protected polymers as catechol system appeared to stick to GPC column, and the contact angle (CA) shown is the advancing contact angle with water.
- the mole fraction of the molecule having at least one ortho-hydroxyl substitution on a benzene ring, such as dopamine, in the backbone will be a fraction of reactivity ratios. In such embodiments, this fraction will typically be between 0.1 and 0.5.
- PAMs are near 0.47 fraction of the maleimide dopamine (typically between 0.45 and 0.5), although this falls to around 0.3 (typically 0.25 to 0.35) in the case of methacrylates.
- a polymeric adhesive is formed using JEFFAMINE® D230 polyetheramine as the amine component (curing agent) in a DGEBA-based epoxy.
- D230 (12.23 g, 0.053 mmol, 1.00 equiv) was added to a 60 mL jar containing DGEBA (37.77 g, 0.106 mmol, 2.00 equiv) at 35° C. After stirring for 5-10 min, the resulting solution was degassed for 10 min at ⁇ 80 kPa and 35° C.
- FIG. 4 B an additive (here, a dopamine residue where R is a hydroxyl group) was identified and mixed into the amine component, forming the improved polymeric adhesive.
- R was selected to form methoxy, methyl, and fluorinated analogs.
- FIGS. 5 A and 5 B even very small amounts of the adhesive modifier can significantly improve the adhesive properties of an adhesive.
- various adhesive modifiers were tested on aluminum substrates for lap shear (ASTM D1002 10) performance in dry conditions as a function of additive loading in the formulation (normalized to the maleimide-catechol content).
- FIG. 5 B the same adhesive modifiers were tested after the lap shear specimens have been conditioned under the hot-wet environment, so-called because the specimens were maintained for two weeks submerged in water at 60° C. As can be seen in both figures, there is significant performance gains even from very low levels of adhesive modifier.
- the adhesive modifier is present in the total formulation mass in an amount less than about 2% by weight, preferably less than about 1.5% by weight, more preferably less than about 1% by weight, and still more preferably less than about 0.6% by weight. In certain embodiments, the adhesive modifier is present in an amount between about 0.1% and 0.6% by weight.
- a series of synthetic catechol-containing polymers have been prepared, and used as a modifier to a model epoxy adhesive formulation.
- the modified epoxy in the above example has shown about a 50% improvement in lap shear strength for minimally prepared alumina substrates over the baseline epoxy, and a nearly 60% improvement for specimens maintained in “hot-wet” conditions.
- the performance of the modified epoxy on the bare alumina substrate is comparable to a substrate prepared with reactive alkoxy silane (aminopropyltriethoxy silane, APTES), which is the industry standard.
- APTES reactive alkoxy silane
- This improved adhesive performance can allow for increased fabrication throughput (due to, e.g., reduced surface preparation times), improved composite repair, and improved performance in hot-wet conditions.
- FIG. 6 An example method ( 600 ) is depicted in FIG. 6 . There, once the adhesive with the adhesive modifier is provided ( 610 ), it is applied to a first untreated surface ( 620 ). The first surface is then adhered to a second untreated surface ( 630 ) and this is then allowed to cure ( 640 ) as appropriate for the adhesive in question.
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Abstract
Description
- This application claims priority to and the benefit of U.S. Provisional Application 62/546,645 titled “ADMIXED MODIFIERS FOR ADHESIVES FOR IMPROVED INTERFACIAL ADHESION TO UNPRIMED SUBSTRATES” filed on Aug. 17, 2017. The entirety of, including all attachments filed with U.S. Provisional Application 62/546,645, which is hereby incorporated by reference herein.
- The invention described herein may be manufactured, used, and/or licensed by or for the United States Government.
- All adhesives eventually delaminate from targeted substrates, and environmental conditions play a major role in determining the time before delamination occurs. This delamination is accelerated by extreme climatic environments (e.g. hot/wet conditions).
- Traditionally, combating this delamination is accomplished by applying a surface primer on the targeted substrates before adhesive application. This requires significantly increased processing times.
- Thus, a technique for improving adhesion to unprimed substrates, that does not require significantly increased processing times, is desirable.
- The present invention is drawn to a method for improving interfacial adhesion of an adhesive to unprimed substrates. In particular the method is drawn towards the use of adhesive modifiers with particular characteristics with the adhesive to improve adhesion without requiring priming a substrate's surface.
- Disclosed is a method for improving interfacial adhesion of an adhesive to unprimed substrates, involving admixing an adhesive with an adhesive modifier, where the modifier is at least partially soluble in at least one component of the adhesive formulation and includes either a non-aromatic polyol with a number of alcohols of 2 or greater or a molecule having at least one ortho-hydroxyl substitution on a benzene ring.
- Advantageously, the adhesive may be an epoxy (for example a diglycidyl ether of Bisphenol-A (DGEBA)-based resin), an acrylate-based adhesive, a thermoplastic elastomer (TPE), or a thermoplastic urethane or ureas (TPU).
- Also advantageously, the adhesive modifier may include a dopamine, a maleimide-dopamine monomer, tris, or a derivative thereof.
- It is further advantageous when the adhesive modifier is a copolymer of a monomer having an ortho-hydroxyl substitution on a benzene ring, such as a maleimide-dopamine monomer or derivative, and an acrylate monomer, such as an acrylate with a branched or straight alkyl side chain of between 1 and 12 carbons. In particular, it is advantageous when the copolymer is a polymeric acrylate-maleimide or derivative thereof.
- It may be advantageous for copolymers where the mole fraction of the monomer having an ortho-hydroxyl substitution on a benzene ring in the copolymer is between 0.1 and 0.5. It is also advantageous for the adhesive modifier to be present in the total formulation mass in an amount less than 0.5% by weight, and when present in a two-part epoxy including a curing agent, for the adhesive modifier to be mixed into the curing agent.
- Further disclosed is an improved adhesive, which includes a baseline adhesive formulation and an adhesive modifier present in an amount less than 2% by weight of the total weight of the improved adhesive, where the adhesive modifier utilizes a copolymer of a monomer having an ortho-hydroxyl substitution on a benzene ring and an acrylate monomer.
- Advantageously, the monomer having an ortho-hydroxyl substitution on a benzene ring may be a dopamine monomer, a maleimide-dopamine monomer, or a derivative thereof.
- Also advantageously, the acrylate monomer may be a branched or straight alkyl side chain of between 1 and 12 carbons.
- It may be advantageous for the mole fraction of the monomer having an ortho-hydroxyl substitution on a benzene ring in the copolymer to be between 0.1 and 0.5.
- It is also advantageous that the baseline adhesive may be selected from the group consisting of an epoxy, an acrylate-based adhesive (to also include methacrylates, more broadly alkyl-acrylates, cyanoacrylates, hydroxyl-ethyl methacrylates, etc.), a thermoplastic elastomers (TPE), and a thermoplastic urethane or urea (TPU).
- It is further advantageous that the adhesive modifier may be present in an amount less than 2% by weight of the total weight of the improved adhesive, and more advantageous when it is present in an amount less than 1.0% by weight of the total weight of the improved adhesive, and still more advantageous when it is present in an amount between 0.1% and 0.6% by weight of the total weight of the improved adhesive.
-
FIG. 1 is a flowchart describing a method for producing an improved adhesive. -
FIGS. 2A-2C are molecular structures of various adhesive modifiers that can be utilized in the present invention. -
FIGS. 3A-3D are embodiments of a method for producing an adhesive modifier. -
FIG. 4A is an example reaction forming a polymeric adhesive. -
FIG. 4B is an example reaction forming an improved polymeric adhesive utilizing one embodiment of a small molecule additive. -
FIG. 5A is a graph showing lap-shear performance of adhesives varying with increasing concentrations of various adhesive modifiers under dry conditions. -
FIG. 5B is a graph showing lap-shear performance of adhesives varying with increasing concentrations of various adhesive modifiers under hot/wet conditions. -
FIG. 6 is a flowchart describing a method for utilizing the improved adhesive. - The embodiments of the invention and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and detailed in the following description. It should be noted that the features illustrated in the drawings are not necessarily drawn to scale. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments of the invention. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments of the invention may be practiced and to further enable those skilled in the art to practice the embodiments of the invention. Accordingly, the examples should not be construed as limiting the scope of the embodiments of the invention.
- The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the full scope of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term “about” as used herein refers to values±5%, so “about 0.5%” would include values greater than or equal to 0.475% and less than or equal to 0.525%.
- Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
- The present invention is drawn to an adhesive having an improved interfacial adhesion to unprimed substrates.
- Referring to
FIG. 1 , the method (100) begins by providing (110) at least one adhesive and an adhesive modifier. - There is generally no limitation on the adhesive that may be employed. In various embodiments the adhesive may be an epoxy, including but not limited to those having a diglycidyl ether of Bisphenol-A (DGEBA)-based resin. In other embodiments, the adhesive may utilize an acrylate-based adhesive, a thermoplastic elastomer (TPE), or a thermoplastic urethane or ureas (TPU).
- The adhesive modifier must be at least partially soluble in the adhesive. Further, the adhesive modifier should include a non-aromatic polyol or a molecule having at least one ortho-hydroxyl substitution on a benzene ring.
- In certain embodiments of where the adhesive modifier includes a non-aromatic polyol, the polyol contains a primary amine. In other embodiments, the polyol contains between 2 and 4 hydroxyl groups. And in still more preferred embodiments, the polyol is tris.
- Structures of various non-limiting embodiments of molecules having at least one ortho-hydroxyl substitution on a benzene ring that can be used as adhesive modifiers can be seen in
FIGS. 2A-2C . InFIG. 2A , the modifiers include dopamine (202) (“dopa”) and a dimethyl analog to dopa (201), 2-(3,4-Dimethylphenyl)ethanaminne (“M-control”). InFIG. 2B , the modifiers include maleimnide-dopamine (203) (“maleimide” inFIGS. 5A and 5B ) and tris (204).FIG. 2C shows several polymeric adhesive modifiers, based on polymeric acrylate-maleimides (PAMs), that incorporate the maleimide-catechol residue or analog in a copolymer with acrylates with varying length of alkyl side chain. A variant using a methyl group and the dopamine analog residue (205) (“P-control”) is shown alongside dopamine residue variants with methyl (206) (“P-methyl”) and hexyl (207) (“P-hexyl”) groups. A more generic structure is also shown (208) where R1 is a branched or straight alkyl side chain of between 1 and 12 carbons, typically a methyl, ethyl, butyl, hexyl, or 2-ethylhexyl, and R2 is typically either a methyl, hydroxyl, or methoxy group, or a fluorine. In preferred embodiments, R2 is a hydroxyl group. Other polymeric structures are also envisioned. - In embodiments using acrylates, some non-limiting examples of the polymerizable acrylate monomers which may be used include acrylic acid, methacrylic acid; alkyl acrylates (e.g., methyl acrylate, ethyl acrylate, etc.); cycloaliphatic acrylates (e.g. isobornyl acrylate); typical alkyl methacrylates (e.g., methyl methacrylate, butyl methacrylate); functional methacrylates (e.g., acrylic acid, hydroxy-ethyl methacrylate (HEMA)); cycloaliphatic methacrylates (e.g., cyclohexyl methacrylate; iso-bornyl methacrylate); aryl methacrylates (e.g., phenyl methacrylate; benzyl methacrylate; bisphenol dimethacrylates); functional methacrylates (e.g., 2-hydroxyethyl methacrylate; 4-methacryloxyethoxybenzaldehyde; 4-methacryloxyethoxybenzoic acid); ethylene glycol dimethacrylate; diethylene glycol dimethacrylate; triethylene glycol dimethacrylate; tetraethylene glycol dimethacrylate; polyethylene glycol and polypropylene glycol dimethacrylates; ethoxylated and propoxylated bisphenol dimethacrylates; neopentyl glycol dimethacrylate; trimethylolpropane trimethacrylate; 1,6-hexanediol-, 1,10-decanediol and 1,4-cyclohexanediol dimethacrylates; pentaerythritol tetramethacrylate; 1,10-decamethylene dimethacrylate; 1H, 1H-pentadecafluoroctyl methacrylate; 2,2-bis[p-(2′-hydroxy-3-methacryloxypropoxy)phenyl]propane, i.e. bis-GMA; and various nonhydroxylated homologs of bis-GMA e.g. 2,2-bis[p-(2′-methacryloxyethoxy)phenyl]propane; various diurethane dimethacrylates (e.g., the diadduct of 2-hydroxyethyl methacrylate and trimethylhexamethylene diisocyanate), oligomeric urethanes with multifunctional methacrylate groups (e.g. urethane derivatives of bis-GMA and aliphatic and cycloaliphatic diisocyanates), and other prepolymer types of monomers (e.g., siloxane multifunctional methacrylates; polyfluorinated oligomeric multifunctional methacrylates) and the like. Mixtures of the above and other acrylate monomers or other copolymerizable monomers (such as any vinyl monomer capable of free radical polymerization, e.g., styrene, α-methylstyrene, vinyl biphenyl, vinyl acetate, pentafluorostyrene, and similar olefinic monomers) also may be used.
- One example method for producing such a structure is illustrated in
FIG. 3A-3D . Initially, the maleimide intermediate component (FIG. 3A , Reference “1”) is produced (FIG. 3A ) by reacting maleimide in the presence of methylchloroformate and triethylamine (TEA). Separately, the dopamine intermediate component is protected by trialkyl silanes (FIG. 3B , Reference “2”) is produced by reacting dopamine hydrochloride in the presence of imidazole and triethylchlorosilane. These two intermediate components are then reacted in the presence of TEA and heat to generate a maleimide-dopamine protected by trialkylsilanes (FIG. 3C , Reference “M1”). - As shown in
FIG. 3D , that intermediate is then copolymerized with an alkyl acrylate using azobisisobutyronitrile (AIBN). Since the unprotected catechol is a free radical scavenger, the phenols of monomer 1 (M1) shown inFIG. 3D were silane protected to allow for radical propagation. After the polymer was isolated, the protecting groups were removed via addition of small amounts of concentrated hydrochloric acid. While catechol surface binding, adhesion, and the formation of metal-catechol complexes have shown dependence on pH, this relationship is very much dependent on the local media and substrate surface energies. Under the conditions reported here, if the various PAMs were left in an acidic environment they discolored (oxidized) after a week. To remove excess acid after the deprotection, the PAMs were precipitated into water from THF three times. The pH of the precipitate solution was measured to ensure a range between 6-7. After precipitation into water, the PAMs were dried under vacuum (0.17 Torr) for a minimum of five (5) hours to afford off white powders in good to moderate yields. - Still referencing
FIG. 3D , using a free radical polymerization route with a 1:1 acrylate to maleimide monomer (1) feed ratio allowed for approximate sequence and composition control of the PAMs. Due to the free radical copolymerization reactivity ratios of similar acrylates and maleimide monomers, it was expected that the sequence should be alternating with the acrylates (x) having a mildly higher affinity to polymerize with themselves (e.g. xyxy and xxyxxy). Although there are reports that maleimide-based monomers (y) can homopolymerize under select conditions, the propensity to alternate reaction with the acrylates was preferred. Thus, adjacent catechols in the resulting backbone sequence should be minimized. This is reflected in the final polymer repeat unit stoichiometry x: y ratios (53:47) observed via 1H NMR as the percentage of maleimide is consistent (within 3%) for this class of PAMs. The catechol spacing, along with the two carbon linker from the succinimide nitrogen, is similar in connectivity to the naturally occurring Dopa residue, and should provide sufficient free volume for potential catechol interaction when adsorbed onto a surface. Also, the mechanics of the polymers should be similar as the Mn for the silyl-protected PAMs are all above 100 kDa, which exceeds the molecular weight of entanglement for acrylates (see Table, below). - In the table below, yields are of deprotected polymers over two steps. Mn and PDIs were taken of silyl-protected polymers as catechol system appeared to stick to GPC column, and the contact angle (CA) shown is the advancing contact angle with water.
-
R Yield Mn (kDa) PDI CA Methyl 67% 144 2.55 60.2 ± 1.6 Ethyl 88% 136 3.80 63.1 ± 1.7 Butyl 93% 134 3.85 70.8 ± 0.9 Hexyl 73% 118 3.27 88.9 ± 2.1 2-Ethylhexyl 69% 124 2.24 93.8 ± 2.6 - In some embodiments, such as for acrylates or methacrylates, the mole fraction of the molecule having at least one ortho-hydroxyl substitution on a benzene ring, such as dopamine, in the backbone will be a fraction of reactivity ratios. In such embodiments, this fraction will typically be between 0.1 and 0.5. For example, preferably embodiments of PAMs are near 0.47 fraction of the maleimide dopamine (typically between 0.45 and 0.5), although this falls to around 0.3 (typically 0.25 to 0.35) in the case of methacrylates.
- Once the adhesive and adhesive modifier is provided, the adhesive modifier is mixed into the adhesive. Referring to
FIGS. 4A and 4B , an example of this is shown. InFIG. 4A , a polymeric adhesive is formed using JEFFAMINE® D230 polyetheramine as the amine component (curing agent) in a DGEBA-based epoxy. In one example, D230 (12.23 g, 0.053 mmol, 1.00 equiv) was added to a 60 mL jar containing DGEBA (37.77 g, 0.106 mmol, 2.00 equiv) at 35° C. After stirring for 5-10 min, the resulting solution was degassed for 10 min at −80 kPa and 35° C. in a vacuum oven (Yamato ADP 200C). At atmospheric pressure, the solution was heated at 35° C. for 2.3 h and then 40° C. for 1 h. The transparent, colorless, and viscous solution was allowed to reach room temperature over 0.5 h. InFIG. 4B , an additive (here, a dopamine residue where R is a hydroxyl group) was identified and mixed into the amine component, forming the improved polymeric adhesive. Other embodiments, where R was selected to form methoxy, methyl, and fluorinated analogs were also utilized. - As shown in
FIGS. 5A and 5B , even very small amounts of the adhesive modifier can significantly improve the adhesive properties of an adhesive. InFIG. 5A , various adhesive modifiers were tested on aluminum substrates for lap shear (ASTM D1002 10) performance in dry conditions as a function of additive loading in the formulation (normalized to the maleimide-catechol content). InFIG. 5B , the same adhesive modifiers were tested after the lap shear specimens have been conditioned under the hot-wet environment, so-called because the specimens were maintained for two weeks submerged in water at 60° C. As can be seen in both figures, there is significant performance gains even from very low levels of adhesive modifier. For example, a maximum lap shear strength in both cases can be seen with 0.28 wt % of the PAM having a methyl residue (SeeFIG. 2C , Reference 206). Other variants similarly show improved performance even at levels of the adhesive modifier between 0.1 wt % and 1.0 wt %. In certain embodiments, the adhesive modifier is present in the total formulation mass in an amount less than about 2% by weight, preferably less than about 1.5% by weight, more preferably less than about 1% by weight, and still more preferably less than about 0.6% by weight. In certain embodiments, the adhesive modifier is present in an amount between about 0.1% and 0.6% by weight. - As shown, a series of synthetic catechol-containing polymers have been prepared, and used as a modifier to a model epoxy adhesive formulation. The modified epoxy in the above example has shown about a 50% improvement in lap shear strength for minimally prepared alumina substrates over the baseline epoxy, and a nearly 60% improvement for specimens maintained in “hot-wet” conditions. The performance of the modified epoxy on the bare alumina substrate is comparable to a substrate prepared with reactive alkoxy silane (aminopropyltriethoxy silane, APTES), which is the industry standard.
- This improved adhesive performance can allow for increased fabrication throughput (due to, e.g., reduced surface preparation times), improved composite repair, and improved performance in hot-wet conditions.
- Extensive characterization of polydopamine-alkylsilane surface treatments used to modify epoxy bonding to alumina substrates can be found in “Synthesis and Characterization of Aminopropyltriethoxysilane-Polydopamine Coatings,” by Knorr, D. B., Jr.; Tran, N. T.; Gaskell, K. J.; Orlicki, J. A.; Woicik, J. C.; Jaye, C.; Fischer, D. A.; Lenhart, J. L. (Langmuir, 32, 2016, 4370-4381) and “Polydopamine and Polydopamine-Silane Hybrid Surface Treatments in Structural Adhesive Applications,” by Tran, N. T.; Flanagan, D. P.; Orlicki, J. A.; Lenhart, J. L.; Proctor, K. L.; Knorr, D. B., Jr. (Langmuir, 34, 2018, 1274-1286), which are both hereby incorporated by reference. Details of the poly(acrylate-maleimide) polymer synthesis and characterization can be found in “Side chain length impacting thermal transitions and water uptake of acrylate-maleimide copolymers with pendent catechols,” by Bartucci, M. A.; Napadensky, E.; Lenhart, J. L.; Orlicki, J. A. (RSC Adv., 7, 2017, 49114-49118), which is hereby incorporated by reference.
- One of skill in the art would recognize that these improved adhesives can be used in a variety of fields, including but not limited to Sporting goods, Automotive assembly, electronic assembly, marine applications, furniture assembly, footwear assembly, and residential and commercial construction applications.
- An example method (600) is depicted in
FIG. 6 . There, once the adhesive with the adhesive modifier is provided (610), it is applied to a first untreated surface (620). The first surface is then adhered to a second untreated surface (630) and this is then allowed to cure (640) as appropriate for the adhesive in question. - It should be emphasized that the above-described embodiments are merely possible examples of implementations. Many variations and modifications may be made to the above-described embodiments. All such modifications and variations are intended to be included herein within the scope of the disclosure and protected by the following claims. Obviously, many modifications and variations of the present invention are possible in light of the above teachings.
- All references listed herein are also part of the application and are incorporated by reference in their entirety as if fully set forth herein.
Claims (19)
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US18/228,174 US20240002708A1 (en) | 2017-08-17 | 2023-07-31 | Admixed modifiers for adhesives |
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US201762546645P | 2017-08-17 | 2017-08-17 | |
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US17/378,336 US20210340415A1 (en) | 2017-08-17 | 2021-07-16 | Admixed modifiers for adhesives |
US18/228,174 US20240002708A1 (en) | 2017-08-17 | 2023-07-31 | Admixed modifiers for adhesives |
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US11471797B2 (en) | 2019-04-26 | 2022-10-18 | Access Business Group International Llc | Water treatment system |
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DE10027206A1 (en) * | 2000-05-31 | 2001-12-13 | Osram Opto Semiconductors Gmbh | Age-stable epoxy resin systems, molded materials and components made from them and their use |
US7745006B2 (en) * | 2006-12-15 | 2010-06-29 | Ashland Licensing And Intellectual Property, Llc | Low odor, fast cure, toughened epoxy adhesive |
KR100872359B1 (en) * | 2006-12-19 | 2008-12-05 | 제일모직주식회사 | Thermosetting resin composition, color filter using the composition, and liquid crystal display and image sensor using the color filter |
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US9283298B2 (en) * | 2013-09-25 | 2016-03-15 | Clemson University | Compliant surgical adhesive |
CN104388029B (en) * | 2014-12-03 | 2016-08-03 | 湖南皓志科技股份有限公司 | A kind of normal-temperature curing epoxy resin flexibility casting glue |
US10513641B2 (en) * | 2015-06-30 | 2019-12-24 | Purdue Research Foundation | Adhesives and methods of making the same |
CN106634756A (en) * | 2017-01-04 | 2017-05-10 | 濮阳惠成电子材料股份有限公司 | Two-component LED pouring sealant |
US11130886B2 (en) * | 2017-12-31 | 2021-09-28 | Purdue Research Foundation | Adhesives |
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US20210340415A1 (en) | 2021-11-04 |
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