US20230415920A1 - Systems and methods for joining a first structure and a second structure with a choreographed adhesive de-aeration process - Google Patents
Systems and methods for joining a first structure and a second structure with a choreographed adhesive de-aeration process Download PDFInfo
- Publication number
- US20230415920A1 US20230415920A1 US18/463,575 US202318463575A US2023415920A1 US 20230415920 A1 US20230415920 A1 US 20230415920A1 US 202318463575 A US202318463575 A US 202318463575A US 2023415920 A1 US2023415920 A1 US 2023415920A1
- Authority
- US
- United States
- Prior art keywords
- adhesive
- collapsible
- standoff
- bond
- bond cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64F—GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLY ADAPTED FOR USE IN CONNECTION WITH AIRCRAFT; DESIGNING, MANUFACTURING, ASSEMBLING, CLEANING, MAINTAINING OR REPAIRING AIRCRAFT, NOT OTHERWISE PROVIDED FOR; HANDLING, TRANSPORTING, TESTING OR INSPECTING AIRCRAFT COMPONENTS, NOT OTHERWISE PROVIDED FOR
- B64F5/00—Designing, manufacturing, assembling, cleaning, maintaining or repairing aircraft, not otherwise provided for; Handling, transporting, testing or inspecting aircraft components, not otherwise provided for
- B64F5/10—Manufacturing or assembling aircraft, e.g. jigs therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4835—Heat curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
- B29C65/5007—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the structure of said adhesive tape, threads or the like
- B29C65/5021—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the structure of said adhesive tape, threads or the like being multi-layered
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
- B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
- B29C65/544—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by suction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
- B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
- B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
- B29C65/7826—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being non-integral with the parts to be joined, e.g. particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7841—Holding or clamping means for handling purposes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/001—Joining in special atmospheres
- B29C66/0012—Joining in special atmospheres characterised by the type of environment
- B29C66/0014—Gaseous environments
- B29C66/00145—Vacuum, e.g. partial vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
- B29C66/124—Tongue and groove joints
- B29C66/1244—Tongue and groove joints characterised by the male part, i.e. the part comprising the tongue
- B29C66/12441—Tongue and groove joints characterised by the male part, i.e. the part comprising the tongue being a single wall
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
- B29C66/124—Tongue and groove joints
- B29C66/1246—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove
- B29C66/12461—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being rounded, i.e. U-shaped or C-shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/342—Preventing air-inclusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/532—Joining single elements to the wall of tubular articles, hollow articles or bars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/61—Joining from or joining on the inside
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/721—Fibre-reinforced materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8145—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/81455—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps being a fluid inflatable bag or bladder, a diaphragm or a vacuum bag for applying isostatic pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/10—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using hot gases (e.g. combustion gases) or flames coming in contact with at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3076—Aircrafts
- B29L2031/3082—Fuselages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3076—Aircrafts
- B29L2031/3085—Wings
Definitions
- bonds for large or complex structures involve resin transfer molding, high tolerance film adhesive, or costly co-cure methods.
- paste bonds such as those that may be used in pi joints and single shear joints in aircraft, utilize adhesive injection approaches that can create bondlines between the bonded members that have some voids and variation in strength, and accordingly, may be rated with a lower performance capability.
- a method of joining a first structure and a second structure comprises placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
- a bondline joining a first structure and a second structure made by a process comprising placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the evacuated bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure and to form the bondline joining the first structure and the second structure.
- FIG. 2 illustrates the system with a portion of a wing skin coupled or bonded to the spars, the wing ribs, and the longerons, according to an example implementation.
- FIGS. 3 A- 3 F illustrate an example process to join a first structure to a second structure in a single-shear configuration, according to an example implementation.
- FIGS. 6 A- 6 G illustrate an example process to join the first structure to the second structure in a dual-shear configuration, according to an example implementation.
- FIGS. 7 A- 7 F illustrate another example process to join the first structure to the second structure, according to an example implementation.
- FIG. 8 illustrates a flowchart of an example of a method of joining a first structure and a second structure, according to an example implementation.
- FIG. 9 illustrates a flowchart of functions for use with the method shown in FIG. 8 , according to an example implementation.
- FIG. 11 illustrates a flowchart of functions for use with the method shown in FIG. 8 , according to an example implementation.
- FIG. 18 illustrates a flowchart of additional functions for use with the method shown in FIG. 8 , according to an example implementation.
- FIG. 19 illustrates a flowchart of additional functions for use with the method shown in FIG. 8 , according to an example implementation.
- Example systems and methods involve joining a first structure and a second structure to create a void-free bondline between the first structure and the second structure.
- An example method includes placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
- collapsible stand-offs are used to maintain gap fill widths for adhesive insertion between the first structure and the second structure.
- the collapsible standoffs then collapse at designated temperature and/or pressure combinations to force out entrapped air that may otherwise create a void.
- the collapsible stand-offs may control bondline thickness during a curing process and reduce gas entrapment to improve bondline quality.
- FIG. 2 illustrates the system 100 with a portion of a wing skin 116 coupled or bonded to the spars 106 , the wing ribs 110 , and the longerons 112 , according to an example implementation.
- the wing skin 116 is formed to a component of the wing (e.g., the spars 106 , the wing ribs 110 , and the longerons 112 ).
- FIGS. 3 A- 3 F , FIGS. 5 A- 5 E , FIGS. 6 A- 6 G , and FIGS. 7 A- 7 F illustrate various example phases of joining a first structure to a second structure, according example implementations.
- An example first structure can include a component of the wing 102 of the aircraft 104
- an example second structure can include the wing skin 116 of the wing 102 of the aircraft 104 .
- a bondline is created between the first structure and the second structure.
- the first structure and the second structure can include other components of the wing 102 or other components of the aircraft 104 as well.
- the first structure 120 and the second structure 122 can be a fuselage stringer and fuselage skin. Other examples are possible as well.
- the second structure 122 includes a base 126 and a flange 128 extending perpendicular to the base 126 .
- the first structure 120 is held in place by the fixture(s) (e.g., example fixtures shown in FIG. 4 ) so that the first structure 120 is adjacent to and parallel with the flange 128 .
- the fixture(s) e.g., example fixtures shown in FIG. 4
- a bond cavity 130 is formed between the first structure 120 and the flange 128 .
- the bond cavity 130 is formed between the first structure and the second structure 122 via positioning of the first structure 120 relative to the second structure 122 .
- the adhesive 132 is de-aerated during evacuation of the bond cavity 130 to further enable a voidfree bondline to be created.
- De-aerated adhesive has no air, and thus, no voids or trapped air bubbles will be present.
- the adhesive 132 illustrated in FIGS. 3 A- 3 B includes air bubbles and has not yet been de-aerated. As seen by comparing FIGS. 3 B with 3 C, the evacuation of the bond cavity 130 removes air from the adhesive 132 .
- FIG. 3 D illustrates a cross-sectional view of a subsequent stage in which after deaerating the adhesive 132 , the first structure 120 and the second structure 122 are moved relative to one another such that deaerated adhesive is disposed between the first structure 120 and the second structure 122 .
- the first structure 120 may be moved toward the second structure 122 , which can be stationary.
- the second structure 122 can be moved toward the first structure 120 , which can be stationary.
- both the first structure 120 and the second structure 122 can be moved in a relative manner toward one another.
- FIG. 3 D illustrates the first structure 120 and the second structure 122 moved relative to one another so that each bonding surface 133 / 135 of the first structure 120 and the second structure 122 move toward each other causing the deaerated adhesive 132 to be disposed in the bond cavity 130 between the first structure 120 and the second structure 122 resulting in the deaerated adhesive 132 joining and bonding the first structure 120 to the second structure 122 .
- fixtures (not shown in FIG. 3 D ) move the first structure 120 and the second structure 122 relative to each other so that the deaerated adhesive 132 on each of the first structure 120 and the second structure 122 contacts and forms a bondline.
- the vacuum continuously evacuates the bond cavity 130 .
- the vacuum can be shut off (manually or using an electronic valve).
- FIG. 3 F illustrates a cross-sectional view of a subsequent stage in which the heater 134 is turned off and components are removed from the first structure 120 and the second structure 122 , and any excess adhesive is trimmed at edges resulting in a bondline 148 being formed to join the first structure 120 and the second structure 122 .
- the bondline 148 is a voidfree bondline, for example.
- the fixtures 152 and 154 are shown coupled to the first structure 120 and the second structure 122 using a temporary adhesive 151 .
- the fixture 152 can include a slider rod 153 movable within a translation sleeve 155 to enable movement of the first structure 120 relative to the second structure 122 , for example.
- the system 150 in FIG. 4 can include more or fewer components as well, such as any of the additional components described in FIGS. 3 A- 3 F , for example.
- the second structure 122 includes the base 126 and the flange 128 extending perpendicular to the base 126 .
- the first structure 120 is held in place by the fixture(s) (e.g., example fixtures shown in FIG. 4 ) so that the first structure 120 is adjacent to and parallel with the flange 128 .
- the bond cavity 130 is formed between the first structure 120 and the flange 128 .
- adhesive 132 Prior to positioning of the first structure 120 adjacent to and parallel with the flange 128 of the second structure 122 , adhesive 132 is placed on a surface of the first structure 120 that faces the flange 128 , and adhesive 132 is also placed on a surface of the flange 128 that faces the first structure 120 .
- the collapsible standoffs 156 and 158 are used to control a position of the first structure 120 relative to the second structure 122 , and are inserted between the first structure 120 and the second structure 122 .
- the collapsible standoff 156 is placed in a hole 161 of a surface of the second structure 122 , and the surface of the second structure 122 is configured to move toward the first structure 120 .
- Adhesive 132 can be placed in the hole 161 of the surface of the second structure 122 to bond the collapsible standoff 156 in place.
- collapsible standoffs 156 and 158 are positioned in the adhesive 132 and remain in place on the first structure 120 and the second structure 122 .
- FIG. 5 A Other components shown in FIG. 5 A that are the same as shown in FIGS. 3 A- 3 F are not described again for simplicity and include the heater 134 , the perforated adhesive tape 136 , the semi-permeable breather material 138 , the vacuum bag 140 , the vacuum seal tape 142 , and the vacuum port 144 .
- the first structure 120 and the second structure 122 are moved relative to one another by forcing the first structure 120 against the collapsible standoff 156 to contact the collapsible standoff 156 , and by forcing the second structure 122 against the collapsible standoff 158 to contact the collapsible standoff 158 and cause the adhesive to be positioned between the first structure 120 and the second structure 122 .
- the adhesive 132 is de-aerated during evacuation of the bond cavity 130 to further enable a voidfree bondline to be created.
- De-aerated adhesive has no air, and thus, no voids or trapped air bubbles will be present.
- the collapsible standoffs 156 and 158 collapse at a predetermined temperature due to thermal softening of the collapsible standoffs 156 and 158 to enable a bondline to form between the first structure 120 and the second structure 122 .
- the collapsible standoffs 156 and 158 are structures designed with materials that soften under temperature and pressure combinations, and can be fabricated using additive manufacturing, for example.
- the collapsible standoffs 156 and 158 are a spiral or spring-like configuration, a truss configuration, a hollow column configuration, or a wireframe-like configuration.
- the collapsible standoffs 156 and 158 include guide pin configurations to provide component alignment and merging guidance, and the guide pins may be pressed into pre-drilled holes in the first structure 120 and the second structure 122 with the collapsible standoffs 156 and 158 positioned over the guide pins.
- the collapsible standoffs 156 and 158 include a solenoid in a shoulder bolt to provide guide and controllable collapsibility that is electrically or pneumatically actuated.
- the collapsible standoffs 156 and 158 collapse in a one-dimensional manner while providing alignment and spacing between the first structure 120 and the second structure 122 .
- FIG. 5 D illustrates a cross-sectional view of a subsequent stage in which the heat is applied by the heater 134 and the collapsible standoffs 156 and 158 have been caused to collapse due to heating and thermal softening at a predetermined temperature.
- the bond cavity 130 can be continuously evacuated via the vacuum port 144 drawing the first structure 120 and the second structure 122 toward each other due to vacuum pressure, for example.
- the vacuum pressure also assists with causing the collapse of the collapsible standoffs 156 and 158 .
- heat is applied to achieve a first temperature to cause the collapsible standoffs 156 and 158 to collapse resulting in the first structure 120 and the second structure 122 moving toward each other due to vacuum pressure, and then heat is applied to achieve a second temperature higher than the first temperature to cure the deaerated adhesive 132 and bond the first structure 120 to the second structure 122 .
- the collapsible standoffs 156 and 158 have a melting point of about 170° F. and the adhesive 132 has a cure temperature of about 350° F.
- the collapsible standoffs 156 and 158 soften and collapse after reaching the first temperature of about 170° F., and then the heat is increased to the cure temperature to cure the adhesive 132 .
- FIG. 5 E illustrates a cross-sectional view of a subsequent stage in which the heater 134 is turned off and components are removed from the first structure 120 and the second structure 122 , and any excess adhesive is trimmed at edges resulting in a bondline 148 being formed to join the first structure 120 and the second structure 122 .
- the bondline 148 is a voidfree bondline, for example.
- a thickness of the bondline 148 between the first structure 120 and the second structure 122 is controlled via a residual thickness of the collapsed collapsible standoffs 156 and 158 .
- FIGS. 6 A- 6 G illustrate an example process to join the first structure 120 to the second structure 122 in a dual-shear configuration, according to an example implementation.
- the processes illustrated in FIGS. 6 A- 6 G are similar to those illustrated in FIGS. 3 A- 3 F , however, in the examples in FIGS. 6 A- 6 G , the second structure 122 has two flanges rather than one flange and the first structure 120 is positioned between the two flanges of the second structure 122 .
- the second structure 122 includes the base 126 , the flange 128 extending perpendicular to the base 126 , and the flange 160 also extending perpendicular to the base 126 .
- the first structure 120 is held in place by the fixture(s) (e.g., example fixtures shown in FIG. 4 ) so that the first structure 120 can be positioned into the area between the flange 128 and the flange 160 . With the positioning of the first structure 120 into the area between the flange 128 and the flange 160 , the bond cavity 130 is formed.
- the adhesive 132 Prior to inserting the first structure 120 between the flange 128 and the flange 160 , the adhesive 132 is generally placed on a surface of the first structure 120 that will contact the flange 128 and the flange 160 , and adhesive 132 is also placed on surfaces of the flange 128 and the flange 160 .
- FIG. 6 B illustrates a cross-sectional view of a subsequent stage in which other components are applied including the heater 134 , the semi-permeable breather material 138 , the vacuum bag 140 , the vacuum seal tape 142 , and the vacuum port 144 . These components are the same as shown in FIGS. 3 A- 3 F and are not described again for simplicity. Note that in the example shown in FIG. 6 B , the vacuum bag 140 has semi rigid and flexible portion to enable movement of the parts, and the example includes two heaters (e.g., heaters 134 ) on each side of the second structure 122 .
- the vacuum bag 140 has semi rigid and flexible portion to enable movement of the parts, and the example includes two heaters (e.g., heaters 134 ) on each side of the second structure 122 .
- FIG. 6 C illustrates a cross-sectional view of a subsequent stage in which after positioning the components, the bond cavity 130 is evacuated via the vacuum port 144 to deaerate the bond cavity 130 as well as to deaerate the adhesive 132 within the bond cavity 130 .
- FIG. 6 D illustrates a cross-sectional view of a subsequent stage in which the first structure 120 is moved relative to the second structure 122 after the adhesive 132 has been deaerated, so as to position the first structure 120 between the flange 128 and the flange 160 .
- the bond cavity 130 continues to be evacuated during the movement. Arrows are shown to illustrate air drawn out of the bond cavity 130 and out of the adhesive 132 and through the semi-permeable breather material 138 , and then out through the vacuum port 144 .
- the adhesive 132 is de-aerated during evacuation of the bond cavity 130 to further enable a voidfree bondline to be created. De-aerated adhesive has no air, and thus, no voids or trapped air bubbles will be present.
- the first structure 120 and the second structure 122 are moved relative to one another such that deaerated adhesive is disposed between the first structure 120 and the second structure 122 .
- the first structure 120 may be moved toward the second structure 122 , which can be stationary.
- the second structure 122 can be moved toward the first structure 120 , which can be stationary.
- both the first structure 120 and the second structure 122 can be moved in a relative manner toward one another.
- FIG. 6 E illustrates a cross-sectional view of a subsequent stage in which the first structure 120 is further moved relative to the second structure 122 so as to position the first structure 120 between the flange 128 and the flange 160 , and to contact the spacer 162 at a bottom of the bond cavity 130 .
- the bond cavity 130 is continuously evacuated via the vacuum port 144 while moving the first structure 120 and the second structure 122 relative to one another. It may be beneficial to continue evacuation via the vacuum port 144 to prevent any air from seeping back into the bond cavity 130 .
- FIG. 6 F illustrates a cross-sectional view of a subsequent stage in which the deaerated adhesive 132 disposed between the first structure 120 and the second structure 122 is cured, via the heater 134 , to bond the first structure 120 to the second structure 122 .
- the heater 134 is turned on causing heat to flow through the first structure 120 , the flange 128 , the flange 160 , and the adhesive 132 .
- the heater 134 can include a silicon rubber pad with resistive elements (e.g., flexible wires running through the pad) to provide resistance heating, for example.
- the vacuum continuously evacuates the bond cavity 130 .
- the vacuum can be shut off (manually or using an electronic valve).
- FIG. 6 G illustrates a cross-sectional view of a subsequent stage in which the heater 134 is turned off and components are removed from the first structure 120 and the second structure 122 , and any excess adhesive is trimmed at edges resulting in a bondline 148 being formed to join the first structure 120 and the second structure 122 .
- the bondline 148 is a voidfree bondline, for example.
- FIGS. 7 A- 7 F illustrate another example process to join the first structure 120 to the second structure 122 , according to an example implementation.
- the processes illustrated in FIGS. 7 A- 7 F are similar to those illustrated in FIGS. 6 A- 6 G , however, in the examples in FIGS. 7 A- 7 E , a collapsible standoff 164 is positioned at a bottom of the bond cavity 130 .
- An amount of adhesive 166 is then inserted into the bond cavity 130 on top of the collapsible standoff 164 .
- the adhesive 166 of FIG. 7 A is not de-aerated.
- FIG. 7 B illustrates a cross-sectional view of a subsequent stage in which other components are applied including the heater 134 , the semi-permeable breather material 138 , the vacuum bag 140 , the vacuum seal tape 142 , and the vacuum port 144 . These components are the same as shown in FIGS. 6 A- 6 E and are not described again for simplicity.
- the first structure 120 By moving the first structure 120 into the bond cavity 130 , the first structure 120 contacts the adhesive 166 causing the adhesive to surround the first structure 120 , for example. Further movement of the first structure 120 into the bond cavity 130 causes the adhesive 166 to fill the bond cavity. In addition, capillarity will induce a uniform fill of the bond cavity 130 with the adhesive 166 , for example.
- FIG. 7 E illustrates a cross-sectional view of a subsequent stage in which the deaerated adhesive 166 disposed between the first structure 120 and the second structure 122 is cured, via the heater 134 , to bond the first structure 120 to the second structure 122 .
- the adhesive 166 is illustrated as filling the bond cavity 130 , as mentioned, due to capillarity and movement of the first structure 120 .
- the heater 134 is turned on causing heat to flow through the first structure 120 , the flange 128 , the flange 160 , and the adhesive 166 .
- the heater 134 can include a silicon rubber pad with resistive elements (e.g., flexible wires running through the pad) to provide resistance heating, for example.
- FIG. 7 F illustrates a cross-sectional view of a subsequent stage in which the heater 134 is turned off and components are removed from the first structure 120 and the second structure 122 , and any excess adhesive is trimmed at edges resulting in a bondline 148 being formed to join the first structure 120 and the second structure 122 .
- the bondline 148 is a voidfree bondline, for example.
- a thickness of the bondline 148 between the first structure 120 and the second structure 122 is controlled via a residual thickness of the collapsed collapsible standoff 164 .
- FIG. 8 illustrates a flowchart of an example of a method 200 of joining a first structure 120 and a second structure 122 , according to an example implementation.
- Method 200 shown in FIG. 8 presents an example of a method that could be used with the system 150 or with components of thereof.
- the functions described with respect to FIG. 8 may be supplemented by, replaced by, or combined with functions and phases described above with respect to FIGS. 3 A- 3 F , FIG. 4 , FIGS. 5 A- 5 E , FIGS. 6 A- 6 G , and FIGS. 7 A- 7 F , for example.
- devices or systems may be used or configured to perform logical functions presented in FIG. 8 .
- the method 200 is considered a choreographed adhesive de-aeration process in which stages of the process when performed in order provide a de-aerated adhesive useful to join the first structure 120 and the second structure 122 to form a bondline.
- components of the devices and/or systems may be configured to perform the functions such that the components are actually configured and structured (with hardware and/or software) to enable such performance.
- components of the devices and/or systems may be arranged to be adapted to, capable of, or suited for performing the functions, such as when operated in a specific manner.
- Method 200 includes one or more operations, functions, or actions as illustrated by one or more of blocks 202 - 210 . Further, blocks of FIGS. 9 - 22 may be performed in accordance with one or more of blocks 202 - 210 . Although the blocks are illustrated in a sequential order, these blocks may also be performed in parallel, and/or in a different order than those described herein. Also, the various blocks may be combined into fewer blocks, divided into additional blocks, and/or removed based upon the desired implementation.
- one or more blocks of the method 200 may be represented in program code or circuitry used for controlling robotic mechanisms for joining the first structure and the second structure (e.g., as for assembling a bonded structure and/or a wing including a plurality of bonded structures). While method 200 and variations thereof may be executed automatically using, for example, one or more robotic armatures controlled by program code operating in accordance with the method 200 , some tasks may be performed manually. Thus, within examples, certain functionality described with respect to the method 200 may be performed automatically while other portions can be performed manually. Alternatively, all blocks of the method 200 may be performed automatically or all blocks of the method 200 may be performed manually.
- the method 200 includes evacuating the bond cavity 130 via the vacuum port 144 to deaerate the adhesive 132 within the bond cavity 130 .
- the method 200 includes after deaerating the adhesive 132 , moving the first structure 120 and the second structure 122 relative to one another such that deaerated adhesive is disposed between the first structure 120 and the second structure 122 .
- FIG. 11 illustrates a flowchart of functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 11 illustrates block 216 , which includes an example function for moving the first structure 120 and the second structure 122 relative to one another including moving the first structure 120 and the second structure 122 so that each bonding surface of the first structure 120 and the second structure 122 move toward each other.
- FIG. 12 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 12 illustrates block 218 , which includes an example function for forming the bond cavity 130 between the first structure 120 and the second structure 122 via positioning of the first structure 120 relative to the second structure 122 .
- FIG. 13 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 13 illustrates block 220 , which includes an example function for moving the first structure 120 and the second structure 122 relative to one another causing the deaerated adhesive to be disposed in the bond cavity 130 between the first structure 120 and the second structure 122 .
- FIG. 14 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 14 illustrates block 222 , which includes an example function for inserting a spacer 162 into a bottom area of the bond cavity 130 to control bondline thickness.
- FIG. 15 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 15 illustrates block 224 , which includes an example function for inserting a collapsible standoff 164 into a bottom area of the bond cavity 130 to control a distance of distribution of the adhesive 132 into the bond cavity 130 based on temperature, and the collapsible standoff 164 collapses at a predetermined temperature.
- FIG. 16 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 16 illustrates block 226 , which includes an example function for placing the semi-permeable breather material 138 at the one or more exits 137 of the bond cavity 130 .
- FIG. 17 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 17 illustrates block 228 , which includes an example function for continuously evacuating the bond cavity 130 via the vacuum port 144 while moving the first structure 120 and the second structure 122 relative to one another.
- FIG. 18 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 18 illustrates block 230 , which includes an example function for controlling a position of the first structure 120 relative to the second structure 122 via a collapsible standoff 156 / 158 / 164 , and the collapsible standoff 156 / 158 / 164 collapses at a predetermined temperature due to thermal softening of the collapsible standoff 156 / 158 / 164 .
- FIG. 19 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 19 illustrates block 232 , which includes an example function for controlling a thickness of a bondline between the first structure 120 and the second structure 122 via a residual thickness of a collapsed collapsible standoff 156 / 158 / 164 .
- FIG. 20 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 20 illustrates blocks 234 , 236 , and 238 .
- an example function includes placing a collapsible standoff 156 in a hole 161 of a surface of the second structure 122 , and the surface of the second structure 122 is configured to move toward the first structure 120 .
- an example function includes placing the adhesive 132 in the hole 161 of the surface of the second structure 122 .
- an example function includes forcing the first structure 120 against the collapsible standoff 156 to contact the collapsible standoff 156 and force the adhesive 132 to flow between the first structure 120 and the second structure 122 .
- FIG. 21 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 21 illustrates blocks 240 and 242 .
- an example function includes while curing the deaerated adhesive disposed between the first structure 120 and the second structure 122 to bond the first structure 120 to the second structure 122 , causing the collapsible standoff 156 to collapse due to heating and thermal softening at a predetermined temperature
- an example function includes continuously evacuating the bond cavity via the vacuum port 144 drawing the first structure 120 and the second structure 122 toward each other.
- FIG. 22 illustrates a flowchart of additional functions for use with the method 200 shown in FIG. 8 , according to an example implementation.
- FIG. 22 illustrates blocks 244 , 246 , and 248 .
- an example function includes placing a collapsible standoff 156 / 158 between the first structure 120 and the second structure 122 to control a position of the first structure 120 relative to the second structure 122 , and the collapsible standoff 156 / 158 collapses at a predetermined temperature due to thermal softening.
- an example function includes applying heat to achieve a first temperature to cause the collapsible standoff 156 / 158 to collapse resulting in the first structure 120 and the second structure 122 moving toward each other due to vacuum pressure.
- an example function includes applying heat to achieve a second temperature higher than the first temperature to cure the deaerated adhesive and bond the first structure 120 to the second structure 122 .
- example methods and systems described herein can enable creation of bonded structures that have improved strength and higher quality.
- the example methods and systems described herein can enable creation of voidfree bondlines in pi joints and single shear joints in aircraft. This results from adhesive being de-aerated within the bond cavity so that no or reduced voids are included in the resulting bondline.
- system(s), device(s), and method(s) disclosed herein include a variety of components, features, and functionalities. It should be understood that the various examples of the system(s), device(s), and method(s) disclosed herein may include any of the components, features, and functionalities of any of the other examples of the system(s), device(s), and method(s) disclosed herein in any combination or any sub-combination, and all of such possibilities are intended to be within the scope of the disclosure.
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Abstract
An example method of joining a first structure and a second structure is described that includes placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
Description
- The present disclosure is a divisional of and claims priority to U.S. application Ser. No. 17/502,270, filed on Oct. 15, 2021, which claims priority to U.S. Provisional Application No. 63/126,626, filed on Dec. 17, 2020, the entire contents of each of which are herein incorporated by reference.
- The present disclosure relates generally to forming a bonded structure. In particular, the present disclosure relates to reducing voids in bondlines between a first structure and a second structure and forming a void free bondline.
- Components used in vehicles, such as wings used in aircraft, include several bonded members. For example, exterior surfaces of a wing, and the structures used to provide support for those surfaces, may be constructed in a bonded manner using adhesives to create bondelines.
- Currently, bonds for large or complex structures involve resin transfer molding, high tolerance film adhesive, or costly co-cure methods. Further, currently, paste bonds such as those that may be used in pi joints and single shear joints in aircraft, utilize adhesive injection approaches that can create bondlines between the bonded members that have some voids and variation in strength, and accordingly, may be rated with a lower performance capability.
- As such, there is a desire for an improved bonding method to produce higher quality bonds in a low cost manner.
- In an example, a method of joining a first structure and a second structure is described. The method comprises placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
- In another example, a bondline joining a first structure and a second structure is described made by a process comprising placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the evacuated bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure and to form the bondline joining the first structure and the second structure.
- In another example, a system for joining a first structure and a second structure is described. The system comprises one or more fixtures forming a bond cavity between a first structure and a second structure via positioning of the first structure relative to the second structure and to cause movement of the first structure and the second structure relative to one another, a vacuum bag to secure the first structure and the second structure by surrounding a portion of the first structure and the second structure, a vacuum port coupled to the vacuum bag for evacuating the bond cavity to deaerate an adhesive within the bond cavity such that deaerated adhesive is disposed between the first structure and the second structure, and one or more heaters for curing the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
- The features, functions, and advantages that have been discussed can be achieved independently in various examples or may be combined in yet other examples. Further details of the examples can be seen with reference to the following description and drawings.
- The novel features believed characteristic of the illustrative examples are set forth in the appended claims. The illustrative examples, however, as well as a preferred mode of use, further objectives and descriptions thereof, will best be understood by reference to the following detailed description of an illustrative example of the present disclosure when read in conjunction with the accompanying drawings, wherein:
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FIG. 1A illustrates a system for forming a bonded wing of an aircraft, according to an example implementation. -
FIG. 1B illustrates an example of the aircraft including the bonded wing, according to an example implementation. -
FIG. 2 illustrates the system with a portion of a wing skin coupled or bonded to the spars, the wing ribs, and the longerons, according to an example implementation. -
FIGS. 3A-3F illustrate an example process to join a first structure to a second structure in a single-shear configuration, according to an example implementation. -
FIG. 4 illustrates an example of a system for joining the first structure and the second structure, according to an example implementation. -
FIGS. 5A-5E illustrate another example process to join the first structure to the second structure, according to an example implementation. -
FIGS. 6A-6G illustrate an example process to join the first structure to the second structure in a dual-shear configuration, according to an example implementation. -
FIGS. 7A-7F illustrate another example process to join the first structure to the second structure, according to an example implementation. -
FIG. 8 illustrates a flowchart of an example of a method of joining a first structure and a second structure, according to an example implementation. -
FIG. 9 illustrates a flowchart of functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 10 illustrates a flowchart of functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 11 illustrates a flowchart of functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 12 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 13 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 14 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 15 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 16 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 17 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 18 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 19 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 20 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 21 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. -
FIG. 22 illustrates a flowchart of additional functions for use with the method shown inFIG. 8 , according to an example implementation. - Disclosed examples will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all of the disclosed examples are shown. Indeed, several different examples may be described and should not be construed as limited to the examples set forth herein. Rather, these examples are described so that this disclosure will be thorough and complete and will fully convey the scope of the disclosure to those skilled in the art.
- Example systems and methods involve joining a first structure and a second structure to create a void-free bondline between the first structure and the second structure. An example method includes placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
- The example systems and methods can in some instances enable creating high quality, void-free bondlines in bond configurations that are traditionally high in void content, have high variation in strength, and would otherwise take strength “knockdowns” in performance predictions.
- In some examples described herein, collapsible stand-offs are used to maintain gap fill widths for adhesive insertion between the first structure and the second structure. The collapsible standoffs then collapse at designated temperature and/or pressure combinations to force out entrapped air that may otherwise create a void. Thus, the collapsible stand-offs may control bondline thickness during a curing process and reduce gas entrapment to improve bondline quality.
-
FIG. 1A illustrates asystem 100 for forming abonded wing 102 of anaircraft 104, according to an example implementation.FIG. 1B illustrates an example of theaircraft 104 including the bondedwing 102. - The
system 100 includes a plurality ofspars 106, which are held in place by a plurality offixture arms 108. The plurality offixture arms 108 are not included in the assembled wing, but are rather provided for purposes of assembly. Other fixtures or tools can be used for holding aspects of thesystem 100 in place during assembly. Thesystem 100 further includes a plurality ofwing ribs 110, which are attached between thespars 106. Thesystem 100 further includes a plurality oflongerons 112, which run parallel to thespars 106, and which provide an interface between thewing ribs 110 and other aspects of thesystem 100. Thelongerons 112 may provide a strength to thesystem 100. - The
spars 106 can collectively form a portion of awing box 114 that provides lateral structure to thesystem 100, and which provides a general shape and dimension of thesystem 100. Further, additional components of thesystem 100 may couple to thewing box 114. Accordingly, the dimensions of thespars 106 may strictly adhere to design plans for thewing 102. -
FIG. 2 illustrates thesystem 100 with a portion of awing skin 116 coupled or bonded to thespars 106, thewing ribs 110, and thelongerons 112, according to an example implementation. By coupling thewing skin 116 to a component of the wing (e.g., thespars 106, thewing ribs 110, and the longerons 112), the bondedwing 102 is formed. -
FIGS. 3A-3F ,FIGS. 5A-5E ,FIGS. 6A-6G , andFIGS. 7A-7F illustrate various example phases of joining a first structure to a second structure, according example implementations. An example first structure can include a component of thewing 102 of theaircraft 104, and an example second structure can include thewing skin 116 of thewing 102 of theaircraft 104. By joining the first structure and the second structure, a bondline is created between the first structure and the second structure. The first structure and the second structure can include other components of thewing 102 or other components of theaircraft 104 as well. For instance, in an example, thefirst structure 120 and thesecond structure 122 can be a fuselage stringer and fuselage skin. Other examples are possible as well. -
FIGS. 3A-3F illustrate an example process to join afirst structure 120 to asecond structure 122 in a single-shear configuration, according to an example implementation. In particular,FIG. 3A shows a cross-sectional view of an initial stage of joining thefirst structure 120 to thesecond structure 122. Thefirst structure 120, which may be a component of a wing of an aircraft such as thespars 106, thewing ribs 110, or thelongerons 112, is held in placed with one or more fixtures (not shown inFIG. 3A , which can include thefixture arms 108 ofFIG. 1A ) relative to thesecond structure 122, which can include or be thewing skin 116 of the wing of the aircraft. - As shown in
FIG. 3A , thesecond structure 122 includes abase 126 and aflange 128 extending perpendicular to thebase 126. Thefirst structure 120 is held in place by the fixture(s) (e.g., example fixtures shown inFIG. 4 ) so that thefirst structure 120 is adjacent to and parallel with theflange 128. With the positioning of thefirst structure 120 held in place adjacent to and parallel with theflange 128 of thesecond structure 122, abond cavity 130 is formed between thefirst structure 120 and theflange 128. Thus, thebond cavity 130 is formed between the first structure and thesecond structure 122 via positioning of thefirst structure 120 relative to thesecond structure 122. - Prior to positioning of the
first structure 120 adjacent to and parallel with theflange 128 of thesecond structure 122, adhesive 132 is placed on asurface 133 of thefirst structure 120 that faces theflange 128, and adhesive 132 is also placed on asurface 135 of theflange 128 that faces thefirst structure 120. The adhesive 132 can be a layer of adhesive, as shown inFIG. 3A , that substantially covers surface area of theflange 128 and thefirst structure 120 over an area of each that will overlap when theflange 128 and thefirst structure 120 are brought together. For example, the adhesive 132 is shown to cover an entire (or a substantial portion) of thesurface 135 of theflange 128 that faces thefirst structure 120 whereas the adhesive 132 may only cover half or a bottom portion of thesurface 133 of thefirst structure 120 that faces theflange 128. - In some examples, the adhesive 132 may only be placed on one of the
first structure 120 or theflange 128. It is desired to place the adhesive 132 such that the adhesive 132 results within thebond cavity 130 for bonding thefirst structure 120 to thesecond structure 122. The adhesive 132 is also pre-placed on eachbonding surface 133/135 of thefirst structure 120 and thesecond structure 122 prior to joining thefirst structure 120 and thesecond structure 122. -
FIG. 3B illustrates a cross-sectional view of a subsequent stage in which aheater 134, such as a heat blanket, is positioned adjacent to thebond cavity 130, by surrounding theflange 128 and thefirst structure 120, for example. Following, perforatedadhesive tape 136 is placed at one ormore exits 137 of thebond cavity 130 to allow vacuum through and to block flow of adhesive, for example. Asemi-permeable breather material 138 is then placed over the perforatedadhesive tape 136 at one ormore exits 137 of thebond cavity 130. Thesemi-permeable breather material 138 will assist to entrap the adhesive 132 when joining thefirst structure 120 to thesecond structure 122, for example. Thesemi-permeable breather material 138 can include a material such as foam or rubber, for example. Thesemi-permeable breather material 138 can also include open cell foam, or semi-porous fiberglass material, for example. - Then, a
vacuum bag 140 is secured to thefirst structure 120 and thesecond structure 122 so as to surround a portion of thefirst structure 120 and thesecond structure 122.Vacuum seal tape 142 is used to create a vacuum seal attachment of thevacuum bag 140 to thefirst structure 120 and thesecond structure 122. - The
vacuum bag 140 is applied to each side of thefirst structure 120 and thesecond structure 122 to create a sealed enclosure. Thevacuum bag 140 is placed around theheater 134 as well. Thevacuum bag 140 can include a silicon rubber sheet or nylon film, for example. - In some examples, the
heater 134 is optional, and a separate heating element is incorporated into thevacuum bag 140. Still other forms of heating can be provided as well, such as forced air that convectively heats the adhesive or induction heating when inductable media is placed at or near thebond cavity 130. - In
FIG. 3B , avacuum port 144 is also coupled to thevacuum bag 140 for evacuating thebond cavity 130 via a vacuum (not shown). -
FIG. 3C illustrates a cross-sectional view of a subsequent stage in which thebond cavity 130 is evacuated via thevacuum port 144 to deaerate thebond cavity 130 as well as to deaerate the adhesive 132 within thebond cavity 130. Arrows are shown to illustrate air drawn out of thebond cavity 130 and out of the adhesive 132 and through the perforatedadhesive tape 136 and thesemi-permeable breather material 138, and then out through thevacuum port 144. Thesemi-permeable breather material 138 allows air to pass, but will prevent the adhesive 132 from flowing out of thebond cavity 130. The air is evacuated from all areas within thevacuum bag 140, for example, in order to evacuate all air out of areas where the adhesive 132 is placed to enable a voidfree bondline to be created between thefirst structure 120 and thesecond structure 122. - Further, by pre-placing the adhesive 132 on the
first structure 120 and thesecond structure 122, the adhesive 132 is de-aerated during evacuation of thebond cavity 130 to further enable a voidfree bondline to be created. De-aerated adhesive has no air, and thus, no voids or trapped air bubbles will be present. - Note that the adhesive 132 illustrated in
FIGS. 3A-3B includes air bubbles and has not yet been de-aerated. As seen by comparingFIGS. 3B with 3C, the evacuation of thebond cavity 130 removes air from the adhesive 132. -
FIG. 3D illustrates a cross-sectional view of a subsequent stage in which after deaerating the adhesive 132, thefirst structure 120 and thesecond structure 122 are moved relative to one another such that deaerated adhesive is disposed between thefirst structure 120 and thesecond structure 122. To do so, thefirst structure 120 may be moved toward thesecond structure 122, which can be stationary. Alternatively, thesecond structure 122 can be moved toward thefirst structure 120, which can be stationary. Still alternatively, both thefirst structure 120 and thesecond structure 122 can be moved in a relative manner toward one another. -
FIG. 3D illustrates thefirst structure 120 and thesecond structure 122 moved relative to one another so that eachbonding surface 133/135 of thefirst structure 120 and thesecond structure 122 move toward each other causing the deaerated adhesive 132 to be disposed in thebond cavity 130 between thefirst structure 120 and thesecond structure 122 resulting in the deaerated adhesive 132 joining and bonding thefirst structure 120 to thesecond structure 122. For example, fixtures (not shown inFIG. 3D ) move thefirst structure 120 and thesecond structure 122 relative to each other so that the deaerated adhesive 132 on each of thefirst structure 120 and thesecond structure 122 contacts and forms a bondline. - In the example shown in
FIG. 3D , thebond cavity 130 is continuously evacuated via thevacuum port 144 while moving thefirst structure 120 and thesecond structure 122 relative to one another. It may be beneficial to continue evacuation via thevacuum port 144 to prevent any air from seeping back into thebond cavity 130. -
FIG. 3E illustrates a cross-sectional view of a subsequent stage in which the deaerated adhesive 132 disposed between thefirst structure 120 and thesecond structure 122 is cured, via theheater 134, to bond thefirst structure 120 to thesecond structure 122. InFIG. 3D , theheater 134 is activated causingheat 146 to flow through thefirst structure 120, theflange 128 and to thedeaerated adhesive 132. Theheater 134 can include a silicon rubber pad with resistive elements (e.g., flexible wires running through the pad) to provide resistance heating, for example. - As shown in
FIG. 3E , during curing of the deaerated adhesive 132, the vacuum continuously evacuates thebond cavity 130. In other examples, however, during curing of the deaerated adhesive 132, the vacuum can be shut off (manually or using an electronic valve). -
FIG. 3F illustrates a cross-sectional view of a subsequent stage in which theheater 134 is turned off and components are removed from thefirst structure 120 and thesecond structure 122, and any excess adhesive is trimmed at edges resulting in abondline 148 being formed to join thefirst structure 120 and thesecond structure 122. Thebondline 148 is a voidfree bondline, for example. -
FIG. 4 illustrates an example of asystem 150 for joining thefirst structure 120 and thesecond structure 122, according to an example implementation. Thesystem 150 includes one ormore fixtures bond cavity 130 between thefirst structure 120 and thesecond structure 122 via positioning of thefirst structure 120 relative to thesecond structure 122 and to cause movement of thefirst structure 120 and thesecond structure 122 relative to one another. Thesystem 150 also includes thevacuum bag 140 to secure thefirst structure 120 and thesecond structure 122 by surrounding a portion of thefirst structure 120 and thesecond structure 122. Thesystem 150 also includes thevacuum port 144 coupled to thevacuum bag 140 for evacuating thebond cavity 130 to deaerate the adhesive 132 within thebond cavity 130 such that deaerated adhesive is disposed between thefirst structure 120 and thesecond structure 122. The system also includes one or more heaters (e.g., the heater 134) for curing the deaerated adhesive disposed between thefirst structure 120 and thesecond structure 122 to bond thefirst structure 120 to thesecond structure 122. - In
FIG. 4 , thefixtures first structure 120 and thesecond structure 122 using atemporary adhesive 151. Thefixture 152 can include aslider rod 153 movable within atranslation sleeve 155 to enable movement of thefirst structure 120 relative to thesecond structure 122, for example. - The
system 150 inFIG. 4 can include more or fewer components as well, such as any of the additional components described inFIGS. 3A-3F , for example. -
FIGS. 5A-5E illustrate another example process to join thefirst structure 120 to thesecond structure 122, according to an example implementation. The processes illustrated inFIGS. 5A-5E are similar to those illustrated inFIGS. 3A-3F , however, in the examples inFIGS. 5A-5E ,collapsible standoffs first structure 120 and thesecond structure 122 to control a position of thefirst structure 120 relative to thesecond structure 122. - As shown in
FIG. 5A , thesecond structure 122 includes thebase 126 and theflange 128 extending perpendicular to thebase 126. Thefirst structure 120 is held in place by the fixture(s) (e.g., example fixtures shown inFIG. 4 ) so that thefirst structure 120 is adjacent to and parallel with theflange 128. With the positioning of thefirst structure 120 held in place adjacent to and parallel with theflange 128 of thesecond structure 122, thebond cavity 130 is formed between thefirst structure 120 and theflange 128. - Prior to positioning of the
first structure 120 adjacent to and parallel with theflange 128 of thesecond structure 122, adhesive 132 is placed on a surface of thefirst structure 120 that faces theflange 128, and adhesive 132 is also placed on a surface of theflange 128 that faces thefirst structure 120. - In addition, the
collapsible standoffs first structure 120 relative to thesecond structure 122, and are inserted between thefirst structure 120 and thesecond structure 122. In one example, thecollapsible standoff 156 is placed in ahole 161 of a surface of thesecond structure 122, and the surface of thesecond structure 122 is configured to move toward thefirst structure 120. Adhesive 132 can be placed in thehole 161 of the surface of thesecond structure 122 to bond thecollapsible standoff 156 in place. Similarly, thecollapsible standoff 158 is placed in ahole 163 of a surface of thefirst structure 120, and the surface of thefirst structure 120 is configured to move toward thesecond structure 122. Adhesive 132 can be placed in thehole 163 of the surface of thefirst structure 120 to bond thecollapsible standoff 158 in place. - In other examples, the
collapsible standoffs first structure 120 and thesecond structure 122. - Other components shown in
FIG. 5A that are the same as shown inFIGS. 3A-3F are not described again for simplicity and include theheater 134, the perforatedadhesive tape 136, thesemi-permeable breather material 138, thevacuum bag 140, thevacuum seal tape 142, and thevacuum port 144. - After positioning the components, the
first structure 120 and thesecond structure 122 are moved relative to one another by forcing thefirst structure 120 against thecollapsible standoff 156 to contact thecollapsible standoff 156, and by forcing thesecond structure 122 against thecollapsible standoff 158 to contact thecollapsible standoff 158 and cause the adhesive to be positioned between thefirst structure 120 and thesecond structure 122. -
FIG. 5B illustrates a cross-sectional view of a subsequent stage in which thebond cavity 130 is evacuated via thevacuum port 144 to deaerate thebond cavity 130 as well as to deaerate the adhesive 132 within thebond cavity 130. Arrows are shown to illustrate air drawn out of thebond cavity 130 and out of the adhesive 132 and through the perforatedadhesive tape 136 and thesemi-permeable breather material 138, and then out through thevacuum port 144. Thesemi-permeable breather material 138 allows air to pass, but will prevent the adhesive 132 from flowing out of thebond cavity 130. The air is evacuated from all areas within thevacuum bag 140, for example, in order to evacuate all air out of areas where the adhesive 132 is placed to enable a voidfree bondline to be created between thefirst structure 120 and thesecond structure 122. - Further, by pre-placing the adhesive 132 on the
first structure 120 and thesecond structure 122, the adhesive 132 is de-aerated during evacuation of thebond cavity 130 to further enable a voidfree bondline to be created. De-aerated adhesive has no air, and thus, no voids or trapped air bubbles will be present. -
FIG. 5C illustrates a cross-sectional view of a subsequent stage in which heat is applied by theheater 134. InFIG. 5C , theheater 134 is turned on causing heat to flow through thefirst structure 120, theflange 128 and the adhesive 132. Theheater 134 can include a silicon rubber pad with resistive elements (e.g., flexible wires running through the pad) to provide resistance heating, for example. - When heating, the
collapsible standoffs collapsible standoffs first structure 120 and thesecond structure 122. Thecollapsible standoffs collapsible standoffs first structure 120 from thesecond structure 122 until a threshold temperature is reached. - Within examples, the
collapsible standoffs collapsible standoffs first structure 120 and thesecond structure 122 with thecollapsible standoffs - In still other examples, the
collapsible standoffs - Within examples, the
collapsible standoffs first structure 120 and thesecond structure 122. -
FIG. 5D illustrates a cross-sectional view of a subsequent stage in which the heat is applied by theheater 134 and thecollapsible standoffs bond cavity 130 can be continuously evacuated via thevacuum port 144 drawing thefirst structure 120 and thesecond structure 122 toward each other due to vacuum pressure, for example. The vacuum pressure also assists with causing the collapse of thecollapsible standoffs - In some examples, heat is applied to achieve a first temperature to cause the
collapsible standoffs first structure 120 and thesecond structure 122 moving toward each other due to vacuum pressure, and then heat is applied to achieve a second temperature higher than the first temperature to cure the deaerated adhesive 132 and bond thefirst structure 120 to thesecond structure 122. In one example, thecollapsible standoffs collapsible standoffs -
FIG. 5E illustrates a cross-sectional view of a subsequent stage in which theheater 134 is turned off and components are removed from thefirst structure 120 and thesecond structure 122, and any excess adhesive is trimmed at edges resulting in abondline 148 being formed to join thefirst structure 120 and thesecond structure 122. Thebondline 148 is a voidfree bondline, for example. A thickness of thebondline 148 between thefirst structure 120 and thesecond structure 122 is controlled via a residual thickness of the collapsedcollapsible standoffs -
FIGS. 6A-6G illustrate an example process to join thefirst structure 120 to thesecond structure 122 in a dual-shear configuration, according to an example implementation. The processes illustrated inFIGS. 6A-6G are similar to those illustrated inFIGS. 3A-3F , however, in the examples inFIGS. 6A-6G , thesecond structure 122 has two flanges rather than one flange and thefirst structure 120 is positioned between the two flanges of thesecond structure 122. - As shown in
FIG. 6A , thesecond structure 122 includes thebase 126, theflange 128 extending perpendicular to thebase 126, and theflange 160 also extending perpendicular to thebase 126. Thefirst structure 120 is held in place by the fixture(s) (e.g., example fixtures shown inFIG. 4 ) so that thefirst structure 120 can be positioned into the area between theflange 128 and theflange 160. With the positioning of thefirst structure 120 into the area between theflange 128 and theflange 160, thebond cavity 130 is formed. - A
spacer 162 is inserted into a bottom area of thebond cavity 130 to prohibit adhesive accumulation. For example, it is desirable to avoid that overfilling the bond cavity with adhesive, and thus, thespacer 162 is placed to prevent adhesive from filling the area. In one example, thespacer 162 includes a closed cell foam elastic member. Thespacer 162 also controls insertion depth of thefirst structure 120 relative to thesecond structure 122. - Prior to inserting the
first structure 120 between theflange 128 and theflange 160, the adhesive 132 is generally placed on a surface of thefirst structure 120 that will contact theflange 128 and theflange 160, and adhesive 132 is also placed on surfaces of theflange 128 and theflange 160. -
FIG. 6B illustrates a cross-sectional view of a subsequent stage in which other components are applied including theheater 134, thesemi-permeable breather material 138, thevacuum bag 140, thevacuum seal tape 142, and thevacuum port 144. These components are the same as shown inFIGS. 3A-3F and are not described again for simplicity. Note that in the example shown inFIG. 6B , thevacuum bag 140 has semi rigid and flexible portion to enable movement of the parts, and the example includes two heaters (e.g., heaters 134) on each side of thesecond structure 122. -
FIG. 6C illustrates a cross-sectional view of a subsequent stage in which after positioning the components, thebond cavity 130 is evacuated via thevacuum port 144 to deaerate thebond cavity 130 as well as to deaerate the adhesive 132 within thebond cavity 130. -
FIG. 6D illustrates a cross-sectional view of a subsequent stage in which thefirst structure 120 is moved relative to thesecond structure 122 after the adhesive 132 has been deaerated, so as to position thefirst structure 120 between theflange 128 and theflange 160. Thebond cavity 130 continues to be evacuated during the movement. Arrows are shown to illustrate air drawn out of thebond cavity 130 and out of the adhesive 132 and through thesemi-permeable breather material 138, and then out through thevacuum port 144. Further, by pre-placing the adhesive 132 on thefirst structure 120 and thesecond structure 122, the adhesive 132 is de-aerated during evacuation of thebond cavity 130 to further enable a voidfree bondline to be created. De-aerated adhesive has no air, and thus, no voids or trapped air bubbles will be present. - After deaerating the adhesive 132, the
first structure 120 and thesecond structure 122 are moved relative to one another such that deaerated adhesive is disposed between thefirst structure 120 and thesecond structure 122. To do so, thefirst structure 120 may be moved toward thesecond structure 122, which can be stationary. Alternatively, thesecond structure 122 can be moved toward thefirst structure 120, which can be stationary. Still alternatively, both thefirst structure 120 and thesecond structure 122 can be moved in a relative manner toward one another. -
FIG. 6E illustrates a cross-sectional view of a subsequent stage in which thefirst structure 120 is further moved relative to thesecond structure 122 so as to position thefirst structure 120 between theflange 128 and theflange 160, and to contact thespacer 162 at a bottom of thebond cavity 130. In the example shown inFIG. 6E , thebond cavity 130 is continuously evacuated via thevacuum port 144 while moving thefirst structure 120 and thesecond structure 122 relative to one another. It may be beneficial to continue evacuation via thevacuum port 144 to prevent any air from seeping back into thebond cavity 130. -
FIG. 6F illustrates a cross-sectional view of a subsequent stage in which the deaerated adhesive 132 disposed between thefirst structure 120 and thesecond structure 122 is cured, via theheater 134, to bond thefirst structure 120 to thesecond structure 122. InFIG. 6F , theheater 134 is turned on causing heat to flow through thefirst structure 120, theflange 128, theflange 160, and the adhesive 132. Theheater 134 can include a silicon rubber pad with resistive elements (e.g., flexible wires running through the pad) to provide resistance heating, for example. - As shown in
FIG. 6F , during curing of the adhesive 132, the vacuum continuously evacuates thebond cavity 130. In other examples, however, during curing of the adhesive 132, the vacuum can be shut off (manually or using an electronic valve). -
FIG. 6G illustrates a cross-sectional view of a subsequent stage in which theheater 134 is turned off and components are removed from thefirst structure 120 and thesecond structure 122, and any excess adhesive is trimmed at edges resulting in abondline 148 being formed to join thefirst structure 120 and thesecond structure 122. Thebondline 148 is a voidfree bondline, for example. -
FIGS. 7A-7F illustrate another example process to join thefirst structure 120 to thesecond structure 122, according to an example implementation. The processes illustrated inFIGS. 7A-7F are similar to those illustrated inFIGS. 6A-6G , however, in the examples inFIGS. 7A-7E , acollapsible standoff 164 is positioned at a bottom of thebond cavity 130. - As shown in
FIG. 7A , thesecond structure 122 includes thebase 126, theflange 128 extending perpendicular to thebase 126, and theflange 160 also extending perpendicular to thebase 126. Thefirst structure 120 is held in place by the fixture(s) (e.g., example fixtures shown inFIG. 4 ) so that thefirst structure 120 can be positioned into the area between theflange 128 and theflange 160. With the positioning of thefirst structure 120 into the area between theflange 128 and theflange 160, thebond cavity 130 is formed. - The
collapsible standoff 164 is inserted into a bottom area of thebond cavity 130 to control bondline thickness. Thecollapsible standoff 164 also controls a distance that thefirst structure 120 extends into thebond cavity 130 based on temperature. For example, thecollapsible standoff 164 will collapse once heated to a threshold temperature allowing compression of thecollapsible standoff 164. - An amount of adhesive 166 is then inserted into the
bond cavity 130 on top of thecollapsible standoff 164. The adhesive 166 ofFIG. 7A is not de-aerated. -
FIG. 7B illustrates a cross-sectional view of a subsequent stage in which other components are applied including theheater 134, thesemi-permeable breather material 138, thevacuum bag 140, thevacuum seal tape 142, and thevacuum port 144. These components are the same as shown inFIGS. 6A-6E and are not described again for simplicity. - After positioning the components, the
bond cavity 130 is evacuated via thevacuum port 144 to deaerate thebond cavity 130 as well as to deaerate the adhesive 166 within thebond cavity 130. As can be seen by comparingFIGS. 7A with 7B, evacuation of thebond cavity 130 removes air from the adhesive 166. -
FIG. 7C illustrates a cross-sectional view of a subsequent stage in which thefirst structure 120 is moved relative to thesecond structure 122 so as to position thefirst structure 120 between theflange 128 and theflange 160. Thebond cavity 130 continues to be evacuated during the movement. Arrows are shown to illustrate air drawn out of thebond cavity 130 and out of the adhesive 166 and through thesemi-permeable breather material 138, and then out through thevacuum port 144. Further, by pre-placing the adhesive 166 in thebond cavity 130, the adhesive 166 is de-aerated during evacuation of thebond cavity 130 to further enable a voidfree bondline to be created. De-aerated adhesive has no air, and thus, no voids or trapped air bubbles will be present. - By moving the
first structure 120 into thebond cavity 130, thefirst structure 120 contacts the adhesive 166 causing the adhesive to surround thefirst structure 120, for example. Further movement of thefirst structure 120 into thebond cavity 130 causes the adhesive 166 to fill the bond cavity. In addition, capillarity will induce a uniform fill of thebond cavity 130 with the adhesive 166, for example. -
FIG. 7E illustrates a cross-sectional view of a subsequent stage in which the deaerated adhesive 166 disposed between thefirst structure 120 and thesecond structure 122 is cured, via theheater 134, to bond thefirst structure 120 to thesecond structure 122. The adhesive 166 is illustrated as filling thebond cavity 130, as mentioned, due to capillarity and movement of thefirst structure 120. InFIG. 7E , theheater 134 is turned on causing heat to flow through thefirst structure 120, theflange 128, theflange 160, and the adhesive 166. Theheater 134 can include a silicon rubber pad with resistive elements (e.g., flexible wires running through the pad) to provide resistance heating, for example. - As shown in
FIG. 7E , during curing of the adhesive 166, the vacuum continuously evacuates thebond cavity 130. In other examples, however, during curing of the adhesive 166, the vacuum can be shut off (manually or using an electronic valve). - When heating, the
collapsible standoff 164 collapses at a predetermined temperature due to thermal softening of thecollapsible standoff 164 to enable a bondline to form between thefirst structure 120 and thesecond structure 122. Thecollapsible standoff 164 may be the same as or fabricated use the same materials as thecollapsible standoffs -
FIG. 7F illustrates a cross-sectional view of a subsequent stage in which theheater 134 is turned off and components are removed from thefirst structure 120 and thesecond structure 122, and any excess adhesive is trimmed at edges resulting in abondline 148 being formed to join thefirst structure 120 and thesecond structure 122. Thebondline 148 is a voidfree bondline, for example. A thickness of thebondline 148 between thefirst structure 120 and thesecond structure 122 is controlled via a residual thickness of the collapsedcollapsible standoff 164. -
FIG. 8 illustrates a flowchart of an example of amethod 200 of joining afirst structure 120 and asecond structure 122, according to an example implementation.Method 200 shown inFIG. 8 presents an example of a method that could be used with thesystem 150 or with components of thereof. Further, the functions described with respect toFIG. 8 may be supplemented by, replaced by, or combined with functions and phases described above with respect toFIGS. 3A-3F ,FIG. 4 ,FIGS. 5A-5E ,FIGS. 6A-6G , andFIGS. 7A-7F , for example. Further, devices or systems may be used or configured to perform logical functions presented inFIG. 8 . - In one example, the
method 200, and any of the phases shown inFIGS. 3-7 , is considered a choreographed adhesive de-aeration process in which stages of the process when performed in order provide a de-aerated adhesive useful to join thefirst structure 120 and thesecond structure 122 to form a bondline. - In some instances, components of the devices and/or systems may be configured to perform the functions such that the components are actually configured and structured (with hardware and/or software) to enable such performance. In other examples, components of the devices and/or systems may be arranged to be adapted to, capable of, or suited for performing the functions, such as when operated in a specific manner.
Method 200 includes one or more operations, functions, or actions as illustrated by one or more of blocks 202-210. Further, blocks ofFIGS. 9-22 may be performed in accordance with one or more of blocks 202-210. Although the blocks are illustrated in a sequential order, these blocks may also be performed in parallel, and/or in a different order than those described herein. Also, the various blocks may be combined into fewer blocks, divided into additional blocks, and/or removed based upon the desired implementation. - Within examples, one or more blocks of the
method 200 may be represented in program code or circuitry used for controlling robotic mechanisms for joining the first structure and the second structure (e.g., as for assembling a bonded structure and/or a wing including a plurality of bonded structures). Whilemethod 200 and variations thereof may be executed automatically using, for example, one or more robotic armatures controlled by program code operating in accordance with themethod 200, some tasks may be performed manually. Thus, within examples, certain functionality described with respect to themethod 200 may be performed automatically while other portions can be performed manually. Alternatively, all blocks of themethod 200 may be performed automatically or all blocks of themethod 200 may be performed manually. - At
block 202, themethod 200 includes placing the adhesive 132 within thebond cavity 130 for bonding thefirst structure 120 to thesecond structure 122. -
FIG. 9 illustrates a flowchart of functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 9 illustrates block 212, which includes an example function for placing the adhesive 132 within thebond cavity 130 for bonding thefirst structure 120 to thesecond structure 122 including pre-placing the adhesive 132 on each bonding surface of thefirst structure 120 and thesecond structure 122. -
FIG. 10 illustrates a flowchart of functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 10 illustratesblock 214, which includes an example function for placing the adhesive 132 within thebond cavity 130 for bonding thefirst structure 120 to thesecond structure 122 including placing the adhesive 132 within thebond cavity 130 for bonding a component of a wing of an aircraft and a wing skin of the wing of the aircraft. - Referring back to
FIG. 8 , atblock 204, themethod 200 includes securing thevacuum bag 140 to thefirst structure 120 and thesecond structure 122 so as to surround a portion of thefirst structure 120 and thesecond structure 122. - At
block 206, themethod 200 includes evacuating thebond cavity 130 via thevacuum port 144 to deaerate the adhesive 132 within thebond cavity 130. - At
block 208, themethod 200 includes after deaerating the adhesive 132, moving thefirst structure 120 and thesecond structure 122 relative to one another such that deaerated adhesive is disposed between thefirst structure 120 and thesecond structure 122. -
FIG. 11 illustrates a flowchart of functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 11 illustratesblock 216, which includes an example function for moving thefirst structure 120 and thesecond structure 122 relative to one another including moving thefirst structure 120 and thesecond structure 122 so that each bonding surface of thefirst structure 120 and thesecond structure 122 move toward each other. - Referring back to
FIG. 8 , atblock 210, themethod 200 includes curing, via one ormore heaters 134, the deaerated adhesive disposed between thefirst structure 120 and thesecond structure 122 to bond thefirst structure 120 to thesecond structure 122. -
FIG. 12 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 12 illustratesblock 218, which includes an example function for forming thebond cavity 130 between thefirst structure 120 and thesecond structure 122 via positioning of thefirst structure 120 relative to thesecond structure 122. -
FIG. 13 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 13 illustratesblock 220, which includes an example function for moving thefirst structure 120 and thesecond structure 122 relative to one another causing the deaerated adhesive to be disposed in thebond cavity 130 between thefirst structure 120 and thesecond structure 122. -
FIG. 14 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 14 illustratesblock 222, which includes an example function for inserting aspacer 162 into a bottom area of thebond cavity 130 to control bondline thickness. -
FIG. 15 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 15 illustratesblock 224, which includes an example function for inserting acollapsible standoff 164 into a bottom area of thebond cavity 130 to control a distance of distribution of the adhesive 132 into thebond cavity 130 based on temperature, and thecollapsible standoff 164 collapses at a predetermined temperature. -
FIG. 16 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 16 illustratesblock 226, which includes an example function for placing thesemi-permeable breather material 138 at the one ormore exits 137 of thebond cavity 130. -
FIG. 17 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 17 illustratesblock 228, which includes an example function for continuously evacuating thebond cavity 130 via thevacuum port 144 while moving thefirst structure 120 and thesecond structure 122 relative to one another. -
FIG. 18 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 18 illustratesblock 230, which includes an example function for controlling a position of thefirst structure 120 relative to thesecond structure 122 via acollapsible standoff 156/158/164, and thecollapsible standoff 156/158/164 collapses at a predetermined temperature due to thermal softening of thecollapsible standoff 156/158/164. -
FIG. 19 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 19 illustratesblock 232, which includes an example function for controlling a thickness of a bondline between thefirst structure 120 and thesecond structure 122 via a residual thickness of a collapsedcollapsible standoff 156/158/164. -
FIG. 20 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 20 illustratesblocks block 234, an example function includes placing acollapsible standoff 156 in ahole 161 of a surface of thesecond structure 122, and the surface of thesecond structure 122 is configured to move toward thefirst structure 120. Atblock 236, an example function includes placing the adhesive 132 in thehole 161 of the surface of thesecond structure 122. Atblock 238, an example function includes forcing thefirst structure 120 against thecollapsible standoff 156 to contact thecollapsible standoff 156 and force the adhesive 132 to flow between thefirst structure 120 and thesecond structure 122. -
FIG. 21 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 21 illustratesblocks block 240, an example function includes while curing the deaerated adhesive disposed between thefirst structure 120 and thesecond structure 122 to bond thefirst structure 120 to thesecond structure 122, causing thecollapsible standoff 156 to collapse due to heating and thermal softening at a predetermined temperature, and atblock 242 an example function includes continuously evacuating the bond cavity via thevacuum port 144 drawing thefirst structure 120 and thesecond structure 122 toward each other. -
FIG. 22 illustrates a flowchart of additional functions for use with themethod 200 shown inFIG. 8 , according to an example implementation. In particular,FIG. 22 illustratesblocks block 244, an example function includes placing acollapsible standoff 156/158 between thefirst structure 120 and thesecond structure 122 to control a position of thefirst structure 120 relative to thesecond structure 122, and thecollapsible standoff 156/158 collapses at a predetermined temperature due to thermal softening. Atblock 246, an example function includes applying heat to achieve a first temperature to cause thecollapsible standoff 156/158 to collapse resulting in thefirst structure 120 and thesecond structure 122 moving toward each other due to vacuum pressure. Atblock 248, an example function includes applying heat to achieve a second temperature higher than the first temperature to cure the deaerated adhesive and bond thefirst structure 120 to thesecond structure 122. - Using example methods and systems described herein can enable creation of bonded structures that have improved strength and higher quality. For instance, the example methods and systems described herein can enable creation of voidfree bondlines in pi joints and single shear joints in aircraft. This results from adhesive being de-aerated within the bond cavity so that no or reduced voids are included in the resulting bondline.
- By the term “substantially,” “similarity,” and “about” used herein, it is meant that the recited characteristic, parameter, or value need not be achieved exactly, but that deviations or variations, including for example, tolerances, measurement error, measurement accuracy limitations and other factors known to skill in the art, may occur in amounts that do not preclude the effect the characteristic was intended to provide.
- Different examples of the system(s), device(s), and method(s) disclosed herein include a variety of components, features, and functionalities. It should be understood that the various examples of the system(s), device(s), and method(s) disclosed herein may include any of the components, features, and functionalities of any of the other examples of the system(s), device(s), and method(s) disclosed herein in any combination or any sub-combination, and all of such possibilities are intended to be within the scope of the disclosure.
- The description of the different advantageous arrangements has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the examples in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. Further, different advantageous examples may describe different advantages as compared to other advantageous examples. The example or examples selected are chosen and described in order to best explain the principles of the examples, the practical application, and to enable others of ordinary skill in the art to understand the disclosure for various examples with various modifications as are suited to the particular use contemplated.
Claims (20)
1. A system for joining a first structure and a second structure, the system comprising:
one or more fixtures forming a bond cavity between a first structure and a second structure via positioning of the first structure relative to the second structure and to cause movement of the first structure and the second structure relative to one another;
a vacuum bag to secure the first structure and the second structure by surrounding a portion of the first structure and the second structure;
a vacuum port coupled to the vacuum bag for evacuating the bond cavity to deaerate an adhesive within the bond cavity such that deaerated adhesive is disposed between the first structure and the second structure; and
one or more heaters for curing the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
2. The system of claim 1 , further comprising:
a collapsible standoff positioned between the first structure and the second structure to control a position of the first structure relative to the second structure, wherein the collapsible standoff collapses at a predetermined temperature.
3. The system of claim 1 , further comprising:
a collapsible standoff positioned in the adhesive within the bond cavity.
4. The system of claim 1 , wherein the adhesive is placed within the bond cavity on each bonding surface of the first structure and the second structure for bonding the first structure to the second structure.
5. The system of claim 1 , further comprising:
a spacer inserted into a bottom area of the bond cavity to control bondline thickness.
6. The system of claim 1 , further comprising:
a collapsible standoff inserted into a bottom area of the bond cavity to control a distance of distribution of the adhesive into the bond cavity based on temperature, wherein the collapsible standoff collapses at a predetermined temperature.
7. The system of claim 6 , wherein a thickness of a bondline between the first structure and the second structure is controlled via a residual thickness of a collapsed collapsible standoff.
8. The system of claim 1 , further comprising:
a semi-permeable breather material placed at one or more exits of the bond cavity.
9. The system of claim 1 , wherein the vacuum port continuously evacuates the bond cavity while the one or more fixtures cause movement of the first structure and the second structure to one another.
10. The system of claim 1 , further comprising:
a collapsible standoff placed in a hole of a surface of the second structure, wherein the surface of the second structure is configured to move toward the first structure,
wherein the adhesive is placed in the hole of the surface of the second structure, and
wherein the one or more fixtures cause movement of the first structure and the second structure relative to one another to force the first structure against the collapsible standoff to contact the collapsible standoff and force the adhesive to flow between the first structure and the second structure.
11. The system of claim 10 , wherein the one or more heaters cure the deaerated adhesive and cause the collapsible standoff to collapse due to heating and thermal softening at a predetermined temperature.
12. The system of claim 11 , wherein the vacuum port continuously evacuates the bond cavity while the one or more heaters cure the deaerated adhesive.
13. The system of claim 1 , further comprising:
a collapsible standoff placed between the first structure and the second structure to control a position of the first structure relative to the second structure, wherein the collapsible standoff collapses at a predetermined temperature due to thermal softening;
the one or more heaters apply heat to achieve a first temperature to cause the collapsible standoff to collapse resulting in the first structure and the second structure moving toward each other due to vacuum pressure.
14. The system of claim 13 , wherein the one or more heaters apply heat to achieve a second temperature higher than the first temperature to cure the deaerated adhesive and bond the first structure to the second structure.
15. The system of claim 1 , wherein the first structure comprises a component of a wing of an aircraft and the second structure comprises a wing skin of the wing of the aircraft.
16. A system for joining a first structure and a second structure, the system comprising:
one or more fixtures forming a bond cavity between a first structure and a second structure via positioning of the first structure relative to the second structure and to cause movement of the first structure and the second structure relative to one another;
a collapsible standoff positioned between the first structure and the second structure to control a position of the first structure relative to the second structure;
a vacuum bag to secure the first structure and the second structure by surrounding a portion of the first structure and the second structure;
a vacuum port coupled to the vacuum bag for evacuating the bond cavity to deaerate an adhesive within the bond cavity such that deaerated adhesive is disposed between the first structure and the second structure; and
one or more heaters for curing the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
17. The system of claim 16 , wherein the collapsible standoff comprises include a thermoplastic material.
18. The system of claim 16 , wherein the collapsible standoff comprises a spiral or spring-like configuration.
19. The system of claim 16 , wherein the collapsible standoff comprises a hollow column configuration.
20. The system of claim 16 , wherein the collapsible standoff collapses in a one-dimensional manner while providing alignment and spacing between the first structure and the second structure.
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US18/463,575 US20230415920A1 (en) | 2020-12-17 | 2023-09-08 | Systems and methods for joining a first structure and a second structure with a choreographed adhesive de-aeration process |
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US202063126626P | 2020-12-17 | 2020-12-17 | |
US17/502,270 US11787565B2 (en) | 2020-12-17 | 2021-10-15 | Systems and methods for joining a first structure and a second structure with a choreographed adhesive de-aeration process |
US18/463,575 US20230415920A1 (en) | 2020-12-17 | 2023-09-08 | Systems and methods for joining a first structure and a second structure with a choreographed adhesive de-aeration process |
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US17/502,270 Division US11787565B2 (en) | 2020-12-17 | 2021-10-15 | Systems and methods for joining a first structure and a second structure with a choreographed adhesive de-aeration process |
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US18/463,575 Pending US20230415920A1 (en) | 2020-12-17 | 2023-09-08 | Systems and methods for joining a first structure and a second structure with a choreographed adhesive de-aeration process |
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US8262841B2 (en) * | 2010-11-24 | 2012-09-11 | The Boeing Company | Methods for void-free debulking of adhesive bonded joints |
US9308688B1 (en) * | 2013-03-20 | 2016-04-12 | The Boeing Company | Installation assembly and associated method for forming a bonded joint |
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