US20230405757A1 - Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making - Google Patents
Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making Download PDFInfo
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- US20230405757A1 US20230405757A1 US18/240,134 US202318240134A US2023405757A1 US 20230405757 A1 US20230405757 A1 US 20230405757A1 US 202318240134 A US202318240134 A US 202318240134A US 2023405757 A1 US2023405757 A1 US 2023405757A1
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- US
- United States
- Prior art keywords
- lapping plate
- plate platen
- major surface
- barrier
- ring
- Prior art date
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- 230000004888 barrier function Effects 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 claims abstract description 55
- 239000000203 mixture Substances 0.000 claims description 49
- 239000002245 particle Substances 0.000 claims description 35
- 230000007246 mechanism Effects 0.000 claims description 34
- 239000002002 slurry Substances 0.000 claims description 19
- 230000000717 retained effect Effects 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 9
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 description 10
- 239000010432 diamond Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000020347 spindle assembly Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Abstract
The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.
Description
- This application is a divisional patent application of divisional patent application Ser. No. 16/869,233 filed on May 7, 2020, and published as U.S. Pub. No.: 2020/0262025 (Phann et al.), which is a divisional patent application of Ser. No. 15/198,566 filed on Jun. 30, 2016, now issued as U.S. Pat. No. 10,682,737 (Phann et al.); wherein the entirety of each of said applications is incorporated herein by reference.
- The present disclosure relates to lapping plates and methods of making lapping plates that can be used to lap (abrade) one or more bars of sliders.
- The present disclosure includes embodiments of an apparatus for processing a major surface of a lapping plate platen, wherein the apparatus comprises:
-
- a) a rotatable platter configured to secure and physically support the lapping plate platen during processing of the major surface of the lapping plate platen;
- b) one or more liquid dispensers configured to dispense one or more liquid treatment compositions onto the major surface of the lapping plate platen;
- c) a movable barrier mechanism, wherein the movable barrier mechanism comprises one or more ring segments that can be securely adjusted from an open position to allow one or more liquid treatment compositions to pass through between the barrier mechanism and the outside top perimeter of the lapping plate platen to a closed position so that the one or more elastic ring segments form a barrier that extends above the major surface of the lapping plate platen to substantially contain one or more liquid treatment compositions on the major surface of the lapping plate platen during one or more processing steps of the major surface of the lapping plate platen.
- The present disclosure also includes embodiments of a barrier ring assembly configured to be removably retained against a lapping plate platen during processing of a major surface of the lapping plate platen, wherein the ring assembly comprises:
-
- a) a clamp ring having an adjustable inside perimeter that can be retained against an outside perimeter of the lapping plate platen, wherein the clamp ring has an inside perimeter wall, an outside perimeter wall, and slot between at least a portion of the inside perimeter wall and the outside perimeter wall;
- b) a ring that can be slidably positioned within the slot so that the slot supports the ring, wherein the ring can be retained against the outside perimeter of the lapping plate platen, wherein when in a closed position the ring extends above the major surface of the lapping plate platen and forms a barrier to substantially contain a liquid treatment composition on the major surface of the lapping plate platen during processing of the major surface of the lapping plate platen; and
- c) a latch that physically engages the clamp ring and is configured to securely adjust the inside perimeter of the clamp ring from an open and removable position to the closed position that retains the clamp ring and ring to the lapping plate platen to form the barrier to substantially contain a liquid treatment composition on the major surface of the lapping plate platen during processing of the major surface of the lapping plate platen.
- The present disclosure also includes embodiments of a method of processing a major surface of a lapping plate platen, wherein the method comprises:
-
- a) positioning a lapping plate platen on a rotatable platter, wherein the rotatable platter is configured to secure and physically support the lapping plate platen during processing of the major surface of the lapping plate platen;
- b) actuating a movable barrier mechanism to a closed position to form a barrier that extends above the major surface of the lapping plate platen to substantially contain one or more liquid treatment compositions on the major surface of the lapping plate platen during one or more processing steps of the major surface of the lapping plate platen, wherein the movable barrier mechanism comprises one or more ring segments that can be securely adjusted from the closed position to an open position to allow one or more liquid treatment compositions to pass through between the barrier mechanism and the outside top perimeter of the lapping plate platen; and
- c) dispensing at least one liquid treatment composition onto the major surface of the lapping plate platen to process the major surface of the lapping plate platen while the movable barrier mechanism is in the closed position.
-
FIG. 1 is a schematic elevation view showing a multi-step apparatus for processing a major surface of a lapping plate platen; -
FIG. 2 is a plan view of the apparatus shown inFIG. 1 ; -
FIG. 3 is a perspective, underside view of a tool; -
FIG. 4 is a partial, perspective view of a tool used to process a lapping plate platen; -
FIG. 5A is a perspective view of one embodiment of a barrier device according to the present disclosure in the open position; -
FIG. 5B is an exploded view of the device inFIG. 5A ; -
FIG. 5C is a perspective view of the barrier device inFIG. 5A in the closed position; -
FIG. 6A is a perspective view of a second embodiment of a barrier device according to the present disclosure in the open position; -
FIG. 6B is a perspective view of the barrier device inFIG. 6A with a lapping plate platen included; and -
FIG. 6C is a perspective view of the barrier device inFIG. 6B in the closed position. - Lapping machines (apparatuses) can be used to perform lapping operations on various substrates such as a bar of sliders. Such lapping machines can use a lapping plate that performs grinding and/or polishing operations on a substrate such as a bar of sliders. Lapping machines can include a rotating lapping plate that defines a lapping surface which can help abrade the surface of a ceramic material such as AlTiC, which is a two phase composite of alumina (Al2O3) and titanium-carbide (TiC). If desired, a slurry can be applied to the lapping surface to enhance the abrading action as the lapping surface is rotated relative to a slider bar containing a plurality of the sliders held in a pressing engagement against the lapping surface. A lapping plate can be used for a variety of lapping processes such as rough lapping, fine lapping, and kiss lapping. Lapping plates can be constructed such that one, or both, work surfaces of the lapping plate include predetermined amounts of abrasive particles.
- Abrasive particles can be made out of one or more materials. In some embodiments, abrasive particles are selected from the group consisting of diamond particles, cubic boron nitride particles, alumina particles, alumina zirconia particles, silicon carbide particles, and combinations thereof. In some embodiments, abrasive particles can be embedded within a ceramic material such as embedded diamond particles (embedded abrasive particles can also be referred to as encapsulated or composite abrasive particles, or even abrasive beads). Embedded abrasive particles are larger in size as compared to bare abrasive particles because the abrasive particles are embedded within ceramic material. For example, in some embodiments, embedded abrasive particles can have an average particle diameter in the range from 10 to 50 micrometers.
- A variety of materials and methods can be used to construct the abrasive surface of a lapping plate. For example, the abrasive surface can be formed by embedding abrasive particles into the lapping plate in a process that can be referred to as “charging.” Techniques for charging abrasive particles into lapping plates can include hand charging with a tool and charging on an apparatus with various tools.
- A variety of apparatuses and devices can be used for processing a lapping plate platen so as to form an abrasive surface on the platen and form a lapping plate. An example of such an apparatus is described in U.S. Pat. No. 6,585,559 (Griffin et al.), wherein the entirety of said patent is incorporated herein by reference. At least with respect to “charging” a platen with a slurry that includes abrasive particles and a liquid, either a multi-step apparatus can be used or a single-step apparatus can be used.
- A “multi-step” apparatus, machine, or tool can be configured to perform multiple processes on a platen so as to form a lapping plate. An example of a
multi-step apparatus 100 for processing a major surface of a lapping plate platen is described below with respect toFIGS. 1 and 2 . - As shown,
apparatus 100 includes abase 110. The base 110 can be constructed of rigid or high strength materials. As illustrated inFIG. 1 , the base 110 can be mounted on stands, or appropriate support members. As shown, arotatable platter 112 is rotatably mounted on thebase 110. The rotatable platter 112 (or turn table) is configured to secure and physically support the lappingplate platen 114 during processing of the major surface of the lapping plate platen so that it can function as a lapping plate and perform lapping operations. In more detail, theplaten 114 includes one or more surfaces 116 (only one shown) that can be used to perform the actual lapping operations. At least thesurface 116 of theplaten 114 can be an alloy made out of one or more metals. Exemplary metals include at least one of tin, tin alloy, aluminum, copper, combinations of these, and the like. -
Platen 114 can have a wide variety of diameters. In some embodiments,platen 114 can have a diameter in the range from 10 to 20 inches. - A main drive motor (not shown) can be attached to the
base 110, and can provide the force to rotate theplatter 112 during operation of the apparatus 100 (e.g., counterclockwise as indicated by arrow 143). Also, a spindle assembly (not shown) can be coupled to the main drive motor in order to rotate theplatter 112. - As shown, the
apparatus 100 includes a pair ofarms 128 disposed on thebase 110. Although only twoarms 128 are illustrated inFIGS. 1 and 2 , it should be appreciated that various other configurations are possible. For example, only onearm 128 may be provided, or more than twoarms 128 can be provided. As shown, eacharm 128 includes a processinghead receiving portion 130. Aprocessing head 132 is attached to each processinghead receiving portion 130 for performing operations on thesurface 116 of theplaten 114. Each processinghead receiving portion 130 is rotatably mounted to itsrespective arm 128 so that processinghead 132 is capable of rotation. Eacharm 128 further includes aspindle motor 134 that controls rotation of the processinghead receiving portion 130. In some embodiments, the processinghead receiving portion 130 can be configured with a quick change arrangement that can readily accept a variety of texturizing, washing, charging, and other processing heads 132. Thearms 128 are used (in conjunction with the heads 132) to process (e.g., texturizing, washing, and charging operations) theplaten 114 in preparation for lapping operations. The processing heads 132 can be configured based on a given processing step. - An actuator (not shown) can be coupled to each
arm 128. The actuators can function to place the processing heads 132 in desired alignment with thesurface 116 of theplaten 114. Accordingly, the actuators are capable of placing thearms 128 in various operating positions. As shown inFIG. 2 , thehead receiving portion 130 can be placed in a first position wherein at least a portion of theprocessing head 132 overlies a portion of thesurface 116 of theplaten 114 when theprocessing head 132 is in contact with thesurface 116. A second position is also shown wherein anotherprocessing head 132 has been raised and placed out of alignment with the platen 114 (theprocessing head 132 is completely outside the perimeter of surface 116). It can be appreciated that the actuators can also be capable of placing the processing heads 132 in any intermediate positions between the two positions illustrated inFIG. 2 . By virtue of its mode of operation, the actuators can be controllable for placing theheads 132 in contact with thesurface 116 of theplaten 114. In some embodiments, one or more predetermined weights (not shown) can be coupled with eacharm 128 andhead 132 so that a predetermined amount of pressure is applied downward on thehead 132 and, therefore, thesurface 116 ofplaten 114 during processing. Alternatively, pneumatic pressure can be used to apply downward pressure onhead 132. - An apparatus according to the present disclosure can include one or more liquid dispensers configured to dispense one or more liquid treatment compositions onto the
major surface 116 of the lappingplate platen 114. As shown,apparatus 100 includes adispensing unit 138 mounted on thebase 110. The dispensingunit 138 can be configured to dispense controlled quantities of a liquid treatment composition onto thesurface 116 of theplaten 114. The liquid treatment composition dispensed on theplaten 114 can be for example in the form of a liquid containing predetermined concentrations of abrasive particles. The dispensingunit 138 can be configured to dispense a liquid treatment composition in various manners depending on the specific operation being performed. For example, the dispensingunit 138 can be configured to dispense a liquid treatment composition in a drip fashion onto thesurface 116. The dispensingunit 138 can be further controlled to either dispense or not dispense a liquid treatment composition for predetermined intervals of time depending on the specific protocol of the operation being performed. - A “single-step” apparatus can be configured to perform only a charging process to embed abrasive particles into the surface of a platen so as to form a lapping plate. For example, such an apparatus may be substantially similar to
apparatus 100 with the exception of having only onearm 128 and oneprocessing head 132. - An example of “charging” the
surface 116 with a slurry of diamond particles to form a charged lapping surface is described herein below in connection withapparatus 100. “Charging” refers to a process of embedding abrasive particles from a suspension in a liquid into thesurface 116 ofplaten 114. Charging can be performed using aprocessing head 132 in combination with a diamond abrasive charging slurry dispensed from dispensingunit 138. Specifically, as discussed above, pneumatics or predetermined weights (not shown) can be coupled with eacharm 128 andhead 132 so that thehead 132 applies a predetermined amount of pressure to thesurface 116 ofplaten 114 to help embed the diamond particles contained in the slurry into the lappingsurface 116. In addition torotating platter 112 andplaten 114 as indicated byarrow 143, aprocessing head 132 can be rotated as indicated byarrow 142 for a period of time to embed a desired amount of abrasive particles into thesurface 116. It is noted thatrotating platter 112 andhead 132 are not restricted to a particular direction of rotation. - Charging can be performed under a variety of
rotatable platter 112 speeds and for a variety of time periods. Charging can be performed for a time period to produce a dense and even coverage of abrasive particles insurface 116. For example, charging can be performed for a time period in the range from 5 to 120 minutes. The rotational speed of the rotatable platter can be in a range from about 10 to 60 rpms to allow the abrasive particles to become fully embedded within thesurface 116. The rotational speed of theprocessing head 132 can also be in a range from about 10 to 60 rpm. - In some embodiments, charging can be performed under constant conditions. Accordingly, rotational velocity of the charging
head 132, pressure, and slurry concentration can be accurately controlled. - An example of a charging
head 132 is further illustrated inFIG. 3 .Head 132 has alower surface 148 that facessurface 116 during charging. As shown,lower surface 148 has three raised, puck-shaped charging rings 146 mounted to thelower surface 148.Rings 146 can be made out of a variety of materials such as zirconia toughened alumina (ZTA), or alumina. Also, any desired number and shape of chargingrings 146 can be used. - In one embodiment, as shown in
FIG. 4 ,head 132 is lowered relative to surface 116 so thathead 132 is in contact withsurface 116 while having a prescribed amount ofweight forcing rings 146 into contact withsurface 116 under a prescribed amount of pressure. During charging, thehead 132 can rotate counter-clockwise as indicated byarrow 142, and theplaten 114/androtatable platter 112 can rotate counter-clockwise as indicated byarrow 143. A slurry containing abrasive particles such as diamond particles can be discharged ontosurface 116 via one or more dispensing units such as dispensingunit 138 discussed above. As the slurry contacts thesurface 116, rings such as 146 drive the diamond particles intosurface 116 so that the particles become fixed to thesurface 116 so as to form an abrasive surface for lapping operations. As shown inFIG. 3 , rings 146 are positioned a distance inward from the perimeter ofhead 132. Accordingly, as shown inFIG. 4 , ashead 132 rotates theperimeter edge 150 ofhead 132 can go beyond theperimeter edge 151 ofplaten 114 so that therings 146 can contact the outer regions ofsurface 116 and theentire surface 116 can be charged with abrasive particles. - As shown by arrow 149 in
FIG. 4 , unused slurry may be discharged fromsurface 116 overedge 151 due to one or more of centrifugal force ofrotating platen 114, androtating rings 146. Slurry such as diamond particle slurry for charging can be relatively quite expensive. There is a desire to reduce the amount of slurry, especially a slurry used in charging such as a diamond slurry, that is discharged over theedge 151 ofplaten 114 and, oftentimes into a waste collection system. It may also be desirable to reduce the amount of one or more additional treatment compositions such as compositions used to oxidizesurface 116. - Embodiments of the present disclosure include a barrier device to substantially contain one or more liquid treatment compositions on the major surface of the lapping plate platen during one or more processing steps (e.g., charging) of the major surface of the lapping plate platen. A barrier device can cause a treatment composition to pool on the surface of the platen so that the treatment composition is available for use by a head such as
head 132. The contained liquid treatment composition (e.g., diamond slurry) can be distributed radially due to platen rotation, which can help cause the liquid to build up moving from an outer perimeter of the platen towards an inner perimeter. Movement of the charging rings can also help distribute the liquid treatment composition. In some embodiments, a spacer can optionally be used between the perimeter of the platen and the barrier so as to permit the perimeter of a processing head to extend beyond the perimeter of the platen and facilitate processing the entire surface of the platen while at the same time containing the treatment composition on the surface of the platen so that it does leak into a waste treatment system. - In some embodiments, a barrier device can be manually coupled to a lapping plate platen so that the barrier can contain one or more liquid treatment compositions on the major surface of the lapping plate platen during one or more processing steps (e.g., charging) of the major surface of the lapping plate platen. In some embodiments, a barrier device can be optionally or alternatively incorporated into an apparatus (e.g., apparatus 100) for processing a major surface of a lapping plate platen, where the barrier can be configured to automatically couple to a lapping plate platen so that the barrier can contain one or more liquid treatment compositions on the major surface of the lapping plate platen during one or more processing steps (e.g., charging) of the major surface of the lapping plate platen.
- An example of manually coupling a barrier to a lapping plate platen is illustrated in connection with
FIGS. 5A-5C . As shown inFIG. 5C , a barrier device is in the form of aring assembly 500 configured to be removably retained against a lappingplate platen 514 during processing of amajor surface 516 of the lappingplate platen 514. As shown inFIG. 5B , thering assembly 500 includes aclamp ring 505 having an adjustableinside perimeter 506 that can be retained against anoutside perimeter 517 of the lappingplate platen 514. Theclamp ring 505 can have aninside perimeter wall 508, anoutside perimeter wall 507, and slot 509 between at least a portion of theinside perimeter wall 508 and theoutside perimeter wall 507. - As also shown in
FIGS. 5A-5C , aring 520 can be slidably positioned within theslot 509 so that theslot 509 supports thering 520. In some embodiments,ring 520 can be an elastic ring. Theelastic ring 520 can be retained against theoutside perimeter 517 of the lappingplate platen 514. As shown inFIG. 5C , when thering assembly 500 is in a closed position theelastic ring 520 extends above themajor surface 516 of the lappingplate platen 514 and forms a barrier to substantially contain a liquid treatment composition (not shown) on themajor surface 516 of the lappingplate platen 514 during processing of themajor surface 516 of the lappingplate platen 514. - An elastic ring can have a variety of heights and thicknesses. In some embodiments, the elastic ring can have a height of at least 0.5 inches, at least 1 inch, or even 1.5 inches. In some embodiments, the elastic ring can extend above the major surface of the lapping plate platen at least 0.1 inches, at least 0.25 inches, or even at least 1 inch. An elastic ring can have a thickness such that it is rigid enough to remain substantially perpendicular to the major surface of the lapping plate platen and form a barrier to liquid treatment compositions used during processing.
- An elastic ring can have a variety of diameters and can be selected based on the diameter of the lapping plate platen. In some embodiments, the elastic ring can have a diameter of 10 inches or more, 12 inches or more, 15 inches or more, or even 20 inches or more.
- An elastic ring can be made out of one or more elastic materials. In some embodiments, an elastic ring can be made out of rubber.
- As shown,
assembly 500 also includes alatch 530 that physically engages theclamp ring 505 and is configured to securely adjust theinside perimeter wall 508 of theclamp ring 505 from an open andremovable position 531 to theclosed position 532 that retains theclamp ring 505 andelastic ring 520 to the lappingplate platen 514 to form the barrier to substantially contain a liquid treatment composition on the major surface of the lapping plate platen during processing of the major surface of the lapping plate platen. - In some embodiments, a continuous elastic band can be manually coupled to lapping plate platen without a metal band. A band having a diameter less than the lapping plate platen can be stretched and placed around the outside perimeter of a lapping plate platen so that a portion of the band sticks above the major surface of the lapping plate platen during processing to contain a liquid treatment composition (e.g., abrasive slurry).
- As mentioned above, the barrier can be configured to automatically couple to a lapping plate platen so that the barrier can contain one or more liquid treatment compositions on the major surface of the lapping plate platen during one or more processing steps (e.g., charging) of the major surface of the lapping plate platen. An embodiment of an automated barrier is described below in connection with
FIGS. 6A-6C . -
FIGS. 6A-6C show a portion of a multi-step apparatus for processing a major surface of a lapping plate platen, that includes amovable barrier mechanism 600.FIG. 6A shows amovable barrier mechanism 600 surrounding apedestal 605 without a lapping plate platen positioned therein. - As shown in
FIG. 6A , amovable barrier mechanism 600 can include one or more ring segments 601 (six shown). In some embodiments, one ormore ring segments 601 can include one or moreelastic ring segments 601. Theelastic ring segments 601 can be securely adjusted from an open position (as shown inFIG. 6B ) to allow one or more liquid treatment compositions to pass through between thebarrier mechanism 600 and the outsidetop perimeter 617 of the lappingplate platen 614 to a closed position (as shown inFIG. 6C ) so that the one or moreelastic ring segments 601 form a barrier that extends above themajor surface 616 of the lappingplate platen 614 to substantially contain one or more liquid treatment compositions (not shown) on themajor surface 616 of the lappingplate platen 614 during one or more processing steps of themajor surface 616 of the lappingplate platen 614. - As mentioned, one or more elastic ring segments can be used. Some embodiments include three or more elastic ring segments, four or more elastic ring segments, five or more elastic ring segments, six or more elastic ring segments, etc.
- An elastic ring can have a variety of heights and thicknesses. In some embodiments, the elastic ring can have a height of at least 0.5 inches, at least 1 inch, or even 1.5 inches. In some embodiments, the elastic ring can extend above the major surface of the lapping plate platen at least 0.1 inches, at least 0.25 inches, or even at least 1 inch. An elastic ring can have a thickness such that it is rigid enough to remain substantially perpendicular to the major surface of the lapping plate platen and form a barrier to liquid treatment compositions used during processing.
- An elastic ring can have a variety of diameters and can be selected based on the diameter of the lapping plate platen. In some embodiments, the elastic ring can have a diameter of 10 inches or more, 12 inches or more, 15 inches or more, or even 20 inches or more.
- An elastic ring can be made out of one or more elastic materials. In some embodiments, an elastic ring can be made out of rubber.
- A movable barrier mechanism can also include three or more rigid segments that support and move the one or more elastic ring segments from an open position to allow one or more liquid treatment compositions to pass through between the barrier mechanism and the outside top perimeter of the lapping plate platen to a closed position so that the one or more elastic ring segments form a barrier that extends above the major surface of the lapping plate platen to substantially contain one or more liquid treatment compositions on the major surface of the lapping plate platen during one or more processing steps of the major surface of the lapping plate platen. As shown in
FIG. 6A ,movable barrier mechanism 600 includes sixrigid segments 620 that support and help move the sixelastic ring segments 601 from the closed position shown inFIG. 6C to the open position shown inFIG. 6B . Each of therigid segments 620 are a u-shaped channel to receive and support theelastic ring segments 601 in a secure manner. The rigid segments can be made out of a variety of rigid materials that can secure the elastic segments, withstand actuation forces, and the processing environment. In some embodiments, thesegments 620 can be made out of material including plastic, metal, and the like. - The
movable barrier mechanism 600 can include a variety of mechanisms to automate the opening and closing of the barrier mechanism relative to a lapping plate platen. As shown inFIGS. 6A-6C ,barrier mechanism 600 includes sixcam levers 625 that are each coupled to a correspondingrigid segment 620. Eachcam lever 625 is coupled to a spring (not shown) so that eachcam lever 625 is spring loaded to cause the correspondingrigid segment 620 to force the correspondingelastic ring segment 601 to the open position as shown inFIG. 6B in biased manner (i.e., without any counter force applied). As shown inFIG. 6C , themovable barrier mechanism 600 also includes a wire mechanism having awire 630 coupled to each of the cam levers 625. The wire mechanism is configured to move thewire 630, thereby moving each of the cam levers 625 against the force of the spring and to the closed position as shown inFIG. 6C . As can be seen in the closed position, theelastic ring segments 601 are retained against theoutside perimeter 617 of the lappingplate platen 614 when thebarrier mechanism 600 is in the closed position. - In some embodiments, the apparatus shown in
FIGS. 6A-6C can optionally include a spacer element (not shown) positioned between theoutside perimeter 617 of the lappingplate platen 614 and theelastic ring segments 601 when in the closed position. With reference toFIG. 4 , a spacer may be desirable in some embodiments so that the outside perimeter of aprocessing head 132 can extend beyond theoutside perimeter 617 of theplaten 614 and facilitate processing the entire surface of the platen while at the same time containing the treatment composition on the surface of the platen. This may be especially desirable if therings 146 do not cause the bottom ofhead 132 to be offset above the top of theelastic ring segments 601. - To charge a
major surface 616 of the lappingplate platen 614 with an abrasive slurry, a lappingplate platen 614 can be positioned on a rotatable platter orpedestal 605. Therotatable platter 605 can be configured to secure and physically support the lappingplate platen 614 during processing of themajor surface 616 of the lappingplate platen 614. As shown inFIG. 6C , during charging, themovable barrier mechanism 600 can be actuated to a closedposition using wire 630 to form a barrier that extends above themajor surface 616 of the lappingplate platen 614 to substantially contain one or more liquid treatment compositions (not shown) on the major surface of the lappingplate platen 614 during charging of themajor surface 616 of the lappingplate platen 614. In the closed position, therigid segments 620 andelastic ring segments 601 are tightly retained against theoutside perimeter 617 of theplaten 614 to contain the abrasive slurry on thesurface 616 during charging. - As shown in
FIG. 6B , during rinsing and/or one or more other liquid processing protocols, thewire 630 can be released so that the springs (not shown) force each of the cam levers outwards, thereby causing an open space to form between theouter perimeter 617 ofplaten 614 and therigid segments 620 andelastic ring segments 601 so that liquid can pass there between and to a drain.
Claims (20)
1-18. (canceled)
19. A method of processing a major surface of a lapping plate platen, wherein the method comprises:
a) positioning a lapping plate platen with respect to a barrier device on a rotatable platter, wherein the rotatable platter is configured to secure and physically support the lapping plate platen during processing of the major surface of the lapping plate platen, and wherein the barrier device is configured to substantially contain one or more liquid treatment compositions on the major surface of the lapping plate platen during processing of the major surface of the lapping plate platen; and
b) dispensing at least one liquid treatment composition onto the major surface of the lapping plate platen to process the major surface of the lapping plate platen while the barrier device substantially contain the at least one liquid treatment compositions on the major surface of the lapping plate platen.
20. The method of claim 19 , wherein the barrier device comprises a barrier ring assembly configured to be removably retained against a lapping plate platen during processing of a major surface of the lapping plate platen, wherein the barrier ring assembly comprises:
a) a clamp ring having an adjustable inside perimeter that can be retained against an outside perimeter of the lapping plate platen, wherein the clamp ring has an inside perimeter wall, an outside perimeter wall, and a slot between at least a portion of the inside perimeter wall and the outside perimeter wall;
b) a barrier ring that can be slidably positioned within the slot so that the slot supports the barrier ring, wherein the barrier ring can be retained against the outside perimeter of the lapping plate platen, wherein when the clamp ring is in a closed position the barrier ring extends above the major surface of the lapping plate platen and forms a barrier to substantially contain the one or more liquid treatment compositions on the major surface of the lapping plate platen during processing of the major surface of the lapping plate platen; and
c) a latch that physically engages the clamp ring and is configured to securely adjust the inside perimeter of the clamp ring from an open and removable position to the closed position that retains the clamp ring and barrier ring to the lapping plate platen to form the barrier to substantially contain the one or more liquid treatment compositions on the major surface of the lapping plate platen during processing of the major surface of the lapping plate platen, wherein the barrier ring assembly is retained against an outside perimeter of the lapping plate platen during processing of a major surface of the lapping plate platen so that the barrier ring forms a barrier that extends above the major surface of the lapping plate platen to substantially contain the one or more liquid treatment compositions on the major surface of the lapping plate platen during one or more processing steps of the major surface of the lapping plate platen.
21. The method of claim 20 , further comprising a spacer element positioned between the outside perimeter of the lapping plate platen and the barrier ring assembly.
22. The method of claim 20 , further comprising an actuatable arm coupled to an apparatus for processing a major surface of a lapping plate platen, wherein the actuatable arm is rotatably coupled to a processing head, wherein the processing head is adapted to force abrasive particles into the major surface of the lapping plate platen, and wherein the actuatable arm is adapted to selectively position the processing head relative to the major surface of the lapping plate platen.
23. The method of claim 22 , wherein the apparatus further comprises one or more liquid dispensers configured to dispense one or more liquid treatment compositions onto the major surface of the lapping plate platen, wherein at least one of the one or more liquid dispensers is in fluid communication with an abrasive slurry.
24. The method of claim 22 , wherein the apparatus further comprises:
a rotatable platter configured to secure and physically support the lapping plate platen during processing of the major surface of the lapping plate platen; and
a motor coupled to the rotatable platter to drive the rotatable platter during the one or more processing steps of the major surface of the lapping plate platen.
25. The method of claim 20 , wherein the barrier ring comprises an elastic ring.
26. The method of claim 25 , wherein the elastic ring has a height of at least 1 inch and extends above the major surface of the lapping plate platen at least 0.25 inches.
27. The method of claim 25 , wherein the elastic ring comprises rubber.
28. The method of claim 25 , wherein the elastic ring has a diameter of 10 inches or more.
29. The method of claim 19 , further comprising an apparatus for processing the major surface of a lapping plate platen, wherein the apparatus comprises:
a rotatable platter configured to secure and physically support the lapping plate platen during processing of the major surface of the lapping plate platen; and
one or more liquid dispensers configured to dispense one or more liquid treatment compositions onto the major surface of the lapping plate platen, wherein the barrier device comprises a movable barrier mechanism, wherein the movable barrier mechanism comprises one or more ring segments, wherein the barrier mechanism is positioned relative to the rotatable platter such that when a lapping plate platen is positioned on the rotatable platter the one or more ring segments can be securely adjusted from an open position to allow one or more liquid treatment compositions to pass through between the barrier mechanism and the outside top perimeter of the lapping plate platen to a closed position so that the one or more ring segments form a barrier that extends above the major surface of the lapping plate platen to substantially contain one or more liquid treatment compositions on the major surface of the lapping plate platen during one or more processing steps of the major surface of the lapping plate platen, wherein barrier mechanism is configured to automatically open to the open position and close to the closed position during the one or more processing steps, wherein the one or more ring segments comprise a plurality of ring segments, wherein each of the plurality of ring segments comprises two ends, wherein the closed position is defined by one end of a first ring segment of the plurality of ring segments abutting one end of a second ring segment of the plurality of ring segments.
30. The method of claim 29 , wherein the one or more ring segments comprise one or more elastic ring segments.
31. The method of claim 29 , wherein the movable barrier mechanism further comprises three or more rigid segments that that support and move the one or more ring segments from an open position to allow one or more liquid treatment compositions to pass through between the barrier mechanism and the outside top perimeter of the lapping plate platen to a closed position so that the one or more ring segments form a barrier that extends above the major surface of the lapping plate platen to substantially contain one or more liquid treatment compositions on the major surface of the lapping plate platen during one or more processing steps of the major surface of the lapping plate platen.
32. The method of claim 31 , wherein each of the three or more rigid segments comprise a u-shaped channel to receive and support the one or more ring segments in a secure manner, wherein the one or more ring segments are elastic ring segments.
33. The method of claim 31 , wherein the three or more rigid segments comprise metal.
34. The method of claim 31 , wherein the movable barrier mechanism further comprises three or more cam levers, wherein each cam lever is coupled to a corresponding rigid segment, and wherein each cam lever is coupled to a spring so that the cam lever is spring loaded to cause the corresponding rigid segment to move a corresponding ring segment to the open position.
35. The method of claim 34 , wherein the movable barrier mechanism further comprises a wire mechanism coupled to each of the cam levers, wherein the wire mechanism comprises a wire and is configured to move each of the cam levers against the spring load and to the closed position.
36. The method of claim 29 , wherein the one or more ring segments are retained against the outside perimeter of the lapping plate platen when in the closed position.
37. The method of claim 29 , further comprising a spacer element positioned between the outside perimeter of the lapping plate platen and the one or more ring segments when in the closed position so that the one or more ring segments form a barrier that extends above the major surface of the lapping plate platen to substantially contain one or more liquid treatment compositions on the spacer element and the major surface of the lapping plate platen during one or more processing steps of the major surface of the lapping plate platen.
Priority Applications (1)
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US18/240,134 US20230405757A1 (en) | 2016-06-30 | 2023-08-30 | Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making |
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US15/198,566 US10682737B2 (en) | 2016-06-30 | 2016-06-30 | Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making |
US16/869,233 US11780048B2 (en) | 2016-06-30 | 2020-05-07 | Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making |
US18/240,134 US20230405757A1 (en) | 2016-06-30 | 2023-08-30 | Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making |
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US16/869,233 Division US11780048B2 (en) | 2016-06-30 | 2020-05-07 | Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making |
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US16/869,233 Active 2037-09-10 US11780048B2 (en) | 2016-06-30 | 2020-05-07 | Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making |
US18/240,134 Pending US20230405757A1 (en) | 2016-06-30 | 2023-08-30 | Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making |
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US16/869,233 Active 2037-09-10 US11780048B2 (en) | 2016-06-30 | 2020-05-07 | Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making |
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US10682737B2 (en) * | 2016-06-30 | 2020-06-16 | Seagate Technology Llc | Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making |
US11020838B2 (en) | 2017-09-01 | 2021-06-01 | Seagate Technology Llc | One or more conformal members used in the manufacture of a lapping plate, and related apparatuses and methods of making |
US10654146B2 (en) | 2018-01-23 | 2020-05-19 | Seagate Technology Llc | One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making |
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US854592A (en) * | 1906-02-05 | 1907-05-21 | Louise Nelson | Baking utensil for cakes and pies. |
US5299393A (en) * | 1992-07-21 | 1994-04-05 | International Business Machines Corporation | Slurry containment device for polishing semiconductor wafers |
US5876271A (en) * | 1993-08-06 | 1999-03-02 | Intel Corporation | Slurry injection and recovery method and apparatus for chemical-mechanical polishing process |
US6439967B2 (en) * | 1998-09-01 | 2002-08-27 | Micron Technology, Inc. | Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies |
US6602108B2 (en) | 1999-04-02 | 2003-08-05 | Engis Corporation | Modular controlled platen preparation system and method |
US6585559B1 (en) | 1999-04-02 | 2003-07-01 | Engis Corporation | Modular controlled platen preparation system and method |
US6443810B1 (en) * | 2000-04-11 | 2002-09-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing platen equipped with guard ring for chemical mechanical polishing |
US6514123B1 (en) * | 2000-11-21 | 2003-02-04 | Agere Systems Inc. | Semiconductor polishing pad alignment device for a polishing apparatus and method of use |
US6916026B2 (en) * | 2001-01-19 | 2005-07-12 | Arturo Meza | Powered turntable with universal, self-adjusting chuck for holding auto wheels and the like for polishing |
US6953385B2 (en) | 2004-02-05 | 2005-10-11 | Hitachi Global Storage Technologies Netherlands B.V. | System, method, and apparatus for non-traditional kinematics/tooling for efficient charging of lapping plates |
US7232363B2 (en) * | 2004-07-22 | 2007-06-19 | Applied Materials, Inc. | Polishing solution retainer |
US8801497B2 (en) | 2009-04-30 | 2014-08-12 | Rdc Holdings, Llc | Array of abrasive members with resilient support |
US10682737B2 (en) * | 2016-06-30 | 2020-06-16 | Seagate Technology Llc | Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making |
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US11780048B2 (en) | 2023-10-10 |
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