US20230209972A1 - Display device and display device manufacturing method - Google Patents
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- US20230209972A1 US20230209972A1 US17/925,848 US202017925848A US2023209972A1 US 20230209972 A1 US20230209972 A1 US 20230209972A1 US 202017925848 A US202017925848 A US 202017925848A US 2023209972 A1 US2023209972 A1 US 2023209972A1
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Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Definitions
- the disclosure relates to a display device and a display device manufacturing method.
- PTL 1 describes that a vapor deposition mask is used for manufacturing the display device including the OLED.
- FIG. 17 and (b) of FIG. 17 are diagrams for describing problems when the light-emitting layers having a plurality of types of different colors are formed by the vapor deposition method using a vapor deposition mask VM, and a resin layer 131 included in the sealing layer is formed using the ink-jet method.
- a display panel 100 illustrate in (a) of FIG. 17 includes a substrate (not illustrated), a thin film transistor layer (not illustrated) provided on the substrate, a display region DA and a frame region NDA around the display region DA, the display region DA and the frame region NDA including the substrate and the thin film transistor layer, a first electrode 122 provided in the display region DA, a peripheral electrode 122 ′ in the same layer as the first electrode 122 provided in the frame region NDA and including a plurality of openings 122 ′N, and an edge cover 123 provided in the display region DA and the frame region NDA to cover an edge of the first electrode 122 and part of the peripheral electrode 122 ′.
- a plurality of spacers 133 is provided on part of the edge cover 123 in the display region DA, and a plurality of spacers 133 ′ is provided on part of the edge cover 123 in the frame region NDA.
- An aspect of the disclosure has been made in view of the problems described above, and an object of the disclosure is to provide a display device and a display device manufacturing method achieving an improved display quality and frame narrowing by suppressing occurrence of display unevenness.
- an edge cover 23 L is provided in the display region DA and the frame region NDA of the display panel 1 .
- the edge cover 23 L is provided to cover an edge of each of the plurality of first electrodes 22 having the island shape (see (a) of FIG. 4 , (a) of FIG. 6 , (a) of FIG. 8 , and (a) of FIG. 10 ), and each of the plurality of first electrode 22 is exposed from the edge cover 23 L by an opening 23 K of the edge cover 23 L, and the red subpixel RSUB, the green subpixel GSUB, and the blue subpixel BSUB are formed on each of the exposed portions.
- a total height of a height of the edge cover 23 L in the frame region NDA and a height of the second spacer 23 H′ is equal to a total height of a height of the edge cover 23 L in the display region DA and a height of the first spacer 23 H, and a total height of the height of the edge cover 23 L in the frame region NDA and a height of the third spacer 23 M is lower than a total height of the height of the edge cover 23 L in the frame region NDA and the height of the second spacer 23 H′.
- the height of the edge cover 23 L in the display region DA and the height of the edge cover 23 L in the frame region NDA are the same.
- the first spacer 23 H and the second spacer 23 H′ are used for disposing the vapor deposition mask VM as described below, and thus the first spacer 23 H and the second spacer 23 H′ have the same height.
- the trench TREN serves to prevent moisture intrusion from the periphery by forming a slit in the flattening film 21 .
- a bottom of the trench TREN is not a wiring line such as an electrode and is an inorganic insulating film 20 .
- the peripheral electrode 22 ′ is connected to a layer SE 9 forming the source electrode, the drain electrode, and the wiring line and are drawn to the outside (see (a) of FIG. 5 and (b) of FIG. 5 , and (a) of FIG. 9 and (b) of FIG. 9 .
- the capacitance element includes the counter electrode CE of the capacitance element formed directly above the inorganic insulating film 18 , the inorganic insulating film 18 , and the capacitance electrode GE’ formed directly below the inorganic insulating film 18 to overlap the counter electrode CE of the capacitance element in the same layer as the layer forming the gate electrode GE.
- a boundary portion between the display region DA and the frame region NDA (first frame region NDA 1 ) is provided with a non-formation region OP of the first electrode 22 and the peripheral electrode 22 ′ for separating the first electrode 22 and the peripheral electrode 22 ′.
- peripheral electrode 22 ′ and the first electrode 22 are formed of the same material, but the present embodiment is not limited to the case, and the peripheral electrode 22 ′ and the first electrode 22 may be formed by different steps using different materials.
- FIG. 13 is a view illustrating a display region DA of a display panel 1 ′ provided in a display device according to the second embodiment
- FIG. 13 and (c) of FIG. 13 are views illustrating frame regions NDA of the display panel 1 ′ provided in the display device according to the second embodiment.
- a step of forming the edge cover 23 L includes a step (S 25 ) of forming films layers forming the edge cover 23 L and part of the first bank BK 1 and part of the second bank BK 2 and a step (S 26 ) of exposing and developing, and a step (S 27 ) of annealing to form each of the edge cover 23 L and the part of the first bank BK 1 and the part of the second bank BK 2 at a predetermined height.
- a step of forming the spacers includes a step (S 28 ) of forming films layers forming the first spacer 33 H and the second spacer 33 H′ the third spacer 33 M, and
- each of the plurality of third spacer groups 23 MG is provided in the frame region NDA close to the display region DA from the trench TREN
- each of the plurality of second spacer groups 23 H′G is provided in the frame region NDA distal to the trench TREN from the display region DA
- the other configurations are as described in the first embodiment.
- components having the same functions as those described in diagrams of the first embodiment are appended with the same reference signs, and descriptions thereof may be omitted.
- FIG. 15 is a plan view illustrating part of a display panel 1 ′′ provided in the display device according to the third embodiment.
- each of the plurality of third spacer groups 23 MG is provided in the frame region NDA close to the display region DA from the trench TREN, and each of the plurality of second spacer groups 23 H′G is provided in the frame region NDA distal to the trench TREN from the display region DA.
- providing the plurality of third spacers 23 M in the frame region NDA close to the display region DA from the trench TREN allows the organic sealing layer 31 to be flatly formed in at least the display region DA near the frame region NDA, achieving the display device having improved display quality and frame narrowing by suppressing occurrence of display unevenness.
- a display device including
- each of the plurality of the second spacer groups and each of the plurality of the third spacer groups are alternately provided in a direction along an edge of the display region.
- the thin film transistor layer includes a flattening film
- each of the plurality of openings overlaps a respective one of the plurality of second spacers or a respective one of the plurality of third spacers.
- the display device according to any one of aspects 1 to 7,
- the display device according to any one of aspects 1 to 5, wherein some openings of the plurality of openings overlap the plurality of second spacers or the plurality of third spacers, and the remaining openings of the plurality of openings overlap the edge cover.
- the flattening film is a polyimide resin or an acrylic resin.
- the present invention can be utilized for a display device and a method for manufacturing the display device.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A display device includes: a substrate; a thin film transistor layer; a display region and a frame region; a light-emitting element layer including a first electrode, a light-emitting layer, and a second electrode in this order from the thin film transistor laver side; a peripheral electrode; an edge cover configured to cover an edge of the first electrode and an edge of the peripheral electrode; a plurality of spacers provided in the display region and the frame region; and a sealing layer. The plurality of spacers includes a plurality of third spacers provided on the edge cover in the frame region. A plurality of third spacer groups including a plurality of adjacent third spacers of the plurality of third spacers is provided. Each of the plurality of third spacer groups is provided in parallel to each other and in a direction intersecting an edge of the display region.
Description
- The disclosure relates to a display device and a display device manufacturing method.
- In recent years, various display devices including a light-emitting element have been developed. Particularly, a display device including an organic light emitting diode (OLED) has drawn a great deal of attention because the device is capable of achieving lower power consumption, smaller thickness, higher picture quality, and the like.
- For example,
PTL 1 describes that a vapor deposition mask is used for manufacturing the display device including the OLED. - PTL 1: JP 2004-14513 A (published on Jan. 15, 2004)
- Unfortunately, when light-emitting layers having a plurality of types of different colors are formed by a vapor deposition method using a vapor deposition mask and a resin layer included in a sealing layer is formed by an ink-jet method, the following problems arise.
- (a) of
FIG. 17 and (b) ofFIG. 17 are diagrams for describing problems when the light-emitting layers having a plurality of types of different colors are formed by the vapor deposition method using a vapor deposition mask VM, and aresin layer 131 included in the sealing layer is formed using the ink-jet method. - A
display panel 100 illustrate in (a) ofFIG. 17 includes a substrate (not illustrated), a thin film transistor layer (not illustrated) provided on the substrate, a display region DA and a frame region NDA around the display region DA, the display region DA and the frame region NDA including the substrate and the thin film transistor layer, afirst electrode 122 provided in the display region DA, aperipheral electrode 122′ in the same layer as thefirst electrode 122 provided in the frame region NDA and including a plurality ofopenings 122′N, and anedge cover 123 provided in the display region DA and the frame region NDA to cover an edge of thefirst electrode 122 and part of theperipheral electrode 122′. A plurality ofspacers 133 is provided on part of theedge cover 123 in the display region DA, and a plurality ofspacers 133′ is provided on part of theedge cover 123 in the frame region NDA. - The
spacer 133 and thespacer 133′ are used for disposing a vapor deposition mask VM illustrated in (a) ofFIG. 17 , and thus thespacer 133 and thespacer 133′ have the same height. - As illustrated in (a) of
FIG. 17 , a portion of the vapor deposition mask VM disposed to face the display region DA includes a large number of openings VMK, but a portion of the vapor deposition mask VM disposed to face the frame region NDA does not include the opening VMK. Thus, a weight of the portion of the vapor deposition mask VM disposed to face the frame region NDA. is heavier than a weight of the portion of the vapor deposition mask VM disposed to face the display region DA. Thus, to support the vapor deposition mask VM with thespacers spacers 133′ by an area of the frame region NDA is required to be larger than a first density obtained by dividing the number of thespacers 133 by an area of the display region DA. - In the
display panel 100 illustrated in (a) ofFIG. 17 , thespacer 133 is formed in the display region DA at a relatively low density, and thespacer 133′ is formed in the frame region NDA at a high density. In addition, as illustrated in (a) ofFIG. 17 , theedge cover 123 is provided in the frame region NDA to form aremoval region 123K of theedge cover 123 for exposing theperipheral electrode 122′ except for a formation region of thespacer 133′. Note that theremoval region 123K of theedge cover 123 is a common electrode in the display region DA and is used to electrically connect a second electrode (not illustrated) extending from the display region DA to the frame region NDAand theperipheral electrode 122′. - A
display panel 140 illustrated in (b) ofFIG. 17 is a view illustrating a case where a light-emitting layer (not illustrated), a second electrode (not illustrated), and a sealing layer including theresin layer 131 are formed on thedisplay panel 100 illustrated in (a) ofFIG. 17 . - The
display panel 140 illustrated in (b) ofFIG. 17 includes theedge cover 123, thespacer 133, and thespacer 133′ formed as described above. - When the
resin layer 131 is formed by the ink-jet method, thespacer 133 is formed at a relatively low density in the display region DA excluding near the edge of the display region DA close to the frame region NDA, and thus thespacer 133 does not have a large adverse effect on spread of theresin layer 131, and theresin layer 131 having a predetermined thickness can be formed. - As illustrated in (b) of
FIG. 17 , however, near the edge of the display region DA close to the frame region NDA and in the frame region NDA, thespacer 133′ formed at a high density has a large adverse effect on the spread of theresin layer 131, and thus theresin layer 131 is formed thicker than the predetermined film thickness. - As described above, in the
display panel 140 illustrated in (b) ofFIG. 17 , theresin layer 131 is formed thicker near the edge of the display region DA close to the frame region NDA from a central portion of the display region DA, and thus a display device including such adisplay panel 140 causes display unevenness in the display region DA. - An aspect of the disclosure has been made in view of the problems described above, and an object of the disclosure is to provide a display device and a display device manufacturing method achieving an improved display quality and frame narrowing by suppressing occurrence of display unevenness.
- To solve the above problems, a display device of the present invention includes
- a substrate,
- a thin film transistor layer provided on the substrate,
- a display region and a frame region around the display region, the display region and the frame region including the substrate and the thin film transistor layer,
- a light-emitting element layer provided in the display region and including a first electrode, a light-emitting layer, and a second electrode in this order from the thin film transistor layer side,
- a peripheral electrode provided in the frame region and including a plurality of openings,
- an edge cover configured to cover an edge of the first electrode and an edge of the peripheral electrode,
- a plurality of spacers provided in the display region and the frame region, and
- a sealing layer provided on a side opposite to the substrate side in at least part of the frame region and in the display region and including a resin layer.
- The plurality of spacers includes a plurality of first spacers provided on the edge cover in the display region and a plurality of second spacers and a plurality of third spacers provided on the edge cover in the frame region,
- a total height of a height of the edge cover in the frame region and a height of each of the plurality of second spacers is equal to a total height of a height of the edge cover in the display region and a height of each of the plurality of first spacers,
- a total height of a height of the edge cover in the frame region and a height of each of the plurality of third spacers is lower than a total height of the height of the edge cover in the frame region and the height of each of the plurality of second spacers,
- a first density obtained by dividing the number of the plurality of first spacers by an area of the display region is smaller than a second density obtained by dividing the number of the plurality of second spacers by an area of the frame region,
- a plurality of third spacer groups including a plurality of adjacent third spacers of the plurality of third spacers is provided, and
- each of the plurality of third spacer groups is provided in parallel to each other and in a direction intersecting an edge of the display region.
- To solve the problem described above, a display device manufacturing method according to the present invention includes
- forming a thin film transistor layer on a substrate,
- forming a first electrode in a display region and forming a peripheral electrode in a frame region around the display region,
- forming an edge cover to cover an edge of the first electrode and an edge of the peripheral electrode,
- forming a plurality of first spacers on the edge cover in the display region, forming a plurality of second spacers on the edge cover in the frame region such that a total height of a height of the edge cover in the frame region and a height of each of the plurality of second spacers is equal to a total height of a height of the edge cover in the display region and a height of each of the plurality of first spacers, and forming a plurality of third spacers on the edge cover in the frame region such that a total height of a height of the edge cover in the frame region and a height of each of the plurality of third spacers is lower than a total height of a height of the edge cover in the frame region and a height of each of the plurality of second spacers,
- disposing a vapor deposition mask on the plurality of first spacers and the plurality of second spacers,
- forming a light-emitting layer via the vapor deposition mask,
- forming a second electrode that is a common electrode in the display region and extends from the display region to the frame region, and
- forming a sealing layer on a side opposite to the substrate side in at least part of the frame region and in the display region and including a resin layer.
- In the forming a plurality of first spacers, a plurality of second spacers, and a plurality of third spacers,
- the plurality of first spacers and the plurality of second spacers are formed such that a first density obtained by dividing the number of the plurality of first spacers by an area of the display region is smaller than a second density obtained by dividing the number of the plurality of second spacers by an area of the frame region,
- a plurality of third spacer groups including a plurality of adjacent third spacers of the plurality of third spacers is formed, and
- each of the plurality of third spacer groups is disposed in parallel to each other and in a direction intersecting an edge of the display region.
- An aspect of the disclosure can provide a display device and a display device manufacturing method achieving an improved di splay quality and frame narrowing by suppressing occurrence of display unevenness.
-
FIG. 1 is a plan view illustrating a display panel provided in a display device according to a first embodiment. -
FIG. 2 is a partially enlarged view of a portion A illustrated inFIG. 1 . -
FIG. 3 is a partially enlarged view of a portion B illustrated inFIG. 1 . -
FIG. 4(a) is a cross-sectional view taken along line C-C′ illustrated inFIG. 3 and is a view illustrating a display region of the display panel, andFIG. 4(b) is a cross-sectional view taken along line C-C′ illustrated inFIG. 3 and is a view illustrating a frame region (first frame region) closest to the display region of the display panel. -
FIG. 5(a) is a cross-sectional view taken along line C-C′ illustrated inFIG. 3 and is a view illustrating a frame region (second frame region) of the display panel, andFIG. 5(b)(b) is a cross-sectional view taken along line C-C′ illustrated inFIG. 3 and is a view illustrating a frame region (third frame region) farthest from the display region of the display panel. -
FIG. 6(a) is a view illustrating a display region of the display device of the first embodiment corresponding to the cross-section of the display panel illustrated in (a) ofFIG. 4 . andFIG. 6(b) is a view illustrating the frame region (first frame region) closest to the display region of the display device of the first embodiment corresponding to the cross-section of the display panel illustrated in (b) ofFIG. 4 . -
FIG. 7(a) is a view illustrating the frame region (second frame region) of the display device of the first embodiment corresponding to the cross-section of the display panel illustrated in (a) ofFIG. 5 , andFIG. 7(b) is a view illustrating the frame region (third frame region) farthest from the display region of the display device of the first embodiment corresponding to the cross-section of the display panel illustrated in (b) ofFIG. 5 . -
FIG. 8(a) is a cross-sectional view taken along line D-D′ illustrated inFIG. 3 and is a view illustrating a display region of the display panel, andFIG. 8(b) is a cross-sectional view taken along line D-D′ illustrated inFIG. 3 and is a view illustrating a frame region (first frame region) closest to the display region of the display panel. -
FIG. 9(a) is a cross-sectional view taken along line D-D′ illustrated inFIG. 3 and is a view illustrating a frame region (second frame region) of the display panel, andFIG. 9(b) is a cross-sectional view taken along line D-D′ illustrated inFIG. 3 and is a view illustrating a frame region (third frame region) farthest from the display region of the display panel. -
FIG. 10(a) is a view illustrating a display region of the display device of the first embodiment corresponding to the cross-section of the display panel illustrated in (a) ofFIG. 8 , andFIG. 10(b) is a view illustrating the frame region (first frame region) closest to the display region of the display device of the first embodiment corresponding to the cross-section of the display panel illustrated in (b) ofFIG. 8 . -
FIG. 11(a) is a view illustrating the frame region (second frame region) of the display device of the first embodiment corresponding to the cross-section of the display panel illustrated in (a) ofFIG. 9 , andFIG. 11(b) is a view illustrating the frame region (third frame region) farthest from the display region of the display device of the first embodiment corresponding to the cross-section of the display panel illustrated in (b) ofFIG. 9 . -
FIG. 12 is a diagram for describing the display device manufacturing method according to the first embodiment. -
FIG. 13(a) is a view illustrating a display region of a display panel provided in a display device according to a second embodiment, andFIGS. 13(b) and (c) are views illustrating frame regions of the display panel provided in the di splay device according to the second embodiment. -
FIG. 14 is a diagram for describing the display device manufacturing method according to the second embodiment. -
FIG. 15 is a plan view illustrating part of a display panel provided in a display device according to a third embodiment. -
FIG. 16 is a plan view illustrating another part of the display panel provided in the display device according to the third embodiment. -
FIGS. 17(a) and (b) are views for describing problems when the light-emitting layers having different colors of the plurality of types are formed by the vapor deposition method using a vapor deposition mask, and a resin layer included in the sealing layer is formed using the ink-jet method. - Embodiments of the disclosure will be described with reference to
FIG. 1 toFIG. 16 as follows. Hereinafter, for convenience of explanation, components having the same functions as those described in a specific embodiment are appended with the same reference signs, and descriptions thereof may be omitted. -
FIG. 1 is a plan view illustrating adisplay panel 1 provided in adisplay device 40 according to a first embodiment. -
FIG. 2 is a partially enlarged view of a portion A illustrated inFIG. 1 , andFIG. 3 is a partially enlarged view of a portion B illustrated inFIG. 1 . - The
display panel 1 illustrated inFIG. 1 toFIG. 3 includes a substrate 10 (seeFIG. 4 toFIG. 11 ), a thin film transistor layer 4 (seeFIG. 4 toFIG. 11 ) provided on thesubstrate 10, a display region DA including thesubstrate 10 and the thinfilm transistor layer 4 and including a red subpixel RSUB, a green subpixel GSUB, and a blue subpixel BSUB, and a frame region NDA around the display region DA. In the present embodiment, a case will be described as an example, in which three types of different subpixels, that is, a red subpixel RSUB, a green subpixel GSUB, and a blue subpixel 13SI_Tfl are provided in the display region DA, and these three subpixels form one pixel, but the present embodiment is not limited to the case, and subpixels of other colors may be further included to form one pixel in addition to these three subpixels. - As illustrated in
FIG. 2 andFIG. 3 , oneperipheral electrode 22′ including a plurality ofopenings 22′ N is provided in the frame region NDA of thedisplay panel 1, and a plurality of first electrodes 22 (not illustrated) (see (a) ofFIG. 4 , (a) ofFIG. 6 , (a) ofFIG. 8 , and (a) ofFIG. 10 ) is provided in an island shape in the same layer as theperipheral electrode 22′ in the display region D A of thedisplay panel 1. Note that, when thefirst electrode 22 is used as an anode, asecond electrode 25 described later is used as a cathode. - In other words, one
peripheral electrode 22′ provided in the frame region NDA of thedisplay panel 1 and including the plurality ofopenings 22′N is provided to surround the display region DA. Note that thefirst electrode 22 is provided in the same layer as theperipheral electrode 22′ means that thefirst electrode 22 and theperipheral electrode 22′ are layers provided in the same step using the same material. - In the present embodiment, a case will be described as an example in which the
peripheral electrode 22′ and thefirst electrode 22 are formed of the same material, but the present embodiment is not limited to the case, and theperipheral electrode 22′ and thefirst electrode 22 may be formed by different steps using different materials. - In the present embodiment, as illustrated in
FIG. 2 andFIG. 3 , anedge cover 23L is provided in the display region DA and the frame region NDA of thedisplay panel 1. In the display region DA, theedge cover 23L is provided to cover an edge of each of the plurality offirst electrodes 22 having the island shape (see (a) ofFIG. 4 , (a) ofFIG. 6 , (a) ofFIG. 8 , and (a) ofFIG. 10 ), and each of the plurality offirst electrode 22 is exposed from theedge cover 23L by anopening 23K of theedge cover 23L, and the red subpixel RSUB, the green subpixel GSUB, and the blue subpixel BSUB are formed on each of the exposed portions. On the other hand, in the frame region NDA, theedge cover 23L is provided to cover theopening 22′N of theperipheral electrode 22′ and an edge of theperipheral electrode 22′, and aremoval region 23K’ of theedge cover 23L is provided to expose theperipheral electrode 22′. - As illustrated in
FIG. 2 andFIG. 3 , a plurality offirst spacers 23H is provided on theedge cover 23L in the display region DA, and a plurality ofsecond spacers 23H′ and a plurality ofthird spacers 23M are provided on theedge cover 23L in the frame region NDA. A total height of a height of theedge cover 23L in the frame region NDA and a height of thesecond spacer 23H′ is equal to a total height of a height of theedge cover 23L in the display region DA and a height of thefirst spacer 23H, and a total height of the height of theedge cover 23L in the frame region NDA and a height of thethird spacer 23M is lower than a total height of the height of theedge cover 23L in the frame region NDA and the height of thesecond spacer 23H′. Note that in the present embodiment, the height of theedge cover 23L in the display region DA and the height of theedge cover 23L in the frame region NDA are the same. Thefirst spacer 23H and thesecond spacer 23H′ are used for disposing the vapor deposition mask VM as described below, and thus thefirst spacer 23H and thesecond spacer 23H′ have the same height. - A portion of the vapor deposition mask VM disposed to face the display region DA (see (a) of
FIG. 4 and (a) ofFIG. 8 ) includes a large number of openings VMK, but a portion of the vapor deposition mask VM disposed to face the frame region NDA (see (b) ofFIG. 4 , (a) ofFIG. 5 and (b) ofFIG. 5 , (b) ofFIG. 8 , (a) ofFIG. 9 and (b) ofFIG. 9 ) does not include the opening VMK, and thus a weight of the portion of the vapor deposition mask VM disposed to face the frame region NDA is heavier than a weight of the portion of the vapor deposition mask VM disposed to face the display region DA. Thus, to support the vapor deposition mask VM with thefirst spacer 23H and thesecond spacer 23H′ so that deflection of such a vapor deposition mask VM does not occur, a second density obtained by dividing the number of thesecond spacers 23′ by the area of the frame region NDA is required to be larger than a first density obtained by dividing the number of thefirst spacers 23 by the area of the display region DA. Thus, as illustrated inFIG. 2 andFIG. 3 , in thedisplay panel 1, the first density is smaller than the second density. - As illustrated in
FIG. 2 andFIG. 3 , provided is a plurality of third spacer groups 23MG including a plurality of adjacentthird spacers 23M of the plurality ofthird spacers 23M provided in the frame region NDA. Each of the plurality of third spacer groups 23MG is provided in parallel to each other and in a direction intersecting an edge DAE of the display region DA. - As illustrated in
FIG. 2 andFIG. 3 , provided is a plurality ofsecond spacer groups 23H′G including a plurality of adjacentsecond spacers 23H′ of the plurality ofsecond spacers 23H′ provided in the frame region NDA. In the present embodiment, as illustrated inFIG. 2 andFIG. 3 , each of the plurality of third spacer groups 23MG and each of the plurality ofsecond spacer groups 23H′G are provided in parallel to each other, but the present embodiment is not limited to the configuration, and if only each of the plurality of third spacer groups 23MG is provided in parallel to each other and in a direction intersecting the edge DAE of the display region DA, each of the plurality ofsecond spacer groups 23H′G may be formed in non-parallel to each of the plurality of third spacer groups 23MG within a range not intersecting each of the plurality of third spacer groups 23MG. - In the present embodiment, as illustrated in
FIG. 2 andFIG. 3 , - each of the plurality of
second spacer groups 23H′G and each of the plurality of third spacer groups 23MG are alternately provided in a direction along the edge DAE of the display region DA (the left-right direction in the case ofFIG. 2 , - the up-down direction in the case of
FIG. 3 ), but the present embodiment is not limited to the configuration. For example, in the direction along the edge DAE of the display region DA, each of the plurality ofsecond spacer groups 23H′G may be partially continuously formed, and each of the plurality of third spacer groups 23MG may be partially continuously formed. - In the present embodiment, as illustrated in
FIG. 2 andFIG. 3 , a trench (groove) TREN extending along the edge DAE of the display region DA is provided in the frame region NDA. of thedisplay panel 1. The trench TREN is a groove formed in a flattening film 21 (see (a) ofFIG. 5 and (a) ofFIG. 9 ) included in the thinfilm transistor layer 4 to expose part of a wiring line formed in the same layer as the source electrode and the drain electrode of the thin film transistor. As illustrated inFIG. 2 ,FIG. 3 , (a) ofFIG. 7 , and (a) ofFIG. 9 , each of the plurality ofsecond spacer groups 23H′G and each of the plurality of third spacer groups 23MG intersect the trench TREN. - In the present embodiment, as illustrated in
FIG. 2 andFIG. 3 , a first slit SL1 and a second slit SL2 extending along the edge DAE of the display region DA are provided in the frame region NDA distal to the plurality ofsecond spacers 23H′ and the plurality ofthird spacers 23M from the display region DA. The first slit SL1 is provided closer to the display region DA than the second slit SL2. - Note that the trench TREN serves to prevent moisture intrusion from the periphery by forming a slit in the flattening
film 21. A bottom of the trench TREN is not a wiring line such as an electrode and is an inorganic insulatingfilm 20. In the first slit SL1 and the second slit SL2 outside the trench TREN, theperipheral electrode 22′ is connected to a layer SE9 forming the source electrode, the drain electrode, and the wiring line and are drawn to the outside (see (a) ofFIG. 5 and (b) ofFIG. 5 , and (a) ofFIG. 9 and (b) ofFIG. 9 . - In the present embodiment, as illustrated in
FIG. 2 andFIG. 3 , a first bank BK1 is provided along the edge DAE of the display region DA between the first slit SL1 and the second slit SL2, and a second bank BK2 is provided along the edge DAE of the display region DA farther from the display region DA than the second slit SL2. - By providing the first slit SL1 and the second slit SL2, a wider contact between the wiring line and the
peripheral electrode 22′ formed in the same layer as the source electrode and the drain electrode of the thin film transistor can be ensured (see (b) ofFIG. 7 and (b) ofFIG. 11 ). The present the configuration is not limited to the configuration, and at least one of the first slit SL1 and the second slit SL2 need not be provided as long as the contact between the wiring line formed in the same layer as the source electrode and the drain electrode of the thin film transistor and theperipheral electrodes 22′ can be sufficiently secured in other portions. - By providing the first bank BK1 and the second bank BK2, spread of an organic sealing layer (resin layer) 31 (see (b) of
FIG. 7 and (b) ofFIG. 11 ) in thesealing layer 6 described later can be controlled relatively easily in a step of forming the organic sealing layer (resin layer) 31. The present embodiment is not limited to the configuration, and at least one of the first bank BK1 and the second bank BK2 need not be provided. Three or more banks may be provided. - (a) of
FIG. 4 is a cross-sectional view taken along line C-C′ illustrated inFIG. 3 and is a view illustrating the display region DA of thedisplay panel 1, and (b) ofFIG. 4 is a cross-sectional view taken along line C-C′ illustrated inFIG. 3 and is a view illustrating a frame region NDA (first frame region NDA1) closest to the display region DA of the display panel. - (a) of
FIG. 5 is a cross-sectional view taken along line C-C′ illustrated inFIG. 3 and is a view illustrating a frame region NDA (second frame region NDA2) of thedisplay panel 1, and (b) ofFIG. 5 is a cross-sectional view taken along line C-C′ illustrated inFIG. 3 and is a view illustrating a frame region NDA (third frame region NDA3) farthest from the display region DA of thedisplay panel 1. - As illustrated in (a) of
FIG. 4 and (b) ofFIG. 4 , and (a) ofFIG. 5 and (b) ofFIG. 5 , thedisplay panel 1 includes thesubstrate 10, aresin film 12, abarrier layer 3, the thinfilm transistor layer 4, the plurality offirst electrodes 22 and theperipheral electrodes 22′ formed in the same layer, and theedge cover 23L, thefirst spacer 23H, thesecond spacer 23H′, and thethird spacer 23M formed in the same layer in this order. - In the present embodiment, a case will be described in which the
edge cover 23L, thefirst spacer 23H, thesecond spacer 23H′, and thethird spacer 23M are formed by one step using the same material, but the present embodiment is not limited to the case, and theedge cover 23L, thefirst spacer 23H, thesecond spacer 23H′, and thethird spacer 23M may be formed by different steps using different materials. - Examples of the
substrate 10 may include a substrate having heat resistance that is resistant to process temperatures in subsequent steps for forming various films, and for example, a glass substrate or the like can be used. - Examples of the material of the
resin film 12 may include a polyimide resin, an epoxy resin, and a polyamide resin. - The
barrier layer 3 is a layer for preventing moisture or impurities from reaching transistors TR1, TR2, TR3, TR4... and light-emitting element layers 5R, 5B... and may be constituted by, for example, a silicon oxide film, a silicon nitride film or a silicon oxynitride film formed by CVD, or a layered film of these films (seeFIG. 10 ). - The transistors TR1, TR2, TR3, TR4... and a capacitance element are provided as an upper layer overlying the
barrier layer 3. The thinfilm transistor layer 4 including the transistors TR1, TR2, TR3, TR4... and the capacitance element includes asemiconductor film 15, an inorganic insulating film (gate insulating film) 16 as an upper layer overlying thesemiconductor film 15, a gate electrode GE, a capacitance electrode GE’, and a wiring line GE” as an upper layer overlying the inorganic insulatingfilm 16, an inorganic insulating film (first insulating film) 18 as an upper layer overlying the gate electrode GE, the capacitance electrode GE’, and the wiring line GE”, a counter electrode CE as an upper layer overlying the inorganic insulatingfilm 18, an inorganic insulating film (second insulating film) 20 as an upper layer overlying the counter electrode CE, layers SE1 to SE9 forming a source electrode, a drain electrode, and a wiring line as an upper layer overlying the inorganic insulatingfilm 20, and a flattening film (interlayer insulating film) 21 as an upper layer overlying the layers SE1 to SE9 forming the source electrode, the drain electrode, and the wiring line. - Note that the capacitance element includes the counter electrode CE of the capacitance element formed directly above the inorganic insulating
film 18, the inorganic insulatingfilm 18, and the capacitance electrode GE’ formed directly below the inorganic insulatingfilm 18 to overlap the counter electrode CE of the capacitance element in the same layer as the layer forming the gate electrode GE. - The transistors (thin film transistors (TFT)) TR1, TR2, TR3, TR4... are formed to include the
semiconductor film 15, the inorganic insulatingfilm 16, the gate electrode GE, the inorganic insulatingfilm 18, the inorganic insulatingfilm 20, the source electrode, and the drain electrode. - The
semiconductor film 15 is formed of low-temperature polysilicon (LTPS) or an oxide semiconductor, for example. - The layers SE1 to SE9 forming the source electrode, the drain electrode, and the wiring line, the gate electrode GE, the capacitance electrode GE, the wiring line GE”, and the counter electrode CE may be formed of a single layer film or a layered film of metal, the metal including at least one of aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper (Cu), and silver (Ag) for example.
- The inorganic insulating
films - The flattening
film 21 may be formed of, for example, a coatable organic material such as a polyimide resin or an acrylic resin and is preferably formed of a photosensitive organic material. - As the
first electrode 22 and theperipheral electrode 22′,silver (Ag) or aluminum (Al) or the like may be used, for example, and a layered body may be used in which a first metal oxide layer having conductivity, a metal layer that reflects visible light, and a second metal oxide layer that transmits visible light and has conductivity are layered in this order. The first metal oxide layer and the second metal oxide layer may be a metal oxide layer selected from indium tin oxide (ITO) and Indium Zinc Oxide (IZO), and the metal layer may be silver (Ag) or aluminum (Al). - The
edge cover 23L, thefirst spacer 23H, thesecond spacer 23H′, and thethird spacer 23M may be formed of, for example, a coatable photosensitive organic material such as a polyimide resin or an acrylic resin. - (a) of
FIG. 4 and (b) ofFIG. 4 , and (a) ofFIG. 5 and (b) ofFIG. 5 illustrate a state in which a blue light-emittinglayer 24B is deposited on thedisplay panel 1 using the vapor deposition mask VM having a large number of openings VMK for forming a blue light-emitting layer to depositing the blue light-emittinglayer 24B at a predetermined position in thedisplay panel 1. Note that on thedisplay panel 1 illustrated in (a) ofFIG. 4 and (b) ofFIG. 4 , and (a) ofFIG. 5 and (b) ofFIG. 5 , a red light-emittinglayer 24R and a green light-emitting layer (not illustrated) have been already deposited at predetermined positions using a vapor deposition mask for forming the red light-emitting layer and a vapor deposition mask for forming the green light-emitting layer. - As illustrated in (b) of
FIG. 4 , and (a) ofFIG. 5 and (b) ofFIG. 5 , theopening 22′N of theperipheral electrode 22′ and - the
third spacer 23M preferably overlap each other. As described above, since theperipheral electrode 22′ is provided as one electrode to surround the display region DA, when the plurality ofopenings 22′N is not provided in theperipheral electrode 22′, the flatteningfilm 21 as a lower layer is a resin layer, and thus the flatteningfilm 21 absorbs water due to retention during manufacturing, water washing, or the like, and the moisture absorbed by the flatteningfilm 21 cannot be discharged through the plurality ofopenings 22′N of theperipheral electrodes 22′, the plurality ofopenings 22′N serving as gas vent holes, thus causing deterioration of the light-emitting element layers 5R, 5B,.. provided in thedisplay panel 1. Each layer provided in the light-emitting element layers 5R, 5B... is a material very weak to moisture. Thus, in the present embodiment, theperipheral electrode 22′ is provided with a large number ofopenings 22′N for allowing a gas component (moisture) to pass through from the flatteningfilm 21. Theedge cover 23L formed of an organic material and thethird spacer 23M formed of an organic material are preferably provided on the plurality ofopenings 22′N. - In the present embodiment, as illustrated in (b) of
FIG. 4 , and (a) ofFIG. 5 and (b) ofFIG. 5 , theperipheral electrode 22′ contacts the flatteningfilm 21 included in the thinfilm transistor layer 4, but the present embodiment is not limited to the configuration. - (a) of
FIG. 8 is a cross-sectional view taken along line D-D′ illustrated inFIG. 3 and is a view illustrating the display region DA of thedisplay panel 1, and (b) ofFIG. 8 is a cross-sectional view taken along line D-D′ illustrated inFIG. 3 and is a view illustrating a frame region NDA (first frame region NDA1) closest to the display region DA of the display panel. - (a) of
FIG. 9 is a cross-sectional view taken along line D-D′ illustrated inFIG. 3 and is a view illustrating a frame region NDA (second frame region NDA2) of thedisplay panel 1, and (b) ofFIG. 9 is a cross-sectional view taken along line D-D′ illustrated inFIG. 3 and is a view illustrating a frame region NDA (third frame region NDA3) farthest from the display region DA of thedisplay panel 1. - (b) of
FIG. 8 , and (a) ofFIG. 9 and (b) ofFIG. 9 are views illustrating part of thedisplay panel 1 including the plurality ofsecond spacer groups 23H′G including the plurality ofsecond spacers 23H′ adjacent to each other in the frame regions NDA (the first frame region NDA1 to the third frame region NDA3). As illustrated in the drawings, each of the plurality ofsecond spacers 23H′ contacts the vapor deposition mask VM, and thus the deflection of the vapor deposition mask VM can be suppressed by the plurality ofsecond spacers 23H′. - On the other hand, (b) of
FIG. 4 , and (a) ofFIG. 5 and (b) ofFIG. 5 are views illustrating part of thedisplay panel 1 including the plurality of third spacer group 23MG including the plurality ofthird spacers 23M adjacent to each other in the frame regions NDA (the first frame region NDA1 to the third frame region NDA3). As illustrated in the drawings, since a height of each of the plurality ofthird spacers 23M is lower than the height of thesecond spacer 23H′, the plurality of third spacer groups 23MG including the plurality ofthird spacers 23M adjacent to each other serves as passages for spreading anorganic sealing layer 31 described later formed in the display region DA to the frame region NDA when theorganic sealing layer 31 included in thesealing layer 6 is formed. Thus, according to the plurality of third spacer groups 23MG, it is possible to suppress theorganic sealing layer 31 from being formed thick near the edge of the display region DA close to the frame region NDA from the central portion of the display region DA. - Note that (a) of
FIG. 4 and (a) ofFIG. 8 are views illustrating part of thedisplay panel 1 including thefirst spacer 23H provided in the display region DA. As illustrated inFIG. 2 andFIG. 3 , since the first density obtained by dividing the number of thefirst spacers 23H by the area of the display region DA is significantly smaller than the second density obtained by dividing the number of thesecond spacers 23H′ by the area of the frame region NDA, thefirst spacer 23H does not adversely affect the spread of theorganic sealing layer 31 in the central portion of the display region DA. - As illustrated in (b) of
FIG. 8 , and (a) ofFIG. 9 and (b) ofFIG. 9 , theopening 22′N of theperipheral electrode 22′ and thesecond spacer 23H′ preferably overlap each other. As described above, since theperipheral electrode 22′ is provided as one electrode to surround the display region DA, when the plurality ofopenings 22′N is not provided in theperipheral electrode 22′, the flatteningfilm 21 as a lower layer is a resin layer, and thus the flatteningfilm 21 absorbs water due to retention during manufacturing, water washing, or the like, and the moisture absorbed by the flatteningfilm 21 cannot be discharged through the plurality ofopenings 22′N of theperipheral electrodes 22′, the plurality ofopenings 22′N serving as gas vent holes, thus causing deterioration of the light-emitting element layers 5R, 5B,... provided in thedisplay panel 1. Each layer provided in the light-emitting element layers 5R, 5B... is a material very weak to moisture. Thus, in the present embodiment, theperipheral electrode 22′ is provided with a large number ofopenings 22′N for allowing a gas component (moisture) to pass through from the flatteningfilm 21. Theedge cover 23L formed of an organic material and thesecond spacer 23H′ formed of an organic material are preferably provided on the plurality ofopenings 22′N. - As illustrated in (a) of
FIG. 4 and (b) ofFIG. 4 , and (a) ofFIG. 8 and (b) ofFIG. 8 , a boundary portion between the display region DA and the frame region NDA (first frame region NDA1) is provided with a non-formation region OP of thefirst electrode 22 and theperipheral electrode 22′ for separating thefirst electrode 22 and theperipheral electrode 22′. - Note that in the present embodiment, a case is described in which the plurality of
openings 22′N of theperipheral electrode 22′ overlap thesecond spacer 23H′ or thethird spacer 23M, but the present embodiment is not limited to the case, and some openings of the plurality ofopenings 22′N of theperipheral electrodes 22′ may overlap thesecond spacer 23H′ or thethird spacer 23M, and the remaining openings of the plurality ofopenings 22′N of theperipheral electrodes 22′ may overlap theedge cover 23L. - (a) of
FIG. 6 is a view illustrating the display region DA of thedisplay device 40 according to the first embodiment corresponding to the cross-section of thedisplay panel 1 illustrated in (a) ofFIG. 4 , and (b) ofFIG. 6 is a view illustrating the frame region NDA (first frame region NDA1) closest to the display region DA of thedisplay device 40 of the first embodiment corresponding to the cross-section of thedisplay panel 1 illustrated in (b) ofFIG. 4 . - (a) of
FIG. 7 is a view illustrating the frame region NDA (second frame region NDA2) of thedisplay device 40 according to the first embodiment corresponding to the cross-section of thedisplay panel 1 illustrated in (a) ofFIG. 5 , and (b) ofFIG. 7 is a view illustrating the frame region NDA (third frame region NDA3) farthest from the display region DA of thedisplay device 40 of the first embodiment corresponding to the cross-section of thedisplay panel 1 illustrated in (b) ofFIG. 5 . - (a) of
FIG. 10 is a view illustrating the display region DA of thedisplay device 40 according to the first embodiment corresponding to the cross-section of thedisplay panel 1 illustrated in (a) ofFIG. 8 , and (b) ofFIG. 10 is a view illustrating the frame region NDA (first frame region NDA1) closest to the display region DA of thedisplay device 40 of the first embodiment corresponding to the cross-section of thedisplay panel 1 illustrated in (b) ofFIG. 8 . - (a) of
FIG. 11 is a view illustrating the frame region NDA (second frame region NDA2) of thedisplay device 40 according to the first embodiment corresponding to the cross-section of thedisplay panel 1 illustrated in (a) ofFIG. 9 , and (b) ofFIG. 11 is a view illustrating the frame region NDA (third frame region NDA3) farthest from the display region DA of thedisplay device 40 of the first embodiment corresponding to the cross-section of thedisplay panel 1 illustrated in (b) ofFIG. 9 . - As illustrated in (a) of
FIG. 6 and (a) ofFIG. 10 , in the display region DA ofdisplay device 40, the light-emitting element layers 5R, 5B... including thefirst electrode 22, the light-emittinglayers second electrode 25 in this order are formed. The light-emittingelement layer 5R is a layer including a light-emitting element that emits red light, and the light-emittingelement layer 5B is a layer including a light-emitting element that emits blue light. Note that although not illustrated in (a) ofFIG. 6 and (a) ofFIG. 10 , in the display region DA ofdisplay device 40, a light-emitting element layer including a light-emitting element that emits green light is also formed. - Although not illustrated in (a) of
FIG. 6 and (a) ofFIG. 10 , the light-emitting element layers 5R, 5B,... provided in the display region DA ofdisplay device 40 may further include at least one of a hole injection layer and a hole transport layer between thefirst electrode 22 and the light-emittinglayers layers second electrode 25. - The
display device 40 includes, for each subpixel, thefirst electrode 22 having the island shape, the light-emittinglayers second electrode 25. - the
first electrode 22 is provided for each subpixel, and thesecond electrode 25 is provided in common with all of the subpixels. - As illustrated in (a) of
FIG. 6 and (b) ofFIG. 6 , (a) ofFIG. 7 and (b) ofFIG. 7 , (a) ofFIG. 10 and (b) ofFIG. 10 , and (a) ofFIG. 11 and (b) ofFIG. 11 , thesealing layer 6 including theorganic sealing layer 31 is provided - on the side opposite to the
substrate 10 side in at least part of the frame region NDA (the first frame region NDA1 to the third frame region NDA3) and in the display region DA of thedisplay device 40. - The
sealing layer 6 is a light transmissive layer and includes a firstinorganic sealing film 30 that covers thesecond electrode 25, anorganic sealing layer 31 formed on a side above the firstinorganic sealing film 30, and a secondinorganic sealing film 32 that covers theorganic sealing layer 31. Thesealing layer 6 that covers the light-emitting element layers 5R, 5B,.., inhibits foreign matters such as water and oxygen from penetrating the light-emitting element layers 5R, 5B,... - Each of the first
inorganic sealing film 30 and the secondinorganic sealing film 32 may include, for example, a silicon oxide film, a silicon nitride film, or a silicon oxynitride film formed by the CVD, or a layered film of the silicon oxide film, the silicon nitride film, and the silicon oxynitride film. Theorganic sealing layer 31 is a light-transmitting organic film thicker than the firstinorganic sealing film 30 and the secondinorganic sealing film 32, and may be formed of a coatable photosensitive organic material such as a polyimide resin or an acrylic resin. - As described above, the present embodiment describes a case in which the
sealing layer 6 including the firstinorganic sealing film 30, the secondinorganic sealing film 32, and theorganic sealing layer 31 between the firstinorganic sealing film 30 and the secondinorganic sealing film 32 is used, but the sealing layer is not limited to the case as long as the sealing layer includes the organic sealing layer. - The
second electrode 25 is the common electrode in the display region DA and extends from the display region DA to the frame region NDA (the first frame region NDA1 to the third frame region NDA3). Thesecond electrode 25 is electrically connected to theperipheral electrode 22′. - As illustrated in (b) of
FIG. 7 and (b) ofFIG. 11 , in the frame region NDA (third frame region NDA3) of thedisplay device 40, theorganic sealing layer 31 included in thesealing layer 6 is formed to a portion contacting the first bank BK1. - As illustrated in (a) of
FIG. 6 and (b) ofFIG. 6 , (a) ofFIG. 7 and (b) ofFIG. 7 , (a) ofFIG. 10 and (b) ofFIG. 10 , and (a) ofFIG. 11 and (b) ofFIG. 11 , in thedisplay device 40, by providing the plurality ofthird spacers 23M described above, theorganic sealing layer 31 can be formed to be flat in the entirety from the display region DA to the frame region NDA (the first frame region NDA1 to the third frame region NDA3), achieving thedisplay device 40 having improved display quality and frame narrowing by suppressing occurrence of display unevenness. - In the present embodiment, as illustrated in (a) of
FIG. 6 and (b) ofFIG. 6 , (a) ofFIG. 7 and (b) ofFIG. 7 , (a) ofFIG. 10 and (b) ofFIG. 10 , and (a) ofFIG. 11 and (b) ofFIG. 11 , a case is described as an example in which the glass substrate is used as thesubstrate 10, but the present embodiment is not limited to the case, and when thedisplay device 40 is formed as a flexible display device, thesubstrate 10 may be peeled off from theresin film 12 by a laser lift off step (LLO step) to form the flexible display device. After thesubstrate 10 is peeled off from theresin film 12 by the LLO step, a film may be attached to theresin film 12 via an adhesive layer to form the flexible display device. -
FIG. 12 is a diagram for describing a manufacturing method of thedisplay device 40 according to the first embodiment. - A step of forming the thin
film transistor layer 4 on thesubstrate 10 includes a step (S1) of forming the flatteningfilm 21 and a step (S2) of patterning the flatteningfilm 21. In the step (S2) of patterning the flatteningfilm 21, the first slit SL1, the second slit SL2, and the trench TREN are formed in the frame region NDA, and a contact hole for electrically connecting the drain electrode SE3 of the transistor TR2 and thefirst electrode 22 is formed in the display region DA. - A step of forming the
first electrode 22 and theperipheral electrode 22′ with the same material to form thefirst electrode 22 in the display region DA and theperipheral electrode 22′ in the frame region NDA around the display region DA includes a step (S3) of forming films thefirst electrode 22 and theperipheral electrode 22′ and a step (S4) of patterning thefirst electrode 22 and theperipheral electrode 22′. In the step (S4) of patterning thefirst electrode 22 and theperipheral electrode 22′, theperipheral electrode 22′ having the plurality ofopenings 22′N is formed in the frame region NDA, and thefirst electrode 22 having the island shape is formed in the display region DA. In the present embodiment, a case will be described as an example in which theperipheral electrode 22′ and thefirst electrode 22 are formed of the same material, but the present embodiment is not limited to the case, and theperipheral electrode 22′ and thefirst electrode 22 may be formed by different steps using different materials. - A step of forming the
edge cover 23L and a step of forming the spacers include a step (S5) of forming films layers forming theedge cover 23L, thefirst spacer 23H and thesecond spacer 23H′ thethird spacer 23M, and the first bank BK1 and second bank BK2, a step (S6) of exposing and developing, and a step (S7) of annealing to form each of theedge cover 23L, thefirst spacer 23H and thesecond spacer 23H′, thethird spacer 23M, and the first bank BK1 and the second bank BK2 at a predetermined height. Note that in the present embodiment, the step of forming theedge cover 23L and the step of forming the spacers are performed simultaneously. In the present embodiment, a case will be described in which theedge cover 23L, thefirst spacer 23H, thesecond spacer 23H′, and thethird spacer 23M are formed by one step using the same material, but the present embodiment is not limited to the case, and theedge cover 23L, thefirst spacer 23H, thesecond spacer 23H′, and thethird spacer 23M may be formed by different steps using different materials. - Note that layers forming the
edge cover 23L, thefirst spacer 23H, thesecond spacer 23H′, thethird spacer 23M, and the first bank BK1 and second bank BK2 may be formed by film formation of, for example, a coatable photosensitive organic material such as a polyimide resin or an acrylic resin. - In a step (S6) of exposing and developing, the coated photosensitive organic material is exposed using a grey-tone mask, and then developed. In the present embodiment, since the coated photosensitive organic material is negative-working, a gray-tone mask is used in which the
edge cover 23L formed in the display region DA and the frame region NDA is exposed to a first accumulated light amount, theedge cover 23L and thefirst spacer 23H formed in the display region DA, theedge cover 23L and thesecond spacer 23H′, and the first bank BK1 and the second bank BK2 formed in the frame region NDA are exposed to a second accumulated light amount, theedge cover 23L and thethird spacer 23M formed in the frame region NDA are exposed to a third accumulated light amount, and theopening 23K of theedge cover 23L in the display region DA and theremoval region 23K’ of theedge cover 23L in the frame region NDA are exposed to a fourth accumulated light amount. Magnitudes of the accumulated light amounts of the exposure light are the second accumulated light amount > the third accumulated light amount > the first accumulated light amount > the fourth accumulated light amount. Note that the fourth accumulated light amount may be zero. - In the present embodiment, a case is described as an example in which the height of the first bank BK1 and the height of the second bank BK2 are equal to the height of the
first spacer 23H and the height of thesecond spacer 23H′, but the present embodiment is not limited to the case, and, for example, each of the height of the first bank BK1 and the height of the second bank BK2 may be different from the height of thefirst spacer 23H and the height of thesecond spacer 23H′. - When the coated photosensitive organic material is positive-working, the magnitudes of the accumulated light amounts of the exposure light are the second accumulated light amount < the third accumulated light amount < the first accumulated light amount < the fourth accumulated light amount.
- Subsequently, a step (S8) of disposing the vapor deposition mask VM on the
first spacer 23H and thesecond spacer 23H′, a step (S9) of forming a film the light-emitting layer via the vapor deposition mask VM, and a step (S10) of forming thesecond electrode 25 which is a common electrode in the display region DA and extends from the display region DA to the frame region NDA are performed, and thus the light-emitting element layers 5R, 5B,... can be provided on the thinfilm transistor layer 4 of thesubstrate 10. - Thereafter, a step (S11) of forming the first
inorganic sealing film 30, a step (S12) of forming a film theorganic sealing layer 31 by the ink-jet method, and a step (S13) of forming the secondinorganic sealing film 32, which are steps of forming thesealing layer 6, were performed to form thesealing layer 6 on the side opposite to thesubstrate 10 side of part of the frame region NDA and the display region DA. - Next, a second embodiment of the present invention will be described with reference to
FIG. 13 andFIG. 14 . Afirst spacer 33H, asecond spacer 33H′, and athird spacer 33M provided in the display device of the present embodiment are different from the first embodiment in that they are formed of a material different from that of theedge cover 23L, and the other configurations are as described in the first embodiment. For convenience of explanation, components having the same functions as those described in diagrams of the first embodiment are appended with the same reference signs, and descriptions thereof may be omitted. - (a) of
FIG. 13 is a view illustrating a display region DA of adisplay panel 1′ provided in a display device according to the second embodiment, and (b) ofFIG. 13 and (c) ofFIG. 13 are views illustrating frame regions NDA of thedisplay panel 1′ provided in the display device according to the second embodiment. - As illustrated in (a) of
FIG. 13 , (b) ofFIG. 13 , and (c) ofFIG. 13 , theedge cover 23L formed in the display region DA and the frame region NDA of thedisplay panel 1′ may be formed of, for example, a coatable photosensitive organic material including a polyimide resin, and thefirst spacer 33H formed in the display region DA of the display-panel 1′ and thesecond spacer 33H′ and thethird spacer 33M formed in the frame region NDA of thedisplay panel 1′ may be formed of an coatable photosensitive organic material including an acrylic resin. The present embodiment is not limited to the configuration, and theedge cover 23L formed in the display region DA and the frame region NDA of thedisplay panel 1′ may be formed of a coatable photosensitive organic material including an acrylic resin, and thefirst spacer 33H formed in the display region DA of thedisplay panel 1′ and thesecond spacer 33H′ and thethird spacer 33M formed in the frame region NDA of thedisplay panel 1′ may be formed of an coatable photosensitive organic material including an polyimide resin. - As described above, in the present embodiment, the
edge cover 23L and thefirst spacer 33H, thesecond spacer 33H′, and thethird spacer 33M may be formed of two different materials, and thus can have a variety of characteristics as compared with a case of being formed of one material. -
FIG. 14 is a diagram for describing the display device manufacturing method according to the second embodiment. - The steps S21 to S24 illustrated in
FIG. 14 are the same as the steps S1 to S4 described above in the first embodiment, and thus the description here is omitted. - A step of forming the
edge cover 23L includes a step (S25) of forming films layers forming theedge cover 23L and part of the first bank BK1 and part of the second bank BK2 and a step (S26) of exposing and developing, and a step (S27) of annealing to form each of theedge cover 23L and the part of the first bank BK1 and the part of the second bank BK2 at a predetermined height. - The height of the
edge cover 23L and the height of the part of the first bank BK1 and the height of the part of the second bank BK2 can be the same, and thus, in the step of forming theedge cover 23L, a normal mask can be used without using the gray-tone mask. That is, in the present embodiment, since the coated photosensitive organic material is negative-working, theedge cover 23L formed in the display region DA and the frame region NDA and the part of the first bank BK1 and the part of the second bank BK2 formed in the frame region NDA are exposed to a fifth accumulated light amount, and theopening 23K of theedge cover 23L in the display region DA and theremoval region 23K’ of theedge cover 23L in the frame region NDA are exposed to a sixth accumulated light amount. Note that the sixth accumulated light amount may be zero. - A step of forming the spacers includes a step (S28) of forming films layers forming the
first spacer 33H and thesecond spacer 33H′ thethird spacer 33M, and - part of remaining first bank BK1 and part of remaining second bank BK2, a step (S29) of exposing and developing, and a step (S30) of annealing to form each of the
first spacer 33H and thesecond spacer 33H′, thethird spacer 33M, the part of the remaining first bank BK1 and the part of the remaining second bank BK2 at a predetermined height. - In the present embodiment, since the coated photosensitive organic material is negative-working, the grey-tone mask was used in which the
first spacer 33H formed in the display region DA, thesecond spacer 33H′, the part of the remaining first bank BK1, and the part of the remaining second bank BK2 formed in the frame region NDA are exposed to a seventh accumulated light amount, and thethird spacer 33M formed in the frame region NDA is exposed to an eighth accumulated light amount. The magnitudes of the accumulated light amounts of the exposure light are the seventh accumulated light amount > the eighth accumulated light amount. - Note that in the present embodiment, after the step of forming the
edge cover 23L, the step of forming the spacers is performed, and the material for forming theedge cover 23L and used in the step of forming theedge cover 23L is the coatable photosensitive organic material including the polyimide resin, and the material for forming the spacer and used in the step of forming the spacer is the coatable photosensitive organic material including the acrylic resin. - Thereafter, by performing steps S31 to S33 illustrated in
FIG. 14 , the light-emitting element layers 5R, 5B,... was provided on the thinfilm transistor layer 4 of thesubstrate 10, and by performing steps S34 to S36 illustrated inFIG. 14 , thesealing layer 6 was formed on the side opposite to thesubstrate 10 side of the part of the frame region NDA and the display region DA. Note that the steps S31 to S36 illustrated inFIG. 14 are the same as the steps S8 to S13 described above in the first embodiment, and thus the description here is omitted. - Next, a third embodiment of the present invention will be described with reference to
FIG. 15 andFIG. 16 . The display device according to the present embodiment differs from the first embodiment in that each of the plurality of third spacer groups 23MG is provided in the frame region NDA close to the display region DA from the trench TREN, and each of the plurality ofsecond spacer groups 23H′G is provided in the frame region NDA distal to the trench TREN from the display region DA, and the other configurations are as described in the first embodiment. For convenience of explanation, components having the same functions as those described in diagrams of the first embodiment are appended with the same reference signs, and descriptions thereof may be omitted. -
FIG. 15 is a plan view illustrating part of adisplay panel 1″ provided in the display device according to the third embodiment. -
FIG. 16 is a plan view illustrating another part of thedisplay panel 1″ provided in the display device according to the third embodiment. Note that thedisplay panel 1″ is obtained in the middle of the manufacturing process of the display device according to the third embodiment. - As illustrated in
FIG. 15 andFIG. 16 , each of the plurality of third spacer groups 23MG is provided in the frame region NDA close to the display region DA from the trench TREN, and each of the plurality ofsecond spacer groups 23H′G is provided in the frame region NDA distal to the trench TREN from the display region DA. - According to the display device including the
display panel 1″ of the present embodiment, providing the plurality ofthird spacers 23M in the frame region NDA close to the display region DA from the trench TREN allows theorganic sealing layer 31 to be flatly formed in at least the display region DA near the frame region NDA, achieving the display device having improved display quality and frame narrowing by suppressing occurrence of display unevenness. - A display device including
- a substrate,
- a thin film transistor layer provided on the substrate,
- a display region and a frame region around the display region, the display region and the frame region including the substrate and the thin film transistor layer,
- a light-emitting element layer provided in the display region and including a first electrode, a light-emitting layer, and a second electrode in this order from the thin film transistor layer side,
- a peripheral electrode provided in the frame region and including a plurality of openings,
- an edge cover configured to cover an edge of the first electrode and an edge of the peripheral electrode,
- a plurality of spacers provided in the display region and the frame region, and
- a sealing layer provided on a side opposite to the substrate side in at least part of the frame region and in the display region and including a resin layer,
- wherein the plurality of spacers includes a plurality of first spacers provided on the edge cover in the display region and a plurality of second spacers and a plurality of third spacers provided on the edge cover in the frame region,
- a total height of a height of the edge cover in the frame region and a height of each of the plurality of second spacers is equal to a total height of a height of the edge cover in the display region and a height of each of the plurality of first spacers,
- a total height of a height of the edge cover in the frame region and a height of each of the plurality of third spacers is lower than a total height of the height of the edge cover in the frame region and the height of each of the plurality of second spacers,
- a first density obtained by dividing the number of the plurality of first spacers by an area of the display region is smaller than a second density obtained by dividing the number of the plurality of second spacers by an area of the frame region,
- a plurality of third spacer groups including a plurality of adjacent third spacers of the plurality of third spacers is provided, and
- each of the plurality of third spacer groups is provided in parallel to each other and in a direction intersecting an edge of the display region.
- The display device according to
aspect 1, - wherein a plurality of second spacer groups including a plurality of adjacent second spacers of the plurality of second spacers is provided, and
- each of the plurality of third spacer groups and each of the plurality of second spacer groups are provided in parallel to each other.
- The display device according to
aspect 2, - wherein each of the plurality of the second spacer groups and each of the plurality of the third spacer groups are alternately provided in a direction along an edge of the display region.
- The display device according to
aspect - wherein the thin film transistor layer includes a flattening film,
- a groove extending along the edge of the display region is formed in the frame region in the flattening film, and
- the groove intersects the plurality of second spacer groups and the plurality of third spacer groups.
- The display device according to
aspect 2 wherein the thin film transistor layer includes a flattening film, - a groove extending along the edge of the display region is formed in the frame region in the flattening film,
- each of the plurality of third spacer groups is provided in the frame region close to the display region from the groove, and
- each of the plurality of second spacer groups is provided in the frame region distal to the groove from the display region.
- The display device according to any one of
aspects 1 to 5, - wherein each of the plurality of openings overlaps a respective one of the plurality of second spacers or a respective one of the plurality of third spacers.
- The display device according to any one of
aspects 1 to 6, wherein the thin film transistor layer includes a flattening film, and the peripheral electrode contacts the flattening film. - The display device according to any one of
aspects 1 to 7, - wherein the second electrode is a common electrode in the display region and extends from the display region to the frame region, and
- the second electrode is electrically connected to the peripheral electrode.
- The display device according to any one of
aspects 1 to 5, wherein some openings of the plurality of openings overlap the plurality of second spacers or the plurality of third spacers, and the remaining openings of the plurality of openings overlap the edge cover. - The display device according to
aspect - wherein the flattening film is a polyimide resin or an acrylic resin.
- The display device according to any one of
aspects 1 to 10, - wherein the edge cover, the plurality of first spacers, the plurality of second spacers, and the plurality of third spacers are the same material.
- The display device according to any one of
aspects 1 to 10, - wherein the edge cover, the plurality of first spacers, the plurality of second spacers, and the plurality of third spacers are different materials.
- The display device according to any one of
aspects 1 to 12, - wherein one or more banks formed along the edge of the display region are provided in the frame region distal to the plurality of second spacers and the plurality of third spacers from the display region.
- A display device manufacturing method including
- forming a thin film transistor layer on a substrate,
- forming a first electrode in a display region and forming a peripheral electrode in a frame region around the display region,
- forming an edge cover to cover an edge of the first electrode and an edge of the peripheral electrode,
- forming a plurality of first spacers on the edge cover in the display region, forming a plurality of second spacers on the edge cover in the frame region such that a total height of a height of the edge cover in the frame region and a height of each of the plurality of second spacers is equal to a total height of a height of the edge cover in the display region and a height of each of the plurality of first spacers, and forming a plurality of third spacers on the edge cover in the frame region such that a total height of a height of the edge cover in the frame region and a height of each of the plurality of third spacers is lower than a total height of a height of the edge cover in the frame region and a height of each of the plurality of second spacers,
- disposing a vapor deposition mask on the plurality of first spacers and the plurality of second spacers,
- forming a light-emitting layer via the vapor deposition mask,
- forming a second electrode that is a common electrode in the display region and extends from the display region to the frame region, and
- forming a sealing layer on a side opposite to the substrate side in at least part of the frame region and in the display region and including a resin layer,
- wherein in the forming a plurality of first spacers, a plurality of second spacers, and a plurality of third spacers,
- the plurality of first spacers and the plurality of second spacers are formed such that a first density obtained by dividing the number of the plurality of first spacers by an area of the display region is smaller than a second density obtained by dividing the number of the plurality of second spacers by an area of the frame region,
- a plurality of third spacer groups including a plurality of adjacent third spacers of the plurality of third spacers is formed, and
- each of the plurality of third spacer groups is disposed in parallel to each other and in a direction intersecting an edge of the display region.
- The display device manufacturing method according to aspect 14,
- wherein in the forming a first electrode and a peripheral electrode, the first electrode and the peripheral electrode are formed of the same material.
- The display device manufacturing method according to
aspect 14 or 15, - wherein the forming an edge cover and the forming a plurality of first spacers, a plurality of second spacers, and a plurality of third spacers are performed simultaneously, and
- the plurality of first spacers, the plurality of second spacers, the plurality of third spacers, and the edge cover are formed of the same material by exposing using a graytone mask and developing.
- The display device manufacturing method according to any one of aspects 14 to 16,
- wherein in the forming a sealing layer, the resin layer is formed by an ink-jet method.
- The present invention is not limited to each of the embodiments described above, and various modifications may be made within the scope of the claims. Embodiments obtained by appropriately combining technical approaches disclosed in each of the different embodiments also fall within the technical scope of the present invention. Furthermore, novel technical features can be formed by combining the technical approaches disclosed in each of the embodiments.
- The present invention can be utilized for a display device and a method for manufacturing the display device.
-
- 1, 1′, 1″ Display panel
- DA Display region
- NDA, NDA1 to NDA3 Frame region
- 4 Thin film transistor layer
- 5R, 5B Light-emitting element layer
- 6 Sealing layer
- 10 Substrate
- 21 Flattening film
- 22 First electrode
- 22′ Peripheral electrode
- 22′N Opening
- 23L Edge cover
- 23K Opening of edge cover
- 23K” Removal region of edge cover
- 23H, 33H First spacer
- 23H′, 33H′ Second spacer
- 23M, 33M Third spacer
- 23H′G Second spacer group
- 23MG Third spacer group
- 24R, 24B Light-emitting layer
- 25 Second electrode
- 31 Organic sealing layer (resin layer)
- 40 Display device
- OP Non-formation region of first electrode and peripheral electrode
- DA Display region
- DAE Edge of display region
- NDA, NDA1 to NDA3 Frame region
- TREN Trench
-
BK 1 First bank - BK2 Second bank
- VM Vapor deposition mask
- VMK Opening
Claims (17)
1. A display device comprising:
a substrate;
a thin film transistor layer provided on the substrate;
a display region and a frame region around the display region, the display region and the frame region including the substrate and the thin film transistor layer;
a light-emitting element layer provided in the display region and including a first electrode, a light-emitting layer, and a second electrode in this order from the thin film transistor layer side;
a peripheral electrode provided in the frame region and including a plurality of openings;
an edge cover configured to cover an edge of the first electrode and an edge of the peripheral electrode;
a plurality of spacers provided in the display region and the frame region; and
a sealing layer provided on a side opposite to the substrate side in at least part of the frame region and in the display region and including a resin layer,
wherein the plurality of spacers includes a plurality of first spacers provided on the edge cover in the display region and a plurality of second spacers and a plurality of third spacers provided on the edge cover in the frame region,
a total height of a height of the edge cover in the frame region and a height of each of the plurality of second spacers is equal to a total height of a height of the edge cover in the display region and a height of each of the plurality of first spacers,
a total height of a height of the edge cover in the frame region and a height of each of the plurality of third spacers is lower than a total height of the height of the edge cover in the frame region and the height of each of the plurality of second spacers,
a first density obtained by dividing the number of the plurality of first spacers by an area of the display region is smaller than a second density obtained by dividing the number of the plurality of second spacers by an area of the frame region,
a plurality of third spacer groups including a plurality of adjacent third spacers of the plurality of third spacers is provided, and
each of the plurality of third spacer groups is provided in parallel to each other and in a direction intersecting an edge of the display region.
2. The display device according to claim 1 ,
wherein a plurality of second spacer groups including a plurality of adjacent second spacers of the plurality of second spacers is provided, and
each of the plurality of third spacer groups and each of the plurality of second spacer groups are provided in parallel to each other.
3. The display device according to claim 2 ,
wherein each of the plurality of the second spacer groups and each of the plurality of the third spacer groups are alternately provided in a direction along an edge of the display region.
4. The display device according to claim 2 ,
wherein the thin film transistor layer includes a flattening film,
a groove extending along the edge of the display region is formed in the frame region in the flattening film, and
the groove intersects the plurality of second spacer groups and the plurality of third spacer groups.
5. The display device according to claim 2 ,
wherein the thin film transistor layer includes a flattening film,
a groove extending along the edge of the display region is formed in the frame region in the flattening film,
each of the plurality of third spacer groups is provided in the frame region close to the display region from the groove, and
each of the plurality of second spacer groups is provided in the frame region distal to the groove from the display region.
6. The display device according to claim 1 ,
wherein each of the plurality of openings overlaps a respective one of the plurality of second spacers or a respective one of the plurality of third spacers.
7. The display device according to claim 1 ,
wherein the thin film transistor layer includes a flattening film, and
the peripheral electrode contacts the flattening film.
8. The display device according to claim 1 ,
wherein the second electrode is a common electrode in the display region and extends from the display region to the frame region, and
the second electrode is electrically connected to the peripheral electrode.
9. The display device according to claim 1 ,
wherein some openings of the plurality of openings overlap the plurality of second spacers or the plurality of third spacers, and
the remaining openings of the plurality of openings overlap the edge cover.
10. The display device according to claim 4 ,
wherein the flattening film is a polyimide resin or an acrylic resin.
11. The display device according to claim 1 ,
wherein the edge cover, the plurality of first spacers, the plurality of second spacers, and the plurality of third spacers are the same material.
12. The display device according to claim 1 ,
wherein the edge cover, the plurality of first spacers, the plurality of second spacers, and the plurality of third spacers are different materials.
13. The display device according to claim 1 ,
wherein one or more banks formed along the edge of the display region are provided in the frame region distal to the plurality of second spacers and the plurality of third spacers from the display region.
14. A display device manufacturing method comprising:
forming a thin film transistor layer on a substrate;
forming a first electrode in a display region and forming a peripheral electrode in a frame region around the display region;
forming an edge cover to cover an edge of the first electrode and an edge of the peripheral electrode;
forming a plurality of first spacers on the edge cover in the display region, forming a plurality of second spacers on the edge cover in the frame region such that a total height of a height of the edge cover in the frame region and a height of each of the plurality of second spacers is equal to a total height of a height of the edge cover in the display region and a height of each of the plurality of first spacers, and forming a plurality of third spacers on the edge cover in the frame region such that a total height of a height of the edge cover in the frame region and a height of each of the plurality of third spacers is lower than a total height of a height of the edge cover in the frame region and a height of each of the plurality of second spacers;
disposing a vapor deposition mask on the plurality of first spacers and the plurality of second spacers;
forming a light-emitting layer via the vapor deposition mask;
forming a second electrode that is a common electrode in the display region and extends from the display region to the frame region; and
forming a sealing layer on a side opposite to the substrate side in at least part of the frame region and in the display region and including a resin layer,
wherein in the forming a plurality of first spacers, a plurality of second spacers, and a plurality of third spacers, the plurality of first spacers and the plurality of second spacers are formed such that a first density obtained by dividing the number of the plurality of first spacers by an area of the display region is smaller than a second density obtained by dividing the number of the plurality of second spacers by an area of the frame region,
a plurality of third spacer groups including a plurality of adjacent third spacers of the plurality of third spacers is formed, and
the plurality of third spacers is formed such that each of the plurality of third spacer groups is disposed in parallel to each other and in a direction intersecting an edge of the display region.
15. The display device manufacturing method of according to claim 14 ,
wherein in the forming a first electrode and a peripheral electrode, the first electrode and the peripheral electrode are formed of the same material.
16. The display device manufacturing method according to claim 14 ,
wherein the forming an edge cover and the forming a plurality of first spacers, a plurality of second spacers, and a plurality of third spacers are performed simultaneously, and
the plurality of first spacers, the plurality of second spacers, the plurality of third spacers, and the edge cover are formed of the same material by exposing using a gray-tone mask and developing.
17. The display device manufacturing method according to claim 14 ,
wherein in the forming a sealing layer, the resin layer is formed by an ink-jet method.
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PCT/JP2020/022562 WO2021250749A1 (en) | 2020-06-08 | 2020-06-08 | Display device and display device manufacturing method |
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