US20230171987A9 - Flexible display module, method for manufacturing the same, and flexible display device - Google Patents
Flexible display module, method for manufacturing the same, and flexible display device Download PDFInfo
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- US20230171987A9 US20230171987A9 US16/909,405 US202016909405A US2023171987A9 US 20230171987 A9 US20230171987 A9 US 20230171987A9 US 202016909405 A US202016909405 A US 202016909405A US 2023171987 A9 US2023171987 A9 US 2023171987A9
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- H01L51/5253—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- H01L27/323—
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- H01L27/3276—
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- H01L51/56—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- H01L2227/323—
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- H01L2251/5338—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present disclosure relates to the field of display technology, especially to a flexible display module, a method for manufacturing the same, and a flexible display device.
- narrow-frame and frameless display screens extend the bending region of the display screen using pad bending technology so as to bend the bonding region to the back of the display panel to reduce the area of the peripheral region on the periphery of display region.
- the current pad bending technology requires addition of three mask processes, i.e., EBA (etch bending A) and EBB (etch bending B) etching and opening processes performed in the bending region, and a filling process performed at the openings of the bending region.
- EBA etch bending A
- EBB etch bending B
- Embodiments of the present disclosure provide a flexible display module, a method for manufacturing the same, and a flexible display device, which can simplify the manufacturing process of the flexible display module.
- a flexible display module comprises: a flexible display panel; and a first transparent conductive layer disposed on a light exit side of the flexible display panel.
- the flexible display panel comprises a main display region, a bending region, and a driving circuit region; the main display region comprises a pixel array layer.
- the first transparent conductive layer comprises a first touch electrode located in the main display region, a driving circuit located in the driving circuit region, a first touch electrode lead electrically connected to the first touch electrode and the driving circuit, respectively, and a wiring electrically connecting the pixel array layer and the driving circuit.
- the flexible display module further comprises: a second transparent conductive layer and an insulating layer stacked with the first transparent conductive layer on the light exit side of the flexible display panel.
- the first transparent conductive layer and the second transparent conductive layer are spaced apart by the insulating layer.
- the second transparent conductive layer comprises a second touch electrode located in the main display region, and a second touch electrode lead electrically connected to the second touch electrode and the driving circuit, respectively.
- the second transparent conductive layer is disposed between the first transparent conductive layer and the flexible display panel.
- the bending region is located between the main display region and the driving circuit region.
- the bending region comprises a groove. An edge of the groove close to the main display region is flush with an edge of the insulating layer close to the driving circuit region.
- the flexible display module further comprises: a planarization layer disposed on a side of the first transparent conductive layer facing away from the flexible display panel.
- the planarization layer covers the main display region, the bending region and the driving circuit region.
- a material of the planarization layer comprises an organic insulating material, and the planarization layer fills the groove.
- a flexible display device comprising the flexible display module described in any one of the foregoing embodiments.
- a method for manufacturing a flexible display module comprises: forming a flexible display panel, the flexible display panel comprising a main display region, a bending region, and a driving circuit region, the main display region comprising a pixel array layer; and forming a first transparent conductive layer on a light exit side of the flexible display panel.
- the first transparent conductive layer comprising a first touch electrode located in the main display region, a driving circuit located in the driving circuit region, a first touch electrode lead electrically connected to the first touch electrode and the driving circuit, respectively, and a wiring electrically connecting the pixel array layer and the driving circuit.
- the method before forming a first transparent conductive layer on a light exit side of the flexible display panel, the method further comprises: forming a second transparent conductive layer and an insulating layer successively on the light exit side of the flexible display panel.
- the second transparent conductive layer comprises a second touch electrode located in the main display region, and a second touch electrode lead electrically connected to the second touch electrode and the driving circuit, respectively.
- the first transparent conductive layer and the second transparent conductive layer are spaced apart by the insulating layer.
- the bending region is located between the main display region and the driving circuit region.
- the method further comprises: forming a groove in the bending region. An edge of the groove close to the main display region is flush with an edge of the insulating layer close to the driving circuit region.
- forming a groove in the bending region comprises: forming an insulating film and a first photoresist pattern successively on a side of the second transparent conductive layer facing away from the flexible display panel, the first photoresist pattern comprising a photoresist completely-removed region, the photoresist completely-removed region at least corresponding to a portion of the bending region; over-etching the insulating film to obtain the insulating layer; stripping off the first photoresist pattern, and forming a second photoresist pattern on a side of the insulating layer facing away from the flexible display panel; and etching a portion of the flexible display panel that is located in the bending region to obtain the groove.
- the method further comprises: forming a planarization layer on a side of the first transparent conductive layer facing away from the flexible display panel, the planarization layer covering the main display region, the bending region, and the driving circuit region.
- a material of the planarization layer comprises an organic insulating material, and the planarization layer fills the groove.
- FIG. 1 is a schematic structural view of a flexible display device provided by an embodiment of the present disclosure
- FIG. 2 a is a schematic structural view of a flexible display module provided by an embodiment of the present disclosure
- FIG. 2 b is a top view of the embodiment shown in FIG. 2 a in a direction perpendicular to the flexible display panel;
- FIG. 3 is a schematic structural view of a flexible display module provided by an embodiment of the present disclosure.
- FIG. 4 is a schematic structural view of a flexible display module provided by the related art
- FIG. 5 is a schematic structural view of a flexible display module provided by an embodiment of the present disclosure.
- FIG. 6 is a schematic structural view of a flexible display module provided by an embodiment of the present disclosure.
- FIG. 7 is a flow chart of manufacturing a flexible display module provided by an embodiment of the present disclosure.
- FIG. 8 is a schematic view illustrating a process of manufacturing a flexible display module provided by an embodiment of the present disclosure
- FIG. 9 is a flow chart of manufacturing a groove provided by an embodiment of the present disclosure.
- FIG. 10 is a schematic view illustrating a process of manufacturing a groove provided by an embodiment of the present disclosure.
- FIG. 11 is a schematic view illustrating a process of manufacturing a groove provided by an embodiment of the present disclosure.
- a flexible display device may be used as a mobile phone, a tablet computer, a personal digital assistant (PDA), an in-vehicle computer, etc.
- PDA personal digital assistant
- the specific use of the flexible display device is not particularly limited in embodiments of the present disclosure.
- the flexible display device may comprise, for example, a frame 1 , a flexible display module 2 , a circuit board 3 , a cover plate 4 , and other electronic accessories including a camera and the like.
- the flexible display module 2 comprises a flexible display panel and a functional layer integrated on the flexible display panel.
- the functional layer may be, for example, a polarizer, a touch structure, or the like.
- the frame 1 may be a U-shaped frame, and the flexible display module 2 and the circuit board 3 are disposed in the frame 1 .
- the cover plate 4 is disposed on the light exit side of the flexible display module 2
- the circuit board 3 is disposed on a side of the flexible display panel facing away from the cover plate 4 .
- An embodiment of the present disclosure provides a flexible display module 2 , which can be used as the flexible display module 2 in the above-mentioned flexible display device.
- the flexible display module 2 comprises a flexible display panel 10 , and a first transparent conductive layer 21 disposed on the light exit side of the flexible display panel 10 .
- the flexible display panel 10 comprises a main display region 101 , a bending region 102 , and a driving circuit region 103 .
- the main display region 101 comprises a pixel array layer 11 .
- the first transparent conductive layer 21 comprises a first touch electrode 211 located in the main display region 101 , a driving circuit 212 located in the driving circuit region 103 , and a first touch electrode lead 213 electrically connected to the first touch electrode 211 and the driving circuit 212 , respectively, and a wiring 214 electrically connecting the pixel array layer and the driving circuit 212 .
- the flexible display panel 10 may be, for example, an OLED display panel, a micro-light emitting diode (Micro-LED) display panel, or a quantum dot light emitting diode (QLED) display panel.
- OLED organic light emitting diode
- QLED quantum dot light emitting diode
- the flexible display panel 10 comprises a plurality of sub-pixels.
- the pixel array layer in the flexible array substrate comprises functional structures for constituting sub-pixels.
- the pixel array layer comprises a pixel circuit and a light emitting device 14 .
- the pixel circuit comprises a thin film transistor 13 , a capacitor, and the like.
- the thin film transistor 13 may be a bottom gate type, a top gate type, a double gate type, or the like.
- the light emitting device 14 comprises a first electrode 141 , a light emitting functional layer 142 , and a second electrode 143 .
- a pixel defining layer 15 is provided between adjacent light emitting devices 14 .
- the first electrode 141 is an anode and the second electrode 143 is a cathode, or the first electrode 141 is a cathode and the second electrode 143 is an anode.
- the light emitting functional layer 142 is an organic light emitting functional layer. If the flexible display panel 10 is a QLED display panel, the light emitting functional layer 142 is a quantum dot light emitting functional layer.
- the light emitting device 14 is a Micro-LED light emitting unit.
- Each Micro-LED light emitting unit is electrically connected to a first operating voltage (VDD) layer and a second operating voltage (VSS) layer, respectively.
- the flexible display panel 10 further comprises an encapsulation layer 16 for encapsulating the light emitting device 14 so as to prevent the light emitting device 14 from being in contact with water vapor and oxygen.
- the driving circuit comprises a plurality of different output terminals, which are electrically connected to the first touch electrode lead and the wiring respectively so as to avoid a short circuit between the first touch electrode electrically connected to the first touch electrode lead and the pixel array layer electrically connected to the wiring.
- the wiring includes multiple sub-wirings, and each sub-wiring is electrically connected to at least part of the conductive structures in the pixel array layer.
- the thin film transistor 13 comprises conductive structures such as a gate, a source and a drain.
- the sub-wiring may be used as a gate line and electrically connected to the gate of the thin film transistor 13 .
- the sub-wiring may also be used as a data line and electrically connected to the source of the thin film transistor 13 .
- the flexible display module 2 in order to enable the flexible display module 2 to realize a touch function, only comprises a layer of first touch electrode.
- the flexible display module 2 further comprises a second touch electrode disposed in a different layer from the first touch electrode.
- the first touch electrode is located in the main display region 101 and the driving circuit is located in the driving circuit region 103 . Therefore, the first touch electrode lead electrically connected to the first touch electrode and the driving circuit respectively should be located in the main display region 101 , the bending region 102 , and the driving circuit region 103 .
- the flexible display panel 10 comprises an array substrate, and the array substrate comprises a substrate.
- the substrate should at least comprise a flexible substrate 111 .
- the substrate may further comprise a spacer layer 112 , and the material of the spacer layer 112 includes an inorganic insulating material.
- one or more layers of the flexible substrate 111 and the spacer layer 112 may be stacked alternately.
- a spacer layer 112 may be disposed at a position closest to the first transparent conductive layer 21 to improve the performance of the pixel array layer 11 disposed on the substrate.
- the driving circuit 33 has been formed.
- the insulating structure 31 between the touch structure 32 and the flexible display panel, and the insulating structure 31 should at least expose the driving circuit 33 , so that the touch structure 32 is electrically connected to the driving circuit 33 .
- the insulating structure 31 has a certain pattern, which needs to be made by one mask process.
- the first transparent conductive layer comprises a driving circuit, a first touch electrode, a first touch electrode lead, and a wiring.
- the driving circuit, the first touch electrode, the first touch electrode lead, and the wiring can be obtained using the same mask process, which can simplify the manufacturing process of the flexible display module 2 and reduce the manufacturing cost.
- the driving circuit, the first touch electrode, the first touch electrode lead, and the wiring may be formed simultaneously, a short circuit will not occur among the first touch electrode, the first touch electrode lead, and the wiring.
- there is no need to dispose an insulating structure between the flexible display panel and the first transparent conductive layer which can further reduce one mask process and decrease the thickness of the flexible display module.
- the flexible display module 2 further comprises a second transparent conductive layer 22 and an insulating layer 23 stacked with the first transparent conductive layer 21 on the light exit side of the flexible display panel 10 .
- the first transparent conductive layer 21 and the second transparent conductive layer 22 are spaced apart by the insulating layer 23 .
- the second transparent conductive layer 22 comprises a second touch electrode located in the main display region 101 , and a second touch electrode lead electrically connected to the second touch electrode and the driving circuit, respectively.
- the second transparent conductive layer 22 is located between the flexible display panel 10 and the first transparent conductive layer 21 , or the second transparent conductive layer 22 is located on a side of the first transparent conductive layer 21 facing away from the flexible display panel 10 .
- the material of the insulating layer 23 is not limited as long as it can provide an insulating effect.
- the material of the insulating layer 23 is silicon nitride.
- the second touch electrode is located in the main display region 101 and the driving circuit is located in the driving circuit region 103 . Therefore, the second touch electrode lead electrically connected to the second touch electrode and the driving circuit respectively should be located in the main display region 101 , the bending region 102 , and the driving circuit region 103 .
- the first touch electrode and the second touch electrode are disposed in different layers to realize mutual-capacitive touch.
- the bending region 102 is located between the main display region 101 and the driving circuit region 103 , and the bending region 102 comprises a groove.
- the edge of the groove close to the main display region 101 is flush with the edge of the insulating layer 23 close to the driving circuit region 103 .
- the groove corresponds to the entire bending region 102 .
- the groove corresponds to a portion of the bending region 102 .
- the substrate includes a flexible substrate 111 and a spacer layer 112 , and the spacer layer 112 is disposed closer to the first transparent conductive layer 21 than the flexible substrate 111 , the portions in the spacer layer 112 , the first gate insulating layer 131 , the second gate insulating layer 132 , and the interlayer insulating layer 133 that are located in the bending region 102 are hollowed out to form a groove.
- both the EBA and EBB processes need to be performed to form the groove completely.
- the insulating layer 23 between the first transparent conductive layer 21 and the second transparent conductive layer 22 , in the case of ensuring that the insulating layer 23 covers the second transparent conductive layer 22 , it is possible to etch at least one of the interlayer insulating layer 133 , the second gate insulating layer 132 , the first gate insulating layer 131 , and the spacer layer 112 while the insulating layer 23 is being formed, thereby omitting one of the EBA or EBB process.
- the flexible display module 2 further comprises a planarization layer 24 disposed on a side of the first transparent conductive layer 21 facing away from the flexible display panel 10 .
- the planarization layer 24 covers the main display region 101 , the bending region 102 , and driving circuit region 103 .
- the material of the planarization layer 24 includes an organic insulating material, and the planarization layer 24 fills the groove.
- the material of the planarization layer 24 includes an organic insulating material.
- the organic insulating material is more flexible than the inorganic insulating material.
- the flexible display module 2 further comprises a first conductive structure 41 and a second conductive structure 42 located in the driving circuit region 103 .
- the first conductive structure 41 and the second conductive structure 42 are stacked.
- the first conductive structure 41 or the second conductive structure 42 includes a plurality of protrusions.
- the protrusions are in direct contact with the second conductive structure 42 .
- the second conductive structure 42 includes a plurality of protrusions
- the protrusions are in direct contact with the first conductive structure 41 .
- first conductive structure 41 and the second conductive structure 42 are electrically connected to the first transparent conductive layer 21 .
- first conductive structure 41 and the second conductive structure 42 may be electrically connected to the first touch electrode lead.
- first conductive structure 41 and the second conductive structure 42 may also be electrically connected to the wiring.
- the resistance of the wiring or the first touch electrode lead can be reduced by jumpering the wiring or the first touch electrode lead in the first transparent conductive layer 21 .
- the gate line or data line can be jumpered, which can also play a role in preventing static electricity.
- a flexible display panel comprises a main display region 101 , a bending region 102 , and a driving circuit region 103 .
- the main display region 101 comprises a pixel array layer 11 .
- the method for manufacturing the flexible display module 2 can be implemented by the following steps.
- the flexible display panel 10 comprises a main display region 101 , a bending region 102 , and a driving circuit region 103 .
- the main display region 101 comprises a pixel array layer 11 .
- the flexible display panel 10 may be, for example, an OLED display panel, a Micro-LED display panel, or a QLED display panel.
- the flexible display panel 10 comprises a plurality of sub-pixels.
- the pixel array layer in the flexible array substrate comprises functional structures for constituting sub-pixels.
- the pixel array layer comprises a pixel circuit and a light emitting device 14 .
- the pixel circuit comprises a thin film transistor 13 , a capacitor, and the like.
- the thin film transistor 13 may be a bottom gate type, a top gate type, a double gate type, or the like.
- the light emitting device 14 comprises a first electrode 141 , a light emitting functional layer 142 , and a second electrode 143 .
- a pixel defining layer 15 is provided between adjacent light emitting devices 14 .
- the first electrode 141 is an anode and the second electrode 143 is a cathode, or the first electrode 141 is a cathode and the second electrode 143 is an anode.
- the light emitting functional layer 142 is an organic light emitting functional layer. If the flexible display panel 10 is a QLED display panel, the light emitting functional layer 142 is a quantum dot light emitting functional layer.
- the light emitting device 14 is a Micro-LED light emitting unit.
- Each Micro-LED light emitting unit is electrically connected to a first operating voltage (VDD) layer and a second operating voltage (VSS) layer, respectively.
- the flexible display panel 10 further comprises an encapsulation layer 16 for encapsulating the light emitting device 14 to prevent the light emitting device 14 from being in contact with water vapor and oxygen.
- the flexible display panel 10 comprises an array substrate, and the array substrate comprises a substrate.
- the substrate should at least comprise a flexible substrate 111 .
- the substrate may further comprise a spacer layer 112 , and the material of the spacer layer 112 includes an inorganic insulating material.
- one or more layers of the flexible substrate 111 and the spacer layer 112 may be stacked alternately.
- a spacer layer 112 may be disposed at a position closest to the first transparent conductive layer 21 to improve the performance of the pixel array layer 11 disposed on the substrate.
- the first transparent conductive layer 21 comprises a first touch electrode 211 located in the main display region 101 , a driving circuit 212 located in the driving circuit region 103 , a first touch electrode lead 213 electrically connected to the first touch electrode 211 and the driving circuit 212 , respectively, and a wiring 214 electrically connecting the pixel array layer and the driving circuit 212 .
- the driving circuit comprises a plurality of different output terminals, which are electrically connected to the first touch electrode lead and the wiring respectively, so as to avoid a short circuit between the first touch electrode electrically connected to the first touch electrode lead and the pixel array layer electrically connected to the wiring.
- the wiring includes multiple sub-wirings, and each sub-wiring is electrically connected to at least part of the conductive structures in the pixel array layer.
- the thin film transistor 13 comprises conductive structures such as a gate, a source and a drain.
- the sub-wiring can be used as a gate line and electrically connected to the gate of the thin film transistor 13 .
- the sub-wiring can also be used as a data line and electrically connected to the source of the thin film transistor 13 .
- the flexible display module 2 in order to enable the flexible display module 2 to realize a touch function, only comprises a layer of first touch electrode.
- the flexible display module 2 further comprises a second touch electrode disposed in a different layer from the first touch electrode.
- the first touch electrode is located in the main display region 101 and the driving circuit is located in the driving circuit region 103 . Therefore, the first touch electrode lead electrically connected to the first touch electrode and the driving circuit respectively should be located in the main display region 101 , the bending region 102 , and the driving circuit region 103 .
- the driving circuit 33 has been formed.
- the insulating structure 31 between the touch structure 32 and the flexible display panel, and the insulating structure 31 should at least expose the driving circuit 33 , so that the touch structure 32 is electrically connected to the driving circuit 33 .
- the insulating structure 31 has a certain pattern, which needs to be made by one mask process.
- the first transparent conductive layer comprises a driving circuit, a first touch electrode, a first touch electrode lead, and a wiring.
- the driving circuit, the first touch electrode, the first touch electrode lead, and the wiring can be obtained using the same mask process, which can simplify the manufacturing process of the flexible display module 2 and reduce the manufacturing cost.
- the driving circuit, the first touch electrode, the first touch electrode lead, and the wiring may be formed simultaneously, a short circuit will not occur among the first touch electrode, the first touch electrode lead, and the wiring.
- there is no need to dispose an insulating structure between the flexible display panel and the first transparent conductive layer which can further reduce one mask process and decrease the thickness of the flexible display module.
- the method before forming a first transparent conductive layer 21 on the light exit side of the flexible display panel, the method further comprises: forming a second transparent conductive layer 22 and an insulating layer 23 successively on the light exit side of the flexible display panel 10 .
- the second transparent conductive layer 22 comprises a second touch electrode located in the main display region 101 , and a second touch electrode lead electrically connected to the second touch electrode and the driving circuit, respectively.
- the first transparent conductive layer 21 and the second transparent conductive layer 22 are spaced apart by the insulating layer 23 .
- the material of the insulating layer 23 is not limited as long as it can provide an insulating effect.
- the material of the insulating layer 23 is silicon nitride.
- the second touch electrode is located in the main display region 101 and the driving circuit is located in the driving circuit region 103 . Therefore, the second touch electrode lead electrically connected to the second touch electrode and the driving circuit respectively should be located in the main display region 101 , the bending region 102 , and the driving circuit region 103 .
- the first touch electrode and the second touch electrode are disposed in different layers to realize mutual-capacitive touch.
- the bending region 102 is located between the main display region 101 and the driving circuit region 103 , and the bending region 102 comprises a groove.
- a method for manufacturing the groove comprises the following steps.
- the first photoresist pattern 51 includes a photoresist completely-removed region, and the photoresist completely-removed region at least corresponds to a portion of the bending region 102 .
- the portion in the interlayer insulating layer 133 that is located in the bending region 102 is at least etched, and the portions in the second gate insulating layer 132 , the first gate insulating layer 131 , etc. that are located in the bending region 102 may even be etched.
- the first photoresist pattern 51 may be removed by an ashing process.
- the remaining parts of the portions in the interlayer insulating layer 133 , the second gate insulating layer 132 , the first interlayer insulating layer 131 , and the spacer layer 112 that are located in the bending region 102 are etched.
- the substrate includes a flexible substrate 111 and a spacer layer 112 , and the spacer layer 112 is disposed closer to the first transparent conductive layer 21 than the flexible substrate 111 , the portions in the spacer layer 112 , the first gate insulating layer 131 , the second gate insulating layer 132 , and the interlayer insulating layer 133 that are located in the bending region 102 are hollowed out to form a groove.
- both the EBA and EBB processes need to be performed to form the groove completely.
- the insulating layer 23 between the first transparent conductive layer 21 and the second transparent conductive layer 22 , in the case of ensuring that the insulating layer 23 covers the second transparent conductive layer 22 , it is possible to etch at least one of the interlayer insulating layer 133 , the second gate insulating layer 132 , the first gate insulating layer 131 , and the spacer layer 112 while the insulating layer 23 is being formed, thereby omitting one of the EBA or EBB process.
- the method further comprises: forming a planarization layer 24 on a side of the first transparent conductive layer 21 facing away from the flexible display panel 10 .
- the planarization layer 24 covers the main display region 101 , the bending region 102 , and driving circuit region 103 .
- the material of the planarization layer 24 includes an organic insulating material, and the planarization layer 24 fills the groove.
- the material of the planarization layer 24 includes an organic insulating material.
- the organic insulating material is more flexible than the inorganic insulating material.
Abstract
Description
- The present application claims the benefit of Chinese Patent Application No. 201910660745.3 filed on Jul. 22, 2019, the entire disclosure of which is incorporated herein by reference.
- The present disclosure relates to the field of display technology, especially to a flexible display module, a method for manufacturing the same, and a flexible display device.
- In recent years, the screen-to-body ratios of various display screens are getting larger and larger to meet the customer demand, and narrow-frame and frameless display screens have gradually become the mainstream of the market.
- At present, narrow-frame and frameless display screens extend the bending region of the display screen using pad bending technology so as to bend the bonding region to the back of the display panel to reduce the area of the peripheral region on the periphery of display region.
- However, the current pad bending technology requires addition of three mask processes, i.e., EBA (etch bending A) and EBB (etch bending B) etching and opening processes performed in the bending region, and a filling process performed at the openings of the bending region. As a result, the number of masks is undoubtedly increased, which further increases the manufacturing processes and manufacturing cost of the display screen.
- Embodiments of the present disclosure provide a flexible display module, a method for manufacturing the same, and a flexible display device, which can simplify the manufacturing process of the flexible display module.
- In a first aspect, there is provided a flexible display module. The flexible display module comprises: a flexible display panel; and a first transparent conductive layer disposed on a light exit side of the flexible display panel. The flexible display panel comprises a main display region, a bending region, and a driving circuit region; the main display region comprises a pixel array layer. The first transparent conductive layer comprises a first touch electrode located in the main display region, a driving circuit located in the driving circuit region, a first touch electrode lead electrically connected to the first touch electrode and the driving circuit, respectively, and a wiring electrically connecting the pixel array layer and the driving circuit.
- Optionally, the flexible display module further comprises: a second transparent conductive layer and an insulating layer stacked with the first transparent conductive layer on the light exit side of the flexible display panel. The first transparent conductive layer and the second transparent conductive layer are spaced apart by the insulating layer. The second transparent conductive layer comprises a second touch electrode located in the main display region, and a second touch electrode lead electrically connected to the second touch electrode and the driving circuit, respectively.
- Optionally, the second transparent conductive layer is disposed between the first transparent conductive layer and the flexible display panel.
- Optionally, the bending region is located between the main display region and the driving circuit region. The bending region comprises a groove. An edge of the groove close to the main display region is flush with an edge of the insulating layer close to the driving circuit region.
- Optionally, the flexible display module further comprises: a planarization layer disposed on a side of the first transparent conductive layer facing away from the flexible display panel. The planarization layer covers the main display region, the bending region and the driving circuit region. A material of the planarization layer comprises an organic insulating material, and the planarization layer fills the groove.
- In a second aspect, there is provided a flexible display device comprising the flexible display module described in any one of the foregoing embodiments.
- In a third aspect, there is provided a method for manufacturing a flexible display module. The method comprises: forming a flexible display panel, the flexible display panel comprising a main display region, a bending region, and a driving circuit region, the main display region comprising a pixel array layer; and forming a first transparent conductive layer on a light exit side of the flexible display panel. The first transparent conductive layer comprising a first touch electrode located in the main display region, a driving circuit located in the driving circuit region, a first touch electrode lead electrically connected to the first touch electrode and the driving circuit, respectively, and a wiring electrically connecting the pixel array layer and the driving circuit.
- Optionally, before forming a first transparent conductive layer on a light exit side of the flexible display panel, the method further comprises: forming a second transparent conductive layer and an insulating layer successively on the light exit side of the flexible display panel. The second transparent conductive layer comprises a second touch electrode located in the main display region, and a second touch electrode lead electrically connected to the second touch electrode and the driving circuit, respectively. The first transparent conductive layer and the second transparent conductive layer are spaced apart by the insulating layer.
- Optionally, the bending region is located between the main display region and the driving circuit region. The method further comprises: forming a groove in the bending region. An edge of the groove close to the main display region is flush with an edge of the insulating layer close to the driving circuit region.
- Optionally, forming a groove in the bending region comprises: forming an insulating film and a first photoresist pattern successively on a side of the second transparent conductive layer facing away from the flexible display panel, the first photoresist pattern comprising a photoresist completely-removed region, the photoresist completely-removed region at least corresponding to a portion of the bending region; over-etching the insulating film to obtain the insulating layer; stripping off the first photoresist pattern, and forming a second photoresist pattern on a side of the insulating layer facing away from the flexible display panel; and etching a portion of the flexible display panel that is located in the bending region to obtain the groove.
- Optionally, after forming a first transparent conductive layer on the light exit side of the flexible display panel, the method further comprises: forming a planarization layer on a side of the first transparent conductive layer facing away from the flexible display panel, the planarization layer covering the main display region, the bending region, and the driving circuit region. A material of the planarization layer comprises an organic insulating material, and the planarization layer fills the groove.
- In order to more clearly illustrate embodiments of the present disclosure or technical solutions in the prior art, the drawings to be used for description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. A person having an ordinary skill in the art may also obtain other drawings based on these drawings without spending inventive efforts.
-
FIG. 1 is a schematic structural view of a flexible display device provided by an embodiment of the present disclosure; -
FIG. 2 a is a schematic structural view of a flexible display module provided by an embodiment of the present disclosure; -
FIG. 2 b is a top view of the embodiment shown inFIG. 2 a in a direction perpendicular to the flexible display panel; -
FIG. 3 is a schematic structural view of a flexible display module provided by an embodiment of the present disclosure; -
FIG. 4 is a schematic structural view of a flexible display module provided by the related art; -
FIG. 5 is a schematic structural view of a flexible display module provided by an embodiment of the present disclosure; -
FIG. 6 is a schematic structural view of a flexible display module provided by an embodiment of the present disclosure; -
FIG. 7 is a flow chart of manufacturing a flexible display module provided by an embodiment of the present disclosure; -
FIG. 8 is a schematic view illustrating a process of manufacturing a flexible display module provided by an embodiment of the present disclosure; -
FIG. 9 is a flow chart of manufacturing a groove provided by an embodiment of the present disclosure; -
FIG. 10 is a schematic view illustrating a process of manufacturing a groove provided by an embodiment of the present disclosure; and -
FIG. 11 is a schematic view illustrating a process of manufacturing a groove provided by an embodiment of the present disclosure. - The technical solutions in embodiments of the present disclosure will be described clearly and comprehensively below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of them. All other embodiments obtained by a person having an ordinary skill in the art based on the embodiments of the present disclosure without spending inventive efforts fall within the protection scope of the present disclosure.
- A flexible display device may be used as a mobile phone, a tablet computer, a personal digital assistant (PDA), an in-vehicle computer, etc. The specific use of the flexible display device is not particularly limited in embodiments of the present disclosure.
- As shown in
FIG. 1 , the flexible display device may comprise, for example, a frame 1, aflexible display module 2, a circuit board 3, a cover plate 4, and other electronic accessories including a camera and the like. Theflexible display module 2 comprises a flexible display panel and a functional layer integrated on the flexible display panel. The functional layer may be, for example, a polarizer, a touch structure, or the like. - Taking the light exit direction of the above flexible display panel being top emission as an example, the frame 1 may be a U-shaped frame, and the
flexible display module 2 and the circuit board 3 are disposed in the frame 1. The cover plate 4 is disposed on the light exit side of theflexible display module 2, and the circuit board 3 is disposed on a side of the flexible display panel facing away from the cover plate 4. - An embodiment of the present disclosure provides a
flexible display module 2, which can be used as theflexible display module 2 in the above-mentioned flexible display device. - As shown in
FIGS. 2 a and 2 b , theflexible display module 2 comprises aflexible display panel 10, and a first transparentconductive layer 21 disposed on the light exit side of theflexible display panel 10. Theflexible display panel 10 comprises amain display region 101, a bendingregion 102, and adriving circuit region 103. Themain display region 101 comprises apixel array layer 11. The first transparentconductive layer 21 comprises afirst touch electrode 211 located in themain display region 101, a drivingcircuit 212 located in thedriving circuit region 103, and a firsttouch electrode lead 213 electrically connected to thefirst touch electrode 211 and the drivingcircuit 212, respectively, and awiring 214 electrically connecting the pixel array layer and the drivingcircuit 212. - In some embodiments, the
flexible display panel 10 may be, for example, an OLED display panel, a micro-light emitting diode (Micro-LED) display panel, or a quantum dot light emitting diode (QLED) display panel. - In some embodiments, the
flexible display panel 10 comprises a plurality of sub-pixels. The pixel array layer in the flexible array substrate comprises functional structures for constituting sub-pixels. - For example, the pixel array layer comprises a pixel circuit and a
light emitting device 14. - The pixel circuit comprises a
thin film transistor 13, a capacitor, and the like. Thethin film transistor 13 may be a bottom gate type, a top gate type, a double gate type, or the like. - Taking the
flexible display panel 10 being an OLED display panel or a QLED display panel as an example, thelight emitting device 14 comprises afirst electrode 141, a light emittingfunctional layer 142, and asecond electrode 143. Apixel defining layer 15 is provided between adjacent light emittingdevices 14. - The
first electrode 141 is an anode and thesecond electrode 143 is a cathode, or thefirst electrode 141 is a cathode and thesecond electrode 143 is an anode. - If the
flexible display panel 10 is an OLED display panel, the light emittingfunctional layer 142 is an organic light emitting functional layer. If theflexible display panel 10 is a QLED display panel, the light emittingfunctional layer 142 is a quantum dot light emitting functional layer. - Taking the
flexible display panel 10 being a Micro-LED display panel as an example, thelight emitting device 14 is a Micro-LED light emitting unit. Each Micro-LED light emitting unit is electrically connected to a first operating voltage (VDD) layer and a second operating voltage (VSS) layer, respectively. - On this basis, the
flexible display panel 10 further comprises anencapsulation layer 16 for encapsulating thelight emitting device 14 so as to prevent thelight emitting device 14 from being in contact with water vapor and oxygen. - In some embodiments, the driving circuit comprises a plurality of different output terminals, which are electrically connected to the first touch electrode lead and the wiring respectively so as to avoid a short circuit between the first touch electrode electrically connected to the first touch electrode lead and the pixel array layer electrically connected to the wiring.
- In some embodiments, the wiring includes multiple sub-wirings, and each sub-wiring is electrically connected to at least part of the conductive structures in the pixel array layer.
- For example, the
thin film transistor 13 comprises conductive structures such as a gate, a source and a drain. The sub-wiring may be used as a gate line and electrically connected to the gate of thethin film transistor 13. As shown inFIG. 3 , the sub-wiring may also be used as a data line and electrically connected to the source of thethin film transistor 13. - In some embodiments, in order to enable the
flexible display module 2 to realize a touch function, theflexible display module 2 only comprises a layer of first touch electrode. Alternatively, theflexible display module 2 further comprises a second touch electrode disposed in a different layer from the first touch electrode. - In some embodiments, the first touch electrode is located in the
main display region 101 and the driving circuit is located in thedriving circuit region 103. Therefore, the first touch electrode lead electrically connected to the first touch electrode and the driving circuit respectively should be located in themain display region 101, the bendingregion 102, and the drivingcircuit region 103. - In some embodiments, the
flexible display panel 10 comprises an array substrate, and the array substrate comprises a substrate. The substrate should at least comprise aflexible substrate 111. On this basis, the substrate may further comprise aspacer layer 112, and the material of thespacer layer 112 includes an inorganic insulating material. - Here, one or more layers of the
flexible substrate 111 and thespacer layer 112 may be stacked alternately. On this basis, considering the higher flatness of thespacer layer 112 made of an inorganic material, aspacer layer 112 may be disposed at a position closest to the first transparentconductive layer 21 to improve the performance of thepixel array layer 11 disposed on the substrate. - As shown in
FIG. 4 , in the related art, while the flexible display panel is being manufactured, the drivingcircuit 33 has been formed. In order to avoid a short circuit between a touch structure 32 and other signal wirings electrically connected to the driving circuit, there is a need to form an insulating structure 31 between the touch structure 32 and the flexible display panel, and the insulating structure 31 should at least expose the drivingcircuit 33, so that the touch structure 32 is electrically connected to the drivingcircuit 33. In this way, the insulating structure 31 has a certain pattern, which needs to be made by one mask process. - In the flexible display module provided by the embodiment of the present disclosure, on the one hand, the first transparent conductive layer comprises a driving circuit, a first touch electrode, a first touch electrode lead, and a wiring. Thus the driving circuit, the first touch electrode, the first touch electrode lead, and the wiring can be obtained using the same mask process, which can simplify the manufacturing process of the
flexible display module 2 and reduce the manufacturing cost. On the other hand, since the driving circuit, the first touch electrode, the first touch electrode lead, and the wiring may be formed simultaneously, a short circuit will not occur among the first touch electrode, the first touch electrode lead, and the wiring. Compared with the related art, in embodiments of the present disclosure, there is no need to dispose an insulating structure between the flexible display panel and the first transparent conductive layer, which can further reduce one mask process and decrease the thickness of the flexible display module. - Optionally, as shown in
FIG. 3 , theflexible display module 2 further comprises a second transparentconductive layer 22 and an insulatinglayer 23 stacked with the first transparentconductive layer 21 on the light exit side of theflexible display panel 10. The first transparentconductive layer 21 and the second transparentconductive layer 22 are spaced apart by the insulatinglayer 23. The second transparentconductive layer 22 comprises a second touch electrode located in themain display region 101, and a second touch electrode lead electrically connected to the second touch electrode and the driving circuit, respectively. - In some embodiments, as shown in
FIG. 3 , the second transparentconductive layer 22 is located between theflexible display panel 10 and the first transparentconductive layer 21, or the second transparentconductive layer 22 is located on a side of the first transparentconductive layer 21 facing away from theflexible display panel 10. - In some embodiments, the material of the insulating
layer 23 is not limited as long as it can provide an insulating effect. For example, the material of the insulatinglayer 23 is silicon nitride. - In some embodiments, the second touch electrode is located in the
main display region 101 and the driving circuit is located in thedriving circuit region 103. Therefore, the second touch electrode lead electrically connected to the second touch electrode and the driving circuit respectively should be located in themain display region 101, the bendingregion 102, and the drivingcircuit region 103. - In an embodiment of the present disclosure, the first touch electrode and the second touch electrode are disposed in different layers to realize mutual-capacitive touch.
- Optionally, as shown in
FIG. 3 , the bendingregion 102 is located between themain display region 101 and the drivingcircuit region 103, and the bendingregion 102 comprises a groove. The edge of the groove close to themain display region 101 is flush with the edge of the insulatinglayer 23 close to thedriving circuit region 103. - In some embodiments, the groove corresponds to the
entire bending region 102. Alternatively, as shown inFIG. 3 , the groove corresponds to a portion of the bendingregion 102. - As shown in
FIG. 3 , on the basis of an example in which the thin film transistor is a top gate type thin film transistor, the substrate includes aflexible substrate 111 and aspacer layer 112, and thespacer layer 112 is disposed closer to the first transparentconductive layer 21 than theflexible substrate 111, the portions in thespacer layer 112, the firstgate insulating layer 131, the secondgate insulating layer 132, and the interlayer insulatinglayer 133 that are located in thebending region 102 are hollowed out to form a groove. Since the total thickness of thespacer layer 112, the firstgate insulating layer 131, the secondgate insulating layer 132, and the interlayer insulatinglayer 133 is relatively large, both the EBA and EBB processes need to be performed to form the groove completely. - However, in an embodiment of the present disclosure, at the time of forming the insulating
layer 23 between the first transparentconductive layer 21 and the second transparentconductive layer 22, in the case of ensuring that the insulatinglayer 23 covers the second transparentconductive layer 22, it is possible to etch at least one of the interlayer insulatinglayer 133, the secondgate insulating layer 132, the firstgate insulating layer 131, and thespacer layer 112 while the insulatinglayer 23 is being formed, thereby omitting one of the EBA or EBB process. - Optionally, as shown in
FIG. 5 , theflexible display module 2 further comprises aplanarization layer 24 disposed on a side of the first transparentconductive layer 21 facing away from theflexible display panel 10. Theplanarization layer 24 covers themain display region 101, the bendingregion 102, and drivingcircuit region 103. The material of theplanarization layer 24 includes an organic insulating material, and theplanarization layer 24 fills the groove. - In an embodiment of the present disclosure, the material of the
planarization layer 24 includes an organic insulating material. The organic insulating material is more flexible than the inorganic insulating material. By filling the groove located in thebending region 102 with theplanarization layer 24, on the one hand, the flexibility of the bendingregion 102 in theflexible display module 2 can be improved; on the other hand, compared with the prior art, the filling process after the EBA and EBB processes can be omitted, and one mask process can be further reduced. - Optionally, as shown in
FIG. 6 , theflexible display module 2 further comprises a firstconductive structure 41 and a secondconductive structure 42 located in thedriving circuit region 103. The firstconductive structure 41 and the secondconductive structure 42 are stacked. The firstconductive structure 41 or the secondconductive structure 42 includes a plurality of protrusions. In the case where the firstconductive structure 41 includes a plurality of protrusions, the protrusions are in direct contact with the secondconductive structure 42. In the case where the secondconductive structure 42 includes a plurality of protrusions, the protrusions are in direct contact with the firstconductive structure 41. - On this basis, the first
conductive structure 41 and the secondconductive structure 42 are electrically connected to the first transparentconductive layer 21. - Here, the first
conductive structure 41 and the secondconductive structure 42 may be electrically connected to the first touch electrode lead. Alternatively, the firstconductive structure 41 and the secondconductive structure 42 may also be electrically connected to the wiring. - In an embodiment of the present disclosure, the resistance of the wiring or the first touch electrode lead can be reduced by jumpering the wiring or the first touch electrode lead in the first transparent
conductive layer 21. On this basis, the gate line or data line can be jumpered, which can also play a role in preventing static electricity. - An embodiment of the present disclosure provides a method for manufacturing a flexible display module. As shown in
FIGS. 2 a, 2 b and 3, a flexible display panel comprises amain display region 101, a bendingregion 102, and adriving circuit region 103. Themain display region 101 comprises apixel array layer 11. As shown inFIG. 7 , the method for manufacturing theflexible display module 2 can be implemented by the following steps. - S11, as shown in
FIG. 8 , forming aflexible display panel 10. Theflexible display panel 10 comprises amain display region 101, a bendingregion 102, and adriving circuit region 103. Themain display region 101 comprises apixel array layer 11. - In some embodiments, the
flexible display panel 10 may be, for example, an OLED display panel, a Micro-LED display panel, or a QLED display panel. - In some embodiments, the
flexible display panel 10 comprises a plurality of sub-pixels. The pixel array layer in the flexible array substrate comprises functional structures for constituting sub-pixels. - For example, the pixel array layer comprises a pixel circuit and a
light emitting device 14. - The pixel circuit comprises a
thin film transistor 13, a capacitor, and the like. Thethin film transistor 13 may be a bottom gate type, a top gate type, a double gate type, or the like. - Taking the
flexible display panel 10 being an OLED display panel or a QLED display panel as an example, thelight emitting device 14 comprises afirst electrode 141, a light emittingfunctional layer 142, and asecond electrode 143. Apixel defining layer 15 is provided between adjacent light emittingdevices 14. - The
first electrode 141 is an anode and thesecond electrode 143 is a cathode, or thefirst electrode 141 is a cathode and thesecond electrode 143 is an anode. - If the
flexible display panel 10 is an OLED display panel, the light emittingfunctional layer 142 is an organic light emitting functional layer. If theflexible display panel 10 is a QLED display panel, the light emittingfunctional layer 142 is a quantum dot light emitting functional layer. - Taking the
flexible display panel 10 being a Micro-LED display panel as an example, thelight emitting device 14 is a Micro-LED light emitting unit. Each Micro-LED light emitting unit is electrically connected to a first operating voltage (VDD) layer and a second operating voltage (VSS) layer, respectively. - On this basis, the
flexible display panel 10 further comprises anencapsulation layer 16 for encapsulating thelight emitting device 14 to prevent thelight emitting device 14 from being in contact with water vapor and oxygen. - In some embodiments, the
flexible display panel 10 comprises an array substrate, and the array substrate comprises a substrate. The substrate should at least comprise aflexible substrate 111. On this basis, the substrate may further comprise aspacer layer 112, and the material of thespacer layer 112 includes an inorganic insulating material. - Here, one or more layers of the
flexible substrate 111 and thespacer layer 112 may be stacked alternately. On this basis, considering the higher flatness of thespacer layer 112 made of an inorganic material, aspacer layer 112 may be disposed at a position closest to the first transparentconductive layer 21 to improve the performance of thepixel array layer 11 disposed on the substrate. - S12, as shown in
FIGS. 2 a and 2 b , forming a first transparentconductive layer 21 on the light exit side of theflexible display panel 10. The first transparentconductive layer 21 comprises afirst touch electrode 211 located in themain display region 101, a drivingcircuit 212 located in thedriving circuit region 103, a firsttouch electrode lead 213 electrically connected to thefirst touch electrode 211 and the drivingcircuit 212, respectively, and awiring 214 electrically connecting the pixel array layer and the drivingcircuit 212. - In some embodiments, the driving circuit comprises a plurality of different output terminals, which are electrically connected to the first touch electrode lead and the wiring respectively, so as to avoid a short circuit between the first touch electrode electrically connected to the first touch electrode lead and the pixel array layer electrically connected to the wiring.
- In some embodiments, the wiring includes multiple sub-wirings, and each sub-wiring is electrically connected to at least part of the conductive structures in the pixel array layer.
- For example, the
thin film transistor 13 comprises conductive structures such as a gate, a source and a drain. The sub-wiring can be used as a gate line and electrically connected to the gate of thethin film transistor 13. As shown inFIG. 3 , the sub-wiring can also be used as a data line and electrically connected to the source of thethin film transistor 13. - In some embodiments, in order to enable the
flexible display module 2 to realize a touch function, theflexible display module 2 only comprises a layer of first touch electrode. Alternatively, theflexible display module 2 further comprises a second touch electrode disposed in a different layer from the first touch electrode. - In some embodiments, the first touch electrode is located in the
main display region 101 and the driving circuit is located in thedriving circuit region 103. Therefore, the first touch electrode lead electrically connected to the first touch electrode and the driving circuit respectively should be located in themain display region 101, the bendingregion 102, and the drivingcircuit region 103. - As shown in
FIG. 4 , in the related art, while the flexible display panel is being manufactured, the drivingcircuit 33 has been formed. In order to avoid a short circuit between a touch structure 32 and other signal wirings electrically connected to the driving circuit, there is a need to form an insulating structure 31 between the touch structure 32 and the flexible display panel, and the insulating structure 31 should at least expose the drivingcircuit 33, so that the touch structure 32 is electrically connected to the drivingcircuit 33. In this way, the insulating structure 31 has a certain pattern, which needs to be made by one mask process. - In the method for manufacturing a flexible display module provided by an embodiment of the present disclosure, on the one hand, the first transparent conductive layer comprises a driving circuit, a first touch electrode, a first touch electrode lead, and a wiring. Thus the driving circuit, the first touch electrode, the first touch electrode lead, and the wiring can be obtained using the same mask process, which can simplify the manufacturing process of the
flexible display module 2 and reduce the manufacturing cost. On the other hand, since the driving circuit, the first touch electrode, the first touch electrode lead, and the wiring may be formed simultaneously, a short circuit will not occur among the first touch electrode, the first touch electrode lead, and the wiring. Compared with the related art, in embodiments of the present disclosure, there is no need to dispose an insulating structure between the flexible display panel and the first transparent conductive layer, which can further reduce one mask process and decrease the thickness of the flexible display module. - Optionally, before forming a first transparent
conductive layer 21 on the light exit side of the flexible display panel, the method further comprises: forming a second transparentconductive layer 22 and an insulatinglayer 23 successively on the light exit side of theflexible display panel 10. The second transparentconductive layer 22 comprises a second touch electrode located in themain display region 101, and a second touch electrode lead electrically connected to the second touch electrode and the driving circuit, respectively. The first transparentconductive layer 21 and the second transparentconductive layer 22 are spaced apart by the insulatinglayer 23. - In some embodiments, the material of the insulating
layer 23 is not limited as long as it can provide an insulating effect. For example, the material of the insulatinglayer 23 is silicon nitride. - In some embodiments, the second touch electrode is located in the
main display region 101 and the driving circuit is located in thedriving circuit region 103. Therefore, the second touch electrode lead electrically connected to the second touch electrode and the driving circuit respectively should be located in themain display region 101, the bendingregion 102, and the drivingcircuit region 103. - In an embodiment of the present disclosure, the first touch electrode and the second touch electrode are disposed in different layers to realize mutual-capacitive touch.
- Optionally, the bending
region 102 is located between themain display region 101 and the drivingcircuit region 103, and the bendingregion 102 comprises a groove. A method for manufacturing the groove comprises the following steps. - S111, as shown in
FIG. 10 , forming an insulatingfilm 231 and afirst photoresist pattern 51 successively on a side of the second transparentconductive layer 22 facing away from theflexible display panel 10. Thefirst photoresist pattern 51 includes a photoresist completely-removed region, and the photoresist completely-removed region at least corresponds to a portion of the bendingregion 102. - S112, as shown in
FIG. 11 , over-etching the insulatingfilm 231 to obtain an insulatinglayer 23. - In some embodiments, during the process of over-etching the insulating
film 231, the portion in theinterlayer insulating layer 133 that is located in thebending region 102 is at least etched, and the portions in the secondgate insulating layer 132, the firstgate insulating layer 131, etc. that are located in thebending region 102 may even be etched. - S113, stripping off the
first photoresist pattern 51, and forming asecond photoresist pattern 52 on a side of the insulatinglayer 23 facing away from theflexible display panel 10. - Here, for example, the
first photoresist pattern 51 may be removed by an ashing process. - S114, etching the portion in the
flexible display panel 10 that is located in thebending region 102 to obtain a groove. - That is, the remaining parts of the portions in the
interlayer insulating layer 133, the secondgate insulating layer 132, the firstinterlayer insulating layer 131, and thespacer layer 112 that are located in thebending region 102 are etched. - As shown in
FIG. 3 , on the basis of an example in which the thin film transistor is a top gate type thin film transistor, the substrate includes aflexible substrate 111 and aspacer layer 112, and thespacer layer 112 is disposed closer to the first transparentconductive layer 21 than theflexible substrate 111, the portions in thespacer layer 112, the firstgate insulating layer 131, the secondgate insulating layer 132, and the interlayer insulatinglayer 133 that are located in thebending region 102 are hollowed out to form a groove. Since the total thickness of thespacer layer 112, the firstgate insulating layer 131, the secondgate insulating layer 132, and the interlayer insulatinglayer 133 is relatively large, both the EBA and EBB processes need to be performed to form the groove completely. - However, in an embodiment of the present disclosure, at the time of forming the insulating
layer 23 between the first transparentconductive layer 21 and the second transparentconductive layer 22, in the case of ensuring that the insulatinglayer 23 covers the second transparentconductive layer 22, it is possible to etch at least one of the interlayer insulatinglayer 133, the secondgate insulating layer 132, the firstgate insulating layer 131, and thespacer layer 112 while the insulatinglayer 23 is being formed, thereby omitting one of the EBA or EBB process. - Optionally, as shown in
FIG. 5 , after forming a first transparentconductive layer 21 on the light exit side of the flexible display panel, the method further comprises: forming aplanarization layer 24 on a side of the first transparentconductive layer 21 facing away from theflexible display panel 10. Theplanarization layer 24 covers themain display region 101, the bendingregion 102, and drivingcircuit region 103. The material of theplanarization layer 24 includes an organic insulating material, and theplanarization layer 24 fills the groove. - In an embodiment of the present disclosure, the material of the
planarization layer 24 includes an organic insulating material. The organic insulating material is more flexible than the inorganic insulating material. By filling the groove located in thebending region 102 with theplanarization layer 24, on the one hand, the flexibility of the bendingregion 102 in theflexible display module 2 can be improved; on the other hand, compared with the prior art, the filling process after the EBA and EBB processes can be omitted, and one mask process can be further reduced. - What have been stated above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art familiar with this technical field within the technical scope revealed by the present disclosure should be encompassed within the protection scope of the present disclosure. Thus, the protection scope of the present disclosure should be based on the protection scope of the claims.
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CN110600520A (en) * | 2019-09-19 | 2019-12-20 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
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KR102625708B1 (en) * | 2018-08-27 | 2024-01-16 | 삼성디스플레이 주식회사 | Display device |
KR102587878B1 (en) * | 2018-08-31 | 2023-10-11 | 엘지디스플레이 주식회사 | Display Device And Method of Manufacturing the Same |
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CN109273503B (en) * | 2018-09-27 | 2021-01-22 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
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