US20230081642A1 - Heat-rejecting media for use in dual-printed circuit board device - Google Patents
Heat-rejecting media for use in dual-printed circuit board device Download PDFInfo
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- US20230081642A1 US20230081642A1 US17/487,398 US202117487398A US2023081642A1 US 20230081642 A1 US20230081642 A1 US 20230081642A1 US 202117487398 A US202117487398 A US 202117487398A US 2023081642 A1 US2023081642 A1 US 2023081642A1
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- information handling
- thermally
- heat
- handling resource
- flexible
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
Definitions
- the present disclosure relates in general to information handling systems, and more particularly to cooling of information handling system components using heat-rejecting media, in particular a thermally-conductive medium for use in a device comprising a dual printed circuit board, such as a solid state drive.
- An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information.
- information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated.
- the variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications.
- information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
- SSDs solid state drives
- PCB dual-printed circuit board
- PMIC power management integrated circuit
- a PMIC may generate significant heat during operation, and due to the limited space (e.g., approximately 2 millimeters) between the two PCBs, it may not be feasible to thermally couple a traditional heatsink to the PMIC to allow for efficient air cooling of the PMIC.
- the disadvantages and problems associated with thermal control of information handling resources may be substantially reduced or eliminated.
- an information handling system may include a processor and an information handling resource communicatively coupled to the processor, the information handling resource comprising a heat-generating component and heat-rejecting media thermally coupled to the information handling resource, the heat-rejecting media comprising a source, a sink, and a thermally-conductive strip coupled between the source and the sink.
- the source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component.
- the sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.
- the source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component.
- the sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.
- an information handling resource may include a heat-generating component and heat-rejecting media thermally coupled to the information handling resource, the heat-rejecting media comprising a source, a sink, and a thermally-conductive strip coupled between the source and the sink.
- the source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component.
- the sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.
- FIG. 1 illustrates a block diagram of an example information handling system, in accordance with embodiments of the present disclosure
- FIG. 2 illustrates an exploded isometric perspective view of an example device, in accordance with embodiments of the present disclosure
- FIG. 3 illustrates a side perspective view of example heat-rejecting media in accordance with embodiments of the present disclosure
- FIG. 4 illustrates a view of the bottom of a top PCB of the device depicted in FIG. 2 , in accordance with embodiments of the present disclosure
- FIG. 5 illustrates an isometric perspective view of the device depicted in FIG. 2 assembled but with its enclosure removed, in accordance with embodiments of the present disclosure
- FIG. 6 illustrates a side view of the device depicted in FIG. 2 assembled, in accordance with embodiments of the present disclosure.
- an information handling system may include any instrumentality or aggregate of instrumentalities operable to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, entertainment, or other purposes.
- an information handling system may be a personal computer, a PDA, a consumer electronic device, a network storage device, or any other suitable device and may vary in size, shape, performance, functionality, and price.
- the information handling system may include memory, one or more processing resources such as a central processing unit (CPU) or hardware or software control logic. Additional components of the information handling system may include one or more storage devices, one or more communications ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, and a video display. The information handling system may also include one or more buses operable to transmit communication between the various hardware components.
- processing resources such as a central processing unit (CPU) or hardware or software control logic.
- Additional components of the information handling system may include one or more storage devices, one or more communications ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, and a video display.
- I/O input and output
- the information handling system may also include one or more buses operable to transmit communication between the various hardware components.
- Computer-readable media may include any instrumentality or aggregation of instrumentalities that may retain data and/or instructions for a period of time.
- Computer-readable media may include, without limitation, storage media such as a direct access storage device (e.g., a hard disk drive or floppy disk), a sequential access storage device (e.g., a tape disk drive), compact disk, CD-ROM, DVD, random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and/or flash memory; as well as communications media such as wires, optical fibers, microwaves, radio waves, and other electromagnetic and/or optical carriers; and/or any combination of the foregoing.
- storage media such as a direct access storage device (e.g., a hard disk drive or floppy disk), a sequential access storage device (e.g., a tape disk drive), compact disk, CD-ROM, DVD, random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-
- information handling resources may broadly refer to any component system, device or apparatus of an information handling system, including without limitation processors, buses, memories, I/O devices and/or interfaces, storage resources, network interfaces, motherboards, integrated circuit packages; electro-mechanical devices (e.g., air movers), displays, and power supplies.
- FIG. 1 illustrates a block diagram of an example information handling system 102 , in accordance with embodiments of the present disclosure.
- information handling system 102 may comprise a server chassis configured to house a plurality of servers or “blades.”
- information handling system 102 may comprise a personal computer (e.g., a desktop computer, laptop computer, mobile computer, and/or notebook computer).
- information handling system 102 may comprise a storage enclosure configured to house a plurality of physical disk drives and/or other computer-readable media for storing data. As shown in FIG.
- information handling system 102 may include a chassis 100 housing a processor 103 , a memory 104 , a temperature sensor 106 , an air mover 108 , a management controller 112 , a device 116 , and heat-rejecting media 122 .
- Processor 103 may comprise any system, device, or apparatus operable to interpret and/or execute program instructions and/or process data, and may include, without limitation a microprocessor, microcontroller, digital signal processor (DSP), application specific integrated circuit (ASIC), or any other digital or analog circuitry configured to interpret and/or execute program instructions and/or process data.
- processor 103 may interpret and/or execute program instructions and/or process data stored in memory 104 and/or another component of information handling system 102 .
- Memory 104 may be communicatively coupled to processor 103 and may comprise any system, device, or apparatus operable to retain program instructions or data for a period of time.
- Memory 104 may comprise random access memory (RAM), electrically erasable programmable read-only memory (EEPROM), a PCMCIA card, flash memory, magnetic storage, opto-magnetic storage, or any suitable selection and/or array of volatile or non-volatile memory that retains data after power to information handling system 102 is turned off.
- RAM random access memory
- EEPROM electrically erasable programmable read-only memory
- PCMCIA card PCMCIA card
- flash memory magnetic storage
- opto-magnetic storage or any suitable selection and/or array of volatile or non-volatile memory that retains data after power to information handling system 102 is turned off.
- Air mover 108 may include any mechanical or electro-mechanical system, apparatus, or device operable to move air and/or other gases in order to cool information handling resources of information handling system 102 .
- air mover 108 may comprise a fan (e.g., a rotating arrangement of vanes or blades which act on the air).
- air mover 108 may comprise a blower (e.g., a centrifugal fan that employs rotating impellers to accelerate air received at its intake and change the direction of the airflow).
- rotating and other moving components of air mover 108 may be driven by a motor 110 .
- the rotational speed of motor 110 may be controlled by an air mover control signal communicated from thermal control system 114 of management controller 112 .
- air mover 108 may cool information handling resources of information handling system 102 by drawing cool air into an enclosure housing the information handling resources from outside the chassis, expelling warm air from inside the enclosure to the outside of such enclosure, and/or moving air across one or more heat sinks (not explicitly shown) internal to the enclosure to cool one or more information handling resources.
- Management controller 112 may comprise any system, device, or apparatus configured to facilitate management and/or control of information handling system 102 and/or one or more of its component information handling resources. Management controller 112 may be configured to issue commands and/or other signals to manage and/or control information handling system 102 and/or its information handling resources. Management controller 112 may comprise a microprocessor, microcontroller, DSP, ASIC, field programmable gate array (“FPGA”), EEPROM, or any combination thereof. Management controller 112 also may be configured to provide out-of-band management facilities for management of information handling system 102 . Such management may be made by management controller 112 even if information handling system 102 is powered off or powered to a standby state.
- management controller 112 may include or may be an integral part of a baseboard management controller (BMC), a remote access controller (e.g., a Dell Remote Access Controller or Integrated Dell Remote Access Controller), or an enclosure controller. In other embodiments, management controller 112 may include or may be an integral part of a chassis management controller (CMC).
- BMC baseboard management controller
- CMC chassis management controller
- management controller 112 may include a thermal control system 114 .
- Thermal control system 114 may include any system, device, or apparatus configured to receive one or more signals indicative of one or more temperatures within information handling system 102 (e.g., one or more signals from one or more temperature sensors 106 ), and based on such signals, calculate an air mover driving signal to maintain an appropriate level of cooling, increase cooling, or decrease cooling, as appropriate, and communicate such air mover driving signal to air mover 108 .
- thermal control system 114 may be configured to receive information from other information handling resources and calculate the air mover driving signal based on such received information in addition to temperature information.
- thermal control system 114 may receive configuration data from device 116 and/or other information handling resources of information handling system 102 , which may include thermal requirements information of one or more information handling resources. In addition to temperature information collected from sensors within information handling system 102 , thermal control system 114 may also calculate the air mover driving signal based on such information received from information handling resources.
- Temperature sensor 106 may be any system, device, or apparatus (e.g., a thermometer, thermistor, etc.) configured to communicate a signal to management controller 112 or another controller indicative of a temperature within information handling system 102 .
- information handling system 102 may comprise a plurality of temperature sensors 106 , wherein each temperature sensor 106 detects a temperature of a particular component and/or location within information handling system 102 .
- Device 116 may comprise any component information handling system of information handling system 102 , including without limitation processors, buses, memories, I/O devices and/or interfaces, storage resources, network interfaces, motherboards, integrated circuit packages, electro-mechanical devices, displays, and power supplies.
- device 116 may comprise an SSD having a PMIC.
- Heat-rejecting media 122 may include any system, device, or apparatus configured to transfer heat from an information handling resource (e.g., device 116 , as shown in FIG. 1 ), thus reducing a temperature of the information handling resource.
- heat-rejecting media 122 may include a solid member thermally coupled to the information handling resource (e.g., heat spreader) such that heat generated by the information handling resource is transferred from the information handling resource into air surrounding the information handling resource.
- heat-rejecting media 122 may be thermally coupled to device 116 and arranged such that heat generated by device 116 is transferred to air driven by air mover 108 , as described in greater detail below.
- information handling system 102 may include one or more other information handling resources.
- FIG. 1 depicts only one air mover 108 and one device 116 .
- information handling system 102 may include any number of air movers 108 and devices 116 .
- approaches similar or identical to those used to cool device 116 as described herein may be employed to provide cooling of processor 103 , memory 104 , management controller 112 , and/or any other information handling resource of information handling system 102 .
- FIG. 2 illustrates an exploded isometric perspective view of an example device 116 , in accordance with embodiments of the present disclosure.
- heat-rejecting media 122 is not depicted in FIG. 2 .
- device 116 may be implemented in a dual-PCB design comprising a top PCB 202 and a bottom PCB 204 .
- top PCB 202 and bottom PCB 204 may be enclosed by an enclosure comprising a top cover 206 and a bottom cover 208 .
- one or both of top cover 206 and bottom cover 208 may be constructed from metal or another thermally-conductive material.
- device 116 may comprise an SSD.
- top and bottom are arbitrary and used for purposes of exposition, and not meant to require a particular position of device 116 within information handling system 102 .
- FIG. 3 illustrates a side perspective view of example heat-rejecting media 122 in accordance with embodiments of the present disclosure.
- heat-rejecting media 122 may include a source 302 thermally coupled to a sink 304 via a thermally-conductive strip 306 .
- Source 302 may be configured to mechanically and thermally couple to a heat-generating component (e.g., a PMIC of an SSD), and may comprise a skin 308 constructed from flexible, thermally-conductive material (e.g., thin layer of graphite, such as a thickness of 0.1 mm), with a cavity formed within skin 308 , such cavity including a solid, flexible foam 310 .
- a heat-generating component e.g., a PMIC of an SSD
- a skin 308 constructed from flexible, thermally-conductive material (e.g., thin layer of graphite, such as a thickness of 0.1 mm), with a cavity formed within skin 308 , such cavity including a solid, flexible foam 310 .
- the use of flexible skin 308 and flexible foam 310 in source 302 may allow source 302 to be compressed between top PCB 202 and bottom PCB 204 , providing mechanical pressure to ensure thermal coupling of source 302 to a heat-generating component of device 116 .
- Sink 304 may be configured to mechanically and thermally couple to one or more structures of device 116 (e.g., top cover 202 or other structure), and may comprise a skin 312 constructed from flexible, thermally-conductive material (e.g., thin layer of graphite, such as a thickness of 0.1 mm), with a cavity formed within skin 312 , such cavity including a solid, flexible foam 314 .
- the use of flexible skin 312 and flexible foam 314 in sink 304 may allow sink 304 to be compressed between components of device 116 (e.g., top PCB 202 , bottom PCB 204 , and/or other components of device 116 ) providing mechanical pressure to ensure thermal coupling of sink 304 to such components.
- Strip 306 may comprise a strip of thermally-conductive material (e.g., thin layer of graphite, such as a thickness of 0.1 mm). In some embodiments, strip 306 may be coated with thermally-insulating material, to maximize heat transfer from source 302 to sink 304 via strip 306 .
- thermally-conductive material e.g., thin layer of graphite, such as a thickness of 0.1 mm.
- strip 306 may be coated with thermally-insulating material, to maximize heat transfer from source 302 to sink 304 via strip 306 .
- skin 308 , skin 312 , and strip 306 may be formed from the same continuous piece of material (e.g., graphite sheet or strip), with skin 308 wrapped around foam 310 and skin 312 wrapped around foam 314 .
- the thin profile of heat-rejecting media 122 may make its use advantageous within a dual-PCB structure, such as that shown in FIG. 2 , as it may allow heat-rejecting media 122 to traverse the narrow space that may be present between top PCB 202 and bottom PCB 204 in order to transfer heat from a location internal to such narrow space to an edge of or the exterior of device 116 (where, in some embodiments, such heat may further be transferred to air flowing proximate to device 116 ).
- source 302 , sink 304 , and/or strip 306 may be shaped to contour to specific features within device 116 .
- source 302 may have a cubic shape to facilitate optimal thermal coupling between source 302 and a heat-generating component of device 116 .
- sink 304 and/or a portion of strip 306 may have curves and/or bends to facilitate contouring of heat-rejecting media 122 to components of device 116 (e.g., a barrel capacitor, as shown in other figures described below).
- such shapes of source 302 , sink 304 , and strip 306 may not be limited to those depicted in FIG. 3 , and may vary between implementations of device 116 .
- FIG. 4 illustrates a view of the bottom of top PCB 202 , in accordance with embodiments of the present disclosure.
- FIG. 5 illustrates an isometric perspective view of device 116 , assembled but with its enclosure removed, in accordance with embodiments of the present disclosure.
- FIG. 6 illustrates a side view of device 116 assembled, in accordance with embodiments of the present disclosure.
- top PCB 202 may have a heat-generating component 402 (e.g., PMIC) mounted thereto.
- source 302 may be thermally coupled to heat-generating component 402 and strip 306 may be routed between the space between top PCB 202 and bottom PCB 204 .
- a compressive force of source 302 between top PCB 202 and bottom PCB 204 may provide mechanical force for thermally coupling source 302 to heat-generating component 402 .
- strip 306 may terminate into sink 304 at an edge of top PCB 202 .
- strip 306 and/or sink 304 may be shaped to contour to one or more components or features of device 116 , such as barrel capacitor 404 .
- a compressive force of sink 304 between top cover 206 and barrel capacitor 404 may provide mechanical force for thermally coupling sink 304 to capacitor 404 and/or top cover 206 . Accordingly, heat may be transferred from heat-generating component 402 to top cover 206 , barrel capacitor 404 , and/or another component at or near the exterior of device 116 , where such heat may be transferred to air flow proximate to device 116 .
- references in the appended claims to an apparatus or system or a component of an apparatus or system being adapted to, arranged to, capable of, configured to, enabled to, operable to, or operative to perform a particular function encompasses that apparatus, system, or component, whether or not it or that particular function is activated, turned on, or unlocked, as long as that apparatus, system, or component is so adapted, arranged, capable, configured, enabled, operable, or operative. Accordingly, modifications, additions, or omissions may be made to the systems, apparatuses, and methods described herein without departing from the scope of the disclosure. For example, the components of the systems and apparatuses may be integrated or separated.
- each refers to each member of a set or each member of a subset of a set.
Abstract
Heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource may include a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource
Description
- The present disclosure relates in general to information handling systems, and more particularly to cooling of information handling system components using heat-rejecting media, in particular a thermally-conductive medium for use in a device comprising a dual printed circuit board, such as a solid state drive.
- As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
- As processors, graphics cards, random access memory (RAM) and other components in information handling systems have increased in clock speed and power consumption, the amount of heat produced by such components as a side-effect of normal operation has also increased. Often, the temperatures of these components need to be kept within a reasonable range to prevent overheating, instability, malfunction and damage leading to a shortened component lifespan. Accordingly, air movers (e.g., cooling fans and blowers) have often been used in information handling systems to cool information handling systems and their components.
- However, for some components of an information handling system, air cooling may be impossible or impractical. For example, many solid state drives (SSDs) used for storing data are implemented using a dual-printed circuit board (PCB) rigid-flex design, with a power management integrated circuit (PMIC) placed between the two PCBs which may provide electrical energy to various components of the SSD. A PMIC may generate significant heat during operation, and due to the limited space (e.g., approximately 2 millimeters) between the two PCBs, it may not be feasible to thermally couple a traditional heatsink to the PMIC to allow for efficient air cooling of the PMIC.
- In accordance with the teachings of the present disclosure, the disadvantages and problems associated with thermal control of information handling resources may be substantially reduced or eliminated.
- In accordance with embodiments of the present disclosure, an information handling system may include a processor and an information handling resource communicatively coupled to the processor, the information handling resource comprising a heat-generating component and heat-rejecting media thermally coupled to the information handling resource, the heat-rejecting media comprising a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.
- In accordance with these and other embodiments of the present disclosure, heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource may include a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.
- In accordance with these and other embodiments of the present disclosure, an information handling resource may include a heat-generating component and heat-rejecting media thermally coupled to the information handling resource, the heat-rejecting media comprising a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.
- Technical advantages of the present disclosure may be readily apparent to one skilled in the art from the figures, description and claims included herein. The objects and advantages of the embodiments will be realized and achieved at least by the elements, features, and combinations particularly pointed out in the claims.
- It is to be understood that both the foregoing general description and the following detailed description are examples and explanatory and are not restrictive of the claims set forth in this disclosure.
- A more complete understanding of the present embodiments and advantages thereof may be acquired by referring to the following description taken in conjunction with the accompanying drawings, in which like reference numbers indicate like features, and wherein:
-
FIG. 1 illustrates a block diagram of an example information handling system, in accordance with embodiments of the present disclosure; -
FIG. 2 illustrates an exploded isometric perspective view of an example device, in accordance with embodiments of the present disclosure; -
FIG. 3 illustrates a side perspective view of example heat-rejecting media in accordance with embodiments of the present disclosure; -
FIG. 4 illustrates a view of the bottom of a top PCB of the device depicted inFIG. 2 , in accordance with embodiments of the present disclosure; -
FIG. 5 illustrates an isometric perspective view of the device depicted inFIG. 2 assembled but with its enclosure removed, in accordance with embodiments of the present disclosure; and -
FIG. 6 illustrates a side view of the device depicted inFIG. 2 assembled, in accordance with embodiments of the present disclosure. - Preferred embodiments and their advantages are best understood by reference to
FIGS. 1 through 6 , wherein like numbers are used to indicate like and corresponding parts. For the purposes of this disclosure, an information handling system may include any instrumentality or aggregate of instrumentalities operable to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, entertainment, or other purposes. For example, an information handling system may be a personal computer, a PDA, a consumer electronic device, a network storage device, or any other suitable device and may vary in size, shape, performance, functionality, and price. The information handling system may include memory, one or more processing resources such as a central processing unit (CPU) or hardware or software control logic. Additional components of the information handling system may include one or more storage devices, one or more communications ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, and a video display. The information handling system may also include one or more buses operable to transmit communication between the various hardware components. - For the purposes of this disclosure, computer-readable media may include any instrumentality or aggregation of instrumentalities that may retain data and/or instructions for a period of time. Computer-readable media may include, without limitation, storage media such as a direct access storage device (e.g., a hard disk drive or floppy disk), a sequential access storage device (e.g., a tape disk drive), compact disk, CD-ROM, DVD, random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and/or flash memory; as well as communications media such as wires, optical fibers, microwaves, radio waves, and other electromagnetic and/or optical carriers; and/or any combination of the foregoing.
- For the purposes of this disclosure, information handling resources may broadly refer to any component system, device or apparatus of an information handling system, including without limitation processors, buses, memories, I/O devices and/or interfaces, storage resources, network interfaces, motherboards, integrated circuit packages; electro-mechanical devices (e.g., air movers), displays, and power supplies.
-
FIG. 1 illustrates a block diagram of an exampleinformation handling system 102, in accordance with embodiments of the present disclosure. In some embodiments,information handling system 102 may comprise a server chassis configured to house a plurality of servers or “blades.” In other embodiments,information handling system 102 may comprise a personal computer (e.g., a desktop computer, laptop computer, mobile computer, and/or notebook computer). In yet other embodiments,information handling system 102 may comprise a storage enclosure configured to house a plurality of physical disk drives and/or other computer-readable media for storing data. As shown inFIG. 1 ,information handling system 102 may include achassis 100 housing aprocessor 103, amemory 104, atemperature sensor 106, anair mover 108, amanagement controller 112, adevice 116, and heat-rejectingmedia 122. -
Processor 103 may comprise any system, device, or apparatus operable to interpret and/or execute program instructions and/or process data, and may include, without limitation a microprocessor, microcontroller, digital signal processor (DSP), application specific integrated circuit (ASIC), or any other digital or analog circuitry configured to interpret and/or execute program instructions and/or process data. In some embodiments,processor 103 may interpret and/or execute program instructions and/or process data stored inmemory 104 and/or another component ofinformation handling system 102. -
Memory 104 may be communicatively coupled toprocessor 103 and may comprise any system, device, or apparatus operable to retain program instructions or data for a period of time.Memory 104 may comprise random access memory (RAM), electrically erasable programmable read-only memory (EEPROM), a PCMCIA card, flash memory, magnetic storage, opto-magnetic storage, or any suitable selection and/or array of volatile or non-volatile memory that retains data after power toinformation handling system 102 is turned off. -
Air mover 108 may include any mechanical or electro-mechanical system, apparatus, or device operable to move air and/or other gases in order to cool information handling resources ofinformation handling system 102. In some embodiments,air mover 108 may comprise a fan (e.g., a rotating arrangement of vanes or blades which act on the air). In other embodiments,air mover 108 may comprise a blower (e.g., a centrifugal fan that employs rotating impellers to accelerate air received at its intake and change the direction of the airflow). In these and other embodiments, rotating and other moving components ofair mover 108 may be driven by amotor 110. The rotational speed ofmotor 110 may be controlled by an air mover control signal communicated fromthermal control system 114 ofmanagement controller 112. In operation,air mover 108 may cool information handling resources ofinformation handling system 102 by drawing cool air into an enclosure housing the information handling resources from outside the chassis, expelling warm air from inside the enclosure to the outside of such enclosure, and/or moving air across one or more heat sinks (not explicitly shown) internal to the enclosure to cool one or more information handling resources. -
Management controller 112 may comprise any system, device, or apparatus configured to facilitate management and/or control ofinformation handling system 102 and/or one or more of its component information handling resources.Management controller 112 may be configured to issue commands and/or other signals to manage and/or controlinformation handling system 102 and/or its information handling resources.Management controller 112 may comprise a microprocessor, microcontroller, DSP, ASIC, field programmable gate array (“FPGA”), EEPROM, or any combination thereof.Management controller 112 also may be configured to provide out-of-band management facilities for management ofinformation handling system 102. Such management may be made bymanagement controller 112 even ifinformation handling system 102 is powered off or powered to a standby state. In certain embodiments,management controller 112 may include or may be an integral part of a baseboard management controller (BMC), a remote access controller (e.g., a Dell Remote Access Controller or Integrated Dell Remote Access Controller), or an enclosure controller. In other embodiments,management controller 112 may include or may be an integral part of a chassis management controller (CMC). - As shown in
FIG. 1 ,management controller 112 may include athermal control system 114.Thermal control system 114 may include any system, device, or apparatus configured to receive one or more signals indicative of one or more temperatures within information handling system 102 (e.g., one or more signals from one or more temperature sensors 106), and based on such signals, calculate an air mover driving signal to maintain an appropriate level of cooling, increase cooling, or decrease cooling, as appropriate, and communicate such air mover driving signal toair mover 108. In these and other embodiments,thermal control system 114 may be configured to receive information from other information handling resources and calculate the air mover driving signal based on such received information in addition to temperature information. For example, as described in greater detail below,thermal control system 114 may receive configuration data fromdevice 116 and/or other information handling resources ofinformation handling system 102, which may include thermal requirements information of one or more information handling resources. In addition to temperature information collected from sensors withininformation handling system 102,thermal control system 114 may also calculate the air mover driving signal based on such information received from information handling resources. -
Temperature sensor 106 may be any system, device, or apparatus (e.g., a thermometer, thermistor, etc.) configured to communicate a signal tomanagement controller 112 or another controller indicative of a temperature withininformation handling system 102. In many embodiments,information handling system 102 may comprise a plurality oftemperature sensors 106, wherein eachtemperature sensor 106 detects a temperature of a particular component and/or location withininformation handling system 102. -
Device 116 may comprise any component information handling system ofinformation handling system 102, including without limitation processors, buses, memories, I/O devices and/or interfaces, storage resources, network interfaces, motherboards, integrated circuit packages, electro-mechanical devices, displays, and power supplies. In particular embodiments,device 116 may comprise an SSD having a PMIC. - As shown in
FIG. 1 ,device 116 may have mechanically and thermally coupled thereto heat-rejectingmedia 122. Heat-rejectingmedia 122 may include any system, device, or apparatus configured to transfer heat from an information handling resource (e.g.,device 116, as shown inFIG. 1 ), thus reducing a temperature of the information handling resource. For example, heat-rejectingmedia 122 may include a solid member thermally coupled to the information handling resource (e.g., heat spreader) such that heat generated by the information handling resource is transferred from the information handling resource into air surrounding the information handling resource. For example, in the embodiments represented byFIG. 1 , heat-rejectingmedia 122 may be thermally coupled todevice 116 and arranged such that heat generated bydevice 116 is transferred to air driven byair mover 108, as described in greater detail below. - In addition to
processor 103,memory 104,temperature sensor 106,air mover 108,management controller 112,device 116, and heat-rejectingmedia 122,information handling system 102 may include one or more other information handling resources. In addition, for the sake of clarity and exposition of the present disclosure,FIG. 1 depicts only oneair mover 108 and onedevice 116. In embodiments of the present disclosure,information handling system 102 may include any number ofair movers 108 anddevices 116. However, in some embodiments, approaches similar or identical to those used tocool device 116 as described herein may be employed to provide cooling ofprocessor 103,memory 104,management controller 112, and/or any other information handling resource ofinformation handling system 102. -
FIG. 2 illustrates an exploded isometric perspective view of anexample device 116, in accordance with embodiments of the present disclosure. For purposes of clarity and exposition, heat-rejectingmedia 122 is not depicted inFIG. 2 . As shown inFIG. 2 ,device 116 may be implemented in a dual-PCB design comprising atop PCB 202 and abottom PCB 204. Further,top PCB 202 andbottom PCB 204 may be enclosed by an enclosure comprising atop cover 206 and abottom cover 208. In some embodiments, one or both oftop cover 206 andbottom cover 208 may be constructed from metal or another thermally-conductive material. In some embodiments,device 116 may comprise an SSD. - In the foregoing paragraph (and throughout this disclosure), the use of the terms “top” and “bottom” are arbitrary and used for purposes of exposition, and not meant to require a particular position of
device 116 withininformation handling system 102. -
FIG. 3 illustrates a side perspective view of example heat-rejectingmedia 122 in accordance with embodiments of the present disclosure. As shown inFIG. 3 , heat-rejectingmedia 122 may include asource 302 thermally coupled to asink 304 via a thermally-conductive strip 306. -
Source 302 may be configured to mechanically and thermally couple to a heat-generating component (e.g., a PMIC of an SSD), and may comprise askin 308 constructed from flexible, thermally-conductive material (e.g., thin layer of graphite, such as a thickness of 0.1 mm), with a cavity formed withinskin 308, such cavity including a solid,flexible foam 310. The use offlexible skin 308 andflexible foam 310 insource 302 may allowsource 302 to be compressed betweentop PCB 202 andbottom PCB 204, providing mechanical pressure to ensure thermal coupling ofsource 302 to a heat-generating component ofdevice 116. -
Sink 304 may be configured to mechanically and thermally couple to one or more structures of device 116 (e.g.,top cover 202 or other structure), and may comprise askin 312 constructed from flexible, thermally-conductive material (e.g., thin layer of graphite, such as a thickness of 0.1 mm), with a cavity formed withinskin 312, such cavity including a solid,flexible foam 314. The use offlexible skin 312 andflexible foam 314 insink 304 may allow sink 304 to be compressed between components of device 116 (e.g.,top PCB 202,bottom PCB 204, and/or other components of device 116) providing mechanical pressure to ensure thermal coupling ofsink 304 to such components. -
Strip 306 may comprise a strip of thermally-conductive material (e.g., thin layer of graphite, such as a thickness of 0.1 mm). In some embodiments,strip 306 may be coated with thermally-insulating material, to maximize heat transfer fromsource 302 to sink 304 viastrip 306. - In some embodiments,
skin 308,skin 312, andstrip 306 may be formed from the same continuous piece of material (e.g., graphite sheet or strip), withskin 308 wrapped aroundfoam 310 andskin 312 wrapped aroundfoam 314. - The thin profile of heat-rejecting
media 122 may make its use advantageous within a dual-PCB structure, such as that shown inFIG. 2 , as it may allow heat-rejectingmedia 122 to traverse the narrow space that may be present betweentop PCB 202 andbottom PCB 204 in order to transfer heat from a location internal to such narrow space to an edge of or the exterior of device 116 (where, in some embodiments, such heat may further be transferred to air flowing proximate to device 116). - In some embodiments,
source 302,sink 304, and/orstrip 306 may be shaped to contour to specific features withindevice 116. For example, as shown inFIG. 3 ,source 302 may have a cubic shape to facilitate optimal thermal coupling betweensource 302 and a heat-generating component ofdevice 116. As another example, sink 304 and/or a portion ofstrip 306 may have curves and/or bends to facilitate contouring of heat-rejectingmedia 122 to components of device 116 (e.g., a barrel capacitor, as shown in other figures described below). However, such shapes ofsource 302,sink 304, andstrip 306 may not be limited to those depicted inFIG. 3 , and may vary between implementations ofdevice 116. -
FIG. 4 illustrates a view of the bottom oftop PCB 202, in accordance with embodiments of the present disclosure.FIG. 5 illustrates an isometric perspective view ofdevice 116, assembled but with its enclosure removed, in accordance with embodiments of the present disclosure.FIG. 6 illustrates a side view ofdevice 116 assembled, in accordance with embodiments of the present disclosure. - As shown in
FIGS. 4 and 6 ,top PCB 202 may have a heat-generating component 402 (e.g., PMIC) mounted thereto. As also shown inFIGS. 4 and 6 ,source 302 may be thermally coupled to heat-generatingcomponent 402 andstrip 306 may be routed between the space betweentop PCB 202 andbottom PCB 204. In some embodiments, a compressive force ofsource 302 betweentop PCB 202 andbottom PCB 204 may provide mechanical force forthermally coupling source 302 to heat-generatingcomponent 402. - As shown in
FIGS. 4-6 ,strip 306 may terminate intosink 304 at an edge oftop PCB 202. Further,strip 306 and/or sink 304 may be shaped to contour to one or more components or features ofdevice 116, such asbarrel capacitor 404. In some embodiments, a compressive force ofsink 304 betweentop cover 206 andbarrel capacitor 404 may provide mechanical force forthermally coupling sink 304 tocapacitor 404 and/ortop cover 206. Accordingly, heat may be transferred from heat-generatingcomponent 402 totop cover 206,barrel capacitor 404, and/or another component at or near the exterior ofdevice 116, where such heat may be transferred to air flow proximate todevice 116. - As used herein, when two or more elements are referred to as “coupled” to one another, such term indicates that such two or more elements are in electronic communication or mechanical communication, as applicable, whether connected indirectly or directly, with or without intervening elements.
- This disclosure encompasses all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend. Similarly, where appropriate, the appended claims encompass all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend. Moreover, reference in the appended claims to an apparatus or system or a component of an apparatus or system being adapted to, arranged to, capable of, configured to, enabled to, operable to, or operative to perform a particular function encompasses that apparatus, system, or component, whether or not it or that particular function is activated, turned on, or unlocked, as long as that apparatus, system, or component is so adapted, arranged, capable, configured, enabled, operable, or operative. Accordingly, modifications, additions, or omissions may be made to the systems, apparatuses, and methods described herein without departing from the scope of the disclosure. For example, the components of the systems and apparatuses may be integrated or separated. Moreover, the operations of the systems and apparatuses disclosed herein may be performed by more, fewer, or other components and the methods described may include more, fewer, or other steps. Additionally, steps may be performed in any suitable order. As used in this document, “each” refers to each member of a set or each member of a subset of a set.
- Although exemplary embodiments are illustrated in the figures and described below, the principles of the present disclosure may be implemented using any number of techniques, whether currently known or not. The present disclosure should in no way be limited to the exemplary implementations and techniques illustrated in the drawings and described above.
- Unless otherwise specifically noted, articles depicted in the drawings are not necessarily drawn to scale.
- All examples and conditional language recited herein are intended for pedagogical objects to aid the reader in understanding the disclosure and the concepts contributed by the inventor to furthering the art, and are construed as being without limitation to such specifically recited examples and conditions. Although embodiments of the present disclosure have been described in detail, it should be understood that various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the disclosure.
- Although specific advantages have been enumerated above, various embodiments may include some, none, or all of the enumerated advantages. Additionally, other technical advantages may become readily apparent to one of ordinary skill in the art after review of the foregoing figures and description.
- To aid the Patent Office and any readers of any patent issued on this application in interpreting the claims appended hereto, applicants wish to note that they do not intend any of the appended claims or claim elements to invoke 35 U.S.C. § 112(f) unless the words “means for” or “step for” are explicitly used in the particular claim.
Claims (18)
1. An information handling system comprising:
a processor; and
an information handling resource communicatively coupled to the processor, the information handling resource comprising:
a heat-generating component; and
heat-rejecting media thermally coupled to the information handling resource, the heat-rejecting media comprising:
a source comprising a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component;
a sink comprising a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource; and
a thermally-conductive strip thermally coupled between the source and the sink.
2. The information handling system of claim 1 , wherein the information handling resource comprises a solid state drive.
3. The information handling system of claim 2 , wherein the heat-generating component comprises a power management integrated circuit of the solid state drive.
4. The information handling system of claim 1 , wherein:
the information handling resource is implemented at least in part by a first printed circuit board and a second printed circuit board;
the heat-generating component is mounted on one of the first printed circuit board and the second printed circuit board; and
mechanical compression between the first printed circuit board and the second printed circuit board of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component.
5. The information handling system of claim 1 , wherein at least one of the first flexible and thermally-conductive skin, the second flexible and thermally-conductive skin, and the thermally-conductive strip are formed from graphite.
6. The information handling system of claim 1 , wherein the first flexible and thermally-conductive skin, the second flexible and thermally-conductive skin, and the thermally-conductive strip are formed from the same sheet of material.
7. Heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource, the heat-rejecting media comprising:
a source comprising a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component of the information handling resource;
a sink comprising a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource; and
a thermally-conductive strip thermally coupled between the source and the sink.
8. The heat-rejecting media of claim 7 , wherein the information handling resource comprises a solid state drive.
9. The heat-rejecting media of claim 8 , wherein the heat-generating component comprises a power management integrated circuit of the solid state drive.
10. The heat-rejecting media of claim 7 , wherein:
the information handling resource is implemented at least in part by a first printed circuit board and a second printed circuit board;
the heat-generating component is mounted on one of the first printed circuit board and the second printed circuit board; and
mechanical compression between the first printed circuit board and the second printed circuit board of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component.
11. The heat-rejecting media of claim 7 , wherein at least one of the first flexible and thermally-conductive skin, the second flexible and thermally-conductive skin, and the thermally-conductive strip are formed from graphite.
12. The heat-rejecting media of claim 7 , wherein the first flexible and thermally-conductive skin, the second flexible and thermally-conductive skin, and the thermally-conductive strip are formed from the same sheet of material.
13. An information handling resource comprising:
a heat-generating component; and
heat-rejecting media thermally coupled to the information handling resource, the heat-rejecting media comprising:
a source comprising a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component;
a sink comprising a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource; and
a thermally-conductive strip thermally coupled between the source and the sink.
14. The information handling resource of claim 13 , wherein the information handling resource comprises a solid state drive.
15. The information handling resource of claim 14 , wherein the heat-generating component comprises a power management integrated circuit of the solid state drive.
16. The information handling resource of claim 13 , wherein:
the information handling resource is implemented at least in part by a first printed circuit board and a second printed circuit board;
the heat-generating component is mounted on one of the first printed circuit board and the second printed circuit board; and
mechanical compression between the first printed circuit board and the second printed circuit board of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component.
17. The information handling resource of claim 13 , wherein at least one of the first flexible and thermally-conductive skin, the second flexible and thermally-conductive skin, and the thermally-conductive strip are formed from graphite.
18. The information handling resource of claim 13 , wherein the first flexible and thermally-conductive skin, the second flexible and thermally-conductive skin, and the thermally-conductive strip are formed from the same sheet of material.
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