US20220302022A1 - Semiconductor substrate structure and method of manufacturing the same - Google Patents
Semiconductor substrate structure and method of manufacturing the same Download PDFInfo
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- US20220302022A1 US20220302022A1 US17/204,829 US202117204829A US2022302022A1 US 20220302022 A1 US20220302022 A1 US 20220302022A1 US 202117204829 A US202117204829 A US 202117204829A US 2022302022 A1 US2022302022 A1 US 2022302022A1
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
Definitions
- the present disclosure relates generally to a semiconductor substrate structure and a method of manufacturing a semiconductor package structure.
- a semiconductor substrate structure includes a substrate, an electronic device, and a filling material.
- the substrate defines a cavity.
- the electronic device is disposed in the cavity and spaced apart from the substrate by a gap.
- the filling material is disposed in the gap and covers a first region of an upper surface of the electronic device.
- a semiconductor substrate structure includes a substrate, an electronic device, a filling material, and a dielectric layer.
- the substrate defines a cavity.
- the electronic device is disposed in the cavity.
- the filling material includes a protrusion disposed on a first region of an upper surface of the electronic device.
- the dielectric layer is disposed over the electronic device and includes an extending portion engaged with the protrusion of the filling material.
- a method of manufacturing a semiconductor substrate structure includes the following operations: providing a substrate, the substrate defining a cavity; disposing an electronic device in the cavity, the electronic device being spaced apart from the substrate by a gap, and the gap includes a first inlet end and a second inlet end; and applying a filling material into the gap via the first inlet end and the second inlet end, wherein a flow rate of the filling material at the first inlet end is greater than a flow rate of the filling material at the second inlet end.
- FIG. 1 illustrates a cross-sectional view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure
- FIG. 1B illustrates a top view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure
- FIG. 2A illustrates a cross-sectional view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure
- FIG. 2B illustrates a top view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure
- FIG. 3A illustrates a cross-sectional view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure
- FIG. 3B illustrates a cross-sectional view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure.
- FIG. 4A , FIG. 4B , FIG. 4 B 1 , FIG. 4C , FIG. 4D , FIG. 4E , and FIG. 4F illustrate various operations in a method of manufacturing a semiconductor substrate structure in accordance with some embodiments of the present disclosure.
- FIG. 1 illustrates a cross-sectional view of a semiconductor substrate structure 1 in accordance with some embodiments of the present disclosure.
- the semiconductor substrate structure 1 includes a substrate 10 , an electronic device 20 , a filling material 30 , and conductive pads 210 and 220 .
- the substrate 10 may define a cavity 10 C.
- the cavity 10 C has at least a sidewall 101 and a sidewall 102 opposite to the sidewall 101 .
- the cavity 10 C is exposed from an upper surface 10 a of the substrate 10 .
- the cavity 10 C is a through cavity that penetrates the substrate 10 .
- the cavity 10 C may be a recess that recesses from the upper surface 10 a without penetrating the substrate 10 .
- the substrate 10 may have a CTE of less than about 20 10 ⁇ 6 /K.
- the semiconductor substrate structure 1 may further include a carrier 10 A, and the substrate 10 together with the carrier 10 A may define the cavity 10 C.
- the carrier 10 A may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, a polymer-impregnated glass-fiber-based copper foil laminate, or a tape.
- the carrier 10 A may include an interconnection structure, such as a plurality of conductive traces or a through via.
- the carrier 10 A includes a ceramic material or a metal plate.
- the substrate 10 includes a base layer 12 , one or more interconnection vias 13 , and a dielectric layer 15 .
- the material of the base layer 12 may include a dielectric material or an insulating material.
- the base layer 12 may be a core substrate, a coreless substrate, or other suitable substrate.
- the base layer 12 may include a plurality of sub-layers.
- the base layer 12 may define at least one through hole 12 H.
- the interconnection via 13 is disposed in the through hole 12 H.
- the interconnection via 13 may include a base conductive layer 131 and an insulation material 132 .
- the base conductive layer 131 is disposed or formed on a side wall of the through hole 12 H, and defines a central through hole.
- the insulation material 132 fills the central through hole defined by the base conductive layer 131 .
- the insulation material 132 may be omitted, and a bulk conductive material may fill the through hole 12 H to form the interconnection via.
- the interconnection via 30 may further include a plurality of wiring layers or conductive patterns disposed on the sub-layers of the base layer 12 and connected to the base conductive layer 131 .
- the interconnection via 13 may further include an upper electrode 13 a and a bottom electrode 13 b respectively disposed on the upper surface and the bottom surface of the base layer 12 , and electrically connected to the base conductive layer 131 .
- the dielectric layer 15 is disposed on the upper electrode 13 a, the bottom electrode 13 b, and the base layer 12 . In some embodiments, the dielectric layer 15 covers the upper electrode 13 a, the bottom electrode 13 b, and the base layer 12 and defines the cavity 10 C.
- the electronic device 20 may be disposed in the cavity 10 C. In some embodiments, the electronic device 20 is spaced apart from the substrate 10 by a gap G 1 .
- the electronic device 20 has an upper surface 201 and a bottom surface 202 opposite to the upper surface 201 .
- the upper surface 201 may be leveled with or lower than the upper surface 10 a of the substrate 10 .
- the upper surface 201 of the electronic device 20 includes a region 201 A and a region 201 C.
- the region 201 A of the upper surface 201 of the electronic device 20 is proximal to an edge (e.g., edge 20 E) of the electronic device 20 .
- the region 201 A of the upper surface 201 of the electronic device 20 is along with an edge (e.g., edge 20 E) of the electronic device 20 .
- the region 201 C is at a central region of the upper surface 201 of the electronic device 20 .
- the electronic device 20 includes an active devices such as a transistor and/or a passive device such as a resistor, a capacitor, an inductor, or a combination thereof.
- the electronic device 20 e.g., silicon-based layers
- the electronic device 20 may have a CTE of less than about 5 10 ⁇ 6 /K. In some embodiments, the electronic device 20 (e.g., silicon-based layers) may have a CTE from about 3 10 ⁇ 6 /K to about 5 10 ⁇ 6 /K.
- the conductive pads 210 are disposed on the region 201 C of the upper surface 201 of the electronic device 20 .
- the conductive pad 210 has a thickness T 2 of equal to or greater than about 15 ⁇ m. In some embodiments, the thickness T 2 of the conductive pad 210 is from about 15 ⁇ m to about 25 ⁇ m.
- the conductive pads 220 are disposed under the bottom surface 202 of the electronic device 20 . In some embodiments, the conductive pads 220 are between the bottom surface 202 of the electronic device 20 and the bottom surface of the cavity 10 C.
- the filling material 30 may be disposed in the gap G 1 .
- the filling material 30 partially covers the upper surface 201 of the electronic device 20 .
- the filling material 30 covers the region 201 A of the upper surface 201 of the electronic device 20 .
- the filling material 30 contacts the region 201 A of the upper surface 201 of the electronic device 20 .
- the filling material 30 directly or physically contacts the region 201 A of the upper surface 201 of the electronic device 20 .
- the filling material 30 further covers the bottom surface 202 of the electronic device 20 .
- the conductive pads 220 are covered or surrounded by the filling material 30 .
- the filling material 30 may include resin, ink (e.g. Ajinomoto build-up film (ABF) ink), or a molding compound.
- the filling material 30 may have a CTE of greater than about 20 10 ⁇ 6 /K.
- the filling material 30 may have a CTE of equal to or greater than about 30 10 ⁇ 6 /K.
- the filling material 30 may have a CTE from about 30 10 ⁇ 6 /K to about 40 10 ⁇ 6 /K.
- a difference between the CTE of the filling material 30 and the CTE of the substrate 10 is less than a difference between the CTE of the filling material 30 and the CTE of the electronic device 20 .
- the filling material 30 includes a protrusion 31 disposed on the region 201 A of the upper surface 201 of the electronic device 20 .
- the protrusion 31 of the filling material 30 contacts the region 201 A of the upper surface 201 of the electronic device 20 .
- the protrusion 31 of the filling material 30 directly or physically contacts a portion of the region 201 A of the upper surface 201 of the electronic device 20 .
- the protrusion 31 of the filling material 30 has a thickness T 1 that is substantially the same as the thickness T 2 of the conductive pad 210 .
- the filling material 30 includes a portion 301 (which is also referred to as “a stepped portion”). In some embodiments, the portion 301 of the filling material 30 covers the region 201 A of the upper surface 201 of the electronic device 20 . In some embodiments, the portion 301 of the filling material 30 contacts the region 201 A of the upper surface 201 of the electronic device 20 . In some embodiments, the portion 301 of the filling material 30 includes the protrusion 31 . In some embodiments, the filling material 30 includes a plurality of fillers.
- a density of the fillers proximal to the region 201 A of the upper surface 201 of the electronic device 20 is less than a density of the fillers proximal to the bottom surface 202 of the electronic device 20 . In some embodiments, a density of the fillers proximal to the region 201 A of the upper surface 201 of the electronic device 20 is less than a density of the fillers proximal to the region 201 C of the upper surface 201 of the electronic device 20 .
- the region 201 C of the upper surface 201 of the electronic device 20 is free from being covered by the filling material 30 . In some embodiments, the region 201 C of the upper surface 201 of the electronic device 20 is spaced apart from the filling material 30 . In some embodiments, the filling material 30 defines an opening 310 . In some embodiments, the opening 310 of the filling material 30 exposes the region 201 C of the upper surface 201 of the electronic device 20 . In some embodiments, the conductive pads 210 are exposed from the opening 310 of the filling material 30 . In some embodiments, the conductive pads 210 on the region 201 C of the upper surface 201 of the electronic device 20 are free from being covered by the filling material 30 .
- a distance D 1 between a sidewall 311 of the opening 310 and the sidewall 101 of the cavity 10 C is different from a distance D 2 (which is also referred to as a width of the gap G 1 ) between a sidewall 312 of the opening 310 and the sidewall 102 of the cavity 10 C.
- the distance D 1 is greater than the distance D 2 (i.e., the width of the gap G 1 ).
- the distance D 2 i.e., the width of the gap G 1
- the thickness T 2 of the conductive pad 210 is greater than the thickness T 2 of the conductive pad 210 .
- a ratio (D 2 /T 2 ) of the distance D 2 (i.e., the width of the gap G 1 ) to the thickness T 2 of the conductive pad 210 is greater than about 2 . In some embodiments, a ratio (D 2 /T 2 ) of the distance D 2 (i.e., the width of the gap G 1 ) to the thickness T 2 of the conductive pad 210 is equal to or greater than about 4. For example, the distance D 2 may be about 100 and the thickness T 2 of the conductive pad 210 may be about 25 ⁇ m.
- the filling material 30 further covers one or more portions of the upper surface 10 a of the substrate 10 .
- the upper surface 10 a of the substrate 10 includes a portion 10 a 1 proximal to the sidewall 101 of the cavity 10 C and a portion 10 a 2 proximal to the sidewall 102 of the cavity 10 C.
- the portion 10 a 1 of the upper surface 10 a is connected to the sidewall 101 of the cavity 10 C.
- the portion 10 a 1 of the upper surface 10 a is proximal to the region 201 A of the upper surface 201 and distal from the region 201 C of the upper surface 201 of the electronic device 20 .
- the filling material 30 covers the portion 10 a 1 of the upper surface 10 a of the substrate 10 . In some embodiments, the portion 10 a 2 of the upper surface 10 a is connected to the sidewall 102 of the cavity 10 C. In some embodiments, the filling material 30 covers the portion 10 a 2 of the upper surface 10 a of the substrate 10 .
- the adhesion between the filling material 30 and the substrate 10 is relatively improved, for example, greater than the adhesion between the filling material 30 and the electronic device 20 .
- the filling material 30 further covers or contacts one or more portions of the upper surface 10 a of the substrate 10 , and thus the bonding strength between the filling material 30 and the substrate 10 can be further improved with the increased contact area between the filling material 30 and the substrate 10 .
- the increased contact area between the filling material 30 and the substrate 10 can further increase the overall adhesion between the filling material 30 , the electronic device 20 , and the substrate 10 . Therefore, the delamination issue can be effectively prevented or reduced, and thus the reliability of the semiconductor substrate structure 1 can be further improved.
- FIG. 1B illustrates a top view of a semiconductor substrate structure 1 in accordance with some embodiments of the present disclosure.
- FIG. 1 illustrates a cross-sectional view along the cross-sectional line 1 A- 1 A′ in FIG. 1B .
- the filling material 30 includes a plurality of ribs (e.g., ribs 321 , 322 , 323 , and 324 ) which define the opening 310 .
- the rib 321 covers the region 201 A of the upper surface 201 of the electronic device 20 .
- the rib 323 is opposite to the rib 321 , and a width W 1 of the rib 321 is different from a width W 2 of the rib 323 . In some embodiments, the width W 1 of the rib 321 is greater than the width W 2 of the rib 323 .
- the width W 1 of the rib 321 is different from a width W 4 of the rib 322 and a width W 5 of the rib 324 . In some embodiments, the width W 1 of the rib 321 is greater than the width W 4 of the rib 322 . In some embodiments, the width W 1 of the rib 321 is greater than the width W 5 of the rib 324 .
- the filling material 30 has a substantially planar upper surface.
- the upper surface of the ribs (e.g., ribs 321 , 322 , 323 , and 324 ) of the filling material 30 are substantially coplanar.
- an area of the portion 10 a 1 of the upper surface 10 a of the substrate 10 covered by the rib 321 is different from an area of the portion 10 a 2 of the upper surface 10 a of the substrate 10 covered by the rib 323 .
- the area of the portion 10 a 1 is greater than the area of the portion 10 a 2 .
- the upper surface 201 of the electronic device 20 has a width W 3 along a direction DR 1 substantially parallel to the width W 1 .
- the width W 3 satisfies the following condition: W 3 ⁇ (W 1 +W 2 )/2.
- the width W 3 satisfies the following condition: W 3 ⁇ (W 1 +W 2 )/2.
- the overall warpage of the semiconductor substrate structure 1 can be effectively reduced.
- the warpage of a unit or a singulated semiconductor substrate structure 1 can be lower than about 50 ⁇ m, and the warpage of a panel type structure including unsingulated semiconductor substrate structures 1 can be lower than about 4 mm. Therefore, the reliability of the semiconductor substrate structure 1 can be improved.
- the filling material 30 partially covers or contacts the upper surface 201 of the electronic device 20 , since the contact region/area between the filling material 30 and the electronic device 20 is reduced, the warpage issue of the semiconductor substrate structures 1 due to the CTE mismatch between the filling material 30 and the electronic device 20 can be effectively reduced.
- the conductive pads 210 are free from being covered by the filling material 30 , and thus the via holes for forming conductive through vias that electrically connect to the electronic device 20 only need to penetrate through a dielectric layer directly on the conductive pads 210 without further penetrating through composite layers of a filling material and a dielectric layer. Therefore, the subsequent manufacturing process for forming the conductive through vias is simplified, delamination issues between composite heterogeneous layers (e.g., multilayers of the electronic device 20 /a filling material/a dielectric layer) can be effectively reduced, and thus the reliability of the semiconductor substrate structure 1 can be further improved.
- composite heterogeneous layers e.g., multilayers of the electronic device 20 /a filling material/a dielectric layer
- Table 1 shows the experimental results of the exemplary semiconductor substrate structures (E 1 -E 5 ).
- W 1 indicates the width W 1 of the rib 321 proximal to the region 201 A of the upper surface 201 of the electronic device 20
- W 2 indicates the width W 2 of the rib 323 distal from the region 201 A of the upper surface 201 of the electronic device 20
- W 3 indicates the width W 3 of the upper surface 201 of the electronic device 20
- Status indicates the evaluation of the warpage optionally with detailed description.
- FIG. 2A illustrates a cross-sectional view of a semiconductor substrate structure 2 in accordance with some embodiments of the present disclosure.
- the semiconductor substrate structure 2 is similar to the semiconductor substrate structure 1 in FIG. 1 , and some of the differences therebetween are described below.
- the upper surface 201 of the electronic device 20 further includes a region 201 B different from the regions 201 A and 201 C.
- the filling material 30 further includes a portion 302 above the region 201 B of the upper surface 201 of the electronic device 20 .
- the portion 302 of the filling material 30 covers the region 201 B of the upper surface 201 of the electronic device 20 .
- a volume of the portion 301 of the filling material 30 above the region 201 A of the upper surface 201 of the electronic device 20 is different from a volume of the portion 302 of the filling material 30 above the region 201 B of the upper surface 201 of the electronic device 20 .
- the volume of the portion 301 is greater than the volume of the portion 302 .
- the filling material 30 includes a plurality of fillers, and a density of the fillers proximal to the region 201 A is less than a density of the fillers proximal to the region 201 B.
- FIG. 2B illustrates a top view of a semiconductor substrate structure 2 in accordance with some embodiments of the present disclosure.
- FIG. 2A illustrates a cross-sectional view along the cross-sectional line 2 A- 2 A′ in FIG. 2B .
- an area of the region 201 A of the upper surface 201 of the electronic device 20 is different from an area of the region 201 B of the upper surface 201 of the electronic device 20 .
- the area of the region 201 A of the upper surface 201 of the electronic device 20 is greater than the area of the region 201 B of the upper surface 201 of the electronic device 20 .
- the rib 321 covers the region 201 A of the upper surface 201 of the electronic device 20 .
- the rib 323 covers the region 201 B of the upper surface 201 of the electronic device 20 . In some embodiments, an area of the region 201 A of the upper surface 201 of the electronic device 20 covered by the rib 321 is greater than an area of the region 201 B of the upper surface 201 of the electronic device 20 covered by the rib 323 .
- FIG. 3A illustrates a cross-sectional view of a semiconductor substrate structure 3 A in accordance with some embodiments of the present disclosure.
- the semiconductor substrate structure 3 A is similar to the semiconductor substrate structure 1 in FIG. 1 , and some of the differences therebetween are described below.
- the portion 301 of the filling material 30 covers the region 201 A of the upper surface 201 of the electronic device 20 , and the portion 301 has an uneven upper surface.
- the thickness of the portion 301 of the filling material 30 decreases along a direction from the gap G 1 toward the electronic device 20 .
- the thickness of the portion 301 of the filling material 30 decreases along a direction from an edge (e.g., the edge 20 E) of the electronic device 20 toward the conductive pads 210 over the electronic device 20 .
- the protrusion 31 of the portion 301 has an uneven upper surface.
- the thickness T 1 of the protrusion 31 of the portion 301 of the filling material 30 decreases along a direction from the gap G 1 toward the electronic device 20 . In some embodiments, the thickness T 1 of the protrusion 31 of the portion 301 of the filling material 30 decreases along a direction from an edge (e.g., the edge 20 E) of the electronic device 20 toward the conductive pads 210 over the electronic device 20 . In some embodiments, the thickness T 1 of the protrusion 31 of the portion 301 of the filling material 30 decreases from the sidewall 311 of the opening 310 toward the conductive pad 210 .
- FIG. 3B illustrates a cross-sectional view of a semiconductor substrate structure 3 B in accordance with some embodiments of the present disclosure.
- the semiconductor substrate structure 3 A is similar to the semiconductor substrate structure 1 in FIG. 1 , and some of the differences therebetween are described below.
- the semiconductor substrate structure 3 B includes a substrate 10 , an electronic device 20 , a filling material 30 , dielectric layers 40 , 42 , 51 and 53 , one or more conductive elements 50 and 52 , one or more conductive vias 60 and 62 , solder masks 70 and 72 , and conductive pads 210 and 220 .
- the dielectric layer 40 is disposed over the electronic device 20 and includes an extending portion 41 .
- the extending portion 41 of the dielectric layer 40 is engaged with the protrusion 31 of the filling material 30 .
- the extending portion 41 of the dielectric layer 40 is interlocked with the protrusion 31 of the filling material 30 .
- the extending portion 41 of the dielectric layer 40 contacts the region 201 C of the upper surface 201 of the electronic device.
- the extending portion 41 of the dielectric layer 40 directly or physically contacts the region 201 C of the upper surface 201 of the electronic device 20 .
- the extending portion 41 of the dielectric layer 40 directly or physically contacts the conductive pads 210 on the upper surface 201 of the electronic device 20 .
- the extending portion 41 of the dielectric layer 40 includes a stepped structure.
- the stepped structure of the dielectric layer 40 conforms to a morphology of the portion 301 (or stepped portion) of the filling material 30 .
- the conductive element 50 is disposed on the dielectric layer 40 and electrically connected to the electronic device 20 through the conductive via 60 within the dielectric layer 40 .
- the conductive via 60 has a continuous sidewall 61 extending from the conductive element 50 toward the electronic device 20 .
- the conductive via 60 is spaced apart from the filling material 30 .
- the extending portion 41 of the dielectric layer 40 is between the filling material 30 and the conductive via 60 .
- the dielectric layer 42 is disposed under the bottom surface 202 of the electronic device 20 .
- the conductive element 52 is electrically connected to the electronic device 20 through the conductive via 62 within the dielectric layer 42 .
- the conductive via 62 is electrically connected to the electronic device 20 through the conductive pads 220 within the cavity 10 C filled with the filling material 30 .
- the dielectric layers 40 and 42 may include an organic dielectric material and/or an inorganic dielectric material, for example, bismaleimide triazine (BT), polyimide (PI), polybenzoxazole (PBO), an Ajinomoto build-up film (ABF), polypropylene (PP), silicon oxide, silicon nitride, silicon oxynitride, or the like.
- BT bismaleimide triazine
- PI polyimide
- PBO polybenzoxazole
- ABSF Ajinomoto build-up film
- PP polypropylene
- silicon oxide silicon nitride
- silicon oxynitride silicon oxynitride
- the conductive elements 50 and 52 may include one or more circuit layers including one or more conductive wiring patterns. In some embodiments, the conductive elements 50 and 52 may include redistribution layers or wiring layers stacked with the dielectric layers 51 and 53 , respectively. In some embodiments, the solder masks 70 and 72 may define openings for solder balls to be disposed on and electrically connected to the conductive elements 50 and 52 , respectively, to facilitate external electrical connection.
- the extending portion 41 of the dielectric layer 40 interlocked with the protrusion 31 of the filling material 30 can provide an increased inter-bonding strength between the dielectric layer 40 and the filling material 30 , which is similar to a mold-lock effect. Therefore, the overall adhesion between the filling material 30 , the dielectric layer 40 , and the electronic device 20 can be increased, and thus the reliability of the semiconductor substrate structure 3 B can be improved.
- the extending portion 41 of the dielectric layer 40 directly or physically contacts the conductive pads 210 on the electronic device 20 , and thus the via holes for forming the conductive vias 60 that electrically connect to the electronic device 20 only need to penetrate through the dielectric layer 40 directly on the conductive pads 210 without further penetrating through composite layers of the filling material 30 and the dielectric layer 40 . Therefore, the manufacturing process for forming the conductive vias 60 is simplified, delamination issues between composite heterogeneous layers (e.g., multilayers of the electronic device 20 /the filling material 30 /the dielectric layer 40 ) can be effectively reduced, and thus the reliability of the semiconductor substrate structure 3 B can be further improved.
- composite heterogeneous layers e.g., multilayers of the electronic device 20 /the filling material 30 /the dielectric layer 40
- FIG. 4A , FIG. 4B , FIG. 4 B 1 , FIG. 4C , FIG. 4D , FIG. 4E , and FIG. 4F illustrate various operations in a method of manufacturing a semiconductor substrate structure in accordance with some embodiments of the present disclosure.
- a substrate 10 may be provided, and the substrate 10 may define a cavity 10 C.
- the cavity 10 C is exposed from an upper surface 10 a of the substrate 10 .
- a carrier 10 A may be further provided, and the substrate 10 together with the carrier 10 A define the cavity 10 C.
- the substrate 10 may be formed by the following operations: providing a base layer 12 having a through hole 12 H, disposing a base conductive layer 131 on a side wall of the through hole 12 H to define a central through hole, filling the central through hole with an insulation material 132 , forming an upper electrode 13 a and a bottom electrode 13 b respectively on the upper surface and the bottom surface of the base layer 12 , and covering the base layer 12 with a dielectric layer 15 , and removing a portion of the dielectric layer 15 to form the cavity 10 C.
- the dielectric layer 15 may be disposed on a carrier 10 A prior to or after performing the operation of removing a portion of the dielectric layer 15 , and the substrate 10 and the carrier 10 A collectively define the cavity 10 C.
- an electronic device 20 may be disposed in the cavity 10 C.
- the electronic device 20 may be disposed on the carrier 10 A.
- conductive pads 210 may be disposed on the upper surface 201 of the electronic device 20 .
- conductive pads 220 may be disposed on the carrier 10 A and connected to the bottom surface 202 of the electronic device 20 .
- the electronic device 20 is spaced apart from the substrate 10 by a gap G 1 , and the gap G 1 includes an inlet region G 1 A (also referred to as “a first inlet end”) and an outlet region G 1 B (also referred to as “an outlet end” or “a second inlet end”).
- the inlet region G 1 A and the outlet region G 1 B are both over the upper surface 201 of the electronic device 20 .
- the inlet region G 1 A and the outlet region G 1 B are at the same side (i.e., the side proximal to the upper surface 201 ) of the electronic device 20 .
- the gap G 1 surrounds the electronic device 20 .
- the gap G 1 has a substantially consistent width D 2 .
- the width D 2 of the gape G 1 is substantially constant surrounding the electronic device 20 .
- a fixture 80 may be disposed over the substrate 10 , and the fixture 80 may define the inlet region G 1 A and the outlet region G 1 B.
- the inlet region G 1 A and the outlet region G 1 B include openings having different sizes.
- the size of the opening of the inlet region G 1 A is greater than the size of the opening of the outlet region G 1 B.
- the inlet region G 1 A includes one opening, and the outlet region G 1 B includes one or more openings (e.g., openings G 1 B 1 , G 1 B 2 , and G 1 B 3 ) each having a size less than that of the opening of the inlet region G 1 A.
- the fixture 80 may be a metal plate, for example, a stainless plate.
- the inlet region G 1 A exposes an edge portion (i.e., portion 10 a 1 ) of the upper surface 10 a of the substrate 10 and an edge portion (e.g., a portion proximal to the edge 20 E) of the upper surface 201 of the electronic device 20 .
- the outlet region G 1 B exposes another edge portion(s) of the upper surface 10 a of the substrate 10 and another edge portion(s) of the upper surface 201 of the electronic device 20 .
- the opening G 1 B 1 of the outlet region G 1 B exposes the portion 10 a 2 of the upper surface 10 a of the substrate 10 and the edge portion proximal to the edge 20 E′ of the upper surface 201 of the electronic device 20 .
- the opening G 1 B 2 of the outlet region G 1 B exposes the portion 10 a 3 of the upper surface 10 a of the substrate 10 and the edge portion proximal to the edge 20 E′′ of the upper surface 201 of the electronic device 20 .
- the opening G 1 B 3 of the outlet region G 1 B exposes the portion 10 a 4 of the upper surface 10 a of the substrate 10 and the edge portion proximal to the edge 20 E′′′ of the upper surface 201 of the electronic device 20 .
- the fixture 80 includes a blocking portion covering a portion (i.e., the region 201 C) of the upper surface 201 of the electronic device 20 .
- the blocking portion of the fixture 80 covers the conductive pads 210 on the upper surface 201 of the electronic device 20 .
- a ratio of an area of the blocking portion of the fixture 80 to an area of the upper surface 201 (e.g., including the regions 201 C, 201 B and 201 C) of the electronic device 20 is from about 0.7 to less than about 1.
- the fixture 80 includes a plurality of openings exposing a plurality of portions (e.g., the regions 201 A and 201 B) of the upper surface 201 of the electronic device 20 .
- the openings of the fixture 80 correspond to the inlet region G 1 A and the outlet region G 1 B.
- the positions of the openings of the fixture 80 correspond to that of the inlet region G 1 A and the outlet region G 1 B.
- the shapes and the sizes of the openings of the fixture 80 correspond to that of the inlet region G 1 A and the outlet region G 1 B.
- a filling material 30 is applied in the gap G 1 from the inlet region G 1 A.
- the filling material 30 flows along the flowing direction S 1 to fill the gap G 1 .
- a portion of the filling material 30 flows out of the gap G 1 from the outlet region G 1 B.
- a flow rate of the filling material 30 at the inlet region G 1 A is greater than a flow rate of the filling material 30 at the outlet region G 1 B during the operation of applying the filling material 30 .
- the filling material 30 includes fillers, and the fillers also flow along the flowing direction S 1 in the gap G 1 .
- the relatively high flow rate proximal to the inlet region G 1 A may render the fillers spreading more diversely at the inlet region G 1 A
- the relatively low flow rate proximal to the outlet region G 1 B may render the fillers spreading more densely at the outlet region G 1 B.
- the density of the fillers in the filling material 30 may increase with the decrease of the flow rate as the filling material 30 flows along the flowing direction S 1 from the inlet region G 1 A toward the outlet region G 1 B.
- a density of the fillers proximal to the inlet region G 1 A is less than a density of the fillers proximal to the outlet region G 1 B.
- a density of the fillers proximal to the inlet region G 1 A is less than a density of the fillers proximal to the bottom surface 202 of the electronic device 20 .
- voids 90 may be present between the upper surface 201 of the electronic device 20 and the fixture 80 .
- the conductive pads 210 are spaced apart from the filling material 30 by the voids 90 .
- the inlet region G 1 A and the outlet region G 1 B may serve as a first inlet end and a second inlet end, respectively, and the filling material 30 may be applied in the gap G 1 via the first inlet end (i.e., the inlet region G 1 A) and the second inlet end (i.e., the outlet region G 1 B).
- a flow rate of the filling material 30 at the first inlet end i.e., the inlet region G 1 A
- a flow rate of the filling material 30 at the second inlet end i.e., the outlet region G 1 B
- the fixture 80 is disposed over the substrate 10 prior to applying the filling material 30 .
- the distance between the fixture 80 and the electronic device 20 is defined by the thickness T 2 of the conductive pad 210 .
- a portion of the filling material 30 flowing in-between the fixture 80 and the electronic device 20 may form a protrusion 31 having a thickness T 1 that is substantially the same as the thickness T 2 of the conductive pad 210 (i.e., the distance between the fixture 80 and the electronic device 20 ).
- portions of the filling material 30 protruded out of the openings of the fixture 80 may be removed, for example, by scraping off the excessed portions of the filling material 30 along the upper surface of the fixture 80 .
- the as-formed filling material 30 has a substantially planar upper surface after the scraping operation.
- the fixture 80 may be omitted, and the size of the opening of the inlet region G 1 A may be equal to or less than the size of the openings of the outlet region G 1 B.
- a relatively great force may be applied on the filling material 30 at the inlet region G 1 A when directing the filling material 30 into the gap G 1 .
- the filling material 30 may be applied into the gap G 1 by injection. By applying a relatively great force on the filling material 30 at the inlet region G 1 A, a flow rate of the filling material 30 at the inlet region G 1 A is greater than a flow rate of the filling material 30 at the outlet region G 1 B during the operation of applying the filling material 30 .
- the inlet region G 1 A and the outlet region G 1 B may serve as a first inlet end and a second inlet end while the fixture 80 may be omitted.
- a flow rate of the filling material 30 at the first inlet end i.e., the inlet region G 1 A
- a flow rate of the filling material 30 at the second inlet end is greater than a flow rate of the filling material 30 at the second inlet end (i.e., the outlet region G 1 B) during the operation of applying the filling material 30 .
- bubbles originally within the filling material 30 can be flushed away out of the gap G 1 from the outlet region G 1 B. Therefore, bubbles within the filling material 30 at regions under the bottom surface 202 of the electronic device 20 and adjacent to the sidewalls of the electronic device 20 can be reduced.
- bubbles within the filling material 30 at regions under the bottom surface 202 of the electronic device 20 can be pushed toward regions adjacent to the sidewalls of the electronic device 20 .
- the aforesaid design of the first inlet end (i.e., the inlet region G 1 A) and the second inlet end (i.e., the outlet region G 1 B) is advantageous to further flushing or expelling away the bubbles in subsequent processes.
- the bubbles within the filling material 30 at regions under the bottom surface 202 of the electronic device 20 and adjacent to the sidewalls of the electronic device 20 can be flushed away along the flowing direction S 1 and out of the gap G 1 from the outlet region G 1 B effectively.
- the filling material 30 by applying the filling material 30 with a higher flow rate at the inlet region G 1 A and a lower flow rate at the outlet region G 1 B, bubbles originally within the filling material 30 can be flushed away from the region under the bottom surface 202 of the electronic device 20 , and thus the issues of bubbles located under the bottom surface 202 of the electronic device 20 can be effectively prevented or reduced.
- the fixture 80 may be removed. As such, the semiconductor substrate structure 2 illustrated in FIGS. 2A-2B is formed.
- the carrier 10 A may be removed, and dielectric layers 40 and 42 may be formed on the upper surface and the bottom surface of the structure shown in FIG. 4D , respectively.
- the dielectric layers 40 and 42 may be formed by lamination.
- the dielectric layers 40 and 42 may be patterned to form openings or via holes, through vias 60 and 62 may be formed in the openings or via holes, and sub-layers of conductive elements 50 and 52 may be formed on the dielectric layers 40 and 42 , respectively, to electrically connect to the electronic device 20 through the through vias 60 and 62 .
- FIG. 4F the dielectric layers 40 and 42 may be patterned to form openings or via holes, through vias 60 and 62 may be formed in the openings or via holes, and sub-layers of conductive elements 50 and 52 may be formed on the dielectric layers 40 and 42 , respectively, to electrically connect to the electronic device 20 through the through vias 60 and 62 .
- dielectric layers 51 and 53 may be formed on the conductive elements 50 and 52 , respectively, additional sub-layers of the conductive elements 50 and 52 may be formed on the dielectric layers 51 and 53 , respectively, and solder masks 70 and 72 may be formed over the conductive elements 50 and 52 to define openings for solder balls to be disposed on and electrically connected to the conductive elements 50 and 52 , respectively.
- the semiconductor substrate structure 3 B illustrated in FIG. 3B is formed.
- the terms “approximately,” “substantially,” “substantial” and “about” are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation.
- the terms when used in conjunction with a numerical value, can refer to a range of variation less than or equal to ⁇ 10% of said numerical value, such as less than or equal to ⁇ 5%, less than or equal to ⁇ 4%, less than or equal to ⁇ 3%, less than or equal to ⁇ 2%, less than or equal to ⁇ 1%, less than or equal to ⁇ 0.5%, less than or equal to ⁇ 0.1%, or less than or equal to ⁇ 0.05%.
- two numerical values can be deemed to be “substantially” or “about” the same if a difference between the values is less than or equal to ⁇ 10% of an average of the values, such as less than or equal to ⁇ 5%, less than or equal to ⁇ 4%, less than or equal to ⁇ 3%, less than or equal to ⁇ 2%, less than or equal to ⁇ 1%, less than or equal to ⁇ 0.5%, less than or equal to ⁇ 0.1%, or less than or equal to ⁇ 0.05%.
- substantially parallel can refer to a range of angular variation relative to 0° that is less than or equal to ⁇ 10°, such as less than or equal to ⁇ 5°, less than or equal to ⁇ 4°, less than or equal to ⁇ 3°, less than or equal to ⁇ 2°, less than or equal to ⁇ 1°, less than or equal to ⁇ 0.5°, less than or equal to ⁇ 0.1°, or less than or equal to ⁇ 0.05°.
- substantially perpendicular can refer to a range of angular variation relative to 90° that is less than or equal to ⁇ 10°, such as less than or equal to ⁇ 5°, less than or equal to ⁇ 4°, less than or equal to ⁇ 3°, less than or equal to ⁇ 2°, less than or equal to ⁇ 1°, less than or equal to ⁇ 0.5°, less than or equal to ⁇ 0.1°, or less than or equal to ⁇ 0.05°.
- Two surfaces can be deemed to be coplanar or substantially coplanar if a displacement between the two surfaces is no greater than 5 ⁇ m, no greater than 2 ⁇ m, no greater than 1 ⁇ m, or no greater than 0.5 ⁇ m.
- conductive As used herein, the terms “conductive,” “electrically conductive” and “electrical conductivity” refer to an ability to transport an electric current. Electrically conductive materials typically indicate those materials that exhibit little or no opposition to the flow of an electric current. One measure of electrical conductivity is Siemens per meter (S/m). Typically, an electrically conductive material is one having a conductivity greater than approximately 10 4 S/m, such as at least 10 5 S/m or at least 10 6 S/m. The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.
- a component provided “on” or “over” another component can encompass cases where the former component is directly on (e.g., in physical contact with) the latter component, as well as cases where one or more intervening components are located between the former component and the latter component.
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Abstract
Description
- The present disclosure relates generally to a semiconductor substrate structure and a method of manufacturing a semiconductor package structure.
- Along with the rapid development in electronics industry and the progress of semiconductor processing technologies, semiconductor chips are integrated with an increasing number of electronic components to achieve improved electrical performance and additional functions. However, the increasing number of electronic components increases the overall size of the package. Embedded substrates having cavities to accommodate electronic components, followed by filling gaps between the electronic components and the substrate with filling materials, are provided to solve the aforesaid issues. However, warpage may easily occur due to the coefficient of thermal expansion (CTE) mismatch between the filling materials and the electronic components.
- In one or more embodiments, a semiconductor substrate structure includes a substrate, an electronic device, and a filling material. The substrate defines a cavity. The electronic device is disposed in the cavity and spaced apart from the substrate by a gap. The filling material is disposed in the gap and covers a first region of an upper surface of the electronic device.
- In one or more embodiments, a semiconductor substrate structure includes a substrate, an electronic device, a filling material, and a dielectric layer. The substrate defines a cavity. The electronic device is disposed in the cavity. The filling material includes a protrusion disposed on a first region of an upper surface of the electronic device. The dielectric layer is disposed over the electronic device and includes an extending portion engaged with the protrusion of the filling material.
- In one or more embodiments, a method of manufacturing a semiconductor substrate structure includes the following operations: providing a substrate, the substrate defining a cavity; disposing an electronic device in the cavity, the electronic device being spaced apart from the substrate by a gap, and the gap includes a first inlet end and a second inlet end; and applying a filling material into the gap via the first inlet end and the second inlet end, wherein a flow rate of the filling material at the first inlet end is greater than a flow rate of the filling material at the second inlet end.
- Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawings. It is noted that various features may not be drawn to scale, and the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
-
FIG. 1 illustrates a cross-sectional view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure; -
FIG. 1B illustrates a top view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure; -
FIG. 2A illustrates a cross-sectional view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure; -
FIG. 2B illustrates a top view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure; -
FIG. 3A illustrates a cross-sectional view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure; -
FIG. 3B illustrates a cross-sectional view of a semiconductor substrate structure in accordance with some embodiments of the present disclosure; and -
FIG. 4A ,FIG. 4B , FIG. 4B1,FIG. 4C ,FIG. 4D ,FIG. 4E , andFIG. 4F illustrate various operations in a method of manufacturing a semiconductor substrate structure in accordance with some embodiments of the present disclosure. - Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar elements. The present disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings.
-
FIG. 1 illustrates a cross-sectional view of asemiconductor substrate structure 1 in accordance with some embodiments of the present disclosure. Thesemiconductor substrate structure 1 includes asubstrate 10, anelectronic device 20, afilling material 30, andconductive pads - The
substrate 10 may define acavity 10C. In some embodiments, thecavity 10C has at least asidewall 101 and asidewall 102 opposite to thesidewall 101. In some embodiments, thecavity 10C is exposed from anupper surface 10 a of thesubstrate 10. In some embodiments, thecavity 10C is a through cavity that penetrates thesubstrate 10. In some other embodiments, thecavity 10C may be a recess that recesses from theupper surface 10 awithout penetrating thesubstrate 10. In some embodiments, thesubstrate 10 may have a CTE of less than about 20 10−6/K. - In some embodiments, the
semiconductor substrate structure 1 may further include acarrier 10A, and thesubstrate 10 together with thecarrier 10A may define thecavity 10C. Thecarrier 10A may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, a polymer-impregnated glass-fiber-based copper foil laminate, or a tape. Thecarrier 10A may include an interconnection structure, such as a plurality of conductive traces or a through via. In some embodiments, thecarrier 10A includes a ceramic material or a metal plate. In some embodiments, thesubstrate 10 includes abase layer 12, one ormore interconnection vias 13, and adielectric layer 15. - The material of the
base layer 12 may include a dielectric material or an insulating material. Thebase layer 12 may be a core substrate, a coreless substrate, or other suitable substrate. Thebase layer 12 may include a plurality of sub-layers. Thebase layer 12 may define at least one throughhole 12H. The interconnection via 13 is disposed in the throughhole 12H. The interconnection via 13 may include a baseconductive layer 131 and aninsulation material 132. The baseconductive layer 131 is disposed or formed on a side wall of the throughhole 12H, and defines a central through hole. Theinsulation material 132 fills the central through hole defined by the baseconductive layer 131. In some embodiments, theinsulation material 132 may be omitted, and a bulk conductive material may fill the throughhole 12H to form the interconnection via. In some embodiments, the interconnection via 30 may further include a plurality of wiring layers or conductive patterns disposed on the sub-layers of thebase layer 12 and connected to the baseconductive layer 131. In some embodiments, the interconnection via 13 may further include anupper electrode 13 a and abottom electrode 13 b respectively disposed on the upper surface and the bottom surface of thebase layer 12, and electrically connected to the baseconductive layer 131. In some embodiments, thedielectric layer 15 is disposed on theupper electrode 13 a, thebottom electrode 13 b, and thebase layer 12. In some embodiments, thedielectric layer 15 covers theupper electrode 13 a, thebottom electrode 13 b, and thebase layer 12 and defines thecavity 10C. - The
electronic device 20 may be disposed in thecavity 10C. In some embodiments, theelectronic device 20 is spaced apart from thesubstrate 10 by a gap G1. Theelectronic device 20 has anupper surface 201 and abottom surface 202 opposite to theupper surface 201. In some embodiments, theupper surface 201 may be leveled with or lower than theupper surface 10 a of thesubstrate 10. In some embodiments, theupper surface 201 of theelectronic device 20 includes aregion 201A and aregion 201C. In some embodiments, theregion 201A of theupper surface 201 of theelectronic device 20 is proximal to an edge (e.g.,edge 20E) of theelectronic device 20. In some embodiments, theregion 201A of theupper surface 201 of theelectronic device 20 is along with an edge (e.g.,edge 20E) of theelectronic device 20. In some embodiments, theregion 201C is at a central region of theupper surface 201 of theelectronic device 20. In some embodiments, theelectronic device 20 includes an active devices such as a transistor and/or a passive device such as a resistor, a capacitor, an inductor, or a combination thereof. In some embodiments, the electronic device 20 (e.g., silicon-based layers) may have a CTE of less than about 10 10−6/K. In some embodiments, the electronic device 20 (e.g., silicon-based layers) may have a CTE of less than about 5 10−6/K. In some embodiments, the electronic device 20 (e.g., silicon-based layers) may have a CTE from about 3 10−6/K to about 5 10−6/K. - In some embodiments, the
conductive pads 210 are disposed on theregion 201C of theupper surface 201 of theelectronic device 20. In some embodiments, theconductive pad 210 has a thickness T2 of equal to or greater than about 15 μm. In some embodiments, the thickness T2 of theconductive pad 210 is from about 15 μm to about 25 μm. In some embodiments, theconductive pads 220 are disposed under thebottom surface 202 of theelectronic device 20. In some embodiments, theconductive pads 220 are between thebottom surface 202 of theelectronic device 20 and the bottom surface of thecavity 10C. - The filling
material 30 may be disposed in the gap G1. In some embodiments, the fillingmaterial 30 partially covers theupper surface 201 of theelectronic device 20. In some embodiments, the fillingmaterial 30 covers theregion 201A of theupper surface 201 of theelectronic device 20. In some embodiments, the fillingmaterial 30 contacts theregion 201A of theupper surface 201 of theelectronic device 20. In some embodiments, the fillingmaterial 30 directly or physically contacts theregion 201A of theupper surface 201 of theelectronic device 20. In some embodiments, the fillingmaterial 30 further covers thebottom surface 202 of theelectronic device 20. In some embodiments, theconductive pads 220 are covered or surrounded by the fillingmaterial 30. In some embodiments, the fillingmaterial 30 may include resin, ink (e.g. Ajinomoto build-up film (ABF) ink), or a molding compound. In some embodiments, the fillingmaterial 30 may have a CTE of greater than about 20 10−6/K. In some embodiments, the fillingmaterial 30 may have a CTE of equal to or greater than about 30 10−6/K. In some embodiments, the fillingmaterial 30 may have a CTE from about 30 10−6/K to about 40 10−6/K. In some embodiments, a difference between the CTE of the fillingmaterial 30 and the CTE of thesubstrate 10 is less than a difference between the CTE of the fillingmaterial 30 and the CTE of theelectronic device 20. - In some embodiments, the filling
material 30 includes aprotrusion 31 disposed on theregion 201A of theupper surface 201 of theelectronic device 20. In some embodiments, theprotrusion 31 of the fillingmaterial 30 contacts theregion 201A of theupper surface 201 of theelectronic device 20. In some embodiments, theprotrusion 31 of the fillingmaterial 30 directly or physically contacts a portion of theregion 201A of theupper surface 201 of theelectronic device 20. In some embodiments, theprotrusion 31 of the fillingmaterial 30 has a thickness T1 that is substantially the same as the thickness T2 of theconductive pad 210. - In some embodiments, the filling
material 30 includes a portion 301 (which is also referred to as “a stepped portion”). In some embodiments, theportion 301 of the fillingmaterial 30 covers theregion 201A of theupper surface 201 of theelectronic device 20. In some embodiments, theportion 301 of the fillingmaterial 30 contacts theregion 201A of theupper surface 201 of theelectronic device 20. In some embodiments, theportion 301 of the fillingmaterial 30 includes theprotrusion 31. In some embodiments, the fillingmaterial 30 includes a plurality of fillers. In some embodiments, a density of the fillers proximal to theregion 201A of theupper surface 201 of theelectronic device 20 is less than a density of the fillers proximal to thebottom surface 202 of theelectronic device 20. In some embodiments, a density of the fillers proximal to theregion 201A of theupper surface 201 of theelectronic device 20 is less than a density of the fillers proximal to theregion 201C of theupper surface 201 of theelectronic device 20. - In some embodiments, the
region 201C of theupper surface 201 of theelectronic device 20 is free from being covered by the fillingmaterial 30. In some embodiments, theregion 201C of theupper surface 201 of theelectronic device 20 is spaced apart from the fillingmaterial 30. In some embodiments, the fillingmaterial 30 defines anopening 310. In some embodiments, theopening 310 of the fillingmaterial 30 exposes theregion 201C of theupper surface 201 of theelectronic device 20. In some embodiments, theconductive pads 210 are exposed from theopening 310 of the fillingmaterial 30. In some embodiments, theconductive pads 210 on theregion 201C of theupper surface 201 of theelectronic device 20 are free from being covered by the fillingmaterial 30. In some embodiments, a distance D1 between asidewall 311 of theopening 310 and thesidewall 101 of thecavity 10C is different from a distance D2 (which is also referred to as a width of the gap G1) between asidewall 312 of theopening 310 and thesidewall 102 of thecavity 10C. In some embodiments, the distance D1 is greater than the distance D2 (i.e., the width of the gap G1). In some embodiments, the distance D2 (i.e., the width of the gap G1) is greater than the thickness T2 of theconductive pad 210. In some embodiments, a ratio (D2/T2) of the distance D2 (i.e., the width of the gap G1) to the thickness T2 of theconductive pad 210 is greater than about 2. In some embodiments, a ratio (D2/T2) of the distance D2 (i.e., the width of the gap G1) to the thickness T2 of theconductive pad 210 is equal to or greater than about 4. For example, the distance D2 may be about 100 and the thickness T2 of theconductive pad 210 may be about 25 μm. - In some embodiments, the filling
material 30 further covers one or more portions of theupper surface 10 a of thesubstrate 10. In some embodiments, theupper surface 10 a of thesubstrate 10 includes aportion 10 a 1 proximal to thesidewall 101 of thecavity 10C and aportion 10 a 2 proximal to thesidewall 102 of thecavity 10C. In some embodiments, theportion 10 a 1 of theupper surface 10 a is connected to thesidewall 101 of thecavity 10C. In some embodiments, theportion 10 a 1 of theupper surface 10 a is proximal to theregion 201A of theupper surface 201 and distal from theregion 201C of theupper surface 201 of theelectronic device 20. In some embodiments, the fillingmaterial 30 covers theportion 10 a 1 of theupper surface 10 a of thesubstrate 10. In some embodiments, theportion 10 a 2 of theupper surface 10 a is connected to thesidewall 102 of thecavity 10C. In some embodiments, the fillingmaterial 30 covers theportion 10 a 2 of theupper surface 10 a of thesubstrate 10. - According to some embodiments of the present disclosure, since the difference between the CTE of the filling
material 30 and the CTE of thesubstrate 10 is relatively small, for example, less than the difference between the CTE of the fillingmaterial 30 and the CTE of theelectronic device 20, the adhesion between the fillingmaterial 30 and thesubstrate 10 is relatively improved, for example, greater than the adhesion between the fillingmaterial 30 and theelectronic device 20. Moreover, according to some embodiments of the present disclosure, the fillingmaterial 30 further covers or contacts one or more portions of theupper surface 10 a of thesubstrate 10, and thus the bonding strength between the fillingmaterial 30 and thesubstrate 10 can be further improved with the increased contact area between the fillingmaterial 30 and thesubstrate 10. In addition, while the adhesion between the fillingmaterial 30 and the substrate 10 (e.g., the dielectric layer 15) is greater than the adhesion between the fillingmaterial 30 and the electronic device 20 (e.g., silicon-based layer), the increased contact area between the fillingmaterial 30 and thesubstrate 10 can further increase the overall adhesion between the fillingmaterial 30, theelectronic device 20, and thesubstrate 10. Therefore, the delamination issue can be effectively prevented or reduced, and thus the reliability of thesemiconductor substrate structure 1 can be further improved. -
FIG. 1B illustrates a top view of asemiconductor substrate structure 1 in accordance with some embodiments of the present disclosure. In some embodiments,FIG. 1 illustrates a cross-sectional view along thecross-sectional line 1A-1A′ inFIG. 1B . - Referring to
FIGS. 1 and 1B , in some embodiments, the fillingmaterial 30 includes a plurality of ribs (e.g.,ribs opening 310. In some embodiments, therib 321 covers theregion 201A of theupper surface 201 of theelectronic device 20. In some embodiments, therib 323 is opposite to therib 321, and a width W1 of therib 321 is different from a width W2 of therib 323. In some embodiments, the width W1 of therib 321 is greater than the width W2 of therib 323. In some embodiments, the width W1 of therib 321 is different from a width W4 of therib 322 and a width W5 of therib 324. In some embodiments, the width W1 of therib 321 is greater than the width W4 of therib 322. In some embodiments, the width W1 of therib 321 is greater than the width W5 of therib 324. - In some embodiments, the filling
material 30 has a substantially planar upper surface. In some embodiments, the upper surface of the ribs (e.g.,ribs material 30 are substantially coplanar. - Referring to
FIGS. 1 and 1B , in some embodiments, an area of theportion 10 a 1 of theupper surface 10 a of thesubstrate 10 covered by therib 321 is different from an area of theportion 10 a 2 of theupper surface 10 a of thesubstrate 10 covered by therib 323. In some embodiments, the area of theportion 10 a 1 is greater than the area of theportion 10 a 2. In some embodiments, theupper surface 201 of theelectronic device 20 has a width W3 along a direction DR1 substantially parallel to the width W1. In some embodiments, the width W3 satisfies the following condition: W3≥(W1+W2)/2. In some embodiments, the width W3 satisfies the following condition: W3≥(W1+W2)/2. According to some embodiments of the present disclosure, with the aforesaid design of the widths W1, W2 and W3, the overall warpage of thesemiconductor substrate structure 1 can be effectively reduced. For example, the warpage of a unit or a singulatedsemiconductor substrate structure 1 can be lower than about 50 μm, and the warpage of a panel type structure including unsingulatedsemiconductor substrate structures 1 can be lower than about 4 mm. Therefore, the reliability of thesemiconductor substrate structure 1 can be improved. - According to some embodiments of the present disclosure, with the aforesaid design of the filling
material 30 partially covers or contacts theupper surface 201 of theelectronic device 20, since the contact region/area between the fillingmaterial 30 and theelectronic device 20 is reduced, the warpage issue of thesemiconductor substrate structures 1 due to the CTE mismatch between the fillingmaterial 30 and theelectronic device 20 can be effectively reduced. - In addition, according to some embodiments of the present disclosure, the
conductive pads 210 are free from being covered by the fillingmaterial 30, and thus the via holes for forming conductive through vias that electrically connect to theelectronic device 20 only need to penetrate through a dielectric layer directly on theconductive pads 210 without further penetrating through composite layers of a filling material and a dielectric layer. Therefore, the subsequent manufacturing process for forming the conductive through vias is simplified, delamination issues between composite heterogeneous layers (e.g., multilayers of theelectronic device 20/a filling material/a dielectric layer) can be effectively reduced, and thus the reliability of thesemiconductor substrate structure 1 can be further improved. - Presented below are experimental results of exemplary semiconductor substrate structures. The exemplary semiconductor substrate structures have structures similar to that shown in
FIGS. 1 and 1B . Table 1 shows the experimental results of the exemplary semiconductor substrate structures (E1-E5). In table 1, “W1” indicates the width W1 of therib 321 proximal to theregion 201A of theupper surface 201 of theelectronic device 20, “W2” indicates the width W2 of therib 323 distal from theregion 201A of theupper surface 201 of theelectronic device 20, “W3” indicates the width W3 of theupper surface 201 of theelectronic device 20, and “Status” indicates the evaluation of the warpage optionally with detailed description. -
TABLE 1 Warpage W1 (μm) W2 (μm) W3 (μm) (W1 + W2)/2 (mm) Status E1 600 400 500 500 3.2 Good E2 500 500 500 500 3.4 Bubbles observed below the electronic device E3 400 600 500 500 3.3 Bubbles observed at sidewall of the electronic device E4 600 400 300 500 3.7 Good E5 600 400 100 500 5.1 Good -
FIG. 2A illustrates a cross-sectional view of asemiconductor substrate structure 2 in accordance with some embodiments of the present disclosure. Thesemiconductor substrate structure 2 is similar to thesemiconductor substrate structure 1 inFIG. 1 , and some of the differences therebetween are described below. - In some embodiments, the
upper surface 201 of theelectronic device 20 further includes aregion 201B different from theregions material 30 further includes aportion 302 above theregion 201B of theupper surface 201 of theelectronic device 20. In some embodiments, theportion 302 of the fillingmaterial 30 covers theregion 201B of theupper surface 201 of theelectronic device 20. - In some embodiments, a volume of the
portion 301 of the fillingmaterial 30 above theregion 201A of theupper surface 201 of theelectronic device 20 is different from a volume of theportion 302 of the fillingmaterial 30 above theregion 201B of theupper surface 201 of theelectronic device 20. In some embodiments, the volume of theportion 301 is greater than the volume of theportion 302. In some embodiments, the fillingmaterial 30 includes a plurality of fillers, and a density of the fillers proximal to theregion 201A is less than a density of the fillers proximal to theregion 201B. -
FIG. 2B illustrates a top view of asemiconductor substrate structure 2 in accordance with some embodiments of the present disclosure. In some embodiments,FIG. 2A illustrates a cross-sectional view along thecross-sectional line 2A-2A′ inFIG. 2B . - Referring to
FIGS. 2A-2B , in some embodiments, an area of theregion 201A of theupper surface 201 of theelectronic device 20 is different from an area of theregion 201B of theupper surface 201 of theelectronic device 20. In some embodiments, the area of theregion 201A of theupper surface 201 of theelectronic device 20 is greater than the area of theregion 201B of theupper surface 201 of theelectronic device 20. In some embodiments, therib 321 covers theregion 201A of theupper surface 201 of theelectronic device 20. - In some embodiments, the
rib 323 covers theregion 201B of theupper surface 201 of theelectronic device 20. In some embodiments, an area of theregion 201A of theupper surface 201 of theelectronic device 20 covered by therib 321 is greater than an area of theregion 201B of theupper surface 201 of theelectronic device 20 covered by therib 323. -
FIG. 3A illustrates a cross-sectional view of asemiconductor substrate structure 3A in accordance with some embodiments of the present disclosure. Thesemiconductor substrate structure 3A is similar to thesemiconductor substrate structure 1 inFIG. 1 , and some of the differences therebetween are described below. - In some embodiments, the
portion 301 of the fillingmaterial 30 covers theregion 201A of theupper surface 201 of theelectronic device 20, and theportion 301 has an uneven upper surface. In some embodiments, the thickness of theportion 301 of the fillingmaterial 30 decreases along a direction from the gap G1 toward theelectronic device 20. In some embodiments, the thickness of theportion 301 of the fillingmaterial 30 decreases along a direction from an edge (e.g., theedge 20E) of theelectronic device 20 toward theconductive pads 210 over theelectronic device 20. In some embodiments, theprotrusion 31 of theportion 301 has an uneven upper surface. In some embodiments, the thickness T1 of theprotrusion 31 of theportion 301 of the fillingmaterial 30 decreases along a direction from the gap G1 toward theelectronic device 20. In some embodiments, the thickness T1 of theprotrusion 31 of theportion 301 of the fillingmaterial 30 decreases along a direction from an edge (e.g., theedge 20E) of theelectronic device 20 toward theconductive pads 210 over theelectronic device 20. In some embodiments, the thickness T1 of theprotrusion 31 of theportion 301 of the fillingmaterial 30 decreases from thesidewall 311 of theopening 310 toward theconductive pad 210. -
FIG. 3B illustrates a cross-sectional view of asemiconductor substrate structure 3B in accordance with some embodiments of the present disclosure. Thesemiconductor substrate structure 3A is similar to thesemiconductor substrate structure 1 inFIG. 1 , and some of the differences therebetween are described below. - In some embodiments, the
semiconductor substrate structure 3B includes asubstrate 10, anelectronic device 20, a fillingmaterial 30, dielectric layers 40, 42, 51 and 53, one or moreconductive elements conductive vias conductive pads - In some embodiments, the
dielectric layer 40 is disposed over theelectronic device 20 and includes an extendingportion 41. In some embodiments, the extendingportion 41 of thedielectric layer 40 is engaged with theprotrusion 31 of the fillingmaterial 30. In some embodiments, the extendingportion 41 of thedielectric layer 40 is interlocked with theprotrusion 31 of the fillingmaterial 30. In some embodiments, the extendingportion 41 of thedielectric layer 40 contacts theregion 201C of theupper surface 201 of the electronic device. In some embodiments, the extendingportion 41 of thedielectric layer 40 directly or physically contacts theregion 201C of theupper surface 201 of theelectronic device 20. In some embodiments, the extendingportion 41 of thedielectric layer 40 directly or physically contacts theconductive pads 210 on theupper surface 201 of theelectronic device 20. In some embodiments, the extendingportion 41 of thedielectric layer 40 includes a stepped structure. In some embodiments, the stepped structure of thedielectric layer 40 conforms to a morphology of the portion 301 (or stepped portion) of the fillingmaterial 30. - In some embodiments, the
conductive element 50 is disposed on thedielectric layer 40 and electrically connected to theelectronic device 20 through the conductive via 60 within thedielectric layer 40. In some embodiments, the conductive via 60 has acontinuous sidewall 61 extending from theconductive element 50 toward theelectronic device 20. In some embodiments, the conductive via 60 is spaced apart from the fillingmaterial 30. In some embodiments, the extendingportion 41 of thedielectric layer 40 is between the fillingmaterial 30 and the conductive via 60. - In some embodiments, the
dielectric layer 42 is disposed under thebottom surface 202 of theelectronic device 20. In some embodiments, theconductive element 52 is electrically connected to theelectronic device 20 through the conductive via 62 within thedielectric layer 42. In some embodiments, the conductive via 62 is electrically connected to theelectronic device 20 through theconductive pads 220 within thecavity 10C filled with the fillingmaterial 30. In some embodiments, thedielectric layers - In some embodiments, the
conductive elements conductive elements dielectric layers conductive elements - According to some embodiments of the present disclosure, the extending
portion 41 of thedielectric layer 40 interlocked with theprotrusion 31 of the fillingmaterial 30 can provide an increased inter-bonding strength between thedielectric layer 40 and the fillingmaterial 30, which is similar to a mold-lock effect. Therefore, the overall adhesion between the fillingmaterial 30, thedielectric layer 40, and theelectronic device 20 can be increased, and thus the reliability of thesemiconductor substrate structure 3B can be improved. - In addition, according to some embodiments of the present disclosure, the extending
portion 41 of thedielectric layer 40 directly or physically contacts theconductive pads 210 on theelectronic device 20, and thus the via holes for forming theconductive vias 60 that electrically connect to theelectronic device 20 only need to penetrate through thedielectric layer 40 directly on theconductive pads 210 without further penetrating through composite layers of the fillingmaterial 30 and thedielectric layer 40. Therefore, the manufacturing process for forming theconductive vias 60 is simplified, delamination issues between composite heterogeneous layers (e.g., multilayers of theelectronic device 20/the fillingmaterial 30/the dielectric layer 40) can be effectively reduced, and thus the reliability of thesemiconductor substrate structure 3B can be further improved. -
FIG. 4A ,FIG. 4B , FIG. 4B1,FIG. 4C ,FIG. 4D ,FIG. 4E , andFIG. 4F illustrate various operations in a method of manufacturing a semiconductor substrate structure in accordance with some embodiments of the present disclosure. - Referring to
FIG. 4A , asubstrate 10 may be provided, and thesubstrate 10 may define acavity 10C. In some embodiments, thecavity 10C is exposed from anupper surface 10 a of thesubstrate 10. In some embodiments, acarrier 10A may be further provided, and thesubstrate 10 together with thecarrier 10A define thecavity 10C. - In some embodiments, the
substrate 10 may be formed by the following operations: providing abase layer 12 having a throughhole 12H, disposing a baseconductive layer 131 on a side wall of the throughhole 12H to define a central through hole, filling the central through hole with aninsulation material 132, forming anupper electrode 13 a and abottom electrode 13 b respectively on the upper surface and the bottom surface of thebase layer 12, and covering thebase layer 12 with adielectric layer 15, and removing a portion of thedielectric layer 15 to form thecavity 10C. In some embodiments, thedielectric layer 15 may be disposed on acarrier 10A prior to or after performing the operation of removing a portion of thedielectric layer 15, and thesubstrate 10 and thecarrier 10A collectively define thecavity 10C. - Referring to
FIG. 4B and FIG. 4B1, FIG. 4B1 illustrating a cross-sectional view along thecross-sectional line 4B-4B′ inFIG. 4B , anelectronic device 20 may be disposed in thecavity 10C. In some embodiments, theelectronic device 20 may be disposed on thecarrier 10A. In some embodiments,conductive pads 210 may be disposed on theupper surface 201 of theelectronic device 20. In some embodiments,conductive pads 220 may be disposed on thecarrier 10A and connected to thebottom surface 202 of theelectronic device 20. In some embodiments, theelectronic device 20 is spaced apart from thesubstrate 10 by a gap G1, and the gap G1 includes an inlet region G1A (also referred to as “a first inlet end”) and an outlet region G1B (also referred to as “an outlet end” or “a second inlet end”). In some embodiments, the inlet region G1A and the outlet region G1B are both over theupper surface 201 of theelectronic device 20. In some embodiments, the inlet region G1A and the outlet region G1B are at the same side (i.e., the side proximal to the upper surface 201) of theelectronic device 20. In some embodiments, as shown in FIG. 4B1, the gap G1 surrounds theelectronic device 20. In some embodiments, the gap G1 has a substantially consistent width D2. In some embodiments, the width D2 of the gape G1 is substantially constant surrounding theelectronic device 20. - Still referring to
FIG. 4B and FIG. 4B1, afixture 80 may be disposed over thesubstrate 10, and thefixture 80 may define the inlet region G1A and the outlet region G1B. In some embodiments, the inlet region G1A and the outlet region G1B include openings having different sizes. In some embodiments, the size of the opening of the inlet region G1A is greater than the size of the opening of the outlet region G1B. In some embodiments, the inlet region G1A includes one opening, and the outlet region G1B includes one or more openings (e.g., openings G1B1, G1B2, and G1B3) each having a size less than that of the opening of the inlet region G1A. In some embodiments, thefixture 80 may be a metal plate, for example, a stainless plate. - Still referring to FIG. 4B1, in some embodiments, the inlet region G1A exposes an edge portion (i.e.,
portion 10 a 1) of theupper surface 10 a of thesubstrate 10 and an edge portion (e.g., a portion proximal to theedge 20E) of theupper surface 201 of theelectronic device 20. In some embodiments, the outlet region G1B exposes another edge portion(s) of theupper surface 10 a of thesubstrate 10 and another edge portion(s) of theupper surface 201 of theelectronic device 20. In some embodiments, the opening G1B1 of the outlet region G1B exposes theportion 10 a 2 of theupper surface 10 a of thesubstrate 10 and the edge portion proximal to theedge 20E′ of theupper surface 201 of theelectronic device 20. In some embodiments, the opening G1B2 of the outlet region G1B exposes theportion 10 a 3 of theupper surface 10 a of thesubstrate 10 and the edge portion proximal to theedge 20E″ of theupper surface 201 of theelectronic device 20. In some embodiments, the opening G1B3 of the outlet region G1B exposes theportion 10 a 4 of theupper surface 10 a of thesubstrate 10 and the edge portion proximal to theedge 20E′″ of theupper surface 201 of theelectronic device 20. - Still referring to FIG. 4B1, the
fixture 80 includes a blocking portion covering a portion (i.e., theregion 201C) of theupper surface 201 of theelectronic device 20. In some embodiments, the blocking portion of thefixture 80 covers theconductive pads 210 on theupper surface 201 of theelectronic device 20. In some embodiments, a ratio of an area of the blocking portion of thefixture 80 to an area of the upper surface 201 (e.g., including theregions electronic device 20 is from about 0.7 to less than about 1. In some embodiments, thefixture 80 includes a plurality of openings exposing a plurality of portions (e.g., theregions upper surface 201 of theelectronic device 20. In some embodiments, the openings of thefixture 80 correspond to the inlet region G1A and the outlet region G1B. In some embodiments, the positions of the openings of thefixture 80 correspond to that of the inlet region G1A and the outlet region G1B. In some embodiments, the shapes and the sizes of the openings of thefixture 80 correspond to that of the inlet region G1A and the outlet region G1B. - Referring to
FIG. 4C , a fillingmaterial 30 is applied in the gap G1 from the inlet region G1A. As the fillingmaterial 30 is filled into the gap G1, the fillingmaterial 30 flows along the flowing direction S1 to fill the gap G1. In some embodiments, a portion of the fillingmaterial 30 flows out of the gap G1 from the outlet region G1B. In some embodiments, a flow rate of the fillingmaterial 30 at the inlet region G1A is greater than a flow rate of the fillingmaterial 30 at the outlet region G1B during the operation of applying the fillingmaterial 30. In some embodiments, the fillingmaterial 30 includes fillers, and the fillers also flow along the flowing direction S1 in the gap G1. In some embodiments, the relatively high flow rate proximal to the inlet region G1A may render the fillers spreading more diversely at the inlet region G1A, and the relatively low flow rate proximal to the outlet region G1B may render the fillers spreading more densely at the outlet region G1B. Accordingly, the density of the fillers in the fillingmaterial 30 may increase with the decrease of the flow rate as the fillingmaterial 30 flows along the flowing direction S1 from the inlet region G1A toward the outlet region G1B. In some embodiments, a density of the fillers proximal to the inlet region G1A is less than a density of the fillers proximal to the outlet region G1B. In some embodiments, a density of the fillers proximal to the inlet region G1A is less than a density of the fillers proximal to thebottom surface 202 of theelectronic device 20. In some embodiments, voids 90 may be present between theupper surface 201 of theelectronic device 20 and thefixture 80. In some embodiments, theconductive pads 210 are spaced apart from the fillingmaterial 30 by thevoids 90. - In some embodiments, the inlet region G1A and the outlet region G1B may serve as a first inlet end and a second inlet end, respectively, and the filling
material 30 may be applied in the gap G1 via the first inlet end (i.e., the inlet region G1A) and the second inlet end (i.e., the outlet region G1B). In some embodiments, a flow rate of the fillingmaterial 30 at the first inlet end (i.e., the inlet region G1A) is greater than a flow rate of the fillingmaterial 30 at the second inlet end (i.e., the outlet region G1B) during the operation of applying the fillingmaterial 30. - In some embodiments, the
fixture 80 is disposed over thesubstrate 10 prior to applying the fillingmaterial 30. In some embodiments, the distance between thefixture 80 and theelectronic device 20 is defined by the thickness T2 of theconductive pad 210. In some embodiments, a portion of the fillingmaterial 30 flowing in-between thefixture 80 and theelectronic device 20 may form aprotrusion 31 having a thickness T1 that is substantially the same as the thickness T2 of the conductive pad 210 (i.e., the distance between thefixture 80 and the electronic device 20). In some embodiments, portions of the fillingmaterial 30 protruded out of the openings of thefixture 80 may be removed, for example, by scraping off the excessed portions of the fillingmaterial 30 along the upper surface of thefixture 80. In some embodiments, the as-formedfilling material 30 has a substantially planar upper surface after the scraping operation. - In some other embodiments, the
fixture 80 may be omitted, and the size of the opening of the inlet region G1A may be equal to or less than the size of the openings of the outlet region G1B. In some embodiments, a relatively great force may be applied on the fillingmaterial 30 at the inlet region G1A when directing the fillingmaterial 30 into the gap G1. In some embodiments, the fillingmaterial 30 may be applied into the gap G1 by injection. By applying a relatively great force on the fillingmaterial 30 at the inlet region G1A, a flow rate of the fillingmaterial 30 at the inlet region G1A is greater than a flow rate of the fillingmaterial 30 at the outlet region G1B during the operation of applying the fillingmaterial 30. In some embodiments, as mentioned above, the inlet region G1A and the outlet region G1B may serve as a first inlet end and a second inlet end while thefixture 80 may be omitted. In some embodiments, by applying a relatively great force on the fillingmaterial 30 at the first inlet end (i.e., the inlet region G1A) than that at the second inlet end (i.e., the outlet region G1B), a flow rate of the fillingmaterial 30 at the first inlet end (i.e., the inlet region G1A) is greater than a flow rate of the fillingmaterial 30 at the second inlet end (i.e., the outlet region G1B) during the operation of applying the fillingmaterial 30. - According to some embodiments of the present disclosure, with the design of the inlet region G1A and the outlet region G1B, bubbles originally within the filling
material 30 can be flushed away out of the gap G1 from the outlet region G1B. Therefore, bubbles within the fillingmaterial 30 at regions under thebottom surface 202 of theelectronic device 20 and adjacent to the sidewalls of theelectronic device 20 can be reduced. In addition, according to some embodiments, with the aforesaid design (e.g., the difference in flow rates) of the first inlet end (i.e., the inlet region G1A) and the second inlet end (i.e., the outlet region G1B), bubbles within the fillingmaterial 30 at regions under thebottom surface 202 of theelectronic device 20 can be pushed toward regions adjacent to the sidewalls of theelectronic device 20. Since it is more difficult to expel bubbles below theelectronic device 20 than to expel bubble at sidewalls of theelectronic device 20, the aforesaid design of the first inlet end (i.e., the inlet region G1A) and the second inlet end (i.e., the outlet region G1B) is advantageous to further flushing or expelling away the bubbles in subsequent processes. - In addition, according to some embodiments of the present disclosure, with the design of the inlet region G1A and the outlet region G1B arranged at the same side (e.g., the side proximal to the
upper surface 201 or distal from the bottom surface 202) of theelectronic device 20, the bubbles within the fillingmaterial 30 at regions under thebottom surface 202 of theelectronic device 20 and adjacent to the sidewalls of theelectronic device 20 can be flushed away along the flowing direction S1 and out of the gap G1 from the outlet region G1B effectively. - Moreover, according to some embodiments of the present disclosure, by applying the filling
material 30 with a higher flow rate at the inlet region G1A and a lower flow rate at the outlet region G1B, bubbles originally within the fillingmaterial 30 can be flushed away from the region under thebottom surface 202 of theelectronic device 20, and thus the issues of bubbles located under thebottom surface 202 of theelectronic device 20 can be effectively prevented or reduced. - Referring to
FIG. 4D , thefixture 80 may be removed. As such, thesemiconductor substrate structure 2 illustrated inFIGS. 2A-2B is formed. - Referring to
FIG. 4E , thecarrier 10A may be removed, anddielectric layers FIG. 4D , respectively. In some embodiments, thedielectric layers - Referring to
FIG. 4F , thedielectric layers vias conductive elements dielectric layers electronic device 20 through the throughvias FIG. 3B ,dielectric layers conductive elements conductive elements dielectric layers solder masks conductive elements conductive elements semiconductor substrate structure 3B illustrated inFIG. 3B is formed. - As used herein, the terms “approximately,” “substantially,” “substantial” and “about” are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. For example, when used in conjunction with a numerical value, the terms can refer to a range of variation less than or equal to ±10% of said numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two numerical values can be deemed to be “substantially” or “about” the same if a difference between the values is less than or equal to ±10% of an average of the values, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, “substantially” parallel can refer to a range of angular variation relative to 0° that is less than or equal to ±10°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, “substantially” perpendicular can refer to a range of angular variation relative to 90° that is less than or equal to ±10°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.
- Two surfaces can be deemed to be coplanar or substantially coplanar if a displacement between the two surfaces is no greater than 5 μm, no greater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm.
- As used herein, the terms “conductive,” “electrically conductive” and “electrical conductivity” refer to an ability to transport an electric current. Electrically conductive materials typically indicate those materials that exhibit little or no opposition to the flow of an electric current. One measure of electrical conductivity is Siemens per meter (S/m). Typically, an electrically conductive material is one having a conductivity greater than approximately 104 S/m, such as at least 105 S/m or at least 106 S/m. The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.
- As used herein, the singular terms “a,” “an,” and “the” may include plural referents unless the context clearly dictates otherwise. In the description of some embodiments, a component provided “on” or “over” another component can encompass cases where the former component is directly on (e.g., in physical contact with) the latter component, as well as cases where one or more intervening components are located between the former component and the latter component.
- While the present disclosure has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations do not limit the present disclosure. It can be clearly understood by those skilled in the art that various changes may be made, and equivalent components may be substituted within the embodiments without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. There may be distinctions between the artistic renditions in the present disclosure and the actual apparatus, due to variables in manufacturing processes and the like. There may be other embodiments of the present disclosure which are not specifically illustrated. The specification and drawings are to be regarded as illustrative rather than restrictive. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. While the methods disclosed herein have been described with reference to particular operations performed in a particular order, it can be understood that these operations may be combined, sub-divided, or re-ordered to form an equivalent method without departing from the teachings of the present disclosure. Therefore, unless specifically indicated herein, the order and grouping of the operations are not limitations of the present disclosure.
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US20190131224A1 (en) * | 2017-10-26 | 2019-05-02 | Samsung Electro-Mechanics Co., Ltd. | Fan-out semiconductor package |
US20210265274A1 (en) * | 2020-02-25 | 2021-08-26 | Samsung Electronics Co., Ltd. | Semiconductor package and method of manufacturing the semiconductor package |
US20210384095A1 (en) * | 2018-11-16 | 2021-12-09 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package |
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US20180061776A1 (en) * | 2016-08-24 | 2018-03-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
US20190131224A1 (en) * | 2017-10-26 | 2019-05-02 | Samsung Electro-Mechanics Co., Ltd. | Fan-out semiconductor package |
US20210384095A1 (en) * | 2018-11-16 | 2021-12-09 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package |
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