US20220142292A1

US20220142292A1 - Insole-type electronic device and method for manufacturing insole-type electronic device

Info

Publication number: US20220142292A1
Application number: US17/439,078
Authority: US
Inventors: Futa NOMURA
Original assignee: NEC Corp
Current assignee: NEC Corp
Priority date: 2019-03-27
Filing date: 2020-02-19
Publication date: 2022-05-12
Also published as: WO2020195373A1; JPWO2020195373A1; JP7156504B2

Abstract

Provided is an insole-type electronic device that has high communication performance and high reliability. This insole-type electronic device comprises an insole body, an extension part, a first electronic module, a second electronic module, and a wire. The insole body is a sheet-like member placed on the sole of a shoe. The extension part is a sheet-like member which is connected to the insole body and with which the instep of a foot is wrapped from above when the electronic device is worn on the foot. The first electronic module is an electronic circuit embedded in the insole body. The second electronic module is an electronic circuit that is embedded in the extension part and enables at least some of the communication functions. The wire electrically connects the first electronic module and the second electronic module.

Description

TECHNICAL FIELD

The present invention relates to an insole-type electronic device and a method for manufacturing the insole-type electronic device.

BACKGROUND ART

A watching means for preventing an accident by wandering of an elderly person and a lost child includes a method of causing a device that transmits location information wirelessly to be carried. In the method, it is necessary for a person to be watched to surely wear a watching device. However, in a case of a portable device such as a smartphone, there is a risk that the device may be forgotten to be carried or the device may be dropped. Meanwhile, a method of wrapping a device around a body with a band or the like on account of focusing on surely wearing the device may cause discomfort to a person to be watched. Thus, it is an issue to achieve both conditions where a person to be watched surely wear a device and the person to be watched does not need to be aware of wearing the device.
In order to tackle such an issue, a method of mounting a device in an insole placed inside a shoe and allowing the device to be worn simply by putting on the shoe, and a method of attaching a device to an outer upper part of the shoe are devised. For example, PTL 1 discloses a method of incorporating a location information acquisition unit, a storage unit, a transmission unit, a power generation unit, a power storage unit, and a control unit in an insole. Further, PTL 2 discloses a method of incorporating a global positioning system (GPS) receiver, a communication unit, a control unit, and a mobile phone in a heel of a shoe. Furthermore, PTL 3 discloses a method of attaching a decorative member capable of storing a GPS positioning device on an outer side of a shoe.

CITATION LIST

Patent Literature

[PTL 1] Japanese Patent No. 5978477
[PTL 2] Japanese Unexamined Patent Application Publication No. 2000-028698
[PTL 3] Japanese Registered Utility Model Publication No. 3161137

SUMMARY OF INVENTION

Technical Problem

However, the technique in PTL 1 has a problem that a load is applied to a device due to a weight of a wearer and a load during walking. In addition, when various communication modules are incorporated, there is a problem that an antenna is blocked by a human body (foot) and communication performance deteriorates. Further, the technique in PTL 2 has a problem that a special shoe with a processed heel portion is required. Furthermore, the technique in PTL 3 has a problem that the decorative member may be damaged or fall off due to an external factor.
The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an insole-type electronic device having high communication performance and high reliability.

Solution to Problem

In order to solve the above-described problems, an insole-type electronic device according to the present invention includes an insole body, an extension portion, a first electronic module, a second electronic module, and a wiring. The insole body is a sheet-shaped member to be placed on a midsole in a shoe. The extension portion is a sheet-shaped member being connected to the insole body and being wound around an upper side of an instep during wearing the insole-type electronic device. The first electronic module is an electronic circuit being incorporated in the insole body. The second electronic module is an electronic circuit that is incorporated in the extension portion and performs at least a part of a communication function. The wiring electrically connects the first electronic module and the second electronic module to each other.

Advantageous Effects of Invention

An advantageous effect of the present invention is to be able to provide an insole-type electronic device having high communication performance and high reliability.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view illustrating an insole-type electronic device according to a first example embodiment.

FIG. 2 is a plan view illustrating an insole-type electronic device according to a second example embodiment.

FIG. 3 is a cross-sectional view illustrating one example of a connection portion of an insole-type electronic device according to a third example embodiment.

FIG. 4 is a cross-sectional view illustrating one example of a connection portion of an insole-type electronic device according to a fourth example embodiment.

FIG. 5 is a cross-sectional view illustrating a specific example of the connection portion of the insole-type electronic device according to the fourth example embodiment.

FIG. 6 is a cross-sectional view illustrating one example of a connection portion of an insole-type electronic device according to a fifth example embodiment.

FIG. 7 is a cross-sectional view illustrating one example of a connection portion of an insole-type electronic device according to a sixth example embodiment.

FIG. 8 is a cross-sectional view illustrating another example of the connection portion of the insole-type electronic device according to the sixth example embodiment.

FIG. 9 is a perspective view illustrating a first example of an insole body and an extension portion of an insole-type electronic device according to a seventh example embodiment.

FIG. 10 is a perspective view illustrating a second example of the insole body and the extension portion of the insole-type electronic device according to the seventh example embodiment.

FIG. 11 is a perspective view illustrating a third example of the insole body and the extension portion of the insole-type electronic device according to the seventh example embodiment.

FIG. 12 is a perspective view illustrating a fourth example of the insole body and the extension portion of the insole-type electronic device according to the seventh example embodiment.

FIG. 13 is a perspective view illustrating a fifth example of the insole body and the extension portion of the insole-type electronic device according to the seventh example embodiment.

FIG. 14 is a plan view illustrating a mounting form of a main module of an insole-type electronic device according to an eighth example embodiment.

FIG. 15 is a cross-sectional view illustrating a specific example of the mounting form of the main module of the insole-type electronic device according to the eighth example embodiment.

FIG. 16 is a plan view illustrating one example of the mounting form of the main module of the insole-type electronic device according to the eighth example embodiment.

FIG. 17 is a plan view illustrating another example of the mounting form of the main module of the insole-type electronic device according to the eighth example embodiment.

FIG. 18 is a perspective view illustrating still another example of the mounting form of the main module of the insole-type electronic device according to the eighth example embodiment.

FIG. 19 is an assembly diagram illustrating a method for manufacturing an insole-type electronic device according to a ninth example embodiment.

EXAMPLE EMBODIMENT

In the following, example embodiments of the present invention are described in detail with reference to the drawings. The below-described example embodiments include a technically preferred limitation in order to implement the present invention, however, the scope of the invention is not limited to the following. A similar component in each drawing is assigned with a same number, and thereby the description thereof may be omitted.

First Example Embodiment

FIG. 1 is a schematic perspective view illustrating an insole-type electronic device according to a first example embodiment. The insole-type electronic device includes an insole body 1, an extension portion 2, a first electronic module 3, a second electronic module 4, and a wiring 5.
The insole body 1 is a sheet-shaped member to be placed on a midsole in a shoe. The extension portion 2 is a sheet-shaped member being connected to the insole body 1 and being wound around an upper side of an instep during wearing the insole-type electronic device. The first electronic module 3 is an electronic circuit being incorporated in the insole body 1. The second electronic module 4 is an electronic circuit that is incorporated in the extension portion 2 and performs at least a part of a communication function. The wiring 5 is a conductor that electrically connects the first electronic module 3 and the second electronic module 4 each other.
With the above configuration, the second electronic module 4 can be placed on an instep during wearing the insole-type electronic device. This configuration can, for example, prevent a communication function of the second electronic module 4 that performs at least a part of the communication function from being disturbed by presence of a foot. Further, the second electronic module can be prevented from being loaded by a foot. As a result, the insole-type electronic device with high communication performance and high reliability can be provided.

Second Example Embodiment

FIG. 2 is a top view illustrating an insole-type electronic device 100 according to the present example embodiment. As illustrated in the figure, the insole-type electronic device 100 includes a sheet-shaped insole body 10 to be placed on a midsole in a shoe and an extension portion 20 being connected to the insole body 10 and being wound on an instep during wearing the insole-type electronic device 100. The insole-type electronic device 100 also includes a main module 30 being incorporated in the insole body 10, an extension module 40 being incorporated in the extension portion 20, and a wiring 50 that electrically connects the main module 30 and the extension module 40 to each other.
For the insole body 10, a material having elasticity and flexibility such as rubber, polyurethane, polyester, leather, and wool can be used, for example. The extension portion 20 can also be configured using a similar material.
FIG. 2 illustrates an example in which the main module 30 includes a control unit 31, a battery 32, and a sensor 33, and the extension module 40 includes a location detection unit 41, a communication unit 42, and a power generation element 43. However, the present example embodiment is not limited to this example, and each module does not necessarily need to include the above components and may include another electronic circuit. The extension module may include, for example, an antenna of which communication performance deteriorates due to shielding by a human body (foot), an electronic component being vulnerable to a load, and the like.
The location detection unit 41 is a circuit that detects a location by a method such as a GPS, three-point positioning by wireless communication, or pedestrian dead reckoning (PDR).
The communication unit 42 is an electronic circuit that includes an antenna and transmits and receives wireless communication, for example.
The power generation element 43 is an element that generates power from heat, light, a radio wave, pressure, vibration, friction, and the like.
The control unit 31 controls the location detection unit 41, the communication unit 42, and the sensor 33 and performs location detection processing, processing based on data acquired by the sensor 33, control of communication, and the like.
For example, when the insole-type electronic device 100 is used as a watching device, the location detection unit 41 receives a location detection signal, the control unit 31 calculates a current location, and the calculated current location is wirelessly transmitted to an externally provided watching server.
The wiring 50 is a conductor that electrically connects the insole body 10 and the extension portion 20 across a connection portion. A type of the wiring 50 is not particularly limited as long as the wiring 50 has flexibility, however it is preferable to use a flexible flat cable that is small in size and has high durability against repeated bending.
As described above, the present example embodiment is able to provide the insole-type electronic device having high communication performance and high reliability by placing, in the extension portion, a communication module of which communication performance deteriorates due to shielding by a human body and an electronic component being vulnerable to a load.

Third Example Embodiment

As described according to the second example embodiment, a wiring 50 passes through a connection portion between an insole body 10 and an extension portion 20, however stress is generated at the connection portion between the insole body 10 and the extension portion 20 when a user wears a device and the like. The present example embodiment describes a configuration in which the wiring 50 is less likely to be damaged by the stress.
FIG. 3 is a cross-sectional view illustrating one example of a section at an A-A′ cutting plane in FIG. 2. In the example of FIG. 3, a cavity 21 is provided in a connection portion 11, and the wiring 50 is passed through the cavity 21. In a case where the wiring 50 is placed through the cavity 21, the wiring 50 can be bent independently of the connection portion when the connection portion 11 is deformed, and thus stress can be prevented from being concentrated on the wiring 50. Note that, a structure of the cavity 21 can be, for example, a slit shape in such a way as not to affect a size of the device. Further, both ends of the slit may be rounded in order to prevent the slit from tearing.

Fourth Example Embodiment

FIG. 4 is a cross-sectional view illustrating another method for preventing stress from concentrating on a wiring 50 in a connection portion 11 between an insole body 10 and an extension portion 20. The connection portion 11 according to the present example embodiment has a cavity 21 similarly to the second example embodiment. The wiring 50 in the cavity 21 has a redundant portion 51. Herein, redundancy of the redundant portion 51 means that, when a force is applied to the wiring 50, the redundant portion 51 has an extra length to turn aside the force.
FIG. 5 is a schematic diagram illustrating a specific example of the redundant portion 51. Each redundant portion is provided in the cavity 21. The redundant portion 51 a in FIG. 5(a) has a structure in which the wiring repeatedly bends in a bellows shape. With this structure, even though the wiring 50 receives expansion/contraction force, the force can be turned aside without tension being applied to the wiring 50. In the redundant portion 51 b in FIG. 5(b), the wiring 50 has a spiral shape. With this structure, it is possible to prevent tension from being applied to the wiring 50 similarly to FIG. 5(a). Further, in the redundant portion 51 c in FIG. 5(c), the wiring 50 has a loose shape. With this structure, it is possible to prevent tension from being applied to the wiring 50 similarly to FIGS. 5(a) and (b).

Fifth Example Embodiment

A purpose of the present example embodiment is to protect a wiring 50 in a connection portion 11 similarly to the fourth example embodiment. FIG. 6 is a cross-sectional view of the connection portion 11 illustrating a configuration of the present example embodiment. The connection portion 11 has a cavity 21. A splint-like reinforcing member 52 is joined to the wiring 50 in the connection portion 11. Even though tension is applied to the wiring 50, the wiring 50 itself is not damaged by an action of the reinforcing member 52. The redundant portion 51 according to the fourth example embodiment may be provided on an outside of the reinforcing member 52.

Sixth Example Embodiment

A purpose of the present example embodiment is to protect a wiring 50 in a connection portion 11 similarly to the fourth and fifth example embodiments. FIG. 7 is a cross-sectional view of the connection portion 11 illustrating a configuration of the present example embodiment. The wiring 50 has a rigid substrate 60 with wiring in the connection portion 11. Then, the wiring 50 on a side of an insole body 10 and the wiring 50 on a side of an extension portion 20 are each connected to the rigid substrate 60 and are electrically connected to one another. The rigid substrate 60 enhances strength of a place where deformation occurs, and thus the wiring 50 in the connection portion 11 is hardly disconnected. In the example in FIG. 7, cavities 21 a and 21 b are each provided at positions away from connection portions 61 and 62 that connect the rigid substrate 60 and the wiring 50. The wiring 50 can be bent independently in the cavities 21 a and 21 b. With this configuration, the connection portions 61 and 62 are covered with a flexible material configuring an insole body 10 and an extension portion 20. As a result, when a housing is bent, bending stress can be received while being distributed to the material of the insole body 10 and the extension portion 20, and thus the stress concentration on the connection portions between an electric wire and the substrate can be reduced.
FIG. 8 is a cross-sectional view illustrating another specific example using the rigid substrate 60. In the connection portion 11 in FIG. 8, the wiring 50 is connected to the rigid substrate 60, and the wiring 50 outside the connection portions 61 and 62 has redundant portions 51 d and 51 e. The redundant portions 51 d and 51 e move in the cavity 21 and tension is turned aside, thereby disconnection of the wiring 50 and the connection portions 61 and 62 can be prevented.

Seventh Example Embodiment

The present example embodiment describes a specific example of an extension portion. FIG. 9 is a perspective view illustrating an insole body 10 and an extension portion 20 a. The description of a module and a wiring is omitted. As illustrated in FIG. 9, the extension portion 20 a has an arched structure covering an instep. In this structure, the extension portion 20 a is supported from both side surfaces of the insole body 10. Thereby, when an elastic material is used as a material of the extension portion 20 a, a weight of the extension portion 20 a can be supported by itself. Thus, it is possible to prevent the extension portion 20 a from hanging down on the instep portion and reduce displacement of the extension portion 20 a during wearing an insole-type electronic device. In addition, a circuit between the insole body 10 and the extension portion 20 a can be formed from both side surfaces, and thus a degree of freedom in wiring is increased.
FIG. 10 is a perspective view illustrating another example of an extension portion. The description of a module and a wiring is omitted. As illustrated in FIG. 10, an extension portions 20 b and 20 c are formed from both sides of the insole body 10 in this example. It is desirable that the two extension portions 20 b and 20 c maintain a positional relationship without displacement from each other. FIG. 11 illustrates a specific example of a structure that prevents displacement. In FIG. 11(a), the extension portion 20 b on one side has a plurality of holes 22 and the extension portion 20 c on another side has a plurality of protrusions 23. By fitting each of the protrusions 23 into each of the holes 22, the two extension portions 20 b and 20 c can be joined at any position. Further, in FIG. 11(b), the extension portion 20 b on one side has a plurality of grooves 24, and the extension portion 20 c on another side has a plurality of ridges 25 that fit into the grooves 24. By fitting each of the ridges 25 into each of the grooves 14 at any position, the two extension portions 20 b and 20 c can be joined at any position. The above fitting shape is just an example, and other shapes can be adopted as long as a configuration is provided in such a way that the two extension portions can be combined and fastened.
Further, another example of the configuration that prevents an extension portion from hanging down due to the own weight is illustrated in a perspective view of FIG. 12. In this example, in addition to the same insole body 10 and the extension portion 20 as in FIG. 2, a core material 26 is embedded across a joint portion between the insole body 10 and an extension portion 20 d. A material of the core material 26 is not particularly limited, however highly rigid resin, metal, a shape memory material, or the like can be used. As a characteristic of the shape memory material, a material that becomes a memorized shape at a temperature of around a human body temperature is suitable.
Further, another example of the configuration that prevents an extension portion from hanging down due to the own weight is illustrated in a perspective view of FIG. 13. In this example, in addition to the same insole body 10 and the extension portion 20 as in FIG. 2, an extension portion 20 e has a shoelace hole 27. The extension portion 20 e can be fastened to an upper part of a shoe by passing a shoelace 200 through the shoelace hole 27 of the extension portion 20 e. A structure of the shoelace hole 27 is not particularly limited, however a round hole, a square hole, a slit, or the like can be used. An edge portion of the shoelace hole 27 can be made hard to tear by thickening a base material of the extension portion 20 e. Further, a structure of the extension portion 20 e can be used for both cases in which an extension portion is formed from one side and in which the extension portion is formed from both sides.
As described above, according to the present example embodiment, it is possible to prevent the extension portion from hanging down on the instep portion and reduce displacement of the extension portion during wearing the insole-type electronic device.

Eighth Example Embodiment

The present example embodiment describes a method for mounting a main module 30 in an insole body 10. FIG. 14 is a plan view illustrating a state in which the main module 30 including a circuit substrate 31 is mounted in a plantar arch portion of the insole body 10. In this structure, it is preferable that the circuit substrate 31 has flexibility in order to cope with bending of the insole body 10, and, for example, a flexible substrate, a rigid flexible substrate, or a structure in which the flexible substrate is connected by a small connector can be used.
FIG. 15 is a cross-sectional view at a B-B′ in FIG. 14. Various configurations can be used for mounting the main module 30. FIGS. 15(a) to (d) illustrates a specific example of the mounting method. FIG. 15(a) is a cross-sectional view illustrating a structure in which the circuit substrate 31 and a battery 32 are attached to a surface of the insole body 10. The circuit substrate 31 may be attached to the surface of the insole body 10 and then covered with a sheet material having flexibility in order to protect the circuit substrate 31, although not illustrated in the figure. A direction in which a substrate is attached is not limited to either a ground side or a foot side.
In FIG. 15(b), a recess 12 is provided at a place of an insole base material where a substrate is attached, and the circuit substrate 31 and the battery 32 are placed in the recess 12. In this way, it is possible to prevent the substrate from protruding from the insole base material.
FIG. 15(c) is a cross-sectional view illustrating an example in which a lid 13 is provided on an upper portion of the recess 12 in addition to the configuration in FIG. 15(b). With this configuration, the circuit substrate 31 can be protected by the lid 13. Further, when the lid 13 is removed, the circuit substrate 31 can be easily taken out, and thus battery replacement and an inspection of a device are facilitated.
FIG. 15(d) is a cross-sectional view illustrating a structure in which the circuit substrate 31 and the battery 32 are covered with a protective material 34 and then mounted in the insole body 10. By using this structure, it is possible to protect a component that requires strength and waterproofness. A material of the protective material 34 is not particularly limited, however, resin, metal, or the like can be used in consideration of strength and waterproofness.
FIG. 16 is a plan view illustrating a configuration in which components of the main module 30 are directly embedded in the insole body 10 without being mounted on the circuit substrate 31. When the components are mounted directly in the insole body 10, a wiring 50 is formed at least on a surface of the insole body 10. However, in FIG. 16, the description of the wiring 50 is omitted. When the components are mounted here, the components are exposed, and thus it is desirable to cover the surface. As a structure for covering the surface, a structure in which the same material as the insole body 10 is covered over the mounted components can be used.
Further, when bending force is applied to the insole body 10, stress is applied to a component mounting portion. Thus, the mounting direction of the component is preferably set in such a way that a longitudinal direction of the insole body 10 and a longitudinal direction of the component are perpendicular to each other, and thereby the bending stress in the longitudinal direction of the component mounting portion is reduced when the insole body 10 is bent.
FIG. 17 is a plan view illustrating a configuration in which the main module 30 is divided into three units 31 a, 31 b, and 31 c, connected to each other by a wiring 52, and covered with a protective material 14. When the main module 30 becomes large in the longitudinal direction of the insole body 10, the main module 30 receives large bending stress due to the bending of a shoe during walking. The main module 30 is divided in order to reduce the stress caused by bending. In this case, the number of divisions, size, distribution of the components, and the like are not particularly limited.
FIG. 18 is a perspective view illustrating an example in which the main module 30 is placed in a heel cup 10 a when the insole body 10 has the heel cup 10 a extending upward from a rear end portion of a heel. By using this structure, a thickness of the insole body 10 can be reduced compared with the case where the main module 30 is mounted in a foot sole portion of the insole body 10. This configuration enhances wearability. Further, the heel cup 10 a is less likely to be loaded by weight than the foot sole portion, and thus the component can be protected.

Ninth Example Embodiment

The present example embodiment describes a method for manufacturing an insole-type electronic device. First, from a sheet-shaped material, an insole body is molded according to a shape of a foot. Next, an extension portion is molded in an arch shape covering an instep from one side or both sides of the insole body.
When a cavity is provided as described according to the third example embodiment, it is easy to manufacture the cavity by sticking two pre-molded members together. One example is illustrated in FIG. 19. In FIG. 19, a lower portion 10 b of the insole body and an upper portion 10 c of the insole body are stuck together. At this time, a cavity 21 is formed in the lower portion 10 b of the insole body. In the example in FIG. 19, a main module 30 is placed in an insole body 10, an extension module 40 is placed in an extension portion 20, and the main module 30 and the extension module 40 are connected by a wiring 50. In addition, a redundant portion 51 is provided in a portion corresponding to the portion of the cavity 21 in the wiring 50. Note that, the above configuration is one example, and other methods such as a method of directly enclosing a component and a circuit substrate at the time of molding or a method of mounting a component in a component mounting space provided in the insole body 10 can be used.
Next, the lower portion 10 b of the insole body and the upper portion 10 c of the insole body are joined by a method such as gluing or fixing with a fastener. Then, the completed extension portion 20 is curved to the instep side.
While the invention has been particularly shown and described with reference to exemplary embodiments thereof, the invention is not limited to these embodiments. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the claims.
This application is based upon and claims the benefit of priority from Japanese patent application No. 2019-061169, filed on Mar. 27, 2019, the disclosure of which is incorporated herein in its entirety by reference.

REFERENCE SIGNS LIST

1, 10 Insole body
2, 20 Extension portion
3 First electronic module
4 Second electronic module
5, 50 Wiring
30 Main module
40 Extension module
51 Redundant portion
100 Insole-type electronic device

Claims

What is claimed is:

1. An insole-type electronic device comprising:

a sheet-shaped insole body to be placed on a midsole in a shoe;

a sheet-shaped extension portion being connected to the insole body and being wound around an upper side of an instep during wearing the insole-type electronic device;

a first electronic module mounted in the insole body;

a second electronic module incorporated in the extension portion; and

a wiring that electrically connects the first electronic module and the second electronic module to each other.

2. The insole-type electronic device according to claim 1, further comprising

a cavity in a connection portion between the insole body and the extension portion, wherein

the wiring is placed in the cavity.

3. The insole-type electronic device according to claim 2, wherein

the wiring in the connection portion has a redundant portion to which tension is not applied even when the wiring is extended.

4. The insole-type electronic device according to claim 3, wherein

the redundant portion is any one of a bellows shape, a spiral shape, or a loose shape.

5. The insole-type electronic device according to claim 2, wherein

the wiring in the connection portion has a splint like reinforcing member that reinforces the wiring.

6. The insole-type electronic device according to claim 2, wherein

the wiring in the connection portion is connected via a rigid substrate.

7. The insole-type electronic device according to claim 1, wherein

the extension portion is an arched shape being connected to both side surfaces of the insole body.

8. The insole-type electronic device according to claim 1, wherein

the extension portion have two parts which are extending upward from each of both side surfaces of the insole body wherein

the two parts have fasteners fastening the end portion of the two parts each other.

9. The insole-type electronic device according to claim 1, further comprising

a core material being incorporated across the insole body and the extension portion.

10. A method for manufacturing an insole-type electronic device, comprising:

connecting, to a sheet-shaped insole body to be placed on a midsole in a shoe, a sheet-shaped extension portion being wound on an upper side of an instep during wearing the insole body;

mounting a first electronic module in the insole body;

incorporating a second electronic module in the extension portion; and

forming a wiring that electrically connects the first electronic module and the second electronic module to each other.

11. The insole-type electronic device according to claim 3, wherein

12. The insole-type electronic device according to claim 3, wherein

the wiring in the connection portion is connected via a rigid substrate.

13. The insole-type electronic device according to claim 2, wherein

14. The insole-type electronic device according to claim 3, wherein

15. The insole-type electronic device according to claim 4, wherein

16. The insole-type electronic device according to claim 5, wherein

17. The insole-type electronic device according to claim 6, wherein

18. The insole-type electronic device according to claim 2, wherein

19. The insole-type electronic device according to claim 3, wherein

20. The insole-type electronic device according to claim 4, wherein