US20220128633A1 - Sensor Device - Google Patents
Sensor Device Download PDFInfo
- Publication number
- US20220128633A1 US20220128633A1 US17/573,717 US202217573717A US2022128633A1 US 20220128633 A1 US20220128633 A1 US 20220128633A1 US 202217573717 A US202217573717 A US 202217573717A US 2022128633 A1 US2022128633 A1 US 2022128633A1
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- US
- United States
- Prior art keywords
- coil
- windings
- magnetic field
- sensor
- sensor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004804 winding Methods 0.000 claims abstract description 40
- 230000004907 flux Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 6
- 230000010354 integration Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0094—Sensor arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/142—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage using Hall-effect devices
- G01D5/145—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage using Hall-effect devices influenced by the relative movement between the Hall device and magnetic fields
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0005—Geometrical arrangement of magnetic sensor elements; Apparatus combining different magnetic sensor types
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0011—Arrangements or instruments for measuring magnetic variables comprising means, e.g. flux concentrators, flux guides, for guiding or concentrating the magnetic flux, e.g. to the magnetic sensor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0017—Means for compensating offset magnetic fields or the magnetic flux to be measured; Means for generating calibration magnetic fields
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0023—Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration
- G01R33/0035—Calibration of single magnetic sensors, e.g. integrated calibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/04—Arrangements of electric connections to coils, e.g. leads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/07—Hall effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
Definitions
- the invention relates to a sensor device with a coil.
- the integration costs for the sensor devices with vertically arranged windings are increased due to the necessary several metal plies or separate coil carriers.
- the present is a sensor device comprising a laterally arranged double coil with a first coil and a second coil.
- First windings of the first coil and second windings of the second coils are arranged in a spiral shape on a substrate, and both the first windings and the second windings extend in each case from a first or second center point of the corresponding spiral to a common region.
- At least one magnetic field sensor is located in a mounted state on the laterally arranged double coil.
- the magnetic field sensor can be calibrated well also in the presence of superimposed fields.
- the arrangement permits a diagnosis in the event of a disturbance of the magnetic field sensors also in an environment with, for example, stray fields.
- the magnetic field sensor is, for example, a Hall sensor, an AMR sensor, a GMR sensor, a flux-gate sensor or a TMR sensor, with the type of magnetic field sensor not being limiting for the invention, however.
- FIG. 1 shows a double coil with a magnetic field sensor and exemplary field lines.
- FIG. 2 shows a double coil with a magnetic field sensor on a die.
- FIG. 3 shows a double coil with two magnetic field sensors and exemplary field lines.
- FIG. 4 shows a sensor arrangement in a conductor carrier (lead frame).
- FIG. 1 shows a sensor arrangement 10 with a laterally arranged double coil 20 formed of a first coil 30 a and a second coil 30 b on a substrate 15 .
- the first coil 30 a has windings 40 a formed in a spiral shape from a first center point 50 a of the first coil 30 a to a common region 60 .
- the common region 60 is located between the first coil 30 a and the second coil 30 b and is arranged at the center of the double coil 20 .
- the second coil 30 b has second windings 40 b formed in a spiral shape from a second center point 50 b of the second coil 30 b to the common region 60 .
- the first windings 40 a and the second windings 40 b are shown in FIG. 1 as a clockwise Archimedes spiral, but both could be counterclockwise as well. It is apparent that the second coil 30 b is formed from a mirror image of the first coil 30 a on the x and y axes.
- the first windings 40 a of the first coil 30 a and the second windings 40 of the second coil 30 b are electrically interconnected at the common region 60 . Due to the arrangement of the first windings 40 a and of the second windings 40 b, the current direction in the first coil 30 a and the second coil 30 b is in opposite directions.
- the winding spacings in the first coil 30 a and in the second coil 30 b are kept as small as possible in order for a current density to be attainable that is as high as possible.
- Exemplary parameters are 40 ⁇ m for the conductor path width of the coils and 2 ⁇ m for the spacing of the conductor paths. However, these parameters are not limiting for the invention. Depending on the thicknesses of the metal layer used, the spacings can also be substantially different, however.
- a magnetic field sensor 70 is located on the upper side of the double coil 20 at the common region 60 , i.e. is disposed between the first coil 30 a and the second coil 30 b.
- the magnetic field sensor 70 can also be disposed below the double coil 20 .
- the magnetic field sensor 70 is a TMR sensor or a Hall sensor, whereby the choice is not limiting of the invention.
- one of the first coil 30 or the second coil 30 b When current is applied to the double coil 20 , one of the first coil 30 or the second coil 30 b generates a magnetic field in the z-direction (i.e. perpendicularly to the x-y-plane), and the other one of the first coil 30 or the second coil 30 b generates a magnetic field opposite to the z-direction.
- the generated magnetic field is shown in FIG. 1 as field lines.
- the first center point 50 a of the first coil 30 a is electrically connected via a first bond wire 90 a to a first connector 80 a on a lead frame (connection frame/conductor carrier) of a housing 100 .
- the second center point 50 b of the second coil 30 b is electrically connected via a second bond wire 80 b to a second connector 80 b of the lead frame of the housing 100 .
- This connection can also be established via conductor paths in a further metal ply. These connections are shown in FIG. 4 .
- FIG. 2 shows a further aspect of the invention, in which the magnetic field sensor 70 is applied to a chip 75 (a so-called “die”).
- the z-direction is offset from the plane of the double coil.
- FIG. 3 shows a further aspect of the invention, in which two magnetic field sensors 72 a and 72 b are disposed in each case in the center points 50 a and 50 b of the corresponding coil 30 a and 30 b.
- the two magnetic field sensors 72 a and 72 b are either located below a bond pad or the two magnetic field sensors 72 a and 72 b are each an interconnection of several individual sensors of which the common effective point is located below the bond pad.
- 4 TMR elements in a Wheatstone bridge or 4 magnetic field sensors 72 a and 72 b connected in parallel for improving the signal-noise ratio could be used, for example.
- the first coil 30 a and the second coil 30 b can be configured such that the magnetic field sensors 72 a and 72 b measure the same field component.
- the first coil 30 a and the second coil 30 b are configured in opposite winding directions, i.e. a clockwise spiral (first windings 40 a ) and a counterclockwise spiral (second windings 40 b ).
- first windings 40 a a clockwise spiral
- second windings 40 b a counterclockwise spiral
- the windings are therefore mirrored only on the x-axis.
- the current direction is consequently in the same direction in the first coil 30 a and the second coil 30 b and is shown in FIG. 3 by the cross and point symbol.
- the magnetic-field sensors 72 a and 72 b are operated differentially and the coils 30 a and 30 b are configured with windings 40 a and 40 b with the same winding direction as in FIG. 1 , wherein the current direction in the corresponding coils 30 a and 30 b is contrary.
- FIG. 4 shows the sensor device in a lead frame (connection frame) 100 .
- the first center point 50 a and the second center point 50 b are electrically connected in each case to connectors 80 a, 80 b via bond wires 90 a, 90 b.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measuring Magnetic Variables (AREA)
Abstract
Description
- The present application is a continuation of non-provisional U.S. patent application Ser. No. 16/750,748 (Pub. No.: US 2020/0241083 A1) filed on 23 Jan. 2020, which claims the benefit of the filing date of German Patent Application No.
DE 10 2019 101 931.1 filed on Jan. 25, 2019, the contents of which are incorporated herein by reference in their entirety. - The invention relates to a sensor device with a coil.
- Sensor devices of the type mentioned above are known, for example, from the German patent no. DE 11 2010 000 848 B4 (Allegro). In this patent document, a double coil is disclosed, however which has only one winding in each case as a self-text conductor, and wherein each coil of the double coil is located above a z-axis magnetic-field sensor element.
- From the German patent no. DE 10 2011 016 159 B3 the integration of a vertical coil (i.e. repetition of the windings in the z-direction and not in the x- or y-directions) with several windings above a z-axis magnetic field sensor is known. The patent document also discloses the integration of two vertical coils with several windings above a z-axis magnetic-field sensor in each case.
- A different device is also known from the U.S. Pat. No. 7,345,470, which shows a plurality of non-integrated coils for sample testing.
- The state of the art shows solutions for sensor devices with coils with single windings, which limit the possible coil factor and thus also the obtainable magnetic field in relation to the current fed to the coils.
- Moreover, the integration costs for the sensor devices with vertically arranged windings are increased due to the necessary several metal plies or separate coil carriers.
- The present is a sensor device comprising a laterally arranged double coil with a first coil and a second coil. First windings of the first coil and second windings of the second coils are arranged in a spiral shape on a substrate, and both the first windings and the second windings extend in each case from a first or second center point of the corresponding spiral to a common region. At least one magnetic field sensor is located in a mounted state on the laterally arranged double coil.
- Using this device, the magnetic field sensor can be calibrated well also in the presence of superimposed fields. The arrangement permits a diagnosis in the event of a disturbance of the magnetic field sensors also in an environment with, for example, stray fields.
- The magnetic field sensor is, for example, a Hall sensor, an AMR sensor, a GMR sensor, a flux-gate sensor or a TMR sensor, with the type of magnetic field sensor not being limiting for the invention, however.
- For a more complete understanding of the present invention and the advantages thereof, reference is now made to the following description and the accompanying drawings, in which:
-
FIG. 1 shows a double coil with a magnetic field sensor and exemplary field lines. -
FIG. 2 shows a double coil with a magnetic field sensor on a die. -
FIG. 3 shows a double coil with two magnetic field sensors and exemplary field lines. -
FIG. 4 shows a sensor arrangement in a conductor carrier (lead frame). - The invention will now be described on the basis of the drawings. It will be understood that the embodiments and aspects of the invention described herein are only examples and do not limit the protective scope of the claims in any way. The invention is defined by the claims and their equivalents. It will be understood that features of one aspect or embodiment of the invention can be combined with a feature of a different aspect or aspects and/or embodiments of the invention.
-
FIG. 1 shows asensor arrangement 10 with a laterally arrangeddouble coil 20 formed of afirst coil 30 a and asecond coil 30 b on asubstrate 15. Thefirst coil 30 a haswindings 40 a formed in a spiral shape from afirst center point 50 a of thefirst coil 30 a to acommon region 60. Thecommon region 60 is located between thefirst coil 30 a and thesecond coil 30 b and is arranged at the center of thedouble coil 20. Thesecond coil 30 b hassecond windings 40 b formed in a spiral shape from asecond center point 50 b of thesecond coil 30 b to thecommon region 60. Thefirst windings 40 a and thesecond windings 40 b are shown inFIG. 1 as a clockwise Archimedes spiral, but both could be counterclockwise as well. It is apparent that thesecond coil 30 b is formed from a mirror image of thefirst coil 30 a on the x and y axes. - The
first windings 40 a of thefirst coil 30 a and the second windings 40 of thesecond coil 30 b are electrically interconnected at thecommon region 60. Due to the arrangement of thefirst windings 40 a and of thesecond windings 40 b, the current direction in thefirst coil 30 a and thesecond coil 30 b is in opposite directions. The winding spacings in thefirst coil 30 a and in thesecond coil 30 b are kept as small as possible in order for a current density to be attainable that is as high as possible. Exemplary parameters are 40 μm for the conductor path width of the coils and 2 μm for the spacing of the conductor paths. However, these parameters are not limiting for the invention. Depending on the thicknesses of the metal layer used, the spacings can also be substantially different, however. - In one aspect of the invention, a
magnetic field sensor 70 is located on the upper side of thedouble coil 20 at thecommon region 60, i.e. is disposed between thefirst coil 30 a and thesecond coil 30 b. Themagnetic field sensor 70 can also be disposed below thedouble coil 20. Themagnetic field sensor 70 is a TMR sensor or a Hall sensor, whereby the choice is not limiting of the invention. - When current is applied to the
double coil 20, one of the first coil 30 or thesecond coil 30 b generates a magnetic field in the z-direction (i.e. perpendicularly to the x-y-plane), and the other one of the first coil 30 or thesecond coil 30 b generates a magnetic field opposite to the z-direction. This results in the current density through the twocoils magnetic field sensor 70. The generated magnetic field is shown inFIG. 1 as field lines. - The
first center point 50 a of thefirst coil 30 a is electrically connected via afirst bond wire 90 a to afirst connector 80 a on a lead frame (connection frame/conductor carrier) of ahousing 100. Thesecond center point 50 b of thesecond coil 30 b is electrically connected via asecond bond wire 80 b to asecond connector 80 b of the lead frame of thehousing 100. This connection can also be established via conductor paths in a further metal ply. These connections are shown inFIG. 4 . -
FIG. 2 shows a further aspect of the invention, in which themagnetic field sensor 70 is applied to a chip 75 (a so-called “die”). In other words, the z-direction is offset from the plane of the double coil. -
FIG. 3 shows a further aspect of the invention, in which twomagnetic field sensors center points corresponding coil magnetic field sensors magnetic field sensors magnetic field sensors - In this aspect of the invention, the
first coil 30 a and thesecond coil 30 b can be configured such that themagnetic field sensors first coil 30 a and thesecond coil 30 b are configured in opposite winding directions, i.e. a clockwise spiral (first windings 40 a) and a counterclockwise spiral (second windings 40 b). Differently toFIG. 1 , the windings are therefore mirrored only on the x-axis. The current direction is consequently in the same direction in thefirst coil 30 a and thesecond coil 30 b and is shown inFIG. 3 by the cross and point symbol. - In a different aspect of the sensor arrangement shown in
FIG. 3 , the magnetic-field sensors coils windings FIG. 1 , wherein the current direction in the corresponding coils 30 a and 30 b is contrary. -
FIG. 4 shows the sensor device in a lead frame (connection frame) 100. Thefirst center point 50 a and thesecond center point 50 b are electrically connected in each case toconnectors bond wires - The foregoing description of the preferred embodiment of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed, and modifications and variations are possible in light of the above teachings or may be acquired from practice of the invention. The embodiment was chosen and described in order to explain the principles of the invention and its practical application to enable one skilled in the art to utilize the invention in various embodiments as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims appended hereto, and their equivalents. The entirety of each of the aforementioned documents is incorporated by reference herein.
- 10 sensor device
- 15 substrate
- 20 double coil
- 30 a first coil
- 30 b second coil
- 40 a first windings
- 40 b second windings
- 50 a first center point
- 50 b second center point
- 60 common region
- 70 magnetic field sensor
- 72 a magnetic field sensor
- 72 b magnetic field sensor
- 75 chip
- 80 a first connector
- 80 b second connector
- 90 a first bond wire
- 90 b second bond wire
- 100 housing
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/573,717 US20220128633A1 (en) | 2019-01-25 | 2022-01-12 | Sensor Device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019101931.1 | 2019-01-25 | ||
DE102019101931.1A DE102019101931A1 (en) | 2019-01-25 | 2019-01-25 | Sensor device |
US16/750,748 US20200241083A1 (en) | 2019-01-25 | 2020-01-23 | Sensor Device |
US17/573,717 US20220128633A1 (en) | 2019-01-25 | 2022-01-12 | Sensor Device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/750,748 Continuation US20200241083A1 (en) | 2019-01-25 | 2020-01-23 | Sensor Device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20220128633A1 true US20220128633A1 (en) | 2022-04-28 |
Family
ID=71524078
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/750,748 Abandoned US20200241083A1 (en) | 2019-01-25 | 2020-01-23 | Sensor Device |
US17/573,717 Abandoned US20220128633A1 (en) | 2019-01-25 | 2022-01-12 | Sensor Device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/750,748 Abandoned US20200241083A1 (en) | 2019-01-25 | 2020-01-23 | Sensor Device |
Country Status (3)
Country | Link |
---|---|
US (2) | US20200241083A1 (en) |
CN (2) | CN117075017A (en) |
DE (1) | DE102019101931A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3341069B1 (en) | 2015-08-24 | 2020-10-21 | Abiomed, Inc. | Hemostatic valve for medical device introducer |
CN111566495B (en) * | 2017-12-27 | 2022-06-24 | 旭化成微电子株式会社 | Magnetic sensor module and IC chip for the same |
JP7204453B2 (en) * | 2018-11-30 | 2023-01-16 | 株式会社東芝 | current detector |
CN112968261B (en) * | 2021-02-03 | 2022-08-26 | 中国电子科技集团公司第四十三研究所 | Miniaturized high-performance patch bridge |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US6707298B2 (en) * | 2001-10-29 | 2004-03-16 | Yamaha Corporation | Magnetic sensor |
US7573262B2 (en) * | 2002-11-29 | 2009-08-11 | Yamaha Corporation | Magnetic sensor, and method of compensating temperature-dependent characteristic of magnetic sensor |
US8836062B2 (en) * | 2011-04-05 | 2014-09-16 | Micronas Gmbh | Integrated passive component |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4404069B2 (en) * | 2001-10-29 | 2010-01-27 | ヤマハ株式会社 | Magnetic sensor |
JP2006024845A (en) | 2004-07-09 | 2006-01-26 | Yamaha Corp | Probe card and inspecting method for magnetic sensor |
JP4625743B2 (en) * | 2005-09-28 | 2011-02-02 | キヤノン電子株式会社 | Magnetic detection element |
JP2009036717A (en) * | 2007-08-03 | 2009-02-19 | Fujikura Ltd | Magnetic sensor |
JP2010008357A (en) * | 2008-06-30 | 2010-01-14 | Fujikura Ltd | Magnetic sensor |
CN201369237Y (en) * | 2008-09-19 | 2009-12-23 | 周有庆 | Primary current sensor for PCB flat spiral coils of straight leads |
DE112010000848B4 (en) | 2009-02-17 | 2018-04-05 | Allegro Microsystems, Llc | Circuits and methods for generating a self-test of a magnetic field sensor |
CN103091647A (en) * | 2011-10-28 | 2013-05-08 | 爱盛科技股份有限公司 | Magnetic sensing device |
CN102914750B (en) * | 2012-11-19 | 2015-05-06 | 中国科学院上海微系统与信息技术研究所 | Micromechanical magnetic field sensor and application thereof |
EP2778704B1 (en) * | 2013-03-11 | 2015-09-16 | Ams Ag | Magnetic field sensor system |
TWI614778B (en) * | 2016-12-19 | 2018-02-11 | Coil structure and coil device capable of generating a uniform magnetic field | |
US10996289B2 (en) * | 2017-05-26 | 2021-05-04 | Allegro Microsystems, Llc | Coil actuated position sensor with reflected magnetic field |
-
2019
- 2019-01-25 DE DE102019101931.1A patent/DE102019101931A1/en active Granted
-
2020
- 2020-01-23 US US16/750,748 patent/US20200241083A1/en not_active Abandoned
- 2020-02-03 CN CN202310812822.9A patent/CN117075017A/en active Pending
- 2020-02-03 CN CN202010079155.4A patent/CN111487575A/en active Pending
-
2022
- 2022-01-12 US US17/573,717 patent/US20220128633A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6707298B2 (en) * | 2001-10-29 | 2004-03-16 | Yamaha Corporation | Magnetic sensor |
US7573262B2 (en) * | 2002-11-29 | 2009-08-11 | Yamaha Corporation | Magnetic sensor, and method of compensating temperature-dependent characteristic of magnetic sensor |
US8836062B2 (en) * | 2011-04-05 | 2014-09-16 | Micronas Gmbh | Integrated passive component |
Also Published As
Publication number | Publication date |
---|---|
CN111487575A (en) | 2020-08-04 |
US20200241083A1 (en) | 2020-07-30 |
CN117075017A (en) | 2023-11-17 |
DE102019101931A1 (en) | 2020-07-30 |
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