US20220030739A1 - Thermal bridge for an electrical component - Google Patents
Thermal bridge for an electrical component Download PDFInfo
- Publication number
- US20220030739A1 US20220030739A1 US16/935,493 US202016935493A US2022030739A1 US 20220030739 A1 US20220030739 A1 US 20220030739A1 US 202016935493 A US202016935493 A US 202016935493A US 2022030739 A1 US2022030739 A1 US 2022030739A1
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- US
- United States
- Prior art keywords
- plates
- bridge
- thermal
- assembly
- internal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the subject matter herein relates generally to heat dissipation for electrical components.
- thermal energy it may be desirable to transfer thermal energy (or heat) away from designated components of a system or device.
- Some systems use electrical components, such as electrical connectors, to transmit data and/or electrical power to and from different systems or devices.
- electrical components such as pluggable modules for transmitting data signals through communication cable(s) in the form of optical signals and/or electrical signals.
- electrical components such as integrated circuits, for controlling the system. The electrical components define heat generating sources within the system.
- thermal energy generated by electrical components within a system can degrade performance or even damage components of the system.
- systems include a thermal component, such as a heat sink, which engages the heat source, absorbs the thermal energy from the heat source, and transfers the thermal energy away.
- the heat sink is typically thermally coupled to another thermal component at yet another thermal interface. The components lose efficiency at each thermal interface. Additionally, it is difficult to achieve efficient thermal coupling at the interfaces due to limited thermal interface areas and variations in the surfaces, such as due to surface flatness of the interfacing surfaces.
- a thermal bridge in one embodiment, includes an upper bridge assembly including a plurality of upper plates arranged in an upper plate stack. Each upper plate has a front end and a rear end. Each upper plate has sides between the front end and the rear end. Each upper plate has an inner end and an outer end.
- the thermal bridge includes a lower bridge assembly including a plurality of lower plates arranged in a lower plate stack. Each lower plate has a front end and a rear end. Each lower plate has sides between the front end and the rear end. Each lower plate has an inner end and an outer end. The outer ends of the lower plates are configured to face and thermally couple to an electrical component. The sides of the lower plates face the sides of the upper plates to thermally interface the lower plates with the upper plates.
- the thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly.
- the spring element includes an upper spring member engaging the upper plates to bias the upper plates in a first biasing direction generally away from the lower plates.
- the spring element includes a lower spring member engaging the lower plates to bias the lower plates in a second biasing direction generally away from the upper plates.
- the thermal bridge includes an internal bridge frame having connecting elements that extend internally through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.
- a thermal bridge in another embodiment, includes an upper bridge assembly including a plurality of upper plates arranged in an upper plate stack. Each upper plate has a front end and a rear end. Each upper plate has sides between the front end and the rear end. Each upper plate has an inner end and an outer end.
- the upper plates include upper bridge plates and upper spacer plates.
- the upper bridge plates have upper overlapping region.
- the thermal bridge includes a lower bridge assembly including a plurality of lower plates arranged in a lower plate stack. Each lower plate has a front end and a rear end. Each lower plate has sides between the front end and the rear end. Each lower plate has an inner end and an outer end.
- the lower plates include lower bridge plates and lower spacer plates. The lower bridge plates have lower overlapping regions.
- the lower plates are configured to face and thermally couple to an electrical component.
- the lower spacer plates are aligned with the upper bridge plates and the lower bridge plates are aligned with the upper spacer plates such that the lower overlapping regions overlap with the upper overlapping regions.
- the sides of the lower bridge plates thermally interface with the sides of the upper bridge plates.
- the thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly.
- the spring element includes an upper spring member engaging the upper plates to bias the upper plates in a first biasing direction generally away from the lower plates.
- the spring element includes a lower spring member engaging the lower plates to bias the lower plates in a second biasing direction generally away from the upper plates.
- the thermal bridge includes an internal bridge frame having connecting elements extending internally through the upper plates and lower plates to hold the upper plates in the upper plate stack and hold the lower plates in the lower plate stack.
- a thermal bridge in a further embodiment, includes an upper bridge assembly including a plurality of upper plates arranged in an upper plate stack. Each upper plate has a front end and a rear end. Each upper plate has sides between the front end and the rear end. Each upper plate has an inner end and an outer end. Each upper plate has a front thermal interface, a rear thermal interface and an upper thermal interface.
- the thermal bridge includes a lower bridge assembly including a plurality of lower plates arranged in a lower plate stack. Each lower plate has a front end and a rear end. Each lower plate has sides between the front end and the rear end. Each lower plate has an inner end and an outer end. The sides of the lower plates face the sides of the upper plates to thermally interface the lower plates with the upper plates.
- the thermal bridge includes a first cap plate coupled to a first side of the upper plate stack and the lower plate stack.
- the first cap plate has a first side thermal interface.
- the thermal bridge includes a second cap plate coupled to a second side of the upper plate stack and the lower plate stack.
- the second cap plate has a second side thermal interface.
- the thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly.
- the spring element includes an upper spring member engaging the upper plates to bias the upper plates in a first biasing direction generally away from the lower plates.
- the spring element includes a lower spring member engaging the lower plates to bias the lower plates in a second biasing direction generally away from the upper plates.
- the thermal bridge includes an internal bridge frame having connecting elements extending between the first cap plate and the second cap plate.
- the connecting elements hold the upper plates in the upper plate stack and the lower plates in the lower plate stack.
- the internal bridge frame extends internally through the lower plates such that the front thermal interface, the rear thermal interface and the lower thermal interface are unobstructed at the bottom of the lower bridge assembly for interfacing with an electrical component.
- the lower plates transfer heat from the electrical component to the upper plates.
- the internal bridge frame extends internally through the upper plates such that the front thermal interface, the rear thermal interface and the upper thermal interface are unobstructed at the top of the upper bridge assembly for interfacing with at least one heat transfer device.
- the upper plates transfer heat to the at least one heat transfer device.
- FIG. 1 is a front perspective view of a communication system and a thermal bridge in accordance with an exemplary embodiment for dissipating heat from at least one electrical component of the communication system.
- FIG. 2 is an exploded view of the thermal bridge in accordance with an exemplary embodiment.
- FIG. 3 is a cross-sectional view of the thermal bridge taken through one of the upper bridge plates and one of the lower spacer plates in accordance with an exemplary embodiment showing the thermal bridge in an expanded state.
- FIG. 4 is a cross-sectional view of the thermal bridge taken through one of the upper bridge plate and the lower spacer plates in accordance with an exemplary embodiment showing the thermal bridge in a compressed state.
- FIG. 5 is a cross-sectional view of the thermal bridge taken through one of the upper spacer plates and one of the lower bridge plates in accordance with an exemplary embodiment showing the thermal bridge in an expanded state.
- FIG. 6 is a cross-sectional view of the thermal bridge taken through the upper spacer plate and the lower bridge plate in accordance with an exemplary embodiment showing the thermal bridge in a compressed state.
- FIG. 7 is a perspective view of a thermal bridge in accordance with an exemplary embodiment.
- FIG. 8 is an enlarged view of a portion of the thermal bridge in accordance with an exemplary embodiment.
- FIG. 9 is a perspective view of a thermal bridge in accordance with an exemplary embodiment.
- FIG. 10 is an exploded view of the thermal bridge in accordance with an exemplary embodiment.
- FIG. 11 is a side view of the thermal bridge in accordance with an exemplary embodiment.
- FIG. 12 is an enlarged side view of the thermal bridge in accordance with an exemplary embodiment.
- FIG. 13 is a side view of a portion of the thermal bridge in accordance with an exemplary embodiment.
- FIG. 14 is a side view of a portion of the thermal bridge in accordance with an exemplary embodiment.
- FIG. 15 is an exploded, perspective view of a thermal bridge in accordance with an exemplary embodiment.
- FIG. 16 is a side view of the thermal bridge in accordance with an exemplary embodiment.
- FIG. 1 is a front perspective view of a communication system 100 and a thermal bridge 200 in accordance with an exemplary embodiment for dissipating heat from at least one electrical component 102 of the communication system 100 .
- the thermal bridge 200 is configured to be thermally coupled to the electrical component 102 at a lower thermal interface 104 at a bottom of the thermal bridge 200 .
- a heat transfer device 106 is provided to dissipate heat from the thermal bridge 200 .
- the thermal bridge 200 is configured to be thermally coupled to the heat transfer device 106 at an upper thermal interface 108 .
- the thermal bridge 200 forms a thermal interface between the electrical component 102 and the heat transfer device 106 .
- the heat transfer device 106 may be a heat sink, such as a finned heat sink, configured to be air cooled by transferring heat to the passing airflow.
- the heat transfer device 106 may be a heat spreader, a cold plate having liquid cooling, and the like.
- the thermal bridge is compressible between the electrical component 102 and the heat transfer device 106 .
- the lower thermal interface 104 is conformable to a shape of the electrical component 102 and the upper thermal interface 108 is conformable to a shape of the heat transfer device 106 for efficient thermal transfer therebetween.
- the electrical component 102 is mounted to a circuit board 110 .
- the electrical component 102 may be a communication connector, such as a receptacle connector, a header connector, a plug connector, or another type of communication connector.
- the electrical component 102 may be an electronic package, such as an integrated circuit.
- the electrical component 102 may be a pluggable module, such as an I/O transceiver module. Other types of electrical components may be provided in alternative embodiments.
- the thermal bridge 200 includes an upper bridge assembly 202 , a lower bridge assembly 204 , a spring element 206 between the upper and lower bridge assemblies 202 , 204 , and an internal bridge frame 208 for holding the upper and lower bridge assemblies 202 , 204 together.
- the lower bridge assembly 204 is configured to thermally engage the electrical component 102 .
- the upper bridge assembly 202 is configured to dissipate heat into the external environment and/or to the heat transfer device 106 .
- the upper bridge assembly 202 is in thermal communication with the lower bridge assembly 204 and dissipates heat away from the lower bridge assembly 204 to cool the electrical component 102 .
- the spring element 206 biases the upper and lower bridge assemblies 202 , 204 apart.
- the upper and lower bridge assemblies 202 , 204 are compressible relative to each other.
- the upper and lower bridge assemblies 202 , 204 are compressible between the electrical component 102 and the heat transfer device 106 .
- the internal bridge frame 208 provides internal support for the upper and lower bridge assemblies 202 , 204 .
- the internal support eliminates the need for an external frames, which provides more surface area for heat dissipation and/or for the thermal interface with the heat transfer device 106 .
- the spring element 206 presses the upper bridge assembly 202 outward in a first biasing direction (for example, upward) against the internal bridge frame 208 and the spring element 206 presses the lower bridge assembly 204 outward in a second biasing direction (for example, downward) against the internal bridge frame 208 .
- the upper bridge assembly 202 and the lower bridge assembly 204 may be held by the internal bridge frame 208 in a manner to allow a limited amount of floating movement of the upper bridge assembly 202 and the lower bridge assembly 204 relative to the internal bridge frame 208 .
- FIG. 2 is an exploded view of the thermal bridge 200 in accordance with an exemplary embodiment.
- the thermal bridge 200 includes the upper bridge assembly 202 and the lower bridge assembly 204 .
- the spring element 206 is located between the upper and lower bridge assemblies 202 , 204 .
- the internal bridge frame 208 is configured to hold the upper and lower bridge assemblies 202 , 204 .
- the thermal bridge 200 is parallelepiped (for example, generally box shaped).
- the thermal bridge 200 includes a top 270 , a bottom 272 , a front 274 , a rear 276 , a first side 280 , and a second side 282 .
- the top 270 may be generally planar.
- the bottom 272 may be generally planar.
- the front 274 may be generally planar.
- the rear 276 may be generally planar.
- the first side 280 may be generally planar.
- the second side 282 may be generally planar.
- the frame structure used to hold the thermal bridge 200 together is defined by the internal bridge frame 208 and is configured to be contained generally within the interior of the thermal bridge 200 .
- the outer surfaces of the thermal bridge 200 are each exposed and accessible for heat dissipation and/or for interfacing with other components, such as the electrical component 102 and/or the heat transfer device 106 (both shown in FIG. 1 ).
- the internal bridge frame 208 allows for a large amount of usable external surface area for the thermal bridge 200 .
- the internal bridge frame 208 is only exposed at the first side 280 and the second side 282 , preferably at a small footprint and remote from the top 270 and the bottom 272 .
- no portion of the internal bridge frame 208 extends along the front 274 or the rear 276 .
- no portion of the internal bridge frame 208 extends along the top 270 or the bottom 272 .
- the internal bridge frame 208 is remote from the upper thermal interface 108 such that the internal bridge frame 208 does not obstruct the upper thermal interface 108 and provides a large amount of usable external surface area for interfacing with the heat transfer device 106 .
- the internal bridge frame 208 is remote from the lower thermal interface 104 such that the internal bridge frame 208 does not obstruct the lower thermal interface 104 and provides a large amount of usable external surface area for interfacing with the electrical component 102
- the bridge assemblies 202 , 204 each include a plurality of plates that are arranged together in plate stacks.
- the plates are interleaved with each other for thermal communication between the upper bridge assembly 202 and the lower bridge assembly 204 .
- the individual plates are movable relative to each other such that the plates may be individually articulated to conform to the electrical component 102 and/or the heat transfer device 106 .
- the individual plates may conform to the electrical component 102 at the lower thermal interface 104 for improved contact and/or proximity between the thermal bridge 200 and the electrical component 102 and/or the individual plates may conform to the heat transfer device 106 at the upper thermal interface 108 for improved contact and/or proximity between the thermal bridge 200 and the heat transfer device 106 .
- a gap or space may be provided between the plates of the bridge assemblies 202 , 204 to allow compressive movement of the spring element 206 between the bridge assemblies 202 , 204 .
- the upper bridge assembly 202 includes a plurality of upper plates 230 arranged in an upper plate stack 232 .
- Each upper plate 230 has sides 234 extending between an inner end 236 and an outer end 238 of the upper plate 230 .
- the inner end 236 faces the lower bridge assembly 204 .
- the outer end 238 faces outward, such as toward the heat transfer device 106 .
- various upper plates 230 may have different shapes, such as different heights and/or different features between the inner end 236 and the outer end 238 .
- the upper plates 230 include upper bridge plates 240 and upper spacer plates 242 .
- the upper spacer plates 242 are located between the upper bridge plates 240 .
- Each upper bridge plate 240 includes a base 300 at the outer end 238 and overlapping regions 312 , 314 at the inner end 236 configured to overlap with adjacent lower plates of the lower bridge assembly 204 .
- the upper bridge plate 240 is upside-down U-shaped; however, the upper bridge plate 240 may have other shapes in alternative embodiments.
- the upper bridge plate 240 includes a first leg 302 extending downward from the base 300 and a second leg 304 extending downward from the base 300 with an upper pocket 306 located between the first leg 302 and the second leg 304 .
- the upper pocket 306 is open at the inner end, such as to receive a lower plate of the lower bridge assembly 204 .
- the upper pocket 306 is defined by edges 308 extending along the base 300 and the legs 302 , 304 .
- the edges 308 at the top of the upper pocket 306 are configured to engage the spring element 206 when assembled. For example, the spring element 206 may be received in the upper pocket 306 .
- the first leg 302 defines the overlapping regions 312 at the sides 234 of the upper bridge plate 240 and the second leg 304 defines the overlapping regions 314 at the sides 234 of the upper bridge plate 240 .
- the overlapping regions 312 , 314 are configured to overlap with adjacent lower plates of the lower bridge assembly 204 .
- the overlapping regions 312 , 314 provide large surface areas configured to be thermally coupled to the lower plates.
- the upper bridge plates 240 include slots 310 that receive the internal bridge frame 208 .
- the slots 310 are elongated, such as in a vertical direction to allow vertical movement of the upper bridge plates 240 relative to the internal bridge frame 208 .
- Each upper spacer plate 242 includes a spacer base 350 at the outer end 238 and a spacer tab 352 extending from the spacer base 350 .
- the spacer tab 352 extends to the inner end 236 of the upper spacer plate 242 .
- the spacer tab 352 may be approximately centered along the spacer base 350 .
- the spacer base 350 includes a first arm 354 extending to a first side of the spacer tab 352 and a second arm 356 extending to a second side of the spacer tab 352 .
- the upper spacer plate 242 is T-shaped; however, the upper spacer plate 242 may have other shapes in alternative embodiments.
- the spacer tab 352 is configured to be aligned with a corresponding lower plate of the lower bridge assembly 204 , such as to be received in a pocket of such lower plate. A bottom edge of the spacer tab 352 may engage the spring element 206 when assembled.
- the upper spacer plates 242 include slots 360 that receive the internal bridge frame 208 .
- the slots 360 are elongated, such as in a vertical direction to allow vertical movement of the upper spacer plates 242 relative to the internal bridge frame 208 .
- the lower bridge assembly 204 includes a plurality of lower plates 250 arranged in a lower plate stack 252 .
- Each lower plate 250 has sides 254 extending between an inner end 256 and an outer end 258 of the lower plate 250 .
- the inner end 256 faces the upper bridge assembly 202 .
- the outer end 258 faces outward, such as toward the electrical component 102 (shown in FIG. 1 ).
- various lower plates 250 may have different shapes and/or heights between the inner end 256 and the outer end 258 .
- the lower plates 250 include lower bridge plates 260 and lower spacer plates 262 .
- the lower spacer plates 262 are located between the lower bridge plates 260 .
- Each lower bridge plate 260 includes a base 400 at the outer end 258 and overlapping regions 412 , 414 at the inner end 256 configured to overlap with adjacent upper plates 230 of the upper bridge assembly 202 .
- the overlapping regions 412 , 414 overlap with the overlapping regions 312 , 314 of the upper bridge plates 240 .
- the lower bridge plate 260 is U-shaped; however, the lower bridge plate 260 may have other shapes in alternative embodiments.
- the lower bridge plate 260 includes a first leg 402 extending upward from the base 400 and a second leg 404 extending upward from the base 400 with a lower pocket 406 located between the first leg 402 and the second leg 404 .
- the lower pocket 406 is open at the inner end 256 , such as to receive the spacer tab 352 of the corresponding upper spacer plate 242 .
- the lower pocket 406 is defined by edges 408 extending along the base 400 and the legs 402 , 404 .
- the edges 408 may guide the spacer tab 352 into the lower pocket 406 .
- the edges 408 may be chamfered to guide the spacer tab 352 into the lower pocket 406 .
- the edges 408 at the bottom of the lower pocket 406 is configured to engage the spring element 206 when assembled. For example, the spring element 206 may be received in the lower pocket 406 .
- the first leg 402 defines the overlapping regions 412 at the sides 254 of the lower bridge plate 260 and the second leg 404 defines the overlapping regions 414 at the sides 254 of the lower bridge plate 260 .
- the overlapping regions 412 , 414 are configured to overlap with the overlapping regions 312 , 314 of the adjacent upper bridge plates 240 .
- the overlapping regions 412 , 414 provide large surface areas configured to be thermally coupled to the upper bridge plates 240 .
- the overlapping regions 412 , 414 are configured to overlap the overlapping regions 312 , 314 by an overlap distance sufficient to allow efficient thermal transfer between the lower plates 250 and the upper plates 230 .
- the sides of the plates are slidable relative to each other to allow movement between the upper plates 230 and the lower plates 250 and change the overlap distance.
- the lower bridge plates 260 include slots 410 that receive the internal bridge frame 208 .
- the slots 410 are elongated, such as in a vertical direction to allow vertical movement of the lower bridge plates 260 relative to the internal bridge frame 208 .
- Each lower spacer plate 262 includes a spacer base 450 at the outer end 258 and a spacer tab 452 extending from the spacer base 450 .
- the spacer tab 452 extends to the inner end 256 of the lower spacer plate 262 .
- the spacer tab 452 may be approximately centered along the spacer base 450 .
- the spacer base 450 includes a first arm 454 extending to a first side of the spacer tab 452 and a second arm 456 extending to a second side of the spacer tab 452 .
- the lower spacer plate 262 is upside-down T-shaped; however, the lower spacer plate 262 may have other shapes in alternative embodiments.
- the spacer tab 452 is configured to be aligned with the upper pocket 306 of the corresponding upper bridge plate 240 , such as to be received in the upper pocket 306 .
- the spacer tab 452 may be guided into the upper pocket 306 by the edges 308 .
- the edges 308 may be chamfered to guide the spacer tab 452 into the upper pocket 306 .
- a top edge of the spacer tab 452 may engage the spring element 206 when assembled.
- the lower spacer plates 262 include slots 460 that receive the internal bridge frame 208 .
- the slots 460 are elongated, such as in a vertical direction to allow vertical movement of the lower spacer plates 262 relative to the internal bridge frame 208 .
- the spring element 206 is separate and discrete from the upper and lower bridge assemblies 202 , 204 .
- the spring element 206 may be a stamped and formed part.
- the spring element 206 is manufactured from a thin metal material such that the spring element 206 is flexible.
- the spring element 206 includes a plurality of spring plates 210 that are arranged in a spring plate stack located between the upper and lower bridge assemblies 202 , 204 .
- the spring plates 210 are vertically stacked to provide spring forces in the vertical direction.
- Other types of spring elements 206 may be used in alternative embodiments, such as coil springs, leaf springs, C-shaped channel springs, and the like.
- the spring elements 206 may be segmented to include a plurality of spring tabs separated by gaps that are movable independent from each other to provide independent spring pressure.
- the spring element 206 is configured to be received in the upper and lower pockets 306 , 406 .
- the spring element 206 is located between the upper plates 230 and the lower plates 250 .
- the spring element 206 is located between the spacer tab 352 and the edge 408 at the bottom of the lower pocket 406 and the spring element 206 is located between the spacer tab 452 and the edges 308 at the top of the upper pocket 306 .
- the spring plates 210 are compressible between the upper plates 230 and the lower plates 250 .
- the spring plates 210 are cupped leaf springs arranged back-to-back to form the spring element 206 .
- the spring plates 210 are arranged in an alternating upward facing and downward facing pattern.
- the spring plates 210 meet either at the outer edges or at the center in the stack of spring plates. Any number of spring plates 210 may be provided depending on the amount of spring force required, the spacing between the upper plates 230 and the lower plates 250 , and the size of the spring plates 210 . Other types of spring elements may be provided in alternative embodiments.
- the spring element 206 extends between a first side 212 and a second side 214 .
- the spring element 206 includes tabs 216 , 218 at the first and second sides 212 , 214 , respectively.
- the tabs 216 , 218 may be used for locating the spring element 206 relative to the internal bridge frame 208 .
- the tabs 216 , 218 may engage the internal bridge frame 208 to position the spring element 206 internally within the thermal bridge 200 .
- the tabs 216 , 218 may be located at the outer tips of the spring element 206 .
- the tabs 216 , 218 may alternatively (or additionally) be approximately centered between the edges rather than the outer tips.
- the internal bridge frame 208 includes connecting elements 220 that extend internally through the upper bridge assembly 202 and the lower bridge assembly 204 .
- the connecting elements 220 are configured to capture the upper plates 230 in the upper plate stack 232 and the lower plates 250 and the lower plate stack 252 .
- the connecting elements 220 may be coupled to the opposite side plate 222 or 224 .
- the connecting element may be latched or welded to the opposite side plate 222 , 224 .
- the connecting elements 220 include one or more upper connecting element and one or more lower connecting element.
- the upper connecting element 220 is received in the upper slots 310 , 360 of the upper bridge plates 240 and the upper spacer plates 242 , respectively.
- the lower connecting element 220 is received in the lower slots 410 , 460 of the lower bridge plates 260 and the lower spacer plates 262 .
- the internal bridge frame 208 includes a first side plate 222 at a first side of the upper bridge assembly 202 and a first side of the lower bridge assembly 204 and a second side plate 224 at a second side of the upper bridge assembly 202 and a second side of the lower bridge assembly 204 .
- the connecting elements 220 extend between the first side plate 222 and the second side plate 224 .
- the connecting elements 220 may be formed integral with the first side plate 222 and/or the second side plate 224 .
- the side plates 222 , 224 and the connecting elements 220 may be stamped and formed from a sheet of metal.
- the connecting elements 220 may be separate from the side plates 222 , 224 and secured thereto, such as by soldering, crimping, latching, clipping, using fasteners or otherwise securing the connecting elements 220 to the side plates 222 , 224 .
- the connecting elements 220 may be secured to the thermal bridge 200 without the use of the side plates 222 , 224 .
- the connecting elements 220 may be secured directly to plates of the upper bridge assembly 202 and/or the lower bridge assembly 204 .
- the connecting elements 220 are flat, planar spars configured to pass through the upper and lower plates 230 , 250 .
- the connecting elements 220 may be stamped and formed from a metal sheet.
- the connecting elements 220 may be generally rectangular in cross-section.
- other types of connecting elements may be used in alternative embodiments.
- the connecting elements 220 may be round or square pins that may be manufactured by an extrusion process.
- Other types of connecting elements 220 may be used in alternative embodiments.
- the first and second side plates 222 , 224 include slots 226 , 228 , respectively.
- the slots 226 , 228 receive the tabs 216 , 218 of the spring element 206 .
- the tabs 216 , 218 may protrude from the plate stacks into the slots 226 , 228 .
- the slots 226 , 228 may be located near the sides.
- the slots 226 , 228 may additionally, or alternatively, be located at the center of the corresponding plates 222 , 224 .
- the slots 226 , 228 may be oversized relative to the tabs 216 , 218 to allow a limited amount of floating movement of the tabs 216 , 218 within the slots 226 , 228 .
- the slots 226 , 228 may accommodate compression and expansion of the spring element 206 .
- the slots 226 , 228 may accommodate vertical movement within the slots 226 , 228 and may accommodate horizontal movement within the slots 226 , 228 .
- Providing oversized slots 226 , 228 resists binding of the spring element 206 when the spring element 206 is expanded or contracted.
- the thermal bridge 200 includes a first cap plate 290 and a second cap plate 292 .
- the first cap plate 290 is provided at the first side 280 and the second cap plate 292 is provided at the second side 282 .
- the upper plate stack 232 and the lower plate stack 252 are held between the cap plates 290 , 292 .
- the cap plates 290 , 292 each include an opening 294 that receives the spring element 206 .
- the openings 294 are aligned with the upper and lower pockets 306 , 406 .
- the cap plates 290 , 292 each include slots 296 that receive the connecting elements 220 .
- the slots 296 are aligned with the slots 310 , 410 .
- the first and second side plates 222 , 224 are configured to be coupled to the first and second cap plates 290 , 292 .
- the thermal bridge 200 may be provided without the side plates 222 , 224 and/or without the cap plates 290 , 292 .
- the connecting elements 220 may be coupled directly to the cap plates 290 , 292 rather than the side plates 222 , 224 .
- the thermal bridge 200 may be provided without the cap plates 290 , 292 , rather using the side plates 222 , 224 to hold the plate stacks.
- FIG. 3 is a cross-sectional view of the thermal bridge 200 taken through one of the upper bridge plates 240 and one of the lower spacer plates 262 in accordance with an exemplary embodiment showing the thermal bridge 200 in an expanded state.
- FIG. 4 is a cross-sectional view of the thermal bridge 200 taken through one of the upper bridge plate 240 and the lower spacer plates 262 in accordance with an exemplary embodiment showing the thermal bridge 200 in a compressed state.
- the lower spacer plate 262 When assembled, the lower spacer plate 262 is aligned with the upper bridge plate 240 .
- the spacer tab 452 is aligned with the upper pocket 306 .
- the spacer tab 452 is movable within the upper pocket 306 as the thermal bridge 200 is compressed and expanded.
- the edges 308 of the upper pocket 306 guide the spacer tab 452 in the upper pocket 306 .
- the spring element 206 is received in the upper pocket 306 between the upper plate 230 and the lower plate 250 .
- the spring element 206 presses the upper plate 230 in an upward biasing direction and presses the lower plate 250 in a downward biasing direction.
- the spring element 206 tends to separate the upper plate 230 from the lower plate 250 to press the base 300 of the upper bridge plate 240 into thermal engagement with the heat transfer device 106 and to press the spacer base 450 of the lower spacer plates 262 into thermal engagement with the electrical component 102 .
- the upper bridge plate 240 and the lower spacer plate 262 are independently movable relative to each other and relative to adjacent upper plates 230 and lower plates 250 .
- the upper plates 230 are configured to float relative to the lower plates 250 and the spring elements 206 allow the floating movement of the upper plates 230 and the lower plates 250 .
- the upper mating interface is conformable to the heat transfer device 106 and the lower mating interface is conformable to the electrical component 102 .
- the internal bridge frame 208 passes through the upper bridge plate 240 and the lower spacer plate 262 .
- the connecting elements 220 pass through the slot 310 and the slot 460 .
- the connecting elements 220 are located at or near the inner edges of the slots 310 , 460 .
- the connecting elements 220 are located at or near the outer edges of the slots 310 , 460 .
- FIG. 5 is a cross-sectional view of the thermal bridge 200 taken through one of the upper spacer plates 242 and one of the lower bridge plates 260 in accordance with an exemplary embodiment showing the thermal bridge 200 in an expanded state.
- FIG. 6 is a cross-sectional view of the thermal bridge 200 taken through the upper spacer plate 242 and the lower bridge plate 260 in accordance with an exemplary embodiment showing the thermal bridge 200 in a compressed state.
- the upper spacer plate 242 When assembled, the upper spacer plate 242 is aligned with the lower bridge plate 260 .
- the spacer tab 352 is aligned with the lower pocket 406 .
- the spacer tab 352 is movable within the lower pocket 406 as the thermal bridge 200 is compressed and expanded.
- the edges 408 of the lower pocket 406 guide the spacer tab 352 in the lower pocket 406 .
- the spring element 206 is received in the lower pocket 406 between the upper plate 230 and the lower plate 250 .
- the spring element 206 presses the upper plate 230 in an upward biasing direction and presses the lower plate 250 in a downward biasing direction.
- the spring element 206 tends to separate the upper plate 230 from the lower plate 250 to press the spacer base 350 of the upper spacer plate 242 into thermal engagement with the heat transfer device 106 and to press the base 400 of the lower bridge plate 260 into thermal engagement with the electrical component 102 .
- the upper spacer plate 242 and the lower bridge plate 260 are independently movable relative to each other and relative to adjacent upper plates 230 and lower plates 250 .
- the internal bridge frame 208 passes through the upper spacer plate 242 and the lower bridge plate 260 .
- the connecting elements 220 pass through the slot 360 and the slot 410 .
- the connecting elements 220 are located at or near the inner edges of the slots 360 , 410 .
- the connecting elements 220 are located at or near the outer edges of the slots 360 , 410 .
- FIG. 7 is a perspective view of a thermal bridge 500 in accordance with an exemplary embodiment.
- FIG. 8 is an enlarged view of a portion of the thermal bridge 500 in accordance with an exemplary embodiment.
- the thermal bridge 500 is sized and shaped differently than the thermal bridge illustrated in FIGS. 1 and 2 .
- the thermal bridge 500 includes similar features as the thermal bridge 200 .
- the thermal bridge 500 is shaped differently than the thermal bridge 200 being short and long as opposed to generally cube shaped. Other shapes are possible in alternative embodiments for the thermal bridge 500 or the thermal bridge 200 .
- the thermal bridge 500 includes an upper bridge assembly 502 including a plurality of upper plates 530 and a lower bridge assembly 504 including a plurality of lower plates 550 .
- a spring element 506 is provided between the upper bridge assembly 502 and the lower bridge assembly 504 .
- the thermal bridge 500 includes an internal bridge frame 508 extending through the interior of the thermal bridge 500 to hold the upper and lower plate stacks together.
- the thermal bridge 500 includes cap plates 590 , 592 at first and second sides of the thermal bridge 500 to hold the upper and lower plate stacks together.
- the internal bridge frame 508 is coupled to the cap plates 590 , 592 .
- the internal bridge frame 508 includes connecting elements 520 passing through slots in the upper plates 530 and the lower plates 550 .
- each upper plate 530 may include a plurality of slots receiving corresponding connecting elements 520 and each lower plate 550 may include a plurality of slots receiving corresponding connecting elements 520 .
- the connecting elements 520 may have various shapes and may be connected to the cap plates by various methods.
- the connecting elements 520 may include pins 522 extending between a head 524 ( FIG. 7 ) and a tip 526 ( FIG. 8 ). The tip 526 may be deformed, such as by pressing, coining or riveting the end of the pin 522 .
- three sets of connecting elements 520 are provided, such as at a front, a rear and a middle of the thermal bridge 500 .
- the spring element 506 is approximately centered between the front and the rear of the thermal bridge 500 .
- the tabs 516 extend from ends of the spring element 506 .
- the tabs 516 are received in openings 518 in the cap plates 590 , 592 .
- the tabs 516 may be used to locate the spring element 506 relative to the upper and lower plates 530 , 550 .
- the tabs 516 , 518 may be located at the outer tips of the spring element 506 .
- the tabs 516 , 518 may alternatively (or additionally) be approximately centered between the edges rather than the outer tips.
- the spring elements 506 may be segmented to include a plurality of spring tabs separated by gaps that are movable independent from each other to provide independent spring pressure.
- FIG. 9 is a perspective view of a thermal bridge 600 in accordance with an exemplary embodiment.
- FIG. 10 is an exploded view of the thermal bridge 600 in accordance with an exemplary embodiment.
- FIG. 11 is a side view of the thermal bridge 600 in accordance with an exemplary embodiment.
- FIG. 12 is an enlarged side view of the thermal bridge 600 in accordance with an exemplary embodiment.
- the thermal bridge 600 is sized and shaped differently than the thermal bridge 200 illustrated in FIGS. 1 and 2 and the thermal bridge 500 illustrated in FIG. 7 .
- the thermal bridge 600 includes similar features as the thermal bridges 200 , 500 .
- the thermal bridge 600 includes an upper bridge assembly 602 including a plurality of upper plates 630 and a lower bridge assembly 604 including a plurality of lower plates 650 .
- One or more spring elements 606 are provided between the upper bridge assembly 602 and the lower bridge assembly 604 .
- the thermal bridge 600 includes an internal bridge frame 608 extending through the interior of the thermal bridge 600 to hold the upper and lower plate stacks together.
- the thermal bridge 600 includes cap plates 690 , 692 at first and second sides of the thermal bridge 600 to hold the upper and lower plate stacks together.
- the internal bridge frame 608 is coupled to the cap plates 690 , 692 .
- the internal bridge frame 608 includes connecting elements 620 passing through slots in the upper plates 630 and the lower plates 650 .
- each upper plate 630 may include a plurality of slots receiving corresponding connecting elements 620 and each lower plate 650 may include a plurality of slots receiving corresponding connecting elements 620 .
- the connecting elements 620 include pins 622 .
- three sets of connecting elements 620 are provided, such as at a front, a rear and a middle of the thermal bridge 600 .
- the thermal bridge 600 includes a plurality of the spring elements 606 .
- the thermal bridge 600 includes a front spring element 606 near a front of the thermal bridge 600 and a rear spring element 606 near a rear of the thermal bridge 600 .
- the spring elements 606 may be identical to each other.
- FIG. 13 is a side view of a portion of the thermal bridge 600 in accordance with an exemplary embodiment.
- FIG. 14 is a side view of a portion of the thermal bridge 600 in accordance with an exemplary embodiment.
- Each upper plate 630 has sides 634 extending between an inner end 636 and an outer end 638 of the upper plate 630 .
- the inner end 636 faces the lower bridge assembly 604 .
- the outer end 638 faces outward, such as to interface with the heat transfer device 106 (shown in FIG. 1 ).
- the upper plates 630 include upper bridge plates 640 ( FIG. 13 ) and upper spacer plates 642 ( FIG. 14 ).
- the upper spacer plates 642 are located between the upper bridge plates 640 .
- the upper spacer plates 642 are shorter than the upper bridge plates 640 .
- the upper bridge plate 640 include overlapping regions 644 configured to overlap with adjacent lower plates 650 for thermal transfer between the lower plates 650 and the upper plates 630 .
- Each lower plate 650 has sides 654 extending between an inner end 656 and an outer end 658 of the lower plate 650 .
- the inner end 656 faces the upper bridge assembly 602 .
- the outer end 658 faces outward, such as to interface with the electrical component 102 (shown in FIG. 1 ).
- the lower plates 650 include lower bridge plates 660 ( FIG. 14 ) and lower spacer plates 662 ( FIG. 13 ).
- the lower spacer plates 662 are located between the lower bridge plates 660 .
- the lower spacer plates 662 are shorter than the lower bridge plates 660 .
- the lower bridge plates 660 include overlapping regions 664 configured overlap with adjacent upper plates 630 for thermal transfer between the lower plates 650 and the upper plates 630 .
- the upper bridge plates 640 When assembled, the upper bridge plates 640 are aligned with the lower spacer plates 662 and the lower bridge plates 660 are aligned with the upper spacer plates 642 . Gaps may be provided between the upper plates 630 and the lower plates 650 to allow compression or movement of the upper plates 630 relative to the lower plates 650 . As the thermal bridge 600 is compressed, the amount of overlap between the overlapping regions 644 , 664 is increased.
- the frame structure used to hold the thermal bridge 600 together is defined by the internal bridge frame 608 and is configured to be contained generally within the interior of the thermal bridge 600 .
- the outer surfaces of the thermal bridge 600 (for example, the top, bottom, front, rear, first side, and second side) are each exposed and accessible for heat dissipation and/or for interfacing with other components, such as the electrical component 102 and/or the heat transfer device 106 (both shown in FIG. 1 ).
- the internal bridge frame 608 allows for a large amount of usable external surface area for the thermal bridge 600 .
- FIG. 15 is an exploded, perspective view of a thermal bridge 700 in accordance with an exemplary embodiment.
- FIG. 16 is a side view of the thermal bridge 700 in accordance with an exemplary embodiment.
- the thermal bridge 700 is similar to the thermal bridges 200 , 500 , 600 and includes similar features as the thermal bridges 200 , 500 , 600 .
- the thermal bridge 700 includes an upper bridge assembly 702 including a plurality of upper plates 730 and a lower bridge assembly 704 including a plurality of lower plates 750 .
- Spring elements 706 are provided between the upper bridge assembly 702 and the lower bridge assembly 704 .
- the thermal bridge 700 includes an internal bridge frame 708 extending through the interior of the thermal bridge 700 to hold the upper and lower plate stacks together.
- the thermal bridge 700 includes cap plates 790 , 792 at first and second sides of the thermal bridge 700 to hold the upper and lower plate stacks together.
- the internal bridge frame 708 is coupled to the cap plates 790 , 792 .
- the internal bridge frame 708 includes connecting elements 720 passing through slots in the upper plates 730 and the lower plates 750 .
- each upper plate 730 may include a plurality of slots receiving corresponding connecting elements 720 and each lower plate 750 may include a plurality of slots receiving corresponding connecting elements 720 .
- the connecting elements 720 include pins 722 .
- three sets of connecting elements 720 are provided, such as at a front, a rear and a middle of the thermal bridge 700 .
- the thermal bridge 700 includes a plurality of the spring elements 706 .
- the thermal bridge 700 includes four spring elements 706 positioned approximately equidistant along the length of the thermal bridge 700 .
- the spring elements 706 may be identical to each other.
- each spring element 706 includes an upper spring member 710 and a lower spring member 712 .
- a connecting section 714 extends between the upper and lower spring members 710 , 712 .
- the connecting section 714 may be curved, such as being C-shaped.
- the connecting section 714 is flexible and configured to spread the upper and lower spring members 710 , 712 apart when the connecting section is flexed or compressed.
- the upper spring member 710 is configured to engage the upper plates 730 and is configured to spring bias the upper plates 730 in a first biasing direction (for example, generally upward) generally away from the lower plates 750 .
- the lower spring member 712 is configured to engage the lower plates 750 and is configured to spring bias the lower plates 750 in a second biasing direction (for example, generally downward) generally away from the upper plates 730 .
- the upper plates 730 are configured to float relative to the lower plates 750 and the spring elements 706 allow the floating movement of the upper plates 730 and the lower plates 750 .
- the upper mating interface is conformable to the heat transfer device 106 and the lower mating interface is conformable to the electrical component 102 .
- the upper spring member 710 is segmented to include a plurality of upper spring tabs separated by upper gaps.
- the upper spring tabs are configured to engage corresponding upper plates 730 .
- the upper spring tabs are movable independent from each other, such as to provide independent spring pressure to the corresponding upper plates 730 .
- the upper spring tabs may be flared outward away from the lower spring member 712 , such as at an angle.
- the lower spring member 712 is segmented to include a plurality of lower spring tabs separated by lower gaps.
- the lower spring tabs are configured to engage corresponding lower plates 750 .
- the lower spring tabs are movable independent from each other, such as to provide independent spring pressure to the corresponding lower plates 750 .
- the lower spring tabs may be flared outward away from the upper spring member 710 , such as at an angle.
Abstract
Description
- The subject matter herein relates generally to heat dissipation for electrical components.
- It may be desirable to transfer thermal energy (or heat) away from designated components of a system or device. Some systems use electrical components, such as electrical connectors, to transmit data and/or electrical power to and from different systems or devices. Some systems use electrical components, such as pluggable modules for transmitting data signals through communication cable(s) in the form of optical signals and/or electrical signals. Some systems use electrical components, such as integrated circuits, for controlling the system. The electrical components define heat generating sources within the system.
- A common challenge that confronts developers of electrical systems is heat management. Thermal energy generated by electrical components within a system can degrade performance or even damage components of the system. To dissipate the thermal energy, systems include a thermal component, such as a heat sink, which engages the heat source, absorbs the thermal energy from the heat source, and transfers the thermal energy away. The heat sink is typically thermally coupled to another thermal component at yet another thermal interface. The components lose efficiency at each thermal interface. Additionally, it is difficult to achieve efficient thermal coupling at the interfaces due to limited thermal interface areas and variations in the surfaces, such as due to surface flatness of the interfacing surfaces.
- Accordingly, there is a need for a thermal transfer assembly that efficiently transfers thermal energy away from an electrical component.
- In one embodiment, a thermal bridge is provided. The thermal bridge includes an upper bridge assembly including a plurality of upper plates arranged in an upper plate stack. Each upper plate has a front end and a rear end. Each upper plate has sides between the front end and the rear end. Each upper plate has an inner end and an outer end. The thermal bridge includes a lower bridge assembly including a plurality of lower plates arranged in a lower plate stack. Each lower plate has a front end and a rear end. Each lower plate has sides between the front end and the rear end. Each lower plate has an inner end and an outer end. The outer ends of the lower plates are configured to face and thermally couple to an electrical component. The sides of the lower plates face the sides of the upper plates to thermally interface the lower plates with the upper plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The spring element includes an upper spring member engaging the upper plates to bias the upper plates in a first biasing direction generally away from the lower plates. The spring element includes a lower spring member engaging the lower plates to bias the lower plates in a second biasing direction generally away from the upper plates. The thermal bridge includes an internal bridge frame having connecting elements that extend internally through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.
- In another embodiment, a thermal bridge is provided. The thermal bridge includes an upper bridge assembly including a plurality of upper plates arranged in an upper plate stack. Each upper plate has a front end and a rear end. Each upper plate has sides between the front end and the rear end. Each upper plate has an inner end and an outer end. The upper plates include upper bridge plates and upper spacer plates. The upper bridge plates have upper overlapping region. The thermal bridge includes a lower bridge assembly including a plurality of lower plates arranged in a lower plate stack. Each lower plate has a front end and a rear end. Each lower plate has sides between the front end and the rear end. Each lower plate has an inner end and an outer end. The lower plates include lower bridge plates and lower spacer plates. The lower bridge plates have lower overlapping regions. The lower plates are configured to face and thermally couple to an electrical component. The lower spacer plates are aligned with the upper bridge plates and the lower bridge plates are aligned with the upper spacer plates such that the lower overlapping regions overlap with the upper overlapping regions. The sides of the lower bridge plates thermally interface with the sides of the upper bridge plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The spring element includes an upper spring member engaging the upper plates to bias the upper plates in a first biasing direction generally away from the lower plates. The spring element includes a lower spring member engaging the lower plates to bias the lower plates in a second biasing direction generally away from the upper plates. The thermal bridge includes an internal bridge frame having connecting elements extending internally through the upper plates and lower plates to hold the upper plates in the upper plate stack and hold the lower plates in the lower plate stack.
- In a further embodiment, a thermal bridge is provided. The thermal bridge includes an upper bridge assembly including a plurality of upper plates arranged in an upper plate stack. Each upper plate has a front end and a rear end. Each upper plate has sides between the front end and the rear end. Each upper plate has an inner end and an outer end. Each upper plate has a front thermal interface, a rear thermal interface and an upper thermal interface. The thermal bridge includes a lower bridge assembly including a plurality of lower plates arranged in a lower plate stack. Each lower plate has a front end and a rear end. Each lower plate has sides between the front end and the rear end. Each lower plate has an inner end and an outer end. The sides of the lower plates face the sides of the upper plates to thermally interface the lower plates with the upper plates. Each lower plate has a front thermal interface, a rear thermal interface and a lower thermal interface. The thermal bridge includes a first cap plate coupled to a first side of the upper plate stack and the lower plate stack. The first cap plate has a first side thermal interface. The thermal bridge includes a second cap plate coupled to a second side of the upper plate stack and the lower plate stack. The second cap plate has a second side thermal interface. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The spring element includes an upper spring member engaging the upper plates to bias the upper plates in a first biasing direction generally away from the lower plates. The spring element includes a lower spring member engaging the lower plates to bias the lower plates in a second biasing direction generally away from the upper plates. The thermal bridge includes an internal bridge frame having connecting elements extending between the first cap plate and the second cap plate. The connecting elements hold the upper plates in the upper plate stack and the lower plates in the lower plate stack. The internal bridge frame extends internally through the lower plates such that the front thermal interface, the rear thermal interface and the lower thermal interface are unobstructed at the bottom of the lower bridge assembly for interfacing with an electrical component. The lower plates transfer heat from the electrical component to the upper plates. The internal bridge frame extends internally through the upper plates such that the front thermal interface, the rear thermal interface and the upper thermal interface are unobstructed at the top of the upper bridge assembly for interfacing with at least one heat transfer device. The upper plates transfer heat to the at least one heat transfer device.
-
FIG. 1 is a front perspective view of a communication system and a thermal bridge in accordance with an exemplary embodiment for dissipating heat from at least one electrical component of the communication system. -
FIG. 2 is an exploded view of the thermal bridge in accordance with an exemplary embodiment. -
FIG. 3 is a cross-sectional view of the thermal bridge taken through one of the upper bridge plates and one of the lower spacer plates in accordance with an exemplary embodiment showing the thermal bridge in an expanded state. -
FIG. 4 is a cross-sectional view of the thermal bridge taken through one of the upper bridge plate and the lower spacer plates in accordance with an exemplary embodiment showing the thermal bridge in a compressed state. -
FIG. 5 is a cross-sectional view of the thermal bridge taken through one of the upper spacer plates and one of the lower bridge plates in accordance with an exemplary embodiment showing the thermal bridge in an expanded state. -
FIG. 6 is a cross-sectional view of the thermal bridge taken through the upper spacer plate and the lower bridge plate in accordance with an exemplary embodiment showing the thermal bridge in a compressed state. -
FIG. 7 is a perspective view of a thermal bridge in accordance with an exemplary embodiment. -
FIG. 8 is an enlarged view of a portion of the thermal bridge in accordance with an exemplary embodiment. -
FIG. 9 is a perspective view of a thermal bridge in accordance with an exemplary embodiment. -
FIG. 10 is an exploded view of the thermal bridge in accordance with an exemplary embodiment. -
FIG. 11 is a side view of the thermal bridge in accordance with an exemplary embodiment. -
FIG. 12 is an enlarged side view of the thermal bridge in accordance with an exemplary embodiment. -
FIG. 13 is a side view of a portion of the thermal bridge in accordance with an exemplary embodiment. -
FIG. 14 is a side view of a portion of the thermal bridge in accordance with an exemplary embodiment. -
FIG. 15 is an exploded, perspective view of a thermal bridge in accordance with an exemplary embodiment. -
FIG. 16 is a side view of the thermal bridge in accordance with an exemplary embodiment. -
FIG. 1 is a front perspective view of acommunication system 100 and athermal bridge 200 in accordance with an exemplary embodiment for dissipating heat from at least oneelectrical component 102 of thecommunication system 100. Thethermal bridge 200 is configured to be thermally coupled to theelectrical component 102 at a lowerthermal interface 104 at a bottom of thethermal bridge 200. In an exemplary embodiment, aheat transfer device 106 is provided to dissipate heat from thethermal bridge 200. For example, thethermal bridge 200 is configured to be thermally coupled to theheat transfer device 106 at an upperthermal interface 108. Thethermal bridge 200 forms a thermal interface between theelectrical component 102 and theheat transfer device 106. Theheat transfer device 106 may be a heat sink, such as a finned heat sink, configured to be air cooled by transferring heat to the passing airflow. In other various embodiments, theheat transfer device 106 may be a heat spreader, a cold plate having liquid cooling, and the like. - In an exemplary embodiment, the thermal bridge is compressible between the
electrical component 102 and theheat transfer device 106. In an exemplary embodiment, the lowerthermal interface 104 is conformable to a shape of theelectrical component 102 and the upperthermal interface 108 is conformable to a shape of theheat transfer device 106 for efficient thermal transfer therebetween. - In an exemplary embodiment, the
electrical component 102 is mounted to acircuit board 110. In various embodiments, theelectrical component 102 may be a communication connector, such as a receptacle connector, a header connector, a plug connector, or another type of communication connector. In other various embodiments, theelectrical component 102 may be an electronic package, such as an integrated circuit. In other various embodiments, theelectrical component 102 may be a pluggable module, such as an I/O transceiver module. Other types of electrical components may be provided in alternative embodiments. - In an exemplary embodiment, the
thermal bridge 200 includes anupper bridge assembly 202, alower bridge assembly 204, aspring element 206 between the upper andlower bridge assemblies internal bridge frame 208 for holding the upper andlower bridge assemblies lower bridge assembly 204 is configured to thermally engage theelectrical component 102. Theupper bridge assembly 202 is configured to dissipate heat into the external environment and/or to theheat transfer device 106. Theupper bridge assembly 202 is in thermal communication with thelower bridge assembly 204 and dissipates heat away from thelower bridge assembly 204 to cool theelectrical component 102. - The
spring element 206 biases the upper andlower bridge assemblies lower bridge assemblies lower bridge assemblies electrical component 102 and theheat transfer device 106. - In an exemplary embodiment, the
internal bridge frame 208 provides internal support for the upper andlower bridge assemblies heat transfer device 106. In an exemplary embodiment, thespring element 206 presses theupper bridge assembly 202 outward in a first biasing direction (for example, upward) against theinternal bridge frame 208 and thespring element 206 presses thelower bridge assembly 204 outward in a second biasing direction (for example, downward) against theinternal bridge frame 208. Theupper bridge assembly 202 and thelower bridge assembly 204 may be held by theinternal bridge frame 208 in a manner to allow a limited amount of floating movement of theupper bridge assembly 202 and thelower bridge assembly 204 relative to theinternal bridge frame 208. -
FIG. 2 is an exploded view of thethermal bridge 200 in accordance with an exemplary embodiment. Thethermal bridge 200 includes theupper bridge assembly 202 and thelower bridge assembly 204. Thespring element 206 is located between the upper andlower bridge assemblies internal bridge frame 208 is configured to hold the upper andlower bridge assemblies - In an exemplary embodiment, the
thermal bridge 200 is parallelepiped (for example, generally box shaped). For example, thethermal bridge 200 includes a top 270, a bottom 272, a front 274, a rear 276, afirst side 280, and asecond side 282. The top 270 may be generally planar. The bottom 272 may be generally planar. The front 274 may be generally planar. The rear 276 may be generally planar. Thefirst side 280 may be generally planar. Thesecond side 282 may be generally planar. However, thethermal bridge 200 may have other shapes in alternative embodiments. The frame structure used to hold thethermal bridge 200 together is defined by theinternal bridge frame 208 and is configured to be contained generally within the interior of thethermal bridge 200. As such, the outer surfaces of the thermal bridge 200 (for example, the top 270, bottom 272,front 274, rear 276,first side 280, and second side 282) are each exposed and accessible for heat dissipation and/or for interfacing with other components, such as theelectrical component 102 and/or the heat transfer device 106 (both shown inFIG. 1 ). Theinternal bridge frame 208 allows for a large amount of usable external surface area for thethermal bridge 200. In an exemplary embodiment, theinternal bridge frame 208 is only exposed at thefirst side 280 and thesecond side 282, preferably at a small footprint and remote from the top 270 and the bottom 272. In an exemplary embodiment, no portion of theinternal bridge frame 208 extends along the front 274 or the rear 276. In an exemplary embodiment, no portion of theinternal bridge frame 208 extends along the top 270 or the bottom 272. - In an exemplary embodiment, the
internal bridge frame 208 is remote from the upperthermal interface 108 such that theinternal bridge frame 208 does not obstruct the upperthermal interface 108 and provides a large amount of usable external surface area for interfacing with theheat transfer device 106. In an exemplary embodiment, theinternal bridge frame 208 is remote from the lowerthermal interface 104 such that theinternal bridge frame 208 does not obstruct the lowerthermal interface 104 and provides a large amount of usable external surface area for interfacing with theelectrical component 102 - In an exemplary embodiment, the
bridge assemblies upper bridge assembly 202 and thelower bridge assembly 204. The individual plates are movable relative to each other such that the plates may be individually articulated to conform to theelectrical component 102 and/or theheat transfer device 106. For example, the individual plates may conform to theelectrical component 102 at the lowerthermal interface 104 for improved contact and/or proximity between thethermal bridge 200 and theelectrical component 102 and/or the individual plates may conform to theheat transfer device 106 at the upperthermal interface 108 for improved contact and/or proximity between thethermal bridge 200 and theheat transfer device 106. A gap or space may be provided between the plates of thebridge assemblies spring element 206 between thebridge assemblies - In an exemplary embodiment, the
upper bridge assembly 202 includes a plurality ofupper plates 230 arranged in anupper plate stack 232. Eachupper plate 230 hassides 234 extending between aninner end 236 and anouter end 238 of theupper plate 230. Theinner end 236 faces thelower bridge assembly 204. Theouter end 238 faces outward, such as toward theheat transfer device 106. Optionally, variousupper plates 230 may have different shapes, such as different heights and/or different features between theinner end 236 and theouter end 238. - In an exemplary embodiment, the
upper plates 230 includeupper bridge plates 240 andupper spacer plates 242. Theupper spacer plates 242 are located between theupper bridge plates 240. Eachupper bridge plate 240 includes a base 300 at theouter end 238 and overlappingregions inner end 236 configured to overlap with adjacent lower plates of thelower bridge assembly 204. In the illustrated embodiment, theupper bridge plate 240 is upside-down U-shaped; however, theupper bridge plate 240 may have other shapes in alternative embodiments. In various embodiments, theupper bridge plate 240 includes afirst leg 302 extending downward from thebase 300 and asecond leg 304 extending downward from the base 300 with anupper pocket 306 located between thefirst leg 302 and thesecond leg 304. Theupper pocket 306 is open at the inner end, such as to receive a lower plate of thelower bridge assembly 204. Theupper pocket 306 is defined byedges 308 extending along thebase 300 and thelegs edges 308 at the top of theupper pocket 306 are configured to engage thespring element 206 when assembled. For example, thespring element 206 may be received in theupper pocket 306. - In an exemplary embodiment, the
first leg 302 defines the overlappingregions 312 at thesides 234 of theupper bridge plate 240 and thesecond leg 304 defines the overlappingregions 314 at thesides 234 of theupper bridge plate 240. The overlappingregions lower bridge assembly 204. The overlappingregions - In an exemplary embodiment, the
upper bridge plates 240 includeslots 310 that receive theinternal bridge frame 208. In an exemplary embodiment, theslots 310 are elongated, such as in a vertical direction to allow vertical movement of theupper bridge plates 240 relative to theinternal bridge frame 208. - Each
upper spacer plate 242 includes aspacer base 350 at theouter end 238 and aspacer tab 352 extending from thespacer base 350. Thespacer tab 352 extends to theinner end 236 of theupper spacer plate 242. Thespacer tab 352 may be approximately centered along thespacer base 350. Thespacer base 350 includes afirst arm 354 extending to a first side of thespacer tab 352 and asecond arm 356 extending to a second side of thespacer tab 352. In the illustrated embodiment, theupper spacer plate 242 is T-shaped; however, theupper spacer plate 242 may have other shapes in alternative embodiments. In an exemplary embodiment, thespacer tab 352 is configured to be aligned with a corresponding lower plate of thelower bridge assembly 204, such as to be received in a pocket of such lower plate. A bottom edge of thespacer tab 352 may engage thespring element 206 when assembled. - In an exemplary embodiment, the
upper spacer plates 242 includeslots 360 that receive theinternal bridge frame 208. In an exemplary embodiment, theslots 360 are elongated, such as in a vertical direction to allow vertical movement of theupper spacer plates 242 relative to theinternal bridge frame 208. - In an exemplary embodiment, the
lower bridge assembly 204 includes a plurality oflower plates 250 arranged in alower plate stack 252. Eachlower plate 250 hassides 254 extending between aninner end 256 and anouter end 258 of thelower plate 250. Theinner end 256 faces theupper bridge assembly 202. Theouter end 258 faces outward, such as toward the electrical component 102 (shown inFIG. 1 ). Optionally, variouslower plates 250 may have different shapes and/or heights between theinner end 256 and theouter end 258. - In an exemplary embodiment, the
lower plates 250 includelower bridge plates 260 andlower spacer plates 262. Thelower spacer plates 262 are located between thelower bridge plates 260. Eachlower bridge plate 260 includes a base 400 at theouter end 258 and overlappingregions 412, 414 at theinner end 256 configured to overlap with adjacentupper plates 230 of theupper bridge assembly 202. For example, the overlappingregions 412, 414 overlap with the overlappingregions upper bridge plates 240. In the illustrated embodiment, thelower bridge plate 260 is U-shaped; however, thelower bridge plate 260 may have other shapes in alternative embodiments. In various embodiments, thelower bridge plate 260 includes afirst leg 402 extending upward from thebase 400 and asecond leg 404 extending upward from the base 400 with alower pocket 406 located between thefirst leg 402 and thesecond leg 404. Thelower pocket 406 is open at theinner end 256, such as to receive thespacer tab 352 of the correspondingupper spacer plate 242. Thelower pocket 406 is defined byedges 408 extending along thebase 400 and thelegs edges 408 may guide thespacer tab 352 into thelower pocket 406. Optionally, theedges 408 may be chamfered to guide thespacer tab 352 into thelower pocket 406. Theedges 408 at the bottom of thelower pocket 406 is configured to engage thespring element 206 when assembled. For example, thespring element 206 may be received in thelower pocket 406. - In an exemplary embodiment, the
first leg 402 defines the overlapping regions 412 at thesides 254 of thelower bridge plate 260 and thesecond leg 404 defines the overlappingregions 414 at thesides 254 of thelower bridge plate 260. The overlappingregions 412, 414 are configured to overlap with the overlappingregions upper bridge plates 240. The overlappingregions 412, 414 provide large surface areas configured to be thermally coupled to theupper bridge plates 240. The overlappingregions 412, 414 are configured to overlap the overlappingregions lower plates 250 and theupper plates 230. The sides of the plates are slidable relative to each other to allow movement between theupper plates 230 and thelower plates 250 and change the overlap distance. - In an exemplary embodiment, the
lower bridge plates 260 includeslots 410 that receive theinternal bridge frame 208. In an exemplary embodiment, theslots 410 are elongated, such as in a vertical direction to allow vertical movement of thelower bridge plates 260 relative to theinternal bridge frame 208. - Each
lower spacer plate 262 includes aspacer base 450 at theouter end 258 and aspacer tab 452 extending from thespacer base 450. Thespacer tab 452 extends to theinner end 256 of thelower spacer plate 262. Thespacer tab 452 may be approximately centered along thespacer base 450. Thespacer base 450 includes afirst arm 454 extending to a first side of thespacer tab 452 and asecond arm 456 extending to a second side of thespacer tab 452. In the illustrated embodiment, thelower spacer plate 262 is upside-down T-shaped; however, thelower spacer plate 262 may have other shapes in alternative embodiments. In an exemplary embodiment, thespacer tab 452 is configured to be aligned with theupper pocket 306 of the correspondingupper bridge plate 240, such as to be received in theupper pocket 306. Thespacer tab 452 may be guided into theupper pocket 306 by theedges 308. Theedges 308 may be chamfered to guide thespacer tab 452 into theupper pocket 306. A top edge of thespacer tab 452 may engage thespring element 206 when assembled. - In an exemplary embodiment, the
lower spacer plates 262 includeslots 460 that receive theinternal bridge frame 208. In an exemplary embodiment, theslots 460 are elongated, such as in a vertical direction to allow vertical movement of thelower spacer plates 262 relative to theinternal bridge frame 208. - In an exemplary embodiment, the
spring element 206 is separate and discrete from the upper andlower bridge assemblies spring element 206 may be a stamped and formed part. Thespring element 206 is manufactured from a thin metal material such that thespring element 206 is flexible. In an exemplary embodiment, thespring element 206 includes a plurality ofspring plates 210 that are arranged in a spring plate stack located between the upper andlower bridge assemblies spring plates 210 are vertically stacked to provide spring forces in the vertical direction. Other types ofspring elements 206 may be used in alternative embodiments, such as coil springs, leaf springs, C-shaped channel springs, and the like. Optionally, thespring elements 206 may be segmented to include a plurality of spring tabs separated by gaps that are movable independent from each other to provide independent spring pressure. - The
spring element 206 is configured to be received in the upper andlower pockets spring element 206 is located between theupper plates 230 and thelower plates 250. For example, thespring element 206 is located between thespacer tab 352 and theedge 408 at the bottom of thelower pocket 406 and thespring element 206 is located between thespacer tab 452 and theedges 308 at the top of theupper pocket 306. Thespring plates 210 are compressible between theupper plates 230 and thelower plates 250. In the illustrated embodiment, thespring plates 210 are cupped leaf springs arranged back-to-back to form thespring element 206. Thespring plates 210 are arranged in an alternating upward facing and downward facing pattern. Thespring plates 210 meet either at the outer edges or at the center in the stack of spring plates. Any number ofspring plates 210 may be provided depending on the amount of spring force required, the spacing between theupper plates 230 and thelower plates 250, and the size of thespring plates 210. Other types of spring elements may be provided in alternative embodiments. - The
spring element 206 extends between afirst side 212 and asecond side 214. Thespring element 206 includestabs second sides tabs spring element 206 relative to theinternal bridge frame 208. Thetabs internal bridge frame 208 to position thespring element 206 internally within thethermal bridge 200. Thetabs spring element 206. Thetabs - In an exemplary embodiment, the
internal bridge frame 208 includes connectingelements 220 that extend internally through theupper bridge assembly 202 and thelower bridge assembly 204. The connectingelements 220 are configured to capture theupper plates 230 in theupper plate stack 232 and thelower plates 250 and thelower plate stack 252. The connectingelements 220 may be coupled to theopposite side plate opposite side plate elements 220 include one or more upper connecting element and one or more lower connecting element. The upper connectingelement 220 is received in theupper slots upper bridge plates 240 and theupper spacer plates 242, respectively. The lower connectingelement 220 is received in thelower slots lower bridge plates 260 and thelower spacer plates 262. - In an exemplary embodiment, the
internal bridge frame 208 includes afirst side plate 222 at a first side of theupper bridge assembly 202 and a first side of thelower bridge assembly 204 and asecond side plate 224 at a second side of theupper bridge assembly 202 and a second side of thelower bridge assembly 204. The connectingelements 220 extend between thefirst side plate 222 and thesecond side plate 224. In various embodiments, the connectingelements 220 may be formed integral with thefirst side plate 222 and/or thesecond side plate 224. For example, theside plates elements 220 may be stamped and formed from a sheet of metal. In alternative embodiments, the connectingelements 220 may be separate from theside plates elements 220 to theside plates elements 220 may be secured to thethermal bridge 200 without the use of theside plates elements 220 may be secured directly to plates of theupper bridge assembly 202 and/or thelower bridge assembly 204. - In an exemplary embodiment, the connecting
elements 220 are flat, planar spars configured to pass through the upper andlower plates elements 220 may be stamped and formed from a metal sheet. The connectingelements 220 may be generally rectangular in cross-section. However, other types of connecting elements may be used in alternative embodiments. For example, the connectingelements 220 may be round or square pins that may be manufactured by an extrusion process. Other types of connectingelements 220 may be used in alternative embodiments. - In an exemplary embodiment, the first and
second side plates slots slots tabs spring element 206. For example, thetabs slots slots slots plates slots tabs tabs slots slots spring element 206. Theslots slots slots oversized slots spring element 206 when thespring element 206 is expanded or contracted. - In an exemplary embodiment, the
thermal bridge 200 includes afirst cap plate 290 and asecond cap plate 292. Thefirst cap plate 290 is provided at thefirst side 280 and thesecond cap plate 292 is provided at thesecond side 282. Theupper plate stack 232 and thelower plate stack 252 are held between thecap plates cap plates opening 294 that receives thespring element 206. Theopenings 294 are aligned with the upper andlower pockets cap plates slots 296 that receive the connectingelements 220. Theslots 296 are aligned with theslots second side plates second cap plates thermal bridge 200 may be provided without theside plates cap plates elements 220 may be coupled directly to thecap plates side plates thermal bridge 200 may be provided without thecap plates side plates -
FIG. 3 is a cross-sectional view of thethermal bridge 200 taken through one of theupper bridge plates 240 and one of thelower spacer plates 262 in accordance with an exemplary embodiment showing thethermal bridge 200 in an expanded state.FIG. 4 is a cross-sectional view of thethermal bridge 200 taken through one of theupper bridge plate 240 and thelower spacer plates 262 in accordance with an exemplary embodiment showing thethermal bridge 200 in a compressed state. - When assembled, the
lower spacer plate 262 is aligned with theupper bridge plate 240. Thespacer tab 452 is aligned with theupper pocket 306. Thespacer tab 452 is movable within theupper pocket 306 as thethermal bridge 200 is compressed and expanded. Theedges 308 of theupper pocket 306 guide thespacer tab 452 in theupper pocket 306. - The
spring element 206 is received in theupper pocket 306 between theupper plate 230 and thelower plate 250. Thespring element 206 presses theupper plate 230 in an upward biasing direction and presses thelower plate 250 in a downward biasing direction. Thespring element 206 tends to separate theupper plate 230 from thelower plate 250 to press thebase 300 of theupper bridge plate 240 into thermal engagement with theheat transfer device 106 and to press thespacer base 450 of thelower spacer plates 262 into thermal engagement with theelectrical component 102. Theupper bridge plate 240 and thelower spacer plate 262 are independently movable relative to each other and relative to adjacentupper plates 230 andlower plates 250. Theupper plates 230 are configured to float relative to thelower plates 250 and thespring elements 206 allow the floating movement of theupper plates 230 and thelower plates 250. As such, the upper mating interface is conformable to theheat transfer device 106 and the lower mating interface is conformable to theelectrical component 102. - The
internal bridge frame 208 passes through theupper bridge plate 240 and thelower spacer plate 262. For example, the connectingelements 220 pass through theslot 310 and theslot 460. In the expanded state, the connectingelements 220 are located at or near the inner edges of theslots elements 220 are located at or near the outer edges of theslots -
FIG. 5 is a cross-sectional view of thethermal bridge 200 taken through one of theupper spacer plates 242 and one of thelower bridge plates 260 in accordance with an exemplary embodiment showing thethermal bridge 200 in an expanded state.FIG. 6 is a cross-sectional view of thethermal bridge 200 taken through theupper spacer plate 242 and thelower bridge plate 260 in accordance with an exemplary embodiment showing thethermal bridge 200 in a compressed state. - When assembled, the
upper spacer plate 242 is aligned with thelower bridge plate 260. Thespacer tab 352 is aligned with thelower pocket 406. Thespacer tab 352 is movable within thelower pocket 406 as thethermal bridge 200 is compressed and expanded. Theedges 408 of thelower pocket 406 guide thespacer tab 352 in thelower pocket 406. - The
spring element 206 is received in thelower pocket 406 between theupper plate 230 and thelower plate 250. Thespring element 206 presses theupper plate 230 in an upward biasing direction and presses thelower plate 250 in a downward biasing direction. Thespring element 206 tends to separate theupper plate 230 from thelower plate 250 to press thespacer base 350 of theupper spacer plate 242 into thermal engagement with theheat transfer device 106 and to press thebase 400 of thelower bridge plate 260 into thermal engagement with theelectrical component 102. Theupper spacer plate 242 and thelower bridge plate 260 are independently movable relative to each other and relative to adjacentupper plates 230 andlower plates 250. - The
internal bridge frame 208 passes through theupper spacer plate 242 and thelower bridge plate 260. For example, the connectingelements 220 pass through theslot 360 and theslot 410. In the expanded state, the connectingelements 220 are located at or near the inner edges of theslots elements 220 are located at or near the outer edges of theslots -
FIG. 7 is a perspective view of athermal bridge 500 in accordance with an exemplary embodiment.FIG. 8 is an enlarged view of a portion of thethermal bridge 500 in accordance with an exemplary embodiment. Thethermal bridge 500 is sized and shaped differently than the thermal bridge illustrated inFIGS. 1 and 2 . Thethermal bridge 500 includes similar features as thethermal bridge 200. Thethermal bridge 500 is shaped differently than thethermal bridge 200 being short and long as opposed to generally cube shaped. Other shapes are possible in alternative embodiments for thethermal bridge 500 or thethermal bridge 200. - The
thermal bridge 500 includes anupper bridge assembly 502 including a plurality ofupper plates 530 and alower bridge assembly 504 including a plurality oflower plates 550. Aspring element 506 is provided between theupper bridge assembly 502 and thelower bridge assembly 504. Thethermal bridge 500 includes aninternal bridge frame 508 extending through the interior of thethermal bridge 500 to hold the upper and lower plate stacks together. Thethermal bridge 500 includescap plates thermal bridge 500 to hold the upper and lower plate stacks together. Theinternal bridge frame 508 is coupled to thecap plates - In an exemplary embodiment, the
internal bridge frame 508 includes connectingelements 520 passing through slots in theupper plates 530 and thelower plates 550. Optionally, eachupper plate 530 may include a plurality of slots receiving corresponding connectingelements 520 and eachlower plate 550 may include a plurality of slots receiving corresponding connectingelements 520. In various embodiments, the connectingelements 520 may have various shapes and may be connected to the cap plates by various methods. For example, the connectingelements 520 may includepins 522 extending between a head 524 (FIG. 7 ) and a tip 526 (FIG. 8 ). Thetip 526 may be deformed, such as by pressing, coining or riveting the end of thepin 522. In the illustrated embodiment, three sets of connectingelements 520 are provided, such as at a front, a rear and a middle of thethermal bridge 500. - In an exemplary embodiment, the
spring element 506 is approximately centered between the front and the rear of thethermal bridge 500. Thetabs 516 extend from ends of thespring element 506. Thetabs 516 are received inopenings 518 in thecap plates tabs 516 may be used to locate thespring element 506 relative to the upper andlower plates tabs spring element 506. Thetabs spring elements 506 may be segmented to include a plurality of spring tabs separated by gaps that are movable independent from each other to provide independent spring pressure. -
FIG. 9 is a perspective view of athermal bridge 600 in accordance with an exemplary embodiment.FIG. 10 is an exploded view of thethermal bridge 600 in accordance with an exemplary embodiment.FIG. 11 is a side view of thethermal bridge 600 in accordance with an exemplary embodiment.FIG. 12 is an enlarged side view of thethermal bridge 600 in accordance with an exemplary embodiment. - The
thermal bridge 600 is sized and shaped differently than thethermal bridge 200 illustrated inFIGS. 1 and 2 and thethermal bridge 500 illustrated inFIG. 7 . Thethermal bridge 600 includes similar features as thethermal bridges - The
thermal bridge 600 includes anupper bridge assembly 602 including a plurality ofupper plates 630 and alower bridge assembly 604 including a plurality oflower plates 650. One ormore spring elements 606 are provided between theupper bridge assembly 602 and thelower bridge assembly 604. Thethermal bridge 600 includes aninternal bridge frame 608 extending through the interior of thethermal bridge 600 to hold the upper and lower plate stacks together. Thethermal bridge 600 includescap plates thermal bridge 600 to hold the upper and lower plate stacks together. Theinternal bridge frame 608 is coupled to thecap plates - In an exemplary embodiment, the
internal bridge frame 608 includes connectingelements 620 passing through slots in theupper plates 630 and thelower plates 650. Optionally, eachupper plate 630 may include a plurality of slots receiving corresponding connectingelements 620 and eachlower plate 650 may include a plurality of slots receiving corresponding connectingelements 620. In various embodiments, the connectingelements 620 includepins 622. In the illustrated embodiment, three sets of connectingelements 620 are provided, such as at a front, a rear and a middle of thethermal bridge 600. - In an exemplary embodiment, the
thermal bridge 600 includes a plurality of thespring elements 606. For example, in the illustrated embodiment, thethermal bridge 600 includes afront spring element 606 near a front of thethermal bridge 600 and arear spring element 606 near a rear of thethermal bridge 600. Thespring elements 606 may be identical to each other. -
FIG. 13 is a side view of a portion of thethermal bridge 600 in accordance with an exemplary embodiment.FIG. 14 is a side view of a portion of thethermal bridge 600 in accordance with an exemplary embodiment. - Each
upper plate 630 hassides 634 extending between aninner end 636 and anouter end 638 of theupper plate 630. Theinner end 636 faces thelower bridge assembly 604. Theouter end 638 faces outward, such as to interface with the heat transfer device 106 (shown inFIG. 1 ). In an exemplary embodiment, theupper plates 630 include upper bridge plates 640 (FIG. 13 ) and upper spacer plates 642 (FIG. 14 ). Theupper spacer plates 642 are located between theupper bridge plates 640. Theupper spacer plates 642 are shorter than theupper bridge plates 640. Theupper bridge plate 640 include overlappingregions 644 configured to overlap with adjacentlower plates 650 for thermal transfer between thelower plates 650 and theupper plates 630. - Each
lower plate 650 hassides 654 extending between aninner end 656 and anouter end 658 of thelower plate 650. Theinner end 656 faces theupper bridge assembly 602. Theouter end 658 faces outward, such as to interface with the electrical component 102 (shown inFIG. 1 ). In an exemplary embodiment, thelower plates 650 include lower bridge plates 660 (FIG. 14 ) and lower spacer plates 662 (FIG. 13 ). Thelower spacer plates 662 are located between thelower bridge plates 660. Thelower spacer plates 662 are shorter than thelower bridge plates 660. Thelower bridge plates 660 include overlappingregions 664 configured overlap with adjacentupper plates 630 for thermal transfer between thelower plates 650 and theupper plates 630. - When assembled, the
upper bridge plates 640 are aligned with thelower spacer plates 662 and thelower bridge plates 660 are aligned with theupper spacer plates 642. Gaps may be provided between theupper plates 630 and thelower plates 650 to allow compression or movement of theupper plates 630 relative to thelower plates 650. As thethermal bridge 600 is compressed, the amount of overlap between the overlappingregions - The frame structure used to hold the
thermal bridge 600 together is defined by theinternal bridge frame 608 and is configured to be contained generally within the interior of thethermal bridge 600. As such, the outer surfaces of the thermal bridge 600 (for example, the top, bottom, front, rear, first side, and second side) are each exposed and accessible for heat dissipation and/or for interfacing with other components, such as theelectrical component 102 and/or the heat transfer device 106 (both shown inFIG. 1 ). Theinternal bridge frame 608 allows for a large amount of usable external surface area for thethermal bridge 600. -
FIG. 15 is an exploded, perspective view of athermal bridge 700 in accordance with an exemplary embodiment.FIG. 16 is a side view of thethermal bridge 700 in accordance with an exemplary embodiment. Thethermal bridge 700 is similar to thethermal bridges thermal bridges - The
thermal bridge 700 includes anupper bridge assembly 702 including a plurality ofupper plates 730 and alower bridge assembly 704 including a plurality oflower plates 750.Spring elements 706 are provided between theupper bridge assembly 702 and thelower bridge assembly 704. Thethermal bridge 700 includes aninternal bridge frame 708 extending through the interior of thethermal bridge 700 to hold the upper and lower plate stacks together. Thethermal bridge 700 includescap plates thermal bridge 700 to hold the upper and lower plate stacks together. Theinternal bridge frame 708 is coupled to thecap plates - In an exemplary embodiment, the
internal bridge frame 708 includes connectingelements 720 passing through slots in theupper plates 730 and thelower plates 750. Optionally, eachupper plate 730 may include a plurality of slots receiving corresponding connectingelements 720 and eachlower plate 750 may include a plurality of slots receiving corresponding connectingelements 720. In various embodiments, the connectingelements 720 includepins 722. In the illustrated embodiment, three sets of connectingelements 720 are provided, such as at a front, a rear and a middle of thethermal bridge 700. - In an exemplary embodiment, the
thermal bridge 700 includes a plurality of thespring elements 706. For example, in the illustrated embodiment, thethermal bridge 700 includes fourspring elements 706 positioned approximately equidistant along the length of thethermal bridge 700. Thespring elements 706 may be identical to each other. - In the illustrated embodiment, the
spring elements 706 are C-shaped leaf springs. Other types of spring elements may be used in alternative embodiments. Eachspring element 706 includes anupper spring member 710 and alower spring member 712. A connectingsection 714 extends between the upper andlower spring members section 714 may be curved, such as being C-shaped. The connectingsection 714 is flexible and configured to spread the upper andlower spring members upper spring member 710 is configured to engage theupper plates 730 and is configured to spring bias theupper plates 730 in a first biasing direction (for example, generally upward) generally away from thelower plates 750. Thelower spring member 712 is configured to engage thelower plates 750 and is configured to spring bias thelower plates 750 in a second biasing direction (for example, generally downward) generally away from theupper plates 730. Theupper plates 730 are configured to float relative to thelower plates 750 and thespring elements 706 allow the floating movement of theupper plates 730 and thelower plates 750. As such, the upper mating interface is conformable to theheat transfer device 106 and the lower mating interface is conformable to theelectrical component 102. - In an exemplary embodiment, the
upper spring member 710 is segmented to include a plurality of upper spring tabs separated by upper gaps. The upper spring tabs are configured to engage correspondingupper plates 730. The upper spring tabs are movable independent from each other, such as to provide independent spring pressure to the correspondingupper plates 730. Optionally, the upper spring tabs may be flared outward away from thelower spring member 712, such as at an angle. - In an exemplary embodiment, the
lower spring member 712 is segmented to include a plurality of lower spring tabs separated by lower gaps. The lower spring tabs are configured to engage correspondinglower plates 750. The lower spring tabs are movable independent from each other, such as to provide independent spring pressure to the correspondinglower plates 750. Optionally, the lower spring tabs may be flared outward away from theupper spring member 710, such as at an angle. - It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. § 112(f), unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
Claims (23)
Priority Applications (3)
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US16/935,493 US11240934B1 (en) | 2020-07-22 | 2020-07-22 | Thermal bridge for an electrical component |
TW110126388A TW202211401A (en) | 2020-07-22 | 2021-07-19 | Thermal bridge for an electrical component |
CN202110829641.8A CN113973471A (en) | 2020-07-22 | 2021-07-22 | Thermal bridge for electrical components |
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US16/935,493 US11240934B1 (en) | 2020-07-22 | 2020-07-22 | Thermal bridge for an electrical component |
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US11486661B2 (en) * | 2020-05-28 | 2022-11-01 | Te Connectivity Solutions Gmbh | Thermal bridge for an electrical component |
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US20210168965A1 (en) * | 2019-12-03 | 2021-06-03 | The Florida State University Research Foundation, Inc. | Integrated thermal-electrical component for power electronics converters |
US11917797B2 (en) * | 2019-12-03 | 2024-02-27 | The Florida State University Research Foundation, Inc. | Integrated thermal-electrical component for power electronics converters |
US20220082771A1 (en) * | 2020-09-17 | 2022-03-17 | TE Connectivity Services Gmbh | Heat exchange assembly for a pluggable module |
US20230102497A1 (en) * | 2021-09-15 | 2023-03-30 | TE Connectivity Services Gmbh | Heat exchange assembly |
US11864353B2 (en) * | 2021-09-15 | 2024-01-02 | Te Connectivity Solutions Gmbh | Heat exchange assembly |
US20230239993A1 (en) * | 2022-01-26 | 2023-07-27 | Microsoft Technology Licensing, Llc | Cooling systems for a circuit board |
Also Published As
Publication number | Publication date |
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US11240934B1 (en) | 2022-02-01 |
TW202211401A (en) | 2022-03-16 |
CN113973471A (en) | 2022-01-25 |
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