US20210352824A1 - Liquid-cooling termination structure having temperature sensing function - Google Patents
Liquid-cooling termination structure having temperature sensing function Download PDFInfo
- Publication number
- US20210352824A1 US20210352824A1 US17/384,502 US202117384502A US2021352824A1 US 20210352824 A1 US20210352824 A1 US 20210352824A1 US 202117384502 A US202117384502 A US 202117384502A US 2021352824 A1 US2021352824 A1 US 2021352824A1
- Authority
- US
- United States
- Prior art keywords
- water cooling
- liquid
- temperature sensing
- cooling head
- heat source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/14—Methods or arrangements for maintaining a constant temperature in parts of machine tools
- B23Q11/141—Methods or arrangements for maintaining a constant temperature in parts of machine tools using a closed fluid circuit for cooling or heating
Abstract
A liquid-cooling termination structure having temperature sensing function is disposed on a liquid-cooling system which is used for performing a heat dissipating operation to a heat source of equipment. The liquid-cooling termination structure includes a water cooling head and a temperature sensing unit. The water cooling head is formed with an adhering surface used for being adhered on the heat source. The temperature sensing unit includes a sensing terminal, and a signal transferring cable extended from the sensing terminal. The sensing terminal is combined with the water cooling head from the exterior of the water cooling head, and the signal transferring cable is connected to the equipment for obtaining the temperature of the heat source through the water cooling head.
Description
- This application is a divisional application of U.S. patent application Ser. No. 16/432,756, filed on Jun. 5, 2019, and entitled “LIQUID-COOLING TERMINATION STRUCTURE HAVING TEMPERATURE SENSING FUNCTION”, which is a divisional application of U.S. patent application Ser. No. 15/693,058, filed on Aug. 31, 2017, and entitled “LIQUID-COOLING TERMINATION STRUCTURE HAVING TEMPERATURE SENSING FUNCTION”. The entire disclosures of the above applications are all incorporated herein by reference.
- The present invention relates to a liquid-cooling system, especially to a liquid-cooling termination structure having temperature sensing function.
- For monitoring the operating condition of a heat source, such as a central processing unit (CPU), and preventing overheating which may cause malfunction, a liquid-cooling system applied in an equipment, such as a cellphone or a computer, is disposed with a temperature sensor on the above-mentioned heat source, so that the temperature of the heat source is able to be obtained through the temperature sensor, and the operating condition of the heat source can be monitored and other data can also be obtained.
- However, the means of disposing the temperature sensor on the heat source for obtaining the temperature thereof requires the heat source to provide a function of outputting a temperature signal, thus a concern of leaking information may be caused, and the information security is unable to be comprehensively protected.
- Accordingly, the applicant of the present invention has devoted himself for improving the mentioned disadvantages.
- The present invention is to provide a liquid-cooling termination structure having temperature sensing function, in which a liquid-cooling termination is integrated with a temperature sensor, so that the temperature of a heat source can be obtained through the liquid-cooling termination being in contact with the heat source, in other words the heat source is not required to provide a function of outputting a temperature signal, so that the information security of an equipment can be effectively protected.
- Accordingly, the present invention provides a liquid-cooling termination structure having temperature sensing function, which is disposed on a liquid-cooling system used for performing a heat dissipating operation to a heat source of equipment. The liquid-cooling termination structure includes a water cooling head and a temperature sensing unit. The water cooling head disposed outside the heat source of equipment, having an adhering surface adhered to the heat source of equipment. The temperature sensing unit includes a sensing terminal, and a signal transferring cable extended from the sensing terminal. The sensing terminal is combined with the water cooling head from the exterior of the water cooling head, and the signal transferring cable is connected to the equipment for obtaining the temperature of the heat source through the water cooling head. Wherein the water cooling head is formed as a polygonal sheet-like member, a recessed surface is formed at a corner of the adhering surface, and the sensing terminal of the temperature sensing unit is formed as a flat circular member and combined on the recessed surface.
-
FIG. 1 is a perspective exploded view according to a first embodiment of the present invention; -
FIG. 2 is a cross sectional view showing the assembly according to the first embodiment of the present invention; -
FIG. 3 is a cross sectional view showing the assembly according to a second embodiment of the present invention; -
FIG. 4 is a perspective view showing the assembly according to a third embodiment of the present invention; -
FIG. 5 is a partial exploded view according to the third embodiment of the present invention; -
FIG. 6 is a perspective exploded view according to a fourth embodiment of the present invention; -
FIG. 7 is a perspective view showing the assembly according to the fourth embodiment of the present invention; and -
FIG. 8 is a cross sectional view showing the assembly according to a fifth embodiment of the present invention. - Preferred embodiments of the present invention will be described with reference to the drawings.
- Please refer to
FIG. 1 andFIG. 2 , whereinFIG. 1 is a perspective exploded view according to a first embodiment of the present invention andFIG. 2 is a cross sectional view showing the assembly according to the first embodiment of the present invention. The present invention provides a liquid-cooling termination structure having temperature sensing function. The liquid-cooling termination structure is disposed on a liquid-cooling system (not shown in figures), and the above-mentioned liquid-cooling system is used for dissipating a heat source of an equipment such as a cellphone or a computer, or used for working with an equipment such as a large-scale server, a medical equipment, a precision instrument or an electric-powered device for providing a heat dissipation effect. The above-mentioned heat source can be a central processing unit (CPU) or other electric components capable of generating heat which are disposed inside the cellphone or the computer. The liquid-cooling termination structure includes awater cooling head 1 and atemperature sensing unit 2. - The
water cooling head 1 is formed as a polygonal sheet-like member made of a thermal conductive material, and the above-mentioned thermal conductive material can be copper or aluminum. Thewater cooling head 1 is formed with at least one adheringsurface 100, so that the adheringsurface 100 is able to be adhered on the above-mentioned heat source 3 (as shown inFIG. 2 ), thereby allowing the liquid-cooling system to perform a heat dissipating operation to theheat source 3. According to this embodiment, thewater cooling head 1 is further formed with atop surface 111 arranged opposite to the adheringsurface 100, andlateral surfaces 12 continuously surrounding peripheries of the adheringsurface 100 and thetop surface 111, so as to form the above-mentioned sheet-like member. - The
temperature sensing unit 2 can be a contacting-type or infrared sensor, and the interior thereof is mainly composed of a thermal couple or a thermistor. Thetemperature sensing unit 2 includes asensing terminal 20, and asignal transferring cable 21 extended from the rear end of thesensing terminal 20, and thesignal transferring cable 21 is connected to the above-mentioned cellphone or the computer. According to this embodiment, thetemperature sensing terminal 20 is formed as an elongated rod-like member, and screwed on thewater cooling head 1 by utilizing ascrew piece 221. Wherein, thetop surface 111 of thewater cooling head 1 is formed with ascrew hole 112, two ends of thescrew piece 22 are respectively formed with apackage hole 220 and ascrew rod 221, thepackage hole 220 allows thesensing terminal 20 to be packaged therein, thescrew rod 221 is screwed in thescrew hole 112 of thewater cooling head 1, so that thesensing terminal 20 is combined with thewater cooling head 1. Accordingly, when thermal energy is generated by theheat source 3, the thermal energy can be transferred to thewater cooling head 1 adjacently adhered with theheat source 3, and thesensing terminal 20 can be served to sense thewater cooling head 1 for obtaining the temperature of theheat source 3. - Please refer to
FIG. 3 , according to a second embodiment provided by the present invention, thewater cooling head 1 further includes abottom plate 10, and acover plate 11 covered on thebottom plate 10. Theadhering surface 100 is formed below thebottom plate 10, and thetop surface 111 is formed above thecover plate 11. Anaccommodation chamber 110 is formed between thecover plate 11 and thebottom plate 10, thebottom plate 10 is formed with a plurality offins 101 arranged with intervals and disposed in theaccommodation chamber 110, and thecover plate 11 is disposed with twowater connecting ports 13 communicated with theaccommodation chamber 110, thereby allowing the above-mentioned liquid-cooling system to be connected. According to theFIG. 1 andFIG. 2 disclosed in the first embodiment, thetemperature sensing unit 2 is screwed on thecover plate 11 through thescrew piece 22, in other words the above-mentionedscrew hole 112 is formed on thetop surface 111 of thecover plate 11, and thescrew rod 221 of thescrew piece 22 is screwed in thescrew hole 112 of thecover plate 11. - Please refer to
FIG. 4 andFIG. 5 , according to a third embodiment provided by the present invention, arecessed surface 102 is formed at a corner of the adheringsurface 100 of thewater cooling head 1, and apositioning post 103 is formed on therecessed surface 102. Thesensing terminal 20 of thetemperature sensing unit 2 is formed as a flat circular member having apositioning hole 201, thesensing terminal 20 is sleeved on thepositioning post 103 through thepositioning hole 201, so that thesensing terminal 20 can be combined on therecessed surface 102 with a riveting or soldering means; according to this embodiment, ascrew hole 104 is formed in thepositioning post 103, and ascrewing member 202 is utilized for being screwed in thescrew hole 104 so as to be fastened. Moreover, astand 14 is stacked on thetop surface 11 of thewater cooling head 1, thestand 14 has extendingfeet 140 corresponding to corners of thewater cooling head 1, so that the extendingfeet 140 are able to work with a circuit board (not shown in figures) of theheat source 3 for allowing thewater cooling head 1 to be fastened with theheat source 3. - Please refer to
FIG. 6 andFIG. 7 , according to a fourth embodiment provided by the present invention, thesensing terminal 20 of thetemperature sensing unit 2 is formed in a needle-like status, and inserted to the interior from thelateral surface 12 of thewater cooling head 1. Details are provided as follows, thelateral surface 12 of thewater cooling head 1 is formed with anorifice 120, and theorifice 120 allows thesensing terminal 20 in the needle-like status to be tightly inserted therein so as to be packaged in thewater cooling head 1; moreover, please refer toFIG. 8 , an outer edge of theorifice 120 is further processed with a soldering operation for forming a sealedportion 23, so that thesensing terminal 20 can also be packaged in thewater cooling head 1. - Accordingly, with the above-mentioned components, the liquid-cooling termination structure having temperature sensing function is assembled.
- Based on what has been disclosed above, the liquid-cooling termination structure having temperature sensing function provided by the present invention enables the
temperature sensing unit 2 and thewater cooling head 1 to be integrated with the liquid-cooling termination being combined, so that the temperature of theheat source 3 can be obtained through thewater cooling head 1 being in contact with theheat source 3. As such, theheat source 3 is not required to provide a function of outputting a temperature signal, so that the information security of the cellphone or the computer can be ensured, and the concern of leaking information can be avoided. - Although the present invention has been described with reference to the foregoing preferred embodiment, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
Claims (4)
1. A liquid-cooling termination structure having temperature sensing function, disposed on a liquid-cooling system used for performing a heat dissipating operation to a heat source of equipment, and including:
a water cooling head, disposed outside the heat source of equipment, having an adhering surface adhered to the heat source of equipment; and
a temperature sensing unit, including a sensing terminal, and a signal transferring cable extended from the sensing terminal, wherein the sensing terminal is combined with the water cooling head from the exterior of the water cooling head, and the signal transferring cable is connected to the equipment for obtaining the temperature of the heat source through the water cooling head;
wherein the water cooling head is formed as a polygonal sheet-like member, a recessed surface is formed at a corner of the adhering surface, and the sensing terminal of the temperature sensing unit is formed as a flat circular member and combined on the recessed surface.
2. The liquid-cooling termination structure having temperature sensing function according to claim 1 , wherein a positioning post is formed on the recessed surface, a positioning hole is formed on the sensing terminal, and the positioning hole is sleeved on the positioning post.
3. The liquid-cooling termination structure having temperature sensing function according to claim 2 , wherein a screw hole is formed in the positioning post, and a screwing member is utilized for being screwed in the screw hole.
4. The liquid-cooling termination structure having temperature sensing function according to claim 3 , wherein a stand is stacked on the top surface of the water cooling head, and the stand has extending feet corresponding to corners of the water cooling head.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/384,502 US20210352824A1 (en) | 2017-08-31 | 2021-07-23 | Liquid-cooling termination structure having temperature sensing function |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/693,058 US20190069443A1 (en) | 2017-08-31 | 2017-08-31 | Liquid-cooling termination structure having temperature sensing function |
US16/432,756 US11116105B2 (en) | 2017-08-31 | 2019-06-05 | Liquid-cooling termination structure having temperature sensing function |
US17/384,502 US20210352824A1 (en) | 2017-08-31 | 2021-07-23 | Liquid-cooling termination structure having temperature sensing function |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/432,756 Division US11116105B2 (en) | 2017-08-31 | 2019-06-05 | Liquid-cooling termination structure having temperature sensing function |
Publications (1)
Publication Number | Publication Date |
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US20210352824A1 true US20210352824A1 (en) | 2021-11-11 |
Family
ID=65436242
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/693,058 Abandoned US20190069443A1 (en) | 2017-08-31 | 2017-08-31 | Liquid-cooling termination structure having temperature sensing function |
US16/432,756 Active 2037-09-22 US11116105B2 (en) | 2017-08-31 | 2019-06-05 | Liquid-cooling termination structure having temperature sensing function |
US17/384,502 Abandoned US20210352824A1 (en) | 2017-08-31 | 2021-07-23 | Liquid-cooling termination structure having temperature sensing function |
US17/384,443 Abandoned US20210352823A1 (en) | 2017-08-31 | 2021-07-23 | Liquid-cooling termination structure having temperature sensing function |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/693,058 Abandoned US20190069443A1 (en) | 2017-08-31 | 2017-08-31 | Liquid-cooling termination structure having temperature sensing function |
US16/432,756 Active 2037-09-22 US11116105B2 (en) | 2017-08-31 | 2019-06-05 | Liquid-cooling termination structure having temperature sensing function |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US17/384,443 Abandoned US20210352823A1 (en) | 2017-08-31 | 2021-07-23 | Liquid-cooling termination structure having temperature sensing function |
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US (4) | US20190069443A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6942018B2 (en) * | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
US20130208421A1 (en) * | 2009-05-12 | 2013-08-15 | Iceotope Limited | Cooled Electronic System |
US8929073B2 (en) * | 2011-06-13 | 2015-01-06 | Hitachi, Ltd. | Boiling refrigerant type cooling system |
US20150372354A1 (en) * | 2013-02-06 | 2015-12-24 | Sanyo Electric Co., Ltd. | Battery system |
US11105688B2 (en) * | 2017-01-16 | 2021-08-31 | Shibaura Electronics Co., Ltd. | Attaching a thermistor on a case |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4830515A (en) * | 1987-12-28 | 1989-05-16 | Omega Engineering, Inc. | Mounting clip for a thermocouple assembly |
US6599012B2 (en) * | 2002-01-03 | 2003-07-29 | Mamac Systems, Inc. | Thermowell adapter |
US7578337B2 (en) * | 2005-04-14 | 2009-08-25 | United States Thermoelectric Consortium | Heat dissipating device |
DE102007036484B3 (en) * | 2007-08-01 | 2009-02-05 | Endress + Hauser Wetzer Gmbh + Co. Kg | Device for determining and / or monitoring the temperature |
US8944151B2 (en) * | 2008-05-28 | 2015-02-03 | International Business Machines Corporation | Method and apparatus for chip cooling |
US8390420B2 (en) * | 2010-12-16 | 2013-03-05 | Emerson Electric Co. | Immersion well assembly |
ITUB20160129A1 (en) * | 2016-01-21 | 2017-07-21 | Skf Ab | Procedure and mounting device of a temperature sensor. |
-
2017
- 2017-08-31 US US15/693,058 patent/US20190069443A1/en not_active Abandoned
-
2019
- 2019-06-05 US US16/432,756 patent/US11116105B2/en active Active
-
2021
- 2021-07-23 US US17/384,502 patent/US20210352824A1/en not_active Abandoned
- 2021-07-23 US US17/384,443 patent/US20210352823A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6942018B2 (en) * | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
US20130208421A1 (en) * | 2009-05-12 | 2013-08-15 | Iceotope Limited | Cooled Electronic System |
US8929073B2 (en) * | 2011-06-13 | 2015-01-06 | Hitachi, Ltd. | Boiling refrigerant type cooling system |
US20150372354A1 (en) * | 2013-02-06 | 2015-12-24 | Sanyo Electric Co., Ltd. | Battery system |
US11105688B2 (en) * | 2017-01-16 | 2021-08-31 | Shibaura Electronics Co., Ltd. | Attaching a thermistor on a case |
Also Published As
Publication number | Publication date |
---|---|
US20190069443A1 (en) | 2019-02-28 |
US20190289747A1 (en) | 2019-09-19 |
US11116105B2 (en) | 2021-09-07 |
US20210352823A1 (en) | 2021-11-11 |
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